Chip bonding apparatus and semiconductor device
By incorporating a drive unit, a transmission guide unit, and a rotation unit into the chip bonding device, and combining a single guide structure with a needle roller guide assembly, the problems of decreased guiding accuracy and large space occupation are solved, achieving high-precision chip alignment and miniaturized design.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- 智慧星空(上海)工程技术有限公司
- Filing Date
- 2026-01-13
- Publication Date
- 2026-05-19
AI Technical Summary
Existing chip bonding devices are prone to slight vibration and displacement due to increased gap under long-term high-frequency operation, resulting in decreased guiding accuracy and difficulty in meeting submicron-level alignment accuracy requirements. Furthermore, their loose structural layout occupies a large space, which is not conducive to the miniaturization and integration of the equipment.
The device employs a drive unit, transmission guide unit, rotation unit, and adsorption unit arranged sequentially along a third direction, combined with a single guide component structure and a needle roller guide assembly, to achieve high-precision linear motion and rotation, reduce the lateral space occupied by the device, and enhance guiding accuracy and angle compensation capability.
It achieves high-precision chip alignment and flatness requirements, reduces the lateral space occupied by the device, and contributes to the miniaturization design of the equipment and efficient process execution.
Smart Images
Figure CN121510905B_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor equipment technology, and more particularly to a chip bonding apparatus and semiconductor equipment. Background Technology
[0002] In semiconductor packaging processes, chip bonding devices are used to achieve high-precision alignment and bonding between chips and substrates. Their guiding accuracy directly affects the consistency of bonding positions and packaging reliability. Existing chip bonding equipment's guiding structure is prone to slight vibrations and misalignments due to increased gaps under long-term high-frequency motion, leading to decreased guiding accuracy and failing to meet the sub-micron alignment accuracy requirements of advanced packaging processes. Furthermore, the structural layout of existing chip bonding devices is relatively loose, with the transmission and guiding components occupying a large space, which is detrimental to the overall miniaturization and integration design of the equipment. Therefore, there is an urgent need for a bonding device that can achieve high rigidity, low vibration, and maintain stable guiding accuracy over a limited space to meet the ever-increasing demands for packaging density and process efficiency. Summary of the Invention
[0003] This application provides a chip bonding apparatus and semiconductor device. By sequentially arranging a driving unit, a transmission guiding unit, a rotating unit, and an adsorption unit along a third direction, the adsorption unit achieves high-precision linear motion along the third direction and precise rotation about an axis parallel to the third direction. This structure not only compensates for the angle of the chip adsorbed by the adsorption unit, meeting the alignment accuracy and flatness requirements of semiconductor processes such as bonding, but also, the guiding component in the transmission guiding unit adopts a single guiding element structure, reducing the lateral space occupied by the device while ensuring guiding accuracy, which is beneficial for miniaturization design.
[0004] To achieve the above objectives, according to a first aspect of this application, a chip bonding apparatus is provided, comprising:
[0005] Adsorption unit, used to adsorb and pick up / place chips;
[0006] The drive unit is used to provide driving force;
[0007] A transmission and guiding unit is disposed between the driving unit and the adsorption unit. It includes a transmission component and a guiding component. The transmission component is connected to the output end of the driving unit and is used to convert the rotational motion output by the driving unit into linear motion of the adsorption unit along a third direction. The guiding component is connected to the transmission component and is used to constrain the linear motion of the adsorption unit.
[0008] A rotating unit is located between the transmission guide unit and the adsorption unit, and is used to drive the adsorption unit to rotate around an axis parallel to a third direction.
[0009] The guide component is a single guide structure.
[0010] According to a second aspect of this application, a semiconductor device is also provided, including the chip bonding apparatus described in the above technical solution.
[0011] In the chip bonding apparatus of this application embodiment, the above technical solution has at least the following beneficial effects: by sequentially arranging the driving unit, transmission guiding unit, rotation unit, and adsorption unit along a third direction, high-precision linear motion of the adsorption unit along the third direction and precise rotation about an axis parallel to the third direction are achieved. This structure can not only compensate for the angle of the chip adsorbed by the adsorption unit, meeting the requirements of high alignment accuracy and high flatness of chips in semiconductor processes such as bonding, but also, the guiding component in the transmission guiding unit adopts a single guiding component structure, which reduces the lateral space occupied by the device while ensuring guiding accuracy, which is beneficial to the miniaturization design of the equipment.
[0012] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description
[0013] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0014] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.
[0015] Figure 1 This is one of the overall structural schematic diagrams of the chip bonding apparatus provided in the embodiments of this disclosure;
[0016] Figure 2 This is the second schematic diagram of the overall structure of the chip bonding device provided in the embodiments of this disclosure;
[0017] Figure 3 yes Figure 2 An enlarged 3D schematic diagram of part A in the middle;
[0018] Figure 4 yes Figure 2 Enlarged schematic diagram of part B;
[0019] Figure 5 This is the third schematic diagram of the overall structure of the chip bonding device provided in the embodiments of this disclosure;
[0020] Figure 6This is a top view schematic diagram of the third position detection component provided in the embodiments of this disclosure;
[0021] Figure 7 yes Figure 2 An enlarged schematic diagram of section C;
[0022] Figure 8 This is a cross-sectional view of the adsorption unit of the chip bonding apparatus provided in this embodiment along a third direction.
[0023] Explanation of reference numerals in the attached figures:
[0024] 1-Chip bonding device;
[0025] 10-Adsorption unit; 11-Suction cup; 111-Protrusion; 112-Flat surface; 113-Permanent magnet; 12-Suction cup adapter plate; 121-Positioning groove; 122-Magnetic guide block;
[0026] 20-Drive unit; 21-Motor; 22-Coupling;
[0027] 30-Transmission guide unit; 31-Transmission assembly; 311-Lead screw; 3111-First end; 312-Nut; 313-Connector; 314-Bearing mounting seat; 32-Guide assembly; 321-Guide shaft; 3211-Hollow channel; 322-Needle roller guide sleeve; 3221-Needle roller; 323-Elastic element; 33-Cover;
[0028] 40 - Rotary unit; 41 - Rotary table adapter plate; 42 - Rotary table;
[0029] 50 - Force control unit; 51 - Force sensor;
[0030] 60-Position detection unit; 61-First position detection component; 611-Support base; 612-Scale; 613-Reading head; 62-Second position detection component; 621-First photoelectric switch; 622-Second photoelectric switch; 623-Light shield; 63-Third position detection component; 631-First displacement sensor; 632-Second displacement sensor;
[0031] 70 - Attitude adjustment unit; 71 - Base; 711 - Through hole; 72 - Elastic component; 721 - First support part; 722 - Second support part; 723 - Spring; 73 - Differential head;
[0032] 8- Mounting substrate;
[0033] X - First direction; Y - Second direction; Z - Third direction. Detailed Implementation
[0034] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0035] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.
[0036] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.
[0037] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.
[0038] This application provides a chip bonding apparatus and a semiconductor device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.
[0039] Please see Figure 1A chip bonding apparatus 1 according to this application includes: an adsorption unit 10 for adsorbing and picking up / placing chips; a driving unit 20 for providing driving force; a transmission and guiding unit 30 disposed between the driving unit 20 and the adsorption unit 10, including a transmission component 31 and a guiding component 32. The transmission component 31 is connected to the output end of the driving unit 20 and is used to convert the rotational motion output by the driving unit 20 into linear motion of the adsorption unit 10 along a third direction (the Z direction is defined as the third direction in this application). The guiding component 32 is connected to the transmission component 31 and is used to constrain the linear motion of the adsorption unit 10; and a rotation unit 40 disposed between the transmission and guiding unit 30 and the adsorption unit 10 for driving the adsorption unit 10 to rotate around an axis parallel to the third direction. The guiding component 32 is a single guiding member structure.
[0040] In this technical solution, the drive unit 20 serves as a power source, and its output end 211 is connected to the transmission component 31 in the transmission guide unit 30 via a coupling 22. The transmission component 31 inside the transmission guide unit 30 is connected to the guide component 32, which is connected to the rotating unit 40. The rotating unit 40 is then connected to the adsorption unit 10, thus forming a complete motion transmission path from the drive unit 20 to the adsorption unit 10. During operation, the drive unit 20 outputs rotational motion, which is converted into linear motion along the Z direction via the transmission component 31. The guide component 32 then constrains and guides the linear motion, ensuring that the adsorption unit 10 can achieve high-precision, low-vibration displacement along the Z direction. The guide component 32 adopts a single-guide structure. Compared to the traditional multi-guide shaft structure, the single-guide shaft structure can reduce the lateral space occupied by the device while ensuring guiding accuracy, which is beneficial for miniaturization design. Simultaneously, the single-guide structure reduces assembly clearance. Furthermore, the rotating unit 40 can independently drive the adsorption unit 10 to rotate around an axis parallel to the Z direction (i.e., perform Rz rotation), thereby compensating for the orientation of the chip adsorbed by the adsorption unit 10 to meet the requirements of subsequent semiconductor processes such as bonding for chip alignment accuracy and flatness. It is understood that the specific structure of the single guide can be selected according to actual needs, including but not limited to rigid guide elements such as guide rods and guide shafts extending along a third direction.
[0041] Therefore, this application adopts the above design, which, through the sequential arrangement of the driving unit 20, transmission guide unit 30, rotation unit 40, and adsorption unit 10 along the third direction, achieves high-precision linear motion of the adsorption unit 10 along the Z direction and precise rotation around the Z axis. This structure can not only compensate for the angle of the chip adsorbed by the adsorption unit 10, meeting the alignment accuracy and flatness requirements of semiconductor processes such as bonding, but also, the guide component 32 in the transmission guide unit 30 adopts a single guide shaft structure, which reduces the lateral space occupied by the device while ensuring guidance accuracy, thus facilitating the miniaturization design of the device.
[0042] It is understood that the drive unit 20 includes a motor 21, the specific type of which can be selected according to actual needs, and its core function is to provide the required power output.
[0043] Please see Figure 1 , Figure 2 and Figure 3 The guide assembly 32 in the transmission guide unit 30 includes a guide shaft 321, a needle roller guide sleeve 322, and an elastic element 323. The guide shaft 321 extends along a third direction and has an axially penetrating hollow channel 3211 inside. The needle roller guide sleeve 322 is sleeved on the outer peripheral surface of the guide shaft 321, and has multiple needle rollers 3221 distributed circumferentially thereon. Each needle roller 3221 makes rolling contact with the outer peripheral surface of the guide shaft 321 and constrains the movement of the guide shaft 321. The elastic element 323 is sleeved on the outer peripheral surface of the guide shaft 321 and is closer to the adsorption unit 10 than the needle roller guide sleeve 322.
[0044] In this technical solution, the guide shaft 321 in the guide assembly 32 adopts a prism structure extending along the Z direction, and both ends of the guide shaft 321 are open, forming a hollow channel 3211 that runs through along the Z direction inside. Compared with a cylindrical guide shaft, this prism structure can effectively restrict the rotation of the guide shaft 321 around its own axis, thereby ensuring the linear motion accuracy of the guide shaft 321 along the Z direction. A needle roller guide sleeve 322 is sleeved on the outer circumferential surface of the guide shaft 321. Multiple needle rollers 3221 are evenly distributed circumferentially on the needle roller guide sleeve 322, and each needle roller 3221 is embedded in the body of the needle roller guide sleeve 322. When the guide shaft 321 moves along the Z direction, the needle roller guide sleeve 322 moves synchronously. At this point, the needle roller 3221 forms a rolling contact with the outer circumferential surface of the guide shaft 321. Compared with the traditional ball bearing guide structure, the needle roller 3221 and the guide shaft 321 have a larger contact area and a more uniform stress distribution, which helps to improve the rigidity of the guide assembly 32, suppress vibration, and further improve the guiding accuracy of the guide assembly 32. Simultaneously, the needle roller 3221 and the guide shaft 321 operate through rolling friction, resulting in low friction between them. This not only facilitates smooth motion transmission through the guide shaft 321 but also improves transmission efficiency and extends the service life of the guide assembly 32. Furthermore, an elastic element 323 is fitted onto the guide shaft 321. This elastic element 323 is located below the needle roller guide sleeve 322, providing elastic support for the needle roller guide sleeve 322 and preventing it from slipping or falling off due to long-term use or vibration. This avoids affecting the accuracy of the guide assembly 32 due to displacement of the needle roller guide sleeve 322 and reduces the risk of interference with other components.
[0045] Furthermore, a cover 33 is fitted over the guide assembly 32. The cover 33 has through holes inside that are adapted to the structure of the guide assembly 32. These holes are used to limit the rotation or offset of the guide assembly 32 during movement, thereby maintaining the guiding accuracy of the guide assembly 32. At the same time, the cover 33 can effectively prevent dust, grease, lubricating oil and other particulate matter from escaping outward, preventing them from contaminating critical components such as chips.
[0046] Therefore, this application adopts the above design, which effectively improves the overall rigidity of the guide assembly 32 and suppresses vibration through the coordinated cooperation of the needle roller guide sleeve 322 and the guide shaft 321, thereby improving the guiding accuracy. At the same time, the added elastic element 323 can provide stable elastic support for the needle roller guide sleeve 322, preventing it from slipping or falling off during long-term use or under vibration, thereby avoiding the impact of the needle roller guide sleeve 322 displacement on the guiding accuracy and reducing the risk of interference with other components.
[0047] It is understood that the inner diameter of the needle roller guide sleeve 322 matches the outer diameter of the guide shaft 321, so that the needle roller guide sleeve 322 can be stably fitted onto the guide shaft 321. Furthermore, the specific type of the elastic element 323 can be selected according to actual structural requirements; for example, a helical spring, disc spring, or wave spring can be used. Its core function is to possess appropriate elastic properties to reliably provide continuous support for the needle roller guide sleeve 322.
[0048] Please see Figure 1 , Figure 2 and Figure 4 The transmission component 31 in the transmission guide unit 30 includes: a lead screw 311, the first end of which 3111 is connected to the output end of the drive unit 20 for receiving rotational power, and the lead screw 311 is at least partially housed in the hollow channel 3211 of the guide component 32; a nut 312, which is threadedly connected to the outer periphery of the lead screw 311; and a connector 313, which connects the nut 312 and the guide shaft 321 so that the guide shaft 321 moves linearly synchronously with the nut 312.
[0049] In this technical solution, the transmission assembly 31 includes a lead screw 311, a nut 312, and a connector 313. The first end 3111 of the lead screw 311 is connected to the output end 211 of the drive unit 20 via a coupling 22 to receive the rotational motion output by the drive unit 20. Simultaneously, the first end 3111 of the lead screw 311 is supported by a bearing mounting seat 314 to ensure its rotational stability. The nut 312 is sleeved on the outer circumference of the lead screw 311 and forms a helical transmission pair with the lead screw 311 through a threaded engagement, thereby converting the rotational motion of the lead screw 311 into the linear motion of the nut 312. The second end of the lead screw 311 extends along its axial direction (Z-direction) and passes through the hollow channel 3211 inside the guide shaft 321, so that the transmission assembly 31 and the guide assembly 32 are integrated along the same axis. This design effectively reduces the lateral dimension of the device, which is beneficial for miniaturization. Nut 312 is fixedly connected to guide shaft 321 through connector 313, so that guide shaft 321 can move linearly synchronously with nut 312.
[0050] Therefore, this application adopts the above design, integrating the transmission component 31 and the guide component 32 in the transmission guide unit 30 coaxially along the Z direction, so that the transmission axis and the guide axis coincide, reducing the lateral space occupied by the device, and helping to achieve the miniaturization and compact layout of the device.
[0051] It is understood that the transmission component 31 can be selected according to actual transmission requirements, for example, a ball screw or other suitable transmission form can be used.
[0052] Please see Figure 1The chip bonding device also includes a force control unit 50, which includes a force sensor 51. The force sensor 51 is connected in series between the transmission guide unit 30 and the rotation unit 40 to detect the force applied to the chip.
[0053] In this technical solution, the force sensor 51 in the force control unit 50 is positioned between the transmission guide unit 30 and the rotation unit 40. Compared to the drive unit 20 and the transmission guide unit 30, the force control unit 50 is closer to the adsorption unit 10 to reduce interference from the intermediate structure on the force signal and improve response speed and accuracy. When the transmission guide unit 30 drives the adsorption unit 10 to move along the Z direction, causing the chip adsorbed by the adsorption unit 10 to contact the substrate, the force sensor 51 detects the contact force generated between the chip and the substrate in real time and outputs a corresponding force feedback signal. Based on this feedback signal, the force control unit 50 implements closed-loop control, dynamically adjusting the output of the drive unit 20 to keep the actual bonding force stable within the preset process range. The force control unit 50 can effectively avoid chip damage due to overpressure or bonding defects due to insufficient pressure, thereby ensuring high precision and high reliability of the bonding process.
[0054] Please see Figure 1 The rotating unit 40 includes: a rotating table adapter plate 41, fixed to the side of the force sensor 51 near the adsorption unit 10; and a rotating table 42, rotatably mounted on the rotating table adapter plate 41 and fixedly connected to the adsorption unit 10, so as to drive the adsorption unit 10 to rotate around an axis parallel to the third direction.
[0055] In this technical solution, a rotating unit 40 is positioned between a force control unit 50 and an adsorption unit 10. A rotating stage adapter plate 41 is fixed to the side of the force sensor 51 in the force control unit 50 closest to the adsorption unit 10. A rotating stage 42 is rotatably supported on the rotating stage adapter plate 41 and fixedly connected to the adsorption unit 10. The rotating unit 40 drives the adsorption unit 10 to rotate around a third-dimensional axis, thereby precisely adjusting the angular position of the adsorbed chip to compensate for angular alignment deviations between the chip and the substrate, meeting the high requirements of semiconductor processes such as bonding for angular alignment accuracy and planar fit. Furthermore, when the workpiece stage used to support the substrate has limited travel or insufficient positioning accuracy in angular adjustment, by setting a high-precision rotating unit 40 above the adsorption unit 10, fine angular alignment of the chip can be completed independently without relying on the angular movement of the workpiece stage. This design not only expands the total angular adjustment range of the system but also significantly improves the final alignment accuracy through high-resolution closed-loop control at the upper level, effectively addressing the stringent requirements of complex bonding processes for angular alignment.
[0056] It is understood that the rotating unit 40 can be directly fixed to the force control unit 50, or it can be indirectly connected to the force control unit 50 through an adapter or the like. The aforementioned adapter plate is used to achieve structural adaptation, ease of assembly, or adjustment of preload without affecting the accurate transmission of force.
[0057] Please see Figure 1 , Figure 5 and Figure 6 The chip bonding apparatus further includes a position detection unit 60, which includes:
[0058] The first position detection component 61 includes: a scale 612 fixed to the support base 611 and a reading head 613 disposed opposite to the scale 612 with a predetermined gap. The first position detection component 61 is configured to detect the displacement of the adsorption unit 10 in a third direction.
[0059] The second position detection component 62 includes: a first photoelectric switch 621 and a second photoelectric switch 622 fixed to the mounting substrate 8 and spaced apart along a third direction; and a light-shielding sheet 623 fixed to the transmission guide unit 30 and moving between the first photoelectric switch 621 and the second photoelectric switch 622 with the transmission guide unit 30. The second position detection component 62 is configured to determine the movement direction or movement limit position of the adsorption unit 10 along a third direction.
[0060] The third position detection component 63 includes: a first displacement sensor 631 arranged on the first direction (X direction is defined as the first direction in this application) side of the adsorption unit 10, and a second displacement sensor 632 arranged on the second direction (Y direction is defined as the second direction in this application) side of the adsorption unit 10. The third position detection component 63 is configured to detect the displacement of the adsorption unit 10 along the first direction and the second direction.
[0061] In this technical solution, the first position detection component 61 in the position detection unit 60 is used to detect the displacement of the adsorption unit 10 along the Z direction, and includes a scale 612 and a reading head 613. A support base 611 for mounting the scale 612 is disposed between the transmission guide unit 30 and the force control unit 50, and moves synchronously with both along the Z direction. The scale 612 is fixed to the side wall of the support base 611 and extends along the Z direction. The reading head 613 is fixed to the mounting base 8 and maintains a predetermined gap with and is positioned opposite to the scale 612. When the drive unit 20 and the transmission guide unit 30 drive the adsorption unit 10 to move along the Z direction, the scale 612 moves accordingly, and the reading head 613 outputs a corresponding displacement signal in real time. Based on this displacement signal, the control system implements closed-loop feedback control on the drive unit 20, dynamically adjusting the movement of the transmission guide unit 30, thereby precisely controlling the position of the adsorption unit 10 and achieving high-precision Z-direction positioning and trajectory tracking.
[0062] The second position detection component 62 in the position detection unit 60 is used to detect the limit position of the adsorption unit 10 along the Z direction and to assist in determining the direction of movement of the adsorption unit 10. The second position detection component 62 includes a first photoelectric switch 621, a second photoelectric switch 622, and a light-shielding plate 623. The first photoelectric switch 621 and the second photoelectric switch 622 are both fixed on the mounting substrate 8 and arranged at intervals along the Z direction, with the first photoelectric switch 621 located above and the second photoelectric switch 622 located below. The light-shielding plate 623 is fixed to the nut 312 in the transmission guide unit 30, moves synchronously with the adsorption unit 10 along the Z direction, and can sequentially block the photosensitive areas of the first photoelectric switch 621 and the second photoelectric switch 622.
[0063] When the light-shielding plate 623 blocks the first photoelectric switch 621, its output signal changes (e.g., from on to off), and the control system determines that the adsorption unit 10 has reached the upper limit position in the Z direction. Similarly, when the light-shielding plate 623 blocks the second photoelectric switch 622, the control system determines that the adsorption unit 10 has reached the lower limit position in the Z direction based on the change in its output signal. The above signal changes can serve as a soft limit, thereby effectively preventing the adsorption unit 10 from colliding with or interfering with the movement of other components inside the equipment due to overtravel.
[0064] Furthermore, by detecting the sequence of changes in the output states of the first photoelectric switch 621 and the second photoelectric switch 622, the direction of movement of the adsorption unit 10 can be determined. Specifically: if the second photoelectric switch 622 is blocked first (the indicator light changes from on to off), and then the first photoelectric switch 621 is blocked (the indicator light changes from on to off), then the adsorption unit 10 is determined to be moving in the positive direction of the Z direction (i.e., moving upward); if the first photoelectric switch 621 is unblocked first (the indicator light changes from off to on), and then the second photoelectric switch 622 is unblocked again (the indicator light changes from off to on), then the adsorption unit 10 is determined to be moving in the negative direction of the Z direction (i.e., moving downward).
[0065] The third position detection component 63 in the position detection unit 60 is used to detect in real time the parasitic offsets in the X and Y directions generated by the adsorption unit 10 during its movement along the Z direction. Although the transmission guide unit 30 provides high-precision Z-direction guidance for the adsorption unit 10, due to factors such as mechanical assembly errors, guide gaps, or dynamic disturbances, the adsorption unit 10 inevitably generates micron-level or even submicron-level lateral (X and Y direction) offsets when moving in the Z direction. Therefore, a first displacement sensor 631 and a second displacement sensor 632 are respectively installed in the X and Y directions of the adsorption unit 10. The first displacement sensor 631 and the second displacement sensor 632 are located around the adsorption unit 10, ensuring that the distance between the two displacement sensors and the adsorption unit 10 is within the effective measurement range of each displacement sensor. When the adsorption unit 10 experiences an X or Y direction offset, the first displacement sensor 631 and the second displacement sensor 632 output corresponding displacement signals in real time. Based on the offset in the X and Y directions, the control system drives the lower workpiece stage to perform a reverse compensation movement, ensuring that the substrate and chip remain precisely aligned, thereby improving the alignment accuracy and yield of the bonding process. It is understood that the first displacement sensor 631 and the second displacement sensor 632 are preferably capacitive displacement sensors.
[0066] Please see Figure 1 , Figure 2 , Figure 4 and Figure 7 The chip bonding apparatus further includes: a mounting substrate 8, a transmission guide unit 30 fixed to the mounting substrate 8; and an attitude adjustment unit 70 disposed on the mounting substrate 8. The attitude adjustment unit 70 drives the mounting substrate 8 to swing around the axis of the second direction to adjust the attitude of the transmission guide unit 30 and the adsorption unit 10 fixed on the mounting substrate 8.
[0067] In this technical solution, the bearing mounting seat 314 of the transmission guide unit 30 is fixedly mounted on the mounting substrate 8. The attitude adjustment unit 70 is disposed on the side of the mounting substrate 8 and is configured to drive the mounting substrate 8 to swing at a small angle around an axis parallel to the Y direction. Since the adsorption unit 10 and the transmission guide unit 30 are connected, the adsorption unit 10 and the transmission guide unit 30 swing synchronously with the mounting substrate 8, thereby achieving fine adjustment of the attitude of the adsorption unit 10. This attitude adjustment mechanism can be used to correct the attitude of a single chip bonding device 1; on the other hand, in a semiconductor device containing multiple chip bonding devices 1, if the devices share the same mounting substrate 8 or are connected by a linkage mechanism, the attitude consistency between multiple chip bonding devices 1 can be ensured, improving the process uniformity and alignment accuracy of multi-chip synchronous bonding.
[0068] It is understood that the attitude adjustment unit 70 can be installed at the end or bottom of the mounting substrate 8, as long as its output end can apply an effective adjustment torque around the Y direction to the mounting substrate 8, thus achieving fine-tuning of the attitude of the adsorption unit 10. In practical applications, its specific installation position can be optimized according to the internal space layout of the equipment, the distribution of the center of gravity, and the adjustment sensitivity requirements.
[0069] Please see Figure 7 The attitude adjustment unit 70 includes: a base 71, which is fixedly disposed on the side of the mounting substrate 8 and has a through hole 711 thereon; an elastic component 72, which includes a first support portion 721 disposed on the mounting substrate 8, a second support portion 722 disposed on the base 71, and a spring 723 connected between the first support portion 721 and the second support portion 722; and a micrometer head 73, which is screwed into the through hole 711 of the base 71. By screwing the micrometer head 73, the end of the micrometer head 73 is made to contact or move away from the mounting substrate 8, so as to drive the mounting substrate 8 to swing around the axis of the second direction.
[0070] In this technical solution, the attitude adjustment unit 70 includes a base 71, an elastic component 72, and a micro-head 73. The base 71 is fixed to the side of the mounting substrate 8, and has a through hole 711 inside to accommodate the micro-head 73. The elastic component 72 includes a first support portion 721, a second support portion 722, and a spring 723. The first support portion 721 is fixed to the mounting substrate 8, the second support portion 722 is fixed to the base 71, and the spring 723 connects the first support portion 721 and the second support portion 722 to provide a restoring elastic force for the mounting substrate 8. The micro-head 73 passes through the through hole 711, and its end has a ball head that acts on the side wall of the mounting substrate 8. When the micro-head 73 is screwed in, the ball head pushes against the mounting substrate 8, causing it to partially deflect. The mounting substrate 8, together with the transmission guide unit 30 and the adsorption unit 10 on it, rotates counterclockwise around the Y direction. At this time, the spring 723 is stretched and stores elastic potential energy. When the micro-head 73 is unscrewed, the pushing force decreases, the spring 723 releases energy, and pulls the mounting substrate 8 back to its original position. The mounting substrate 8, together with the transmission guide unit 30 and the adsorption unit 10 on it, rotates clockwise around the Y direction, thereby achieving bidirectional fine adjustment of the attitude of the adsorption unit 10. By adjusting the screw-in depth of the micro-head 73, the tilt angle of the mounting substrate 8 can be precisely controlled, thereby correcting the perpendicularity of the adsorption unit 10 relative to the ideal horizontal plane, meeting the requirements of high-precision bonding processes for chip bonding attitude.
[0071] Please see Figure 8The adsorption unit 10 includes: a suction cup 11, including a protrusion 111 and a flat surface 112, with a plurality of permanent magnets 113 disposed on the flat surface 112, the plurality of permanent magnets 113 being evenly distributed at the center of the suction cup 11; and a suction cup adapter plate 12, including a positioning groove 121 and a magnetic block 122, the positioning groove 121 being adapted to and engaged with the protrusion 111, and each magnetic block 122 being disposed opposite to the corresponding permanent magnet 113 along a third direction.
[0072] In this technical solution, the suction cup 11 is connected to the rotating unit 40 via a suction cup adapter plate 12. The suction cup 11 has a first surface and a second surface, the second surface being used for vacuum adsorption of the chip, and the first surface being used for docking and mounting with the suction cup adapter plate 12. Specifically, the first surface of the suction cup 11 includes a protrusion 111 and a flat surface 112. The protrusion 111 engages with and locks into the positioning groove 121 on the suction cup adapter plate 12, achieving precise positioning of the suction cup 11 on the suction cup adapter plate 12. A plurality of permanent magnets 113 are embedded in the flat surface 112, and the suction cup adapter plate 12 contains magnetically conductive blocks 122 corresponding to the positions of each permanent magnet 113. In the assembled state, the permanent magnets 113 and the magnetically conductive blocks 122 are aligned along the Z-direction (thickness direction) to form a closed magnetic circuit, generating a stable magnetic attraction force. The magnetic attraction force serves as an auxiliary holding force for mechanical engagement. In the event of an unexpected failure of the vacuum adsorption system, it can prevent the suction cup 11 from falling off due to gravity or inertia, thereby avoiding collision damage to the substrate below or other precision components and improving the safety and reliability of the equipment operation.
[0073] In some embodiments of this application, a semiconductor device is also provided, which includes the chip bonding apparatus described in any of the above technical solutions. Since the chip bonding apparatus in this semiconductor device has the same technical features as the aforementioned chip bonding apparatus, both can solve the same technical problems and achieve the same technical effects.
[0074] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.
[0075] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.
Claims
1. A chip bonding apparatus, characterized in that, include: Adsorption unit, used to adsorb and pick up / place chips; The drive unit is used to provide driving force; A transmission and guiding unit is disposed between the driving unit and the adsorption unit, and includes a transmission component and a guiding component. The transmission component is connected to the output end of the driving unit and is used to convert the rotational motion output by the driving unit into linear motion of the adsorption unit along a third direction. The guiding component is connected to the transmission component and is used to constrain the linear motion of the adsorption unit. A rotating unit is disposed between the transmission guide unit and the adsorption unit, and is used to drive the adsorption unit to rotate about an axis parallel to a third direction; The guide component is a single guide structure; The guiding component includes: The guide shaft extends along a third direction and has an axially through hollow channel inside. A needle roller guide sleeve is sleeved on the outer peripheral surface of the guide shaft. Multiple needle rollers are distributed circumferentially thereon. Each needle roller makes rolling contact with the outer peripheral surface of the guide shaft and constrains the movement of the guide shaft. The transmission assembly includes: A lead screw, the first end of which is connected to the output end of the drive unit for receiving rotational power, and the lead screw is at least partially housed within the hollow channel; A nut, threadedly connected to the outer circumference of the lead screw; A connector connects the nut and the guide shaft so that the guide shaft moves linearly synchronously with the nut.
2. The chip bonding apparatus according to claim 1, characterized in that, The guide assembly in the transmission guide unit further includes: An elastic element is sleeved on the outer circumferential surface of the guide shaft and is closer to the adsorption unit than the needle roller guide sleeve.
3. The chip bonding apparatus according to claim 1, characterized in that, The chip bonding device also includes a force control unit. The force control unit includes a force sensor; The force sensor is connected in series between the transmission guide unit and the rotation unit to detect the force applied to the chip.
4. The chip bonding apparatus according to claim 3, characterized in that, The rotating unit includes: A rotary table adapter plate is fixed to the side of the force sensor near the adsorption unit; A rotating platform is rotatably mounted on the rotating platform adapter plate and fixedly connected to the adsorption unit to drive the adsorption unit to rotate around an axis parallel to a third direction.
5. The chip bonding apparatus according to claim 1, characterized in that, The chip bonding device further includes a position detection unit, which includes a first position detection component. The first position detection component includes: a scale fixed to the support base and a reading head disposed opposite to the scale with a predetermined gap. The first position detection component is configured to detect the displacement of the adsorption unit along a third direction.
6. The chip bonding apparatus according to claim 1, characterized in that, The chip bonding apparatus further includes a position detection unit, which includes a second position detection component. The second position detection component includes: a first photoelectric switch and a second photoelectric switch fixed to the mounting substrate and spaced apart along a third direction, and a light-shielding sheet fixed to the transmission guide unit and moving between the first photoelectric switch and the second photoelectric switch with the transmission guide unit. The second position detection component is configured to determine the movement direction or movement limit position of the adsorption unit along a third direction.
7. The chip bonding apparatus according to claim 1, characterized in that, The chip bonding device further includes a position detection unit, which includes a third position detection component. The third position detection component includes: a first displacement sensor arranged on the first direction side of the adsorption unit and a second displacement sensor arranged on the second direction side of the adsorption unit. The third position detection component is configured to detect the displacement of the adsorption unit along the first direction and the second direction.
8. The chip bonding apparatus according to claim 1, characterized in that, The chip bonding apparatus further includes: Mounting substrate; An attitude adjustment unit is disposed on the mounting substrate. The attitude adjustment unit drives the mounting substrate to swing around the axis of the second direction to adjust the attitude of the transmission guide unit and the adsorption unit. The transmission guide unit is fixed to the mounting base plate.
9. The chip bonding apparatus according to claim 8, characterized in that, The attitude adjustment unit includes: A base is fixedly disposed on the side of the mounting base plate, and has through holes thereon; The elastic component includes a first support portion disposed on the mounting base, a second support portion disposed on the base, and a spring connected between the first support portion and the second support portion; A micrometer head is screwed into the through hole of the base. By screwing the micrometer head, the end of the micrometer head is brought into contact with or away from the mounting substrate, thereby driving the mounting substrate to swing around the axis of the second direction.
10. The chip bonding apparatus according to claim 1, characterized in that, The adsorption unit includes: A suction cup includes a protruding part and a flat part, wherein a plurality of permanent magnets are disposed on the flat part and the plurality of permanent magnets are evenly distributed on the suction cup; The suction cup adapter plate includes a positioning groove and a magnetic block. The positioning groove is adapted to and engaged with the protrusion. Each magnetic block is arranged opposite to the corresponding permanent magnet in a third direction.
11. A semiconductor device, characterized in that, The semiconductor device includes: The chip bonding apparatus as described in any one of claims 1 to 10 above.