A heat dissipation device of a hemispherical resonator gyro

Abstract

The application relates to the technical field of hemispherical resonator gyroscopes, in particular to a heat dissipation device of a hemispherical resonator gyroscope, which comprises a hemispherical resonator and a getter arranged in a sealed shell, the sealed shell comprises a first cylinder section and a second cylinder section, the first cylinder section and the second cylinder section are sealingly connected through a folding heat dissipation plate, a thermal actuator and a heat conduction rod are further arranged in the second cylinder section, the thermal actuator is connected with the getter heated by electricity through the heat conduction rod, the thermal actuator comprises a driving end and a positioning end, a positioning plate is arranged on the connecting end of the first cylinder section and the folding heat dissipation plate, and the end of the positioning end is fixedly connected with the positioning plate. The first cylinder section and the second cylinder section of the application are away from each other, the folding heat dissipation plate is unfolded, the heat dissipation surface area is greatly increased, heat dissipation is strengthened, and the hemispherical resonator is far away from the getter, the whole process is driven and controlled by the heat generated by the getter itself.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of hemispherical resonator gyroscopes, and in particular to a heat dissipation device for a hemispherical resonator gyroscope. BACKGROUND

[0002] As a high-precision and high-reliability inertial instrument, the hemispherical resonator gyroscope requires its core component, the hemispherical resonator, to work in an ultra-high vacuum environment to maintain an extremely high quality factor. Therefore, a non-evaporable getter needs to be configured in the vacuum chamber of the gyroscope to adsorb residual gas through an activation process to maintain long-term vacuum degree. The activation of the getter requires heating to several hundred degrees Celsius by power supply, which will generate significant heat. In a vacuum environment, heat is mainly transmitted in the form of radiation, which can easily cause the temperature of internal components of the gyroscope (such as the resonator and solder joints) to be too high, causing problems such as solder melting, loss of assembly precision, and even functional failure. At the same time, if the gas released during the activation process is excessive, it may exceed the load of the vacuum exhaust system. In the patent with the publication number CN112135491B and the title "Heat dissipation device and method for hemispherical resonator gyroscope getter", a scheme combining a wrapped getter heat collection / conduction device with a water-cooling heat dissipation system is used, and a step-by-step activation strategy is adopted, effectively solving the problems of overheating of internal components and protection of the vacuum pump.

[0003] However, the above-mentioned prior art solution still has some deficiencies. First, this solution requires an additional independent wrapped heat sink structure inside the vacuum chamber, and a complete water-cooling system, including a water-cooling head, a circulating pump, a radiator, etc., needs to be matched externally. This undoubtedly increases the complexity and space occupation of the system, and its integration applicability is limited for hemispherical resonator gyroscopes with compact structure and valuable space. Second, this solution has additional energy consumption and relies on an external monitoring system. The circulating pump and fan in the water-cooling system need to be powered continuously, and temperature-sensing platinum resistors need to be pasted on the heat sink and shell for real-time temperature monitoring, and the water-cooling system needs to be controlled based on this data, which increases the energy consumption and complexity of the system. Finally, the heat dissipation efficiency of this heat dissipation system cannot be self-adaptively adjusted according to the heat level of the getter. Its heat dissipation capacity mainly depends on the thermal resistance of the fixed structure and the forced intervention of the external water-cooling system, and it cannot intelligently adjust the heat dissipation intensity at different stages of the activation process (such as the initial heating and high-temperature steady-state stages), which is essentially a passive response to external instruction adjustment method, and there is still room for improvement in energy efficiency and response agility. SUMMARY

[0004] The present application provides a heat dissipation device for a hemispherical resonator gyroscope to solve the above technical problems.

[0005] To achieve the above-mentioned purposes, the technical solutions adopted by the present application are as follows:

[0006] A heat dissipation device of a hemispherical resonator gyroscope, comprising a hemispherical resonator, a getter and a sealed shell, the hemispherical resonator and the getter are arranged in the vacuum chamber of the sealed shell, the sealed shell comprises a first cylinder segment and a second cylinder segment, the first cylinder segment and the second cylinder segment are connected by a folded heat dissipation plate, the hemispherical resonator and the getter are arranged in the first cylinder segment and the second cylinder segment respectively, and the folded heat dissipation plate is arranged at one end close to the second cylinder segment;

[0007] The second cylinder segment is also provided with a thermal actuator and a heat conduction rod, the thermal actuator is connected with the getter heated by electricity through the heat conduction rod, the thermal actuator comprises a driving end and a positioning end, the connecting end of the first cylinder segment and the folded heat dissipation plate is provided with a positioning plate, and the end of the positioning end is fixedly connected with the positioning plate for controlling the relative distance between the first cylinder segment and the second cylinder segment.

[0008] Further, the thermal actuator is provided with two groups, and the two groups of thermal actuators are symmetrically arranged on the two sides of the getter. When the getter generates heat, the heat is synchronously transmitted to the thermal actuators on the two sides through the heat conduction rod, so as to ensure that the two thermal actuators are synchronously driven and balanced thrust is applied to the positioning plate. The folded heat dissipation plate is stably unfolded, which not only increases the distance between the hemispherical resonator and the getter, but also increases the heat dissipation area.

[0009] Further, the driving end of the thermal actuator is arranged on the end face of the second cylinder segment, and the axis of the positioning end of the thermal actuator is perpendicular to the end face of the second cylinder segment. The thrust generated by the thermal actuator can act along the axial direction of the sealed shell, so that the first cylinder segment is stably pushed away, and no other component force is generated.

[0010] Further, the inner side bending parts of the folded heat dissipation plate are provided with positioning rings, and a plurality of the positioning rings are sleeved on the positioning end of the thermal actuator. The core function of the positioning ring is to act as a skeleton of the folded heat dissipation plate and a guide bearing of the positioning end. The plurality of positioning rings constrain the folded heat dissipation plate on the positioning end, so as to ensure that the folded heat dissipation plate moves regularly according to the preset wrinkle form when it is retracted and unfolded, thereby guaranteeing the stability and predictability of the unfolded form. Meanwhile, the sleeving cooperation between the positioning ring and the positioning end can effectively prevent the positioning end from bending or vibrating under the thrust due to the too long cantilever, thereby enhancing the rigidity and stability of the whole extension mechanism.

[0011] Further, the heat conduction rod is made of high-thermal-conductivity material, and the folded heat dissipation plate is a flexible composite heat dissipation film. The heat conduction rod is made of oxygen-free copper or high-purity aluminum and other materials with extremely high thermal conductivity, which is used to transmit the peak heat generated at the getter to the temperature sensing part of the thermal actuator, so as to ensure that the thermal actuator can timely sense the temperature change and trigger the response. The folded heat dissipation plate adopts a flexible composite heat dissipation film, which has both transverse thermal conductivity and mechanical flexibility. It can not only efficiently radiate heat as a huge heat dissipation surface when it is unfolded, but also can repeatedly bend without fatigue damage when it is retracted.

[0012] Further, the positioning end of the thermal actuator is heated to extend when exceeding a high temperature threshold, and the thermal actuator is further provided with an elastic component for restoring the positioning end, and the high temperature threshold is set in a range of 150-180 DEG C. The range of 150-180 DEG C is lower than the solder melting temperature of the hemispherical resonator 1. When lower than the threshold, the thermal actuator remains in the existing state and does not drive the positioning end to displace. Once the temperature exceeds the threshold, the temperature sensing substance in the thermal actuator expands sharply to push out the positioning end against the pre-tightening force of the elastic component, triggering the heat dissipation action.

[0013] Further, the height of the hemispherical resonator is not greater than the height of the first cylinder segment.

[0014] Further, the height of the getter is not greater than the height of the second cylinder segment. When the folded heat dissipation plate is in the folded state, the hemispherical resonator does not contact the getter, and the getter does not contact the inner wall of the sealed shell, so that the getter can release gas when activated.

[0015] Further, the hemispherical resonator comprises a resonator and a sensitive base, the resonator is provided with a center rod, the sensitive base is centrally provided with a support connecting hole for the center rod to penetrate, and the resonator and the sensitive base are connected and fixed by high-temperature easy soldering.

[0016] Further, the getter is fixed to the inner wall of the sealed shell, and the getter is provided with two pins, and the two pins are connected with an external power supply unit through an insulator arranged on the sealed shell. The two pins of the getter are connected with the insulator respectively, and penetrate the end of the second cylinder segment to the outside of the vacuum chamber for power supply to the getter. The insulator on the sealed shell is a metal pipe, and the dimension of the metal pipe is just capable of wrapping the pin. When power is supplied, the insulator serves as a channel for internal and external electrical signals, and a layer of glass is arranged between the insulator and the sealed shell to realize insulation with the sealed shell and ensure the air tightness of the vacuum chamber. When a current signal is applied to the pin, the sealed shell is always in a safe state without current due to the glass, and the sealed shell is not affected.

[0017] Compared with the prior art, the present application has the following beneficial effects:

[0018] 1. The folded heat dissipation plate and the first cylinder segment and the second cylinder segment which can dynamically move are arranged, when the getter is high temperature and exceeds the threshold, the positioning end of the thermal actuator is heated to extend, and then the first cylinder segment is controlled to move away from the second cylinder segment, and the distance between the hemispherical resonator and the getter is physically far away, and the risk of melting of the solder on the hemispherical resonator is reduced.

[0019] 2. In this invention, after the first cylindrical section moves away from the second cylindrical section, the folded heat dissipation plate unfolds, thereby significantly increasing the heat dissipation surface area and enhancing heat dissipation. Moreover, the entire process is driven and controlled by the heat generated by the getter itself, and the heat dissipation intensity matches the heat load, resulting in a more agile response and more precise temperature control.

[0020] 3. This invention utilizes the direct physical response of a thermal actuator to temperature as a driving source, eliminating the need for electrical energy consumption and any external temperature sensors or controllers, thus reducing additional energy consumption and simplifying the system structure. Attached Figure Description

[0021] Figure 1 This is a schematic diagram of the first state planar structure of the present invention;

[0022] Figure 2 This is a schematic diagram of the second state planar structure of the present invention;

[0023] Figure 3 This is a schematic diagram of the thermal actuator.

[0024] Figure 4 This is a schematic diagram of the planar structure of Embodiment 3;

[0025] Figure labels: 1-Hemispherical resonator, 2-Getting agent, 3-Sealed housing, 301-First cylindrical section, 302-Second cylindrical section, 4-Folded heat sink, 5-Thermal actuator, 501-Drive end, 502-Positioning end, 6-Heat-conducting rod, 7-Positioning plate, 8-Positioning ring, 9-Pin, 10-Insulator, 11-Heat insulation plate surface, 12-Connecting rod. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0027] Example 1, as Figures 1-4 As shown, the present invention discloses a heat dissipation device for a hemispherical resonator gyroscope, comprising a hemispherical resonator 1, a getter 2, and a sealed housing 3. The hemispherical resonator 1 and the getter 2 are both disposed within the vacuum chamber of the sealed housing 3. The sealed housing 3 comprises a first cylindrical section 301 and a second cylindrical section 302, which are sealed together by a folded heat dissipation plate 4. The hemispherical resonator 1 and the getter 2 are respectively disposed within the first cylindrical section 301 and the second cylindrical section 302, and the folded heat dissipation plate 4 is disposed at one end near the second cylindrical section 302.

[0028] The second cylinder segment 302 is also provided with a thermal actuator 5 and a heat conduction rod 6, the thermal actuator 5 is connected with the current heating getter 2 through the heat conduction rod 6, the thermal actuator 5 includes a driving end 501 and a positioning end 502, the first cylinder segment 301 is provided with a positioning plate 7 at the connecting end of the folded heat dissipation plate 4, and the end of the positioning end 502 is fixedly connected with the positioning plate 7 and used for controlling the relative distance between the first cylinder segment 301 and the second cylinder segment 302.

[0029] Specifically, the hemispherical resonator 1 must work in a high-vacuum environment to eliminate air damping and ensure a very high quality factor, thereby ensuring the accuracy and stability of the gyroscope. The service life of the hemispherical resonator 1 is up to 15 years or more, during which the internal material will slowly outgas, and the weld may have a small leak. Therefore, it is necessary to continuously adsorb these slowly released gases by the getter 2 to maintain the effect of long-term vacuum. The activation process of the getter 2 must be carried out in a vacuum, and the getter 2 is powered on, and the internal temperature of the getter 2 gradually rises, and the passivation film existing on the surface is removed through reaction to expose the fresh metal layer. During this activation process, the getter 2 releases gas, and the exhaust system needs to exhaust the released gas (the getter 2 is mainly based on zirconium and titanium, and during storage and assembly, the active surface will react with oxygen in the air to form a dense passivation film, which is usually a metal oxide. This film will isolate the internal active metal, making it unable to adsorb gas. In the activation process, the passivation film is decomposed and dispersed by high-temperature heating in a vacuum, exposing the fresh, highly active metal surface). Due to the long activation process, the temperature of the getter 2 can reach several hundred degrees Celsius. The heat released by the getter 2, except for a small part conducted to the outside through the pin 9 and the insulator 10, the rest of the heat mainly reaches the vacuum chamber of the sealed shell 3 and the quartz components such as the hemispherical resonator 1 through the space radiation path. The quartz components have poor thermal conductivity, and the accumulated heat will cause the temperature to gradually rise, eventually causing the temperature at the solder joint inside the hemispherical resonator 1 to exceed the solder temperature, causing the solder to melt. Further, the hemispherical resonator 1 will be displaced under the action of gravity, and in severe cases, it will even slip off, causing product failure. Therefore, the main heat of the getter 2 is in the vacuum chamber of the sealed shell 3, according to the distance of heat transfer, the heat is first transferred to the folded heat dissipation plate 4, and then transferred to the outside, and the remaining heat is transferred to the hemispherical resonator 1. Due to the unfolding effect of the folded heat dissipation plate 4, the distance between the getter 2 and the hemispherical resonator 1 is further expanded, reducing the heat impact on the hemispherical resonator 1 from the getter 2, thereby reducing the risk of thermal melting of the solder joint of the hemispherical resonator 1. Through the morphological change of the folded heat dissipation plate 4, not only the heat exchange area with the external environment is increased, but also the distance between the getter 2 and the hemispherical resonator 1 is expanded, and the heat impact on the hemispherical resonator 1 is reduced through the cooperation of the two.

[0030] The heat actuators 5 are provided in two groups, which are symmetrically arranged on both sides of the getter 2. Specifically, when the getter 2 generates heat, the heat is synchronously transmitted to the heat actuators 5 on both sides through the heat conduction rods 6, ensuring that the two are synchronously driven to exert balanced thrust on the positioning plate 7. This ensures that the folded heat sink plate 4 is smoothly unfolded, not only increasing the distance between the hemispherical resonator 1 and the getter 2, but also increasing the heat dissipation area.

[0031] The driving end 501 of the heat actuator 5 is arranged on the end face of the second cylinder segment 302, and the axis of the positioning end 502 of the heat actuator 5 is perpendicular to the end face of the second cylinder segment 302. Specifically, the thrust generated by the heat actuator 5 can act along the axial direction of the sealed housing 3 to smoothly push the first cylinder segment 301 away without generating other components of force.

[0032] The inner side folds of the folded heat sink plate 4 are each provided with a positioning ring 8, and a plurality of the positioning rings 8 are sleeved on the positioning end 502 of the heat actuator 5. Specifically, the core function of the positioning ring 8 is to act as a skeleton of the folded heat sink plate 4 and a guide bearing of the positioning end 502. The plurality of positioning rings 8 constrain the folded heat sink plate 4 on the positioning end 502, ensuring that it moves regularly according to the preset pleat pattern when it is contracted and expanded, thereby ensuring the stability and predictability of the unfolded pattern. At the same time, the sleeving cooperation of the positioning ring 8 and the positioning end 502 can effectively prevent the positioning end 502 from bending or vibrating under the thrust due to the overlong cantilever, thereby enhancing the rigidity and stability of the entire extension mechanism.

[0033] The heat conduction rod 6 is made of a high-thermal-conductivity material, and the folded heat sink plate 4 is a flexible composite heat dissipation film. Specifically, the heat conduction rod 6 is made of oxygen-free copper or high-purity aluminum and other materials with extremely high thermal conductivity, which is used to transmit the peak heat generated at the getter 2 to the temperature sensing part of the heat actuator 5, ensuring that the heat actuator 5 can timely sense the temperature change and trigger the response. The folded heat sink plate 4 adopts a flexible composite heat dissipation film, such as a polymer film containing graphene or carbon nanotubes, which has excellent transverse thermal conductivity and mechanical flexibility. It can not only serve as a large heat dissipation surface to efficiently radiate heat when unfolded, but also can be repeatedly bent without fatigue damage when retracted.

[0034] The positioning end 502 of the thermal actuator 5 is heated to extend when the temperature exceeds a high temperature threshold, and the thermal actuator 5 is further provided with an elastic component for restoring the positioning end 502, and the high temperature threshold is set to be in a range of 150-180℃. Specifically, the range of 150-180℃ is lower than the solder melting temperature (melting point about 250℃) of the hemispherical resonator 1. When the temperature is lower than the threshold, the thermal actuator 5 remains in the existing state and does not drive the displacement of the positioning end 502. Once the temperature exceeds the threshold, the temperature sensing substance in the thermal actuator 5 expands sharply to push out the positioning end 502 against the pre-tightening force of the elastic component, triggering the heat dissipation action. Since the thermal actuator 5 is of an existing structure, the structural principle thereof is well known to those skilled in the art, and thus will not be described in detail.

[0035] The height of the hemispherical resonator 1 is not greater than the height of the first cylinder segment 301.

[0036] The height of the getter 2 is not greater than the height of the second cylinder segment 302. Specifically, it is ensured that the hemispherical resonator 1 does not contact the getter 2 and the getter 2 does not contact the inner wall of the sealing shell 3 in the original state (folded state) of the folded heat dissipation plate 4, so as to facilitate the gas release of the getter 2 when activated.

[0037] The hemispherical resonator 1 comprises a resonator and a sensitive base, the resonator is provided with a center rod, the sensitive base is centrally provided with a support connecting hole for the center rod to penetrate, and the resonator and the sensitive base are connected and fixed by high-temperature easy soldering. Specifically, the main technical effect of the present application is to prevent the internal solder of the hemispherical resonator 1 from melting due to overheating in a high temperature environment, and even a small displacement deviation can cause the core precision and function of the hemispherical resonator 1 to fail.

[0038] The getter 2 is fixed to the inner wall of the sealed shell 3, and two ends of the getter 2 are provided with pins 9, which are connected with an external power supply unit through insulators 10 provided on the sealed shell 3. Specifically, the two pins 9 of the getter 2 are connected with the insulators 10 respectively, and pass through the end of the second cylinder segment 302 to the outside of the vacuum chamber for energizing the getter 2. The insulator 10 on the sealed shell 3 is a metal tube, and the dimension of the metal tube is just enough to wrap the pin 9. When energized, the insulator 10 serves as a channel for internal and external electrical signals, and there is a layer of glass between the insulator 10 and the sealed shell 3 to realize insulation with the sealed shell 3 and ensure the air tightness of the vacuum chamber. When a current signal is applied to the pin 9, the sealed shell 3 is always in a safe state without current due to the effect of the glass, and will not affect the sealed shell 3. Preferably, the energizing process is to apply current to the getter 2 successively, and the initial current applied is 2A, and then the current is increased by 0.5A successively until the limit current. The specific steps are as follows: the first current is applied to the insulator 10 of the sealed shell 3 to perform the first activation, the first applied current is 2A, and when the air pressure turning point appears in the sealed shell 3, it is marked to start timing and wait for 30 seconds to turn off the power, and the first activation process is ended. When the air pressure in the sealed shell 3 is lower than 1*10^5Pa, the second current is applied to the insulator 10 of the sealed shell 3, the second applied current is 2.5A, and when the air pressure turning point appears in the sealed shell 3, it is marked to start timing and wait for 30 seconds to turn off the power, and the second activation process is ended. In this way, until the last step of activation, when the air pressure is close to the air pressure before the first activation, the power is turned off to ensure that the getter 2 is activated completely.

[0039] In example two, on the basis of example one, the specific working principle of the heat dissipation device of the hemispherical resonator gyroscope is proposed.

[0040] When the getter 2 is in the inactive normal temperature state, the positioning end 502 of the thermal actuator 5 is in the retracted position, the first cylinder segment 301 is attached to the second cylinder segment 302, and the folded heat sink 4 is in the compressed folded state, and the entire sealed housing 3 is in a compact configuration. First, a first activation current is applied to the getter 2 by an external power source via the insulator 10, and the getter 2 generates heat, and its temperature gradually rises. During this period, a small part of the generated heat is conducted away through the pin 9, and most of it is diffused in the form of radiation to the internal vacuum cavity of the sealed housing 3. During this process, the heat is transferred to the temperature-sensitive parts of the two thermal actuators 5 through the highly thermally conductive heat conduction rod 6. The thermal actuators 5 continuously perceive the temperature from the getter 2. If the temperature does not exceed the set threshold, the thermal actuators 5 remain stationary, and the folded heat sink 4 maintains the folded state, which is conducive to the rapid heating of the getter 2 to the effective activation temperature and the gradual release of its internal gas. If the temperature exceeds the set threshold, the temperature-sensitive substance inside the thermal actuator 5 undergoes a sharp volume expansion, generating a huge pressure that overcomes the pre-tightening force of the internal elastic component, pushing the positioning end 502 to extend outward.

[0041] The positioning end 502 of the thermal actuator 5 extends, pushing the first cylinder segment 301 away from the second cylinder segment 302 through the positioning plate 7 fixedly connected thereto. The distancing of the first cylinder segment 301 drives the hemispherical resonator 1 inside it to move away from the high-temperature getter 2 in space, significantly reducing the heat radiated to the hemispherical resonator 1 and fundamentally reducing the risk of melting of the solder joint overheating. Second, the unfolded folded heat sink 4 has a significantly increased surface area and becomes an efficient radiation heat sink, rapidly conducting heat from the inside to the outside space. At the same time, the unfolding of the structure also improves the internal heat flow path and improves the overall heat dissipation efficiency.

[0042] Preferably, in order to reduce the impact of micro-vibration in the operation of the thermal actuator 5 on the measurement accuracy of the hemispherical resonator 1, the first cylinder segment 301 of the sealed housing 3 is constructed as the fixed base and installation reference of the heat dissipation device of the application. That is, the outer wall of the first cylinder segment 301 is rigidly connected to the external bearing equipment (such as the base plate of the inertial measurement unit IMU) by fasteners. In this way, the hemispherical resonator 1 and the first cylinder segment 301 where it is located as a whole remain in a fixed position with the external equipment throughout the entire working period of the gyroscope, including during the activation process of the getter 2, ensuring that the core sensitive components of the hemispherical resonator 1 are in a static state, meeting the requirements of high-precision inertial instruments for installation stability. On this fixed base, the essential operation process of the application is as follows. When the getter 2 is activated by being powered on, the temperature rises and exceeds the set high temperature threshold. The heat is transferred to the thermal actuator 5 through the heat conducting rod 6. The temperature-sensitive substance of the thermal actuator 5 expands and drives its positioning end 502 to extend outward. Since the driving end 501 of the thermal actuator 5 is fixed to the end face of the second cylinder segment 302, and the end of the positioning end 502 is abutted (or fixedly connected) to the first cylinder segment 301 through the positioning plate 7, therefore, the reaction force generated by the extension of the positioning end 502 will push the entire second cylinder segment 302 away from the fixed first cylinder segment 301.

[0043] As the getter 2 stops heating, its temperature begins to drop. When the temperature drops below the temperature threshold of the thermal actuator 5, the temperature-sensitive substance inside it contracts, and the restoring force of the elastic component (such as a spring) guides the positioning end 502 to return to the initial position.

[0044] In Example Three, based on Example One, a heat dissipation device for a hemispherical resonator gyroscope with a heat insulation plate surface is proposed.

[0045] The first cylinder segment 301 is provided with a heat insulation plate surface 11 on the side facing the second cylinder segment 302, and the heat insulation plate surface 11 is arranged in the vacuum chamber of the sealed housing 3 through a connecting rod 12.

[0046] Specifically, the heat insulation plate surface 11 is a circular plate structure, and the median line of the heat insulation plate surface 11 coincides with the central axis of the hemispherical resonator 1 and is fixedly installed in the inner cavity of the first cylinder segment 301 through the connecting rod 12. Preferably, the connecting rod 12 is arranged adjacent to the positioning plate 7, and its core function is to block the heat dissipation track between the getter 2 and the hemispherical resonator 1. The heat insulation plate surface 11 changes the distribution of the thermal radiation field inside the vacuum chamber, so that the radiant heat flow first radiates to the inner wall of the cavity of the sealed housing 3, and then is reflected multiple times before generating heat at the hemispherical resonator 1. In this process, each reflection is accompanied by energy loss, thereby significantly reducing the net radiant heat reaching the hemispherical resonator 1, greatly improving the reliability of heat protection.

[0047] Of course, the present application can have other various embodiments, and those skilled in the art can make various corresponding changes and modifications according to the present application without departing from the spirit and essence of the present application, and these corresponding changes and modifications shall all belong to the protection scope of the claims of the present application.

Claims

1. A heat dissipation device for a hemispherical resonator gyroscope, comprising a hemispherical resonator (1), a getter (2), and a sealed housing (3), wherein the hemispherical resonator (1) and the getter (2) are both disposed within the vacuum chamber of the sealed housing (3), characterized in that: The sealed housing (3) includes a first cylindrical section (301) and a second cylindrical section (302), which are sealed together by a folded heat dissipation plate (4). The hemispherical harmonic oscillator (1) and the getter (2) are respectively disposed in the first cylindrical section (301) and the second cylindrical section (302). The folded heat dissipation plate (4) is disposed at one end near the second cylindrical section (302). The second cylindrical section (302) is also provided with a thermal actuator (5) and a heat-conducting rod (6). The thermal actuator (5) is connected to the electrically heated getter (2) through the heat-conducting rod (6). The thermal actuator (5) includes a driving end (501) and a positioning end (502). The connection end of the first cylindrical section (301) and the folded heat sink (4) is provided with a positioning plate (7). The end of the positioning end (502) is fixedly connected to the positioning plate (7) to control the relative distance between the first cylindrical section (301) and the second cylindrical section (302).

2. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The thermal actuator (5) is provided in two sets, and the two sets of thermal actuators (5) are symmetrically arranged on both sides of the getter (2).

3. The heat dissipation device for a hemispherical resonant gyroscope according to claim 2, characterized in that: The driving end (501) of the thermal actuator (5) is located on the end face of the second cylinder section (302), and the axis of the positioning end (502) of the thermal actuator (5) is perpendicular to the end face of the second cylinder section (302).

4. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The inner bend of the folded heat sink (4) is provided with a positioning ring (8), and multiple positioning rings (8) are sleeved on the positioning end (502) of the thermal actuator (5).

5. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The heat-conducting rod (6) is made of a high thermal conductivity material, and the folded heat sink (4) is a flexible composite heat sink film.

6. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The positioning end (502) of the thermal actuator (5) is heated and extends when the high temperature threshold is exceeded. The interior of the thermal actuator (5) is also provided with an elastic component that restores the positioning end (502). The high temperature threshold is set in the range of 150℃-180℃.

7. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The height of the hemispherical harmonic oscillator (1) is not greater than the height of the first cylindrical section (301).

8. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The height of the getter (2) is not greater than the height of the second cylinder section (302).

9. The heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The hemispherical resonator (1) includes a resonator and a sensitive base. A central rod is provided on the resonator, and a support connection hole for the central rod to pass through is provided in the center of the sensitive base. The resonator and the sensitive base are connected and fixed by high-temperature effusive solder.

10. A heat dissipation device for a hemispherical resonant gyroscope according to claim 1, characterized in that: The getter (2) is fixed to the inner wall of the sealed housing (3). The getter (2) has pins (9) at both ends. The pins (9) are connected to the external power supply unit through the insulator (10) provided on the sealed housing (3).

Images