Dynamically adaptive wire bonding methods, apparatus, devices, and storage media

Abstract

This invention discloses a dynamic adaptive wire bonding method, apparatus, device, and storage medium. The method includes: based on the position information of a first bonding point, the position information of a second bonding point, and the parameter information of the wire, performing path planning for wire bonding using a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape; bonding the wire to the first bonding point on the chip pad and applying energy; pulling the wire to the substrate pad according to the generated initial bonding path, monitoring the wire bonding path information in real time during the pulling process; when the monitored wire bonding path information exceeds a preset threshold range, dynamically adjusting the initial bonding path; and pulling the wire to the second bonding point on the substrate pad based on the adjusted bonding path, applying energy to the second bonding point to obtain the wire-bonded chip. This invention can avoid short circuits or poor contact problems caused by wire overlap, effectively improving the efficiency of wire bonding.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more specifically to a dynamic adaptive wire bonding method, apparatus, device, and storage medium. Background Technology

[0002] Wire bonding is a critical process step in semiconductor packaging that enables electrical interconnection between the chip and external circuitry. It typically involves connecting chip pads to corresponding pins on the package substrate or lead frame using metal wires. During bonding, the metal wires form a specific three-dimensional spatial structure between the two solder points, known in the industry as a wire arc. To ensure package reliability, traditional wire bonding design and manufacturing must strictly avoid crossing or contact between different wire arcs. Otherwise, in subsequent molding and other processes, the insulating layer between the wire arcs may be damaged due to pressure, vibration, or molding compound flow, leading to a short circuit in the metal wires and causing device malfunction or even complete failure.

[0003] However, as semiconductor packaging technology continues to evolve towards higher density and multifunctionality, increasingly complex bonding scenarios are exceeding the limitations of conventional design specifications, posing significant challenges to existing technologies. Firstly, when wire arcs need to connect to leadframe pins at excessively large angles, the resulting arc shape is steep and difficult to control, easily leading to physical interference with surrounding pins, other bonding wires, or package structures, thus increasing the risk of short circuits or mechanical damage. Furthermore, in some applications, a single wire arc needs to cross multiple other wire arcs, resulting in numerous intersection points in the spatial layout. This not only significantly increases the probability of contact short circuits between wire arcs but also exceeds the capabilities of traditional manufacturing processes, causing a sharp decline in product yield.

[0004] Therefore, how to rationally plan the arc path and effectively avoid arc crossing short circuits during wire bonding is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] This invention provides a dynamic adaptive wire bonding method, apparatus, device, and storage medium to solve the technical problem that wire arc crossover short circuits are easily caused in existing wire bonding processes.

[0006] In a first aspect, the present invention provides a wire bonding method based on dynamic adaptive bonding, comprising:

[0007] Obtain the chip to be bonded, as well as the leads and packaging substrate for packaging the chip to be bonded, and preprocess the pads of the chip to be bonded and the pads of the packaging substrate to obtain the preprocessed chip pads and substrate pads.

[0008] The chip to be bonded is fixed at a preset position on the packaging substrate, and the position information of the chip pads and substrate pads after preprocessing is collected.

[0009] The location information of the first bonding point is determined based on the location information of the chip pads, and the location information of the second bonding point is determined based on the location information of the substrate pads.

[0010] The parameter information of the lead wire is obtained, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, a multi-objective optimization algorithm is used to plan the path of the lead wire bonding and generate an initial bonding path with a preset arc shape.

[0011] The lead is bonded to the first bonding point of the chip pad and energy is applied. The lead is pulled to the substrate pad according to the generated initial bonding path, and the bonding path information of the lead is monitored in real time during the pulling process.

[0012] When the detected bonding path information of the lead exceeds the preset threshold range, the initial bonding path is dynamically adjusted, and the lead is pulled to the second bonding point of the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain the chip after lead bonding.

[0013] Optionally, the step of obtaining the chip to be bonded, the leads and packaging substrate for packaging the chip to be bonded, and preprocessing the chip pads and substrate pads includes:

[0014] The surfaces of the chip pads and substrate pads are subjected to dry cleaning treatment to obtain dry-cleaned chip pads and substrate pads.

[0015] The surfaces of the cleaned chip pads and substrate pads are activated to obtain pretreated chip pads and substrate pads.

[0016] Optionally, the step of fixing the chip to be bonded to a preset position on the packaging substrate and collecting the position information of the chip pads and the substrate pads includes:

[0017] Image information of the chip pads and substrate pads is acquired from at least two different perspectives using an image sensor.

[0018] Feature recognition is performed on the image information of chip pads and substrate pads from different perspectives, and the contour information of chip pads and substrate pads from different perspectives is extracted respectively.

[0019] The contour information of chip pads and substrate pads from different perspectives is matched in three dimensions, and the three-dimensional center point coordinates of the chip pads and substrate pads are calculated based on the results of the three-dimensional matching to obtain the three-dimensional position information of the chip pads and substrate pads.

[0020] Optionally, determining the position information of the first bonding point based on the acquired chip pad position information, and determining the position information of the second bonding point based on the acquired substrate pad position information, includes:

[0021] The initial neck angle of the preset lead is constrained. The bonding area of ​​the chip pad is determined based on the three-dimensional position information of the chip pad. The coordinate information of the first bonding point that satisfies the initial neck angle constraint of the preset lead is determined in the bonding area of ​​the chip pad.

[0022] The preset lead access angle range is defined, and the bonding area of ​​the substrate pad is determined based on the three-dimensional position information of the substrate pad. The coordinate information of the second bonding point that satisfies the preset lead access angle range is determined in the bonding area of ​​the substrate pad.

[0023] Optionally, the step of obtaining the lead wire parameter information and, based on the position information of the first bonding point, the position information of the second bonding point, and the lead wire parameter information, performing path planning for the lead wire bonding using a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape includes:

[0024] Obtain the diameter and material type of the lead wire, and construct a parameterized curve model of the lead wire based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire.

[0025] With the optimization objectives of minimizing the maximum tension during lead wire traction and maximizing the minimum gap between lead wire arcs and adjacent lead wire arcs, the control parameters in the parameterized curve model are solved using the multi-objective optimization algorithm.

[0026] Based on the optimal control parameters of the solved parametric curve model, an initial bonding path with a preset arc shape is generated.

[0027] Optionally, the step of bonding the wire to the first bonding point of the chip pad and applying energy, pulling the wire to the substrate pad according to the generated initial bonding path, and monitoring the bonding path information of the wire in real time during the pulling process includes:

[0028] The dynamic tension value during the lead wire traction process is collected in real time by a tension sensor, and the actual movement trajectory of the bonding head in three-dimensional space is collected in real time by a positioning sensor.

[0029] The actual motion trajectory of the bonding head in three-dimensional space is matched and calculated with the planned trajectory of the initial bonding path to obtain the real-time position deviation of the wire bonding path.

[0030] The bonding path information of the lead wire is obtained based on the dynamic tension value of the lead wire and the real-time positional deviation of the lead wire bonding path.

[0031] Optionally, when the detected bonding path information of the lead exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and based on the adjusted bonding path, the lead is pulled to the second bonding point of the substrate pad, and energy is applied to the second bonding point to obtain the chip after wire bonding, including:

[0032] When the dynamic tension value of the lead wire or the real-time position deviation of the lead wire bonding path exceeds the preset threshold range, the initial bonding path is dynamically adjusted.

[0033] The compensation amount of the initial bonding path is calculated based on the deviation amplitude of the dynamic tension value of the lead wire and the real-time position deviation of the lead bonding path.

[0034] The initial bonding path is corrected based on the calculated compensation amount to generate an adjusted bonding path;

[0035] The bonding head is controlled to move along the adjusted bonding path, pulling the lead to the second bonding point of the substrate pad and applying energy to obtain the chip after wire bonding.

[0036] Secondly, the present invention provides a dynamically adaptive wire bonding device, comprising:

[0037] The acquisition module is used to acquire the chip to be bonded, as well as the lead wire and packaging substrate for packaging the chip to be bonded, and to preprocess the pads of the chip to be bonded and the pads of the packaging substrate to obtain the preprocessed chip pads and substrate pads.

[0038] The acquisition module is used to fix the chip to be bonded to a preset position on the packaging substrate and to acquire the position information of the chip pads and substrate pads after preprocessing.

[0039] The determination module is used to determine the position information of the first bonding point based on the position information of the chip pads collected, and to determine the position information of the second bonding point based on the position information of the substrate pads collected.

[0040] The generation module is used to obtain the parameter information of the lead wire, and based on the position information of the first bonding point, the position information of the second bonding point and the parameter information of the lead wire, perform path planning for the lead wire bonding through a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape.

[0041] The monitoring module is used to bond the lead to the first bonding point of the chip pad and apply energy, pull the lead to the substrate pad according to the generated initial bonding path, and monitor the bonding path information of the lead in real time during the pulling process.

[0042] The adjustment module is used to dynamically adjust the initial bonding path when the detected bonding path information of the lead exceeds a preset threshold range, and to pull the lead to the second bonding point of the substrate pad based on the adjusted bonding path, and apply energy to the second bonding point to obtain the chip after lead bonding.

[0043] Thirdly, the present invention provides a dynamically adaptive wire bonding device, comprising a memory and a processor, wherein:

[0044] The memory is used to store computer programs;

[0045] The processor is used to read the computer program in the memory and execute the steps of dynamic adaptive wire bonding as described in any of the first aspects above.

[0046] Fourthly, the present invention provides a computer-readable storage medium having a readable computer program stored thereon, which, when executed by a processor, implements the steps of the dynamically adaptive wire bonding method as described in any of the first aspects above.

[0047] Compared with existing technologies, this invention provides a dynamically adaptive wire bonding method, apparatus, device, and storage medium. Based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the wire, a multi-objective optimization algorithm is used to plan the wire bonding path, generating an initial bonding path with a preset arc shape. This avoids short circuits or poor contact caused by wire overlap, thereby improving the reliability of the bonding. When the monitored wire bonding path information exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and the wire is pulled to the second bonding point on the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain the wire-bonded chip. Dynamically adjusting the bonding path can respond to changes in the production process in real time, effectively reducing the rework rate caused by path deviation, thereby saving time and costs and improving production efficiency. Attached Figure Description

[0048] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention, and not all embodiments. For those skilled in the art, other drawings obtained from these drawings without creative effort are all within the scope of protection of this application.

[0049] Figure 1 This is a flowchart of a wire bonding method based on dynamic adaptation provided in an embodiment of the present invention.

[0050] Figure 2 This is a flowchart of a method for collecting position information of chip pads and substrate pads, provided by an embodiment of the present invention.

[0051] Figure 3 This is a flowchart of determining the location of a bonding point according to an embodiment of the present invention.

[0052] Figure 4 This is a flowchart of a path planning method for wire bonding provided by an embodiment of the present invention.

[0053] Figure 5 This is a flowchart of a real-time monitoring method for wire bonding, provided by an embodiment of the present invention.

[0054] Figure 6 This is a flowchart illustrating a method for dynamically adjusting the path of wire bonding, as provided in an embodiment of the present invention.

[0055] Figure 7 This is a wire bonding device based on dynamic adaptation provided in an embodiment of the present invention.

[0056] Figure 8 This is a schematic diagram of the structure of a computer device provided in an embodiment of the present invention.

[0057] Figure 9 This is a schematic diagram of the structure of a computer-readable storage medium provided in an embodiment of the present invention. Detailed Implementation

[0058] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0059] To make the description of this disclosure more detailed and complete, illustrative descriptions of embodiments and specific examples of the present invention are provided below; however, these are not the only forms of implementing or utilizing the specific embodiments of the present invention. The embodiments cover features of multiple specific embodiments and the methods, steps, and their order for constructing and operating these specific embodiments. However, other specific embodiments may also be used to achieve the same or equivalent functions and step sequences. Based on the embodiments in this application, all other embodiments obtained by those skilled in the art without inventive effort are within the scope of protection of this application.

[0060] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in sequences other than those illustrated or described herein.

[0061] In the description of the embodiments of the present invention, unless otherwise stated, " / " means "or". For example, A / B can mean A or B. The word "and / or" in the text is merely a description of the relationship between related objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, in the description of the embodiments of this application, "multiple" means two or more. Other quantifiers should be understood similarly. The preferred embodiments described herein are only used to illustrate and explain the present invention and are not intended to limit the present invention. Furthermore, the embodiments and features in the embodiments of this application can be combined with each other without conflict.

[0062] To address the low efficiency of existing dynamic adaptive wire bonding techniques, this invention provides a dynamic adaptive wire bonding method, such as... Figure 1 The flowchart described above illustrates a dynamically adaptive wire bonding method provided in an embodiment of the present invention, which includes the following steps.

[0063] S10: Obtain the chip to be bonded, the leads and the packaging substrate for encapsulating the chip to be bonded, and pre-process the pads of the chip to be bonded and the pads of the packaging substrate to obtain pre-processed chip pads and substrate pads. Specifically, in this embodiment of the invention, by obtaining the chip to be bonded, the leads and the packaging substrate, and pre-processing the pads of the chip to be bonded and the pads of the packaging substrate, the cleanliness of the pads can be ensured, thereby improving the success rate and reliability of the subsequent bonding process. The pre-processing step can remove contaminants and oxide layers from the surface of the pads, reduce the defect rate caused by poor soldering, and ensure the yield rate of the final product.

[0064] S20: Fix the chip to be bonded to a preset position on the packaging substrate, and collect the pre-processed position information of the chip pads and substrate pads. Specifically, in this embodiment of the invention, fixing the chip at the preset position and collecting position information can ensure the alignment accuracy between the chip and the substrate. Accurate position information collection can effectively reduce alignment errors during the bonding process and improve the reliability of the bonding.

[0065] S30: Determine the position information of the first bonding point based on the collected chip pad position information, and determine the position information of the second bonding point based on the collected substrate pad position information. Specifically, in this embodiment of the invention, by determining the position information of the first bonding point and the position information of the second bonding point, necessary geometric parameters are provided for the subsequent wire bonding process, ensuring the accuracy of wire bonding.

[0066] S40: Obtain the parameter information of the lead wire, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, perform path planning for the lead wire bonding using a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape. Specifically, in this embodiment of the invention, the multi-objective optimization algorithm can generate an optimal lead wire bonding path, significantly improving the efficiency and reliability of lead wire bonding and reducing time costs in the production process. Reasonable path planning can reduce the mechanical stress on the lead wire during bonding, avoid lead wire breakage or damage, and improve product stability.

[0067] S50: The wire is bonded to the first bonding point of the chip pad and energy is applied. The wire is then pulled to the substrate pad according to the generated initial bonding path, and the bonding path information of the wire is monitored in real time during the pulling process. Specifically, in this embodiment of the invention, real-time monitoring of the bonding path information of the wire during the pulling process helps to promptly identify and correct potential problems, ensuring the smooth progress of the wire bonding process.

[0068] S60: When the detected bonding path information of the lead exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and the lead is pulled to the second bonding point of the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain the wire-bonded chip. Specifically, in this embodiment of the invention, dynamic adjustment of the bonding path can respond to changes in the production process in real time, ensuring the quality of wire bonding and maintaining high-quality output even in environments with many uncertainties. By adjusting in a timely manner, the rework rate caused by path deviation can be effectively reduced, thereby saving time and costs and improving production efficiency.

[0069] As an optional implementation, in step S10, the chip to be bonded, the leads for packaging the chip to be bonded, and the packaging substrate are obtained. The pads of the chip to be bonded and the pads of the packaging substrate are pre-processed to obtain pre-processed chip pads and substrate pads, including:

[0070] S11: The surfaces of the chip pads and substrate pads are subjected to dry cleaning treatment to obtain dry-cleaned chip pads and substrate pads. Specifically, in this embodiment of the invention, dry cleaning can effectively remove contaminants such as dust, grease, and oxides from the surface of the pads, ensuring that the pad surfaces are clean. Clean pads can significantly improve the contact quality during the soldering process and reduce the defect rate.

[0071] S12: The surfaces of the cleaned chip pads and substrate pads are activated to obtain pre-treated chip pads and substrate pads. Specifically, in this embodiment of the invention, the activation treatment can change the chemical properties of the pad surface, thereby improving the adhesion of solder or leads. Through the activation treatment, the wettability of the soldering interface can be improved, allowing the solder to flow and fill the pad surface better, forming a more reliable connection.

[0072] As an optional implementation method, such as Figure 2 The flowchart described above, provided by an embodiment of the present invention, illustrates a process for acquiring position information of chip pads and substrate pads. In step S20, fixing the chip to be bonded to a preset position on the packaging substrate and acquiring the position information of the chip pads and substrate pads includes:

[0073] S21: Image information of the chip pads and substrate pads is acquired from at least two different perspectives using an image sensor. Specifically, in this embodiment of the invention, acquiring image information from different perspectives can comprehensively cover the shape, position, and state of the pads, ensuring richer and more accurate information. This multi-angle sampling provides a foundation for subsequent feature recognition and analysis. Images from the same perspective can reduce information loss due to perspective deviation, improve the accuracy of pad feature recognition in subsequent analysis, and help ensure the success rate of the soldering process.

[0074] S22: Feature recognition is performed on the image information of chip pads and substrate pads from different perspectives, and the contour information of chip pads and substrate pads from different perspectives is extracted respectively. Specifically, in this embodiment of the invention, the contour information of the pads is automatically identified and extracted by image processing technology, which reduces the reliance on manual operation, improves detection efficiency and consistency, and reduces the possibility of human error.

[0075] S23: Perform stereo matching on the contour information of chip pads and substrate pads from different perspectives, and calculate the three-dimensional center point coordinates of the chip pads and substrate pads based on the stereo matching results to obtain the three-dimensional position information of the chip pads and substrate pads. Specifically, in this embodiment of the invention, the three-dimensional position information of the pads can be obtained by calculating the three-dimensional center point coordinates through stereo matching, providing extremely important spatial data for subsequent soldering or bonding. Accurate three-dimensional position information can significantly improve the alignment accuracy during the soldering process, reduce soldering defects caused by alignment errors, such as cold solder joints or short circuits, and improve the overall quality of the product.

[0076] As an optional implementation method, such as Figure 3 The flowchart described above, provided in an embodiment of the present invention, illustrates a process for determining the location of bonding points. In step S30, the step of presetting the location information of a first bonding point based on the acquired chip pad location information, and presetting the location information of a second bonding point based on the acquired substrate pad location information, includes:

[0077] S31: A constraint condition for the initial neck angle of the lead is preset. Based on the three-dimensional position information of the chip pad, the bonding area of ​​the chip pad is determined. Within the bonding area of ​​the chip pad, the coordinate information of the first bonding point that satisfies the constraint condition for the initial neck angle of the lead is determined. Specifically, in this embodiment of the invention, by presetting the constraint condition for the initial neck angle of the lead, it can be ensured that the shape and direction of the lead meet the design requirements during the soldering process, thereby reducing the risk of soldering defects. By determining the bonding area based on the three-dimensional position information, a suitable first bonding point can be accurately found, which helps improve the alignment accuracy during the soldering process and ensures optimal contact between the lead and the pad.

[0078] S32: A preset lead connection angle range is defined. Based on the three-dimensional position information of the substrate pads, the bonding area of ​​the substrate pads is determined. Within the bonding area of ​​the substrate pads, the coordinate information of a second bonding point that satisfies the preset lead connection angle range is determined. Specifically, in this embodiment of the invention, by presetting the lead connection angle range, it can be ensured that the angle of the lead is appropriate when connected to the substrate pads, optimizing the soldering quality and reducing poor contact caused by improper angles.

[0079] As an optional implementation method, such as Figure 4 The above is a flowchart of path planning for wire bonding provided by an embodiment of the present invention. In step S40, the parameter information of the wire is obtained, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the wire, a multi-objective optimization algorithm is used to plan the path of the wire bonding to generate an initial bonding path with a preset arc shape, including:

[0080] S41: Obtain the diameter and material type of the lead wire, and construct a parametric curve model of the lead wire based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire. Specifically, in this embodiment of the invention, by obtaining the diameter and material type of the lead wire and combining it with the bonding point position information, an accurate parametric curve model can be constructed.

[0081] S42: The control parameters in the parameterized curve model are solved using the multi-objective optimization algorithm, with the optimization objectives being to minimize the maximum tension during lead wire pulling and to maximize the minimum gap between adjacent lead wire arcs. Specifically, in this embodiment of the invention, minimizing the maximum tension during pulling reduces the risk of lead wire deformation or breakage during welding, thereby improving welding reliability. Maximizing the minimum gap between arcs helps reduce interference between leads, improves space utilization, and avoids short circuits or poor contact problems caused by lead wire overlap.

[0082] S43: Based on the optimal control parameters of the solved parametric curve model, an initial bonding path with a preset arc shape is generated. Specifically, in this embodiment of the invention, the generated initial bonding path ensures the correct routing of the lead wires during the welding process, reduces unnecessary path adjustments, and improves welding efficiency. The preset arc shape ensures consistent lead wire paths in each welding process, improving production consistency and reducing welding defects caused by path variations.

[0083] As an optional implementation method, such as Figure 5 The flowchart described above, provided by an embodiment of the present invention, illustrates real-time monitoring of the wire bonding path. In step S50, the wire is bonded to the first bonding point of the chip pad and energy is applied. The wire is then pulled to the substrate pad according to the generated initial bonding path, and the bonding path information of the wire is monitored in real-time during the pulling process. This includes:

[0084] S51: The dynamic tension value during the lead wire pulling process is acquired in real time using a tension sensor, and the actual movement trajectory of the bonding head in three-dimensional space is acquired in real time using a positioning sensor. Specifically, in this embodiment of the invention, the combination of the tension sensor and the positioning sensor enables real-time monitoring of the dynamic tension of the lead wire and the movement trajectory of the bonding head. This real-time monitoring provides important data support for subsequent adjustments and optimizations. Real-time acquisition of dynamic tension values ​​and movement trajectories allows for more accurate parameters, thereby enhancing the reliability of subsequent analysis and ensuring that every step of the welding process is effectively controlled.

[0085] S52: The actual movement trajectory of the bonding head in three-dimensional space is matched and calculated with the planned trajectory of the initial bonding path to obtain the real-time position deviation of the lead bonding path. Specifically, in this embodiment of the invention, by matching and calculating the actual movement trajectory with the planned trajectory, the accuracy and consistency of the welding process can be evaluated in real time, ensuring that the actual movement of the lead conforms to the predetermined design. The real-time position deviation allows for rapid adjustment of the bonding head's movement path to address deviations caused by external factors, thereby improving welding accuracy.

[0086] S53: Based on the dynamic tension value of the lead wire and the real-time positional deviation of the lead wire bonding path, the bonding path information of the lead wire is obtained. Specifically, in this embodiment of the invention, combining the dynamic tension value with the real-time positional deviation allows for a comprehensive evaluation of the bonding path quality of the lead wire, providing a basis for subsequent welding quality control. By acquiring the bonding path information in real time, the operation can be adjusted in real time during the welding process to ensure that the lead wire is welded in the optimal state, thereby improving the stability and reliability of the welding. Based on the obtained bonding path information, the entire welding process can be optimized, reducing the defect rate, improving production efficiency, and ultimately improving product quality.

[0087] As an optional implementation method, such as Figure 6 The flowchart described above illustrates a dynamic adjustment process for wire bonding paths according to an embodiment of the present invention. In step S60, when the detected wire bonding path information exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and the wire is pulled to a second bonding point on the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain a wire-bonded chip.

[0088] S61: When the dynamic tension value of the lead wire or the real-time position deviation of the lead bonding path exceeds a preset threshold range, the initial bonding path is dynamically adjusted. Specifically, in this embodiment of the invention, by monitoring the dynamic tension value and position deviation, real-time feedback control can be achieved to promptly correct problems that occur during the welding process and ensure welding quality. Dynamically adjusting the initial bonding path helps maintain the stability of the welding process, avoids welding defects caused by excessive tension or position deviation, thereby improving the reliability of the final product.

[0089] S62: Based on the deviation amplitude of the dynamic tension value of the lead wire and the real-time positional deviation of the lead bonding path, calculate the compensation amount of the initial bonding path. Specifically, in this embodiment of the invention, by calculating the compensation amount, the initial bonding path can be corrected more accurately, making the actual path during the welding process closer to the designed path, thereby improving the welding accuracy.

[0090] S63: The initial bonding path is corrected based on the calculated compensation amount to generate an adjusted bonding path. Specifically, in this embodiment of the invention, the generated adjusted bonding path can ensure optimal contact between the lead and the pad during the soldering process, thereby improving the soldering quality.

[0091] S64: Control the bonding head to move along the adjusted bonding path, pull the lead to the second bonding point of the substrate pad and apply energy to obtain the wire-bonded chip. Specifically, in this embodiment of the invention, by controlling the movement of the bonding head along the adjusted path, the lead can be effectively and accurately pulled to the target pad, ensuring a high success rate of soldering. Applying energy according to the adjusted bonding path helps improve soldering quality, ensures a reliable connection between the lead and the pad, and enhances the overall performance of the product.

[0092] In this embodiment of the invention, based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, a multi-objective optimization algorithm is used to plan the path for wire bonding, generating an initial bonding path with a preset arc shape. This avoids short circuits or poor contact caused by lead wire overlap, thereby improving the reliability of the bonding. When the monitored wire bonding path information exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and the lead wire is pulled to the second bonding point on the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain the wire-bonded chip. Dynamically adjusting the bonding path can respond to changes in the production process in real time, effectively reducing the rework rate caused by path deviation, thereby saving time and costs and improving production efficiency.

[0093] Example 2

[0094] Based on the above-described dynamically adaptive wire bonding method, this invention provides a dynamically adaptive wire bonding apparatus, such as... Figure 7 As shown in Figure 7, the structure of this dynamically adaptive wire bonding device includes an acquisition module 71, a data acquisition module 72, a determination module 73, a generation module 74, a monitoring module 75, and an adjustment module 76.

[0095] The acquisition module 71 is used to acquire the chip to be bonded, as well as the lead wire and packaging substrate for packaging the chip to be bonded, and to preprocess the pads of the chip to be bonded and the pads of the packaging substrate to obtain preprocessed chip pads and substrate pads.

[0096] The acquisition module 72 is used to fix the chip to be bonded at a preset position on the packaging substrate and to acquire the position information of the chip pads and substrate pads after preprocessing.

[0097] The determining module 73 is used to determine the position information of the first bonding point based on the collected position information of the chip pads, and to determine the position information of the second bonding point based on the collected position information of the substrate pads.

[0098] The generation module 74 is used to acquire the parameter information of the lead wire, and based on the position information of the first bonding point, the position information of the second bonding point and the parameter information of the lead wire, perform path planning for the lead wire bonding through a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape.

[0099] The monitoring module 75 is used to bond the lead to the first bonding point of the chip pad and apply energy, pull the lead to the substrate pad according to the generated initial bonding path, and monitor the bonding path information of the lead in real time during the pulling process.

[0100] The adjustment module 76 is used to dynamically adjust the initial bonding path when the detected bonding path information of the lead exceeds a preset threshold range, and to pull the lead to the second bonding point of the substrate pad based on the adjusted bonding path, and apply energy to the second bonding point to obtain the chip after lead bonding.

[0101] For further details regarding the implementation of the above-mentioned technical solution by each module in the above-mentioned dynamically adaptive wire bonding device, please refer to the description of the dynamically adaptive wire bonding method provided in the above-mentioned embodiments of the invention, which will not be repeated here.

[0102] Example 3

[0103] Based on the above-mentioned dynamically adaptive wire bonding method, such as Figure 8 As shown in the diagram, an embodiment of the present invention provides a schematic diagram of a wire bonding device based on dynamic adaptation. The identification device includes a processor 81 and a memory 82 coupled to the processor 81. The memory 82 stores a computer program, which, when executed by the processor 81, causes the processor 81 to perform the steps of the wire bonding method based on dynamic adaptation described in the above embodiment.

[0104] For further details regarding the implementation of the above-mentioned technical solution by the processor 81 in the above-mentioned dynamically adaptive wire bonding device, please refer to the description of the dynamically adaptive wire bonding method provided in the above-mentioned embodiments of the invention, which will not be repeated here.

[0105] The processor 81 can also be called a CPU (Central Processing Unit). The processor 81 may be an integrated circuit chip with signal processing capabilities. The processor 81 can also be a general-purpose processor, a DSP (Digital Signal Processor), an ASIC (Application Specific Integrated Circuit), an FPGA (Field Programmable Gate Array), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor, or the processor 81 can be any conventional processor.

[0106] Example 4

[0107] like Figure 9 The diagram illustrates the structure of a computer-readable storage medium provided in this embodiment of the invention. The storage medium stores a readable computer program 91. This computer program 91 can be stored in the storage medium as a software product, including several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) or processor to execute all or part of the steps of the methods described in various embodiments of the invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, magnetic disks or optical disks, ROM (Read-Only Memory), RAM (Random Access Memory), or terminal devices such as computers, servers, mobile phones, and tablets.

[0108] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative; for instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple modules or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be indirect coupling or communication connection through some interfaces, apparatuses, or modules, and may be electrical, mechanical, or other forms.

[0109] The modules described as separate components may or may not be physically separate. The components shown as modules may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0110] Furthermore, the functional modules in the various embodiments of this application can be integrated into one processing module, or each module can exist physically separately, or two or more modules can be integrated into one module. The integrated module can be implemented in hardware or as a software functional module. If the integrated module is implemented as a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium.

[0111] In the above embodiments, implementation can be achieved, in whole or in part, through software, hardware, firmware, or any combination thereof. When implemented in software, it can be implemented, in whole or in part, as a computer program product.

[0112] The computer program product includes one or more computer instructions. When the computer program instructions are loaded and executed on a computer, all or part of the processes or functions described in the embodiments of this application are generated. The computer may be a general-purpose computer, a special-purpose computer, a computer network, or other programmable device. The computer instructions may be stored in a computer-readable storage medium or transmitted from one computer-readable storage medium to another. For example, the computer instructions may be transmitted from one website, computer, server, or data center to another website, computer, server, or data center via wired (e.g., coaxial cable, fiber optic, digital subscriber line (DSL)) or wireless (e.g., infrared, wireless, microwave, etc.) means. The computer-readable storage medium may be any available medium that a computer can store or a data storage device such as a server or data center that integrates one or more available media. The available medium may be a magnetic medium (e.g., floppy disk, hard disk, magnetic tape), an optical medium (e.g., DVD), or a semiconductor medium (e.g., solid-state disk (SSD)).

[0113] The technical solutions provided in this application have been described in detail above. Specific examples have been used in this application to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application. At the same time, for those skilled in the art, there will be changes in the specific implementation methods and application scope based on the ideas of this application. Therefore, the content of this specification should not be construed as a limitation of this application.

[0114] Those skilled in the art will understand that embodiments of this application can be provided as methods, systems, or computer program products. Therefore, this application can take the form of a completely hardware embodiment, a completely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, this application can take the form of a computer program product embodied on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0115] This application is described with reference to flowchart illustrations and / or block diagrams of methods, apparatus (systems), and computer program products according to this application. It should be understood that each block of the flowchart illustrations and / or block diagrams, and combinations of blocks in the flowchart illustrations and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing apparatus to produce a machine, such that the instructions, which execute via the processor of the computer or other programmable data processing apparatus, generate instructions for implementing the flowchart illustrations and / or block diagrams. Figure 1 One or more processes and / or boxes Figure 1 A device that provides the functions specified in one or more boxes.

[0116] These computer program instructions may also be stored in a computer-readable storage medium that can direct a computer or other programmable data processing device to function in a particular manner, such that the instructions stored in the computer-readable storage medium produce an article of manufacture including instruction means, which are implemented in a process Figure 1 One or more processes and / or boxes Figure 1 The function specified in one or more boxes.

[0117] These computer program instructions may also be loaded onto a computer or other programmable data processing equipment to cause a series of operational steps to be performed on the computer or other programmable equipment to produce a computer-implemented process, thereby providing instructions that execute on the computer or other programmable equipment for implementing the process. Figure 1 One or more processes and / or boxes Figure 1 The steps of the function specified in one or more boxes.

[0118] Obviously, those skilled in the art can make various modifications and variations to this application without departing from the spirit and scope of this application. Therefore, if such modifications and variations fall within the scope of the claims of this application and their equivalents, this application also intends to include such modifications and variations.

Claims

1. A wire bonding method based on dynamic adaptive bonding, characterized in that, include: Obtain the chip to be bonded, as well as the leads and packaging substrate for packaging the chip to be bonded, and preprocess the pads of the chip to be bonded and the pads of the packaging substrate to obtain the preprocessed chip pads and substrate pads. The chip to be bonded is fixed at a preset position on the packaging substrate, and the position information of the pre-processed chip pads and substrate pads is collected, including: Image information of the chip pads and substrate pads is acquired from at least two different perspectives using an image sensor. Feature recognition is performed on the image information of chip pads and substrate pads from different perspectives, and the contour information of chip pads and substrate pads from different perspectives is extracted respectively. The contour information of chip pads and substrate pads from different perspectives is matched in three dimensions, and the three-dimensional center point coordinates of the chip pads and substrate pads are calculated based on the results of the three-dimensional matching to obtain the three-dimensional position information of the chip pads and substrate pads. The location information of the first bonding point is determined based on the acquired chip pad location information, and the location information of the second bonding point is determined based on the acquired substrate pad location information, including: The initial neck angle of the preset lead is constrained. The bonding area of ​​the chip pad is determined based on the three-dimensional position information of the chip pad. The coordinate information of the first bonding point that satisfies the initial neck angle constraint of the preset lead is determined in the bonding area of ​​the chip pad. The preset lead access angle range is defined, and the bonding area of ​​the substrate pad is determined based on the three-dimensional position information of the substrate pad. The coordinate information of the second bonding point that satisfies the preset lead access angle range is determined in the bonding area of ​​the substrate pad. The diameter and material type of the lead wire are obtained, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, a multi-objective optimization algorithm is used to plan the path of the lead wire bonding and generate an initial bonding path with a preset arc shape. The lead is bonded to the first bonding point of the chip pad and energy is applied. The lead is pulled to the substrate pad according to the generated initial bonding path, and the bonding path information of the lead is monitored in real time during the pulling process. When the detected bonding path information of the lead exceeds the preset threshold range, the initial bonding path is dynamically adjusted, and the lead is pulled to the second bonding point of the substrate pad based on the adjusted bonding path. Energy is applied to the second bonding point to obtain the chip after lead bonding.

2. The wire bonding method based on dynamic adaptation according to claim 1, characterized in that, The process of obtaining the chip to be bonded, the leads and packaging substrate for packaging the chip to be bonded, and preprocessing the chip pads and substrate pads includes: The surfaces of the chip pads and substrate pads are subjected to dry cleaning treatment to obtain dry-cleaned chip pads and substrate pads. The surfaces of the cleaned chip pads and substrate pads are activated to obtain pretreated chip pads and substrate pads.

3. The wire bonding method based on dynamic adaptive bonding according to claim 1, characterized in that, The process of obtaining the diameter and material type of the lead wire, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, performing path planning for the lead wire bonding using a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape, includes: Obtain the diameter and material type of the lead wire, and construct a parametric curve model of the lead wire based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire. With the optimization objectives of minimizing the maximum tension during lead wire traction and maximizing the minimum gap between lead wire arcs and adjacent lead wire arcs, the control parameters in the parameterized curve model are solved using the multi-objective optimization algorithm. Based on the optimal control parameters of the solved parametric curve model, an initial bonding path with a preset arc shape is generated.

4. The wire bonding method based on dynamic adaptive bonding according to claim 1, characterized in that, The step of bonding the lead to the first bonding point of the chip pad and applying energy, pulling the lead to the substrate pad according to the generated initial bonding path, and monitoring the bonding path information of the lead in real time during the pulling process includes: The dynamic tension value during the lead wire traction process is collected in real time by a tension sensor, and the actual movement trajectory of the bonding head in three-dimensional space is collected in real time by a positioning sensor. The actual motion trajectory of the bonding head in three-dimensional space is matched and calculated with the planned trajectory of the initial bonding path to obtain the real-time position deviation of the wire bonding path. The bonding path information of the lead wire is obtained based on the dynamic tension value of the lead wire and the real-time position deviation of the lead wire bonding path.

5. The wire bonding method based on dynamic adaptive bonding according to claim 4, characterized in that, When the detected bonding path information of the lead exceeds a preset threshold range, the initial bonding path is dynamically adjusted, and based on the adjusted bonding path, the lead is pulled to the second bonding point of the substrate pad. Energy is applied to the second bonding point to obtain the chip after wire bonding, including: When the dynamic tension value of the lead wire or the real-time position deviation of the lead wire bonding path exceeds the preset threshold range, the initial bonding path is dynamically adjusted. The compensation amount of the initial bonding path is calculated based on the deviation amplitude of the dynamic tension value of the lead wire and the real-time position deviation of the lead bonding path. The initial bonding path is corrected based on the calculated compensation amount to generate an adjusted bonding path; The bonding head is controlled to move along the adjusted bonding path, pulling the lead to the second bonding point of the substrate pad and applying energy to obtain the chip after wire bonding.

6. A dynamically adaptive wire bonding apparatus, the apparatus being used to implement the dynamically adaptive wire bonding method according to any one of claims 1-5, characterized in that, include: The acquisition module is used to acquire the chip to be bonded, as well as the lead wire and packaging substrate for packaging the chip to be bonded, and to preprocess the pads of the chip to be bonded and the pads of the packaging substrate to obtain the preprocessed chip pads and substrate pads. The acquisition module is used to fix the chip to be bonded at a preset position on the packaging substrate and acquire the position information of the chip pads and substrate pads after preprocessing. The determination module is used to determine the position information of the first bonding point based on the position information of the chip pads collected, and to determine the position information of the second bonding point based on the position information of the substrate pads collected. The generation module is used to obtain the diameter and material type of the lead wire, and based on the position information of the first bonding point, the position information of the second bonding point, and the parameter information of the lead wire, it performs path planning for the lead wire bonding through a multi-objective optimization algorithm to generate an initial bonding path with a preset arc shape. The monitoring module is used to bond the lead to the first bonding point of the chip pad and apply energy, pull the lead to the substrate pad according to the generated initial bonding path, and monitor the bonding path information of the lead in real time during the pulling process. The adjustment module is used to dynamically adjust the initial bonding path when the detected bonding path information of the lead exceeds a preset threshold range, and to pull the lead to the second bonding point of the substrate pad based on the adjusted bonding path, and apply energy to the second bonding point to obtain the chip after lead bonding.

7. A wire bonding device based on dynamic adaptive bonding, characterized in that, Includes memory and processor, wherein: The memory is used to store computer programs; The processor is used to read the computer program in the memory and execute the steps of the dynamically adaptive wire bonding method as described in any one of claims 1 to 5.

8. A computer-readable storage medium, characterized in that, It stores a readable computer program that, when executed by a processor, implements the steps of the dynamically adaptive wire bonding method as described in any one of claims 1 to 5.

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