Wafer wafering detection management method, system, electronic device and storage medium

Abstract

The application provides a wafer sampling detection management method and system, electronic equipment and a storage medium. The method comprises the following steps: creating a database according to device information of each engineering station on a wafer production line and position information of each defect detection station; for each defect detection station, determining all engineering stations corresponding to the defect detection station according to the database; determining wafer information corresponding to each process cavity of each device of each engineering station according to production records of each batch of wafers and the database; for each defect detection station, determining a wafer sampling combination corresponding to the defect detection station according to a preset product sampling ratio of the defect detection station and wafer information corresponding to each process cavity of each device of all engineering stations. The application can realize effective monitoring of as many devices and as many process cavities as possible by using defect detection of a limited number of wafers.

Description

Technical Field

[0001] This invention relates to the field of semiconductor processing and manufacturing technology, and in particular to a wafer sampling inspection and management method, system, electronic device, and storage medium. Background Technology

[0002] With the continuous development and advancement of semiconductor manufacturing technology, the complexity and integration of semiconductor products are increasing, leading to increasingly stringent quality control requirements during the semiconductor manufacturing process. Wafer defect detection during semiconductor manufacturing can promptly identify and correct defects in the production process, thereby improving product quality, reducing scrap rates, and lowering production costs. Efficient defect detection systems can quickly pinpoint problems, helping engineers take swift corrective action, thus accelerating production and improving overall efficiency.

[0003] To improve defect detection efficiency, wafer sampling inspection is generally performed. Currently, in the wafer sampling process for wafer defect detection, the wafer number is basically confirmed and fixed in advance. This sampling method cannot systematically monitor the health status of equipment at the main engineering sites in different wafer manufacturing processes, which can easily lead to some equipment being inspected in a concentrated manner, while other equipment is rarely detected. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer sampling inspection management method, system, electronic device, and storage medium that can effectively monitor as many devices and process cavities as possible by utilizing defect detection on a limited number of wafers, ensuring that maximum monitoring information is obtained for each sampling inspection with limited sampling resources, thereby effectively eliminating monitoring blind spots.

[0005] To achieve the above objectives, the present invention provides a wafer sampling inspection management method, comprising: creating a database based on equipment information of each engineering station on the wafer production line and location information of each defect inspection station, wherein each engineering station includes multiple devices, each device includes multiple process cavities, and the equipment information includes device number and process cavity number; for each defect inspection station, determining all engineering stations corresponding to the defect inspection station based on the database; determining wafer information corresponding to each process cavity of each device at each engineering station based on the production records of each batch of wafers and the database, wherein the wafer information includes wafer batch and wafer number; for each defect inspection station, determining the wafer sampling combination corresponding to the defect inspection station that covers the most devices and the most process cavities based on the preset product sampling ratio corresponding to the defect inspection station and the wafer information corresponding to each process cavity of each device at all engineering stations corresponding to the defect inspection station.

[0006] Optionally, the preset product sampling ratio includes a preset product batch sampling ratio and a preset single batch product wafer number sampling ratio; determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment of all engineering stations corresponding to the defect detection station includes: determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities based on the preset product batch sampling ratio and the preset single batch product wafer number sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment of all engineering stations corresponding to the defect detection station.

[0007] Optionally, determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities based on the preset product batch sampling ratio and preset single batch product wafer number sampling ratio corresponding to the defect detection station, as well as the wafer information corresponding to the wafers of each process cavity of each equipment at all engineering stations corresponding to the defect detection station, includes: determining the wafer batch corresponding to each equipment at each engineering station corresponding to the defect detection station based on the wafer information corresponding to the wafers of each process cavity of each equipment at all engineering stations corresponding to the defect detection station; and determining the wafer batch corresponding to each equipment at each engineering station corresponding to the defect detection station based on the preset product batch sampling ratio and preset single batch product wafer number sampling ratio corresponding to the defect detection station. For each wafer batch corresponding to a device, determine the wafer batch combination that covers the most devices corresponding to that defect detection station; for each wafer batch in the wafer batch combination corresponding to that defect detection station, determine the wafer number combination that covers the most process cavities in that wafer batch based on the preset single batch product wafer number sampling ratio corresponding to that defect detection station and the wafer information corresponding to each process cavity of each device in all engineering stations corresponding to that defect detection station; based on the wafer number combination that covers the most process cavities in each wafer batch in the wafer batch combination corresponding to that defect detection station, determine the wafer sampling inspection combination that covers the most devices and the most process cavities corresponding to that defect detection station.

[0008] Optionally, for each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the preset sampling ratio of the number of wafers per batch corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device in all engineering stations corresponding to the defect detection station, the wafer number combination covering the most process cavities in the wafer batch is determined, including:

[0009] For each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the wafer information corresponding to each process cavity of each device in all engineering stations corresponding to the defect detection station, the device number and process cavity number corresponding to each wafer number in the wafer batch are determined; for each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the device number and process cavity number corresponding to each wafer number in the wafer batch and the preset single batch product wafer number sampling ratio, the wafer number combination covering the most process cavities in the wafer batch is determined.

[0010] Optionally, for each wafer batch in the wafer batch combination corresponding to the defect detection station, the wafer number combination covering the most process cavities in the wafer batch is determined based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch and the preset single-batch product wafer number sampling ratio. This includes: for each wafer batch in the wafer batch combination corresponding to the defect detection station, the wafer number combination covering the most process cavities in the wafer batch is determined based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch, the preset single-batch product wafer number sampling ratio corresponding to the defect detection station, and the preset single-batch product sampling rules; wherein, the preset single-batch product sampling rules include that the wafer numbers of three wafers selected from multiple wafers in the same wafer batch are respectively located in the first segment, middle segment, and last segment of all wafer numbers corresponding to the wafer batch.

[0011] Optionally, for each defect detection station, the preset batch sampling ratio corresponding to the defect detection station is determined based on the number of devices in the engineering station with the most devices among all engineering stations corresponding to the defect detection station and the number of wafer batches passing through all engineering stations corresponding to the defect detection station. The preset single batch wafer number sampling ratio corresponding to the defect detection station is determined based on the number of process cavities in the device with the most process cavities among all engineering stations corresponding to the defect detection station and the number of wafers in a single wafer batch.

[0012] To achieve the above objectives, the present invention also provides a wafer sampling inspection management system, comprising: a database creation module configured to create a database based on equipment information of each engineering station on the wafer production line and location information of each defect detection station, wherein each engineering station includes multiple devices, each device includes multiple process cavities, and the device information includes device number and process cavity number; an engineering station determination module configured to determine all engineering stations corresponding to each defect detection station based on the database; a wafer information determination module configured to determine wafer information corresponding to each process cavity of each device at each engineering station based on the production records of each batch of wafers and the database, wherein the wafer information includes wafer batch and wafer number; and a wafer sampling combination determination module configured to determine, for each defect detection station, the wafer sampling combination corresponding to the defect detection station that covers the most devices and the most process cavities based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device at all engineering stations corresponding to the defect detection station.

[0013] To achieve the above objectives, the present invention also provides an electronic device, including a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, it implements the wafer sampling and inspection management method described above.

[0014] To achieve the above objectives, the present invention also provides a readable storage medium storing a computer program, which, when executed by a processor, implements the wafer sampling and inspection management method described above.

[0015] Compared with existing technologies, the wafer sampling inspection management method, system, electronic device, and storage medium provided by this invention have the following unexpected technical effects: This invention first creates a database based on the equipment information of each engineering station on the wafer production line and the location information of each defect detection station; then, for each defect detection station, it determines all the engineering stations corresponding to that defect detection station based on the database; next, based on the production records of each batch of wafers and the database, it determines the wafer information corresponding to each process cavity of each equipment at each engineering station, where the wafer information includes the wafer batch and wafer number; finally, for each defect detection station, it performs sampling inspection according to the preset product sampling ratio corresponding to that defect detection station and the location information of that defect detection station. By identifying the wafer information corresponding to each process cavity of each equipment at all engineering sites, the wafer sampling combination covering the most equipment and process cavities corresponding to that defect detection site can be determined. This allows for the determination of the wafer sampling combination covering the most equipment and process cavities for each defect detection site, enabling effective monitoring of as many devices and process cavities as possible with a limited number of wafers. This ensures that with limited sampling resources, each sampling obtains maximum monitoring information, effectively eliminating monitoring blind spots. Consequently, it is more conducive to engineers promptly identifying and correcting defects in the semiconductor product manufacturing process, thereby improving semiconductor product quality and reducing the defect rate. Furthermore, this invention can dynamically link defect detection sites with all related upstream engineering sites and their equipment and process cavities. This allows engineers to accurately pinpoint which batch, which wafer, which engineering site, which equipment, and which process cavity completed the process after a defect was discovered, greatly shortening the problem investigation time. Attached Figure Description

[0016] Figure 1 This is a flowchart of a wafer sampling inspection and management method provided in one embodiment of the present invention.

[0017] Figure 2 This is a schematic diagram illustrating the principle of determining wafer batch combinations in a wafer sampling inspection and management method according to an embodiment of the present invention.

[0018] Figure 3 This is a schematic diagram illustrating the principle of determining wafer number combinations in a wafer sampling and inspection management method according to an embodiment of the present invention.

[0019] Figure 4 This is a block diagram of a wafer sampling and inspection management system provided in one embodiment of the present invention.

[0020] Figure 5 This is a block diagram of an electronic device provided according to an embodiment of the present invention.

[0021] The reference numerals in the attached drawings are explained as follows: Database creation module - 110; Engineering site determination module - 120; Wafer information determination module - 130; Wafer sampling combination determination module - 140; Processor - 210; Communication interface - 220; Memory - 230; Communication bus - 240. Detailed Implementation

[0022] The wafer sampling inspection and management method, system, electronic device, and storage medium proposed in this invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of this invention will become clearer from the following description. It should be understood that the structures, proportions, sizes, etc., illustrated in the accompanying drawings are only for illustrative purposes and to enable those skilled in the art to understand and read the invention, and are not intended to limit the implementation conditions of the invention. Any modifications to the structure, changes in proportions, or adjustments to the size, provided that the effects and objectives achieved by this invention are the same or similar, should still fall within the scope of the technical content disclosed in this invention.

[0023] The core idea of ​​this invention is to provide a wafer sampling inspection management method, system, electronic device, and storage medium that can effectively monitor as many devices and process cavities as possible by utilizing defect detection on a limited number of wafers, ensuring that maximum monitoring information is obtained for each sampling inspection under limited sampling resources, so as to effectively eliminate monitoring blind spots.

[0024] It should be noted that the wafer sampling inspection management method provided by the present invention can be applied to the wafer sampling inspection management system provided by the present invention, and the wafer sampling inspection management system provided by the present invention can be configured on the electronic device provided by the present invention. The electronic device provided by the present invention can be a personal computer, a mobile terminal, etc., and the mobile terminal can be a hardware device with various operating systems, such as a mobile phone or a tablet computer.

[0025] To achieve the above-mentioned goals, this invention provides a wafer sampling inspection and management method, please refer to [the relevant documentation]. Figure 1 This is a flowchart of a wafer sampling and inspection management method provided by an embodiment of the present invention. Figure 1As shown, the wafer sampling inspection management method provided by the present invention includes the following steps: Step S100: Create a database based on the equipment information of each engineering station on the wafer production line and the location information of each defect detection station, wherein each engineering station includes multiple devices, each device includes multiple process cavities, and the equipment information includes device number and process cavity number; Step S200: For each defect detection station, determine all engineering stations corresponding to the defect detection station based on the database; Step S300: Based on the production records of each batch of wafers and the database, determine the wafer information corresponding to each process cavity of each device of each engineering station, wherein the wafer information includes wafer batch and wafer number; Step S400: For each defect detection station, determine the wafer sampling combination corresponding to the defect detection station that covers the most devices and the most process cavities based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device of all engineering stations corresponding to the defect detection station.

[0026] Therefore, by employing the wafer sampling inspection management method provided by this invention, the wafer sampling combination corresponding to the most equipment and process cavities covered by each defect inspection station can be determined. This allows for effective monitoring of as many devices and process cavities as possible using a limited number of wafers for defect inspection, ensuring that each sampling obtains maximum monitoring information with limited sampling resources. This effectively eliminates monitoring blind spots, enabling engineers to promptly identify and correct defects in the semiconductor product manufacturing process, thereby improving semiconductor product quality and reducing defect rates. Furthermore, the wafer sampling inspection management method provided by this invention can dynamically link defect inspection stations with all relevant upstream engineering stations, their equipment, and process cavities. This allows engineers to accurately pinpoint which batch of wafer, which engineering station, which equipment, and which process cavity completed the process after a defect is discovered, significantly shortening troubleshooting time. Furthermore, for each defect detection station, by determining the wafer sampling combination that covers the most equipment and process cavities for that station based on the preset product sampling ratio and the wafer information corresponding to each process cavity of each device across all engineering stations corresponding to that station, the system ensures that monitoring of the most equipment and process cavities can be achieved using a limited sampling sample. This effectively eliminates monitoring blind spots and provides a more comprehensive reflection of equipment health, enabling engineers to promptly identify potential problems. Simultaneously, since the number of devices and process cavities in the engineering stations corresponding to different defect detection stations varies, different preset product sampling ratios can be designed for different defect detection stations. This not only ensures monitoring of the most equipment and process cavities using a limited sampling sample but also effectively reduces costs.

[0027] It should be noted that the production records for each batch of wafers include the equipment information corresponding to each wafer in each batch as it passes through each engineering station. For each defect detection station, all engineering stations located between this defect detection station and the previous defect detection station are the engineering stations corresponding to this defect detection station.

[0028] In some exemplary embodiments, the preset product sampling ratio includes a preset product batch sampling ratio and a preset sampling ratio for the number of product pieces per batch.

[0029] The step of determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment of all engineering stations corresponding to the defect detection station includes: determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities based on the preset product batch sampling ratio and the preset single batch product wafer number sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment of all engineering stations corresponding to the defect detection station.

[0030] Therefore, by using the preset product batch sampling ratio, the number of wafer batches that need to be included in the current round of defect detection can be controlled. By using the preset single-batch product wafer number sampling ratio, the number of wafers that need to be inspected in a single batch can be controlled. By determining the wafer sampling combination that covers the most equipment and the most process cavities corresponding to the defect detection station based on the preset product batch sampling ratio, the preset single-batch product wafer number sampling ratio, and the wafer information corresponding to each process cavity of each equipment of all engineering stations corresponding to the defect detection station, the wafer sampling combination that covers the most equipment and process cavities corresponding to the defect detection station can be determined. This can transform wafer sampling from an experience-dependent, passive manual operation into a data-driven, proactive, and intelligent resource optimization problem, thereby ensuring that the maximum equipment monitoring information is obtained within a given cost framework, which is more conducive to controlling sampling costs.

[0031] In some exemplary embodiments, for each defect detection station, the preset batch sampling ratio corresponding to the defect detection station is determined based on the number of devices in the engineering station with the most devices among all engineering stations corresponding to the defect detection station and the number of wafer batches passing through all engineering stations corresponding to the defect detection station. The preset single batch wafer number sampling ratio corresponding to the defect detection station is determined based on the number of process cavities in the device with the most process cavities among all engineering stations corresponding to the defect detection station and the number of wafers in a single wafer batch.

[0032] Therefore, for each defect detection station, the preset product batch sampling ratio corresponding to that defect detection station is determined by the number of devices in the engineering station with the most devices among all the engineering stations corresponding to that defect detection station and the number of wafer batches passing through all the engineering stations corresponding to that defect detection station. The preset single batch product wafer sampling ratio corresponding to that defect detection station is determined by the number of process cavities in the device with the most process cavities among all the engineering stations corresponding to that defect detection station and the number of wafers in a single wafer batch. This ensures that the wafer sampling combination corresponding to that defect detection station can cover all process cavities of all devices in all the engineering stations corresponding to that defect detection station, thereby meeting the monitoring needs of different devices and different process cavities.

[0033] In some exemplary embodiments, determining the wafer sampling combination corresponding to the defect detection station that covers the most equipment and the most process cavities, based on the preset product batch sampling ratio and preset single batch wafer number sampling ratio corresponding to the defect detection station, and the wafer information corresponding to each process cavity of each equipment at all engineering stations corresponding to the defect detection station, includes: determining the wafer batch corresponding to each equipment at each engineering station corresponding to the defect detection station based on the wafer information corresponding to each process cavity of each equipment at all engineering stations corresponding to the defect detection station; determining the wafer batch corresponding to each equipment at each engineering station corresponding to the defect detection station based on the preset product batch sampling ratio and preset single batch wafer number sampling ratio corresponding to the defect detection station, and the wafer information corresponding to each process cavity of each process cavity at all engineering stations corresponding to the defect detection station; and determining the wafer batch corresponding to each equipment at each engineering station corresponding to the defect detection station based on the preset product batch sampling ratio and preset single batch wafer number sampling ratio corresponding to the defect detection station, and the wafer information corresponding to each process cavity of each process cavity at all engineering stations corresponding to the defect detection station. For each wafer batch corresponding to each device at the defect detection site, determine the wafer batch combination that covers the most devices at that defect detection site; for each wafer batch in the wafer batch combination corresponding to that defect detection site, determine the wafer number combination that covers the most process cavities in that wafer batch based on the preset single batch product wafer number sampling ratio corresponding to that defect detection site and the wafer information corresponding to each process cavity of each device at all engineering sites corresponding to that defect detection site; based on the wafer number combination that covers the most process cavities in each wafer batch in the wafer batch combination corresponding to that defect detection site, determine the wafer sampling inspection combination that covers the most devices and the most process cavities at that defect detection site.

[0034] Therefore, by first selecting wafer batches and then selecting wafer numbers for each selected wafer batch, complex problems can be broken down into simpler ones, significantly reducing computational complexity and implementation difficulty. At the same time, it can also prioritize ensuring that as many devices as possible are included in this round of monitoring, preventing situations where an entire device is not monitored. On the basis of ensuring device coverage, further optimization can be performed to ensure that as many process cavities as possible inside each device are covered.

[0035] In some exemplary embodiments, determining the wafer number combination covering the most process cavities in each wafer batch within the wafer batch combination corresponding to the defect detection station, based on the preset sampling ratio of the number of wafers per batch corresponding to the defect detection station and the wafer information corresponding to the wafers of each process cavity of each device at all engineering stations corresponding to the defect detection station, includes: determining the device number and process cavity number corresponding to each wafer number in the wafer batch based on the wafer information corresponding to the wafers of each process cavity of each device at all engineering stations corresponding to the defect detection station; and determining the wafer number combination covering the most process cavities in the wafer batch based on the device number and process cavity number corresponding to each wafer number in the wafer batch and the preset sampling ratio of the number of wafers per batch corresponding to the defect detection station.

[0036] This setup ensures that multiple wafers selected from a chosen batch can maximize coverage of the process cavities within each device. This allows for the use of a limited number of sampled wafers to cover the most diverse range of process cavities that the batch of wafers passes through. This facilitates engineers in promptly identifying performance drift or malfunctions in individual process cavities, preventing affected wafers from flowing into subsequent processes, significantly improving product yield. Furthermore, when defects are detected, engineers can accurately trace which process cavities are causing the problem, rather than simply pinpointing a single device. This greatly shortens fault diagnosis and repair time and accelerates problem resolution.

[0037] In some exemplary embodiments, for each wafer batch in the wafer batch combination corresponding to the defect detection station, determining the wafer number combination covering the most process cavities in the wafer batch based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch and the preset single-batch product wafer number sampling ratio corresponding to the defect detection station includes: for each wafer batch in the wafer batch combination corresponding to the defect detection station, determining the wafer number combination covering the most process cavities in the wafer batch based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch, the preset single-batch product wafer number sampling ratio corresponding to the defect detection station, and the preset single-batch product sampling rules; wherein, the preset single-batch product sampling rules include that the wafer numbers of three wafers selected from multiple wafers in the same wafer batch are respectively located in the first segment, middle segment, and last segment of all wafer numbers corresponding to the wafer batch.

[0038] Therefore, this setup not only ensures the uniformity of the monitored batches while maximizing the coverage of the process chambers inside each device by selecting multiple wafers from the chosen wafer batch, but also reduces the consumption of computing resources and effectively improves computing speed.

[0039] Please continue to refer to this. Figure 2 This is a schematic diagram illustrating the principle of determining wafer batch combinations in a wafer sampling and inspection management method according to an embodiment of the present invention. Figure 2 As shown, assuming four wafer batches A, B, C, and D pass through engineering station 1 and engineering station 2 in sequence, engineering station 1 includes equipment 1-1 and equipment 1-2, and engineering station 2 includes equipment 2-1 and equipment 2-2. Since both engineering station 1 and engineering station 2 include 2 devices, and the number of wafer batches passing through engineering station 1 and engineering station 2 is 4, the preset sampling ratio of the product batch corresponding to the defect detection station M located after engineering station 2 can be set to 2 / 4. Since wafer batch A passes through equipment 1-1 and equipment 2-1, wafer batch B passes through equipment 1-1 and equipment 2-2, wafer batch C passes through equipment 1-1 and equipment 2-2, and wafer batch D passes through equipment 1-2 and equipment 2-2, it can be seen that the wafer batch combination A / D, which is composed of wafer batches A and D, covers the most devices (simultaneously covering equipment 1-1, equipment 2-1, equipment 1-2, and equipment 2-2). Therefore, the wafer batch combination A / D can be regarded as the wafer batch combination corresponding to the defect detection station M that covers the most devices.

[0040] Please continue to refer to this. Figure 3 This is a schematic diagram illustrating the principle of determining wafer number combinations in a wafer sampling and inspection management method according to an embodiment of the present invention. Figure 3As shown, equipment 1-1 includes three process chambers: 1-1-a, 1-1-b, and 1-1-c. Equipment 2-1 also includes three process chambers: 2-1-a, 2-1-b, and 2-1-c. Assuming wafer batch A includes 25 wafers (#1, #2, #3, ..., #25), and both equipment 1-2 and equipment 2-2 include three process chambers, the sampling ratio for the preset single-batch product count corresponding to defect detection station M can be set to 3 / 25. Since wafers #1, #4, #7, #10, #13, #16, #19, #22, and #25 (a total of 9 wafers) in wafer batch A pass through process chambers 1-1-a and 2-1-a, wafers #2, #5, #8, #11, #14, #17, #... in wafer batch A... Eight wafers, including #20 and #23, pass through process chambers 1-1-b and 2-1-b. Eight wafers, including #3, #6, #9, #12, #15, #18, #21, and #24, from wafer batch A pass through process chambers 1-1-c and 2-1-c. The wafer numbers of three wafers, #1, #14, and #24, are located at the beginning, middle, and end of all wafer numbers corresponding to wafer batch A, respectively. Therefore, the wafer number combination #1 / #14 / #24 formed by combining #1, #14, and #24 from wafer batch A can be regarded as the wafer number combination covering the most process chambers in wafer batch A (covering process chambers 1-1-a, 2-1-a, 1-1-b, 2-1-b, 1-1-c, and 2-1-c).

[0041] It should be noted that the specific details on how to determine the wafer number combination that covers the most process cavities in wafer batch D can be adapted to the relevant content above on how to determine the wafer number combination that covers the most process cavities in wafer batch A, and will not be elaborated here.

[0042] Based on the same inventive concept, this invention also provides a wafer sampling and inspection management system, please refer to [reference needed]. Figure 4 This is a block diagram of a wafer sampling and inspection management system provided in one embodiment of the present invention. Figure 4As shown, the wafer sampling inspection management system provided by the present invention includes: a database creation module 110, configured to create a database based on the equipment information of each engineering station on the wafer production line and the location information of each defect detection station, wherein each engineering station includes multiple devices, each device includes multiple process cavities, and the equipment information includes device number and process cavity number; an engineering station determination module 120, configured to determine all engineering stations corresponding to each defect detection station based on the database; a wafer information determination module 130, configured to determine the wafer information corresponding to each process cavity of each device of each engineering station based on the production records of each batch of wafers and the database, wherein the wafer information includes wafer batch and wafer number; and a wafer sampling combination determination module 140, configured to determine the wafer sampling combination corresponding to the defect detection station that covers the most devices and the most process cavities based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device of all engineering stations corresponding to the defect detection station.

[0043] It should be noted that the wafer sampling inspection management system provided by the present invention can be used to execute the wafer sampling inspection management method described above. The technical principles, technical problems solved, and technical effects of the two are similar, and those skilled in the art can clearly understand that, for the sake of convenience and brevity, more details about the wafer sampling inspection management system provided by the present invention can be found in the description of the wafer sampling inspection management method provided by the present invention above, and will not be repeated here.

[0044] Based on the same inventive concept, the present invention also provides an electronic device, please refer to [reference needed]. Figure 5 This is a block diagram of an electronic device provided in one embodiment of the present invention. Figure 5 As shown, the electronic device includes a processor 210 and a memory 230. The memory 230 stores a computer program. When the computer program is executed by the processor 210, it implements the wafer sampling inspection and management method described above. Since the electronic device provided by this invention and the wafer sampling inspection and management method provided by this invention belong to the same inventive concept, the electronic device provided by this invention has at least all the beneficial effects of the wafer sampling inspection and management method provided by this invention. Therefore, the beneficial effects of the electronic device provided by this invention can be referred to the relevant descriptions of the beneficial effects of the wafer sampling inspection and management method provided by this invention above, and will not be repeated here.

[0045] Please continue to refer to this. Figure 5 ,like Figure 5As shown, the electronic device also includes a communication interface 220 and a communication bus 240, wherein the processor 210, the communication interface 220, and the memory 230 communicate with each other through the communication bus 240. The communication bus 240 can be a Peripheral Component Interconnect (PCI) bus or an Extended Industry Standard Architecture (EISA) bus, etc. This communication bus 240 can be divided into an address bus, a data bus, a control bus, etc. For ease of illustration, only one thick line is used to represent it in the figure, but this does not indicate that there is only one bus or one type of bus. The communication interface 220 is used for communication between the aforementioned electronic device and other devices.

[0046] It should be noted that the processor 210 referred to in this invention can be a Central Processing Unit (CPU), or other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. The general-purpose processor can be a microprocessor or any conventional processor. The processor 210 is the control center of the electronic device, connecting various parts of the electronic device through various interfaces and lines.

[0047] It should also be noted that the memory 230 can be used to store the computer program, and the processor 210 implements various functions of the electronic device by running or executing the computer program stored in the memory 230 and calling the data stored in the memory 230. The memory 230 may include non-volatile and / or volatile memory. Non-volatile memory may include read-only memory (ROM), programmable memory (PROM), electrically programmable memory (EPROM), electrically erasable programmable memory (EEPROM), or flash memory. Volatile memory may include random access memory (RAM) or external cache memory. By way of illustration and not limitation, random access memory is available in a variety of forms, such as static random access memory (SRAM), dynamic random access memory (DRAM), synchronous random access memory (SDRAM), dual data rate synchronous random access memory (DDRSDRAM), enhanced synchronous random access memory (ESDRAM), synchronous link dynamic random access memory (SLDRAM), memory bus direct random access memory (RDRAM), direct memory bus dynamic random access memory (DRDRAM), and memory bus dynamic random access memory (RDRAM), etc.

[0048] This invention also provides a readable storage medium storing a computer program, which, when executed by a processor, can implement the wafer sampling inspection and management method described above. Since the readable storage medium provided by this invention and the wafer sampling inspection and management method provided by this invention belong to the same inventive concept, the readable storage medium provided by this invention possesses at least all the beneficial effects of the wafer sampling inspection and management method provided by this invention. Therefore, regarding the beneficial effects of the readable storage medium provided by this invention, please refer to the relevant descriptions of the beneficial effects of the wafer sampling inspection and management method provided by this invention above, and will not be repeated here.

[0049] It should be noted that the readable storage medium provided by this invention can be any combination of one or more computer-readable media. The readable medium can be a computer-readable signal medium or a computer-readable storage medium. The computer-readable storage medium can be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor system, apparatus, or device, or any combination thereof. The computer-readable signal medium can include data signals propagated in baseband or as part of a carrier wave, carrying computer-readable program code. Such propagated data signals can take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. The computer-readable signal medium can also be any computer-readable medium other than a computer-readable storage medium, which can send, propagate, or transmit a program for use by or in conjunction with an instruction execution system, apparatus, or device. The program code contained on the computer-readable medium can be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, etc., or any suitable combination thereof.

[0050] In summary, compared with existing technologies, the wafer sampling inspection management method, system, electronic device, and storage medium provided by this invention have the following unexpected technical effects: This invention can determine the wafer sampling combination that covers the most equipment and process cavities for each defect detection station. This allows for effective monitoring of as many devices and process cavities as possible using a limited number of wafers for defect detection, ensuring that each sampling obtains maximum monitoring information with limited sampling resources. This effectively eliminates monitoring blind spots, making it easier for engineers to promptly detect and correct defects in the semiconductor product manufacturing process, thereby improving semiconductor product quality and reducing the defect rate. Furthermore, this invention can dynamically link defect detection stations with all relevant upstream engineering stations, their equipment, and process cavities. This allows engineers to accurately pinpoint which batch of wafer was processed in which engineering station, which equipment, and which process cavity after a defect is discovered, greatly shortening troubleshooting time.

[0051] It should be noted that computer program code for performing the operations of this invention can be written in one or more programming languages ​​or a combination thereof. These programming languages ​​include object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as C or similar languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a local area network (LAN) or a wide area network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0052] It should be noted that the above description is merely a description of preferred embodiments of the present invention and is not intended to limit the scope of the present invention in any way. Any changes or modifications made by those skilled in the art based on the above disclosure are within the protection scope of the present invention. Obviously, those skilled in the art can make various modifications and variations to the present invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the present invention and its equivalents, the present invention also intends to include these modifications and variations.

Claims

1. A wafer sampling inspection and management method, characterized in that, include: A database is created based on the equipment information of each engineering station on the wafer production line and the location information of each defect detection station. Each engineering station includes multiple devices, and each device includes multiple process chambers. The equipment information includes the device number and the process chamber number. For each defect detection station, all corresponding engineering stations are determined based on the database; Based on the production records of each batch of wafers and the database, the wafer information corresponding to each process chamber of each device at each engineering site is determined. The wafer information includes the wafer batch and wafer number. For each defect detection station, based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device of all engineering stations corresponding to the defect detection station, the wafer sampling combination that covers the most devices and the most process cavities corresponding to the defect detection station is determined.

2. The wafer sampling and inspection management method according to claim 1, characterized in that, The preset product sampling ratio includes the preset product batch sampling ratio and the preset single batch product number sampling ratio. The step of determining the wafer sampling combination corresponding to the defect detection station based on the preset product sampling ratio corresponding to the defect detection station and the wafer information corresponding to each process cavity of each device at all engineering stations corresponding to the defect detection station includes: Based on the preset batch sampling ratio and the preset single batch wafer sampling ratio corresponding to the defect detection station, as well as the wafer information corresponding to each process cavity of each equipment at all engineering stations corresponding to the defect detection station, the wafer sampling combination corresponding to the defect detection station with the most covered equipment and the most covered process cavities is determined.

3. The wafer sampling and inspection management method according to claim 2, characterized in that, The step of determining the wafer sampling combination corresponding to the defect detection station based on the preset batch sampling ratio and the preset single batch wafer number sampling ratio, as well as the wafer information corresponding to each process cavity of each equipment at all engineering stations corresponding to the defect detection station, includes: Based on the wafer information corresponding to each process chamber of each equipment at all engineering sites corresponding to the defect detection site, the wafer batch corresponding to each equipment at each engineering site corresponding to the defect detection site is determined. Based on the preset product batch sampling ratio corresponding to the defect detection station and the wafer batch corresponding to each device of each engineering station corresponding to the defect detection station, determine the wafer batch combination that covers the most devices corresponding to the defect detection station. For each wafer batch in the wafer batch combination corresponding to the defect detection station, the wafer number combination covering the most process cavities in the wafer batch is determined based on the preset sampling ratio of the number of wafers per batch corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment in all engineering stations corresponding to the defect detection station. Based on the wafer number combination that covers the most process cavities in each wafer batch in the wafer batch combination corresponding to the defect detection station, determine the wafer sampling combination that covers the most equipment and the most process cavities corresponding to the defect detection station.

4. The wafer sampling and inspection management method according to claim 3, characterized in that, For each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the preset sampling ratio of the number of wafers per batch corresponding to the defect detection station and the wafer information corresponding to each process cavity of each equipment in all engineering stations corresponding to the defect detection station, the wafer number combination covering the most process cavities in the wafer batch is determined, including: For each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the wafer information corresponding to each process cavity of each equipment in all engineering stations corresponding to the defect detection station, the equipment number and process cavity number corresponding to each wafer number in the wafer batch are determined. For each wafer batch in the wafer batch combination corresponding to the defect detection site, the wafer number combination covering the most process cavities in the wafer batch is determined based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch and the preset sampling ratio of the number of wafers per batch.

5. The wafer sampling and inspection management method according to claim 4, characterized in that, For each wafer batch in the wafer batch combination corresponding to the defect detection station, based on the equipment number and process cavity number corresponding to each wafer number in the wafer batch and the preset sampling ratio of the number of wafers per batch, the wafer number combination covering the most process cavities in the wafer batch is determined, including: For each wafer batch in the wafer batch combination corresponding to the defect detection station, the wafer number combination that covers the most process cavities in the wafer batch is determined according to the equipment number and process cavity number corresponding to each wafer number in the wafer batch, the preset sampling ratio of the number of wafers in a single batch corresponding to the defect detection station, and the preset sampling rules for a single batch. The preset single-batch product sampling rule includes that the wafer numbers of three wafers selected from multiple wafers in the same wafer batch are respectively located in the first, middle and last segments of all wafer numbers corresponding to that wafer batch.

6. The wafer sampling and inspection management method according to claim 2, characterized in that, For each defect detection station, the preset sampling ratio of the product batch corresponding to the defect detection station is determined based on the number of devices in the engineering station with the most devices among all the engineering stations corresponding to the defect detection station and the number of wafer batches passing through all the engineering stations corresponding to the defect detection station. The preset sampling ratio of the number of wafers per batch corresponding to the defect detection station is determined based on the number of process cavities in the device with the most process cavities among all the engineering stations corresponding to the defect detection station and the number of wafers in a single wafer batch.

7. A wafer sampling and inspection management system, characterized in that, include: The database creation module is configured to create a database based on the equipment information of each engineering station on the wafer production line and the location information of each defect detection station. Each engineering station includes multiple devices, each device includes multiple process chambers, and the equipment information includes the device number and the process chamber number. The engineering site determination module is configured to determine all engineering sites corresponding to each defect detection site based on the database. The wafer information determination module is configured to determine the wafer information corresponding to each process chamber of each device at each engineering site based on the production records of each batch of wafers and the database. The wafer information includes the wafer batch and wafer number. The wafer sampling combination determination module is configured to determine, for each defect detection station, the wafer sampling combination that covers the most equipment and the most process cavities corresponding to that defect detection station, based on the preset product sampling ratio corresponding to that defect detection station and the wafer information corresponding to the wafers of each process cavity of each equipment of all engineering stations corresponding to that defect detection station.

8. An electronic device, characterized in that, The method includes a processor and a memory, wherein a computer program is stored in the memory, and when the computer program is executed by the processor, it implements the wafer sampling inspection management method according to any one of claims 1 to 6.

9. A readable storage medium, characterized in that, The readable storage medium stores a computer program, which, when executed by a processor, implements the wafer sampling and inspection management method according to any one of claims 1 to 6.

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