Display panel and display device

Abstract

The embodiment of the invention provides a display panel and a display device, relates to the technical field of display, and is used for reducing the influence of light reflected by a reflective structure in the display panel on the display effect of the display panel. The display panel comprises a substrate, a pixel defining layer arranged on the substrate, a partition structure arranged on the side, away from the substrate, of the pixel defining layer, a light emitting part, a first metal layer arranged between the substrate and the pixel defining layer, and a light blocking structure arranged on the side, away from the substrate, of the first metal layer. The pixel defining layer comprises a first opening, and the pixel defining layer comprises an inorganic material. The partition structure comprises second openings, each second opening is communicated with the corresponding first opening in the direction perpendicular to the substrate, and each light-emitting part is located in the corresponding first opening and the corresponding second opening which are communicated with each other. The light blocking structure comprises third openings, one third opening is communicated with one second opening, and the light blocking structure comprises a shading material. The display panel is used for displaying images.

Description

Technical Field

[0001] This disclosure relates to the field of display technology, and more particularly to a display panel and display device. Background Technology

[0002] OLED (Organic Light Emitting Diode) display panels are highly favored by the market due to their numerous advantages, including low power consumption, short response time, high luminous efficiency, high brightness, and wide viewing angle. Top-emitting OLED display devices, in particular, have advantages over bottom-emitting OLED display devices because they do not affect circuit design, operate at lower voltage for the same brightness, have longer device lifespan, and consume less power. Summary of the Invention

[0003] The purpose of this disclosure is to provide a display panel and display device for reducing the impact of light reflected by the reflective structure inside the display panel on the display effect of the display panel.

[0004] To achieve the above objectives, the embodiments of this disclosure provide the following technical solutions:

[0005] On one hand, a display panel is provided. The display panel includes a substrate, a pixel defining layer disposed on the substrate, a partition structure disposed on the side of the pixel defining layer away from the substrate, a plurality of light-emitting portions, a first metal layer disposed between the substrate and the pixel defining layer, and a light-blocking structure disposed on the side of the first metal layer away from the substrate.

[0006] The pixel defining layer includes a plurality of first openings, and the partition structure includes a plurality of second openings. In a projected image onto the substrate, one second opening at least partially overlaps with one first opening. At least a portion of a light-emitting element is located within one first opening, and adjacent light-emitting elements are separated by the partition structure. The light-blocking structure includes a plurality of third openings. In a projected image onto the substrate, one third opening at least partially overlaps with one second opening, and in a projected image onto the substrate, one light-emitting element at least partially overlaps with one third opening. The light-blocking structure includes a light-shielding material.

[0007] In the aforementioned display panel, by setting a light-blocking structure, at least part of the light illuminating the display panel from the external environment will be blocked by the light-blocking structure and will not shine on the reflective structure between the light-blocking structure and the substrate, thereby reducing the impact of the light reflected by the reflective structure inside the display panel on the display effect of the display panel.

[0008] In some embodiments, the light-blocking structure is disposed on the side of the isolation structure near the substrate.

[0009] In some embodiments, the display panel further includes a second metal layer, a first planarization layer, and a first electrode layer. The second metal layer is disposed on the side of the first metal layer away from the substrate, the first planarization layer is disposed on the side of the second metal layer away from the substrate, the first electrode layer is disposed between the first planarization layer and the pixel defining layer, and a light-blocking structure is disposed between the first planarization layer and the first electrode layer.

[0010] In some embodiments, the display panel further includes a second planarization layer disposed between the first planarization layer and the first electrode layer. A light-blocking structure is disposed between the first and second planarization layers. In a normal projection onto the substrate, the third opening of the light-blocking structure coincides with or is located within the first opening of the pixel defining layer.

[0011] In some embodiments, the first electrode layer includes a plurality of first electrodes, one of which is located on the side of a light-emitting portion closer to the substrate. A light-blocking structure is disposed between the second planarization layer and the first electrode layer, with the edge of the first electrode overlapping the surface of the light-blocking structure away from the substrate.

[0012] In some embodiments, the light-blocking structure is disposed between the first electrode layer and the pixel defining layer. The pixel defining layer covers the surface of the light-blocking structure away from the substrate, as well as the side of the light-blocking structure that forms the third opening.

[0013] In some embodiments, the light-blocking structure is located between the pixel defining layer and the partition structure; the boundary of the light-blocking structure forming the third opening coincides with the boundary of the pixel defining layer forming the first opening, or is located within the boundary of the pixel defining layer forming the first opening; the boundary of the light-blocking structure forming the third opening coincides with the boundary of the partition structure forming the second opening, or is located within the boundary of the partition structure forming the second opening.

[0014] In some embodiments, the partition structure covers the surface of the light-blocking structure away from the substrate and the side of the light-blocking structure that forms the third opening.

[0015] In some embodiments, the light-blocking structure is disposed on the side of the isolation structure away from the substrate.

[0016] In some embodiments, the boundary of the light-blocking structure forming the third opening coincides with the boundary of the partition structure forming the second opening, or is located within the boundary of the partition structure forming the second opening.

[0017] In some embodiments, the display panel further includes an encapsulation structure comprising a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer sequentially disposed along a direction away from the substrate. The first inorganic encapsulation layer includes a plurality of inorganic encapsulation portions, at least a portion of which is located within a first opening. A light-blocking structure is disposed between the organic encapsulation layer and the barrier structure, or between the organic encapsulation layer and the second inorganic encapsulation layer, or on the side of the second inorganic encapsulation layer away from the substrate.

[0018] In some embodiments, the display panel further includes a light filter layer disposed on the side of the encapsulation structure away from the substrate. A light-blocking structure is disposed between the light filter layer and the second inorganic encapsulation layer.

[0019] In some embodiments, the filter layer includes a black matrix and a plurality of filter portions, the black matrix having a plurality of fourth openings, and a filter portion being located within one of the fourth openings. In a projection onto the substrate, the fourth opening is located within the third opening of the light-blocking structure.

[0020] In some embodiments, the partition structure comprises a metallic material or an inorganic material. A cross-section is taken along a plane perpendicular to the substrate to obtain a cross-sectional shape for the partition structure, including at least one of a trapezoid, an inverted trapezoid, or an I-shape.

[0021] On the other hand, a display device is provided. The display device includes a display panel as described in any of the above embodiments.

[0022] The above-described display device has the same structure and beneficial technical effects as the display panel provided in some of the above embodiments, and will not be described again here. Attached Figure Description

[0023] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0024] To more clearly illustrate the technical solutions in this disclosure, the accompanying drawings used in some embodiments of this disclosure will be briefly described below. Obviously, the drawings described below are only drawings of some embodiments of this disclosure, and those skilled in the art can obtain other drawings based on these drawings. In addition, the drawings described below can be regarded as schematic diagrams and are not intended to limit the actual size of the product, the actual flow of the method, the actual timing of the signals, etc. involved in the embodiments of this disclosure.

[0025] Figure 1 This is a structural diagram of a display device according to some embodiments;

[0026] Figure 2 This is a plan view of a display device according to some embodiments;

[0027] Figure 3 This is a cross-sectional structural diagram of a display panel according to some embodiments;

[0028] Figures 4 to 13 This is a cross-sectional structural diagram of the manufacturing process of a display panel according to some embodiments;

[0029] Figure 14 According to Figure 2 A cross-sectional structural diagram obtained from the mid-section line BB;

[0030] Figure 15 According to Figure 14 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0031] Figure 16 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0032] Figure 17 According to Figure 16 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0033] Figure 18 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0034] Figure 19 According to Figure 18 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0035] Figure 20 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0036] Figure 21 According to Figure 20 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0037] Figure 22 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0038] Figure 23 According to Figure 22 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0039] Figure 24 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0040] Figure 25 According to Figure 24 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0041] Figure 26 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0042] Figure 27 According to Figure 26 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0043] Figure 28 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0044] Figure 29 According to Figure 28 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0045] Figure 30 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0046] Figure 31 According to Figure 30 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0047] Figure 32 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0048] Figure 33 According to Figure 32 The diagram shows a cross-sectional structure during the fabrication process of the display panel.

[0049] Figure 34 According to Figure 2 Another cross-sectional structure diagram obtained from the mid-section line BB;

[0050] Figure 35 According to Figure 34 The diagram shows a cross-sectional structure during the fabrication process of the display panel. Detailed Implementation

[0051] The technical solutions in some embodiments of this disclosure will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this disclosure, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments provided in this disclosure are within the scope of protection of this disclosure.

[0052] Unless the context otherwise requires, throughout the specification and claims, the term "comprise" and its other forms, such as the third-person singular "comprises" and the present participle "comprising," are interpreted as open-ended and encompassing, meaning "including, but not limited to." In the description of the specification, terms such as "one embodiment," "some embodiments," "exemplary embodiments," "example," "specific example," or "some examples," etc., are intended to indicate that a particular feature, structure, material, or characteristic associated with that embodiment or example is included in at least one embodiment or example of this disclosure. The illustrative representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics mentioned may be included in any suitable manner in any one or more embodiments or examples.

[0053] Hereinafter, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of embodiments of this disclosure, unless otherwise stated, "a plurality of" means two or more.

[0054] In describing some embodiments, the terms "coupled" and "connected," and their derivative expressions, may be used. The term "connected" should be interpreted broadly; for example, a "connection" can be a fixed connection, a detachable connection, or an integral part; it can be a direct connection or an indirect connection via an intermediate medium. The term "coupled," for example, indicates that two or more components have direct physical or electrical contact. The term "coupled" or "communicatively coupled" may also refer to two or more components that do not have direct contact with each other but still cooperate or interact with each other. The embodiments disclosed herein are not necessarily limited to the content of this document.

[0055] "At least one of A, B and C" has the same meaning as "at least one of A, B or C", both including the following combinations of A, B and C: only A, only B, only C, combinations of A and B, combinations of A and C, combinations of B and C, and combinations of A, B and C.

[0056] "A and / or B" includes the following three combinations: A only, B only, and a combination of A and B.

[0057] As used herein, “about,” “approximately,” or “approximately” includes the stated value and the average value within an acceptable range of deviation from the given value, wherein the acceptable range of deviation is determined by a person skilled in the art taking into account the measurement under discussion and the error associated with the measurement of the given quantity (i.e., the limitations of the measurement system).

[0058] As used herein, “parallel,” “perpendicular,” and “equal” include the described situation and situations that are similar to the described situation, within an acceptable range of deviation, which is determined by those skilled in the art taking into account the measurement under discussion and the error associated with the measurement of a particular quantity (i.e., the limitations of the measurement system). For example, “parallel” includes absolute parallelism and approximate parallelism, where an acceptable range of deviation for approximate parallelism may be, for example, within 5°; “perpendicular” includes absolute perpendicularity and approximate perpendicularity, where an acceptable range of deviation for approximate perpendicularity may also be, for example, within 5°; “equal” includes absolute equality and approximate equality, where an acceptable range of deviation for approximate equality may be, for example, a difference between the two equals being less than or equal to 5% of either one.

[0059] It should be understood that when a layer or element is referred to as being on another layer or substrate, it can mean that the layer or element is directly on the other layer or substrate, or that there is an intermediate layer between the layer or element and the other layer or substrate.

[0060] This document describes exemplary embodiments with reference to cross-sectional views and / or plan views, which are idealized exemplary drawings. In the drawings, the thickness of layers and the area of ​​regions are enlarged for clarity. Therefore, variations in shape relative to the drawings are contemplated due to, for example, manufacturing techniques and / or tolerances. Thus, exemplary embodiments should not be construed as being limited to the shapes of the regions shown herein, but rather include shape deviations due to, for example, manufacturing processes. For example, etched areas shown as rectangular would typically have curved features. Therefore, the regions shown in the drawings are schematic in nature, and their shapes are not intended to show the actual shapes of the areas of the device, nor are they intended to limit the scope of the exemplary embodiments.

[0061] On the one hand, some embodiments of this disclosure provide a display device 100. For example... Figure 1and Figure 2 As shown, the display device 100 includes a display panel 10 and a circuit board 20, with the circuit board 20 connected to the display panel 10.

[0062] The display device 100 can be any device that displays moving (e.g., video), stationary (e.g., still image), text, or images. More specifically, the embodiments described are contemplated to be implemented in or associated with a variety of electronic devices, including but not limited to mobile phones, wireless devices, PDAs (Personal Digital Assistants), PIAs (Personal Information Assistants), handheld or portable computers, GPS receivers / navigators, cameras, camcorders, game consoles, wearable devices, flat panel displays, computer monitors, automotive displays (e.g., odometer displays), navigators, cockpit controllers and / or displays, displays of camera views (e.g., displays of rearview cameras in vehicles), electronic billboards or signs, and aesthetic structures (e.g., displays of images of a piece of jewelry).

[0063] In terms of its form, the display device 100 can be a flat panel display device, a curved display device, or a foldable display device, etc. In terms of its shape, the display device 100 can be rectangular or circular, etc. There are no limitations in this regard; it can be adapted to actual needs.

[0064] For example, the display device 100 may further include a frame and other electronic components, and the display panel 10 may be disposed within the frame. The circuit board 20 is configured to send drive signals to the display panel 10, such as display drive signals and / or touch drive signals. The display panel 10 displays images and / or performs touch operations under the drive of the circuit board 20.

[0065] For example, the circuit board 20 includes, but is not limited to, PCB (Printed Circuit Board) or FPC (Flexible Printed Circuit).

[0066] In some embodiments, such as Figure 2 As shown, the display panel 10 has a display area AA (Active Area). The display panel 10 includes a plurality of pixels disposed in the display area AA. Each pixel includes at least three sub-pixels P, that is, each pixel may include three, four or more sub-pixels. The plurality of sub-pixels included in each pixel may be arranged in a row, a column, an L-shape, a rectangle or a rhombus, etc.

[0067] For example, the light-emitting areas of the multiple sub-pixels included in each pixel may be the same or not completely identical. Sub-pixel P is the smallest light-emitting unit on the display panel 10, and sub-pixel P is used to display images. For example... Figure 2 As shown, multiple sub-pixels P can be arranged in multiple rows and columns.

[0068] The above is for illustrative purposes only and is not intended to limit this disclosure. The specific design can be adapted according to actual needs.

[0069] The following describes the structure of some display panels and their manufacturing methods provided in the embodiments of this disclosure.

[0070] In some embodiments, such as Figure 3 As shown, the display panel 10 includes a back panel 1, and a light-emitting structure 2 and an encapsulation structure 3 disposed on the back panel. The light-emitting structure 2 includes a plurality of light-emitting elements L, and the encapsulation structure 3 is disposed on the side of the light-emitting structure 2 away from the back panel 1.

[0071] The encapsulation structure 3 covers multiple light-emitting elements L to prevent water and oxygen in the environment from entering the display panel 10 and adversely affecting the light-emitting elements L.

[0072] In some embodiments, such as Figure 3 As shown, the backplate 1 includes a substrate 11, and at least one first metal layer 12 and a second metal layer 13 disposed on the substrate 11.

[0073] The substrate 11 is configured to carry the film layer on the display panel 10. Exemplarily, the substrate 11 may be a single-layer substrate including one layer of substrate material, or a composite substrate including at least two layers of substrate material stacked together; the substrate material may be a rigid material or a flexible material.

[0074] Rigid substrate materials include, but are not limited to, rigid glass, quartz, plastic, or PMMA (Polymethylmethacrylate).

[0075] Flexible substrate materials include, but are not limited to, flexible glass, FPC, PI-based film (Polyimide), PC (Polycarbonate), PET (Polyethylene terephthalate), or PEN (Polyethylene naphthalate dimethyl methacrylate).

[0076] Accordingly, the substrate 11 can be a rigid substrate or a flexible substrate. A rigid substrate can consist of one or more rigid substrate materials, or it can consist of at least one rigid substrate material and at least one flexible substrate material stacked together. Correspondingly, the display panel 10 can be a rigid display panel or a flexible display panel.

[0077] It should be noted that the material selection of the substrate 11 is related to the specific design of the display panel 10 and can be selected according to actual needs. This is only an illustrative example and is not intended to limit the scope of this disclosure.

[0078] For example, such as Figure 3 As shown, the first metal layer 12 can be a gate metal layer, and the second metal layer 13 can be a source / drain metal layer (SD). The materials of the first metal layer 12 and / or the second metal layer 13 include, but are not limited to, at least one of the following metal materials: gold, silver, copper, aluminum, platinum, nickel gold, etc.

[0079] In some embodiments, such as Figure 3 As shown, the display panel 10 also includes a first insulating layer 14. The first insulating layer 14 may be an ILD (Interlayer Dielectric). A first insulating layer 14 is disposed between adjacent first metal layers 12 and second metal layers 13. In the case where the display panel 10 includes multiple (two or more) first metal layers 12, a first insulating layer 14 may also be disposed between adjacent first metal layers 12 to separate adjacent first metal layers 12.

[0080] Based on this, in some examples, the first insulating layer 14 between two adjacent first metal layers 12 has a through hole, and the two ends of the through hole are respectively connected to the parts between the two adjacent first metal layers 12 that need to be connected. The parts between the two adjacent first metal layers 12 that need to be connected are connected through the through hole on the first insulating layer 14 between them.

[0081] In some embodiments, such as Figure 3 As shown, the display panel 10 also includes a second insulating layer, which may be a planarization layer 15.

[0082] When the display panel 10 includes one or more (two or more) second metal layers 13, a planarization layer 15 is provided on the side of the second metal layer 13 furthest from the substrate 11. When the display panel 10 includes multiple second metal layers 13, a planarization layer 15 may also be provided between adjacent second metal layers 13 to separate adjacent second metal layers 13.

[0083] Based on this, in some examples, the planar layer 15 between two adjacent second metal layers 13 has through holes, and the two ends of the through holes are respectively connected to the parts between the two adjacent second metal layers 13 that need to be connected. The parts between the two adjacent second metal layers 13 that need to be connected are connected through the through holes on the planar layer 15 between them.

[0084] In some embodiments, in the display panel 10, the number of planarization layers 15 is the same as the number of second metal layers 13. One planarization layer 15 is correspondingly disposed with one second metal layer 13. Each planarization layer 15 is disposed on the side of the corresponding second metal layer 13 away from the substrate 11. Each planarization layer 15 is adjacent to and in contact with the corresponding second metal layer 13.

[0085] In the display panel 10, the planarization layer 15 is provided to separate the parts of the two adjacent second metal layers 13 that need to be electrically insulated, and to make the surface of the back plate 1 furthest from the substrate 11 have a better flatness, so as to ensure the light-emitting display effect of the light-emitting structure 2 formed on the back plate 1 later.

[0086] Based on this, in other embodiments, such as Figure 3 As shown, in the display panel 10, the number of planarization layers 15 is greater than the number of layers of the second metal layer 13, and a planarization layer 15 is also provided on the side of the planarization layer 15 furthest from the substrate 11.

[0087] In this case, the second metal layer 13, which is furthest from the substrate 11 in the back plate 1, is provided with two planarization layers 15 on the side furthest from the substrate 11, so that the surface of the back plate 1 furthest from the substrate 11 can have a higher flatness.

[0088] In some embodiments, such as Figure 3 As shown, the light-emitting structure 2 includes a first electrode layer 21, a light-emitting functional layer 22, and a second electrode layer 23 arranged sequentially in a direction away from the back plate 1.

[0089] For example, one of the first electrode layer 21 and the second electrode layer 23 near the light-emitting surface of the display panel 10 may be formed of a transparent conductive material with a high work function. The electrode material may include at least one of indium tin oxide, indium zinc oxide, indium gallium oxide, gallium zinc oxide, zinc oxide, indium oxide, aluminum zinc oxide, and carbon nanotubes.

[0090] The electrode layer 21 and the electrode layer 23 that are furthest from the light-emitting surface of the display panel 10 may be formed of a material with high conductivity and low work function. The electrode material may include alloys such as magnesium-aluminum alloy and lithium-aluminum alloy, or at least one of metals such as magnesium, aluminum and silver.

[0091] One of the first electrode layer 21 and the second electrode layer 23 is an anode layer and the other is a cathode layer. The first electrode layer 21 and the second electrode layer 23 can be subjected to voltages of different magnitudes, generating an electric field between them, thereby causing the light-emitting functional layer 22 disposed between them to emit light under the action of the electric field.

[0092] Given that the relative magnitudes of the voltages of the first electrode layer 21 and the second electrode layer 23 are determined, the voltages applied to the multiple first electrodes 211 in the first electrode layer 21 can be controlled individually, thereby enabling individual control of the luminous brightness of the portion of the light-emitting functional layer 22 corresponding to the first electrode 211.

[0093] In some embodiments, such as Figure 3 As shown, the first electrode layer 21 includes a plurality of first electrodes 211, and the light-emitting functional layer 22 includes a plurality of light-emitting parts 221, with one light-emitting part 221 corresponding to one first electrode 211.

[0094] For example, such as Figure 3 As shown, the display panel 10 also includes a pixel defining layer 4, which includes a plurality of first openings K1. Each first opening K1 is correspondingly disposed with a first electrode 211, and the first opening K1 exposes at least a portion of the corresponding first electrode 211. A light-emitting part 221 is located in a first opening K1 and at least partially overlaps with a first electrode 211.

[0095] Each sub-pixel P includes a light-emitting element L. When the first electrode layer 21 and the second electrode layer 23 are configured as described above, such as... Figure 3 As shown, each light-emitting element L includes a first electrode 211, a light-emitting portion 221, and a second electrode 231 whose orthogonal projections on the substrate 11 overlap. A light-emitting element L is disposed within a first opening K1.

[0096] For example, the material of the pixel defining layer 4 can be an inorganic material or an organic material.

[0097] In some embodiments, such as Figure 3 As shown, the second electrode layer 23 includes a plurality of second electrodes 231, one second electrode 231 is disposed corresponding to one light-emitting part 221, and one second electrode 231 is located in a first opening K1.

[0098] The multiple second electrodes 231 can be multiple independent electrodes separated from each other, or the multiple second electrodes 231 can be connected to each other to form a whole electrode layer. When the multiple second electrodes 231 are a whole electrode layer, the second electrode 231 refers to the part of the second electrode layer 23 that corresponds to a light-emitting part 221.

[0099] For example, the light-emitting functional layer 22 at least covers the display area AA of the display panel 10. For example... Figure 3 As shown, the light-emitting functional layer 22 includes an organic light-emitting layer (EML). The material of the organic light-emitting layer may include low molecular weight organic materials or polymer materials. These materials are fluorescent or phosphorescent materials that can emit red, green, blue or white light under the action of an electric field.

[0100] The materials of the plurality of light-emitting parts 221 included in the light-emitting functional layer 22 can be the same material. In this case, the light emitted by the plurality of light-emitting parts 221 included in the light-emitting functional layer 22 is light of the same color. For example, the plurality of light-emitting parts 221 included in the light-emitting functional layer 22 can be any color of light such as white light, red light, green light or blue light.

[0101] The materials of the multiple light-emitting parts 221 may not be exactly the same. In this case, the colors of the light emitted by the multiple light-emitting parts 221 included in the light-emitting functional layer 22 are not exactly the same. For example, the light-emitting functional layer 22 may include light-emitting parts 221 that can emit at least two different colors of light, such as white light, red light, green light, or blue light.

[0102] In addition, in order to improve the luminous efficiency of the light-emitting element L in the display panel 10, in addition to the organic light-emitting layer, the light-emitting functional layer 22 may also include one or more of the following: an electron transport layer (ETL), an electron injection layer (EIL), a hole transport layer (HTL), and a hole injection layer (HIL).

[0103] In some embodiments, such as Figure 3 As shown, the display panel 10 may further include a partition structure 5 disposed on the side of the pixel defining layer 4 away from the substrate 11. The partition structure 5 includes a plurality of second openings K2, one second opening K2 and one first opening K1 communicating in a direction perpendicular to the substrate 11, and a light-emitting part 221 is located within the communicating first opening K1 and second opening K2.

[0104] The light-emitting part 221 is located at least inside the first opening K1. The edge of the light-emitting part 221 may be in contact with the sidewall of the pixel defining layer 4 that forms the first opening K1, or the edge of the light-emitting part 221 may overlap the sidewall of the pixel defining layer 4 that forms the first opening K1, or the edge of the light-emitting part 221 may overlap the sidewall of the partition structure 5 that forms the second opening K2.

[0105] The orthographic projection of the partition structure 5 onto the substrate 11 lies between at least two (e.g., any two) adjacent light-emitting elements L. The light-emitting portions 221 of two adjacent light-emitting elements L are separated by the partition structure 5, and the second electrodes 231 of two adjacent light-emitting elements L are separated by the partition structure 5.

[0106] The orthographic projection of each partition structure 5 on the substrate 11 is located between two adjacent light-emitting elements L. There is no overlap between the orthographic projection of the partition structure 5 on the substrate 11 and the two adjacent light-emitting elements L. That is, each partition structure 5 is set between two adjacent light-emitting elements L. The setting of the partition structure 5 will not block the light-emitting elements L, thereby avoiding adverse effects on the light emission effect of the display panel 10.

[0107] For example, such as Figure 3 As shown, a cross-section is made of the partition structure 5 along a plane perpendicular to the substrate 11, and the cross-sectional shape of the partition structure 5 is including but not limited to at least one of trapezoidal, inverted trapezoidal or I-shaped.

[0108] By designing the shape of the partition structure 5, the portion of the light-emitting functional layer 22 corresponding to each light-emitting element 2a can be completely separated, so that the light-emitting functional layer 22 can achieve a more ideal coating state, which is conducive to the separation of the light-emitting part 221 of different light-emitting elements L and the independent light-emitting control of different light-emitting elements L.

[0109] For example, the material of the partition structure 5 can be an insulating material, including but not limited to at least one of inorganic materials such as oxides, nitrides, and silicides. Alternatively, the material of the partition structure 5 can also be a conductive material, including but not limited to at least one of aluminum, silver, indium tin oxide, indium zinc oxide, indium gallium oxide, gallium zinc oxide, and zinc oxide.

[0110] When the partition structure 5 is made of a conductive material, such as Figure 3 As shown, the multiple second electrodes 231 of the second electrode layer 23 can be multiple independent electrodes corresponding to each light-emitting element L. The second electrodes 231 of two adjacent light-emitting elements L can be electrically connected through the partition structure 5. In this case, the multiple second electrodes 231 in the second electrode layer 23 can be connected to each other through multiple partition structures 5 to achieve electrical connection.

[0111] In some embodiments, such as Figure 3 As shown, the display panel 10 also includes an encapsulation structure 3 disposed on the side of the second electrode layer 23 away from the substrate 11.

[0112] For example, the encapsulation structure 3 can be a single layer or multiple layers.

[0113] For example, such as Figure 3As shown, the encapsulation structure 3 may include a first inorganic encapsulation layer 31, a second inorganic encapsulation layer 33, and an organic encapsulation layer 32 disposed sequentially along a direction away from the substrate 11, with the surface of the encapsulation structure 3 away from the substrate 11 being a flat surface. Alternatively, the encapsulation structure may only include the first inorganic encapsulation layer 31. Figure 3 As shown, the first inorganic encapsulation layer 31 includes a plurality of inorganic encapsulation parts 311, and one inorganic encapsulation part 311 is located in a first opening K1 and a second opening K2 that are interconnected.

[0114] At least a portion of the inorganic encapsulation portion 311 is located within the first opening K1, and one inorganic encapsulation portion 311 covers one light-emitting portion 221.

[0115] By setting the encapsulation structure 3, water and oxygen in the environment can be prevented from entering the display panel 10, thereby avoiding adverse effects on the light-emitting performance of the light-emitting element L and improving the service life of the display panel 10.

[0116] In some embodiments, such as Figure 3 As shown, the display panel 10 may also include a filter layer 6 disposed on the side of the encapsulation structure 3 away from the substrate 11.

[0117] For example, the display panel 10 is a touch display panel, such as Figure 3 As shown, the display panel 10 also includes a touch panel 8 (TSP, Touch Screen Panel). The touch panel 8 may be disposed between the encapsulation structure 3 and the filter layer 6, or it may be disposed on the side of the filter layer 6 away from the substrate 11.

[0118] In some examples, the filter layer 6 can be a polarizer. The polarizer can reduce the amount of ambient light entering the display panel 10, thereby reducing the glare from reflective structures in the display panel 10 (e.g., Figure 3 The interference caused by the light reflected from the first metal layer 12 and the second metal layer 13 (shown in the figure) when it exits the display panel 10 to the image to be displayed on the display panel 10 is beneficial to improving the contrast of the image displayed on the display panel 10.

[0119] In other examples, such as Figure 3 As shown, the filter layer 6 may include multiple color filter units CF (Color Filter) and black matrix BM (Black Matrix). The black matrix BM has multiple fourth openings K4. One color filter unit is located in one fourth opening K4. One color filter unit CF is correspondingly arranged with one light-emitting unit 221.

[0120] The light filter CF can be a red filter, blue filter, or green filter, etc. The light emitted by the light-emitting part 221 of the light-emitting element L is made to appear as a specific color, thereby achieving full-color display panel 10. The black matrix BM can be made of black resin or other light-shielding materials. The black matrix BM is used to separate the light emitted by the light filters CF of different colors to prevent color mixing. Simultaneously, the arrangement of the light filters CF and the black matrix BM can also reduce the brightness of ambient light entering the display panel 10 to a certain extent, thereby reducing the reflective structures (e.g., reflective elements) in the display panel 10. Figure 3 The interference caused by the light reflected from the first metal layer 12 and the second metal layer 13 (shown in the figure) when it exits the display panel 10 to the image to be displayed on the display panel 10 is beneficial to improving the contrast of the image displayed on the display panel 10.

[0121] In this case, such as Figure 3 As shown, the display panel 10 adopts a COE (Color Filter On Encapsulation) structure. Each filter element CF is correspondingly set with one light-emitting element L, and the black matrix BM fills the gap area between adjacent filter elements CF.

[0122] like Figure 3 As shown, when the filter layer 6 includes multiple filter sections CF and black matrix BM, in order to ensure the color filtering effect of the filter section CF on the light emitted by the light-emitting element L, in the display panel 10, in the orthogonal projection onto the substrate 11, the filter section CF coincides with or surrounds the first opening K1 of the pixel defining layer 4. Along the direction perpendicular to the substrate 11, each filter section CF is directly opposite a light-emitting element L, and the area of ​​the filter section CF is greater than or equal to the effective light-emitting area of ​​the light-emitting element L. In this way, the light emitted by each light-emitting element L can pass through the corresponding filter section CF and be emitted without being blocked by the black matrix BM surrounding the filter section CF, thus ensuring the light-emitting effect of the display panel 10.

[0123] Taking the filter layer 6 of the display panel 10, which includes multiple filter elements CF and a black matrix BM, as an example, Figure 3 As shown, some of the light from the external environment that shines on the filter CF will pass through the filter CF and enter the display panel 10. When the pixel defining layer 4 is made of inorganic material, due to the good light transmittance of inorganic material, when external light shines into the display panel 10, the light that shines into the display panel 10 (such as...) Figure 3 The light ray G1 shown in the figure is reflected by the reflective structure in the display panel 10 (e.g., Figure 3 The first metal layer 12 and the second metal layer 13 shown in the figure reflect and emit (as shown in the figure). Figure 3 The light (G2) shown in the image will affect the display effect of the display panel 10.

[0124] Based on the above, in some embodiments, the method for preparing the display panel 10 includes steps S1 to S4.

[0125] S1, such as Figures 4 to 8 As shown, back plate 1 is formed.

[0126] S2, such as Figures 9 to 13 As shown, a light-emitting structure 2 and an encapsulation structure 3 are formed.

[0127] S3, such as Figure 12 and Figure 13 As shown, a touch panel 8 is formed.

[0128] S4, such as Figure 12 and Figure 13 As shown, filter layer 6 is formed.

[0129] In some embodiments, such as Figures 4 to 8 As shown, step S1 includes steps S11 and S12.

[0130] For example, such as Figure 4 As shown, step S11 includes S11a and S11b.

[0131] S11a, such as Figure 4 As shown, a first metal layer 12 is formed.

[0132] In step S11a, a conductive material layer can be formed first by sputtering, and then the conductive material layer can be patterned by etching to form the first metal layer 12.

[0133] S11b, such as Figure 4 As shown, a first insulating layer 14 is formed.

[0134] A first insulating layer 14 is disposed between layers corresponding to a first metal layer 12, and the first insulating layer 14 covers the first metal layer 12. For example... Figure 4 As shown, during the fabrication process of the display panel 10, a first metal layer 12 and a corresponding first insulating layer 14 can be formed through steps S11a and S11b.

[0135] When the display panel 10 includes two or more first metal layers 12, such as Figure 5 As shown, during the fabrication of the display panel 10, steps S11a and S11b are repeated to form multiple first metal layers 12. Adjacent first metal layers 12 are separated by a first insulating layer 14. The side of the first metal layer 12 furthest from the substrate 11 that is furthest from the substrate 11 is covered by a first insulating layer 14.

[0136] In some embodiments, such as Figure 6As shown, step S12 includes S12a and S12b.

[0137] S12a, such as Figure 6 As shown, a second metal layer 13 is formed.

[0138] In step S12a, a conductive material layer can be formed first by sputtering, and then the conductive material layer can be patterned by etching to form the second metal layer 13.

[0139] S12b, such as Figure 6 As shown, a flat layer 15 is formed.

[0140] In some examples, the number of planarization layers 15 in the display panel 10 is the same as the number of second metal layers 13, such as... Figure 6 As shown, an interlayer planarization layer 15 and a second metal layer 13 are correspondingly disposed, with the planarization layer 15 covering the second metal layer 13. Figure 6 As shown, during the fabrication process of the display panel 10, a second metal layer 13 and a corresponding planarization layer 15 can be formed through steps S12a and S12b.

[0141] When the display panel 10 includes two or more second metal layers 13, such as Figure 7 As shown, during the fabrication of the display panel 10, steps S12a and S12b are repeated to form multiple layers of second metal layers 13. Adjacent second metal layers 13 are separated by a planarization layer 15. The side of the second metal layer 13 furthest from the substrate 11 that is furthest from the substrate 11 is covered by a planarization layer 15.

[0142] In this case, during the fabrication of the display panel 10, the fabrication process of step S1 can be as follows:

[0143] (S11a→S11b)×M→(S12a→S12b)×N.

[0144] Where M is the number of the first metal layer 12, M≥1; N is the number of the second metal layer 13, N≥1; (S11a→S11b)×M means repeating steps S11a and S11b M times, and (S12a→S12b)×N means repeating steps S12a and S12b N times.

[0145] In other examples, the number of planarization layers 15 in the display panel 10 is greater than the number of second metal layers 13, such as... Figure 8 As shown, after repeating steps S12a and S12b to form at least one corresponding second metal layer 13 and at least one planarization layer 15, step S12b is repeated once more, and two planarization layers 15 are provided on the side of the second metal layer 13 furthest from the substrate 11 away from the substrate 11.

[0146] In this case, the preparation process of step S1 can be:

[0147] (S11a→S11b)×M→(S12a→S12b)×N→S12b.

[0148] In some embodiments, such as Figures 9 to 13 As shown, step S2 includes steps S21 to S26.

[0149] S21, such as Figure 9 As shown, a first electrode layer 21 is formed on the back plate 1. The first electrode layer 21 includes a plurality of first electrodes 211.

[0150] In step S21, an entire electrode layer may be formed first by metal sputtering process, and then the electrode layer may be patterned by etching process to form multiple first electrodes 211.

[0151] S22, such as Figure 10 As shown, a pixel defining layer 4 is formed. The pixel defining layer 4 includes a plurality of first openings K1, each first opening K1 exposing at least a portion of a first electrode 211.

[0152] In step S22, an inorganic material layer may be formed first, and then the inorganic material layer may be patterned by etching process to form a pixel defining layer 4 with multiple first openings K1.

[0153] S23, such as Figure 11 As shown, a partition structure 5 is formed. The partition structure 5 is disposed on the side of the pixel defining layer away from the back plate 1. The partition structure 5 includes a plurality of second openings K2, one of which is connected to a first opening K1 in a direction perpendicular to the back plate 1.

[0154] For example, the partition structure 5 may be made of organic materials, inorganic materials or metallic materials.

[0155] The term "penetrating in the direction perpendicular to the backplate 1" means that, in the direction perpendicular to the backplate 1, the first opening K2 is directly opposite or approximately opposite to the first opening K1 (the orthographic projections of the first opening K1 and the second opening K2 on the backplate 1 coincide or approximately coincide), and the pixel defining layer 4 and the partition structure 5 can be adjacent and in contact, or they can include other film layer structures between them.

[0156] For example, such as Figure 12 As shown, step S24 includes S24a and S24b.

[0157] S24a, such as Figure 12As shown, a functional stack D is formed. The functional stack D includes a light-emitting material layer, a second electrode material layer, and a first inorganic encapsulation material layer, which are sequentially stacked in a direction away from the backplate 1.

[0158] For example, the luminescent material layer can be formed using a vapor deposition process. Figure 12 As shown, during the formation of the light-emitting material layer, the light-emitting material layer is naturally separated by the partition structure 5, so that the formed light-emitting material layer includes a first part formed in the second opening K2 and the first opening K1 that are perpendicular to the back plate 1, and a second part formed on the top of the partition structure 5.

[0159] For example, the second electrode material layer can be formed by sputter deposition, in which the second electrode material particles are deposited via diffuse reflection, such as... Figure 12 As shown, during the formation of the second electrode material layer, the second electrode material layer is naturally separated by the partition structure 5, so that the formed second electrode material layer includes a first portion formed in the second opening K2 and the first opening K1 that are perpendicular to the back plate 1, and a second portion formed on the top of the partition structure 5. The first portion of the second electrode material layer formed by sputter deposition can completely cover the first portion of the light-emitting material layer and contact the partition structure 5.

[0160] For example, the first inorganic encapsulation material layer may be formed using a CVD (chemical vapor deposition) process. Figure 12 As shown, during the formation of the first inorganic encapsulation material layer, the first inorganic encapsulation material layer is naturally separated by the partition structure 5, so that the formed first inorganic encapsulation material layer includes a first part formed in the second opening K2 and the first opening K1 that are perpendicular to the back plate 1, and a second part formed on the top of the partition structure 5.

[0161] S24b, such as Figure 12 As shown, the redundant parts of the functional stack D are removed.

[0162] like Figure 12 As shown, the redundant portion of the functional stack D includes the second portion 22b of the light-emitting material layer formed in step S24a, the second portion 23b of the second electrode layer, and the second portion 31b of the first inorganic encapsulation material layer.

[0163] S25, such as Figure 12 As shown, an organic encapsulation layer 32 is formed.

[0164] For example, the organic encapsulation layer 32 can be formed by an IJP (inkjet printing) process.

[0165] S26, such as Figure 12 As shown, a second inorganic encapsulation layer 33 is formed.

[0166] For example, the second inorganic encapsulation layer 33 may be formed by a CVD process.

[0167] When the display panel 10 includes a light-emitting element L of one color, the material of the light-emitting part 221 of each light-emitting element L can be the same organic light-emitting material. The materials of the multiple light-emitting parts 221 of the light-emitting functional layer 22 of the display panel 10 are the same. Therefore, multiple light-emitting parts 221 can be formed simultaneously in one process step to form the light-emitting functional layer 22.

[0168] In this case, in step S2, as Figure 12 As shown, repeating step S24 once will form the light-emitting part 221 and the second electrode 231 of each light-emitting element L, as well as the inorganic encapsulation part 311 corresponding to the light-emitting element L. In the fabrication process of the display panel 10, the fabrication process of step S2 can be: S21→S22→S23→S24a→S24b→S25→S26.

[0169] like Figure 12 As shown, a light-emitting material layer is formed in the first part of the second opening K2 and the first opening K1, which are perpendicular to the back plate 1, forming the light-emitting portion 221 of each light-emitting element L. A second electrode material layer is formed in the first part of the second opening K2 and the first opening K1, which are perpendicular to the back plate 1, forming the second electrode 231 of each light-emitting element L. A first inorganic encapsulation material layer is formed in the first part of the second opening K2 and the first opening K1, which are perpendicular to the back plate 1, forming the inorganic encapsulation portion 311 of each light-emitting element L. The light-emitting functional layer 22, the second electrode layer 23, and the first inorganic encapsulation layer 31 of the display panel 10 are formed through steps S24a and S24b.

[0170] When the display panel 10 includes light-emitting elements L with at least two different light-emitting colors, and the light-emitting colors of the multiple light-emitting portions 221 of the light-emitting functional layer 22 are not completely identical, the light-emitting portions 221 with the same light-emitting color can be formed simultaneously, while the light-emitting portions 221 with different light-emitting colors can be formed in stages. In this case, during the fabrication process of the display panel 10, the fabrication flow of step S2 can be: S21→S22→S23→(S24a→S24b)×P→S25→S26; where each P in the display panel 10 represents the number of light-emitting colors of the light-emitting elements L, and P≥1.

[0171] When the display panel 10 includes multiple (two or more) light-emitting parts 221 with different light-emitting colors, such as Figure 13As shown, in the process of manufacturing the display panel 10, steps S24a and S24b can be repeated. In the process of repeating steps S24a and S24b once, a light-emitting part 221 with a light-emitting color and a second electrode 231 and an inorganic encapsulation part 311 corresponding to the light-emitting part 221 are formed. Steps S24a and S24b are repeated multiple times to form light-emitting parts 221 with multiple light-emitting colors.

[0172] Taking multiple light-emitting parts 221, including a first colored light-emitting part, a second colored light-emitting part, and a third colored light-emitting part, as an example, light-emitting parts 221 with three different light-emitting colors, such as... Figure 13 As shown, during the fabrication of the display panel, step S24 can be repeated three times, and the light-emitting parts 221 of the three different light-emitting colors are sequentially formed at the target position.

[0173] like Figure 13 As shown, during the first execution of step S24, a first functional stack D1 is formed in step S24a. The first functional stack D1 includes a first color emitting material layer, a second electrode material layer, and a first inorganic encapsulation material layer formed sequentially.

[0174] like Figure 13 As shown, the first color luminescent material layer is formed at the target location (e.g., Figure 13 The portion inside the leftmost first opening K1 shown in the figure is the light-emitting part 221 that needs to be retained, and the portion where the first color light-emitting material layer is formed outside the target position is the redundant part 22b that needs to be removed.

[0175] like Figure 13 As shown, the second electrode material layer is formed at the target location (e.g., Figure 13 The portion of the light-emitting part 221 shown is the inorganic second electrode 231, and the portion of the second electrode material layer formed outside the target position is the redundant part 23b.

[0176] like Figure 13 As shown, the first inorganic encapsulation material layer is formed at the target location (e.g., Figure 13 The portion covering the second electrode 231 shown is the inorganic encapsulation portion 311, and the portion of the first inorganic encapsulation material layer formed outside the target location is the redundant portion 23b that needs to be removed.

[0177] In step S24b, the redundant parts of the first functional stack D1 (such as...) can be removed using an etching process. Figure 13 The stacked layers 22b, 23b and 31b shown are removed, thereby forming a first color light-emitting element L1 at the target location.

[0178] like Figure 13As shown, during the second execution of step S24, a second functional stack D2 is formed in step S24a. The light-emitting material layer in the second functional stack D2 has a different light-emitting color than the light-emitting material layer in the first functional stack D1. Then, in step S24b, the redundant part of the second functional stack D2 is removed, thereby forming a second color light-emitting element L2 at the target position.

[0179] like Figure 13 As shown, during the second execution of step S24, in step S24a, a third functional stack D3 is first formed. The light-emitting material layer of the third functional stack D3 has a different light-emitting color than the light-emitting material layer in the second functional stack D2, and the light-emitting material layer of the third functional stack D3 has a different light-emitting color than the light-emitting material layer in the first functional stack D1. Then, in step S24b, the redundant part of the third functional stack D3 is removed, thereby forming a third color light-emitting element L3 at the target position.

[0180] The formation process of the second color light-emitting element L2 and the third color light-emitting element L3 is the same as that of the first color light-emitting element L1, and will not be elaborated here.

[0181] Thus, in step S2, S24 is repeated multiple times, thereby forming light-emitting parts 221 with various different light-emitting colors, as well as second electrodes 231 and inorganic encapsulation 311 corresponding to the light-emitting parts 221 on the back plate 1.

[0182] In summary, in the display panel provided by some embodiments of this disclosure, multiple light-emitting parts 221 are formed by a vapor deposition process combined with an etching process. When the light emission colors of the multiple light-emitting parts 221 are not completely the same, different organic light-emitting materials are used for the light-emitting parts 221 with different light emission colors, and it is necessary to form the light-emitting materials of different colors at the target positions respectively.

[0183] In some embodiments, during the fabrication of the display panel 10, an FMM (Fine Metal Mask) is used to directly form organic light-emitting materials on the target location. Compared with the fabrication method described in step S24 above, when forming organic light-emitting materials on the target location, redundant portions 22b are not formed on non-target locations. Thus, after forming the target light-emitting portion, it is not necessary to perform an etching step to remove the redundant portions 22b.

[0184] Due to the limitations of the FMM process, when multiple light-emitting parts 221 are formed using the FMM process in the display panel, the PPI (Pixels Per Inch) of the final display panel is smaller compared to forming multiple light-emitting parts 221 using the above step S24. Therefore, by forming the light-emitting functional layer 22 using the above preparation method S24, the resulting display panel can have a higher PPI.

[0185] Based on the above, during the repeated step S24, an etching process can be used to remove the redundant parts of the functional stack D. When the pixel defining layer 4 is made of an organic material, during the etching process to remove the redundant parts 22b in step S24, the organic material has good water absorption, and the pixel defining layer 4 is in contact with the light-emitting part 221 of the adjacent light-emitting element L. Therefore, when the pixel defining layer 4, made of organic material, absorbs water and comes into contact with the light-emitting part 221 of the adjacent light-emitting element L, moisture will be transferred from the pixel defining layer 4 to the light-emitting part 221, affecting the light-emitting quality of the light-emitting part 221, and even causing the light-emitting part 221 to fail.

[0186] To avoid this problem, in some embodiments of this disclosure, the pixel defining layer 4 is made of materials with poor water absorption, such as inorganic materials or metal materials, thereby avoiding the problem of the organic light-emitting material of the light-emitting functional layer 22 failing due to water absorption by the pixel defining layer 4 during the manufacturing process of the display panel 10.

[0187] Based on the above, in some embodiments, to ensure that the light emitted by the light-emitting element L can pass through the corresponding filter section CF and not be blocked by the black matrix BM surrounding the filter section CF, such as... Figure 13 As shown, in the direction perpendicular to the substrate 11, each filter element CF is directly opposite a light-emitting element L, and the area of ​​the filter element CF is greater than or equal to the effective light-emitting area of ​​the light-emitting element L. In the orthogonal projection onto the substrate 11, the first opening K1 of the pixel defining layer 4 is surrounded by the fourth opening K4 of the black matrix BM, and / or, the second opening K2 of the partition structure 5 is surrounded by the fourth opening K4 of the black matrix BM; that is, in the orthogonal projection onto the substrate 11, the first opening K1 of the pixel defining layer 4 is surrounded by the filter element CF, and / or, the second opening K2 of the partition structure 5 is surrounded by the filter element CF.

[0188] In this way, when the area of ​​the filter section CF is larger than the effective light-emitting area of ​​the light-emitting element L, some external light will pass through the filter section CF and enter the display panel.

[0189] like Figure 3 As shown, when the pixel defining layer 4 is made of inorganic material, some external light will pass through the light filter CF and enter the display panel. The light G1 that illuminates the pixel defining layer 4 will then pass through the pixel defining layer 4 and illuminate the reflective structure (e.g., the reflective structure in the display panel 10) in the display panel 10. Figure 3 On the first metal layer 12 and / or the second metal layer 13 shown in the figure, the light G1 that shines on the reflective structure will be reflected and emitted by the reflective structure, causing interference to the image to be displayed on the display panel 10 and affecting the display quality of the display panel.

[0190] When the partition structure 5 is made of inorganic material, the portion of external light that shines on the partition structure 5 will pass through the partition junction 5 and the pixel defining layer 4 in sequence before shining on the reflective structure in the display panel 10 (e.g., Figure 3 On the first metal layer 12 and / or the second metal layer 13 shown in the figure, the light G1 that is irradiated onto the reflective structure is reflected by the reflective structure and emitted.

[0191] When the partition structure 5 is made of metal, the light shining on the partition structure 5 will also be reflected and emitted by the partition structure 5. The light G2 reflected and emitted by the first metal layer 12 and / or the second metal layer 13 and emitted by the display panel 10, and / or the light reflected and emitted by the partition structure 5 made of metal, will interfere with the image to be displayed on the display panel 10.

[0192] To address this issue, some embodiments of this disclosure provide a display panel 10.

[0193] In some embodiments, such as Figure 14 As shown, the display panel 10 also includes a light-blocking structure 7, which includes a light-shielding material. By providing the light-blocking structure 7, after some external light passes through the light filter CF and enters the display panel, at least a portion of the light that shines on the reflective structure in the display panel 10 will be blocked by the light-blocking structure 7, thereby reducing the light reflected from the reflective structure and emitted from the display panel 10, and improving the display quality of the display panel 10.

[0194] The light-blocking structure 7 can be disposed on the side of the partition structure 5 closest to the substrate 11, or on the side of the partition structure 5 furthest from the substrate 11. The partition structure 5 can be made of a light-transmitting material, a semi-transparent and semi-reflective material, or a reflective material. The partition structure 5 can be made of inorganic materials, organic materials, or metallic materials, etc.

[0195] When the partition structure 5 is made of a light-transmitting material or a semi-transparent and semi-reflective material, light from the external environment entering the display panel 10 will pass through the partition structure 5 and be directed towards the film layer structure closer to the substrate 11 in the display panel 10. The light-blocking structure 7, located on the side of the first metal layer 12 away from the substrate 11 and between adjacent light-emitting elements L, can effectively block the reflective structure (e.g., between the light-blocking structure 7 and the substrate 11) in the display panel 10. Figure 15 The problem is that the first metal layer 12 shown in the figure reflects light and causes it to escape from the display panel 10.

[0196] When the partition structure 5 is made of metal, light illuminating any one of the first metal layer 12, the second metal layer 13 and the partition structure 5 will be reflected, and the partition structure 5 is located on the side of the first metal layer 12 and the second metal layer 13 away from the substrate 11.

[0197] Based on this, the light-blocking structure 7 can be disposed between the first metal layer 12 and the second metal layer 13, or between the second metal layer 13 and the partition structure 5, or on the side of the partition structure 5 away from the substrate 11.

[0198] In this way, at least part of the light shining into the display panel 10 from the external environment will be blocked by the light-blocking structure 7 and will not shine on the reflective structure between the light-blocking structure 7 and the substrate 11, thereby reducing the impact of the light reflected by the reflective structure inside the display panel 10 on the display effect of the display panel 10.

[0199] The following describes the specific location of the light-blocking structure 7 in the display panel 10.

[0200] In some embodiments, such as Figure 14 As shown, the display panel 10 includes at least one first metal layer 12 and at least one second metal layer 13, and a light-blocking structure 7 is disposed between adjacent first metal layers 12 and second metal layers 13. The light-blocking structure 7 is located on the side of the first insulating layer 14 furthest from the substrate 11, and the lower surface of the light-blocking structure 7 is in contact with the first insulating layer 14 furthest from the substrate 11.

[0201] When ambient light G1 enters the display panel 10, the light that shines on the first metal layer 12 is blocked by the light-blocking structure 7. In this way, the light G1 that enters the display panel 10 from the outside environment will not shine on the first metal layer 12. Furthermore, the portion of the light that shines on the first metal layer 12 from the display panel 10 after reflection will also be blocked by the light-blocking structure 7 and cannot be emitted. This avoids the problem that the light reflected by the first metal layer 12 will affect the display effect when it exits the display panel 10, thereby improving the display quality of the display panel 10.

[0202] By placing the light-blocking structure 7 between the first electrode layer 21 and the first metal layer 12, the gap between the light-blocking structure 7 and the first metal layer 12 is smaller and the distance is closer, which can better block the light reflected by the first metal layer 12.

[0203] In this case, such as Figure 14 As shown, a third insulating layer 16 is disposed between the light-blocking structure 7 and the second metal layer 13 closest to the substrate 11. The third insulating layer 16 covers the light-blocking structure 7, and the upper surface of the light-blocking structure 7 is in contact with the third insulating layer 16. The third insulating layer 16 separates the light-blocking structure 7 from the second metal layer 13. The third insulating layer 16 can be an interlayer dielectric layer (ILD) or a planarization layer.

[0204] In some embodiments, such as Figure 14As shown, the light-blocking structure 7 includes a plurality of third openings K3. In a normal projection onto the substrate 11, one third opening K3 at least partially overlaps with a first opening K1, and one third opening K3 at least partially overlaps with a second opening K2.

[0205] like Figure 14 As shown, the pixel defining layer 4 includes a plurality of first openings K1, and the partition structure 5 includes a plurality of second openings K2. In the orthographic projection onto the substrate 11, one first opening K1 and one second opening K2 at least partially overlap. In the display panel 10, the light-emitting element L is a top-emitting light-emitting element, the first electrode 211 of the light-emitting element L is a reflective electrode, and the second electrode 231 is a semi-transparent and semi-reflective electrode.

[0206] The portion of external light that passes through the light filter CF and shines on the first electrode 211 will be blocked by the first electrode 211. A third opening K3 is provided on the light-blocking structure 7. The area corresponding to the third opening K3 is the portion that can be blocked by the first electrode 211. While ensuring the anti-reflection effect of the light-blocking structure 7, the overall volume of the light-blocking structure 7 is smaller, which is more conducive to realizing the thin and light design of the display panel 10.

[0207] During the manufacturing process of the display panel 10, such as Figure 15 As shown, step S1 also includes steps S11c, S11d and S11e.

[0208] S11c, forming a light-blocking material layer.

[0209] S11d, a patterned light-blocking material layer, forming a light-blocking structure 7.

[0210] S11e, forming the third insulating layer 16.

[0211] In this case, during the fabrication of the display panel 10, the fabrication process of step S1 can be as follows:

[0212] (S11a→S11b)×M→S11c→S11d→S11e→(S12a→S12b)×N.

[0213] The light-blocking structure 7 is located between two adjacent light-emitting parts 221. By providing the light-blocking structure 7 between two adjacent light-emitting parts 221, and by placing the light-blocking structure 7 on the side of the first metal layer 12 furthest from the substrate 11 in the display panel 10, away from the substrate 11, when external ambient light enters the display panel 10, such as… Figure 15 As shown, the light G1 illuminating the first metal layer 12 is blocked by the light-blocking structure 7 and will not be reflected out of the display panel 10. This avoids the light reflected by the reflective structure inside the display panel 10 from affecting the display effect of the display panel 10, thereby improving the display quality of the display panel 10.

[0214] When the light-blocking structure 7 has a third opening K3, the third insulating layer 16 can fill the third opening K3 and cover the surface of the light-blocking structure 7 away from the substrate 11, ensuring the uniformity of the thickness of the display panel 10, so that the second metal layer 13 formed subsequently can be formed on a relatively flat film structure.

[0215] It should be noted that when the light-blocking structure 7 is located on the side of the light-emitting functional layer 22 away from the substrate 11, the light-blocking structure 7 has a third opening K3. Along the direction perpendicular to the substrate 11, one opening K3 is correspondingly set with one light-emitting element L, and the area of ​​the third opening K3 is greater than or equal to the effective light-emitting area of ​​the light-emitting element L, thereby avoiding the light-blocking structure 7 from blocking the light emitted by the light-emitting element L and ensuring the light emission effect of the light-emitting element L.

[0216] In some embodiments, such as Figure 16 As shown, the light-blocking structure 7 is located at least within the display area AA, and the light-blocking structure 7 has no opening. Thus, during the fabrication process of the display panel 10, as... Figure 17 As shown, step S1 also includes steps S11c and S11e.

[0217] S11c, forming a light-blocking material layer.

[0218] The light-blocking material layer covers at least the display area AA. When the light-blocking structure 7 is disposed on the side of the light-emitting functional layer 22 close to the substrate 11, the light-blocking material layer can serve as the light-blocking structure 7.

[0219] S11e, forming the third insulating layer 16.

[0220] The third insulating layer 16 covers the light-blocking structure 7.

[0221] In the fabrication process of the display panel 10, the fabrication process of step S1 can be: (S11a→S11b)×M→S11c→S11e→(S12a→S12b)×N, or it can be: (S11a→S11b)×M→S11c→S11d→S11e→(S12a→S12b)×N.

[0222] The third insulating layer 16 covers the surface of the light-blocking structure 7 away from the substrate 11, ensuring the uniformity of the thickness of the display panel 10, so that the second metal layer 13 formed subsequently can be formed on a relatively flat film structure.

[0223] When the light-blocking structure 7 is located on the side of the light-emitting functional layer 22 close to the substrate 11, the light-blocking structure 7 may have a third opening K3 or may not have an opening.

[0224] In some embodiments, such as Figure 18 and Figure 20 As shown, along a direction perpendicular to the substrate 11, the light-blocking structure 7 is disposed between the first planarization layer 151 and the first electrode layer 21, and the light-blocking structure 7 is in contact with the first planarization layer 151.

[0225] The first planarization layer 151 mentioned here refers to the planarization layer 15 that covers the second metal layer 13 furthest from the substrate 11. For example, Figure 18 The first planarization layer 151 is shown in the figure, or, Figure 20 The first flat layer 151 is shown in the figure.

[0226] In some examples, in the display panel 10, the second metal layer 13 furthest from the substrate 11 has two planarization layers 15 on the side furthest from the substrate 11, and the light-blocking structure 7 may be disposed between these two planarization layers 15.

[0227] For example, such as Figure 18 As shown, the display panel 10 includes a second metal layer 13 and a first planarization layer 151 and a second planarization layer 152 disposed on the side of the second metal layer 13 away from the substrate 11. The first planarization layer 151 covers the second metal layer 13. The light-blocking structure 7 may be disposed between the first planarization layer 151 and the second planarization layer 152. The light-blocking structure 7 is covered by the second planarization layer 152, and both sides of the light-blocking structure 7 are in contact with the first planarization layer 151 and the second planarization layer 152, respectively.

[0228] In this case, such as Figure 18 As shown, the light-blocking structure 7 may have a third opening K3; in the orthographic projection onto the substrate 11, the third opening K3 of the light-blocking structure 7 coincides with the first opening K1 of the pixel defining layer 4, or is located within the first opening K1 of the pixel defining layer 4.

[0229] like Figure 18 As shown, the size of the third opening K3 of the light-blocking structure 7 is smaller than the size of the first opening K1 of the pixel defining layer 4. The light-blocking structure 7 is located between adjacent light-emitting elements L, and in its orthographic projection onto the substrate 11, the light-blocking structure 7 at least partially overlaps with the adjacent light-emitting elements L. In this way, the light-blocking structure 7 can better block the portion between the first openings K1 of the pixel defining layer 4, preventing light from passing through the pixel defining layer 4 and striking the reflective structures (e.g., reflective elements) in the display panel 10. Figure 18 The first metal layer 12 and / or the second metal layer 13 shown in the figure can also block the light reflected by the reflective structure and prevent the reflected light from leaving the display panel 10, thereby ensuring the display quality of the display panel 10.

[0230] Alternatively, the light-blocking structure 7 can also cover the display area AA and not have an opening.

[0231] The light-blocking structure 7 is located on the side of the light-emitting functional layer 22 closest to the substrate 11. The light-blocking structure 7 does not affect the light emission of the light-emitting element L. Along a direction perpendicular to the substrate 11, the light-blocking structure 7 completely blocks the gap between adjacent light-emitting elements L, effectively blocking reflective structures (e.g., light-reflecting structures) in the display panel 10. Figure 18 The light reflected by the first metal layer 12 and the second metal layer 13 shown in the figure is avoided from being reflected by the reflective structure and then emitted out of the display panel 10, which affects the display effect of the display panel 10, thus ensuring the display quality of the display panel 10.

[0232] The first planarization layer 151 and the second planarization layer 152 are inherent structures in the display panel 10. The light-blocking structure 7 is placed between the first planarization layer 151 and the second planarization layer 152. This not only prevents the light reflected by the reflective structure in the display panel 10 from affecting the display effect, but also does not increase the thickness of the display panel 10, which is conducive to achieving a thinner and lighter design of the display panel 10.

[0233] Along a direction perpendicular to the substrate 11, at least a portion of the light-blocking structure 7 faces the pixel defining layer 4, and the area of ​​the light-blocking structure 7 is larger than the coverage area of ​​the pixel defining layer 4. Thus, even if light from the external environment enters the display panel 10 and passes through the pixel defining layer 4 to reach the reflective structure (e.g., ...) in the display panel 10, ... Figure 19 Parts of the first metal layer 12 and the second metal layer 13 shown in the figure are blocked by the light-blocking structure 7 and will not be illuminated on the reflective structure, thereby avoiding the influence of the reflective structure in the display panel 10 on the display effect of the external ambient light reflection.

[0234] Meanwhile, in the display panel 10, even if the light emitted by the light-emitting element L shines on the reflective structure in the display panel 10, the light reflected by the reflective structure will be blocked by the light-blocking structure 7 and cannot be emitted out of the display panel 10, thereby avoiding the impact of the light emitted by the light-emitting element L being reflected by the reflective structure in the display panel 10 on the display effect of the display panel 10.

[0235] In this case, during the manufacturing process of the display panel 10, such as Figure 19 As shown, the preparation process of step S1 can be: (S11a→S11b)×M→(S12a→S12b)×N→S11c→S11d→S12b, or it can be: (S11a→S11b)×M→(S12a→S12b)×N→S11c→S12b.

[0236] In other examples, such as Figure 20As shown, in the display panel 10, a planarization layer 15 is disposed on the side of the second metal layer 13 furthest from the substrate 11. The light-blocking structure 7 may be disposed between this planarization layer 15 and the first electrode layer 21.

[0237] Taking the display panel 10 including a second metal layer 13 as an example, such as Figure 20 As shown, the display panel 10 may include a first planarization layer 151, with a light-blocking structure 7 disposed between the first planarization layer 151 and the first electrode layer 21. In this case, a third insulating layer 16 is also disposed between the light-blocking structure 7 and the first electrode layer 21, the light-blocking structure 7 is covered by the third insulating layer 16, and the light-blocking structure 7 is in contact with the third insulating layer 16 and the first planarization layer 151.

[0238] In this case, during the manufacturing process of the display panel 10, such as Figure 21 As shown, the preparation process of step S1 can be: (S11a→S11b)×M→(S12a→S12b)×N→S11c→S11d→S11e, or it can be: (S11a→S11b)×M→(S12a→S12b)×N→S11c→S11e.

[0239] In some embodiments, such as Figure 22 As shown, the light-blocking structure 7 is disposed between the planar layer 15, which is furthest from the substrate 11, and the first electrode layer 21.

[0240] like Figure 22 As shown, when the display panel 10 includes a second metal layer 13, the display panel 10 may also include two planarization layers 15, for example... Figure 22 The first planarization layer 151 and the second planarization layer 152 are shown in the figure. The first planarization layer 151 covers the second metal layer 13, and the second planarization layer 152 covers the first planarization layer 151. The light-blocking structure 7 is disposed between the second planarization layer 152 and the first electrode layer 21, and the light-blocking structure 7 is in contact with the second planarization layer 152.

[0241] In this case, such as Figure 22 As shown, a third insulating layer 16 is also provided between the light-blocking structure 7 and the first electrode layer 21. The light-blocking structure 7 is covered by the third insulating layer 16, and the light-blocking structure 7 is in contact with the third insulating layer 16 and the second planarization layer 152.

[0242] In this case, during the manufacturing process of the display panel 10, such as Figure 23As shown, the preparation process of step S1 can be: (S11a→S11b)×M→(S12a→S12b)×N→S12b→S11c→S11d→S11e, or it can be: (S11a→S11b)×M→(S12a→S12b)×N→S12b→S11c→S11e.

[0243] In summary, the light-blocking structure 7 is disposed on the planarization layer 15 furthest from the substrate 11 (e.g., Figure 20 The first planarization layer 151 shown in the figure, or Figure 22 In the case between the second planarization layer 152 and the first electrode layer 21 shown, the light-blocking structure 7 may have a third opening K3, the third opening K3 of the light-blocking structure 7 communicating with the first opening K1 of the pixel defining layer 4 in a direction perpendicular to the substrate 11, and the first electrode 211 located within the third opening K3 and the first opening K1 communicating in a direction perpendicular to the substrate 11; or, the light-blocking structure 7 may not have a third opening K3.

[0244] The lower surfaces of the first electrode layer 21 and the light-blocking structure 7 are both in contact with the uppermost planar layer 15. Even if the light emitted by the light-emitting element L shines on the reflective structure (e.g., Figure 20 or Figure 22 On the first metal layer 12 and the second metal layer 13 shown, the light reflected by the reflective structure is blocked by the light-blocking structure 7 and will not be emitted; the light from the external environment that enters the display panel 10 is blocked by the light-blocking structure 7 and will not shine on the reflective structure, thereby avoiding the problem that the light reflected by the reflective structure will be emitted from the display panel 10 and affect the display effect, thereby improving the display quality of the display panel 10.

[0245] In some embodiments, such as Figure 24 As shown, the first electrode layer 21 includes a plurality of first electrodes 211, with one first electrode 211 located on the side of a light-emitting portion 221 near the substrate 11. A light-blocking structure 7 is disposed between the second planarization layer 152 and the first electrode layer 21. The edge of the first electrode 211 overlaps the surface of the light-blocking structure 7 away from the substrate 11. The lower surface of the light-blocking structure 7 is in contact with the second planarization layer 152, and the portion of the upper surface of the light-blocking structure 7 not covered by the first electrode 211 is in contact with the pixel defining layer 4.

[0246] The edge of the first electrode 211 overlaps with the surface of the light-blocking structure 7 away from the substrate 11, thus protecting the edge portion of the light-blocking structure 7 and preventing damage to the light-blocking structure 7 during the subsequent evaporation and etching processes in the formation of the light-emitting part 221. Furthermore, since the edge of the first electrode 211 overlaps with the light-blocking structure 7, the area of ​​the light-blocking structure 7 is larger, resulting in better light blocking. Moreover, the light-blocking structure 7 is located on the side of the first electrode layer 21 closest to the substrate 11, ensuring that it does not block the emitted light of the light-emitting element L. This ensures that reflected light is prevented from escaping while also not affecting the light emission display of the light-emitting element L.

[0247] In this case, such as Figure 25 As shown, in the fabrication process of the display panel 10, after step S1 and before step S21, step S20 is included, which involves forming the light-blocking structure 7. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0248] In some embodiments, such as Figure 26 and Figure 27 As shown, the light-blocking structure 7 is disposed between the first electrode layer 21 and the pixel defining layer 4. The light-blocking structure 7 is in contact with the back plate 1, and the edge of the light-blocking structure 7 overlaps the surface of the first electrode 211 away from the substrate 11. The pixel defining layer 4 covers the surface of the light-blocking structure 7 away from the substrate 11 and the side of the light-blocking structure 7 that forms the third opening K3.

[0249] In this case, such as Figure 27 As shown, in the fabrication process of the display panel 10, after step S21 and before step S22, step S211 is included, which involves forming the light-blocking structure 7. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0250] In this case, the light-blocking structure 7 and the first electrode 211 are disposed in the same layer. The so-called same layer means that they are disposed on the same film layer structure (e.g., the planar layer 15 furthest from the substrate 11). The thickness of the light-blocking structure 7 and the first electrode 211 can be the same or approximately the same, or they can have different thicknesses.

[0251] In this way, on the one hand, the light-blocking structure 7 can prevent light from the external environment from shining on the reflective structure inside the display panel 10 (e.g., Figure 26 On the first metal layer 12 and the second metal layer 13 shown in the figure; on the other hand, even when the light emitted by the light-emitting element L shines on the reflective structure and is reflected, the light reflected by the reflective structure is blocked by the light-blocking structure 7 and cannot be emitted, thereby avoiding the problem that the light reflected by the reflective structure will affect the display effect when it is emitted out of the display panel 10, thereby improving the display quality of the display panel 10.

[0252] In some embodiments, such as Figure 28 and Figure 29 As shown, the light-blocking structure 7 is disposed between the pixel defining layer 4 and the partition structure 5. The boundary of the light-blocking structure 7 forming the third opening K3 coincides with the boundary of the pixel defining layer 4 forming the first opening K1, or is located within the boundary of the first opening K1; the boundary of the light-blocking structure 7 forming the third opening K3 coincides with the boundary of the partition structure 5 forming the second opening K2, or is located within the boundary of the second opening K2.

[0253] The partition structure 5 covers the surface of the light-blocking structure 7 away from the substrate 11, as well as the side of the light-blocking structure 7 that forms the third opening K3.

[0254] For example, the light-blocking structure 7 may be formed after the pixel defining layer 4 and before the partition structure 5. The partition structure 5 may cover the light-blocking structure 7, thereby protecting the edge portion of the light-blocking structure 7 and preventing damage to the light-blocking structure 7 during the subsequent evaporation and etching processes in the formation of the light-emitting part 221.

[0255] The light-blocking structure 7 covers the upper surface of the pixel defining layer 4. Thus, when ambient light shines into the display panel 10, the light directed towards the pixel defining layer 4 is blocked by the light-blocking structure 7 and cannot reach the pixel defining layer 4, thereby preventing it from passing through the pixel defining layer 4 and reaching the reflective structures (e.g., reflective elements) in the display panel 10. Figure 28 The first metal layer 12 and / or the second metal layer 13 shown in the figure prevent light reflected from the light-emitting structure from escaping from the display panel, thus ensuring the display quality of the display panel 10.

[0256] Meanwhile, when the light emitted by the light-emitting element L in the display panel 10 shines on the light-emitting structure, the light reflected by the light-emitting structure will be blocked by the light-blocking structure 7 and cannot be emitted, thereby preventing the light reflected by the light-emitting structure from escaping the display panel 10 and ensuring the display quality of the display panel 10.

[0257] In this case, such as Figure 29 As shown, in the fabrication process of the display panel 10, after step S22 and before step S23, step S221, forming the light-blocking structure 7, is included. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0258] In conjunction with the description of step S24 in the aforementioned method for preparing the display panel 10, and Figure 12 , Figure 13 and Figure 29In this case, even if the light-blocking structure 7 includes organic materials, it is enclosed by the partition structure 5. On the one hand, the light-blocking structure 7 will not absorb water in step S24; on the other hand, the light-blocking structure 7 will not come into contact with the subsequently formed light-emitting part 221, effectively avoiding the problem that the light-blocking structure 7 absorbing water and coming into contact with the light-emitting part 221 will affect the light-emitting effect of the light-emitting part 221.

[0259] Based on this, it can be understood that when the light-blocking structure 7 is made of a material with poor water absorption, the light-blocking structure 7 may not be covered by the partition structure 5. The side of the light-blocking structure 7 that forms the third opening K3 may be flush or approximately flush with the side of the partition structure 5 that forms the second opening K2.

[0260] In some embodiments, such as Figure 30 , Figure 32 and Figure 34 As shown, the light-blocking structure 7 is disposed on the side of the isolation structure 5 away from the substrate 11. The light-blocking structure 7 may be disposed between the organic encapsulation layer 32 and the isolation structure 5, or between the organic encapsulation layer 32 and the second inorganic encapsulation layer 33, or on the side of the second inorganic encapsulation layer 33 away from the substrate 11.

[0261] In some examples, such as Figure 30 As shown, the first inorganic encapsulation layer 31 covers multiple light-emitting parts 221 and exposes the upper surface of the partition structure 5. The lower surface of the light-blocking structure 7 is in contact with the upper surface of the partition structure 5, and the lower surface of the light-blocking structure 7 completely covers the upper surface of the partition structure 5.

[0262] In this case, the partition structure 5 can be formed using inorganic materials or metallic materials. The reflective structure (e.g., reflecting external light onto the display panel 10) Figure 30 The light from the first metal layer 12 and the second metal layer 13 shown in the figure, and / or the light from the light-emitting element L illuminating the reflective structure, are reflected by the reflective structure and emitted toward the light-emitting side of the display panel 10.

[0263] When the partition structure 5 is made of inorganic material, the light reflected by the reflective structure is blocked by the light-blocking structure 7 after passing through the partition structure 5, thus avoiding the problem that the light reflected by the reflective structure will affect the display effect when it passes through the display panel 10, thereby improving the display quality of the display panel 10.

[0264] When the partition structure 5 is made of metal, the reflective structure includes a first metal layer 12, a second metal layer 13, and the partition structure 5. The portion of the light reflected by the first metal layer 12 and the second metal layer 13 that shines on the partition structure 5 is blocked by the partition structure 5 and cannot be emitted. The light from the external environment shining on the partition structure 5 is blocked by the light-blocking structure 7. In this way, the light from the external environment shining into the display panel 10 can be effectively prevented from being reflected out by the light-emitting structure inside the display panel 10, thus avoiding the influence of the light reflected by the reflective structure on the display effect and improving the display quality of the display panel 10.

[0265] In some embodiments, such as Figure 30 As shown, the light-blocking structure 7 is located on the side of the partition structure 5 away from the substrate 11, and the boundary of the light-blocking structure 7 forming the third opening K3 coincides with the boundary of the partition structure 5 forming the second opening K2, or is located within the boundary of the partition structure 5 forming the second opening K2.

[0266] In this case, the light-blocking structure 7 completely or substantially completely covers the upper surface of the partition structure 5.

[0267] The upper surface of the partition structure 5 is the light-emitting side of the partition structure 5 near the display panel 10. Regardless of whether the partition structure 5 is made of inorganic or metallic materials, that is, regardless of whether the partition structure 5 has good light transmittance or high light reflectivity, by making the light-blocking structure 7 completely cover the upper surface of the partition structure 5, compared to exposing part of the surface of the partition structure 5, the light-blocking structure 7 can achieve a better light-blocking effect, so that the display panel 10 has a better display effect.

[0268] In this case, such as Figure 31 As shown, in the fabrication process of the display panel 10, after step S23 and before step S24, step S231, forming the light-blocking structure 7, is also included. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0269] like Figure 32 As shown, the light-blocking structure 7 can be formed after the organic encapsulation layer 32 and before the second inorganic encapsulation layer 33. The lower surface of the light-blocking structure 7 is in contact with the organic encapsulation layer 32, and the upper surface of the light-blocking structure 7 is in contact with the second inorganic encapsulation layer 33.

[0270] In this case, such as Figure 33 As shown, in the fabrication process of the display panel 10, after step S25 and before step S26, the process includes step S251, forming the light-blocking structure 7. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0271] Light from the external environment that enters the display panel 10 is blocked by the light-blocking structure 7 and will not shine on the reflective structure of the display panel 10 (e.g., Figure 32 The first metal layer 12, the second metal layer 13 and the partition structure 5 shown in the figure effectively prevent light from the external environment from shining into the display panel 10 from being reflected out by the light-emitting structure inside the display panel 10, thereby avoiding the influence of the light reflected by the reflective structure on the display effect and improving the display quality of the display panel 10.

[0272] Meanwhile, when the light emitted by the light-emitting element L of the display panel 10 shines on the reflective structure, the light reflected by the reflective structure is blocked by the partition structure 5 made of metal material, or it passes through the partition structure 5 made of inorganic material and is blocked by the light-blocking structure 7, so that the light reflected by the reflective structure cannot be emitted from the display panel 10, thus ensuring the display quality of the display panel 10.

[0273] In this case, the partition structure 5 can be formed of inorganic materials or metal materials. The light from the external environment that shines on the reflective structure, and / or the light from the light-emitting element L that shines on the reflective structure, is reflected by the reflective structure and emitted towards the light-emitting side of the display panel 10.

[0274] When the partition structure 5 is made of inorganic material, the light reflected by the reflective structure is blocked by the light-blocking structure 7 after passing through the partition structure 5, thus avoiding the problem that the light reflected by the reflective structure will affect the display effect when it passes through the display panel 10, thereby improving the display quality of the display panel 10.

[0275] When the partition structure 5 is made of metal, the reflective structure includes a first metal layer 12 and the partition structure 5. The portion of the light reflected by the first metal layer 12 that shines on the partition structure 5 is blocked by the partition structure 5 and cannot be emitted. The light from the external environment that shines on the partition structure 5 is blocked by the light-blocking structure 7. In this way, the light from the external environment that shines into the display panel 10 can be effectively prevented from being reflected out by the reflective structure inside the display panel 10, thus avoiding the impact of the light reflected by the reflective structure on the display effect and improving the display quality of the display panel 10.

[0276] In some embodiments, such as Figure 34 As shown, the light-blocking structure 7 is disposed between the second inorganic encapsulation layer 33 and the light-filtering layer 6. The lower surface of the light-blocking structure 7 is in contact with the second inorganic encapsulation layer 33, and the upper surface of the light-blocking structure 7 is in contact with the touch panel 8.

[0277] Light from the external environment that enters the display panel 10 is blocked by the light-blocking structure 7 and will not shine on the reflective structure of the display panel 10 (e.g., Figure 34The first metal layer 12, the second metal layer 13 and the partition structure 5 shown in the figure effectively prevent light from the external environment from shining into the display panel 10 from being reflected out by the light-emitting structure inside the display panel 10, thereby avoiding the influence of the light reflected by the reflective structure on the display effect and improving the display quality of the display panel 10.

[0278] Meanwhile, when the light emitted by the light-emitting element L of the display panel 10 shines on the reflective structure, the light reflected by the reflective structure is blocked by the partition structure 5 made of metal material, or it passes through the partition structure 5 made of inorganic material and is blocked by the light-blocking structure 7, so that the light reflected by the reflective structure cannot be emitted from the display panel 10, thus ensuring the display quality of the display panel 10.

[0279] In this case, such as Figure 35 As shown, in the fabrication process of the display panel 10, after step S26 and before step S3, step S261, forming the light-blocking structure 7, is also included. The formation process of the light-blocking structure 7 is described in steps S11c and S11d above.

[0280] For example, such as Figure 35 As shown, in the fabrication process of the display panel 10, after step S261 and before step S3, step S262, forming a filling structure T, is also included. The filling structure T fills the third opening K3 of the light-blocking structure 7, so that the subsequently formed light-filtering layer 6 can be formed on a relatively flat surface. Of course, in step S262, a third insulating layer 16 can also be formed.

[0281] In summary, in some embodiments of this disclosure, by providing a light-blocking structure 7, when external ambient light shines into the display panel 10, the light is blocked by the light-blocking structure 7 and will not shine on the reflective structure of the display panel 10 (e.g., Figure 34 The first metal layer 12 and the partition structure 5 shown in the figure are used to effectively prevent light from the external environment from entering the display panel 10 from being reflected out by the light-emitting structure in the display panel 10, thereby avoiding the influence of the light reflected by the reflective structure on the display effect and improving the display quality of the display panel 10.

[0282] Meanwhile, when the light emitted by the light-emitting element L of the display panel 10 shines on the reflective structure, the light reflected by the reflective structure is blocked by the partition structure 5 made of metal material, or after passing through the partition structure 5 made of inorganic material, it is blocked by the light-blocking structure 7, so that the light reflected by the reflective structure cannot be emitted from the display panel 10, thereby avoiding the influence of the light reflected by the reflective structure on the display effect of the display panel 10 and ensuring the display quality of the display panel 10.

[0283] Furthermore, the light-blocking structure 7 can be flexibly positioned and can be placed between different film layers in the display panel 10 according to actual needs, increasing the design flexibility of the display panel 10.

[0284] It should be noted that the light-emitting structure described in the foregoing embodiments is a general term for the parts of the display panel 10 that can reflect light, for ease of explanation. The parts included in the light-emitting structure do not represent that they are adjacent, connected or cooperative as a whole. They are only used as a substitute for the structure made of reflective material for the purpose of explaining the technical solution. The structural parts included in the reflective structure and their subordinate divisions are not intended to limit this disclosure.

[0285] Based on any of the above embodiments, in some display panels 10 disclosed herein, the partition structure 5 can be made of materials with poor water absorption, such as inorganic materials or metallic materials. Thus, during the fabrication of the display panel 10, the light-emitting portions 221 of adjacent light-emitting elements L are separated by the pixel defining layer 4 and the partition structure 5. Furthermore, the partition structure 5 has poor water absorption; therefore, during the formation of the light-emitting functional layer 22, when multiple light-emitting portions 221 are formed using a vapor deposition process combined with an etching process, even if the pixel defining layer 4 and the partition structure 5 come into contact with the organic light-emitting material of the light-emitting element L, they will not transfer moisture to the organic light-emitting material of the light-emitting element L. This avoids the problem of the organic light-emitting material of the light-emitting element L absorbing water and causing failure.

[0286] The above description is merely a specific embodiment of this disclosure, but the scope of protection of this disclosure is not limited thereto. Any variations or substitutions conceived by those skilled in the art within the scope of the technology disclosed in this disclosure should be included within the scope of protection of this disclosure. Therefore, the scope of protection of this disclosure should be determined by the scope of the claims.

Claims

1. A display panel, characterized in that, include: Substrate; A pixel defining layer is disposed on the substrate; the pixel defining layer includes a plurality of first openings; A partition structure is disposed on the side of the pixel defining layer away from the substrate; the partition structure includes a plurality of second openings, wherein in a normal projection onto the substrate, one of the second openings at least partially overlaps with one of the first openings; Multiple light-emitting parts, at least a portion of one of the light-emitting parts is located within one of the first openings, and two adjacent light-emitting parts are separated by the partition structure; A first metal layer is disposed between the substrate and the pixel defining layer; A light-blocking structure is disposed on the side of the first metal layer away from the substrate; the light-blocking structure includes a plurality of third openings, wherein in a positive projection onto the substrate, one of the third openings at least partially overlaps with one of the second openings; The light-blocking structure includes a light-shielding material.

2. The display panel according to claim 1, characterized in that, The light-blocking structure is disposed on the side of the partition structure close to the substrate.

3. The display panel according to claim 2, characterized in that, The display panel also includes: A second metal layer is disposed on the side of the first metal layer away from the substrate; A first planarization layer is disposed on the side of the second metal layer away from the substrate; A first electrode layer is disposed between the first planarization layer and the pixel defining layer; The light-blocking structure is disposed between the first planarization layer and the first electrode layer.

4. The display panel according to claim 3, characterized in that, The display panel also includes: A second planarization layer is disposed between the first planarization layer and the first electrode layer; The light-blocking structure is disposed between the first planarization layer and the second planarization layer; in the orthographic projection onto the substrate, the third opening of the light-blocking structure coincides with the first opening of the pixel defining layer, or is located within the first opening of the pixel defining layer.

5. The display panel according to claim 4, characterized in that, The first electrode layer includes a plurality of first electrodes, one of which is located on the side of the light-emitting portion closer to the substrate; The light-blocking structure is disposed between the second planarization layer and the first electrode layer, with the edge of the first electrode overlapping the surface of the light-blocking structure away from the substrate.

6. The display panel according to claim 2, characterized in that, The light-blocking structure is disposed between the first electrode layer and the pixel defining layer; The pixel defining layer covers the surface of the light-blocking structure away from the substrate, as well as the side of the light-blocking structure that forms the third opening.

7. The display panel according to claim 2, characterized in that, The light-blocking structure is located between the pixel defining layer and the partition structure; The boundary of the light-blocking structure forming the third opening coincides with the boundary of the pixel defining layer forming the first opening, or is located within the boundary of the pixel defining layer forming the first opening. The boundary of the light-blocking structure forming the third opening coincides with the boundary of the partition structure forming the second opening, or is located within the boundary of the partition structure forming the second opening.

8. The display panel according to claim 7, characterized in that, The partition structure covers the surface of the light-blocking structure away from the substrate, and the side of the light-blocking structure that forms the third opening.

9. The display panel according to claim 1, characterized in that, The light-blocking structure is disposed on the side of the isolation structure away from the substrate.

10. The display panel according to claim 9, characterized in that, The boundary of the light-blocking structure forming the third opening coincides with the boundary of the partition structure forming the second opening, or is located within the boundary of the partition structure forming the second opening.

11. The display panel according to claim 9, characterized in that, The display panel further includes: an encapsulation structure; The encapsulation structure includes a first inorganic encapsulation layer, an organic encapsulation layer, and a second inorganic encapsulation layer arranged sequentially along a direction away from the substrate. The first inorganic encapsulation layer includes a plurality of inorganic encapsulation portions, and at least a portion of one of the inorganic encapsulation portions is located within a first opening. The light-blocking structure is disposed between the organic encapsulation layer and the partition structure, or between the organic encapsulation layer and the second inorganic encapsulation layer, or on the side of the second inorganic encapsulation layer away from the substrate.

12. The display panel according to claim 11, characterized in that, The display panel further includes a filter layer disposed on the side of the encapsulation structure away from the substrate; The light-blocking structure is disposed between the filter layer and the second inorganic encapsulation layer.

13. The display panel according to claim 12, characterized in that, The filter layer includes a black matrix and multiple filter elements. The black matrix has multiple fourth openings, and one filter element is located within one of the fourth openings. In a normal projection onto the substrate, the fourth opening is located within the third opening of the light-blocking structure.

14. The display panel according to any one of claims 1 to 13, characterized in that, The partition structure includes metallic or inorganic materials; A cross-section is made of the partition structure along a plane perpendicular to the substrate, and the cross-sectional shape of the partition structure includes at least one of trapezoidal, inverted trapezoidal or I-shaped.

15. A display device, characterized in that, Includes a display panel as described in any one of claims 1 to 14, and a circuit board; The display panel is connected to the circuit board.

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