LED packaging structure and LED display screen

Abstract

The invention discloses an LED packaging structure, which comprises a silicon adapter plate, a rewiring layer, a plurality of LED chips and a packaging colloid, the silicon adapter plate is provided with a first surface and a second surface; the silicon adapter plate is provided with a silicon through hole; the silicon through hole penetrates through the silicon adapter plate; the rewiring layer is arranged on the first surface of the silicon adapter plate; the rewiring layer is electrically connected with the silicon through hole through a solder ball; the LED chip is arranged on one side, far away from the silicon adapter plate, of the rewiring layer; the LED chips are electrically connected with the rewiring layer through the solder balls, so that the LED chips are connected in an inverted manner; the packaging colloid covers the rewiring layer and the plurality of LED chips. The invention aims to provide the LED packaging structure and the LED display screen to realize uniform light mixing.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of LED packaging, in particular to an LED packaging structure and an LED display screen. BACKGROUND

[0002] The existing LED packaging structure usually packages red, green and blue chips respectively and then assembles them, and such a separate structure causes a physical gap between the light emitting points of the chips, which makes it difficult to realize real pixel-level display. Due to the spatial separation of the chips, obvious graininess appears when viewed at a close distance, and the difference in light distribution angle of the chips causes uneven mixed light, which seriously affects the delicacy and color uniformity of the display picture.

[0003] Therefore, it is urgent to develop an LED packaging structure and an LED display screen to solve the problem of uneven color caused by the spatial separation of multiple chips. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the purpose of the present application is to provide an LED packaging structure and an LED display screen to realize uniform mixed light.

[0005] The purpose of the present application is achieved by the following technical solutions:

[0006] An LED packaging structure comprises a silicon adapter plate, a rewiring layer, a plurality of LED chips and a packaging gel. The silicon adapter plate is provided with a first surface and a second surface. The silicon adapter plate is provided with a through silicon via. The through silicon via penetrates the silicon adapter plate. The rewiring layer is arranged on the first surface of the silicon adapter plate. The rewiring layer is electrically connected to the through silicon via through solder balls. The LED chips are arranged on the side of the rewiring layer away from the silicon adapter plate. The LED chips are electrically connected to the rewiring layer through solder balls, so that the LED chips are connected in a flip-chip manner. The packaging gel covers the rewiring layer and the plurality of LED chips.

[0007] Further, the LED packaging structure comprises three LED chips, which are red, green and blue chips respectively.

[0008] Further, the packaging gel is provided with a liquid crystal optical modulation layer. The liquid crystal optical modulation layer comprises, in sequence from the side away from the rewiring layer, a first polarizer, a first electrode layer, a liquid crystal layer, a second electrode layer and a second polarizer. The silicon adapter plate is further provided with a control unit, which is electrically connected to the first electrode layer and the second electrode layer through the rewiring layer.

[0009] Further, only one independent liquid crystal optical modulation layer is arranged above the three LED chips. The control unit is configured to provide a common driving current to the three LED chips and an alternating current driving signal to the liquid crystal optical modulation layer.

[0010] Further, the three LED chips are respectively provided with independent liquid crystal optical modulation layers above; the control unit is configured to provide independent driving currents to the three LED chips respectively; and independently control the three liquid crystal optical modulation layers.

[0011] Further, the first electrode layer is electrically connected to a reference voltage output end of the control unit; and the second electrode layer is electrically connected to a driving signal output end of the control unit.

[0012] Further, the driving signal output end is configured to provide an alternating current driving signal to the liquid crystal optical modulation layer, so that the direction of the electric field between the first electrode layer and the second electrode layer is periodically reversed.

[0013] Further, the first polaroid is a vertical polaroid; and the second polaroid is a horizontal polaroid.

[0014] Further, the liquid crystal optical modulation layer further comprises a color filter layer.

[0015] An LED display screen comprising the LED packaging structure and a driving substrate; the LED packaging structure is connected to the driving substrate in an array form through the solder balls arranged on the second surface.

[0016] Compared with the prior art, the present application has the following advantages:

[0017] 1. The through silicon via penetrating through the silicon adapter board provides a vertical conductive path for high-density electrical interconnection; the redistribution layer arranged on the first surface of the silicon adapter board and electrically connected to the through silicon via through the solder balls realizes the leading-out and fan-out of the signals from the chip side to the back surface; the multiple LED chips arranged on the side of the redistribution layer away from the silicon adapter board and electrically connected to the redistribution layer through the solder balls in a flip-chip manner enable the multiple chips to share the same silicon adapter board interconnection platform, thereby shortening the electrical path between the chips; and the encapsulation glue covering the redistribution layer and the multiple LED chips provides mechanical protection and optical interface for the integrated structure. The structure realizes the high-density and short-path integration of the multiple LED chips in a single packaging unit through the stacked interconnection design of the silicon adapter board and the redistribution layer.

[0018] 2、Based on the configuration of three LED chips being red light chip, green light chip and blue light chip respectively, the full-color light emitting capability in a single packaging unit is realized; based on the packaging colloid being provided with a liquid crystal optical modulation layer containing a first polaroid, a first electrode layer, a liquid crystal layer, a second electrode layer and a second polaroid, and being connected with each electrode layer through the control unit in the silicon adapter plate via the rewiring layer, the light intensity modulation mechanism integrated in the packaging interior is constructed; further, based on the scheme of the three LED chips sharing a single liquid crystal optical modulation layer and being provided with common driving current and alternating driving signal by the control unit, the overall brightness of the full-color pixel is realized. Or based on another scheme of each LED chip corresponding to an independent liquid crystal optical modulation layer and being independently driven and controlled by the control unit, the independent regulation of each color light output is realized. The integrated structure realizes the high integration of the full-color display unit and the flexible controllability of the light output characteristics by integrating the three-color chips and the liquid crystal optical modulation system in a single packaging body.

[0019] 3、Based on the first electrode layer and the second electrode layer being connected to different output ends of the control unit respectively, the liquid crystal layer is constructed with an independently controllable electric field application path; based on the driving signal output end being configured to provide alternating driving signal and make the electric field direction between the electrode layers periodically reverse, the stable driving of the liquid crystal molecules is realized and the ion aggregation is effectively prevented. The electrode connection and driving scheme avoids the image ghosting problem caused by direct current residue. BRIEF DESCRIPTION OF DRAWINGS

[0020] Figure 1 It is a structure schematic diagram of an LED packaging structure of the present application;

[0021] Figure 2 It is an expanded schematic diagram shown in the figure; Figure 1

[0022] Figure 3 It is a structure schematic diagram of an LED display screen shown in the present application.

[0023] In the figure: 1, silicon adapter plate; 2, first surface; 3, second surface; 4, through silicon via; 5, rewiring layer; 6, solder ball; 7, LED chip; 701, red light chip; 702, green light chip; 703, blue light chip; 8, packaging colloid; 9, liquid crystal optical modulation layer; 901, first polaroid; 902, first electrode layer; 903, liquid crystal layer; 904, second electrode layer; 905, second polaroid; 906, color filter layer; 10, control unit; 101, reference voltage output end; 102, driving signal output end; 11, driving substrate. DETAILED DESCRIPTION

[0024] ​The application will be further described below in conjunction with the drawings and specific embodiments. It should be noted that the following described embodiments or technical features can be combined in any manner to form new embodiments without conflict.

[0025] It should be noted that when an element is referred to as being "on" another element, it can be directly on the other element or intervening elements can also be present. Where, when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element or intervening elements can also be present. As used herein the terms "vertical", "horizontal", "left", "right" and the like are merely used for the purpose of illustration and do not imply any limitation on the position of the present application.

[0026] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in the description of the application herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. As used herein, the term "and / or" includes any and all combinations of one or more of the associated listed items.

[0027] Referring to Figures 1-3 , the specific embodiments of a preferred embodiment of the present application are described below:

[0028] An LED packaging structure, comprising: a silicon adapter plate 1, a rewiring layer 5, a plurality of LED chips 7 and an encapsulating glue 8; the silicon adapter plate 1 is provided with a first surface 2 and a second surface 3; the silicon adapter plate 1 is provided with a through silicon via 4; the through silicon via 4 penetrates through the silicon adapter plate 1; the rewiring layer 5 is arranged on the first surface 2 of the silicon adapter plate 1; the rewiring layer 5 is electrically connected with the through silicon via 4 through solder balls 6; the LED chips 7 are arranged on the side of the rewiring layer 5 away from the silicon adapter plate 1; the LED chips 7 are electrically connected with the rewiring layer 5 through the solder balls 6, so that the LED chips 7 are connected in a flip-chip manner; the encapsulating glue 8 covers the rewiring layer 5 and the plurality of LED chips 7. The core role of the present LED packaging structure is to realize the integration and interconnection of the plurality of LED chips 7 in a single packaging unit through the collaborative design of the silicon adapter plate 1 and the rewiring layer 5.

[0029] The electrical signal is input via the through silicon via 4 of the second surface 3 of the silicon adapter plate 1 and is conducted to the rewiring layer 5 through the solder balls 6; the rewiring layer 5 redistributes and transmits the electrical signal to the corresponding LED chips 7; the LED chips 7 emit light under the drive of the current, and the generated heat is simultaneously dissipated through the paths of the solder balls 6, the rewiring layer 5 and the silicon adapter plate 1; the encapsulating glue 8 protects the internal precise structure from environmental erosion on the one hand and serves as an optical medium to regulate the light emission characteristics on the other hand.

[0030] In the implementation, firstly, the through silicon via 4 and the redistribution layer 5 are made on the silicon adapter plate 1; then the red, green and blue LED chips 7 are bonded to the designated positions of the redistribution layer 5 in flip-chip mode through the solder balls 6; finally, the encapsulation glue 8 covering the chips and the wiring layer is formed by the molding process to complete the preparation of the integrated packaging unit.

[0031] The structure comprises the silicon adapter plate 1, the redistribution layer 5 and the plurality of LED chips 7 which are sequentially stacked. The silicon adapter plate 1 is internally provided with the through silicon via 4 penetrating the first surface 2 and the second surface 3 thereof; the redistribution layer 5 is made on the first surface 2 of the silicon adapter plate 1 and is electrically connected with the through silicon via 4 through the solder balls 6; the plurality of LED chips 7 are arranged on the side of the redistribution layer 5 away from the silicon adapter plate 1 and are bonded to the redistribution layer 5 in flip-chip mode through the solder balls 6; and the encapsulation glue 8 completely covers the redistribution layer 5 and all the LED chips 7 to form a protective shell.

[0032] The packaging integrates the red, green and blue LED chips 7 to form a full-color light-emitting unit. The control unit 10 is configured to implement overall cooperative driving of the three-color chips to realize unified brightness adjustment and color mixing; or to independently drive and control each type of chip to realize accurate color matching and dynamic display effect in a wider color gamut range.

[0033] It can be understood that, based on the through silicon via 4 penetrating the silicon adapter plate 1, a vertical conductive path is provided for high-density electrical interconnection; based on the redistribution layer 5 being made on the first surface 2 of the silicon adapter plate 1 and being electrically connected with the through silicon via 4 through the solder balls 6, the chip-side signal is led out and fanned out to the back surface of the plate; based on the plurality of LED chips 7 being arranged on the side of the redistribution layer 5 away from the silicon adapter plate 1 and being electrically connected with the redistribution layer 5 in flip-chip mode through the solder balls 6, the plurality of chips share the same silicon adapter plate 1 interconnection platform, and the electrical path between the chips is shortened; and based on the encapsulation glue 8 covering the redistribution layer 5 and the plurality of LED chips 7, mechanical protection and optical interface are provided for the integrated structure. Through the stacked interconnection design of the silicon adapter plate 1 and the redistribution layer 5, the structure realizes the integration of the plurality of LED chips 7 in a single packaging unit with high density and short path.

[0034] Preferably, the structure comprises three LED chips 7, which are respectively a red LED chip 701, a green LED chip 702 and a blue LED chip 703. The core role of the present scheme is to integrate the red, green and blue chips in a single packaging unit to form a complete full-color light-emitting pixel.

[0035] The structure is provided with three LED chips 7 in the packaging body, which are respectively a red LED chip 701, a green LED chip 702 and a blue LED chip 703. The three LED chips are electrically interconnected and fixed through the redistribution layer 5 and share the same encapsulation glue 8 and electrical connection structure.

[0036] The control unit 10 can apply the same driving signal to the red, green and blue color chips to make them emit light synchronously and adjust the brightness as a whole unit; or can apply independent driving signals to realize independent control of the brightness of each color to mix and generate any color as required.

[0037] It can be understood that, based on the configuration of the three LED chips 7 as the red light chip 701, the green light chip 702 and the blue light chip 703, the full-color light emitting capability in a single packaging unit is realized; based on the fact that the packaging glue 8 is provided with the liquid crystal optical modulation layer 9 including the first polarizing plate 901, the first electrode layer 902, the liquid crystal layer 903, the second electrode layer 904 and the second polarizing plate 905, and the control unit 10 in the silicon adapter plate 1 is connected with each electrode layer through the rewiring layer 5, the light intensity modulation mechanism integrated in the packaging interior is constructed.

[0038] Preferably, the packaging glue 8 is provided with the liquid crystal optical modulation layer 9; the liquid crystal optical modulation layer 9 includes the first polarizing plate 901, the first electrode layer 902, the liquid crystal layer 903, the second electrode layer 904 and the second polarizing plate 905 which are sequentially stacked in the direction away from the rewiring layer 5; the silicon adapter plate 1 is further provided with the control unit 10 which is electrically connected with the first electrode layer 902 and the second electrode layer 904 through the rewiring layer 5. The core function of the scheme is to realize dynamic electric control adjustment of the light emitting brightness of the LED by integrating the liquid crystal optical modulation layer 9 in the packaging glue 8.

[0039] The liquid crystal optical modulation layer 9 is arranged in the packaging glue 8, and the modulation layer is sequentially stacked from bottom to top by the first polarizing plate 901, the first electrode layer 902, the liquid crystal layer 903, the second electrode layer 904 and the second polarizing plate 905; the control unit 10 integrated in the silicon adapter plate 1 is electrically connected with the first electrode layer 902 and the second electrode layer 904 through the rewiring layer 5.

[0040] The control unit 10 applies a control voltage to the first electrode layer 902 and the second electrode layer 904 to form an electric field in the liquid crystal layer 903; the electric field drives the liquid crystal molecules to deflect and change the optical state, thereby modulating the light intensity passing through the liquid crystal optical modulation layer 9, and finally realizing electric control adjustment of the light emitting brightness of the whole packaging unit.

[0041] Preferably, only one independent liquid crystal optical modulation layer 9 is arranged above the three LED chips 7; the control unit 10 is configured to provide a common driving current to the three LED chips 7 and provide an alternating current driving signal to the one liquid crystal optical modulation layer 9. The core function of the scheme is to synchronously control the synthesized light of the three color chips through the single liquid crystal optical modulation layer 9 to realize unified adjustment of the overall brightness.

[0042] An independent liquid crystal optical modulation layer 9 is arranged on the light emitting path of the three LED chips 7, and the modulation layer covers the light emitting areas of all the three color chips; the output end of the control unit 10 is connected to the common driving end of the three color chips and the electrode layer of the liquid crystal optical modulation layer 9 respectively.

[0043] The control unit 10 provides a unified driving current to the three LED chips 7 to make them emit light synchronously, and applies an alternating driving signal to the liquid crystal optical modulation layer 9; by adjusting the parameters of the alternating signal to control the light transmittance of the modulation layer, the overall brightness of the synthesized light formed by the mixing of red, green and blue colors is synchronously and steplessly adjusted.

[0044] It can be understood that, based on the scheme that the three LED chips 7 share a single liquid crystal optical modulation layer 9 and are provided with a common driving current and an alternating driving signal by the control unit 10, the overall brightness of the full-color pixel is cooperatively controlled;

[0045] Preferably, an independent liquid crystal optical modulation layer 9 is arranged above each of the three LED chips 7; the control unit 10 is configured to provide independent driving currents to the three LED chips 7 respectively, and to independently control the three liquid crystal optical modulation layers 9. The core role of this scheme is to achieve the independent regulation of the intensity of each primary color light by independently controlling the three color chips and their corresponding optical modulation layers.

[0046] An independent liquid crystal optical modulation layer 9 is arranged above each of the three LED chips 7, forming three independent optical regulation channels; the control unit 10 has multiple independent outputs, which are connected to the electrodes of each LED chip 7 and each liquid crystal optical modulation layer 9 respectively.

[0047] The control unit 10 adjusts the driving current of each LED chip 7 to control its light emitting intensity, and independently controls the light transmittance of each liquid crystal optical modulation layer 9; through the double regulation mechanism, the intensity of each primary color light is accurately managed, so as to realize a wider color gamut range and more accurate color reproduction.

[0048] It can be understood that, based on the other scheme that each LED chip 7 corresponds to an independent liquid crystal optical modulation layer 9 and is independently driven and controlled by the control unit 10, the independent regulation of the color light output is realized. The integrated structure integrates the three color chips and the liquid crystal optical modulation system in a single package, realizing the high integration of the full-color display unit and the flexible controllability of the light output characteristics.

[0049] Preferably, the first electrode layer 902 is electrically connected to the reference voltage output end 101 of the control unit 10; and the second electrode layer 904 is electrically connected to the driving signal output end 102 of the control unit 10. The core role of this scheme is to establish a stable electric field control environment for the liquid crystal optical modulation layer 9 through the asymmetric electrode driving architecture.

[0050] The first electrode layer 902 is connected to the reference voltage output end 101 of the control unit 10, and the second electrode layer 904 is connected to the driving signal output end 102. The two electrode layers are respectively connected to different potential control nodes.

[0051] The control unit 10 applies an alternating driving signal to the second electrode layer 904 through the driving signal output end 102, so that a periodically changing potential difference is formed between the two electrode layers. The potential difference generates an electric field with alternating directions in the liquid crystal layer 903, effectively avoiding the accumulation of charges at the electrode interface, and ensuring the long-term stable operation of the liquid crystal optical modulation layer 9.

[0052] Preferably, the driving signal output end 102 is configured to provide an alternating driving signal to the liquid crystal optical modulation layer 9, so that the direction of the electric field between the first electrode layer 902 and the second electrode layer 904 periodically reverses. The core effect of this scheme is to control the periodic reversal of the electric field direction of the liquid crystal layer 903 through the alternating driving signal, preventing the electrochemical degradation of the liquid crystal material.

[0053] The driving signal output end 102 of the control unit 10 is electrically connected to the second electrode layer 904, and the first electrode layer 902 is kept at a fixed potential reference, forming a complete electric field application path between the two electrode layers.

[0054] The driving signal output end 102 continuously provides an alternating voltage signal to the liquid crystal optical modulation layer 9, so that the direction of the electric field between the first electrode layer 902 and the second electrode layer 904 periodically reverses at a set frequency. This alternating electric field can effectively avoid the one-way bias of liquid crystal molecules and reduce the image retention phenomenon caused by charge accumulation.

[0055] It can be understood that based on the connection of the first electrode layer 902 and the second electrode layer 904 to different output ends of the control unit 10, an independently controllable electric field application path is constructed for the liquid crystal layer 903. Based on the configuration of the driving signal output end 102 to provide an alternating driving signal and periodically reverse the direction of the electric field between the electrode layers, stable driving of the liquid crystal molecules is achieved and ion accumulation is effectively prevented. This electrode connection and driving scheme avoids the image sticking problem caused by direct current residue.

[0056] Preferably, the first polarizer 901 is a vertical polarizer, and the second polarizer 905 is a horizontal polarizer. The core effect of this scheme is to construct the light valve basic structure by combining orthogonal polarizers to achieve basic optical control of LED light emission.

[0057] In the liquid crystal optical modulation layer 9, the first polarizer 901 is arranged as a vertical polarizer close to the LED chip 7, and the second polarizer 905 is arranged as a horizontal polarizer on the light emitting surface, and the polarization directions of the two are perpendicular to each other.

[0058] When the liquid crystal layer 903 is not powered, the polarization direction of the vertical polarized light is deflected after passing through the liquid crystal layer 903, and the light can pass through the horizontal polarizer to realize light transmission; when the liquid crystal layer 903 is powered, the vertical polarized light keeps the original polarization direction when passing through the liquid crystal layer 903, and is completely blocked by the horizontal polarizer to realize light shielding, thereby realizing the on-off control of the light path by electric control.

[0059] Preferably, the liquid crystal optical modulation layer 9 further comprises a color filter layer 906. The core function of this scheme is to enhance the color performance and color purity of the LED packaging structure by integrating the color filter layer 906.

[0060] The color filter layer 906 is added in the light path of the liquid crystal optical modulation layer 9, and the color filter layer is arranged between the light emitting surface of the LED chip 7 and the polarizer group, or integrated in other appropriate positions of the liquid crystal optical modulation layer 9.

[0061] When the white light or mixed light emitted by the LED chip 7 passes through the color filter layer 906, the light of a specific wavelength is selectively transmitted, and the light of the remaining wavelengths is absorbed or reflected, thereby improving the color saturation and color gamut range of the output light, and realizing more accurate color reproduction in cooperation with the brightness adjustment of the liquid crystal optical modulation layer 9.

[0062] The LED display screen comprises an LED packaging structure and a driving substrate 11; the LED packaging structure is connected to the driving substrate 11 in an array form through the solder balls 6 arranged on the second surface 3. The core function of the LED display screen is to construct a high-density display panel by arraying and integrating multiple LED packaging structures.

[0063] The LED display screen comprises a driving substrate 11 and multiple LED packaging structures arranged in an array form; each packaging structure is mechanically fixed and electrically interconnected with the corresponding pads of the driving substrate 11 through the solder balls 6 arranged on the second surface 3 of the silicon adapter plate 1.

[0064] The driving substrate 11 provides display data signals and working power to each LED packaging structure; by controlling the light emitting state of each LED chip 7 in different positions of the packaging structure, the required image and video content are synthesized on the display panel to realize full-color display function.

[0065] In summary, based on the silicon adapter plate 1 is provided with through its own through silicon via 4, for high-density electrical interconnection provides a vertical conductive path; based on the redistribution layer 5 is provided on the first surface 2 of the silicon adapter plate 1 and is electrically connected to the through silicon via 4 through the solder ball 6, realizes the chip side signal to the board back side lead-out and fan-out; based on a plurality of LED chips 7 is provided on the side of the redistribution layer 5 away from the silicon adapter plate 1 and is electrically connected to the redistribution layer 5 through the solder ball 6 in a flip-chip manner, so that multiple chips share the same silicon adapter plate 1 interconnection platform, shortens the electrical path between chips; based on the encapsulation glue 8 covers the redistribution layer 5 and the plurality of LED chips 7, provides mechanical protection and optical interface for the integrated structure. The basic structure realizes the higher density and shorter path integration of multiple LED chips 7 in a single packaging unit through the stacked interconnection design of the silicon adapter plate 1 and the redistribution layer 5. Further, based on the configuration of the three LED chips 7 as a red light chip 701, a green light chip 702 and a blue light chip 703, the full-color light emitting capability in a single packaging unit is realized; based on the encapsulation glue 8 is provided with a liquid crystal optical modulation layer 9 including a first polarizer 901, a first electrode layer 902, a liquid crystal layer 903, a second electrode layer 904 and a second polarizer 905, and is connected to each electrode layer through the redistribution layer 5 by the control unit 10 in the silicon adapter plate 1, a light intensity modulation mechanism integrated in the package is constructed; in specific implementation, either based on the scheme that the three LED chips 7 share a single liquid crystal optical modulation layer 9 and are driven by the control unit 10 to provide a common driving current and an alternating driving signal, realizing the overall brightness collaborative control of the full-color pixel; or based on the scheme that each LED chip 7 corresponds to an independent liquid crystal optical modulation layer 9 and is independently driven and controlled by the control unit 10, realizing independent control of each color light output. In addition, based on the first electrode layer 902 and the second electrode layer 904 being connected to different output ends of the control unit 10, respectively, an independently controllable electric field application path is constructed for the liquid crystal layer 903; based on the driving signal output end 102 being configured to provide an alternating driving signal and make the electric field direction between the electrode layers periodically reverse, realizing the stable driving of the liquid crystal molecules and effectively preventing ion aggregation. The integrated structure finally integrates three-color chips and a liquid crystal optical modulation system in a single package, constructs a full-color display unit with high stability and flexible control capability, effectively avoids the image ghosting problem caused by direct current residue, and realizes the overall improvement of display quality.

[0066] In the description of the present specification, the description of the terms "one embodiment", "some embodiments", "an example", "a specific example" or "some examples" and the like means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. Also, the specific features, structures, materials or characteristics described can be combined in an appropriate manner in any one or more embodiments or examples. In addition, the person skilled in the art can combine and combine the different embodiments or examples described in the present specification and the features of the different embodiments or examples without contradiction.

[0067] In addition, the terms "first", "second" are only for the purpose of description, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined with "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "a plurality of" is two or more, unless otherwise specifically limited.

[0068] The above is only a specific embodiment of the present application, but the protection scope of the present application is not limited thereto, and any person skilled in the art can easily think of various changes or replacements within the technical scope disclosed in the present application, which should be covered within the protection scope of the present application. Therefore, the protection scope of the present application should be subject to the protection scope of the claims.

Claims

1. An LED packaging structure, characterized in that, include: A silicon adapter plate (1) has a first surface (2) and a second surface (3) disposed opposite to each other; the silicon adapter plate (1) is provided with a silicon through-hole (4); the silicon through-hole (4) penetrates the silicon adapter plate (1). A redistribution layer (5) is disposed on the first surface (2) of the silicon interposer (1); the redistribution layer (5) is electrically connected to the through-silicon via (4) via solder balls (6); Multiple LED chips (7) are disposed on the side of the redistribution layer (5) away from the silicon adapter board (1); the LED chips (7) are electrically connected to the redistribution layer (5) through solder balls (6), thereby connecting the LED chips (7) in a flip-chip manner. An encapsulating colloid (8) covers the redistribution layer (5) and the plurality of LED chips (7).

2. The LED packaging structure according to claim 1, characterized in that, It includes three LED chips (7); the LED chips (7) are red light chip (701), green light chip (702) and blue light chip (703).

3. The LED packaging structure according to claim 2, characterized in that, The encapsulating colloid (8) is provided with a liquid crystal optical modulation layer (9); the liquid crystal optical modulation layer (9) includes a first polarizer (901), a first electrode layer (902), a liquid crystal layer (903), a second electrode layer (904) and a second polarizer (905) stacked sequentially along the direction away from the redistribution layer (5); the silicon adapter board (1) is also provided with a control unit (10), the control unit (10) being electrically connected to the first electrode layer (902) and the second electrode layer (904) respectively through the redistribution layer (5).

4. The LED packaging structure according to claim 3, characterized in that, Only one independent liquid crystal optical modulation layer (9) is provided above the three LED chips (7); the control unit (10) is configured to provide a common driving current to the three LED chips (7) and to provide an AC driving signal to one of the liquid crystal optical modulation layers (9).

5. The LED packaging structure according to claim 3, characterized in that, Each of the three LED chips (7) has an independent liquid crystal optical modulation layer (9) on its top; the control unit (10) is configured to provide independent driving currents to the three LED chips (7) respectively; and to independently control the three liquid crystal optical modulation layers (9).

6. The LED packaging structure according to claim 3, characterized in that, The first electrode layer (902) is electrically connected to the reference voltage output terminal (101) of the control unit (10); the second electrode layer (904) is electrically connected to the drive signal output terminal (102) of the control unit (10).

7. The LED packaging structure according to claim 6, characterized in that, The drive signal output terminal (102) is configured to provide an AC drive signal to the liquid crystal optical modulation layer (9), so that the electric field direction between the first electrode layer (902) and the second electrode layer (904) is periodically reversed.

8. The LED packaging structure according to claim 3, characterized in that, The first polarizer (901) is a vertical polarizer; the second polarizer (905) is a horizontal polarizer.

9. The LED packaging structure according to claim 3, characterized in that, The liquid crystal optical modulation layer (9) also includes a color filter layer (906).

10. An LED display screen, characterized in that, The LED package structure includes any one of claims 1-9 and a driving substrate (11); the LED package structure is connected to the driving substrate (11) in an array form by solder balls (6) disposed on the second surface (3).

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