Photocuring forming ceramic glue discharging and sintering integrated preparation method and ceramic workpiece

Abstract

The invention belongs to the field of inorganic nonmetal ceramic preparation, and discloses a photo-curing formed ceramic glue discharging and sintering integrated preparation method and a ceramic workpiece, the preparation method comprises the following steps: preparing ceramic slurry: mixing ceramic powder, a sintering aid and an additive into uniform ceramic slurry; the ceramic slurry is subjected to photocuring forming according to a preset component model, and a ceramic biscuit is obtained; putting the ceramic biscuit into a heating furnace, and sequentially carrying out a glue discharging process and a sintering process to obtain a ceramic part by controlling the on-off of protective gas and a temperature curve, so as to complete the glue discharging and sintering integrated preparation of the photocuring formed ceramic workpiece. According to the invention, a glue discharging and sintering integrated technology is adopted to prepare the photocuring formed complex-structure ceramic; the glue discharging process and the sintering process are carried out in the same furnace, the intrinsic complex structure and the same placement position of a biscuit are always kept in the high-temperature post-treatment process and cannot be changed, connection of different procedures without waiting is achieved, and the overall production efficiency is remarkably improved.

Description

Technical Field

[0001] This invention belongs to the technical field of inorganic non-metallic ceramic preparation, and more specifically, relates to a method for integrated preparation of photocurable ceramics by debinding and sintering, and a ceramic workpiece. Background Technology

[0002] Advanced ceramics, with their highly controllable chemical composition, precise manufacturing processes, and advanced technologies, endow ceramic materials with excellent mechanical, thermal, and electrical properties, enabling their widespread application in aerospace, automotive, and electronic communications industries. In critical structural components in the aerospace and automotive sectors, ceramics such as alumina, silicon oxide, silicon nitride, silicon carbide, and boron carbide demonstrate irreplaceable value due to their superior mechanical properties (such as high strength, high hardness, and wear resistance), earning them the title of "the skeleton of modern industry." For example, ceramic turbine blades for aero-engines can withstand hundreds of tons of centrifugal force at full power, potentially replacing traditional metal materials and improving engine efficiency and thrust-to-weight ratio. In the field of electronic communications, multilayer ceramic capacitors and gallium nitride ceramic substrates are core components of electronic devices, directly determining the performance of chips, sensors, and communication equipment. Furthermore, advanced ceramics also have broad application prospects in mining, medical, chemical, textile, and military fields. Photocurable ceramic additive manufacturing technology takes ultraviolet light curing as its core and achieves the layered accumulation of ceramic slurry through "digital light curing". Finally, high-density and high-precision ceramic components are obtained through debinding and sintering, showing significant advantages in the preparation of complex and precision ceramic components.

[0003] However, photocurable ceramic preforms are composed of ceramic powder and organic photosensitive resin, and often have complex and irregular structures, which poses many challenges to their binder removal and sintering processes. During the binder removal stage, the thermal decomposition of the photosensitive resin leads to a gradual decrease in the internal bonding strength of the preform. If the heating rate is not properly controlled or localized stress concentration occurs, it can easily cause cracking, deformation, or even collapse of the preform. Currently, the industry generally uses a traditional binder removal-sintering process. This process requires transferring the sample to a sintering furnace after binder removal. This process involves multiple heating and cooling cycles, and the impacts during sample transfer inevitably cause defects such as cracking of the preform. This results in long production cycles, high energy consumption, low yield, and poor consistency, severely restricting the fabrication process of high-performance non-oxide ceramic components. Summary of the Invention

[0004] To address the aforementioned deficiencies or improvement needs of existing technologies, this invention provides an integrated preparation method for photocurable ceramic debinding and sintering, as well as a ceramic workpiece. This method solves the problems of long production cycles, high energy consumption, low yield, and poor consistency that currently exist in the separate processes of debinding and sintering of photocurable ceramic workpieces.

[0005] To achieve the above objectives, according to one aspect of the present invention, a method for integrated preparation of photocurable ceramics by binder removal and sintering is provided, comprising: S1, Preparation of ceramic slurry: Ceramic powder, sintering aid and additives are mixed into a uniform ceramic slurry; S2, Ceramic slurry is photocured and shaped according to a preset component model to obtain a ceramic blank; S3. The ceramic blank is placed in a heating furnace. By controlling the on and off of the protective gas and the temperature curve, the debinding process and sintering process are carried out in sequence to obtain the ceramic part, thus completing the integrated preparation of the photocurable ceramic workpiece by debinding and sintering.

[0006] The photopolymerization-cured ceramic debinding and sintering integrated preparation method provided by the present invention, S1 specifically includes: Ceramic powder, sintering aid powder, multi-component photosensitive resin monomer, dispersant, plasticizer, leveling agent, defoamer and photoinitiator are mixed by stirring to form a uniform ceramic slurry for photocuring.

[0007] According to the method for preparing photocurable ceramic workpieces provided by the present invention, the ceramic powder used in S1 is one or more of silicon oxide, aluminum oxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, silicon nitride, silicon carbide, tungsten carbide, boron nitride, and aluminum nitride. The sintering aid powder is one or more of the following: alumina, yttrium oxide, magnesium oxide, lanthanum oxide, calcium oxide, cerium oxide, and boron oxide. The monomers of the multi-component photosensitive resin are two or more of the following: 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, hydroxyethyl methacrylate, ethoxylated trimethylolpropane triacrylate, dipropylene glycol diacrylate, isobornyl acrylate, acrylomorpholine, and dipentaerythritol hexaacrylate.

[0008] According to the photopolymerization forming ceramic debinding and sintering integrated preparation method provided by the present invention, in the photopolymerization forming process S2, the laser energy is 1-36 mW / cm². 2 The exposure time is 1-999 s, and the thickness of the formed slice is 15-500 μm.

[0009] According to the photopolymerization forming ceramic debinding and sintering integrated preparation method provided by the present invention, S3 further includes: embedding the ceramic blank in ceramic powder before placing the ceramic blank into the heating furnace; The ceramic powder used for burial is one or more of the following: silicon oxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, α-alumina, β-alumina, α-silicon nitride, β-silicon nitride, α-silicon carbide, β-silicon carbide, tungsten carbide, h-boron nitride, c-boron nitride, β-aluminum nitride, and β-aluminum nitride.

[0010] According to the photopolymerization forming ceramic debinding and sintering integrated preparation method provided by the present invention, in step S3, the debinding and sintering processes are performed sequentially to obtain the ceramic part, specifically including: First, the space inside the heating furnace is evacuated, and then a protective gas is introduced. Under a protective gas atmosphere, the temperature is increased at a preset first heating rate, and when the temperature inside the furnace reaches the preset holding point, it is held for a preset time to carry out the degreasing process in the glue removal process. After the holding time of the degreasing process ends, air is introduced into the heating furnace. Under the air atmosphere, the furnace is heated to the preset carbon removal temperature and held for a preset time to carry out the carbon removal process in the glue removal process. After the holding time for the carbon removal process ends, the furnace is heated at a preset second heating rate. When the temperature inside the furnace reaches the preset sintering temperature, it is held for a preset time to carry out the sintering process.

[0011] According to the integrated preparation method of photocurable ceramic debinding and sintering provided by the present invention, multiple preset heat preservation points are set during the debinding process, and during the heating process, the multiple preset heat preservation points are heat preservation in sequence from low to high. Multiple preset heat preservation points are determined based on the thermogravimetric curves of ceramic blanks obtained from prior experiments. The preset heat preservation points are selected from multiple points, including the temperature points corresponding to the peak value of the first derivative curve of the thermogravimetric curve, the temperature points corresponding to the inflection points before and after the maximum peak value, and the final temperature point.

[0012] According to the integrated preparation method of photocurable ceramic debinding and sintering provided by the present invention, the first heating rate of the debinding process is 0.1-10℃ / min, and it is finally completed by holding at 500-800℃ for 0.5-4 h; the carbon removal process is completed in an air atmosphere by holding at 600-800℃ for 0.5-4 h.

[0013] According to the photopolymerization-cured ceramic debinding and sintering integrated preparation method provided by the present invention, the second heating rate of the sintering process is 0.1-10℃ / min, the sintering temperature is 1000-2100℃, and the sintering time is 0.5-4 h. Furthermore, when the ceramic powder in S1 is an oxide, the sintering process is carried out in an air atmosphere; when the ceramic powder is a non-oxide, after the holding time of the carbon removal process ends, the space inside the furnace is first evacuated, and then a protective gas is introduced, and the sintering process is carried out in a protective gas atmosphere.

[0014] According to another aspect of the present invention, a photocurable ceramic workpiece is provided, which is prepared and obtained based on the photocurable ceramic debinding and sintering integrated preparation method described in any of the above claims.

[0015] In summary, compared with the prior art, the above-described technical solutions conceived in this invention provide an integrated method for photopolymerization forming ceramic debinding and sintering, as well as ceramic workpieces: 1. This invention proposes an integrated debinding and sintering technology for preparing photocurable ceramics with complex structures. Traditional separate processes—"debinding → cooling → transfer → reloading → heating → sintering"—are complex and redundant, hindering the efficient fabrication of complex ceramic components and limiting the integration and development of ceramics with photocurable forming. This invention, however, integrates debinding and sintering within the same furnace. The green body maintains its inherent complex structure and consistent placement throughout the high-temperature post-processing, overcoming the limitation of requiring cooling and transfer after debinding. This achieves seamless transitions between different processes, significantly improving overall production efficiency. 2. This invention reduces energy consumption in the post-processing of photopolymer additive manufacturing. Traditional split processes require multiple heating and cooling cycles, resulting in significant energy consumption. In contrast, the integrated process requires only one heating cycle, and the furnace heat can be utilized in stages (low-temperature debinding and high-temperature sintering), which greatly improves energy efficiency and effectively reduces energy costs in the production process, meeting the energy-saving requirements of industrial production. 3. This invention improves the product yield of photocurable ceramics. On the one hand, by precisely controlling the heating rate and furnace atmosphere during the glue removal stage, cracking and deformation of the green body caused by excessively rapid pyrolysis of organic resin can be avoided. On the other hand, the sample transfer step is eliminated, completely avoiding damage to the green body caused by bumps during the transfer process. This reduces defects from the source of the process, significantly improving product yield and batch consistency, and is especially suitable for the stringent requirements of high-performance ceramics for structural integrity. 4. This invention is adapted to the industrial production of complex ceramic components formed by photopolymerization. The core advantage of photopolymerization additive manufacturing lies in the preparation of complex irregular-shaped components. The integrated process does not require the transfer of the green blank, which can better protect the integrity of the complex structure and solve the problem of easy damage during the transfer of complex green blanks in traditional processes. At the same time, its continuous production mode and stable process parameter control are more easily adapted to industrial production lines, providing key technical support for the large-scale production of high-performance ceramic components. Attached Figure Description

[0016] Figure 1 The present invention provides a flowchart of an integrated process for photopolymerization forming of ceramics by debinding and sintering, and a method for preparing ceramic workpieces.

[0017] Figure 2 This is the thermogravimetric (TG-DTG) curve of the photocurable ceramic preform in the embodiment of the present invention.

[0018] Figure 3This is a post-processing curve diagram of the integrated process of debinding and sintering of photocurable ceramic green bodies in an embodiment of the present invention. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention. Furthermore, the technical features involved in the various embodiments of this invention described below can be combined with each other as long as they do not conflict with each other.

[0020] Please see Figure 1 This embodiment provides a method for the integrated preparation of photocurable ceramics through debinding and sintering. The preparation method includes: S1, Preparation of ceramic slurry: Ceramic powder, sintering aid and additives are mixed into a uniform ceramic slurry; S2, Ceramic slurry is photocured and shaped according to a preset component model to obtain a ceramic blank; S3. The ceramic blank is placed in the heating furnace. By controlling the on and off of the protective gas and the temperature curve, the debinding process and sintering process are carried out in sequence to complete the debinding, carbon removal and sintering process, and obtain the ceramic part. The integrated preparation of photocurable ceramic workpiece debinding and sintering is completed.

[0021] The integrated debinding and sintering process proposed in this embodiment combines the two core processes of debinding and sintering into a single furnace for continuous operation. This is achieved by controlling the flow of protective gas and the temperature profile, eliminating transfer steps and repeated heating and cooling processes between processes. This significantly improves product yield, consistency, and energy efficiency. Specifically, in the debinding zone, precise control of the heating rate and furnace atmosphere ensures the gradual and complete pyrolysis of the organic resin; in the sintering zone, setting an appropriate final temperature and holding time achieves densification of the green body. Compared to the cumbersome process of traditional separate processes involving "debinding → cooling → transfer → reloading → heating → sintering," the integrated process significantly shortens the production cycle and reduces energy consumption by eliminating sample transfer and secondary heating steps. This process has significant application value for the industrial production of high-performance photocurable ceramics.

[0022] This embodiment achieves a one-time temperature change within the ceramic by integrating debinding and sintering, reducing the strong thermal stress caused by multiple heating and cooling cycles, as well as warping deformation during cooling, thus enabling rapid and uniform in-situ grain growth. Compared to traditional separate debinding and sintering methods, this approach offers advantages such as high production efficiency, low energy consumption, and high product yield. It facilitates smooth ceramic post-processing, allows for the fabrication of large-size, complex-structured ceramic parts, and enables continuous production. It solves the problem of repetitive debinding and sintering processes in ceramic green bodies and reduces the risk of cracking due to sample transfer, thereby improving the performance of photopolymerization forming technology products.

[0023] In some embodiments, S1 specifically includes: Ceramic powder, sintering aid powder, multi-component photosensitive resin monomer, dispersant, plasticizer, leveling agent, defoamer and photoinitiator are mixed by stirring to form a uniform ceramic slurry for photocuring.

[0024] The ceramic powder used in S1 is one or more of silicon oxide, aluminum oxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, silicon nitride, silicon carbide, tungsten carbide, boron nitride, and aluminum nitride; the particle size of the ceramic powder is 0.01-100 μm. The sintering aid powder is one or more of the following: alumina, yttrium oxide, magnesium oxide, lanthanum oxide, calcium oxide, cerium oxide, and boron oxide. The monomers of the multi-component photosensitive resin are two or more of the following: 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, hydroxyethyl methacrylate, ethoxylated trimethylolpropane triacrylate, dipropylene glycol diacrylate, isobornyl acrylate, acrylomorpholine, and dipentaerythritol hexaacrylate.

[0025] In the photopolymerization process of S2, the laser energy is 1-36 mW / cm². 2 The exposure time is 1-999 s, and the thickness of the formed slice is 15-500 μm.

[0026] Furthermore, S3, before placing the ceramic blank into the heating furnace, also includes: embedding the ceramic blank in ceramic powder; that is, placing the ceramic blank in a mold, embedding it with ceramic powder, and then placing the mold into the heating furnace. Embedding with ceramic powder facilitates uniform heating of the blank and reduces the volatilization of important elements in the ceramic part; moreover, for non-oxide sintering, at high temperatures, the embedded powder can preferentially react with the residual oxygen after carbon removal, reducing the degree of oxidation of the ceramic sample. The integrated debinding and sintering improves the efficiency of post-processing of ceramic blanks, reduces the damage to the blanks caused by bumps during the transfer process of debinding and sintering in traditional processes, and the entire preparation process is simple and can be widely used in production.

[0027] The ceramic powder used for landfilling is one or more of the following: silicon dioxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, α-alumina, β-alumina, α-silicon nitride, β-silicon nitride, α-silicon carbide, β-silicon carbide, tungsten carbide, h-boron nitride, c-boron nitride, β-aluminum nitride, and β-aluminum nitride; the particle size of the ceramic powder used for landfilling is 0.1-100 μm. The particle size of the ceramic powder used for landfilling is larger than that of the ceramic powder in S1.

[0028] Furthermore, embedding the ceramic blank in ceramic powder specifically includes: When the ceramic blank is a solid workpiece, the ceramic powder is directly buried; When a ceramic blank has a porous structure, the pores are covered on the surface of the blank before the ceramic powder is embedded. For example, tape can be used for covering to prevent ceramic powder from entering the blank and affecting the shrinkage process.

[0029] In some embodiments, the ceramic part is obtained by sequentially performing the debinding and sintering processes in S3, specifically including: First, the space inside the heating furnace is evacuated to a minimum vacuum pressure of -0.1 MPa; then, a protective gas is introduced; the protective gas is one or more of nitrogen, argon, and helium. Under a protective gas atmosphere, the temperature is increased at a preset first heating rate, and the temperature is held at the preset holding point for a preset time to carry out the degreasing process in the glue removal process. After the holding time of the degreasing process ends, air is introduced into the heating furnace. Under the air atmosphere, the furnace is heated to the preset carbon removal temperature and held for a preset time to carry out the carbon removal process in the glue removal process. After the holding time for the carbon removal process ends, the furnace is heated at a preset second heating rate. When the temperature inside the furnace reaches the preset sintering temperature, it is held for a preset time to carry out the sintering process.

[0030] Furthermore, multiple preset heat preservation points are set during the degreasing process. During the heating process, these preset heat preservation points are sequentially heat-preserved in ascending order. That is, multiple preset heat preservation points are set from low to high. During the temperature rise in the furnace, a preset heat preservation time is performed each time a preset heat preservation point is reached. Through multiple sequential heat preservation operations, the degreasing and volatilization stage proceeds more orderly and smoothly, which is conducive to improving the quality of the finished product.

[0031] Specifically, multiple preset heat preservation points are determined based on the thermogravimetric curves of the ceramic green body obtained from prior experiments; the preset heat preservation points are selected from multiple of the following: the temperature points corresponding to the peak value of the first derivative curve of the thermogravimetric curve, the temperature points corresponding to the inflection points before and after the maximum peak value, and the final temperature point.

[0032] refer to Figure 2The thermogravimetric (TG-DTG) curves of ceramic green bodies can be obtained by heating to 800℃ at a rate of 2℃ / min under a nitrogen atmosphere (see...). Figure 2 ); where the DTG curve is the slope curve (first derivative curve) of the TG curve, representing the pyrolysis rate of the organic resin; in Figure 2 In the figure, the temperature points of 137℃, 248℃ and 413℃ are the temperature points corresponding to multiple peaks on the DTG curve. They correspond to the rapid decomposition time points of water vapor and low molecular weight organic matter, a small amount of additives (such as plasticizer PEG) and monofunctional organic matter, and the main high molecular weight organic matter, respectively. The temperature points of 340℃, 500℃ and 600℃ correspond to the temperature points at which the high molecular weight concentrates to start, end decomposition and complete the degreasing process, that is, the temperature points corresponding to the turning points before and after the maximum peak and the final temperature point.

[0033] Therefore, the points where the second derivative of the thermogravimetric curve (TG) is zero, and the points where organic matter begins and ends its concentrated pyrolysis, can be designated as preset holding points with holding times of 0.5-3 hours. The purpose of setting the holding time is to form a degreasing channel inside the ceramic green body, providing a specific flow path for the sequential discharge of organic matter after pyrolysis, and avoiding cracking of the ceramic green body due to excessive internal pressure caused by concentrated pyrolysis.

[0034] Specifically, the first heating rate of the degreasing process is 0.1-10℃ / min, and it is finally completed by holding at 500-800℃ (i.e., the highest temperature range of the preset temperature point) for 0.5-4 h; the carbon removal process is completed in an air atmosphere by holding at 600-800℃ for 0.5-4 h.

[0035] Optionally, refer to Figure 3 The temperature points corresponding to the maximum peak of the first-order derivative curve of the thermogravimetric curve of the ceramic green body, the temperature points corresponding to the inflection points before and after the maximum peak, and the final temperature point can be set as preset holding points for the holding temperature settings of the degreasing process; the first heating rate of the furnace temperature during the degreasing process can be gradually reduced to adapt to the gradually increasing weight loss rate; the first heating rate can also be reduced first, and then gradually increased when the furnace temperature reaches the inflection point corresponding to the maximum peak; there are no specific limitations.

[0036] In some embodiments, the second heating rate of the sintering process is 0.1-10℃ / min, the sintering temperature is 1000-2100℃, and the sintering time is 0.5-4 h.

[0037] Furthermore, when the ceramic powder in S1 is an oxide, the sintering process is carried out in an air atmosphere; when the ceramic powder is a non-oxide, after the holding time of the carbon removal process ends, the space inside the furnace is first evacuated, and then a protective gas is introduced, and the sintering process is carried out in a protective gas atmosphere.

[0038] In some embodiments, a photocurable ceramic workpiece is also provided, which is prepared and obtained based on the above-described photocurable ceramic debinding and sintering integrated preparation method.

[0039] The method and the product obtained by the present invention will be described in more detail below with reference to specific embodiments. Specific implementation examples: 1,6-Hexanediol diacrylate (HDDA) and trimethylolpropane triacrylate (TMP3EOTA) were weighed at a mass ratio of 3:1, totaling 14.42 g. Then, 1.2 g of Solsperse 41000 dispersant, 1.8 g of polyethylene glycol, and 1.2 g of 2,4,6-trimethylbenzoyl diphenylphosphine oxide were added. The mixture was stirred at 1500 r / min for 5 min using a vacuum stirrer to ensure homogeneity. Next, 30 g of silicon nitride powder, 1.2 g of alumina powder, and 1.2 g of yttrium oxide powder were added to the solution in two batches, and stirred at 1800 r / min for 10 min each time, to form a homogeneous ceramic slurry with a solid content of 40 vol%. The printing layer thickness was set to 25 μm, and the power was 18 mW / cm². 2 Laser power and 5-second exposure time were used for photopolymerization to obtain silicon nitride ceramic preforms with complex structures.

[0041] The printed silicon nitride ceramic preform was completely buried in β-phase silicon nitride coarse powder with a particle size of 20 μm.

[0042] The ceramic sample after powder embedding is placed into an integrated debinding and sintering furnace. At this time, a pipeline is set up to connect the inside of the furnace with the outside environment, isolating the internal environment from the external environment. After the vacuum inside the pipeline is evacuated to -0.1 MPa, nitrogen gas is introduced to a slightly positive pressure for low-temperature debinding at 600℃. The debinding process is as follows: the temperature is increased from room temperature to 137℃ at a heating rate of 1℃ / min; then, it is increased to 340℃ at a rate of 0.5℃ / min and held for 1 h; then increased to 413℃ at a rate of 0.2℃ / min and held for 1 h; then increased to 500℃ at a rate of 0.2℃ / min and held for 1 h; finally, it is increased to 600℃ at a rate of 0.2℃ / min and held for 2 h to complete the debinding process. The integrated debinding and sintering furnace can be any heating furnace capable of vacuuming and gas introduction, and there is no specific limitation.

[0043] After degreasing is completed, the equipment automatically closes the nitrogen valve, connecting the furnace chamber with the air, and continues to maintain the temperature at 600℃ for 2 hours to complete the carbon removal process of the green billet.

[0044] After carbon removal, the tube is evacuated again to -0.1 MPa, and then nitrogen is slowly introduced to a slightly positive pressure for sintering in a high-temperature atmosphere of 1750℃. The sintering process involves heating from 600℃ to 1750℃ at a rate of 3℃ / min, holding at that temperature for 2 hours to complete sintering, and finally cooling to 1200℃ at a rate of 3℃ / min with the furnace to obtain a complete and defect-free complex structure silicon nitride ceramic component.

[0045] Those skilled in the art will readily understand that the above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A method for the integrated preparation of photocurable ceramics through binder removal and sintering, characterized in that, include: S1, Preparation of ceramic slurry: Ceramic powder, sintering aid and additives are mixed into a uniform ceramic slurry; S2, Ceramic slurry is photocured and shaped according to a preset component model to obtain a ceramic blank; S3. The ceramic blank is placed in a heating furnace. By controlling the on and off of the protective gas and the temperature curve, the debinding process and sintering process are carried out in sequence to obtain the ceramic part, thus completing the integrated preparation of the photocurable ceramic workpiece by debinding and sintering.

2. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 1, characterized in that, S1 specifically includes: Ceramic powder, sintering aid powder, multi-component photosensitive resin monomer, dispersant, plasticizer, leveling agent, defoamer and photoinitiator are mixed by stirring to form a uniform ceramic slurry for photocuring.

3. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 2, characterized in that, The ceramic powder used in S1 is one or more of the following: silicon oxide, aluminum oxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, silicon nitride, silicon carbide, tungsten carbide, boron nitride, and aluminum nitride. The sintering aid powder is one or more of the following: alumina, yttrium oxide, magnesium oxide, lanthanum oxide, calcium oxide, cerium oxide, and boron oxide. The monomers of the multi-component photosensitive resin are two or more of the following: 1,6-hexanediol diacrylate, trimethylolpropane triacrylate, hydroxyethyl methacrylate, ethoxylated trimethylolpropane triacrylate, dipropylene glycol diacrylate, isobornyl acrylate, acrylomorpholine, and dipentaerythritol hexaacrylate.

4. The integrated preparation method for photocurable ceramics with binder removal and sintering as described in claim 1, characterized in that, In the photopolymerization process of S2, the laser energy is 1-36 mW / cm². 2 The exposure time is 1-999 s, and the thickness of the formed slice is 15-500 μm.

5. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 1, characterized in that, S3 includes, before placing the ceramic blank into the heating furnace, burying the ceramic blank in ceramic powder; The ceramic powder used for burial is one or more of the following: silicon oxide, yttrium oxide, lead zirconate titanate, hydroxyapatite, α-alumina, β-alumina, α-silicon nitride, β-silicon nitride, α-silicon carbide, β-silicon carbide, tungsten carbide, h-boron nitride, c-boron nitride, β-aluminum nitride, and β-aluminum nitride.

6. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 1, characterized in that, In S3, the ceramic parts are obtained by sequentially performing debinding and sintering processes, specifically including: First, the space inside the heating furnace is evacuated, and then a protective gas is introduced. Under a protective gas atmosphere, the temperature is increased at a preset first heating rate, and when the temperature inside the furnace reaches the preset holding point, it is held for a preset time to carry out the degreasing process in the glue removal process. After the holding time of the degreasing process ends, air is introduced into the heating furnace. Under the air atmosphere, the furnace is heated to the preset carbon removal temperature and held for a preset time to carry out the carbon removal process in the glue removal process. After the holding time for the carbon removal process ends, the furnace is heated at a preset second heating rate. When the temperature inside the furnace reaches the preset sintering temperature, it is held for a preset time to carry out the sintering process.

7. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 6, characterized in that, Multiple preset heat preservation points are set during the degreasing process. During the heating process, the multiple preset heat preservation points are kept warm in sequence from low to high. Multiple preset heat preservation points are determined based on the thermogravimetric curves of the ceramic green body obtained from prior experiments; The preset insulation point is obtained from multiple temperature points, including the peak value of the first derivative curve of the thermogravimetric curve, the temperature points corresponding to the inflection points before and after the maximum peak value, and the final temperature point.

8. The integrated preparation method for photocurable ceramics with binder removal and sintering as described in claim 6, characterized in that, The first heating rate of the degreasing process is 0.1-10℃ / min, and it is finally completed by holding at 500-800℃ for 0.5-4 h; the carbon removal process is completed in an air atmosphere by holding at 600-800℃ for 0.5-4 h.

9. The integrated preparation method for photocurable ceramic debinding and sintering as described in claim 6, characterized in that, The second heating rate of the sintering process is 0.1-10℃ / min, the sintering temperature is 1000-2100℃, and the sintering time is 0.5-4 h; Furthermore, when the ceramic powder in S1 is an oxide, the sintering process is carried out in an air atmosphere; when the ceramic powder is a non-oxide, after the holding time of the carbon removal process ends, the space inside the furnace is first evacuated, and then a protective gas is introduced, and the sintering process is carried out in a protective gas atmosphere.

10. A photocurable ceramic workpiece, characterized in that, The ceramic is prepared and obtained by the photocurable ceramic debinding and sintering integrated preparation method according to any one of claims 1-9.

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