AC charging pile PCB low-temperature anti-condensation control system and method

Abstract

The invention discloses an AC charging pile PCB low-temperature anti-condensation control system and method, relates to the technical field of anti-condensation control, and solves the technical problems that real-time changes of environment temperature and humidity and PCB surface temperature need to realize accurate acquisition of sensing data, dynamic calculation of dew point temperature and intelligent adaptive adjustment of a heating strategy. According to the method, the difference between the surface temperature of the PCB and the dew-point temperature is accurately controlled in the high and cold environment by adopting the differentially-arranged sensor array and dynamic sampling frequency adjustment, the dew-point temperature is calculated according to an improved formula, the dew-point temperature calculation error is reduced by combining a moving average filtering technology and a sensor calibration and correction technology, and an accurate basis is provided for a temperature control strategy; a distributed nickel-chromium alloy film heating matrix network is matched with a graded heating control strategy, a drive circuit integrates an energy recovery diode, and the energy utilization rate is increased by the energy feedback recovery rate of a heating resistor inductor.

Description

Technical Field

[0001] This invention relates to the field of anti-condensation control technology, specifically to a low-temperature anti-condensation control system and method for AC charging pile PCBs. Background Technology

[0002] In the field of electric vehicle charging infrastructure, AC charging piles need to adapt to complex outdoor environments. In areas with extremely low temperatures, the diurnal temperature range can cause the surface temperature of the printed circuit board (PCB) of the AC charging pile to lag behind changes in the ambient air temperature. When the PCB surface temperature is below the dew point, moisture in the air will condense into liquid water, causing short circuit faults and affecting the reliability and lifespan of the charging pile.

[0003] According to patent application CN119472614A, a chip high and low temperature aging test chamber anti-condensation control system is disclosed, including a sampling module, a control module, and an execution module. The sampling module includes sensors installed in the high and low temperature test chamber to collect the temperature and humidity of the high and low temperature zone, the insulation zone, and the normal temperature zone of the high and low temperature test chamber, respectively. The sampling results are used by the control module to analyze the condensation risk and to turn the anti-condensation system on or off. The execution module includes an anti-condensation heating belt, a drying compressed air device, and an anti-condensation fan. The execution module performs various anti-condensation measures according to the control of the control module.

[0004] Existing anti-condensation technologies have significant drawbacks: traditional PTC heating element solutions consume a lot of power, making it difficult to meet IEC standard standby power consumption limits; hot air circulation systems require additional duct design, increasing equipment size and the risk of dust accumulation, making them unsuitable for miniaturized AC charging piles; surface coating technologies are prone to material embrittlement and failure below -25℃, resulting in short lifespans and volatile organic compound pollution. Therefore, there is an urgent need to develop a low-power, precise temperature-controlled PCB anti-condensation control system adapted to extreme low-temperature environments. Summary of the Invention

[0005] To address the shortcomings of existing technologies, this invention provides a low-temperature anti-condensation control system and method for AC charging pile PCBs, which solves the problems of real-time changes in ambient temperature and humidity and PCB surface temperature, requiring accurate acquisition of sensor data, dynamic calculation of dew point temperature, and intelligent adaptive adjustment of heating strategies.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a method for controlling low-temperature condensation on the PCB of an AC charging pile, the method specifically comprising the following steps:

[0007] Step 1: Power on and initialize, read the initial temperature and humidity data from the environmental sensor, and load historical operating parameters;

[0008] Step 2: Monitor the ambient temperature and humidity and PCB surface temperature in real time through the sensor module, and calculate the current dew point temperature through the dew point calculation engine;

[0009] Step 3: The control module determines the relationship between the PCB surface temperature and the dew point temperature, and generates first-order, second-order, or third-order heating processing signals;

[0010] Step 4: Analyze the first-order heating processing signal, control the distributed heating matrix network to rapidly increase the temperature with the maximum current, and generate first-order heating processing information;

[0011] Step 5: Analyze the second-order heating processing signal. Based on the temperature difference between the PCB surface temperature and the dew point temperature, perform PID control to generate second-order heating processing information.

[0012] Step 6: Analyze the third-order heating processing signal, control the distributed heating matrix network to maintain the current and retain residual heat, and generate third-order heating processing information.

[0013] As a further aspect of the present invention, the specific method for calculating the current dew point temperature using the dew point calculation engine is as follows:

[0014] One sensor is placed near the PCB inside the charging pile and another is placed at the ventilation opening of the outer shell. Local temperature and humidity deviations are eliminated through spatial redundancy, and the average of the two is taken as the calculation benchmark. Thin film sensors are arranged according to the thermal characteristics of the PCB functional areas. The minimum value priority principle is adopted, and the lowest temperature of the sensor array is taken as the PCB surface temperature benchmark. At the same time, the highest temperature and the average temperature are recorded.

[0015] A moving average was performed on five sets of environmental temperature and humidity data with a 1-second sampling interval to eliminate transient interference, according to the formula. The average temperature was calculated. At the same time, according to the formula The average humidity was calculated. and the calculated average temperature and average humidity As raw data, the dew point temperature is calculated based on the raw data.

[0016] As a further aspect of the present invention, the specific method for calculating the dew point temperature based on the original data is as follows:

[0017] The temperature data is linearly corrected using sensor calibration coefficients, according to the formula. The calibration temperature T was calculated. 校准 K T B is the temperature coefficient. T To offset the zero point, a humidity factor is introduced to correct the humidity data, according to the formula. The calibrated humidity (RH) was calculated.校准 ;

[0018] Then, according to the formula calculate the dew point temperature T on the PCB surface d , where a and b are empirical constants, with a taking the value of 17.625 and b taking the value of 243.04.

[0019] As a further solution of the present invention, the specific method for generating the first-order, second-order or third-order heating treatment signals is as follows:

[0020] Obtain the PCB surface temperature T pcb and the dew point temperature T d . If T pcb < T d -2.0, generate a first-order heating treatment signal. If T d -2.0 ≤ pcb < d + 1.0, generate a second-order heating treatment signal. If T pcb ≥ T d +1.0, generate a third-order heating treatment signal.

[0021] As a further solution of the present invention, the specific method for generating the first-order heating treatment information is as follows:

[0022] Divide the heating matrix into 3 power zones, the core zone, the sub-core zone and the edge zone. Then, automatically adjust the maximum heating current according to the ambient temperature. If the ambient temperature T amb ≥ -30°C, the maximum current is set to I max1 . If the ambient temperature T amb < -30°C, the maximum current is set to I max2 , and the specific values of I max1 and I max2 are set by the operator;

[0023] At the same time, according to the obtained target temperature and dew point temperature on the PCB surface, combine the two to control the heating rate. According to the formula calculate the target temperature T target (t) at time t, where is the attenuation term, is the time constant. At the same time, use the calculated target temperature T target (t) as the standard for heating treatment to generate the first-order heating treatment information.

[0024] As a further solution of the present invention, the specific method for generating the second-order heating treatment information is as follows:

[0025] Obtain the fuzzy input temperature difference , the temperature difference change rate and the ambient humidity gradient According to the formula , , The output is fuzzy, where K p0 K i0 K d0 These are the basic parameters for PID control. , and The adjustment range is calculated based on the fuzzy input. , and The weighting of the adjustment range;

[0026] Analyze the corresponding frequencies and duty cycles under different environments, and establish a corresponding frequency-duty cycle mapping table. Input ( ,RH,T amb The output (PWM frequency, duty cycle) is generated, and second-order heating processing information is generated.

[0027] As a further aspect of the present invention, the specific method for generating the third-order heating treatment information is as follows:

[0028] Based on LSTM neural network, predict the dew point in the next t1 minutes, specifically... T history Historical temperature, RH history For historical humidity, T amb-history Historical environmental temperature, This is the predicted dew point value, then according to the formula... Calculate the holding current I hold 0.5 is the base holding current. To predict the dew point temperature at time t1 in the future, T d The actual dew point temperature is 0.01, which is an adjustment factor, and the calculated holding current I is used. hold The standard is adjusted to generate three-stage heating treatment information.

[0029] A low-temperature anti-condensation control system for AC charging pile PCBs, comprising:

[0030] The information acquisition module is used to read the initial temperature and humidity data of the environmental sensor and the PCB surface temperature, load historical operating parameters, and transmit them to the dew point temperature calculation module.

[0031] Dew point temperature calculation module: This module is used to calculate the corresponding average temperature and average humidity based on the initial temperature and humidity data and the PCB surface temperature, and at the same time, calculate the current dew point temperature based on the two and transmit it to the graded heating control module.

[0032] The graded heating control module compares the relationship between the current dew point temperature and the PCB surface temperature to generate first-order, second-order, and third-order heating processing signals. It analyzes the first-order heating processing signal, controls the distributed heating matrix network to rapidly heat up with maximum current, and generates first-order heating processing information. It analyzes the second-order heating processing signal, performs precise PID control based on the temperature difference between the PCB surface temperature and the dew point temperature, and generates second-order heating processing information. It analyzes the third-order heating processing signal, controls the distributed heating matrix network to maintain current and retain residual heat, and generates third-order heating processing information. Simultaneously, the generated heating processing information is transmitted to the control information output module.

[0033] The control information output module is used to perform corresponding control based on the acquired heating treatment information.

[0034] This invention provides a low-temperature anti-condensation control system and method for AC charging pile PCBs. Compared with the prior art, it has the following advantages:

[0035] This invention achieves precise control of the PCB surface temperature and dew point temperature difference in extremely cold environments by employing a differentiated sensor array and dynamic sampling frequency adjustment. It calculates the dew point temperature using an improved formula, and combines this with moving average filtering and sensor calibration correction techniques to reduce calculation errors and provide a precise basis for temperature control strategies. A distributed nickel-chromium alloy thin-film heating matrix network, coupled with a tiered heating control strategy, integrates energy recovery diodes in the drive circuit, and utilizes the energy feedback recovery rate of the heating resistors and inductors to improve energy utilization. A fuzzy PID control algorithm is introduced, dynamically adjusting PID parameters based on temperature difference, temperature difference change rate, and ambient humidity gradient. An LSTM neural network predicts the dew point temperature change trend over the next 10 minutes, upgrading heating control from passive response to proactive prediction, addressing condensation risks in advance, and improving system response speed and stability. Attached Figure Description

[0036] Figure 1 This is a diagram illustrating the steps and methods of the present invention;

[0037] Figure 2 This is a system block diagram of the present invention. Detailed Implementation

[0038] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0039] Please see Figure 1This application provides a method for controlling low-temperature condensation prevention on the PCB of an AC charging pile, which specifically includes the following steps:

[0040] Step 1: Power-on initialization. The control module reads the initial temperature and humidity data from the environmental sensor and loads historical operating parameters, which are stored in the EEPROM, including PID coefficients, etc.

[0041] After the control module (MCU) is powered on, it first performs kernel initialization, including clock tree configuration, SRAM self-test and peripheral mapping initialization, starts the watchdog timer (WDT) with a timeout of 500ms to ensure that the system can be reset if the initialization process is abnormal, detects the output voltage of the power module, judges the power supply stability by ADC sampling, and enters low power protection mode when the voltage is abnormal.

[0042] The parameter partition table in the EEPROM (storage address 0x0000-0x00FF) is read first to obtain the storage address and length of data such as PID parameters, sensor calibration coefficients, and fault records. The data is then loaded in order of importance: Level 1 parameters (PID coefficients, safety thresholds) → Level 2 parameters (operating mode, historical temperature curves) → Level 3 parameters (log records).

[0043] Step 2: The control module monitors the ambient temperature and humidity and the PCB surface temperature in real time through the sensor module, and calculates the current dew point temperature based on the ambient temperature and humidity data using the dew point calculation engine. The specific calculation method is as follows:

[0044] One sensor is placed near the PCB inside the charging pile and another at the ventilation opening on the outer casing. Spatial redundancy eliminates local temperature and humidity deviations, and the average of the two is used as the calculation benchmark. Specifically, regarding the adjustment of the sampling frequency, if the ambient temperature change rate is >2℃ / min, such as during day-night transitions, the sampling frequency is increased to 1Hz to ensure the capture of rapid temperature and humidity fluctuations; if the ambient temperature change rate is ≤0.5℃ / min, such as during stable low-temperature periods, the sampling frequency is reduced to 0.1Hz to reduce MCU power consumption (standby current can be reduced from 10mA to 2mA). Thin-film sensors are arranged based on the differentiated thermal characteristics of the PCB functional areas. Specifically, in the power supply area, thin-film sensors are placed every 5cm. 2 Deploy one sensor to capture the impact of localized heating on condensation risk, in the communication / metering area, every 10cm. 2 One sensor is deployed to focus on monitoring areas with high incidence of low-temperature condensation, such as edges and corners. Two additional sensors are added to avoid monitoring blind spots. The minimum value priority principle is adopted, and the lowest temperature of the sensor array is used as the PCB surface temperature reference. At the same time, the highest temperature and the average temperature are recorded.

[0045] A moving average was performed on five sets of environmental temperature and humidity data with a 1-second sampling interval to eliminate transient interference, according to the formula. The average temperature is calculated , and at the same time, according to the formula the average humidity is calculated , and the calculated average temperature and average humidity are used as the original data. Then, the temperature data is linearly corrected by using the sensor calibration coefficients stored in the EEPROM. According to the formula the calibrated temperature T 校准 is calculated, where K T is the temperature coefficient, B T is the zero-point offset, which is generated by combining factory calibration and on-site calibration. At the same time, the humidity factor is introduced to correct the humidity data. According to the formula the calibrated humidity RH 校准 is calculated;

[0046] Then, according to the improved Magnus-Tetens formula of the international standard the dew point temperature T d on the PCB surface is calculated, where a and b are empirical constants, and the value of a is 17.625 and the value of b is 243.04.

[0047] Step 3: The control module judges the relationship between the PCB surface temperature and the dew point temperature. When the lowest temperature on the PCB surface is 1°C lower than the dew point temperature, the hierarchical heating operation is started, and the specific operation is as follows:

[0048] When the PCB surface temperature is 2°C lower than the dew point temperature (T pcb <T d - 2.0), the control module controls the distributed heating matrix network to quickly increase the temperature with the maximum current, so that the PCB surface temperature quickly approaches the dew point temperature, and a first-order heating processing signal is generated. When - 2.0°C ≤ PCB surface temperature < dew point temperature + 1.0°C (T d - 2.0 ≤ pcb < d + 1.0), the control module performs precise PID control according to the temperature difference between the PCB surface temperature and the dew point temperature, and generates a second-order heating processing signal. When the PCB surface temperature is 1°C higher than the dew point temperature (T pcb ≥T d + 1.0), the control module controls the distributed heating matrix network to keep the current to maintain the afterheat, and generates a third-order heating processing signal.

[0049] Step 4. The specific method for processing the generated first-order heating processing signal to generate the first-order heating processing information is as follows:

[0050] The heating matrix is ​​divided into three power zones: a core zone, a secondary core zone, and an edge zone. Specifically, the core zone houses the power supply or communication modules, the secondary core zone houses the metering or interface modules, and the edge zone is the perimeter of the PCB. Then, the maximum heating current is automatically adjusted based on the ambient temperature. If the ambient temperature T... amb If the temperature is ≥-30℃, the maximum current is set to I. max1 If the ambient temperature T amb If the temperature is less than -30℃, the maximum current is set to I. max2 , and I max1 and I max2 The specific value is set by the operator, for example, I max1 It is 5.0mA, I max2 The current is 7.0mA. Simultaneously, based on the target PCB surface temperature and dew point temperature, the heating rate is controlled using a combination of these two factors, according to the formula... The target temperature T at time t is calculated. target (t), where, For attenuation term, It is a time constant, and the time constant is It depends on the current PCB surface temperature, specifically Meanwhile, the target temperature T at time t is calculated. target (t) is used as the standard for heating treatment to generate first-order heating treatment information.

[0051] The second-order heating signal is processed using a pulsed heating strategy. The specific method for generating second-order heating processing information through PWM with adjustable duty cycle is as follows:

[0052] Obtaining fuzzy input temperature difference Temperature difference change rate and ambient humidity gradient Next, the output correction amount is obtained based on the fuzzy input, and then the formula is applied. , , The output is fuzzy, where K p0 K i0 K d0 These are the basic parameters for PID control. , and The adjustment range is calculated based on the fuzzy input. , and To adjust the weighting of the amplitude, for example, when the ambient humidity suddenly spikes, specifically... It's very big. If it gets bigger, it will increase K. d (Differential term) rapidly increases heating power to prevent condensation. This occurs when the PCB temperature quickly catches up to the dew point. It is negative, and the absolute value is large. Increasing the value will decrease K. i (Integral term), to avoid overshoot caused by integral saturation;

[0053] Next, analyze the corresponding frequencies and duty cycles under different environments, and establish a corresponding frequency-duty cycle mapping table. Specifically, input ( ,RH,T amb The output (PWM frequency, duty cycle) generates second-order heating processing information, such as temperature. Larger, requiring a higher duty cycle, ambient temperature T amb Extremely low humidity requires higher frequency; high RH requires more aggressive heating.

[0054] The specific method for analyzing the third-order heating processing signal and generating third-order heating processing information is as follows:

[0055] Based on LSTM neural network, predict the dew point in the next t1 minutes, specifically... T history Historical temperature, RH history For historical humidity, T amb-history Historical environmental temperature, This is the predicted dew point value, then according to the formula... Calculate the holding current I hold 0.5 is the base holding current. To predict the dew point temperature at time t1 in the future, T d The actual dew point temperature is 0.01, which is an adjustment factor, and the calculated holding current I is used. hold The standard is adjusted to generate three-stage heating treatment information.

[0056] Example 2

[0057] Please see Figure 2 This application provides a low-temperature anti-condensation control system for AC charging pile PCBs. The system includes an information acquisition module, a dew point temperature calculation module, a graded heating control module, and a control information output module, and is combined with an appendix... Figure 2 It can be seen that the information between the above functional modules is transmitted in one direction only.

[0058] The information acquisition module is used to read the initial temperature and humidity data of the environmental sensor and the PCB surface temperature, load historical operating parameters, and transmit them to the dew point temperature calculation module. The specific processing method is the same as the processing process in step one.

[0059] The dew point temperature calculation module is used to calculate the corresponding average temperature and average humidity based on the initial temperature and humidity data and the PCB surface temperature. At the same time, it calculates the current dew point temperature based on the two and transmits it to the graded heating control module. The specific processing method is the same as the processing process in step two.

[0060] The graded heating control module compares the current dew point temperature with the PCB surface temperature to generate first-order, second-order, and third-order heating processing signals. The specific processing method is the same as in step three. The first-order heating processing signal is analyzed, and the distributed heating matrix network is controlled to rapidly heat up with the maximum current to generate first-order heating processing information. The second-order heating processing signal is analyzed, and precise PID control is performed based on the temperature difference between the PCB surface temperature and the dew point temperature to generate second-order heating processing information. The third-order heating processing signal is analyzed, and the distributed heating matrix network is controlled to maintain the current and retain residual heat to generate third-order heating processing information. At the same time, the generated heating processing information is transmitted to the control information output module, and the specific processing method is the same as in step four.

[0061] The control information output module is used to perform corresponding control based on the acquired heating treatment information.

[0062] The data in the above formulas are all calculated using numerical values, without substituting the units of the parameters. In addition, the contents not described in detail in this specification are all prior art known to those skilled in the art.

[0063] The above embodiments are only used to illustrate the technical methods of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical methods of the present invention without departing from the spirit and scope of the technical methods of the present invention.

Claims

1. A method for controlling low-temperature condensation prevention on the PCB of an AC charging pile, characterized in that, The method specifically includes the following steps: Step 1: Power on and initialize, read the initial temperature and humidity data from the environmental sensor, and load historical operating parameters; Step 2: Monitor the ambient temperature and humidity and PCB surface temperature in real time through the sensor module, and calculate the current dew point temperature through the dew point calculation engine; Step 3: The control module determines the relationship between the PCB surface temperature and the dew point temperature, and generates first-order, second-order, or third-order heating processing signals; Step 4: Analyze the first-order heating processing signal, control the distributed heating matrix network to rapidly increase the temperature with the maximum current, and generate first-order heating processing information; Step 5: Analyze the second-order heating processing signal. Based on the temperature difference between the PCB surface temperature and the dew point temperature, perform PID control to generate second-order heating processing information. Step 6: Analyze the third-order heating processing signal, control the distributed heating matrix network to maintain the current and retain residual heat, and generate third-order heating processing information.

2. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 1, characterized in that, The specific method for calculating the current dew point temperature using the dew point calculation engine is as follows: One sensor is placed near the PCB inside the charging pile and another is placed at the ventilation opening of the outer shell. Local temperature and humidity deviations are eliminated through spatial redundancy, and the average of the two is taken as the calculation benchmark. Thin film sensors are arranged according to the thermal characteristics of the PCB functional areas. The minimum value priority principle is adopted, and the lowest temperature of the sensor array is taken as the PCB surface temperature benchmark. At the same time, the highest temperature and the average temperature are recorded. A moving average was performed on five sets of environmental temperature and humidity data with a 1-second sampling interval to eliminate transient interference, according to the formula. The average temperature was calculated. At the same time, according to the formula The average humidity was calculated. and the calculated average temperature and average humidity As raw data, the dew point temperature is calculated based on the raw data.

3. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 2, characterized in that, The specific method for calculating the dew point temperature based on the raw data is as follows: The temperature data is linearly corrected using sensor calibration coefficients, according to the formula. The calibration temperature T was calculated. 校准 K T B is the temperature coefficient. T To offset the zero point, a humidity factor is introduced to correct the humidity data, according to the formula. The calibrated humidity (RH) was calculated. 校准 ; Next, according to the formula The dew point temperature T on the PCB surface was calculated. d , where a and b are empirical constants, with a taking the value of 17.625 and b taking the value of 243.

04.

4. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 1, characterized in that, The specific method for generating first-order, second-order, or third-order heating processing signals is as follows: Obtain when the PCB surface temperature T pcb and the dew point temperature T d , if T pcb < T d -2.0, generate a first-order heating treatment signal, if T d -2.0 ≤ pcb < d + 1.0, generate a second-order heating treatment signal, if T pcb ≥ T d +1.0 generate a third-order heating treatment signal.

5. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 1, characterized in that, The specific method for generating the first-order heating processing information is as follows: The heating matrix is ​​divided into three power zones: a core zone, a secondary core zone, and an edge zone. Then, the maximum heating current is automatically adjusted based on the ambient temperature. If the ambient temperature T... amb If the temperature is ≥-30℃, the maximum current is set to I. max1 If the ambient temperature T amb If the temperature is less than -30℃, the maximum current is set to I. max2 , and I max1 and I max2 The specific values ​​are set by the operator; Simultaneously, based on the obtained target temperature and dew point temperature of the PCB surface, the heating rate is controlled according to the formula. The target temperature T at time t is calculated. target (t), where, For attenuation term, The time constant is used, and the target temperature T at time t is calculated. target (t) is used as the standard for heating treatment to generate first-order heating treatment information.

6. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 1, characterized in that, The specific method for generating the second-order heating processing information is as follows: Obtaining fuzzy input temperature difference Temperature difference change rate and ambient humidity gradient According to the formula , , The output is fuzzy, where K p0 K i0 K d0 These are the basic parameters for PID control. , and The adjustment range is calculated based on the fuzzy input. , and The weighting of the adjustment range; Analyze the corresponding frequencies and duty cycles under different environments, and establish a corresponding frequency-duty cycle mapping table. Input ( ,RH,T amb The output (PWM frequency, duty cycle) is generated, and second-order heating processing information is generated.

7. The method for controlling low-temperature condensation prevention on the PCB of an AC charging pile according to claim 1, characterized in that, The specific method for generating the third-order heating processing information is as follows: Based on LSTM neural network, predict the dew point in the next t1 minutes, specifically... T history Historical temperature, RH history For historical humidity, T amb-history Historical environmental temperature, This is the predicted dew point value, then according to the formula... Calculate the holding current I hold 0.5 is the base holding current. To predict the dew point temperature at time t1 in the future, T d The actual dew point temperature is 0.01, which is an adjustment factor, and the calculated holding current I is used. hold The standard is adjusted to generate three-stage heating treatment information.

8. A low-temperature anti-condensation control system for AC charging pile PCBs, executed by the low-temperature anti-condensation control method for AC charging pile PCBs according to any one of claims 1-7, characterized in that, include: The information acquisition module is used to read the initial temperature and humidity data of the environmental sensor and the PCB surface temperature, load historical operating parameters, and transmit them to the dew point temperature calculation module. Dew point temperature calculation module: This module is used to calculate the corresponding average temperature and average humidity based on the initial temperature and humidity data and the PCB surface temperature, and at the same time, calculate the current dew point temperature based on the two and transmit it to the graded heating control module. The graded heating control module compares the relationship between the current dew point temperature and the PCB surface temperature to generate first-order, second-order, and third-order heating processing signals. It analyzes the first-order heating processing signal, controls the distributed heating matrix network to rapidly heat up with maximum current, and generates first-order heating processing information. It analyzes the second-order heating processing signal, performs precise PID control based on the temperature difference between the PCB surface temperature and the dew point temperature, and generates second-order heating processing information. It analyzes the third-order heating processing signal, controls the distributed heating matrix network to maintain current and retain residual heat, and generates third-order heating processing information. Simultaneously, the generated heating processing information is transmitted to the control information output module. The control information output module is used to perform corresponding control based on the acquired heating treatment information.

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