Electronic component manufacturing device

Abstract

The invention discloses an electronic component manufacturing device, and relates to the field of circuit board production and preparation. An electronic component manufacturing device comprises a mechanical arm, and further comprises a sleeve, a driving device and a driving device, the cutting assembly is mounted in the sleeve and used for cutting pins at the bottom of the circuit board; the second air pipe is installed on the sleeve, and the second air pipe is used for inflating the sleeve; the air pressure sensor is mounted in the sleeve, and the air pressure sensor is used for monitoring the air pressure in the sleeve; the infrared sensor is mounted in the sleeve, and the infrared sensor is used for detecting the length of the pin entering the sleeve; according to the invention, the mechanical arm drives the sleeve to realize quick positioning, and the stable action of the cutting assembly is matched, so that the problems that the perpendicularity is difficult to guarantee and the pins are easy to skew in manual cutting are effectively solved, and the circuit board is convenient to produce and prepare.

Description

Technical Field

[0001] This invention belongs to the field of circuit board manufacturing technology, specifically, it relates to an electronic component manufacturing apparatus. Background Technology

[0002] In the manufacturing process of electronic components, after the circuit board components are soldered, the protruding pins need to be cut and trimmed to ensure that the pin length meets the assembly requirements.

[0003] Currently, most pin cutting operations are done manually, with operators using tools such as diagonal pliers to manually cut the pins.

[0004] However, when cutting manually, it is difficult to ensure the perpendicularity of the cutting surface to the pin, which can easily lead to problems such as skewed or tilted cutting, resulting in inconsistent pin lengths and affecting subsequent assembly accuracy. At the same time, it is difficult to control the force applied during cutting. Excessive shearing force may cause the pin to deform or bend, or even loosen the solder pad, affecting the reliability of soldering. This is especially problematic for precision circuit boards or small-diameter pins. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to overcome the shortcomings of the prior art and provide a circuit board manufacturing process that can overcome or at least partially solve the above problems.

[0006] To solve the above-mentioned technical problems, the basic concept of the technical solution adopted by the present invention is: an electronic component manufacturing apparatus, including a robotic arm, and further comprising:

[0007] A sleeve is mounted on the robotic arm;

[0008] A cutting assembly, installed inside the sleeve, is used to cut the pins on the bottom of the circuit board;

[0009] Air tube two is installed on the sleeve and is used to inflate the sleeve with air.

[0010] A pressure sensor is installed inside the sleeve, and the pressure sensor is used to monitor the air pressure inside the sleeve.

[0011] An infrared sensor is installed inside the sleeve, and the infrared sensor is used to detect the length of the pin entering the sleeve.

[0012] Using a robotic arm, a sleeve is placed over the pin. An infrared sensor detects the length of the pin. When the top of the sleeve touches the bottom of the circuit board, air enters through the air tube. An air pressure sensor monitors the air pressure inside the sleeve. Then, the robotic arm moves the sleeve downwards and a cutting component cuts off the excess part on the pin.

[0013] Furthermore, the cutting assembly includes a cutting telescopic cylinder and a cutter. Two sets of the cutting telescopic cylinders are fixedly connected to the inner wall of the sleeve, and the cutter is fixedly connected to the telescopic end of the cutting telescopic cylinder. By the synchronous extension of the telescopic ends of the two sets of cutting telescopic cylinders, the pin can be cut by the cutter.

[0014] Furthermore, the sleeve is provided with a first mounting cavity and a second mounting cavity. A compression spring is installed in the second mounting cavity. A pressure plate is connected to the compression spring. A push plate is fixedly connected to the pressure plate. The compression spring is used to pre-compress and store energy. When the stored energy is released, the push plate will move, thereby impacting the pin.

[0015] Furthermore, an inflatable airbag is installed in the first mounting cavity, and a return spring is installed in the first mounting cavity. A movable plate is fixedly connected to the inflated end of the inflatable airbag, and one end of the return spring is connected to the movable plate. A pressure plate is fixedly connected to the movable plate at an incline. By inflating the inflatable airbag, the pressure plate can be moved down to squeeze the pressure plate, thereby causing the pressure plate to move towards the second mounting cavity, and thus causing the push plate to move away from the axis of the sleeve.

[0016] Furthermore, an electromagnet is fixedly connected to the side wall of the sleeve, and the electromagnet is used to attract and fix the second pressure plate after it has moved.

[0017] Furthermore, an inductive displacement sensor is installed on the side wall of the sleeve, which is used to monitor the displacement of the pin after it is subjected to an impact.

[0018] Furthermore, a sealing airbag is installed at the top of the sleeve, and two sets of air pipes are installed on the sleeve, which are respectively connected to the inflatable airbag and the sealing airbag.

[0019] Furthermore, the inflatable airbag is provided with a first vent valve, and the sealed airbag is provided with a second vent valve. The first vent valve and the second vent valve are used to release the gas inside the airbag.

[0020] Furthermore, a mounting base is fixedly connected to the robotic arm, and multiple sets of lifting telescopic cylinders are fixedly connected inside the mounting base. The telescopic end of the lifting telescopic cylinder is fixedly connected to the sleeve. By extending the telescopic end of the lifting telescopic cylinder, the sleeve can be moved away from the mounting base, thereby creating a gap between the two for the discharge of the cut pins.

[0021] Furthermore, a cover plate is installed on the mounting cavity, and a rubber pad is installed on the push plate.

[0022] After adopting the above technical solution, the present invention has the following beneficial effects compared with the prior art: The present invention achieves rapid positioning by driving the sleeve with a robotic arm, and with the stable action of the cutting component, it effectively solves the problem that manual cutting is difficult to guarantee verticality and easily leads to pin skew, which is convenient for use in the production and preparation of circuit boards. Attached Figure Description

[0023] In the attached diagram:

[0024] Figure 1 This is a schematic diagram of the structure of an electronic component manufacturing apparatus proposed in this invention;

[0025] Figure 2 This is a schematic diagram of the mounting base and sleeve in an electronic component manufacturing apparatus proposed in this invention;

[0026] Figure 3 This is a schematic cross-sectional view of the mounting base and sleeve in an electronic component manufacturing apparatus proposed in this invention. Figure 1 ;

[0027] Figure 4 This invention proposes an electronic component manufacturing apparatus. Figure 3 A schematic diagram of the structure of part A;

[0028] Figure 5 This is a schematic cross-sectional view of the mounting base and sleeve in an electronic component manufacturing apparatus proposed in this invention. Figure 2 ;

[0029] Figure 6 This invention proposes an electronic component manufacturing apparatus. Figure 5 A structural diagram of section B;

[0030] Figure 7 This is a schematic cross-sectional view of the mounting base and sleeve in an electronic component manufacturing apparatus proposed in this invention. Figure 3 ;

[0031] Figure 8 This invention proposes an electronic component manufacturing apparatus. Figure 7 A structural diagram of section C;

[0032] Figure 9 This is a schematic diagram of the structure of an electronic component manufacturing apparatus according to the present invention when cutting the bottom pins of a circuit board.

[0033] In the diagram: 1. Robotic arm; 2. Mounting base; 201. Lifting telescopic cylinder; 3. Sleeve; 301. Mounting cavity one; 302. Cover plate; 303. Mounting cavity two; 304. Air pipe one; 305. Air pipe two; 4. Inflatable airbag; 401. Air relief valve one; 501. Return spring; 502. Moving plate; 503. Pressure plate one; 601. Compression spring; 602. Pressure plate two; 603. Push plate; 604. Rubber pad; 605. Electromagnet; 701. Cutting telescopic cylinder; 702. Cutting blade; 8. Sealing airbag; 801. Air relief valve two; 901. Air pressure sensor; 902. Inductive displacement sensor; 903. Infrared sensor. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments will be clearly and completely described below with reference to the accompanying drawings. The following embodiments are used to illustrate the present invention, but are not intended to limit the scope of the present invention.

[0035] Example: Refer to Figure 1 , Figure 3 , Figure 4 , Figure 5 An electronic component manufacturing apparatus includes a robotic arm 1, and further includes: a sleeve 3 mounted on the robotic arm 1; a cutting assembly mounted inside the sleeve 3 for cutting pins on the bottom of a circuit board; a second air tube 305 mounted on the sleeve 3 for inflating the sleeve 3; a pressure sensor 901 mounted inside the sleeve 3 for monitoring the pressure inside the sleeve 3; and an infrared sensor 903 mounted inside the sleeve 3 for detecting the length of the pins entering the sleeve 3. The robotic arm 1 places the sleeve 3 over the pins, and the infrared sensor 903 detects the pin length. When the top of the sleeve 3 touches the bottom of the circuit board, air enters through the second air tube 305, and the pressure sensor 901 monitors the pressure inside the sleeve 3. Subsequently, the robotic arm 1 moves the sleeve 3 downwards, and the cutting assembly cuts off the excess portion of the pins.

[0036] When using this device, the circuit board is first fixed by a clamp, and the position of the plug-in and pin is determined by image recognition. Then, the robotic arm 1 moves the sleeve 3 to below the pin, and the infrared sensor 903 detects the pin length. Subsequently, the robotic arm 1 adjusts the position of the sleeve 3 so that the top of the sleeve 3 rests against the bottom of the circuit board. Then, the air tube 2 305 inflates the sleeve 3, and the air pressure sensor 901 monitors the air pressure inside the sleeve 3. Based on the pin length detected by the infrared sensor 903, the robotic arm 1 moves the sleeve 3 down to the preset cutting position, and starts the cutting component to cut off the excess part on the pin. After the cutting is completed, the robotic arm 1 moves the sleeve 3 away from the pin, completing one cutting operation and preparing for the next pin processing.

[0037] It should be noted that this device is suitable for circuit boards without other through holes next to the pins. If there are holes on other circuit boards next to the pins, gas can easily leak from these holes during the airtightness test, which will interfere with the judgment of the airtightness of the pin solder holes and affect the test results of soldering stability.

[0038] Specifically, as shown in the figure, the cutting assembly includes a cutting telescopic cylinder 701 and a cutter 702. Two sets of cutting telescopic cylinders 701 are fixedly connected to the inner wall of the sleeve 3. The cutter 702 is fixedly connected to the telescopic end of the cutting telescopic cylinder 701. Through the synchronous extension of the telescopic ends of the two sets of cutting telescopic cylinders 701, the pin can be cut by the cutter 702.

[0039] Based on the pin length data detected by the infrared sensor 903 and the required final pin length, the robotic arm 1 and the sleeve 3 work together to precisely adjust the position of the cutter 702, so that the cutter 702 moves to the position where it needs to be cut (the cutting surface is located at the appropriate part of the pin). The telescopic ends of the two sets of cutting telescopic cylinders 701 extend synchronously, driving the cutter 702 to move towards the pin and cut the pin, removing the excess part on the pin, thereby obtaining the pin of the required length. During the cutting process, the smoothness and perpendicularity of the cutting are ensured.

[0040] Furthermore, such as Figure 4 , Figure 6 As shown, the sleeve 3 has a first mounting cavity 301 and a second mounting cavity 303. A compression spring 601 is installed in the second mounting cavity 303, and a pressure plate 602 is connected to the compression spring 601. A push plate 603 is fixedly connected to the pressure plate 602. The compression spring 601 is pre-compressed to store energy. Releasing the stored energy will cause the push plate 603 to move, thereby impacting the pin. An expansion airbag 4 is installed in the first mounting cavity 301, and a return spring 501 is installed in the first mounting cavity 301. A moving plate 502 is fixedly connected to the expansion end of the expansion airbag 4. One end of the return spring 501 is connected to the moving plate 502. A pressure plate 503 is fixedly connected to the inclined part of the sleeve 3. The expansion of the air bladder 4 causes the pressure plate 503 to move downward and squeeze the pressure plate 602, thereby moving the pressure plate 602 towards the mounting cavity 303. This causes the push plate 603 to move away from the axis of the sleeve 3. An electromagnet 605 is fixedly connected to the side wall of the sleeve 3. The electromagnet 605 is used to attract and fix the moved pressure plate 602. An inductive displacement sensor 902 is installed on the side wall of the sleeve 3. The inductive displacement sensor 902 is used to monitor the displacement of the pin after it is impacted. A cover plate 302 is installed on the mounting cavity 301, and a rubber pad 604 is installed on the push plate 603.

[0041] In practical use, the circuit board to be processed is first firmly fixed on the worktable using a fixture to ensure that the circuit board will not shift during subsequent processing. Then, the circuit board is photographed using an industrial camera, and the position of the plug-in on the circuit board is determined based on image recognition technology, thereby accurately obtaining the position information of the pins and providing a basis for the subsequent actions of the robotic arm 1.

[0042] After receiving the pin position information, the robotic arm 1 moves the sleeve 3 to directly below the pin. At this time, the sealing airbag 8 at the top of the sleeve 3 has not yet contacted the bottom of the circuit board. The infrared sensor 903 starts to work, detects the length of the pin, and transmits the detected pin length data to the control system in real time so as to determine the cutting position.

[0043] The robotic arm 1 moves the sleeve 3 upward, causing the sealing airbag 8 at the top of the sleeve 3 to fit tightly against the bottom of the circuit board, thus forming a relatively sealed space between the sealing airbag 8, the bottom of the circuit board, and the inside of the sleeve 3. The air pipe 305 begins to inflate the sleeve 3, and the air pressure sensor 901 monitors the air pressure changes inside the sleeve 3 in real time. If there are gaps in the solder holes at the pin soldering points, gas will leak from the gaps, and the air pressure inside the sleeve 3 will not be able to remain stable. If the soldering is complete and there are no gaps in the solder holes, the air pressure inside the sleeve 3 will stabilize at the set value.

[0044] While performing the airtightness test, air is inflated into the expansion bladder 4 through the air tube 304. The expansion bladder 4 pushes the moving plate 502 to move, and the pressure plate 503 on the moving plate 502 moves down, squeezing the pressure plate 602 in the mounting cavity 303. The pressure plate 602 compresses the compression spring 601 in the mounting cavity 303, causing the push plate 603 to move towards the axis of the sleeve 3 (at this time, the push plate 603 is not in contact with the pin and is in an energy storage and ready-to-fire state). Then, the electromagnet 605 is de-energized, the compression spring 601 releases its stored energy, pushes the pressure plate 602 to move, and then drives the push plate 603 to quickly impact the pin (the impact position is the lower middle part of the pin). The impact force is controlled by the compression of the compression spring 601, and must not exceed 5N to avoid damage to the pins or pads due to excessive force. At the same time, the inductive displacement sensor 902 monitors the displacement of the pins after the impact in real time. If the displacement exceeds 0.2mm, the soldering is considered unstable; if the displacement is ≤0.2mm, the soldering is considered stable. After the impact test is completed, the expansion airbag 4 is inflated again, causing the moving plate 502 to move the pressure plate 1 503 downward. The pressure plate 2 602 moves and resets under the action of the pressure plate 1 503, and is then fixed by the electromagnet 605. At this time, the push plate 603 also returns to its initial position, preparing for subsequent actions.

[0045] Based on the pin length data detected by the infrared sensor 903 and the required final pin length, the robotic arm 1 and the sleeve 3 work together to precisely adjust the position of the cutter 702, moving it to the desired cutting position (the cutting surface is located at a suitable part of the pin). The telescopic ends of the two sets of cutting telescopic cylinders 701 extend synchronously, driving the cutter 702 to move towards the pin and cut it, removing the excess part of the pin, generally leaving 1.5mm. The specific length needs to be set according to the requirements to obtain the pin of the required length. During cutting, the smoothness and perpendicularity of the cut are ensured.

[0046] Another implementation, such as Figure 5 , Figure 8 As shown, a sealing airbag 8 is installed on the top of the sleeve 3. Two sets of air pipes 304 are installed on the sleeve 3. The two sets of air pipes 304 are connected to the inflatable airbag 4 and the sealing airbag 8 respectively. The inflatable airbag 4 is equipped with a first-stage vent valve 401, and the sealing airbag 8 is equipped with a second-stage vent valve 801. The first-stage vent valve 401 and the second-stage vent valve 801 are used to discharge the gas in the airbag.

[0047] After cutting is completed, by controlling the opening of the vent valve 401, the gas in the expansion air bag 4 is discharged from the vent valve 401. Since the vent valve 401 faces the cutter 702, the discharged gas can clean the cutter 702, blowing away the residual pin debris and other impurities on the cutter 702, ensuring the cleanliness and cutting effect of the cutter 702 when used next time.

[0048] Furthermore, such as Figure 3 , Figure 5 As shown, a mounting base 2 is fixedly connected to the robotic arm 1. Multiple sets of lifting telescopic cylinders 201 are fixedly connected inside the mounting base 2. The telescopic end of the lifting telescopic cylinder 201 is fixedly connected to the sleeve 3. By extending the telescopic end of the lifting telescopic cylinder 201, the sleeve 3 can be moved away from the mounting base 2, and a gap will appear between the two for the discharge of the cut pin.

[0049] After the cutting is completed, the push plate 603 has completed its separation action, and the cutter 702 is cleaned, the telescopic end of the lifting telescopic cylinder 201 in the mounting base 2 extends, pushing the sleeve 3 away from the mounting base 2, creating a gap between the mounting base 2 and the sleeve 3. The cut-off lead waste is discharged through this gap to facilitate the cutting of new leads. Afterward, the telescopic end of the lifting telescopic cylinder 201 retracts, and the sleeve 3 returns to its initial position. By inflating the expansion bladder 4, the moving plate 502 drives the pressure plate 503 to move downward, and the push plate 603 will also return to its original position. At the same time, the gas in the sealing bladder 8 is discharged through the vent valve 801. The entire device completes one working cycle and waits for the next lead cutting operation.

[0050] Specifically, solenoid valves can be installed inside air pipe 304 and air pipe 305 to ensure the sealing of sleeve 3. At the same time, a sealing rubber gasket can be installed between sleeve 3 and mounting base 2 to improve the sealing effect.

[0051] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-described technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. An electronic component manufacturing apparatus, comprising a robotic arm (1), characterized in that, Also includes: Sleeve (3) is mounted on the robotic arm (1); A cutting assembly, installed inside the sleeve (3), is used to cut the pins on the bottom of the circuit board; Air tube 2 (305) is installed on the sleeve (3) and is used to inflate the sleeve (3); A pressure sensor (901) is installed inside the sleeve (3) and is used to monitor the air pressure inside the sleeve (3); An infrared sensor (903) is installed inside the sleeve (3) and is used to detect the length of the pin entering the sleeve (3); The sleeve (3) is placed on the pin by the robotic arm (1). The length of the pin is detected by the infrared sensor (903). When the top of the sleeve (3) touches the bottom of the circuit board, air enters the second air pipe (305). The air pressure inside the sleeve (3) is monitored by the air pressure sensor (901). Then the robotic arm (1) moves the sleeve (3) down and cuts off the excess part on the pin by the cutting component.

2. The electronic component manufacturing apparatus according to claim 1, characterized in that, The cutting assembly includes a cutting telescopic cylinder (701) and a cutter (702). The two sets of cutting telescopic cylinders (701) are fixedly connected to the inner wall of the sleeve (3). The cutter (702) is fixedly connected to the telescopic end of the cutting telescopic cylinder (701). By the synchronous extension of the telescopic ends of the two sets of cutting telescopic cylinders (701), the pin can be cut by the cutter (702).

3. The electronic component manufacturing apparatus according to claim 2, characterized in that, The sleeve (3) is provided with a first mounting cavity (301) and a second mounting cavity (303). A compression spring (601) is installed in the second mounting cavity (303). A pressure plate (602) is connected to the compression spring (601). A push plate (603) is fixedly connected to the pressure plate (602). The compression spring (601) is used to pre-compress and store energy. When the stored energy is released in the future, the push plate (603) will move and thus impact the pin.

4. The electronic component manufacturing apparatus according to claim 3, characterized in that, An inflatable airbag (4) is installed in the first mounting cavity (301). A reset spring (501) is installed in the first mounting cavity (301). A movable plate (502) is fixedly connected to the inflated end of the inflatable airbag (4). One end of the reset spring (501) is connected to the movable plate (502). A pressure plate (503) is fixedly connected to the movable plate (502) at an incline. By inflating the inflatable airbag (4), the pressure plate (503) can move down and squeeze the pressure plate (602), thereby causing the pressure plate (602) to move towards the second mounting cavity (303), and thus causing the push plate (603) to move away from the axis of the sleeve (3).

5. The electronic component manufacturing apparatus according to claim 4, characterized in that, An electromagnet (605) is fixedly connected to the side wall of the sleeve (3), and the electromagnet (605) is used to attract and fix the moving pressure plate (602).

6. The electronic component manufacturing apparatus according to claim 5, characterized in that, An inductive displacement sensor (902) is installed on the side wall of the sleeve (3). The inductive displacement sensor (902) is used to monitor the displacement of the pin after it is impacted.

7. The electronic component manufacturing apparatus according to claim 4, characterized in that, The top of the sleeve (3) is equipped with a sealing airbag (8), and two sets of air pipes (304) are installed on the sleeve (3). The two sets of air pipes (304) are respectively connected to the inflatable airbag (4) and the sealing airbag (8).

8. The electronic component manufacturing apparatus according to claim 7, characterized in that, The inflatable airbag (4) is provided with a first vent valve (401), and the sealed airbag (8) is provided with a second vent valve (801). The first vent valve (401) and the second vent valve (801) are used to release the gas inside the airbag.

9. The electronic component manufacturing apparatus according to claim 1, characterized in that, The robotic arm (1) is fixedly connected to a mounting base (2), and multiple sets of lifting telescopic cylinders (201) are fixedly connected inside the mounting base (2). The telescopic end of the lifting telescopic cylinder (201) is fixedly connected to the sleeve (3). By extending the telescopic end of the lifting telescopic cylinder (201), the sleeve (3) can be moved away from the mounting base (2), and a gap will appear between the two for the discharge of the cut pin.

10. An electronic component manufacturing apparatus according to claim 3, characterized in that, A cover plate (302) is installed on the mounting cavity (301), and a rubber pad (604) is installed on the push plate (603).

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