Chip normal temperature testing machine

Abstract

The application relates to the technical field of semiconductor devices, and discloses a chip normal-temperature testing machine, which comprises a rack and a normal-temperature testing module, a turret material transferring module, an appearance detection module, a defective product collecting module and a chip discharging module arranged on the rack; the normal-temperature testing module, the appearance detection module, the defective product collecting module and the chip discharging module are arranged around the turret material transferring module; the normal-temperature testing module comprises a testing turret, a first testing seat and a testing mechanism; the testing turret is connected to the rack; the number of the first testing seats is plural; the plural first testing seats are connected to the testing turret around the axis of the testing turret; the testing mechanism is connected to the rack and is arranged on one side of the testing turret; the testing mechanism is used for cooperating with the first testing seat to test the chip; the normal-temperature testing module based on the testing turret can improve the testing efficiency of the chip by expanding the number of the testing mechanisms on the circumferential side of the testing turret.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor equipment technology, and more specifically, relates to a chip room temperature testing machine. Background Technology

[0002] In chip R&D and mass production, room temperature testing is a crucial step in verifying the functional integrity, electrical performance, and basic reliability of chips to screen for early failures. Related technologies include devices used for testing the electrical performance of chips, such as the Chinese invention patent with publication number CN116353910A, entitled "Chip Testing Device, Chip Flipping Mechanism and Flipping Method Thereof." In this chip testing device, a chip flipping mechanism, a first alignment mechanism, an electrical performance testing mechanism, a second alignment mechanism, an appearance inspection mechanism, and a chip packaging mechanism are sequentially arranged around the outer periphery of the main turret structure. Chip testing is performed at the electrical performance testing mechanism. However, because the electrical performance testing mechanism is connected to the work platform based on a base, and the chip flipping mechanism, the first alignment mechanism, the second alignment mechanism, the appearance inspection mechanism, and the chip packaging mechanism occupy a certain amount of space, the number of electrical performance testing mechanisms in this type of chip testing device is difficult to expand, and the chip testing efficiency cannot be improved by increasing the number of testing mechanisms. Summary of the Invention

[0003] The main objective of this invention is to provide a chip room temperature testing machine that can improve chip testing efficiency by expanding the number of testing mechanisms.

[0004] According to a first aspect of the present invention, a chip room temperature testing machine is provided, comprising a frame and a room temperature testing module, a turret transfer module, an appearance inspection module, a defective product collection module, and a chip unloading module disposed on the frame. The turret transfer module has a pick-up station, an appearance inspection station, a defective product unloading station, and a chip unloading station. The room temperature testing module, the appearance inspection module, the defective product collection module, and the chip unloading module are arranged around the turret transfer module, and the room temperature testing module is disposed corresponding to the pick-up station, the appearance inspection module is disposed corresponding to the appearance inspection station, the defective product collection module is disposed corresponding to the defective product unloading station, and the chip unloading module is disposed corresponding to the chip unloading station. The ambient temperature testing module includes a testing turret, a first testing socket, and a testing mechanism. The testing turret is connected to the frame. There are multiple first testing sockets, which are connected to the testing turret around its axis. Some of the first testing sockets are set to correspond to the pick-up station. The testing mechanism is connected to the frame and located on one side of the testing turret. The testing mechanism is used to cooperate with the first testing socket to test the chip.

[0005] In a specific embodiment of the present invention, the testing mechanism includes a mounting frame, a second test socket, and a test circuit board. The mounting frame is fixedly connected to the frame and is located on one side of the test turret. The second test socket and the test circuit board are fixedly connected to the mounting frame, and the test circuit board is electrically connected to the second test socket. The ambient temperature testing module further includes a driving mechanism and a first elastic element. The driving mechanism is fixedly connected to the frame and located below the second test seat. The first test seat is connected to the test turret through the first elastic element. The first test seat can slide vertically. The driving mechanism is used to drive the first test seat to slide vertically upward so that the first test seat fits against the second test seat. The first elastic element is used to reset the first test seat.

[0006] In a specific embodiment of the present invention, the driving mechanism includes a first mounting base, a first motor, a cam, a sliding seat, a bearing, a second elastic element, and a pressure bar. The first mounting base is disposed below the second test seat. The first motor is fixedly connected to the first mounting base. The cam is fixedly connected to the output shaft of the first motor. The sliding seat is connected to the first mounting base and is capable of sliding vertically. The bearing is fixedly connected to the lower end of the sliding seat. The second elastic element connects the sliding seat and the first mounting base so that the bearing contacts the cam. The second elastic element is capable of elastically extending and retracting vertically. The pressure bar is fixedly connected to the top end of the sliding seat, and the axis of the pressure bar extends vertically. The first motor drives the cam to rotate, causing the sliding seat to rise, thereby causing the pressure bar to apply force to the first test seat to lift the first test seat, and the second elastic element drives the sliding seat to reset.

[0007] In a specific embodiment of the present invention, the appearance inspection station includes a first appearance inspection substation and a second appearance inspection substation. The appearance inspection module includes a chip front inspection mechanism and a chip bottom inspection mechanism. The chip front inspection mechanism and the chip bottom inspection mechanism are fixedly connected to the frame and arranged around the turret transfer module. The chip front inspection mechanism is set in the first appearance inspection substation and the chip bottom inspection mechanism is set in the second appearance inspection substation.

[0008] In a specific embodiment of the present invention, the chip front detection mechanism includes a second mounting base, a second motor, an adsorption seat, and a first camera assembly. The second mounting base is fixedly connected to the frame and has an inclined mounting plate. The mounting plate is set corresponding to the first appearance detection substation. The second motor is fixedly connected to the mounting plate and is located on the side of the mounting plate away from the turret transfer module along its thickness direction. The adsorption seat is fixedly connected to the output shaft of the second motor and is located on the side of the mounting plate close to the turret transfer module along its thickness direction. The adsorption seat has an adsorption surface. The first camera assembly is fixedly connected to the second mounting base. The chip front inspection mechanism has a material picking station and an inspection station. The material picking station corresponds to the first appearance inspection substation. The second motor is used to drive the adsorption seat to rotate so that the adsorption surface moves between the material picking station and the inspection station. The first camera component is set towards the inspection station. When the adsorption surface is located at the material picking station, the adsorption surface is set horizontally upward.

[0009] In a specific embodiment of the present invention, the appearance inspection station further includes a posture adjustment station and a third appearance inspection substation, wherein the first appearance inspection substation, the second appearance inspection substation, the posture adjustment station and the third appearance inspection substation are arranged circumferentially along the turret material transfer module. The appearance inspection module also includes a chip posture adjustment mechanism and a chip side inspection mechanism. The chip posture adjustment mechanism and the chip side inspection mechanism are fixedly connected to the frame. The chip posture adjustment mechanism is set to the posture adjustment station, and the chip side inspection mechanism is set to the third appearance inspection substation. The chip side inspection mechanism has a placement position. The chip posture adjustment mechanism is used to adjust the posture of the chip so that the posture of the chip is adapted to the placement position.

[0010] In a specific embodiment of the present invention, the defective product collection module includes a defective product temporary storage mechanism, a defective product transfer mechanism, and a defective product collection mechanism. The defective product temporary storage mechanism, the defective product transfer mechanism, and the defective product collection mechanism are fixedly connected to the frame. The defective product temporary storage mechanism is set corresponding to the defective product unloading station. The defective product transfer mechanism is located on one side of the defective product temporary storage mechanism, and the defective product collection mechanism is located on one side of the defective product transfer mechanism. The defective product temporary storage mechanism is used to temporarily store defective chips, the defective product collection mechanism is used to collect defective chips, and the defective product transfer mechanism is used to transfer defective chips from the defective product temporary storage mechanism to the defective product collection mechanism.

[0011] In a specific embodiment of the present invention, the defective product temporary storage mechanism includes a third mounting base, a third motor, and a turntable. The third mounting base is fixedly connected to the frame, the third motor is fixedly connected to the third mounting base, and the turntable is fixedly connected to the output shaft of the third motor. The axis of the turntable extends vertically, and the turntable is set corresponding to the defective product temporary storage station. The top surface of the turntable is provided with a plurality of temporary storage slots for holding chips. The plurality of temporary storage slots are arranged circumferentially around the axis of the turntable.

[0012] In a specific embodiment of the present invention, the defective product transfer mechanism includes a fourth mounting base, a lifting assembly, a fourth motor, a swing arm, and an adsorption assembly. The fourth mounting base is fixedly connected to the frame and is located on one side of the third mounting base. The lifting assembly is fixedly connected to the fourth mounting base, and the fourth motor is fixedly connected to the lifting assembly. The lifting assembly is used to drive the fourth motor to lift and lower. One end of the swing arm along its length is fixedly connected to the output shaft of the fourth motor, and the other end is fixedly connected to the adsorption assembly. The fourth motor is used to drive the swing arm to rotate, and the adsorption assembly is used to adsorb chips.

[0013] In a specific embodiment of the present invention, the defective product collection mechanism includes a cross slide and a support plate. The cross slide is fixedly connected to the frame and is located on one side of the fourth mounting base. The support plate is fixedly connected to the cross slide, and the top surface of the support plate is provided with a plurality of support grooves for supporting chips.

[0014] One of the above-described technical solutions of the present invention has at least one of the following advantages or beneficial effects: The present invention relates to a room temperature chip testing machine. The chip undergoes room temperature testing in a room temperature testing module. After testing, the chip is picked up by a turret transfer module at a pick-up station and transferred to a chip unloading module. During this transfer, an appearance inspection module performs appearance inspection on the chip at the appearance inspection station. If the appearance inspection is qualified, the turret transfer module transfers the chip to the chip unloading module at the chip unloading station. If the appearance inspection is unqualified, the turret transfer module transfers the chip to a defective product collection module at a defective product disposal station, thereby completing the chip testing. The room temperature testing module includes a testing turret, a first testing socket, and a testing mechanism. Multiple first testing sockets are connected to the testing turret, some of which correspond to the pick-up station. The first testing sockets are used to hold the chip, and the chip testing is completed by the testing mechanism in cooperation with the first testing sockets. This room temperature testing module based on a testing turret can improve chip testing efficiency by expanding the number of testing mechanisms around the testing turret. Attached Figure Description

[0015] The present invention will be further described below with reference to the accompanying drawings and embodiments; Figure 1 This is a perspective view of the chip room temperature testing machine according to an embodiment of the present invention; Figure 2 This is a perspective view of the chip room temperature testing machine according to an embodiment of the present invention from another angle; Figure 3 This is an embodiment of the present invention. Figure 2 Enlarged diagram of A in the middle; Figure 4 This is a structural diagram of the room temperature testing module according to an embodiment of the present invention; Figure 5 This is a structural diagram showing the cooperation between the testing mechanism and the driving mechanism in an embodiment of the present invention; Figure 6 This is a structural diagram of the driving mechanism according to an embodiment of the present invention; Figure 7 This is an embodiment of the present invention. Figure 4 Enlarged diagram of B in the diagram; Figure 8 This is a structural diagram of the chip front detection mechanism according to an embodiment of the present invention; Figure 9 This is a structural diagram of the chip attitude adjustment mechanism according to an embodiment of the present invention; Figure 10 This is a structural diagram of the defective product temporary storage mechanism according to an embodiment of the present invention; Figure 11 This is a structural diagram of the defective product transfer mechanism according to an embodiment of the present invention; Figure 12 This is a structural diagram of the defective product collection mechanism according to an embodiment of the present invention.

[0016] In the diagram, 1. Frame; 2. Room temperature testing module; 21. Testing turret; 22. First testing seat; 23. Testing mechanism; 231. Mounting bracket; 232. Second testing seat; 233. Testing circuit board; 24. Drive mechanism; 241. First mounting seat; 242. First motor; 243. Cam; 244. Sliding seat; 245. Bearing; 246. Second elastic element; 247. Pressure bar; 25. First elastic element; 3. Turret material transfer module; 4. Appearance inspection module; 41. Chip front inspection mechanism; 411. Second mounting seat; 4111. Mounting plate; 412. Second motor; 413. Adsorption seat; 414. First camera assembly; 42. Chip bottom inspection mechanism; 43. Chip. 431. Attitude adjustment mechanism; 432. XY axis moving module; 433. Rotation module; 434. Adsorption component; 45. Chip side inspection mechanism; 6. Defective product collection module; 51. Defective product temporary storage mechanism; 512. Third mounting base; 513. Third motor; 514. Turntable; 51301. Temporary storage slot; 52. Defective product transfer mechanism; 525. Fourth mounting base; 526. Lifting assembly; 527. Fourth motor; 528. Swing arm; 529. Adsorption assembly; 5301. Defective product collection mechanism; 531. Cross slide; 532. Carrier plate; 53201. Carrier slot; 6. Chip unloading module; 61. Blue film unloading mechanism; 62. Basket lifting platform mechanism; 63. Wafer disk gripper mechanism. Detailed Implementation

[0017] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present invention, and should not be construed as limiting the present invention. Reference Figures 1 to 12As shown, a preferred embodiment of this application discloses a chip room temperature testing machine, including a frame 1 and a room temperature testing module 2, a turret transfer module 3, an appearance inspection module 4, a defective product collection module 5, and a chip unloading module 6 disposed on the frame 1. The turret transfer module 3 has a pick-up station, an appearance inspection station, a defective product unloading station, and a chip unloading station. The room temperature testing module 2, the appearance inspection module 4, the defective product collection module 5, and the chip unloading module 6 are arranged around the turret transfer module 3, with the room temperature testing module 2 corresponding to the pick-up station, the appearance inspection module 4 corresponding to the appearance inspection station, and the defective product collection module 5... The chip unloading module 6 is set up in accordance with the chip unloading station for the defective product unloading station. The room temperature test module 2 includes a test turret 21, a first test socket 22 and a test mechanism 23. The test turret 21 is connected to the frame 1. There are multiple first test sockets 22, which are connected to the test turret 21 around its axis. Some of the first test sockets 22 are set up in accordance with the pick-up station. The test mechanism 23 is connected to the frame 1 and is located on one side of the test turret 21. The test mechanism 23 is used to cooperate with the first test socket 22 to test the chip.

[0018] The chip room temperature testing machine of the present invention performs room temperature testing on the chip in the room temperature testing module 2. After the chip test is completed, the turret transfer module 3 picks up the chip at the pick-up station and transfers it to the chip unloading module 6. During the transfer process, the appearance inspection module 4 performs appearance inspection on the chip located at the appearance inspection station. If the appearance inspection is qualified, the turret transfer module 3 transfers the chip to the chip unloading module 6 at the chip unloading station. If the appearance inspection is unqualified, the turret transfer module 3 transfers the chip to the defective product receiving station. The assembly module 5 is used to complete the chip testing. The room temperature testing module 2 includes a test turret 21, a first test socket 22, and a testing mechanism 23. Multiple first test sockets 22 are connected to the test turret 21. Some of the first test sockets 22 correspond to the pick-up station. The first test sockets 22 are used to carry the chip. The chip testing is completed by the testing mechanism 23 in cooperation with the first test sockets 22. This room temperature testing module 2 based on the test turret 21 can improve the chip testing efficiency by expanding the number of testing mechanisms 23 around the test turret 21.

[0019] It should be noted that the chip to be tested is transferred to the first test socket 22 by the chip feeding mechanism. For example, the chip feeding mechanism includes a driving component and a suction nozzle. The driving component drives the suction nozzle to move, and the suction nozzle is used to pick up the chip. The driving component and the suction nozzle cooperate to transfer the chip to be tested to the first test socket 22.

[0020] In this embodiment, refer to Figures 4 to 5As shown, the testing mechanism 23 includes a mounting frame 231, a second test base 232, and a test circuit board 233. The mounting frame 231 is fixedly connected to the frame 1 and is located on one side of the test turret 21. The second test base 232 and the test circuit board 233 are fixedly connected to the mounting frame 231, and the test circuit board 233 is electrically connected to the second test base 232. The room temperature testing module 2 also includes a driving mechanism 24 and a first elastic element 25. The driving mechanism 24 is fixedly connected to the frame 1 and is located below the second test base 232. The first test socket 22 is connected to the test turret 21 via a first elastic element 25, allowing it to slide vertically. That is, the first test socket 22 is slidably connected to the test turret 21. Simultaneously, the first elastic element 25 connects the test turret 21 and the first test socket 22. The first elastic element 25 is a spring. The drive mechanism 24 drives the first test socket 22 to slide vertically upwards, causing it to engage with the second test socket 232. The first elastic element 25 is used to reset the first test socket 22. In practical applications, after the chip to be tested is placed on the first test socket 22, the test... Under the action of the turret 21, the first test socket 22 carrying the chip moves between the drive mechanism 24 and the second test socket 232. Then, the drive mechanism 24 drives the first test socket 22 upwards until it is in contact with the second test socket 232. At this point, the chip is electrically connected to the test circuit board 233, thus completing the chip test. After the chip test is completed, the drive mechanism 24 resets. At this time, the first test socket 22 resets under the action of the first elastic element 25. The test turret 21 rotates to move the first test socket 22 carrying the next chip to be tested between the drive mechanism 24 and the second test socket 232. Between the two test sockets 232, the above process is repeated to complete the chip test. The first test socket 22, which carries the tested chip, moves to the position corresponding to the pick-up station under the action of the test turret 21. The turret transfer module 3 picks up the tested chip at the pick-up station. Specifically, the advantage of this test mechanism 23 structure is that the second test socket 232 does not need to move during the chip test, the test circuit board 233 is stably set, and the electrical test cables on the test circuit board 233 are not easy to loosen, which can ensure the test accuracy in long-term test work.

[0021] It should be noted that the top surface of the first test holder 22 has a bearing plane, and the first test holder 22 has an adsorption channel that extends to the bearing plane. The adsorption channel is connected to the vacuum equipment through an air pipe. The chip is adsorbed onto the bearing plane through the vacuum equipment, the air pipe, and the adsorption channel, so that the chip can be stably placed on the first test holder 22. When the turret transfer module 3 picks up the chip, the vacuum equipment stops working to ensure the normal operation of the chip transfer.

[0022] In this embodiment, refer to Figures 5 to 6As shown, the drive mechanism 24 includes a first mounting base 241, a first motor 242, a cam 243, a sliding seat 244, a bearing 245, a second elastic element 246, and a pressure bar 247. The first mounting base 241 is located below the second test seat 232. The first motor 242 is fixedly connected to the first mounting base 241. The cam 243 is fixedly connected to the output shaft of the first motor 242. The sliding seat 244 is connected to the first mounting base 241 and can slide vertically. The bearing 245 is fixedly connected to the lower end of the sliding seat 244. The second elastic element 246 connects the sliding seat 244 and the first mounting base 241 so that the bearing 245 contacts the cam 243. The second elastic element 246 can elastically extend and retract vertically. The pressure bar 247 is fixedly connected to the top of the sliding seat 244, and the axis of the pressure bar 247 extends vertically. The first... Motor 242 drives cam 243 to rotate, causing slide 244 to rise, thereby applying force to pressure bar 247 on first test seat 22 to lift it. Second elastic element 246 is used to drive slide 244 to reset. Specifically, after first test seat 22 is lifted by pressure bar 247, both first elastic element 25 and second elastic element 246 are in a stretched state. After chip testing is completed, motor 242 drives cam 243 to rotate and reset. At this time, first elastic element 25 and second elastic element 246 recover their elasticity. First elastic element 25 drives first test seat 22 to reset, and second elastic element 246 drives slide 244 to reset. This type of drive mechanism 24 is simple in structure, easy to install, and can lift first test seat 22 to ensure smooth chip testing.

[0023] It should be noted that when expanding the number of test mechanisms 23 in the chip room temperature tester of this application, the number of drive mechanisms 24 also needs to be expanded. The test mechanisms 23 and drive mechanisms 24 are set one-to-one to ensure the smooth progress of chip testing.

[0024] In this embodiment, the appearance inspection station includes a first appearance inspection substation and a second appearance inspection substation; the appearance inspection module 4 includes a chip front inspection mechanism 41 and a chip bottom inspection mechanism 42. The chip front inspection mechanism 41 and the chip bottom inspection mechanism 42 are fixedly connected to the frame 1 and are arranged around the turret transfer module 3. The chip front inspection mechanism 41 is set corresponding to the first appearance inspection substation and inspects the front of the chip at the first appearance inspection substation. The chip bottom inspection mechanism 42 is set corresponding to the second appearance inspection substation and inspects the bottom of the chip at the second appearance inspection substation. The advantage of this appearance inspection module 4 is that it can inspect both the front and bottom of the chip. The chip tested by the room temperature chip testing machine of this application has reliable performance.

[0025] In this embodiment, refer to Figure 8 As shown, the chip front detection mechanism 41 includes a second mounting base 411, a second motor 412, an adsorption seat 413, and a first camera assembly 414. The second mounting base 411 is fixedly connected to the frame 1 and has an inclined mounting plate 4111. The mounting plate 4111 is set corresponding to the first appearance detection substation. The second motor 412 is fixedly connected to the mounting plate 4111 and is located on the side of the mounting plate 4111 away from the turret transfer module 3 along its thickness direction. The adsorption seat 413 is fixedly connected to the second motor 412. The second mounting plate 411 is located on the output shaft of the machine 412, and the adsorption seat 413 is located on the side of the mounting plate 4111 along its thickness direction near the turret transfer module 3. The adsorption seat 413 has an adsorption surface. The first camera assembly 414 is fixedly connected to the second mounting plate 411. The chip front detection mechanism 41 has a picking station and a detection station. The picking station corresponds to the first appearance detection substation. The second motor 412 is used to drive the adsorption seat 413 to rotate so that the adsorption surface moves between the picking station and the detection station. The first camera assembly 414 is set towards the detection station. When the adsorption surface is located at the material handling station, it is horizontally facing upwards. In practical applications, initially, the adsorption surface is at the material handling station. When the chip undergoes appearance inspection, the turret transfer module 3 lowers the chip onto the adsorption surface at the first appearance inspection sub-station. Then, the second motor 412 drives the adsorption seat 413 to rotate, causing the adsorption surface to rotate to the inspection station. Subsequently, the first camera component 414 captures an image of the chip on the adsorption surface to obtain a frontal image of the chip. Based on this frontal image, the appearance quality of the chip's front side is inspected. After the inspection is completed, the second motor 412 drives the adsorption seat 413 to rotate to the picking station. The turret transfer module 3 picks up the chip located on the adsorption surface and transfers the chip to the second appearance inspection substation. The chip bottom surface inspection mechanism 42 inspects the appearance quality of the chip bottom surface. Specifically, this chip front inspection mechanism 41, based on the mounting plate 4111 and the adsorption seat 413, can effectively receive the chip lowered by the turret transfer module 3. The structure is simple and reliable, which is conducive to the smooth progress of chip front appearance quality inspection.

[0026] The chip bottom surface inspection mechanism 42 includes a second camera component, which is set to correspond to the second appearance inspection substation. The camera end of the second camera component is set upwards, so that the second camera component can directly photograph the bottom surface of the chip located at the second appearance inspection substation on the turret transfer module 3 to obtain the bottom surface image of the chip. Based on the bottom surface image, the appearance quality of the chip bottom surface is inspected. This chip bottom surface inspection mechanism 42 has a simple and reliable structure, which facilitates the inspection of the appearance quality of the chip bottom surface.

[0027] Furthermore, the appearance inspection station also includes a posture adjustment station and a third appearance inspection substation. The first appearance inspection substation, the second appearance inspection substation, the posture adjustment station, and the third appearance inspection substation are arranged circumferentially along the turret transfer module 3. The appearance inspection module 4 also includes a chip posture adjustment mechanism 43 and a chip side inspection mechanism 44. The chip posture adjustment mechanism 43 and the chip side inspection mechanism 44 are fixedly connected to the frame 1. The chip posture adjustment mechanism 43 is set corresponding to the posture adjustment station, and the chip side inspection mechanism 44 is set corresponding to the third appearance inspection substation. The measuring mechanism 44 has a placement position, and the chip posture adjustment mechanism 43 is used to adjust the chip posture so that the chip posture matches the placement position. In practical applications, since the chip needs to be placed on the chip front-side inspection mechanism 41 when performing front-side appearance quality inspection, and will be picked up again by the turret transfer module 3 after inspection, if the chip posture is offset, it will be detrimental to the chip side inspection mechanism 44 in inspecting the appearance quality of the chip side. Therefore, if the chip posture deviates from the preset posture before performing side appearance quality inspection, the chip posture adjustment mechanism 43 will adjust the posture. The entire mechanism 43 adjusts the chip's posture. Specifically, the chip room-temperature testing machine determines whether the chip's posture deviates from the preset posture based on the chip's bottom image. If the chip's posture does not deviate from the preset posture, the turret transfer module 3 lowers the chip to the placement position at the third appearance inspection substation. The chip side inspection mechanism 44 then inspects the appearance quality of the chip's side. After inspection, the turret transfer module 3 picks up the chip from the placement position. Subsequently, chips with acceptable appearance quality are transferred to the chip unloading station and then to the chip unloading module 6. For the outer... If a chip fails the quality inspection, it is transferred to the defective product unloading station and then to the defective product collection module 5. If the chip's orientation deviates from the preset orientation, before performing the aforementioned side appearance quality inspection, the turret transfer module 3 first places the chip at the orientation adjustment station to the chip orientation adjustment mechanism 43. The chip orientation adjustment mechanism 43 adjusts the chip's orientation to the preset orientation so that the chip's orientation is adapted to the placement position. After the chip orientation adjustment is completed, the turret transfer module 3 picks up the chip from the chip orientation adjustment mechanism 43 and then performs the aforementioned side appearance inspection process.

[0028] It should be noted that if the appearance quality of the front of the chip is unqualified, then the bottom and side appearance quality inspection processes will not be performed, and the turret transfer module 3 will directly transfer the chip to the defective product collection module 5. Similarly, if the appearance quality of the bottom of the chip is unqualified, then the side appearance quality inspection process will not be performed, and the turret transfer module 3 will directly transfer the chip to the defective product collection module 5.

[0029] In this embodiment, refer to Figure 9As shown, the chip attitude adjustment mechanism 43 includes an XY axis moving module 431, a rotating module 432, and an adsorption component 433. The rotating module 432 is fixedly connected to the XY axis moving module 431, and the power output end of the rotating module 432 is fixedly connected to the adsorption component 433. The adsorption component 433 is used to adsorb the chip. The XY axis moving module 431 and the rotating module 432 are used to adjust the attitude of the chip.

[0030] The chip side inspection mechanism 44 includes a frame, a reflective prism, and a third camera assembly. There are four reflective prisms. The frame has the aforementioned placement positions. The four reflective prisms are arranged on the frame and around the placement positions. The four prisms face the four sides of the chip. The reflective prisms are used to reflect images of the chip sides and transmit the images to the third camera assembly. The third camera assembly is used to capture images of the chip sides and to inspect the appearance quality of the chip sides based on these images.

[0031] In this embodiment, refer to Figure 3 As shown, the defective product collection module 5 includes a defective product temporary storage mechanism 51, a defective product transfer mechanism 52, and a defective product collection mechanism 53. These three mechanisms are fixedly connected to the frame 1. The defective product temporary storage mechanism 51 is positioned corresponding to the defective product unloading station. The defective product transfer mechanism 52 is located on one side of the defective product temporary storage mechanism 51, and the defective product collection mechanism 53 is located on one side of the defective product transfer mechanism 52. The defective product temporary storage mechanism 51 is used to temporarily store defective chips. The defective product collection mechanism 53... 3 is used to collect defective chips. The defective product transfer mechanism 52 is used to transfer the defective chips on the defective product temporary storage mechanism 51 to the defective product collection mechanism 53. This type of defective product collection module 5 is only set up with the defective product temporary storage mechanism 51 corresponding to the defective product unloading station, which reduces the space occupied by the defective product collection module 5 on the turret transfer module 3 and avoids squeezing the working space of the appearance inspection module 4 and the chip unloading module 6. At the same time, the layout of the defective product collection module 5 has a certain degree of flexibility to make full use of the space on the rack 1.

[0032] In this embodiment, refer to Figure 10As shown, the defective product temporary storage mechanism 51 includes a third mounting base 511, a third motor 512, and a turntable 513. The third mounting base 511 is fixedly connected to the frame 1, the third motor 512 is fixedly connected to the third mounting base 511, and the turntable 513 is fixedly connected to the output shaft of the third motor 512. The axis of the turntable 513 extends vertically and is set to correspond to the defective product temporary storage station. The top surface of the turntable 513 is provided with multiple temporary storage slots 51301 for holding chips. The multiple temporary storage slots 51301 are circumferentially arranged around the axis of the turntable 513. Specifically, in terms of arrangement, one temporary storage slot 51301 of the turntable 513 carries one chip. The third motor 512 drives the turntable 513 to rotate so that the temporary storage slot 51301 without a chip is rotated to the receiving position, and the temporary storage slot 51301 carrying a chip is rotated to the feeding position. The temporary storage slot 51301 receives the chip placed down by the turret transfer module 3 at the receiving position, and the temporary storage slot 51301 is used by the defective product transfer mechanism 52 to pick up the chip at the feeding position. This defective product temporary storage mechanism 51 has a simple structure and has sufficient temporary storage space for chip storage.

[0033] In this embodiment, refer to Figure 11 As shown, the defective product transfer mechanism 52 includes a fourth mounting base 521, a lifting assembly 522, a fourth motor 523, a swing arm 524, and an adsorption assembly 525. The fourth mounting base 521 is fixedly connected to the frame 1 and is located on one side of the third mounting base 511. The lifting assembly 522 is fixedly connected to the fourth mounting base 521, and the fourth motor 523 is fixedly connected to the lifting assembly 522. The lifting assembly 522 is used to drive the fourth motor 523 to lift. One end of the swing arm 524 is fixedly connected to the output shaft of the fourth motor 523 along its length, and the other end is fixedly connected to the adsorption assembly 525. The fourth motor 523 is used to drive the swing arm 524 to rotate, and the adsorption assembly 525 is used to adsorb chips. Specifically, when it is necessary to transfer chips from the defective product temporary storage mechanism 51 to the defective product collection mechanism 53, the fourth motor 523 will drive the chips to be transferred. 23 drives the swing arm 524 to rotate so that the adsorption component 525 moves above the above-mentioned feeding position. Then, the lifting component 522 drives the fourth motor 523 to descend so that the adsorption component 525 contacts the chip to adsorb the chip. After that, the lifting component 522 drives the fourth motor 523 to rise. The fourth motor 523 drives the swing arm 524 to rotate so that the adsorption component 525 moves above the defective product collection mechanism 53. Finally, the lifting component 522 drives the fourth motor 523 to descend so that the adsorption component 525 can place the chip on the defective product collection mechanism 53. This defective product transfer mechanism 52 has a simple structure and can smoothly transfer defective chips. The lifting component 522 can be a vertically extending linear module, and the adsorption component 525 has a core structure with a suction nozzle. The suction nozzle adsorbs the chip by means of negative pressure.

[0034] In this embodiment, refer to Figure 12 As shown, the defective product collection mechanism 53 includes a cross slide 531 and a support plate 532. The cross slide 531 is fixedly connected to the frame 1 and is located on one side of the fourth mounting base 521. The support plate 532 is fixedly connected to the cross slide 531. The top surface of the support plate 532 is provided with multiple support grooves 53201. The support grooves 53201 are used to support chips. In practical applications, the cross slide 531 is used to adjust the position of the support plate 532 so that the support grooves 53201 that do not support chips correspond to the unloading position of the adsorption component 525, thereby ensuring the smooth progress of the defective chip collection work. This defective product collection mechanism 53 has a simple structure and a large capacity.

[0035] In this embodiment, the turret transfer module 3 includes a fixed frame, a transfer turret, an adsorption device, a pressing component, and a driving device. The driving device is fixedly connected to the fixed frame, and its power output end is connected to the transfer turret. The driving device is used to drive the transfer turret to rotate around its axis so that the transfer turret can transfer the chip. The adsorption device is connected to the transfer turret, and there are multiple adsorption devices arranged at intervals around the axial direction of the transfer turret. The pressing component is connected to the fixed frame, and the pick-up station, the first appearance inspection substation, the second appearance inspection substation, and the attitude adjustment... Each of the finishing station, the third appearance inspection substation, the defective product unloading station, and the chip unloading station is equipped with a pressing component. The function of the pressing component is to drive the adsorption device to descend so that the adsorption device can adsorb or release the chip. After the adsorption device descends, it can be reset to ensure the smooth transfer of the chip. The turret transfer module 3 is prior art, and this application will not elaborate on it. For example, the pressing component drives the adsorption device located at the picking station to descend so that the adsorption device picks up the chip at the room temperature testing module 2. After picking up the chip, the pressing component and the adsorption device are reset.

[0036] And reference Figures 1 to 2As shown, the chip unloading module 6 includes a blue film unloading mechanism 61, a wafer disk lifting basket device, a lifting basket lifting platform mechanism 62, and a wafer disk gripper mechanism 63, etc., which are existing technologies and will not be described in detail here. The blue film unloading mechanism 61 includes an XYZ axis moving module, a blue film holder, a rotating module, etc., wherein the blue film holder is connected to the rotating module, the rotating module is connected to the XYZ axis moving module, and the wafer blue film disk is placed on the blue film holder. The XYZ axis moving module, the rotating module, etc. The moving module is used to drive the blue film holder to move and adjust the position of the blue film holder. The turret transfer module 3 mentioned above places the chip into the wafer blue film tray on the blue film holder at the chip unloading station. The wafer tray lifting device is used to store the wafer blue film tray with the chip attached. The tray lifting platform mechanism 62 is used to drive the wafer tray lifting device to move in the vertical direction. The wafer tray gripper mechanism 63 is used to grip or release the wafer blue film tray to realize the transfer of the wafer blue film tray between the blue film holder and the wafer tray lifting device. Although embodiments of the invention have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the claims and their equivalents.

Claims

1. A chip room temperature testing machine, characterized in that, The system includes a frame (1) and a room temperature testing module (2), a turret transfer module (3), an appearance inspection module (4), a defective product collection module (5), and a chip unloading module (6) mounted on the frame (1). The turret transfer module (3) has a picking station, an appearance inspection station, a defective product unloading station, and a chip unloading station. The room temperature testing module (2), the appearance inspection module (4), the defective product collection module (5), and the chip unloading module (6) are arranged around the turret transfer module (3). The room temperature testing module (2) is set to correspond to the picking station, the appearance inspection module (4) is set to correspond to the appearance inspection station, the defective product collection module (5) is set to correspond to the defective product unloading station, and the chip unloading module (6) is set to correspond to the chip unloading station. The ambient temperature test module (2) includes a test turret (21), a first test socket (22), and a test mechanism (23). The test turret (21) is connected to the frame (1). There are multiple first test sockets (22). Multiple first test sockets (22) are connected to the test turret (21) around the axis of the test turret (21). Some of the first test sockets (22) are set corresponding to the picking station. The test mechanism (23) is connected to the frame (1) and is located on one side of the test turret (21). The test mechanism (23) is used to cooperate with the first test socket (22) to test the chip. The testing mechanism (23) includes a mounting frame (231), a second test base (232), and a test circuit board (233). The mounting frame (231) is fixedly connected to the frame (1) and is located on one side of the test turret (21). The second test base (232) and the test circuit board (233) are fixedly connected to the mounting frame (231), and the test circuit board (233) is electrically connected to the second test base (232). The ambient temperature test module (2) further includes a drive mechanism (24) and a first elastic element (25). The drive mechanism (24) is fixedly connected to the frame (1) and is located below the second test seat (232). The first test seat (22) is connected to the test turret (21) through the first elastic element (25). The first test seat (22) can slide vertically. The drive mechanism (24) is used to drive the first test seat (22) to slide vertically upward so that the first test seat (22) fits against the second test seat (232). The first elastic element (25) is used to reset the first test seat (22). The drive mechanism (24) includes a first mounting base (241), a first motor (242), a cam (243), a sliding seat (244), a bearing (245), a second elastic element (246), and a pressure bar (247). The first mounting base (241) is located below the second test seat (232). The first motor (242) is fixedly connected to the first mounting base (241). The cam (243) is fixedly connected to the output shaft of the first motor (242). The sliding seat (244) is connected to the first mounting base (241) and can slide vertically. The bearing (245) is fixedly connected to the lower end of the sliding seat (244). The second elastic element (246) connects the sliding seat (244) and the first mounting seat (241) so that the bearing (245) contacts the cam (243). The second elastic element (246) can elastically extend and retract vertically. The pressure bar (247) is fixedly connected to the top of the sliding seat (244), and the axis of the pressure bar (247) extends vertically. The first motor (242) is used to drive the cam (243) to rotate so that the sliding seat (244) rises, thereby causing the pressure bar (247) to exert force on the first test seat (22) to lift the first test seat (22). The second elastic element (246) is used to drive the sliding seat (244) to reset.

2. The chip room temperature testing machine according to claim 1, characterized in that, The appearance inspection station includes a first appearance inspection substation and a second appearance inspection substation; The appearance inspection module (4) includes a chip front inspection mechanism (41) and a chip bottom inspection mechanism (42). The chip front inspection mechanism (41) and the chip bottom inspection mechanism (42) are fixedly connected to the frame (1) and arranged around the turret transfer module (3). The chip front inspection mechanism (41) is set in the first appearance inspection substation and the chip bottom inspection mechanism (42) is set in the second appearance inspection substation.

3. The chip room temperature testing machine according to claim 2, characterized in that, The chip front detection mechanism (41) includes a second mounting base (411), a second motor (412), an adsorption seat (413), and a first camera assembly (414). The second mounting base (411) is fixedly connected to the frame (1). The second mounting base (411) has an inclined mounting plate (4111). The mounting plate (4111) is set corresponding to the first appearance detection substation. The second motor (412) is fixedly connected to the mounting plate (4111). The second motor (412) is located on the side of the mounting plate (4111) away from the turret transfer module (3) along its thickness direction. The adsorption seat (413) is fixedly connected to the output shaft of the second motor (412). The adsorption seat (413) is located on the side of the mounting plate (4111) close to the turret transfer module (3) along its thickness direction. The adsorption seat (413) has an adsorption surface. The first camera assembly (414) is fixedly connected to the second mounting base (411). The chip front detection mechanism (41) has a material picking station and a detection station. The material picking station corresponds to the first appearance detection substation. The second motor (412) is used to drive the adsorption seat (413) to rotate so that the adsorption surface moves between the material picking station and the detection station. The first camera component (414) is set towards the detection station. When the adsorption surface is located at the material picking station, the adsorption surface is set horizontally upward.

4. The chip room temperature testing machine according to claim 2, characterized in that, The appearance inspection station also includes a posture adjustment station and a third appearance inspection substation. The first appearance inspection substation, the second appearance inspection substation, the posture adjustment station and the third appearance inspection substation are arranged around the turret material transfer module (3). The appearance inspection module (4) further includes a chip posture adjustment mechanism (43) and a chip side inspection mechanism (44). The chip posture adjustment mechanism (43) and the chip side inspection mechanism (44) are fixedly connected to the frame (1). The chip posture adjustment mechanism (43) is set in the posture adjustment station, and the chip side inspection mechanism (44) is set in the third appearance inspection substation. The chip side inspection mechanism (44) has a placement position. The chip posture adjustment mechanism (43) is used to adjust the posture of the chip so that the posture of the chip is adapted to the placement position.

5. The chip room temperature testing machine according to claim 1, characterized in that, The defective product collection module (5) includes a defective product temporary storage mechanism (51), a defective product transfer mechanism (52), and a defective product collection mechanism (53). The defective product temporary storage mechanism (51), the defective product transfer mechanism (52), and the defective product collection mechanism (53) are fixedly connected to the frame (1). The defective product temporary storage mechanism (51) is set corresponding to the defective product unloading station. The defective product transfer mechanism (52) is located on one side of the defective product temporary storage mechanism (51), and the defective product collection mechanism (53) is located on one side of the defective product transfer mechanism (52). The defective product temporary storage mechanism (51) is used to temporarily store unqualified chips. The defective product collection mechanism (53) is used to collect unqualified chips. The defective product transfer mechanism (52) is used to transfer unqualified chips from the defective product temporary storage mechanism (51) to the defective product collection mechanism (53).

6. The chip room temperature testing machine according to claim 5, characterized in that, The defective product temporary storage mechanism (51) includes a third mounting base (511), a third motor (512), and a turntable (513). The third mounting base (511) is fixedly connected to the frame (1), the third motor (512) is fixedly connected to the third mounting base (511), and the turntable (513) is fixedly connected to the output shaft of the third motor (512). The axis of the turntable (513) extends vertically. The turntable (513) is set in accordance with the defective product unloading station. The top surface of the turntable (513) is provided with a plurality of temporary storage slots (51301). The temporary storage slots (51301) are used to carry chips. The plurality of temporary storage slots (51301) are arranged circumferentially around the axis of the turntable (513).

7. The chip room temperature testing machine according to claim 6, characterized in that, The defective product transfer mechanism (52) includes a fourth mounting base (521), a lifting assembly (522), a fourth motor (523), a swing arm (524), and an adsorption assembly (525). The fourth mounting base (521) is fixedly connected to the frame (1) and is located on one side of the third mounting base (511). The lifting assembly (522) is fixedly connected to the fourth mounting base (521). The fourth motor (523) is fixedly connected to the lifting assembly (522). The lifting assembly (522) is used to drive the fourth motor (523) to lift. One end of the swing arm (524) along its length is fixedly connected to the output shaft of the fourth motor (523), and the other end is fixedly connected to the adsorption assembly (525). The fourth motor (523) is used to drive the swing arm (524) to rotate. The adsorption assembly (525) is used to adsorb chips.

8. The chip room temperature testing machine according to claim 7, characterized in that, The defective product collection mechanism (53) includes a cross slide (531) and a support plate (532). The cross slide (531) is fixedly connected to the frame (1) and is located on one side of the fourth mounting base (521). The support plate (532) is fixedly connected to the cross slide (531). The top surface of the support plate (532) is provided with a plurality of support grooves (53201), which are used to support chips.

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