Hemispherical gyroscope vacuum packaging device and method based on air suction heater
By designing a vacuum packaging device for a gas-absorbing thermoelectric hemispherical gyroscope, and employing a multi-branched evacuation pipeline and a high-temperature baking process, the complex vacuum packaging process of hemispherical resonant gyroscopes was solved, achieving efficient and reliable vacuum packaging results.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIAN FLIGHT SELF CONTROL INST OF AVIC
- Filing Date
- 2025-12-24
- Publication Date
- 2026-04-21
AI Technical Summary
In the existing technology, the vacuum packaging process of hemispherical resonator gyroscopes is complex and it is difficult to achieve a high vacuum level. There is a lack of specific vacuum packaging process solutions for gas-absorbing hot-electrode hemispherical resonator gyroscopes.
A vacuum packaging device for a hemispherical gyroscope based on gas-absorbing heat is designed, including components such as a gas extraction pipeline, a vacuum chamber, a programmable power supply, a temperature sensor, and a vacuum pump. Through a multi-branch gas extraction pipeline and a high-temperature baking process, efficient vacuum packaging of the hemispherical resonant gyroscope is achieved.
Mass production vacuum packaging of hemispherical resonant gyroscopes has been achieved, ensuring a long-term high vacuum environment, significantly reducing packaging process time, and improving vacuum level and packaging effect.
Smart Images

Figure CN121898359A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of hemispherical resonant gyroscope technology, specifically relating to a vacuum packaging device and method for a hemispherical gyroscope based on air-absorbing heat. Background Technology
[0002] Due to its excellent SWaP characteristics, the hemispherical resonator gyroscope has received widespread attention in the field of inertial sensors both at home and abroad, and is considered to be the most promising new generation of inertial sensors.
[0003] The structure of a hemispherical resonator gyroscope mainly includes a hemispherical resonator, electrodes, a base, an air intake assembly, an outer casing, and an exhaust pipe. Since air damping has a great influence on the Q value (quality factor) of its core component—the hemispherical resonator, the hemispherical resonator needs to work in a high vacuum environment for a long time. This is a necessary guarantee for the high reliability, high precision, and long life of the hemispherical resonator gyroscope.
[0004] To meet this requirement, a highly uniform and dense welding process is needed to connect the outer casing and the base to form a sealed cavity. Then, the vacuum encapsulation of the hemispherical resonator gyroscope is completed using a method of vacuum heating for exhaust, activation of the intake component, and a slit exhaust pipe. However, due to the extremely high vacuum requirements of the hemispherical resonator gyroscope and the complexity of the entire encapsulation process, no specific process scheme for vacuum encapsulation of the heat-electrode type hemispherical resonator gyroscope has been found. Chinese patent CN115727828 A mentions a device for detecting the internal vacuum level of a resonator gyroscope and a vacuum exhaust and encapsulation method. This method briefly describes the vacuum encapsulation process of the hemispherical resonator gyroscope but does not involve the specific device and method for vacuum encapsulation; its main content is a leak detection scheme after gyroscope encapsulation. Chinese patent CN 114754755 A mentions a device and method for vacuum exhaust and encapsulation of a quartz hemispherical resonator gyroscope, but its hemispherical resonator gyroscope structure does not include an exhaust pipe, and the intake component used is a thin-film type rather than a heat-electrode type. Summary of the Invention
[0005] This invention proposes a vacuum packaging device and method for a hemispherical gyroscope based on gas-absorbing heat, which solves the problem of high-vacuum packaging of hemispherical resonant gyroscopes and fills the gap in the existing technology.
[0006] The technical solution of the present invention: In a first aspect, this application provides a vacuum packaging device for a hemispherical gyroscope based on a gas-evolving thermoelectric generator, characterized in that it includes an air extraction pipeline 3, a vacuum chamber 1, a programmable power supply 6, a temperature sensor 4, a vacuum gauge 8, a vacuum pump 9, a worktable 7, an exhaust channel 2, a hemispherical resonant gyroscope head 5, and an exhaust pipe 13, wherein: Vacuum chamber 1 is a cylindrical cavity structure. Heating resistance wires are installed inside the side walls of the chamber to raise the temperature inside the chamber. There is an exhaust channel 2 above vacuum chamber 1, which is connected to a vacuum pump 9 to maintain the vacuum environment inside the vacuum chamber. The pumping pipeline 3 is located on the workbench 7 and adopts a multi-branch design. Each branch pipeline has a VCR interface installed at the pipe opening, and each branch pipeline has an independent vacuum valve, which can be independently connected to a helium mass spectrometer leak detection device. All branches of the pumping pipeline 3 are connected to the vacuum pump 9 and vacuum gauge 8 below through the workbench 7. Temperature sensors 4 are distributed in multiple locations inside vacuum chamber 1 to monitor the overall temperature of the chamber in real time. The programmable power supply 6 is located outside vacuum chamber 1 and is connected to the activation circuit 16 of the hemispherical resonant gyroscope 5 to be vacuum-sealed through external wires to activate the gas-absorbing heat source 15.
[0007] Specifically, the exhaust pipes 3 are evenly distributed on the workbench 7, and the exhaust pipes 3 have at least 8 branches.
[0008] Specifically, each of the evacuation lines 3 can operate independently, and each line has an independent vacuum valve and helium mass spectrometer leak detection device.
[0009] Specifically, one end of the evacuation line 3 is connected to the vacuum pump 9, and the other end is equipped with a VCR connector. Specifically, vacuum chamber 1 has a square or cylindrical cavity structure, and the height of the chamber is not less than 1m.
[0010] Specifically, an exhaust channel 2 is provided above the vacuum chamber 1, through which the vacuum chamber 1 is evacuated.
[0011] Specifically, a large number of heating resistance wires are installed on the inner wall of the vacuum chamber 1. When the coil is energized, it generates the required heat to raise the temperature inside the chamber.
[0012] Specifically, the programmable power supply 6 provides a DC power input of a specific duration and current intensity through programming, which is then supplied to the heating wire to provide the heat required to activate the suction heat generator 15.
[0013] Specifically, the programmable power supply 6 provides DC power for a duration and current intensity that are set according to the type of the gas-absorbing heat source 15 used, and meets the long-term high vacuum environment requirements inside the hemispherical resonant gyroscope head 5.
[0014] Secondly, this application provides a vacuum packaging method for a hemispherical gyroscope based on a heat-evolving hemispherical resonator, which utilizes the aforementioned vacuum packaging device for a hemispherical resonant gyroscope head based on a heat-evolving hemispherical resonator. The method includes: Step 1: High-temperature baking and vacuum treatment: Step 2: Install the hemispherical resonant gyroscope head 5 onto the air extraction pipe 3; Step 3: Turn on the vacuum pump 9 and evacuate the interior of the hemispherical resonant gyroscope head 5 through the evacuation pipe 3. When the vacuum level inside the hemispherical resonant gyroscope head 5 reaches 1E-5 Pa or higher, spray helium gas into the connection between the exhaust pipe 13 of the hemispherical resonant gyroscope head 5 and the port of the evacuation pipe 3 to check for leaks. If a leak occurs, disassemble the head and repeat step 2. If no leak occurs, proceed to step 4. Step 4: Vacuum degassing of the hemispherical resonant gyroscope head 5; Step 5: Set the current intensity of the programmable power supply 6 to 7A and the duration to 20min to activate the gas-absorbing heat exchanger; Step 6: Sealing and post-processing of the exhaust pipe 13 of the hemispherical resonant gyroscope head 5.
[0015] In summary, the vacuum packaging device for hemispherical resonator gyroscope heads based on the gas-absorbing heat source provided by this invention, with its multi-station design of the pumping pipeline, can achieve batch vacuum packaging of hemispherical resonator gyroscope heads. Through the design of the programmable power supply device and activation scheme, the batch effective activation of the gas-absorbing heat source of the hemispherical resonator gyroscope can be achieved, ensuring the long-term performance of the gas-absorbing heat source in maintaining a vacuum environment. The sealing interface VCR connector installed on the pumping pipeline can be used to fix the exhaust pipe and ensure airtightness. The vacuum packaging method based on the gas-absorbing heat source provided by this invention, in order to improve the overall vacuum degassing efficiency, incorporates a 300℃ high-temperature baking vacuum pretreatment step, which increases the background vacuum level and significantly reduces the total time of the vacuum packaging process. Before the formal vacuum pumping and degassing step, leak detection is performed at the connection between the hemispherical resonator gyroscope head and the pumping pipeline port to ensure that the pumping pipeline is in a high-vacuum sealed environment, improving the final effect of the entire vacuum packaging. Attached Figure Description
[0016] Figure 1 This invention relates to a vacuum-encapsulated device for a hemispherical resonant gyroscope head based on a heat-absorbing gas.
[0017] Figure 2 This invention relates to a vacuum packaging method for a hemispherical resonant gyroscope head based on a heat-absorbing gas.
[0018] Figure 3 This is a schematic diagram of the partial structure of the hemispherical resonant gyroscope described in this invention.
[0019] The components include: vacuum chamber 1, exhaust channel 2, air extraction pipeline 3, temperature sensor 4, hemispherical resonant gyroscope head 5, programmable power supply 6, worktable 7, vacuum gauge 88, vacuum pump 9, outer cover 10, hemispherical resonator 11, flat plate electrode 12, exhaust pipe 13, base 14, air intake heat source 15, and activation circuit 16. Detailed Implementation
[0020] To better understand the features of the present invention, the present invention will be further described in detail through specific embodiments.
[0021] Example 1 like Figures 1-3 As shown, this embodiment proposes a vacuum packaging device for a hemispherical resonant gyroscope head based on a gas-absorbing heat source, including a vacuum pipe 3, a vacuum chamber 1, a programmable power supply 6, a temperature sensor 4, a vacuum gauge 8, a vacuum pump 9, a worktable 7, an exhaust channel 2, a hemispherical resonant gyroscope head 5, and an exhaust pipe 13, wherein: The vacuum chamber 1 provided in this embodiment is a cylindrical cavity structure. Heating resistance wires are provided inside the side wall of the chamber for heating the interior of the chamber. There is an exhaust channel 2 above the vacuum chamber 1, which is connected to a vacuum pump 9 to maintain the vacuum environment inside the vacuum chamber. The pumping pipeline 3 is located on the workbench 7 and adopts a multi-branch design. Each branch pipeline has a VCR interface installed at the pipe opening, and each branch pipeline has an independent vacuum valve, which can be independently connected to a helium mass spectrometer leak detection device. All branches of the pumping pipeline 3 are connected to the vacuum pump 9 and vacuum gauge 8 below through the workbench 7. Temperature sensors 4 are distributed in multiple positions inside the vacuum chamber 1 to monitor the overall temperature of the chamber in real time. The programmable power supply 6 is located outside the vacuum chamber 1 and is connected to the activation circuit 16 of the hemispherical resonant gyroscope 5 to be vacuum-sealed through an external wire to activate the gas-absorbing heat source 15.
[0022] Specifically, the material of the air extraction pipe 3 provided in this embodiment is stainless steel, and the structure of the air extraction pipe 3 is an inverted "J" shaped hook; Specifically, the vacuum sealing device provided in this embodiment includes multiple air extraction pipelines 3, which can realize simultaneous operation of multiple stations; Specifically, the air extraction pipes 3 are evenly arranged on the workbench 7, and are generally designed with 8 branches, each of which can work independently; the end of each branch can be extended by 2 more as needed, so that one workbench can simultaneously complete the air extraction and encapsulation of 8 or 16 hemispherical resonant gyroscope heads 5.
[0023] Specifically, each evacuation pipeline 3 provided in this embodiment can operate independently without affecting others. Each pipeline has an independent vacuum valve and helium mass spectrometer leak detection device. The multi-branch design can simultaneously meet the parallel packaging requirements of multiple hemispherical resonant gyroscope heads. Furthermore, it can operate independently during fault diagnosis, quickly identifying the faulty branch pipeline. Specifically, in this embodiment, one end of the air extraction pipeline 3 is connected to the vacuum pump 9, and the other end is equipped with a VCR connector. The VCR connector is a standard structure in the vacuum industry, which can realize a reliable, convenient and highly airtight connection between the branch pipeline and the exhaust pipe 13 on the hemispherical resonant gyroscope head 5.
[0024] Specifically, the vacuum chamber (1) provided in this embodiment has a square or cylindrical cavity structure, and the height of the chamber is not less than 1m; Specifically, the vacuum chamber (1) provided in this embodiment has an exhaust channel 2 on its upper part, through which the vacuum chamber (1) can be evacuated; Specifically, the vacuum chamber (1) provided in this embodiment is made of stainless steel; Specifically, a large number of heating resistance wires are installed on the inner wall of the vacuum chamber (1) provided in this embodiment. These coils can generate the required heat after being energized, which is used to raise the temperature inside the chamber. Specifically, the programmable power supply 6 provided in this embodiment can provide DC input with a specific duration and current intensity through programming, and pass through the heating wire to provide the heat required to activate the gas-absorbing heat element 15. The duration and current intensity of DC input provided by the programmable power supply 6 need to be set in advance according to the type of gas-absorbing heat element 15 used, and meet the requirements of long-term high vacuum environment inside the hemispherical resonant gyroscope head 5.
[0025] Specifically, the temperature sensors 4 are distributed in multiple locations within the cavity to detect the temperature inside the vacuum chamber 1 in real time.
[0026] Specifically, the hemispherical resonant gyroscope provided in this embodiment consists of a hemispherical resonator, a flat plate electrode, a base, an exhaust pipe 13, an air-absorbing heat element, and a sealing cover.
[0027] Specifically, the base of the hemispherical resonant gyroscope provided in this embodiment is a gyroscope head support assembly manufactured by sintering glass insulators with Kovar alloy. A metal-plated pin is sintered in the center of the insulator, which is used for electrical conduction and activation of the getter when the hemispherical resonant gyroscope head 5 is working. An exhaust port is provided on the base for connecting the exhaust pipe 13.
[0028] Specifically, in this embodiment, the gas-absorbing heat source is fixed to the pins sintered on the base by welding, forming an electrical connection with the pins of the base.
[0029] Specifically, the exhaust pipe 13 of the hemispherical resonant gyroscope provided in this embodiment is made of oxygen-free copper and is fixed to the base by welding.
[0030] Preferably, both the resonator and the electrodes are made of quartz glass and are connected by indium solder or adhesive bonding. The base is a support assembly for the hemispherical resonant gyroscope head 5, manufactured using a method of sintering glass insulators with Kovar alloy. A metal-plated pin is sintered in the center of the insulator, which is used for electrical conduction and getter activation during the operation of the hemispherical resonant gyroscope head 5. An exhaust port is provided on the base for connecting the exhaust pipe 13. The outer casing is made of Kovar alloy and is laser-welded to the base to form a sealed structure, providing a vacuum environment for the hemispherical resonant gyroscope head 5.
[0031] Example 2 like Figure 2 As shown, this embodiment provides a vacuum packaging method for a hemispherical resonant gyroscope head based on a gas-absorbing heat source. The specific steps are as follows: Step 1: High-temperature baking and vacuum treatment: Step 11: Set the heating temperature to 300℃ and the vacuum degree to no less than 1E-5Pa; Step 12: Energize the high-resistance coil of the vacuum chamber wall, and simultaneously evacuate through the exhaust channel 2 above the vacuum chamber (1); Step 13: After the entire chamber reaches the set temperature of 300℃ and the vacuum level is higher than 1E-5 Pa, maintain this temperature for 45 hours. Step 14: Cool down and break the vacuum in the vacuum chamber (1); Step 2: Install the hemispherical resonant gyroscope head 5 onto the air extraction pipe 3; Step 21: Open the sealed interface VCR connector on the air extraction line 3, connect the exhaust pipe 13 of the hemispherical resonant gyroscope head 5 to the air extraction line 3, and then fix it with the sealed interface (VCR interface) to form a vacuum air extraction path. Step 22: After the hemispherical resonant gyroscope head 5 is installed, connect the programmable power supply 6 to the air-absorbing heat source through an external wire. Step 23: Complete the installation and fixation of multiple air extraction pipes 3 and hemispherical resonant gyroscope heads 5 according to step 22, and ensure that each air extraction heat element is connected to the programmable power supply 6. Step 3, Leak Detection: Step 31: Turn on the vacuum pump 9 and evacuate the inside of the hemispherical resonant gyroscope head 5 through the evacuation pipe 3; Step 32: When the vacuum level inside the hemispherical resonant gyroscope head 5 reaches 1E-5Pa or higher, spray helium gas into the connection between the exhaust pipe 13 and the air extraction pipe 3 of the hemispherical resonant gyroscope head 5 to confirm whether a leak has occurred.
[0032] Step 33: If a leak occurs, remove the meter head and repeat step 2; Step 34: If no leak occurs, proceed to the next step.
[0033] Step 4: Vacuum degassing of the hemispherical resonant gyroscope head 5; Step 41: Set the heating temperature to 80℃ and the vacuum degree to no less than 1E-6Pa; Step 42: Power the high resistance coil of the vacuum chamber wall and simultaneously evacuate through the exhaust channel 2 above the vacuum chamber (1) so that the environment inside and outside the hemispherical resonant gyroscope head 5 is under vacuum conditions. Step 43: When the vacuum chamber (1) reaches the set temperature and the vacuum level inside the hemispherical resonant gyroscope head 5 is not lower than 1E-6Pa, maintain it for 120h.
[0034] Step 5: Set the current intensity of the programmable power supply 6 to 7A and the duration to 20min to activate the gas-absorbing heat exchanger; Step 6: Sealing and post-processing of the exhaust pipe 13 of the hemispherical resonant gyroscope head 5. Step 61: The vacuum chamber (1) is cooled to room temperature and the vacuum is broken; Step 62: Manually seal the exhaust pipe 13 of the hemispherical resonant gyroscope head 5 using a sealing pliers that matches the diameter of the exhaust pipe 13, and remove the head; Step 63: Repeat step 62, and remove the hemispherical resonant gyroscope head 5 connected to each of the air extraction pipes 3 one by one.
Claims
1. A vacuum packaging device for a hemispherical gyroscope based on gas-evolving heat sources, characterized in that, Includes a vacuum pumping line (3), a vacuum chamber (1), a programmable power supply (6), a temperature sensor (4), a vacuum gauge (8), a vacuum pump (9), a worktable (7), an exhaust channel (2), a hemispherical resonant gyroscope head (5), and an exhaust pipe (13), among which: Vacuum chamber 1 is a cylindrical cavity structure. Heating resistance wires are provided inside the side wall of the chamber to heat the interior of the chamber. There is an exhaust channel (2) above the vacuum chamber (1). The exhaust channel (2) is connected to the vacuum pump (9) to maintain the vacuum environment inside the vacuum chamber. The pumping pipe (3) is located above the workbench (7). It adopts a multi-branch design. Each branch pipe has a VCR interface installed at the pipe opening. Each branch pipe has an independent vacuum valve and can be independently connected to the helium mass spectrometer leak detection device. All branches of the pumping pipe (3) are connected to the vacuum pump (9) and vacuum gauge (8) below through the workbench (7). Temperature sensors (4) are distributed in multiple positions inside the vacuum chamber (1) to monitor the overall temperature of the chamber in real time. The programmable power supply (6) is located outside the vacuum chamber (1). It is connected to the activation circuit (16) of the hemispherical resonant gyroscope (5) to be vacuum-sealed through an external wire to activate the gas-absorbing heat source (15).
2. The apparatus according to claim 1, characterized in that, The exhaust pipes (3) are evenly arranged on the workbench (7), and the exhaust pipes (3) have at least 8 branches.
3. The apparatus according to claim 2, characterized in that, Each extraction pipeline (3) can work independently, and each pipeline has an independent vacuum valve and helium mass spectrometer leak detection device.
4. The apparatus according to claim 1, characterized in that, One end of the air extraction pipeline (3) is connected to the vacuum pump (9), and the other end is equipped with a VCR connector.
5. The apparatus according to claim 1, characterized in that, The vacuum chamber (1) has a square or cylindrical cavity structure, and the height of the chamber is not less than 1m.
6. The apparatus according to claim 1, characterized in that, An exhaust channel (2) is provided above the vacuum chamber (1) to evacuate the vacuum chamber (1).
7. The apparatus according to claim 1, characterized in that, A large number of heating resistance wires are installed on the inner wall of the vacuum chamber (1). When the coil is energized, it generates the required heat to raise the temperature inside the chamber.
8. The apparatus according to claim 1, characterized in that, The programmable power supply (6) provides a DC input with a specific duration and current intensity through programming, and the heating wire is supplied with the heat required to activate the heat exchanger (15).
9. The apparatus according to claim 1, characterized in that, The programmable power supply (6) provides DC duration and current intensity, which are set according to the type of gas-absorbing heat source (15) used, and meet the long-term high vacuum environment requirements inside the hemispherical resonant gyroscope head (5).
10. A vacuum packaging method for a hemispherical gyroscope based on gas-evolving heat sources, characterized in that, The method utilizes the vacuum encapsulation device for a hemispherical resonant gyroscope head based on gas-absorbing heat sources as described in claims 1-9, and the method includes: Step 1: High-temperature baking and vacuum treatment: Step 2: Install the hemispherical resonant gyroscope head (5) on the air extraction pipe (3); Step 3: Turn on the vacuum pump (9) and evacuate the inside of the hemispherical resonant gyroscope head (5) through the evacuation pipe (3); when the vacuum level inside the hemispherical resonant gyroscope head (5) reaches 1E-5Pa or higher, spray helium gas into the connection between the exhaust pipe (13) of the hemispherical resonant gyroscope head (5) and the port of the evacuation pipe (3) to check for leakage; if leakage occurs, disassemble the head and repeat step 2; if no leakage occurs, proceed to step 4; Step 4: Vacuum degassing of the hemispherical resonant gyroscope head (5); Step 5: Set the current intensity of the programmable power supply (6) to 7A and the duration to 20min to activate the gas-absorbing heat source; Step 6: Sealing and post-processing of the exhaust pipe (13) of the hemispherical resonant gyroscope head (5).
Citation Information
Patent Citations
Device for vacuum exhaust packaging of quartz hemispherical resonator gyroscope and exhaust packaging method
CN114754755A
Device for detecting internal vacuum degree of resonant gyroscope and vacuum exhausting and packaging method
CN115727828A