Wafer film carrier characteristic measuring sample table integrated with temperature control function

Abstract

This invention discloses a wafer thin film carrier characteristic measurement sample stage with integrated temperature control function, relating to the field of wafer thin film technology. It includes a measurement stage body, a temperature control box fixedly connected to the outer wall of the measurement stage body, a main body shell fixedly connected to the inner wall of the measurement stage body, several support components arranged in an arc-shaped array on the top of the main body shell, several fixing mechanisms arranged in an arc-shaped array on the outer wall of the main body shell, and a hot air mechanism arranged on the inner wall of the main body shell. The wafer thin film carrier characteristic measurement sample stage with integrated temperature control function of this invention uses the fixing mechanism and hot air mechanism to directionally heat the "wafer thin film-substrate composite" (the object of wafer thin film carrier characteristic measurement) using a non-contact method of hot air. Furthermore, the fixing mechanism for fixing the "wafer thin film-substrate composite" is non-contact, preventing deformation of the fixture due to thermal expansion.

Description

Technical Field

[0001] This invention relates to the field of wafer thin film technology, and in particular to a sample stage for measuring the carrier characteristics of wafer thin films with integrated temperature control function. Background Technology

[0002] When measuring the charge carrier characteristics of wafer thin films, the core is to measure the film itself. However, in practice, since the thickness of wafer thin films is usually in the nanometer to micrometer range, they do not have structural strength and cannot be picked up and fixed on the measuring instrument. Therefore, all wafer thin film charge carrier characteristic measurements must be performed on a "thin film-substrate composite".

[0003] The measurement of charge carrier characteristics in wafer thin films mainly involves measuring properties such as concentration and mobility of charge carriers. However, these are essentially static and intangible physical properties of a material. In a steady state, they exist quietly within the material and cannot be effectively detected. Existing technologies generally employ external energy excitation to transform them from static properties that cannot be directly measured into dynamic processes that can be detected. Thermal excitation is a commonly used method.

[0004] The traditional method for measuring the carrier characteristics of wafer thin films involves using a fixture to fix the "thin film-substrate composite" and a heating plate to heat it. To ensure the optimal heat conduction path from the heating plate to the wafer thin film, the "thin film-substrate composite" is placed directly on the heating plate. Therefore, the fixture inevitably comes into contact with or is very close to the heating plate. This causes the heating plate to heat the fixture while simultaneously heating the "thin film-substrate composite." Upon heating, the fixture arm elongates, and the clamping components deform. This thermal deformation of the fixture arm causes changes in the clamping force on the "thin film-substrate composite," resulting in uneven clamping force. Furthermore, it causes displacement of the "thin film-substrate composite" after its position is fixed during the carrier characteristic measurement process, thus affecting the accuracy of the wafer thin film carrier characteristic measurement. Summary of the Invention

[0005] The purpose of this invention is to provide a wafer thin film carrier characteristic measurement sample stage with integrated temperature control function to solve the problems mentioned in the background art.

[0006] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: The present invention is: a wafer thin film carrier characteristic measurement sample stage with integrated temperature control function, comprising a measurement stage body, a temperature control box fixedly connected to the outer wall of the measurement stage body, a main body shell fixedly connected to the inner wall of the measurement stage body, a number of support components arranged in an arc-shaped array on the top of the main body shell, a number of fixing mechanisms arranged in an arc-shaped array on the outer wall of the main body shell, and a hot air mechanism arranged on the inner wall of the main body shell.

[0007] Preferably, the fixing mechanism includes a cylinder fixedly connected to the outer wall of the main body shell, a clamping arm shell fixedly connected to the outer wall of the cylinder, and a contact component, a heat storage component and a heat dissipation component respectively provided on the inner wall of the clamping arm shell.

[0008] Preferably, the contact assembly includes two heat-conducting plates symmetrically distributed and fixedly connected to the inner wall of the clamp arm housing. A heat-conducting column is fixedly connected to the outer wall of both heat-conducting plates. Several guide rods are fixedly connected in a rectangular array on the outer wall of one side of the heat-conducting plate. A heat-conducting elastomer is fixedly connected to the inner wall of each guide rod. A tapered guide rod is slidably connected to the inner wall of each guide rod. A composite heat-conducting block is fixedly connected to the outer wall of each tapered guide rod. A heat-conducting spring is sleeved on the outer wall of both the guide rod and the tapered guide rod on the same side. The outer walls of several heat-conducting springs are fixedly connected to the outer walls of the heat-conducting plates. The outer walls of several heat-conducting springs are fixedly connected to the outer walls of the composite heat-conducting block.

[0009] Preferably, a number of heat sinks are fixedly connected in a linear array on the outer wall of the heat-conducting column, a chimney duct is fixedly connected to the inner wall of the clamping arm shell, the outer wall of the heat-conducting column is fixedly connected to the inner wall of the chimney duct, a merging shell is fixedly connected to the top of the clamping arm shell, and a connecting pipe is connected through the top of the merging shell.

[0010] Preferably, the heat storage component includes a cylinder two fixedly connected to the bottom of the clamping arm housing, the outer wall of the piston rod of the cylinder two being slidably connected to the inner wall of the clamping arm housing, a mounting housing one being fixedly connected to the top of the cylinder two, phase change materials being symmetrically slidably connected to the inner wall of the mounting housing one, temperature sensors being fixedly connected to the outer walls of both phase change materials, and the outer wall of the mounting housing one being slidably connected to the inner wall of the clamping arm housing.

[0011] Preferably, a second mounting housing and two hydraulic cylinders are fixedly connected to the inner wall of the clamping arm housing, respectively. A first hydraulic cylinder and a second hydraulic cylinder are fixedly connected to the inner wall of the second mounting housing, respectively. A first spring piston plate is slidably connected to the inner wall of the first hydraulic cylinder, and a second spring piston plate is slidably connected to the inner wall of the second hydraulic cylinder. A redundant drive rod is slidably connected to the inner walls of both the first and second hydraulic cylinders. The outer wall of the redundant drive rod is fixedly connected to the bottom of the first spring piston plate and the top of the second spring piston plate. A pressure rod is slidably connected to the inner wall of the redundant drive rod, and the top of the pressure rod is fixedly connected to the outer wall of the first mounting housing. Spring piston rods are symmetrically slidably connected to the inner walls of the two hydraulic cylinders. The outer walls of the first and second hydraulic cylinders are connected to the outer walls of the two hydraulic cylinders via oil hoses. A telescopic spring plate is fixedly connected to the outer walls of the two hydraulic cylinders.

[0012] Preferably, a guide plate is symmetrically fixedly connected to the inner wall of the clamping arm housing, and a connecting pipe two is fixedly connected to the inner wall of the clamping arm housing and the inner wall of the main body housing. The outer wall of the connecting pipe one is connected to the outer wall of the connecting pipe two. A support frame is fixedly connected to the inner wall of the connecting pipe two. A rotating shaft one is rotatably connected to the inner wall of the support frame. A bevel gear and a fan blade one are fixedly connected to the outer wall of the rotating shaft one.

[0013] Preferably, the hot air mechanism includes a motor fixedly connected to the bottom of the main body shell, a second rotating shaft rotatably connected to the inner wall of the main body shell, a second rotating shaft fixedly connected to the output end of the motor at the outer wall of the second rotating shaft, a second fan blade and a bevel gear disk fixedly connected to the outer wall of the second rotating shaft respectively, the outer wall of the bevel gear meshing with the outer wall of the bevel gear disk, a number of bell-shaped air inlets are opened at the bottom of the main body shell, an installation cylinder is fixedly connected to the inner wall of the main body shell, a number of Y-shaped air outlets are opened at the top of the installation cylinder, a heating component is provided on the inner wall of the installation cylinder, a second honeycomb perforated plate is fixedly connected to the top of the installation cylinder, a perforated plate is fixedly connected to the top of the second honeycomb perforated plate, a number of trumpet-shaped air outlets are opened at the top of the main body shell, and an air outlet component is provided at the top of the main body shell.

[0014] Preferably, the heating assembly includes several concentrically arranged annular honeycomb perforated plates, the diameter of which gradually increases from the inside to the outside. A unidirectional heating plate is fixedly connected to the outer wall of two adjacent annular honeycomb perforated plates. A honeycomb perforated plate is fixedly connected to the inner wall of the innermost unidirectional heating plate, and the outermost unidirectional heating plate is fixedly connected to the inner wall of the mounting cylinder.

[0015] Preferably, the air outlet assembly includes several main air outlet nozzles that are fixedly connected to the top of the main body shell in a circular array. A diversion pipe is connected through the outer wall of two adjacent main air outlet nozzles on the outside. A secondary air outlet nozzle is connected through the middle of the outer wall of several diversion pipes.

[0016] Due to the adoption of the above technical solution, the technical progress achieved by this invention compared to the prior art is as follows: This invention utilizes a fixed mechanism and a hot air mechanism to directionally heat the "wafer thin film-substrate composite," the object for measuring the charge carrier characteristics of a wafer thin film, using a non-contact hot air method. Furthermore, the non-contact fixing mechanism for the "wafer thin film-substrate composite" prevents the heating source from easily heating the clamping fixture of the "wafer thin film-substrate composite" during heating. This prevents the fixture from expanding and deforming due to thermal expansion, which in turn causes uneven clamping force on the "wafer thin film-substrate composite," resulting in displacement of the fixed "wafer thin film-substrate composite" during the heating process. The movement of heat can affect the accuracy of wafer thin film charge carrier characteristic measurement. The contact components, heat storage components, and heat dissipation components are designed to guide and store the heat conducted from the heated wafer thin film-substrate composite to the fixing mechanism, preventing the heat from spreading throughout the fixing mechanism and causing it to expand due to heat. The heating components, honeycomb perforated plate, multi-hole plate, horn-shaped air outlet, and air outlet components are designed to comb and shape the hot air before it is sprayed onto the wafer thin film-substrate composite, making the hot air flow uniform and the voltage stable. This allows the non-contact heating method of hot air to meet the high-precision measurement requirements of wafer thin film charge carrier characteristics. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic cross-sectional view of the overall structure of the present invention; Figure 3 This is a partial structural diagram of the present invention; Figure 4 This is a partial cross-sectional view of the present invention; Figure 5 This is a schematic diagram of the contact component structure of the present invention; Figure 6 This is a schematic cross-sectional view of the contact component structure of the present invention; Figure 7 This is a schematic diagram of the heat storage component structure of the present invention; Figure 8 This is a schematic cross-sectional view of the heat storage component structure of the present invention; Figure 9 This is a side view structural diagram of the heat storage component of the present invention; Figure 10 This is an exploded view of the structure of the emission component of the present invention; Figure 11 This is a partial structural diagram of the hot air mechanism of the present invention; Figure 12 This is a schematic diagram of the heating component structure of the present invention; Figure 13This is a schematic diagram of the air outlet component structure of the present invention.

[0018] In the diagram: 1. Measuring platform body; 2. Temperature control box; 3. Main body shell; 4. Support assembly; 5. Fixing mechanism; 51. Cylinder 1; 52. Clamping arm shell; 53. Contact assembly; 531. Composite heat-conducting block; 532. Heat-conducting spring; 533. Conical guide rod; 534. Guide rod; 535. Heat-conducting elastomer; 536. Heat-conducting plate; 537. Heat-conducting column; 538. Heat sink; 539. Chimney duct; 5310. Merging shell; 5311. Connecting pipe 1; 54. Heat storage assembly; 541. Mounting shell 1; 542. Phase change material; 543. Temperature sensor; 544. Cylinder 2; 545. Mounting shell 2; 546. Pressure rod; 547. Redundant drive rod; 548. Hydraulic cylinder 1; 549. Spring piston plate 1; 5410. Hydraulic cylinder 2; 541 1. Spring piston plate II; 5412. Double oil cylinder; 5413. Spring piston rod; 5414. Telescopic spring plate; 55. Dispersing component; 551. Guide plate; 552. Connecting pipe II; 553. Support frame; 554. Rotating shaft I; 555. Bevel gear; 556. Fan blade I; 6. Hot air mechanism; 61. Motor; 62. Rotating shaft II; 63. Fan blade II; 64. Bell-shaped air inlet; 65. Mounting cylinder; 66. Y-shaped air outlet; 67. Heating component; 671. One-way heating plate; 672. Circular honeycomb perforated plate; 673. Honeycomb perforated plate I; 68. Honeycomb perforated plate II; 69. Perforated plate; 610. Horn-shaped air outlet; 611. Air outlet component; 6111. Main air outlet nozzle; 6112. Diverter pipe; 6113. Secondary air outlet nozzle; 612. Bevel gear disc. Detailed Implementation

[0019] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0020] Specific implementation examples are given below.

[0021] Example 1, please refer to Figure 1 - Figure 3 A wafer thin film carrier characteristic measurement sample stage with integrated temperature control function includes a measurement stage body 1, a temperature control box 2 fixedly connected to the outer wall of the measurement stage body 1, a main body shell 3 fixedly connected to the inner wall of the measurement stage body 1, a number of support components 4 arranged in an arc-shaped array on the top of the main body shell 3, a number of fixing mechanisms 5 arranged in an arc-shaped array on the outer wall of the main body shell 3, and a hot air mechanism 6 arranged on the inner wall of the main body shell 3.

[0022] The main body 1 of the above-mentioned measuring station is composed of a temperature control system, an electrical measurement module, a data acquisition and control system, etc. It is a mature technology in the existing technology. This solution only borrows its function of accurately measuring the carrier characteristics of wafer thin films, and its structure and working principle will not be elaborated further. The aforementioned temperature control box 2 is composed of a core processor, control and data acquisition modules, control output modules and communication interface modules. It is integrated with the temperature control system in the main body of the measurement stage 1 through physical connection and software integration, thereby completing the temperature control in the measurement of the carrier characteristics of wafer thin films. It is a mature technology in the existing technology, and its structure and working principle will not be elaborated further in this solution. The aforementioned support assembly 4 is composed of a cylinder slide and a support block; In a specific implementation of the present invention, the device is placed at a suitable position for measuring the carrier characteristics of wafer thin films, the “wafer thin film-substrate composite” to be measured is placed on the support component 4, several fixing mechanisms 5 are activated to fix the “wafer thin film-substrate composite”, and the hot air mechanism 6 is activated to generate hot air to heat the “wafer thin film-substrate composite”. During the heating process, the temperature of the "wafer thin film-substrate composite" is monitored in real time using temperature control box 2; According to the experimental purpose of measuring the carrier characteristics of wafer thin films, the carrier characteristics of the "wafer thin film-substrate composite" after heating is performed using the main body 1 of the measuring stage, or the carrier characteristics of the "wafer thin film-substrate composite" during the heating process are performed.

[0023] Example 2, as Figure 4 - Figure 11 As shown, the fixing mechanism 5 includes a cylinder 51 fixedly connected to the outer wall of the main body shell 3. A clamping arm shell 52 is fixedly connected to the outer wall of the cylinder 51. A contact component 53, a heat storage component 54, and a heat dissipation component 55 are respectively provided on the inner wall of the clamping arm shell 52. The contact assembly 53 includes two heat-conducting plates 536 symmetrically distributed and fixedly connected to the inner wall of the clamp arm housing 52. A heat-conducting column 537 is fixedly connected to the outer wall of both heat-conducting plates 536. A plurality of guide rods 534 are fixedly connected in a rectangular array on the outer wall of one side of the heat-conducting plate 536. A thermally conductive elastomer 535 is fixedly connected to the inner wall of each of the guide rods 534. A tapered guide rod 533 is slidably connected to the inner wall of each of the guide rods 534. A composite heat-conducting block 531 is fixedly connected to the outer wall of each of the tapered guide rods 533. A thermally conductive spring 532 is sleeved on the outer wall of both the guide rod 534 and the tapered guide rod 533 on the same side. The outer walls of the thermally conductive springs 532 are fixedly connected to the outer walls of the heat-conducting plates 536. The outer walls of the thermally conductive springs 532 are fixedly connected to the outer walls of the composite heat-conducting block 531. Several heat sinks 538 are fixedly connected in a linear array on the outer wall of the heat conduction column 537. A chimney duct 539 is fixedly connected to the inner wall of the clamp arm shell 52. The outer wall of the heat conduction column 537 is fixedly connected to the inner wall of the chimney duct 539. A converging shell 5310 is fixedly connected to the top of the clamp arm shell 52. A connecting pipe 5311 is connected through the top of the converging shell 5310. The heat storage assembly 54 includes a second cylinder 544 fixedly connected to the bottom of the clamping arm housing 52. The outer wall of the piston rod of the second cylinder 544 is slidably connected to the inner wall of the clamping arm housing 52. The top of the second cylinder 544 is fixedly connected to a first mounting housing 541. Phase change materials 542 are symmetrically slidably connected to the inner wall of the first mounting housing 541. Temperature sensors 543 are fixedly connected to the outer walls of both phase change materials 542. The outer wall of the first mounting housing 541 is slidably connected to the inner wall of the clamping arm housing 52. A mounting outer shell 545 and a double hydraulic cylinder 5412 are fixedly connected to the inner wall of the clamping arm outer shell 52. Hydraulic cylinders 548 and 5410 are fixedly connected to the inner wall of the mounting outer shell 545. A spring piston plate 549 is slidably connected to the inner wall of hydraulic cylinder 548, and a spring piston plate 5411 is slidably connected to the inner wall of hydraulic cylinder 5410. A redundant drive rod 547 is slidably connected to the inner wall of both hydraulic cylinder 548 and hydraulic cylinder 5410. The outer wall of the drive rod 547 is fixedly connected to the bottom of the first spring piston plate 549 and the top of the second spring piston plate 5411. The inner wall of the redundant drive rod 547 is slidably connected to the pressure rod 546. The top of the pressure rod 546 is fixedly connected to the outer wall of the first mounting housing 541. The inner wall of the double cylinder 5412 is symmetrically slidably connected to the spring piston rod 5413. The outer walls of the first cylinder 548 and the second cylinder 5410 are connected to the outer wall of the double cylinder 5412 through oil hoses. The outer wall of the double cylinder 5412 is fixedly connected to the telescopic spring plate 5414. A guide plate 551 is symmetrically fixedly connected to the inner wall of the clamping arm housing 52. A connecting pipe 2 552 is fixedly connected to the inner wall of the clamping arm housing 52 and the inner wall of the main body housing 3. The outer wall of the connecting pipe 1 5311 is connected to the outer wall of the connecting pipe 2 552. A support frame 553 is fixedly connected to the inner wall of the connecting pipe 2 552. A rotating shaft 1 554 is rotatably connected to the inner wall of the support frame 553. A bevel gear 555 and a fan blade 1 556 are fixedly connected to the outer wall of the rotating shaft 1 554 respectively.

[0024] The aforementioned clamping arm housing 52, chimney duct 539, and merging housing 5310 are all made of heat-insulating, low-expansion-coefficient materials; The aforementioned phase change material 542 is composed of a phase change material body and a specialized packaging shell. This is a mature technology in the prior art. In this solution, the phase change temperature of the phase change material 542 is slightly higher than room temperature, but much lower than the target heating temperature required for the wafer thin film carrier characteristics measurement and the "thin film-substrate composite". The aforementioned temperature sensor 543 is a mature technology in the prior art. In this solution, it is mainly used to monitor the temperature of the phase change material in real time. It is connected with cylinder 2 544. When the phase change material body changes completely due to temperature change, it will send an electrical signal to cylinder 2 544, causing cylinder 2 544 to perform a corresponding driving action. The aforementioned composite heat-conducting block 531 is made of a material that meets the requirements of high thermal conductivity, high strength and wear resistance, low coefficient of thermal expansion, smooth surface, and good chemical stability. The aforementioned chimney-type air duct 539 provides a separate chimney-type air duct for each heat sink 538 fixedly connected to the outer wall of the heat conduction column 537, and the bottom of each air duct is a funnel-shaped opening. Both the first connecting pipe 5311 and the second connecting pipe 552 are composed of both flexible and rigid pipes, which allows the first connecting pipe 5311 and the second connecting pipe 552 to meet the requirements of smooth ventilation without affecting the overall movement of the fixing mechanism 5. The aforementioned heat storage component 54 involves various structures related to hydraulic oil, constituting the hydraulic oil structure in the prior art; The aforementioned telescopic spring plate 5414 is composed of a stop plate, several springs, and several telescopic rods; The aforementioned spring piston rod 5413 is composed of a piston rod body and a spring. Both the aforementioned spring piston plate 1 549 and spring piston plate 2 5411 are composed of a piston rod body and a spring. In a specific implementation of this invention, the device is placed at a suitable position for measuring the charge carrier characteristics of the wafer thin film. The "wafer thin film-substrate composite" to be measured is placed on several support components 4. At the same time, several cylinders 51 are activated, which drives several clamping arm shells 52 to move towards the "wafer thin film-substrate composite", thereby driving several composite heat-conducting blocks 531 to move towards the "wafer thin film-substrate composite" to complete the clamping and fixing of the "wafer thin film-substrate composite". Several thermally conductive springs 532 serve as a buffer to prevent the fixing mechanism 5 from rigidly clamping the "wafer thin film-substrate composite", which could easily damage the "wafer thin film-substrate composite". The tapered guide rod 533 and the guide rod 534 on the same side play a supporting and guiding role for the thermally conductive spring 532; After the “wafer thin film-substrate composite” is fixed, the hot air mechanism 6 is turned on to generate hot air that blows onto the “wafer thin film-substrate composite” to heat it. Under normal conditions, the smaller diameter side of the tapered guide rod 533 is located within the thermally conductive elastic body 535. After several composite heat-conducting blocks 531 clamp and fix the "wafer thin film-substrate composite", the "wafer thin film-substrate composite" expands due to heat, causing deformation. This deformation causes the composite heat-conducting blocks 531 to shift to one side of the heat-conducting plate 536, thereby causing the tapered guide rod 533 to move into the thermally conductive elastic body 535. This results in the larger diameter side of the tapered guide rod 533 moving into the thermally conductive elastic body 535, thus affecting the... The thermally conductive elastomer 535 causes greater compression, increasing the contact pressure between the tapered guide rod 533 and the thermally conductive elastomer 535, thereby reducing the contact gap between the tapered guide rod 533 and the thermally conductive elastomer 535, improving the heat conduction efficiency between the tapered guide rod 533 and the thermally conductive elastomer 535, thereby improving the efficiency of heat conduction from the composite heat-conducting block 531 to the tapered guide rod 533, and the heat in the tapered guide rod 533 is conducted through the thermally conductive elastomer 535 to the guide rod 534, and finally to the heat-conducting plate 536; As the temperature of the wafer thin film-substrate composite increases, the deformation will be greater, resulting in a greater displacement of the composite heat-conducting block 531. This leads to a greater depth of movement of the larger diameter side of the tapered guide rod 533 into the heat-conducting elastic body 535, resulting in greater compression of the tapered guide rod 533 onto the heat-conducting elastic body 535, greater contact pressure between the tapered guide rod 533 and the heat-conducting elastic body 535, smaller gaps, and higher heat transfer efficiency. During the heating process, several composite heat-conducting blocks 531 are in direct contact with the "wafer thin film-substrate composite". When the temperature of the "wafer thin film-substrate composite" rises due to heating, the heat of the "wafer thin film-substrate composite" will be conducted to the composite heat-conducting blocks 531, and then conducted to the heat-conducting plate 536 on one side through several heat-conducting springs 532, several tapered guide rods 533 and several guide rods 534, and further conducted to the heat-conducting plate 536 on the other side through heat-conducting pillars 537. At this time, the phase change material 542 disposed at the bottom of the mounting housing 541 is attached to the heat-conducting plate 536. The phase change material 542 continuously absorbs and stores the heat conducted to the heat-conducting plate 536, so that the heat conducted to the fixing mechanism 5 by the "wafer thin film-substrate composite" cannot diffuse outward. This prevents the fixing mechanism 5 from deforming due to thermal expansion while fixing the "wafer thin film-substrate composite" whose temperature is constantly rising. This causes the clamping force on the "wafer thin film-substrate composite" to change and become uneven, causing the position of the fixed "wafer thin film-substrate composite" to move during the heating process, thereby affecting the accuracy of the measurement of the charge carrier characteristics of the wafer thin film. When the phase change material 542 is positioned as described above, the pressure rod 546 is at its highest point within the redundant drive rod 547, which restricts the redundant drive rod 547 to a certain height. At this time, the spring piston plate 549 is in a state of squeezing the hydraulic oil in the cylinder 548. The spring in the spring piston plate 549 is in a stretched state, and the hydraulic oil is squeezed into one of the cylinders of the double cylinder 5412 through the delivery hose, thereby driving the spring piston rod 5413 in this cylinder to move, which in turn drives the telescopic spring plate 5414 to move towards the phase change material 542, squeezing the phase change material 542 and causing it to move a certain distance towards the heat conduction plate 536, thus making it close to the heat conduction plate 536. This reduces the heat transfer efficiency between the heat conduction plate 536 and the phase change material 542, allowing the phase change material 542 to better absorb and store the heat conducted to the heat conduction plate 536. Temperature sensor 543 monitors the temperature of phase change material 542 in real time. As phase change material 542 continuously absorbs heat and its internal mass changes from solid to liquid, it transmits an electrical signal to cylinder 544, causing cylinder 544 to move the mounting housing 541 downwards. This, in turn, moves both phase change materials 542 downwards until the unused phase change material 542 on the upper side is positioned directly opposite the heat-conducting plate 536, and the phase change material 542 on the lower side is positioned directly opposite the heat-conducting plate 536. Up to the guide plate 551, the replacement of the liquefied phase change material 542 and the unused phase change material 542 is completed during the heating process of the "wafer thin film-substrate composite". This increases the endurance of the phase change material 542 in this solution for the absorption and storage of heat from the "wafer thin film-substrate composite" to the fixing mechanism 5, and improves the stability and reliability of the directional conduction and absorption and storage of heat from the "wafer thin film-substrate composite" to the fixing mechanism 5. During the process of cylinder 2 544 driving mounting housing 1 541 downward to replace the positions of the two phase change materials 542, mounting housing 1 541 drives pressure rod 546 to slide downward within redundant drive rod 547, no longer limiting redundant drive rod 547. Under the reaction force of the spring in spring piston plate 1 549, spring piston plate 1 549 slides downward within oil cylinder 1 548, no longer squeezing the hydraulic oil in oil cylinder 1 548. This causes spring piston rod 5413, which squeezes telescopic spring plate 5414, to start moving, no longer squeezing telescopic spring plate 5414. Under the reaction force of the spring in telescopic spring plate 5414, telescopic spring plate 5414 moves and no longer squeezes phase change material 542. As the mounting housing 541 slides downward, the pressure rod 546 slides downward within the redundant drive rod 547. Before the phase change material 542 on the upper side moves to the position directly opposite the heat conduction plate 536, the pressure rod 546 moves to the lowest position within the redundant drive rod 547. At this time, the cylinder 544 continuously drives the mounting housing 541 to slide downward a certain distance. When adjusting the position of the phase change material 542 on the upper side, the pressure rod 546 will abut against the redundant drive rod 547, causing the redundant drive rod 547 to slide downward as a whole, thereby driving the spring piston plate 2. 5411 slides downwards within the second cylinder 5410, squeezing the hydraulic oil within the second cylinder 5410. Simultaneously, it drives the first spring piston plate 549 to slide downwards within the first cylinder 548. Under the same principle, the hydraulic oil is squeezed into the other cylinder of the dual cylinders 5412 through the hydraulic delivery pipe, thereby driving the spring piston rod 5413 in the other cylinder to move, which in turn drives the telescopic spring plate 5414 to move, squeezing the phase change material 542 after the position replacement is completed, so that the phase change material 542 after the replacement is also in close contact with the heat-conducting column 537.

[0025] Example 3, as Figure 11 - Figure 13 As shown, the hot air mechanism 6 includes a motor 61 fixedly connected to the bottom of the main body shell 3, a rotating shaft 62 rotatably connected to the inner wall of the main body shell 3, a rotating shaft 62 fixedly connected to the output end of the motor 61 at the outer wall of the rotating shaft 62, a fan blade 63 and a bevel gear 612 fixedly connected to the outer wall of the rotating shaft 62 respectively, a bevel gear 555 meshing with the outer wall of the bevel gear 612, a number of bell-shaped air inlets 64 are opened at the bottom of the main body shell 3, an installation cylinder 65 is fixedly connected to the inner wall of the main body shell 3, a number of Y-shaped air outlets 66 are opened at the top of the installation cylinder 65, a heating component 67 is provided on the inner wall of the installation cylinder 65, a honeycomb perforated plate 68 is fixedly connected to the top of the installation cylinder 65, a perforated plate 69 is fixedly connected to the top of the honeycomb perforated plate 68, a number of trumpet-shaped air outlets 610 are opened at the top of the main body shell 3, and an air outlet component 611 is provided at the top of the main body shell 3; The heating assembly 67 includes several concentrically arranged annular honeycomb perforated plates 672. The diameter of the annular honeycomb perforated plates 672 gradually increases from the inside to the outside. A unidirectional heating plate 671 is fixedly connected to the outer wall of two adjacent annular honeycomb perforated plates 672. A honeycomb perforated plate 673 is fixedly connected to the inner wall of the innermost unidirectional heating plate 671. The outermost unidirectional heating plate 671 is fixedly connected to the inner wall of the mounting cylinder 65. The air outlet assembly 611 includes several main air outlet nozzles 6111 that are fixedly connected to the top of the main body shell 3 in a circular array. Two adjacent main air outlet nozzles 6111 are connected to a common branch pipe 6112 on their outer walls. The middle of the outer walls of the branch pipes 6112 are connected to a secondary air outlet nozzle 6113.

[0026] The number of the aforementioned Y-shaped air outlets 66, the honeycomb holes on the honeycomb perforated plate 68, the holes on the perforated plate 69, the trumpet-shaped air outlets 610, and the main air outlet nozzles 6111 are the same, and their positions correspond one-to-one. The honeycomb holes in the honeycomb perforated plate 68 are all tapering from bottom to top, and the diameter of the honeycomb holes matches the diameter of the connecting part of the perforated plate 69. The aforementioned unidirectional heating plates 671 are all mature technologies in the prior art. In this solution, we only borrow their function of converting electrical energy into heat energy and setting the heating temperature and direction. Their structure and working principle will not be elaborated further. In a specific implementation of the present invention, when the “wafer thin film-substrate composite” is placed in a suitable position on the support component 4 and fixed by several fixing mechanisms 5, there is a small gap between the top of the “wafer thin film-substrate composite” and the top of several main exhaust nozzles 6111 and several secondary exhaust nozzles 6113. When the motor 61 is turned on, the rotating shaft 62 and the bevel gear disk 612 are rotated. When heat is conducted to the heat-conducting column 537, it will be conducted to several heat sinks 538, so that some of the heat conducted to the heat-conducting column 537 can be dissipated. External air enters the chimney duct 539 through the flared opening at the bottom of the chimney duct 539. When the airflow flows in the chimney duct 539, it will flow through several heat sinks 538, thereby carrying the heat absorbed by the heat sinks 538 to the converging shell 5310 for convergence. The rotation of the bevel gear disk 612 drives the bevel gear 555 to rotate, which in turn drives the rotating shaft 554 to rotate, which in turn drives the fan blade 556 to rotate. This continuously swirls the airflow in the connecting pipe 552 and transports it into the main body shell 3. Thus, under the continuous rotation and swirl of the fan blade 556, the airflow that converges in the converging shell 5310 enters the connecting pipe 552 through the connecting pipe 5311 and finally enters the main body shell 3, thereby realizing the recovery and utilization of waste heat generated by heat conduction in the fixed mechanism 5. When the phase change material 542 inside absorbs heat and changes from solid to liquid, it is adjusted to a position facing the two guide plates 551. External air can continuously enter the clamp arm shell 52 through the two guide plates 551 and flow to the phase change material 542, using air convection to complete the cooling operation of the phase change material 542 in this state. The presence of the deflector plate 551 can reduce the distance that external air needs to enter the clamp arm housing 52 and flow to the phase change material 542, and guide the airflow, thereby improving the cooling effect of the air on the phase change material 542. When the fan blade 556 rotates continuously to swirl the air in the connecting pipe 552, it can swirl the air in the clamp arm housing 52 that is cooling the phase change material 542 into the connecting pipe 552, and finally deliver it to the main housing 3. The rotation of the second shaft 62 drives the second fan blade 63 to rotate continuously, drawing in external air and air from inside the main body shell 3 through several bell-shaped air inlets 64, and blowing it toward the heating component 67; When several unidirectional heating plates 671 are powered on and a suitable heating temperature is set, the second fan blade 63 draws air into the main body shell 3 and blows it toward the heating component 67. The air will pass through several annular honeycomb perforated plates 672 and several honeycomb holes opened on the first honeycomb perforated plate 673. In this way, when the unidirectional heating plate 671 heats the air, the several annular honeycomb perforated plates 672 can complete the initial sorting and shaping of the air entering the main body shell 3. Several unidirectional heating plates 671 heat the air inside the honeycomb holes of several annular honeycomb perforated plates 672 and honeycomb perforated plate 673, turning it into hot air. After the air enters the honeycomb holes of several annular honeycomb perforated plates 672 and honeycomb perforated plate 673, it is divided into small streams of air for heating, which helps to improve the uniformity of airflow heating. The second fan blade 63 rotates continuously, blowing hot air through several Y-shaped air outlets 66 towards the air outlet assembly 611. When it is ejected through the air outlet assembly 611, it passes through several honeycomb holes on the honeycomb perforated plate 68 and several holes on the perforated plate 69 in sequence. Then it enters several main air outlet nozzles 6111 through several horn-shaped air outlets 610 and is ejected to the bottom of the "wafer thin film-substrate composite", thereby heating the "wafer thin film-substrate composite". During this process, the hot air can be sorted and shaped step by step before being ejected to the "wafer thin film-substrate composite", thereby achieving uniform flow and voltage stabilization of the hot air before it is ejected to the "wafer thin film-substrate composite". This allows the non-contact heating method of hot air to meet the high-precision measurement requirements of the charge carrier characteristics of the wafer thin film. When hot air enters and is ejected from several main exhaust nozzles 6111, some of the hot air enters several branch pipes 6112, allowing some of the hot air to be ejected through several secondary exhaust nozzles 6113, thereby spraying onto the bottom of the "wafer thin film-substrate composite". This effectively eliminates the heating blind zone that exists when the hot air is ejected from several main exhaust nozzles 6111 to heat the "wafer thin film-substrate composite", thereby further improving the uniformity of heating the "wafer thin film-substrate composite" by using hot air heating.

[0027] The working principle of this invention is as follows: The device is placed at a suitable position for measuring the carrier characteristics of wafer thin films. The “wafer thin film-substrate composite” to be measured is placed on the support assembly 4. At the same time, several cylinders 51 are activated, causing several composite heat-conducting blocks 531 to move towards the “wafer thin film-substrate composite” simultaneously, thus completing the clamping and fixing of the “wafer thin film-substrate composite”. The motor 61 is activated to drive the rotating shaft 62 and the bevel gear disk 612 to rotate. Several unidirectional heating plates 671 are powered on and a suitable heating temperature is set. The rotating shaft 62 rotates, driving the fan blade 63 to rotate continuously. Through several bell-shaped air inlets 64, external air and air inside the main body shell 3 are drawn into the interior of the main body shell 3 and blown towards the heating component 67. The air will pass through several annular honeycomb perforated plates 672 and honeycomb perforated plate 673 with several honeycomb holes. The unidirectional heating plates 671 heat the air. The second fan blade 63 rotates continuously, blowing hot air through several Y-shaped air outlets 66 toward the air outlet assembly 611, and then ejecting it through several main air outlet nozzles 6111 and several secondary air outlet nozzles 6113. During this process, the hot air will pass through several honeycomb holes opened on the honeycomb perforated plate 68 and several holes opened on the perforated plate 69, and then enter several main air outlet nozzles 611 through several trumpet-shaped air outlets 610. After the fixing mechanism 5 completes the clamping and fixing of the "wafer thin film-substrate composite", several composite heat-conducting blocks 531 come into direct contact with the "wafer thin film-substrate composite". When the temperature of the "wafer thin film-substrate composite" rises due to heating, the heat of the "wafer thin film-substrate composite" will be conducted to the composite heat-conducting blocks 531, and then conducted to the heat-conducting plate 536 on one side through several heat-conducting springs 532, several tapered guide rods 533 and several guide rods 534. It is further conducted to the heat-conducting plate 536 on the other side through the heat-conducting pillars 537, and finally conducted to the phase change material 542. The phase change material 542 will absorb and buffer the heat to prevent heat diffusion and cause deformation and expansion of the fixing mechanism 5.

[0028] The foregoing has shown and described the basic principles, main features, and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited to the above embodiments. The embodiments and descriptions in the specification are merely illustrative of the principles of the invention. Various changes and modifications can be made to the invention without departing from its spirit and scope, and all such changes and modifications fall within the scope of the present invention as claimed. The scope of protection of this invention is defined by the appended claims and their equivalents.

Claims

1. A wafer film carrier characteristics measurement sample stage integrated with temperature control function, comprising a measurement stage main body (1), characterized in that: A temperature control box (2) is fixedly connected to the outer wall of the measuring platform body (1), and a main shell (3) is fixedly connected to the inner wall of the measuring platform body (1). Several supporting components (4) are arranged in an arc-shaped array on the top of the main shell (3), and several fixing mechanisms (5) are arranged in an arc-shaped array on the outer wall of the main shell (3). A hot air mechanism (6) is provided on the inner wall of the main shell (3). The fixing mechanism (5) includes a cylinder (51) fixedly connected to the outer wall of the main body shell (3), a clamping arm shell (52) fixedly connected to the outer wall of the cylinder (51), and a contact component (53), a heat storage component (54) and a heat dissipation component (55) respectively provided on the inner wall of the clamping arm shell (52). The contact assembly (53) includes two heat-conducting plates (536) symmetrically distributed and fixedly connected to the inner wall of the clamp arm housing (52). A heat-conducting column (537) is fixedly connected to the outer wall of both heat-conducting plates (536). A plurality of guide rods (534) are fixedly connected in a rectangular array to the outer wall of one side of the heat-conducting plate (536). A thermally conductive elastomer (535) is fixedly connected to the inner wall of each of the guide rods (534). A sliding... A tapered guide rod (533) is dynamically connected. A composite heat-conducting block (531) is fixedly connected to the outer wall of several tapered guide rods (533). A heat-conducting spring (532) is sleeved on the outer wall of the guide rod (534) and the outer wall of the tapered guide rod (533) on the same side. The outer wall of several heat-conducting springs (532) is fixedly connected to the outer wall of the heat-conducting plate (536). The outer wall of several heat-conducting springs (532) is fixedly connected to the outer wall of the composite heat-conducting block (531). A guide plate (551) is symmetrically fixedly connected to the inner wall of the clamping arm shell (52). A connecting pipe two (552) is fixedly connected to the inner wall of the clamping arm shell (52) and the inner wall of the main shell (3). A merging shell (5310) is fixedly connected to the top of the clamping arm shell (52). A connecting pipe one (5311) is connected through the top of the merging shell (5310). The outer wall of the connecting pipe one (5311) is connected through the outer wall of the connecting pipe two (552). A support frame (553) is fixedly connected to the inner wall of the connecting pipe two (552). A rotating shaft one (554) is rotatably connected to the inner wall of the support frame (553). A bevel gear (555) and a fan blade one (556) are fixedly connected to the outer wall of the rotating shaft one (554). The hot air mechanism (6) includes a motor (61) fixedly connected to the bottom of the main body shell (3). A rotating shaft (62) is rotatably connected to the inner wall of the main body shell (3). The outer wall of the rotating shaft (62) is fixedly connected to the output end of the motor (61). A fan blade (63) and a bevel gear disk (612) are fixedly connected to the outer wall of the rotating shaft (62). The outer wall of the bevel gear (555) meshes with the outer wall of the bevel gear disk (612). Several bell-shaped air inlets (64) are opened at the bottom of the main body shell (3). An installation cylinder (65) is fixedly connected to the inner wall of the main body shell (3). The top of the installation cylinder (65) is provided with several Y-shaped air outlets (66). A heating component (67) is provided on the inner wall of the installation cylinder (65). A honeycomb perforated plate (68) is fixedly connected to the top of the installation cylinder (65). A perforated plate (69) is fixedly connected to the top of the honeycomb perforated plate (68). Several trumpet-shaped air outlets (610) are provided on the top of the main body shell (3). An air outlet component (611) is provided on the top of the main body shell (3).

2. The wafer film carrier characteristic measurement sample table with integrated temperature control according to claim 1, characterized in that: The outer wall of the heat-conducting column (537) is linearly arrayed with several heat sinks (538) fixedly connected. The inner wall of the clamping arm shell (52) is fixedly connected with a chimney duct (539). The outer wall of the heat-conducting column (537) is fixedly connected to the inner wall of the chimney duct (539).

3. The wafer film carrier characteristics measurement sample table with integrated temperature control according to claim 2, characterized in that: The heat storage component (54) includes a second cylinder (544) fixedly connected to the bottom of the clamping arm housing (52). The piston rod of the second cylinder (544) is slidably connected to the outer wall of the piston rod and the inner wall of the clamping arm housing (52). The top of the second cylinder (544) is fixedly connected to a first mounting housing (541). Phase change materials (542) are symmetrically slidably connected to the inner wall of the first mounting housing (541). Temperature sensors (543) are fixedly connected to the outer walls of both phase change materials (542). The outer wall of the first mounting housing (541) is slidably connected to the inner wall of the clamping arm housing (52).

4. The wafer film carrier particle property measurement sample table with integrated temperature control according to claim 3, wherein: The inner wall of the clamping arm housing (52) is fixedly connected to the mounting housing two (545) and the double oil cylinder (5412). The inner wall of the mounting housing two (545) is fixedly connected to the oil cylinder one (548) and the oil cylinder two (5410). The inner wall of the oil cylinder one (548) is slidably connected to the spring piston plate one (549). The inner wall of the oil cylinder two (5410) is slidably connected to the spring piston plate two (5411). The inner wall of the mounting housing two (545) is slidably connected to the redundant drive rod (547). The outer wall of the redundant drive rod (547) is slidably connected to the inner wall of the oil cylinder one (548) and the inner wall of the oil cylinder two (5410). The redundant drive rod (547) is fixedly connected to the bottom of spring piston plate one (549) and the top of spring piston plate two (5411) at the outer wall. A pressure rod (546) is slidably connected to the inner wall of the redundant drive rod (547). The top of the pressure rod (546) is fixedly connected to the outer wall of the mounting housing one (541). Spring piston rods (5413) are symmetrically slidably connected to the inner wall of the double cylinder (5412). The outer walls of cylinder one (548) and cylinder two (5410) are connected to the outer wall of the double cylinder (5412) through oil hoses. A telescopic spring plate (5414) is fixedly connected to the outer wall of the double cylinder (5412).

5. The wafer film carrier particle property measurement sample table with integrated temperature control according to claim 1, wherein: The heating assembly (67) includes several concentrically arranged annular honeycomb perforated plates (672). The diameter of the several annular honeycomb perforated plates (672) gradually increases from the inside to the outside. A unidirectional heating plate (671) is fixedly connected to the outer wall of two adjacent annular honeycomb perforated plates (672). A honeycomb perforated plate (673) is fixedly connected to the inner wall of the innermost unidirectional heating plate (671). The outermost unidirectional heating plate (671) is fixedly connected to the inner wall of the mounting cylinder (65).

6. The wafer film carrier particle property measurement sample table with integrated temperature control according to claim 1, wherein: The air outlet assembly (611) includes several main air outlet nozzles (6111) that are fixedly connected to the top of the main body shell (3) in a circular array. A diversion pipe (6112) is connected through the outer wall of two adjacent main air outlet nozzles (6111). A secondary air outlet nozzle (6113) is connected through the middle of the outer wall of several diversion pipes (6112).

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