Radio frequency front-end module, radio frequency switch chip and electronic equipment

Abstract

The invention discloses a radio frequency front-end module, a radio frequency switch chip and electronic equipment. The radio frequency front-end module comprises a substrate, the radio frequency switch chip, a first connecting piece and a second connecting piece. Wherein the radio frequency switch chip comprises a bare core and an analog module arranged on the bare core, the bare core is provided with a power supply port and a switch port, and the switch port is used for transmitting a radio frequency signal. The simulation module comprises an oscillator and a clock driving unit, and the oscillator is connected with the clock driving unit. The first connecting piece is connected between the power supply port and the substrate, and the second connecting piece is connected between the switch port and the substrate. Wherein the radio frequency switch chip further comprises a first filtering module, and the first filtering module is used for inhibiting a ripple signal generated by the clock driving unit from being coupled into the switch port to influence the radio frequency signal, so that the interference of the ripple signal on the radio frequency signal can be reduced, the signal transmission quality of the radio frequency signal is ensured, and the anti-interference capability of the radio frequency switch chip is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of radio frequency technology, and more particularly, to a radio frequency front-end module, a radio frequency switch chip and an electronic device. BACKGROUND

[0002] At present, the radio frequency front-end module has been widely applied in the fields of wireless communication, Internet of Things, smart home and the like, and it can process the radio frequency signal (for example, power amplification, filtering and the like). In the radio frequency front-end module, the radio frequency switch chip is used to control the switching of the radio frequency signal between different paths, so as to complete the receiving and transmitting tasks of the radio frequency signal.

[0003] However, the existing radio frequency switch chip has the problem of poor anti-interference ability. SUMMARY

[0004] The present application provides a radio frequency front-end module, a radio frequency switch chip and an electronic device.

[0005] According to a first aspect of the present application, the present application provides a radio frequency front-end module, which comprises a substrate, a radio frequency switch chip, a first connecting piece and a second connecting piece. The radio frequency switch chip is arranged on the substrate. The radio frequency switch chip comprises a bare chip and an analog module arranged on the bare chip. The bare chip is provided with a power supply port and a switch port, and the switch port is used for transmitting a radio frequency signal. The analog module comprises an oscillator and a clock driving unit. The oscillator is connected with the clock driving unit, and the oscillator is used for providing a clock signal to the clock driving unit. The first connecting piece is connected between the power supply port and the substrate, and the second connecting piece is connected between the switch port and the substrate. The radio frequency switch chip further comprises a first filter module, which is connected between the power supply port and the power supply end of the clock driving unit, and is used for suppressing the coupling of a ripple signal generated by the clock driving unit into the switch port to affect the radio frequency signal.

[0006] The present application provides a radio frequency front-end module, which comprises a substrate, a radio frequency switch chip, a first connecting piece and a second connecting piece. The radio frequency switch chip comprises a bare chip, an analog module and a first filter module. The bare chip is provided with a power supply port and a switch port. The analog module comprises an oscillator and a clock driving unit. The first filter module is connected between the power supply port and the power supply end of the clock driving unit, and can be used for suppressing the coupling of a ripple signal generated by the clock driving unit into the switch port.

[0007] Specifically, during the working process of the clock driving unit, current is periodically drawn from the external power supply, thereby forming a ripple signal (i.e., an interference signal / mixed-mode signal) on the power supply wire between the power supply port and the power supply end of the clock driving unit. The signal frequency of the ripple signal is equal to the signal frequency of the clock signal. Further, in the case of spatial coupling between the first connecting piece and the second connecting piece, the ripple signal is coupled into the switch port through the spatial coupling, thereby affecting the radio frequency signal transmitted by the switch port, for example, deteriorating the signal sensitivity of the radio frequency signal, resulting in a decrease in the signal quality of the radio frequency signal.

[0008] Therefore, the present application sets the first filter module between the power supply port and the power supply end of the clock driving unit, which can suppress the ripple signal to reduce the interference of the ripple signal on the radio frequency signal, thereby ensuring the signal transmission quality of the radio frequency signal and improving the anti-interference ability of the radio frequency switch chip.

[0009] According to the second aspect of the present application, the present application also provides a radio frequency switch chip, which comprises a die, an analog module and a first filter module. The die is provided with a power supply port and a switch port, and the switch port is used for transmitting a radio frequency signal. The analog module is arranged in the die, and the analog module comprises an oscillator and a clock driving unit. The oscillator is connected to the clock driving unit, and the oscillator is used for providing a clock signal to the clock driving unit. The first filter module is connected between the power supply port and the power supply end of the clock driving unit, and is used for suppressing the ripple signal generated by the clock driving unit from being coupled into the switch port to affect the radio frequency signal.

[0010] The present application provides a radio frequency switch chip, which comprises a die, an analog module and a first filter module. The die is provided with a power supply port and a switch port, the analog module comprises an oscillator and a clock driving unit, and the first filter module is connected between the power supply port and the power supply end of the clock driving unit, which can be used for suppressing the ripple signal generated by the clock driving unit from being coupled into the switch port.

[0011] Specifically, during the working process of the clock driving unit, current is periodically drawn from the external power supply, thereby forming a ripple signal (i.e., an interference signal / mixed-mode signal) on the power supply wire between the power supply port and the power supply end of the clock driving unit. The signal frequency of the ripple signal is equal to the signal frequency of the clock signal. Further, the ripple signal is coupled into the switch port through the spatial coupling, thereby affecting the radio frequency signal transmitted by the switch port, for example, deteriorating the signal sensitivity of the radio frequency signal, resulting in a decrease in the signal quality of the radio frequency signal.

[0012] Therefore, this application provides a first filtering module between the power supply port and the power supply terminal of the clock drive unit. The first filtering module can suppress the ripple signal to reduce the interference of the ripple signal on the radio frequency signal, thereby ensuring the signal transmission quality of the radio frequency signal and improving the anti-interference capability of the radio frequency switch chip.

[0013] According to a third aspect of this application, this application also provides an electronic device that includes the above-described radio frequency front-end module; or, the electronic device includes the above-described radio frequency switch chip. Attached Figure Description

[0014] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0015] Figure 1 This is a schematic diagram of the first structure of the radio frequency front-end module provided in the embodiments of this application.

[0016] Figure 2 yes Figure 1 The diagram shows the structure of the clock drive unit in the RF front-end module.

[0017] Figure 3 This is a schematic diagram of the second structure of the radio frequency front-end module provided in the embodiments of this application.

[0018] Figure 4 This is a schematic diagram of the third structure of the radio frequency front-end module provided in the embodiments of this application.

[0019] Figure 5 This is a schematic diagram of the fourth structure of the radio frequency front-end module provided in the embodiments of this application.

[0020] Figure 6 This is a schematic diagram of the fifth structure of the radio frequency front-end module provided in the embodiments of this application.

[0021] Figure 7 This is a schematic diagram of the structure of the radio frequency switch chip provided in the embodiments of this application.

[0022] Figure 8 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0023] In the following well-known solution of the present application will be described with reference to the accompanying drawings so as to be more clearly understood. Obviously, the described embodiments are only a part rather than all of the embodiments of the present application. Based on the embodiments of the present application, all other embodiments obtained by a person of ordinary skill in the art without creative work shall fall within the scope of the present application.

[0024] The present application provides a radio frequency front end module 100, which is an element integrating two or more than two discrete devices such as radio frequency switch, low noise amplifier, filter, duplexer, power amplifier, etc. into an independent module, thereby improving the integration and hardware performance and miniaturizing the volume.

[0025] Referring to Figure 1 , the radio frequency front end module 100 can include a substrate 10, a radio frequency switch chip 20, a first connecting member 30 and a second connecting member 40. The radio frequency switch chip 20 is disposed on the substrate 10. The radio frequency switch chip 20 can include a bare chip 210 and an analog module 50 disposed on the bare chip 210. The bare chip 210 is provided with a power supply port 2102 and a switch port 2104. The switch port 2104 is used for transmitting radio frequency signals. For example, the radio frequency signals can flow into the radio frequency switch chip 20 through the switch port 2104, or flow out of the radio frequency switch chip 20 through the switch port 2104. The first connecting member 30 is connected between the power supply port 2102 and the substrate 10. The second connecting member 40 is connected between the switch port 2104 and the substrate 10.

[0026] As an example, the substrate 10 can be provided with a power supply port 102 for connecting an external power supply. The external power supply is used to provide a working voltage VDD of the chip. For example, the working voltage VDD can be 1.2V, 1.8V, 2.5V, 3.3V, 3.6V, etc. As an embodiment, one end of the first connecting member 30 connected to the substrate 10 can be directly connected to the power supply port 102. As another embodiment, the substrate 10 can include a power supply trace (not shown in the figure) connected to the power supply port 102. One end of the first connecting member 30 connected to the substrate 10 can be connected to the power supply trace.

[0027] As another example, the substrate 10 can be provided with a signal transmission port 104 for transmitting radio frequency signals, for example, the signal transmission port 104 can be externally connected with an antenna to receive or send radio frequency signals. As another example, the signal transmission port 104 can be connected with other functional devices (for example, filter chips, power amplifier chips, low noise amplifier chips, etc.) in the radio frequency front-end module 100 to form a signal transmission link. As an implementation, one end of the second connecting member 40 connected with the substrate 10 can be directly connected with the signal transmission port 104. As another implementation, the substrate 10 can include a signal transmission trace (not shown in the figure) connected with the signal transmission port 104, and one end of the second connecting member 40 connected with the substrate 10 can be connected with the signal transmission trace.

[0028] Of course, in other possible implementations, one end of the second connecting member 40 connected with the substrate 10 can be directly connected with other functional devices through a signal transmission trace to realize the transmission of radio frequency signals. The present application does not limit the specific connection mode of the first connecting member 30 and the second connecting member 40 on the substrate 10.

[0029] In the present embodiment, the analog module 50 can include an oscillator 510 and a clock driving unit 520, the oscillator 510 being connected with the clock driving unit 520, and the oscillator 510 being used to provide a clock signal to the clock driving unit 520. The oscillator 510 can generate a periodic alternating current signal (i.e., a clock signal) with a specific frequency and waveform, provide a synchronous working rhythm for other functional units (for example, the clock driving unit 520) inside the analog module 50, and thus ensure the orderly operation of the radio frequency switch chip 20. Exemplarily, the oscillator 510 can be an RC oscillator, a ring oscillator, an LC oscillator, etc., and the present embodiment does not limit this. The clock driving unit 520 refers to a functional unit driven by a clock signal and working, and the specific implementation of the clock driving unit 520 will be described in detail hereinafter.

[0030] In the present embodiment, the radio frequency switch chip 20 can further include a first filter module 60 connected between the power supply port 2102 and the power supply end (not marked in the figure) of the clock driving unit 520, which is used to suppress the coupling of the ripple signal generated by the clock driving unit 520 into the switch port 2104 to affect the radio frequency signal.

[0031] It should be noted that, in the working process of the clock driving unit 520, current will be periodically drawn from the external power supply, and a ripple signal (i.e., a common-mode signal) will be formed on the power supply wire between the power supply port 2102 and the power supply end of the clock driving unit 520. The signal frequency of the ripple signal is equal to the signal frequency of the clock signal. Further, the first connecting member 30 and the second connecting member 40 in the embodiment have spatial coupling. Specifically, the first connecting member 30 and the second connecting member 40 can be equivalent to an inductor respectively, and the two equivalent inductors have spatial coupling. In this case, the ripple signal will be coupled into the switch port 2104 through the spatial coupling, and thus affect the radio frequency signal transmitted by the switch port 2104, for example, deteriorate the signal sensitivity of the radio frequency signal, and cause the signal quality of the radio frequency signal to decrease.

[0032] In the related art, to solve the problem of the ripple signal interfering with the radio frequency signal, the signal frequency of the clock signal is usually reduced. However, in the case of reducing the signal frequency of the clock signal, the driving capability of the analog module 50 will also decrease, and thus affect the normal working of the radio frequency switch chip 20.

[0033] The inventors of the present application solve the above problem by arranging the first filter module 60 between the power supply port 2102 and the power supply end of the clock driving unit 520. The first filter module 60 can be used to suppress the ripple signal from being coupled into the switch port 2104 through the spatial coupling, so as to reduce the interference of the ripple signal on the radio frequency signal, ensure the signal transmission quality of the radio frequency signal, and improve the anti-interference capability of the radio frequency switch chip 20. Further, since it is not necessary to reduce the signal frequency of the clock signal, the driving capability of the analog module 50 can be ensured, and the normal working of the radio frequency switch chip 20 can be ensured.

[0034] The specific implementation of the radio frequency front-end module 100 will be introduced below.

[0035] In the embodiment, the substrate 10 is substantially rectangular, and is used to fix and support the elements (for example, the radio frequency switch chip 20, a power amplifier chip, a low-noise amplifier chip, a filter chip, and the like) in the radio frequency front-end module 100. Specifically, the substrate 10 can be a copper-clad laminate. By processing the copper-clad laminate through hole processing, chemical copper plating, electroplating copper, etching, and the like, a circuit can be printed on the surface of the substrate. In other possible examples, the substrate 10 can also be a high resistivity silicon (HR-Si) substrate, an ultra-thin glass substrate, a low temperature co-fired ceramic (LTCC) substrate, a thin film piezoelectric insulation substrate (POI), and the like.

[0036] Specifically, the substrate 10 can include a substrate and a plurality of metal layers (not shown in the figures) stacked with each other, the plurality of metal layers are sequentially stacked on the substrate, and the substrate serves as a support for the plurality of metal layers. The metal layer can be a metal layer of a single metal material such as copper, aluminum, silver, etc., can be a metal layer sequentially stacked by a plurality of metal materials, or can be a metal layer prepared by an alloy of a plurality of metal materials, which is used to layout a wire (for example, a wire of an inductor, a primary wire and a secondary wire of a transformer, a transmission line between different elements, or a metal pad for setting a ground metal or a metal pad, for example, a metal pad corresponding to the power port 102 and the signal transmission port 104.

[0037] In the embodiment, the radio frequency switch chip 20 is arranged on the substrate 10, which is used to turn on or turn off the signal path in the radio frequency front-end module 100 to complete the receiving and transmitting tasks of the radio frequency signal. As an implementation manner, as shown in the figure, the radio frequency switch chip 20 can be arranged on the substrate 10 by using a wire bonding process, and the first connecting member 30 and the second connecting member 40 are both bonding wires. As another implementation manner, the radio frequency switch chip 20 can be arranged on the substrate 10 by using a flip-chip process, and the first connecting member 30 and the second connecting member 40 are both metal bumps. Figure 1

[0038] In the embodiment, the radio frequency switch chip 20 can include a bare chip 210 and an analog module 50 and a switch module 52 arranged on the bare chip 210. The bare chip 210 refers to a chip that has not been packaged after wafer cutting and testing. The analog module 50 is connected with a power supply port 2102, and the power supply port 2102 provides a working voltage VDD for the analog module 50. The analog module 50 is also connected with the switch module 52, which is used to output a control signal to the switch module 52 to realize the turn-on or turn-off of the signal path.

[0039] The switch module 52 is connected with a switch port 2104 to control the turn-on or turn-off of the signal path where the switch port 2104 is located. Exemplarily, the switch module 52 can include one or more transistor switches, such as a heterojunction bipolar transistor (HBT), a metal-oxide-semiconductor field-effect transistor (MOSFET), etc., and the specific implementation manner of the switch module 52 is not limited in the present application.

[0040] ​In some possible embodiments, the power supply port 2102 and the switch port 2104 are located on the same side of the die 210. Specifically, the power supply port 2102 and the switch port 2104 can be two adjacent ports on the die 210. Here, “adjacent” means that there is no additional port between the power supply port 2102 and the switch port 2104. Therefore, the power supply port 2102 and the switch port 2104 in this embodiment are arranged “next to” each other, reducing the spacing between the first connecting member 30 and the second connecting member 40, so that there is a certain spatial coupling between the inductances equivalent to the first connecting member 30 and the second connecting member 40.

[0041] In some possible embodiments, the spacing between the power supply port 2102 and the switch port 2104 is less than or equal to 150 um. For example, the spacing between the two can be 150 um, 120 um, 100 um, 80 um, 50 um, and the like. In this case, the spacing between the first connecting member 30 and the second connecting member 40 is small, so that there is a certain spatial coupling between the inductances equivalent to the first connecting member 30 and the second connecting member 40.

[0042] It should be noted here that, in the related art, in order to reduce the above spatial coupling, the technician usually adopts a technical solution of increasing the port spacing or arranging other ports (for example, a ground port) between the power supply port 2102 and the switch port 2104. However, in some possible scenarios, due to the port definition or chip size of the radio frequency switch chip 20, the power supply port 2102 and the switch port 2104 can only be arranged adjacent to each other, or the spacing between the two is less than or equal to 150 um, which inevitably leads to the above spatial coupling.

[0043] When the radio frequency front-end module 100 is in a signal receiving mode, the ripple signal coupled in through the above spatial coupling is extremely easy to interfere with the small-power radio frequency signal at the switch port 2104. In this case, the ripple signal coupled into the switch port 2104 will further deteriorate the signal sensitivity of the radio frequency signal, making it difficult for the subsequent low-noise amplifier (LNA) to well amplify the power of the radio frequency signal. Further, in the case where the radio frequency switch chip 20 is packaged on the substrate 10 by wire bonding technology, compared with the flip-chip packaging mode, the inductance equivalent to the bonding wire is more likely to form spatial coupling to couple the ripple signal into the switch port 2104, thereby affecting the transmission quality of the radio frequency signal at the switch port 2104.

[0044] In some possible embodiments, the radio frequency switch chip 20 can further include a decoupling capacitor C0, which is arranged on the die 210. One end of the decoupling capacitor C0 is connected to the power supply port 2102, and the other end is grounded. The decoupling capacitor C0 can stabilize the operating voltage VDD at the power supply port 2102, and can also play a role in filtering and anti-interference. For example, the capacitance of the decoupling capacitor C0 can be greater than or equal to 10 pF, and less than or equal to 100 pF, for example, the capacitance of the decoupling capacitor C0 can be 10 pF, 20 pF, 30 pF, 50 pF, 80 pF, 100 pF, and the like.

[0045] It should be noted that when the radio frequency front-end module 100 is in a working state, the first connecting member 30 and the second connecting member 40 can be regarded as an inductor at the signal frequency of the radio frequency signal, respectively, and the external power supply connected to the power supply port 102 can be regarded as an "alternating ground". In this case, the first connecting member 30 can be equivalent to a "ground inductor", which is connected in parallel with the decoupling capacitor C0 to form a resonant network. Specifically, when the resonant frequency of the resonant network is close to the signal frequency of the ripple signal, a larger radio frequency voltage (the ripple signal after signal amplitude amplification) will be generated at the power supply port 2102, which will further deteriorate the signal sensitivity of the radio frequency signal, resulting in a decrease in the signal quality of the radio frequency signal.

[0046] As an example, the absolute value of the difference between the resonant frequency of the inductor equivalent to the first connecting member 30 and the decoupling capacitor C0 and the signal frequency of the ripple signal is less than or equal to 300 MHz. For example, the absolute value of the difference between the two can be 300 MHz, 250 MHz, 200 MHz, 150 MHz, 100 MHz, 80 MHz, 50 MHz, 0 MHz, and the like. Specifically, the smaller the absolute value of the difference, the larger the amplitude of the ripple voltage at the power supply port 2102.

[0047] Therefore, to solve the influence of the ripple signal on the transmission of the radio frequency signal, the embodiment sets a first filter module 60 between the power supply port 2102 and the power supply end of the clock driving unit 520. The first filter module 60 can suppress the ripple signal to avoid its coupling into the switch port 2104 through spatial coupling, thereby ensuring the signal transmission quality of the radio frequency signal. The specific implementation of the analog module 50 and the first filter module 60 will be described below.

[0048] In the embodiment, the analog module 50 can include an oscillator 510 and a clock driving unit 520, and the power supply end of the oscillator 510 and the power supply end of the clock driving unit 520 are connected to the power supply port 2102. Specifically, the related description of the oscillator 510 can refer to the related description in the foregoing description, and will not be repeated here.

[0049] The clock driving unit 520 refers to a functional unit driven by a clock signal and working. The clock driving unit 520 can include one or both of the charge pump 5210 and the frequency divider 5230. As an implementation, the clock driving unit 520 can include the charge pump 5210, and the oscillator 510 is connected to the charge pump 5210 and provides a clock signal to the charge pump 5210. As another implementation, referring to Figure 2 , the clock driving unit 520 can include the charge pump 5210 and the frequency divider 5230, and the clock signal output end (not shown in the figure) of the oscillator 510 is connected to the charge pump 5210 and the frequency divider 5230 respectively to provide a clock signal to the charge pump 5210 and the frequency divider 5230 respectively.

[0050] Of course, the clock driving unit 520 can also include other functional units driven by a clock signal, which is not limited in the embodiment.

[0051] Specifically, the charge pump 5210 is a DC-DC converter using a capacitor as an energy storage and energy transfer element, which can boost or buck the voltage output by the low dropout linear regulator 540. It is not difficult to understand that during the process of continuously charging and discharging the capacitor in the charge pump 5210, current will be periodically drawn from the external power supply to form a ripple signal. In the embodiment, the voltage output end of the charge pump 5210 can be connected to the control end (not shown in the figure) of the switch module 52 through a driving unit (not shown in the figure). The driving unit can convert the output voltage of the charge pump 5210 into a control signal of the switch module 52, and then turn on or turn off the signal path where the switch module 52 is located.

[0052] The frequency divider 5230 is used to reduce the frequency of the input clock signal by an integer or a fractional number, and generate one or more new clock signals with a frequency of several times of the input frequency, so as to realize the driving of different functional units. Specifically, the frequency divider 5230 can be a two-dividing frequency divider, a multiple-dividing frequency divider, a reference frequency divider, and a feedback frequency divider, and the specific implementation of the frequency divider 5230 and the charge pump 5210 is not limited in the application.

[0053] In some possible embodiments, as shown in Figure 1 and Figure 2 , the power supply end of the oscillator 510 and the power supply end of the clock driving unit 520 are connected to form a first designated node A. Specifically, the first filter module 60 is connected between the power supply port 2102 and the first designated node A, and the first filter module 60 is also used to suppress the coupling of the ripple signal generated by the oscillator 510 into the switch port 2104 to affect the radio frequency signal.

[0054] It should be noted that the oscillator 510 is a self-excited alternating voltage source, and the clock signal provided for the analog module 50 is generated by relying on the energy storage element (e.g., a capacitor) following a differential relationship, so that the current in the energy storage element periodically changes, thereby forming a ripple current (a ripple signal). Therefore, the first filter module 60 in this embodiment can not only suppress the ripple signal generated by the clock driving unit 520, but also suppress the ripple signal generated by the oscillator 510, thereby achieving double suppression of the ripple signal and ensuring normal transmission of the radio frequency signal.

[0055] Specifically in Figure 2 , the power supply end of the oscillator 510, the power supply end of the charge pump 5210, and the power supply end of the frequency divider 5230 are connected to form a first designated node A. In this case, the first filter module 60 can simultaneously suppress the ripple signals generated by the oscillator 510, the charge pump 5210, and the frequency divider 5230, thereby ensuring normal transmission of the radio frequency signal.

[0056] In other possible embodiments, the power supply end of the oscillator 510 can be directly connected to the power supply port 2102, so as to avoid the access of the first filter module 60 reducing the working current of the oscillator 510 and to ensure normal working of the oscillator 510. Specifically, the application does not limit the connection position of the power supply end of the oscillator 510.

[0057] In this embodiment, the first filter module 60 is used to suppress the coupling of the ripple signal into the switch port 2104 to affect the radio frequency signal.

[0058] In some possible embodiments, as Figure 1 shown, the first filter module 60 can include a first resistor R1 and a first capacitor C1. The first end of the first resistor R1 is connected to the power supply port 2102, and the second end of the first resistor R1 is connected to the power supply end of the clock driving unit 520. One end of the first capacitor C1 is connected to the second end of the first resistor R1, and the other end of the first capacitor C1 is grounded.

[0059] Therefore, the first filter module 60 in this embodiment is implemented by using an RC filter network. In one aspect, compared with an LC filter network, the first resistor R1 occupies a smaller area on the bare chip 60 than an inductor, which is conducive to realizing compact design of the radio frequency switch chip 20. In another aspect, the RC filter network has a simple architecture and can effectively suppress the ripple signal.

[0060] It is emphasized here that the first capacitor C1 is connected to the end of the first resistor R1 connected to the clock driving unit 520, that is, the end of the first resistor R1 not connected to the power supply port 2102. Due to the presence of the decoupling capacitor C0 and the resonance network formed by the inductance equivalent to the first connecting element 30, in this case, if the first capacitor C1 is connected to the first end of the first resistor R1, the first capacitor C1 will be connected in parallel with the decoupling capacitor C0, so that the inductance equivalent to the first connecting element 30, the decoupling capacitor C0 and the first capacitor C1 together form a resonance network, resulting in that the first capacitor C1 and the first resistor R1 cannot form an RC filter network. Therefore, in the embodiment, the first capacitor C1 and the decoupling capacitor C0 are respectively connected to the two ends of the first resistor R1 to ensure that the first filter module 60 can work normally.

[0061] As an implementation manner, the first resistor R1 is a small resistor and the first capacitor C1 is a large capacitor. Exemplarily, the resistance value of the first resistor R1 is greater than or equal to 20Ω and less than or equal to 500Ω. For example, the resistance value of the first resistor R1 can be 20Ω, 50Ω, 100Ω, 200Ω, 300Ω, 500Ω, etc. The capacitance value of the first capacitor C1 is greater than or equal to 10pF and less than or equal to 200pF. For example, the capacitance value of the first capacitor C1 can be 10pF, 20pF, 40pF, 80pF, 120pF, 200pF, etc.

[0062] Since the working current of the clock driving unit 520 is large, the first resistor R1 in the embodiment is implemented by using a small resistance value resistor, which can avoid a large voltage drop of the first resistor R1 to ensure normal power supply to the clock driving unit 520.

[0063] As another implementation manner, the first resistor R1 is a large resistor and the first capacitor C1 is a small capacitor. Since the occupied area of a capacitor on the bare chip 60 is much larger than the occupied area of a resistor on the bare chip 60, in the case that the first capacitor C1 is a small capacitor, the occupied area of the first capacitor C1 on the bare chip 60 can be reduced, which is beneficial to realize compact design of the radio frequency switch chip 20 and reduce the hardware cost of the radio frequency switch chip 20. Specifically, the values of the first resistor R1 and the first capacitor C1 are not limited in the embodiment, and the researchers can flexibly adjust them according to the actual working scene of the radio frequency front-end module 100.

[0064] In other possible embodiments, please refer to Figure 3The first filtering module 60 may include a second resistor R2, a third resistor R3, and a second capacitor C2. The first end of the second resistor R2 is connected to the power supply port 2102, and the second end of the second resistor R2 is connected to the power supply terminal of the clock driving unit 520. The first end of the third resistor R3 is grounded, and the second end of the third resistor R3 is connected to the ground terminal of the clock driving unit 520. The second capacitor C2 is connected between the second ends of the second resistor R2 and the second ends of the third resistor R3.

[0065] Therefore, the first filtering module 60 in this embodiment is implemented using an RCR filtering network, compared to Figure 1 The RC filter network in the image has better anti-interference ability and can effectively suppress ripple signals.

[0066] In one implementation, both the second resistor R2 and the third resistor R3 are small resistors, and the second capacitor C2 is a large capacitor. For example, the resistance value of the second resistor R2 is greater than or equal to 20Ω and less than or equal to 500Ω. For instance, the resistance value of the second resistor R2 can be 20Ω, 50Ω, 100Ω, 200Ω, 300Ω, 500Ω, etc. The resistance value of the third resistor R3 is greater than or equal to 20Ω and less than or equal to 500Ω. For instance, the resistance value of the third resistor R3 can be 20Ω, 50Ω, 100Ω, 200Ω, 300Ω, 500Ω, etc. The capacitance value of the second capacitor C2 is greater than or equal to 10pF and less than or equal to 200pF. For instance, the capacitance value of the second capacitor C2 can be 10pF, 20pF, 40pF, 80pF, 120pF, 200pF, etc. Specifically, this embodiment does not limit the values ​​of the second resistor R2, the third resistor R3, and the second capacitor C2. Researchers can flexibly adjust them according to the actual working scenario of the RF front-end module 100.

[0067] Therefore, in this embodiment, the second resistor R2 and the third resistor R3 are implemented with small resistance values, which can avoid large voltage drops in the second resistor R2 and the third resistor R3, so as to ensure normal power supply to the clock drive unit 520.

[0068] Specifically Figure 3 In this configuration, the ground terminal of the oscillator 510 is connected to the ground terminal of the clock drive unit 520 to form a second designated node B. The first terminal of the third resistor R3 is grounded, and the second terminal of the third resistor R3 is connected to the second designated node B. In this configuration, the first filter module 60 can perform dual suppression of the ripple signal generated by the clock drive unit 520 and the ripple signal generated by the oscillator 510 to improve the suppression effect of the ripple signal.

[0069] Please see Figure 4, the radio frequency switch chip 20 can further include a second filter module 70 connected between the power supply end of the oscillator 510 and the power supply end of the clock driving unit 520, so that the power supply end of the clock driving unit 520 is connected to the power supply end of the oscillator 510 through the second filter module 70. The power supply end of the oscillator 510 is connected to the power supply port 2102 through the first filter module 60. The second filter module 70 is configured to suppress the ripple signal generated by the clock driving unit 520 from coupling into the switch port 2104 to affect the radio frequency signal.

[0070] Therefore, in the present embodiment, the first filter module 60 and the second filter module 70 can respectively suppress the ripple signal generated by the clock driving unit 520, and the first filter module 60 can suppress the ripple signal generated by the oscillator 510, so as to further improve the suppression effect on the ripple signal. Figure 4

[0071] In some possible embodiments, the second filter module 70 can include a fourth resistor R4 and a third capacitor C3. The first end of the fourth resistor R4 is connected to the power supply end of the oscillator 510, and the second end of the fourth resistor R4 is connected to the power supply end of the clock driving unit 520. One end of the third capacitor C3 is connected to the second end of the fourth resistor R4, and the other end of the third capacitor C3 is grounded.

[0072] Therefore, the second filter module 70 in the present embodiment is implemented by using an RC filter network. In one aspect, compared with an LC filter network, the fourth resistor R4 occupies a smaller area on the bare chip 60 than an inductor, which is conducive to the compact design of the radio frequency switch chip 20. In another aspect, the RC filter network has a simple architecture and can effectively suppress the ripple signal. Of course, the second filter module 70 is implemented by using an RCR filter network, and the specific implementation manner of the second filter module 70 is not limited in the present embodiment.

[0073] As an implementation manner, the fourth resistor R4 is a small resistor, and the third capacitor C3 is a large capacitor. For example, the resistance value of the fourth resistor R4 is greater than or equal to 20Ω and less than or equal to 500Ω. For example, the resistance value of the fourth resistor R4 can be 20Ω, 50Ω, 100Ω, 200Ω, 300Ω, 500Ω, etc. The capacitance value of the third capacitor C3 is greater than or equal to 10pF and less than or equal to 200pF. For example, the capacitance value of the third capacitor C3 can be 10pF, 20pF, 40pF, 80pF, 120pF, 200pF, etc. Since the working current of the clock driving unit 520 is large, the fourth resistor R4 in the present embodiment is implemented by using a small resistance resistor, which can avoid a large voltage drop of the fourth resistor R4, so as to ensure the normal power supply to the clock driving unit 520.

[0074] Please refer to​Figure 5 The analog module 50 may also include a bandgap reference voltage unit 530 and a low-dropout linear regulator 540. The bandgap reference voltage unit 530 and the low-dropout linear regulator 540 are connected to each other. The bandgap reference voltage unit 530 is used to provide a reference voltage to the low-dropout linear regulator 540.

[0075] Specifically, the bandgap reference voltage unit 530 is used to generate an extremely stable and accurate output voltage (reference voltage) that hardly changes with temperature, ensuring the proper functioning of the low dropout linear regulator 540. The low dropout linear regulator 540 (LDO) converts a high-amplitude and unstable input voltage (operating voltage VDD) into a stable and low-amplitude output voltage, providing sufficient current to subsequent circuitry (load). This application does not limit the specific implementation of the bandgap reference voltage unit 530 and the low dropout linear regulator 540.

[0076] exist Figure 5 In the embodiment shown, the power supply terminal of the bandgap reference voltage unit 530 and the power supply terminal of the low dropout linear regulator 540 are respectively connected to the power supply port 2102, and the first filter module 60 is connected between the voltage output terminal 5410 of the low dropout linear regulator 540 and the power supply terminal of the clock drive unit 520.

[0077] It should be noted that the low-dropout linear regulator 540 also has a certain degree of suppression effect on ripple signals. Therefore, in conjunction with the low-dropout linear regulator 540, dual suppression of ripple signals can be achieved, thereby improving the ripple signal suppression effect.

[0078] exist Figure 5 In the illustrated embodiment, the RF switch chip 20 may further include a third filter module 80, which is connected between the power supply port 2102 and the power supply terminal of the bandgap reference voltage unit 530. The third filter module 80 is used to suppress the flow of RF signals coupled in through the power supply port 2102 to the bandgap reference voltage unit 530.

[0079] It should be noted that when there is spatial coupling between the first connector 30 and the second connector 40, part of the radio frequency signal transmitted by the switch port 2104 will be coupled into the power supply port 2102 through the aforementioned spatial coupling, thereby forming an interference signal flowing into the radio frequency switch chip 20. At this time, the voltage signal transmitted by the power supply port 2102 (i.e., the operating voltage VDD) will be affected by the interference signal. Specifically, the interference signal will be superimposed on the voltage signal, thereby affecting the normal power supply to the bandgap reference voltage unit 530, causing the analog module 50 and even the radio frequency switch chip 20 to malfunction.

[0080] When the radio frequency front-end module 100 is in a signal transmitting mode, a high-power radio frequency signal at the switch port 2104 is prone to enter the power supply port 2102 through the above-mentioned space coupling, thereby forming an interference signal that interferes with the normal power supply of the analog module 50. Further, in the case where the radio frequency switch chip 20 is packaged on the substrate 10 using a wire bonding process, compared with a flip-chip packaging method, the inductance equivalent to the bonding wire is more likely to form a space coupling to couple part of the radio frequency signal transmitted at the switch port 2104 to the power supply port 2102, thereby interfering with the normal power supply of the analog module 50.

[0081] Therefore, by arranging the third filter module 80 between the power supply port 2102 and the power supply end of the bandgap reference voltage unit 530, the third filter module 80 can suppress the interference signal (i.e., the radio frequency signal coupled into the power supply port 2102), thereby reducing the influence of the interference signal on the voltage signal, to ensure that the bandgap reference voltage unit 530 can be normally powered, and the anti-interference capability of the analog module 50 is improved.

[0082] It should be noted that, compared with other functional units (e.g., a low dropout linear regulator 540, an oscillator, etc.) in the analog module 50, the bandgap reference voltage unit 510 has a poor anti-interference capability to power supply noise. Therefore, to improve the anti-interference capability of the bandgap reference voltage unit 510, the third filter module 80 is arranged between the power supply port 2102 and the power supply end of the bandgap reference voltage unit 510 to suppress the interference signal coupled into the power supply port 2102.

[0083] In some possible embodiments, the power supply port 2102 and the power supply end of the bandgap reference voltage unit 530 are connected to form a first power supply branch S1, the power supply port 2102 and the power supply end of the low dropout linear regulator 540 are connected to form a second power supply branch S2, and the third filter module 80 is connected in the first power supply branch S1. That is, the third filter module 80 is not connected in the second power supply branch S2, and the access of the third filter module 80 can be avoided to reduce the working current of the low dropout linear regulator 540, to ensure the normal working of the low dropout linear regulator 540.

[0084] In some possible embodiments, the power supply end of the bandgap reference voltage unit 530 and the power supply end of the low dropout linear regulator 540 are connected to form a specified node (not shown in the figure), and the third filter module 80 is connected between the specified node and the power supply port 2102. Specifically, the connection position of the power supply end of the low dropout linear regulator 540 is not limited in the present application.

[0085] In some possible embodiments, as shown in FIG. 6, the third filter module 80 is connected between the power supply port 2102 and the power supply end of the bandgap reference voltage unit 530. Figure 5As shown, the third filter module 80 can include a fifth resistor R5 and a fourth capacitor C4. The first end of the fifth resistor R5 is connected to the power supply port 2102, and the second end of the fifth resistor R5 is connected to the power supply end of the bandgap reference voltage unit 530. One end of the fourth capacitor C4 is connected to the second end of the fifth resistor R5, and the other end of the fourth capacitor C4 is grounded.

[0086] Therefore, the third filter module 80 in the embodiment is implemented by using an RC filter network. In one aspect, compared with the LC filter network, the fifth resistor R5 occupies a smaller area on the bare chip 60 than the inductor, which is conducive to the compact design of the structure of the radio frequency switch chip 20. In another aspect, the RC filter network has a simple architecture and can effectively suppress interference signals.

[0087] It is emphasized here that the fourth capacitor C4 is connected to the end of the fifth resistor R5 connected to the bandgap reference voltage unit 530, that is, the end of the fifth resistor R5 not connected to the power supply port 2102. Due to the presence of the decoupling capacitor C0 and the inductor equivalent to the first connecting member 30 forming a resonant network, in this case, if the fourth capacitor C4 is connected to the first end of the fifth resistor R5, the fourth capacitor C4 will be connected in parallel with the decoupling capacitor C0, so that the inductor equivalent to the first connecting member 30, the decoupling capacitor C0 and the fourth capacitor C4 together form a resonant network, resulting in that the fourth capacitor C4 and the fifth resistor R5 cannot form an RC filter network. Therefore, in the embodiment, the fourth capacitor C4 and the decoupling capacitor C0 are respectively connected to the two ends of the fifth resistor R5 to ensure that the third filter module 80 can work normally.

[0088] As an implementation manner, the fifth resistor R5 is a large resistor, and the fourth capacitor C4 is a small capacitor. For example, the resistance value of the fifth resistor R5 is greater than or equal to 0.5kΩ and less than or equal to 5kΩ. For example, the resistance value of the fifth resistor R5 can be 0.5kΩ, 0.8kΩ, 1kΩ, 2kΩ, 3kΩ, 5kΩ, etc. The capacitance value of the fourth capacitor C4 is greater than or equal to 0.5pF and less than or equal to 5pF. For example, the capacitance value of the fourth capacitor C4 can be 0.5pF, 0.8pF, 1pF, 2pF, 3pF, 5pF, etc.

[0089] Therefore, in order to ensure that the time constant of the RC multiplication is unchanged, the fourth capacitor C4 needs to be implemented by using a small-capacitance capacitor when the fifth resistor R5 is implemented by using a large-resistance resistor. Since the area occupied by the capacitor on the bare chip 60 is much larger than the area occupied by the resistor on the bare chip 60, in the case of the fourth capacitor C4 being a small capacitor, the area occupied by the fourth capacitor C4 on the bare chip 60 can be reduced, which is conducive to the compact design of the structure of the radio frequency switch chip 20 and reduces the hardware cost of the radio frequency switch chip 20.

[0090] As another implementation, the fifth resistor R5 is a small resistor, and the fourth capacitor C4 is a large capacitor. Specifically, the embodiment does not limit the values of the fifth resistor R5 and the fourth capacitor C4, and the developers can flexibly adjust them according to the actual working scene of the radio frequency front-end module 100.

[0091] In other possible embodiments, referring to Figure 6 , the third filtering module 80 can include a sixth resistor R6, a seventh resistor R7, and a fifth capacitor C5. Specifically, the first end of the sixth resistor R6 is connected with the power supply port 2102, and the second end of the sixth resistor R6 is connected with the power supply end of the bandgap reference voltage unit 530; the first end of the seventh resistor R7 is grounded, and the second end of the seventh resistor R7 is connected with the ground end of the bandgap reference voltage unit 530; and the fifth capacitor C5 is connected between the second end of the sixth resistor R6 and the second end of the seventh resistor R7.

[0092] Therefore, the third filtering module 80 in the embodiment is implemented by using an RCR filtering network, which has better anti-interference ability than the RC filtering network in Figure 5 , and can better suppress the interference signals.

[0093] As an implementation, the sixth resistor R6 and the seventh resistor R7 are both large resistors, and the fifth capacitor C5 is a small capacitor. Specifically, the resistance value of the sixth resistor R6 is greater than or equal to 0.5kΩ and less than or equal to 5kΩ. For example, the resistance value of the sixth resistor R6 can be 0.5kΩ, 0.8kΩ, 1kΩ, 2kΩ, 3kΩ, 5kΩ, etc. The resistance value of the seventh resistor R7 is greater than or equal to 0.5kΩ and less than or equal to 5kΩ. For example, the resistance value of the seventh resistor R7 can be 0.5kΩ, 0.8kΩ, 1kΩ, 2kΩ, 3kΩ, 5kΩ, etc. The capacitance value of the fifth capacitor C5 is greater than or equal to 0.5pF and less than or equal to 5pF. For example, the capacitance value of the fifth capacitor C5 can be 0.5pF, 0.8pF, 1pF, 2pF, 3pF, 5pF, etc. Specifically, the embodiment does not limit the values of the sixth resistor R6, the seventh resistor R7, and the fifth capacitor C5, and the developers can flexibly adjust them according to the actual working scene of the radio frequency front-end module 100.

[0094] Therefore, in the embodiment, the sixth resistor R6 and the seventh resistor R7 are implemented by using resistors with large resistance values, and the fifth capacitor C5 is implemented by using a capacitor with a small capacitance value, so that the time constant is ensured to be unchanged. Since the area occupied by a capacitor on the bare chip 60 is much larger than the area occupied by a resistor on the bare chip 60, in the case of the fifth capacitor C5 being a small capacitor, the area occupied by the fifth capacitor C5 on the bare chip 60 can be reduced, which is beneficial to the compact design of the radio frequency switch chip 20 and reduces the hardware cost of the radio frequency switch chip 20.

[0095] The embodiment of the present application further provides a radio frequency switch chip 20, which is used to turn on or turn off a signal path in a radio frequency front-end module to complete the receiving and transmitting tasks of a radio frequency signal. Referring to Figure 7 , the radio frequency switch chip 20 can include a bare chip 210, an analog module 50, and a first filter module 60. The bare chip 210 is provided with a power supply port 2102 and a switch port 2104, and the switch port 2104 is used to transmit a radio frequency signal. The analog module 50 is arranged on the bare chip 210. The analog module 50 can include an oscillator 510 and a clock driving unit 520, the oscillator 510 is connected to the clock driving unit 520, and the oscillator 510 is used to provide a clock signal to the clock driving unit 520. The first filter module 60 is connected between the power supply port 2102 and the power supply end of the clock driving unit 520, and is used to suppress the coupling of a ripple signal generated by the clock driving unit 520 into the switch port 2104 to affect the radio frequency signal.

[0096] The present application provides a radio frequency switch chip 20, which can include a bare chip 210, an analog module 50, and a first filter module 60. The bare chip 210 is provided with a power supply port 2102 and a switch port 2104, the analog module 50 can include an oscillator 510 and a clock driving unit 520, and the first filter module 60 is connected between the power supply port 2102 and the power supply end of the clock driving unit 520, which can be used to suppress the coupling of a ripple signal generated by the clock driving unit 520 into the switch port 2104.

[0097] Specifically, during the operation of the clock driving unit 520, current is periodically drawn from an external power supply, and a ripple signal (i.e., an interference signal / mixed-mode signal) is formed on the power supply line between the power supply port 2102 and the power supply end of the clock driving unit 520. The signal frequency of the ripple signal is equal to the signal frequency of the clock signal. Further, the ripple signal is coupled into the switch port 2104 through space coupling, and thus affects the radio frequency signal transmitted by the switch port 2104, for example, deteriorates the signal sensitivity of the radio frequency signal, and causes the signal quality of the radio frequency signal to be reduced.

[0098] Therefore, the first filtering module 60 can suppress the ripple signal to reduce the interference of the ripple signal on the radio frequency signal, so as to ensure the signal transmission quality of the radio frequency signal and improve the anti-interference ability of the radio frequency switch chip 20.

[0099] In some possible embodiments, the radio frequency switch chip 20 is applied to the radio frequency front-end module 100, and the radio frequency front-end module 100 can include the substrate 10, the first connecting piece 30 and the second connecting piece 40. The radio frequency switch chip 20 is arranged on the substrate 10. The first connecting piece 30 is connected between the power supply port 2102 and the substrate 10. The second connecting piece 40 is connected between the switch port 2104 and the substrate 10. The first connecting piece 30 and the second connecting piece 40 are spatially coupled. The first filtering module 60 is configured to suppress the ripple signal from being coupled into the switch port 2104 through the spatial coupling.

[0100] In some possible embodiments, the radio frequency switch chip 20 further includes a decoupling capacitor C0 arranged on the die 210. One end of the decoupling capacitor C0 is connected to the power supply port 2102, and the other end is grounded. The resonant frequency of the equivalent inductance of the first connecting piece 30 and the decoupling capacitor C0 is less than or equal to 300 MHz from the signal frequency of the ripple signal.

[0101] In some possible embodiments, the radio frequency switch chip 20 is arranged on the substrate 10 by wire bonding process. The first connecting piece 30 and the second connecting piece 40 are both bonding wires.

[0102] In some possible embodiments, the radio frequency switch chip 20 is arranged on the substrate 10 by flip-chip process. The first connecting piece 30 and the second connecting piece 40 are both metal bumps.

[0103] In some possible embodiments, the power supply port 2102 and the switch port 2104 are two adjacent ports on the die 210.

[0104] In some possible embodiments, the distance between the power supply port 2102 and the switch port 2104 is less than or equal to 150 um.

[0105] In some possible embodiments, the first filtering module 60 can include a first resistor R1 and a first capacitor C1. One end of the first resistor R1 is connected to the power supply port 2102, and the other end of the first resistor R1 is connected to the power supply end of the clock driving unit 520. One end of the first capacitor C1 is connected to the other end of the first resistor R1, and the other end of the first capacitor C1 is grounded.

[0106] In some possible embodiments, the first resistor R1 has a resistance value greater than or equal to 20Ω and less than or equal to 500Ω. The first capacitor C1 has a capacitance value greater than or equal to 10pF and less than or equal to 200pF.

[0107] In some possible embodiments, the analog module 50 can further include a bandgap reference voltage unit and a low dropout linear regulator 540, the bandgap reference voltage unit and the low dropout linear regulator 540 being connected, the bandgap reference voltage unit being configured to provide a reference voltage to the low dropout linear regulator 540. The power supply end of the bandgap reference voltage unit and the power supply end of the low dropout linear regulator 540 are connected with the power supply port 2102 respectively, and the first filter module 60 is connected between the voltage output end 5410 of the low dropout linear regulator 540 and the power supply end of the clock driving unit 520.

[0108] Specifically, the related introduction and specific implementation manners of the features such as the bare chip 210, the analog module 50, the first filter module 60, and the like can refer to the detailed introduction in the foregoing embodiments, which will not be described herein again. In the case of no conflict, other technical features and related technical solutions about the radio frequency switch chip 20 and the radio frequency front-end module 100 in the foregoing embodiments can be combined into the present embodiment, and for the sake of saving space, will not be described herein again.

[0109] Please refer to Figure 8 The present embodiment also provides an electronic device 300, which can be a 4G or 5G communication device such as a smart phone, a tablet computer, a smart watch, and the like. Specifically, the electronic device 300 can include the radio frequency front-end module 100 in the foregoing embodiments to achieve the collection and transmission of radio frequency signals. In other possible embodiments, the electronic device 300 can also include the radio frequency switch chip 20 in the foregoing embodiments.

[0110] In addition, with the development of 5G technology, the requirements for the performance of the radio frequency front-end module are higher and higher, and the technical solutions of the present application can be applied to the 5G radio frequency front-end module to improve the communication performance of the 5G communication device.

[0111] In the present application, some terms are used in the specification and claims to refer to certain components. Those skilled in the art should understand that hardware manufacturers may use different names to refer to the same component. The specification and claims do not distinguish components by name difference, but by functional difference. As mentioned throughout the specification and claims, “including” is an open term, which should be interpreted as “including but not limited to”; “approximately” means that those skilled in the art can solve the technical problem within a certain error range and basically achieve the technical effect.

[0112] In the description of the present application, it should be understood that the terms "upper", "lower", "front", "back", "left", "right", "inner", and "outer" indicate the orientation or positional relationship shown in the drawings, which are only for the convenience of simplifying the description of the present application, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0113] In the present application, unless otherwise explicitly specified or limited, the terms "mounting", "connection", "connecting", "fixing" and the like should be understood in a broad sense. For example, it can be fixedly connected, or detachably connected, or integrally connected; it can be mechanically connected, or electrically connected; it can be directly connected, or indirectly connected through an intermediate medium, or it can be the communication inside two elements, or it can be only surface contact. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0114] In the description of the present application, the description of the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the present application. In the present application, the illustrative description of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described can be combined in any appropriate manner in any one or more embodiments or examples. In addition, those skilled in the art can combine and combine the different embodiments or examples described in the present application and the features of the different embodiments or examples, without contradiction.

[0115] In addition, the terms "first", "second" are only for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features limited by "first", "second" can explicitly or implicitly include at least one of the features. In the description of the present application, the meaning of "multiple" is at least two, such as two, three, etc., unless otherwise explicitly specified.

[0116] Finally, it should be noted that: the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art can understand that the technical solutions recorded in the foregoing embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. A radio frequency front-end module, characterized in that, include: substrate; An RF switch chip is disposed on the substrate; the RF switch chip includes a bare die and an analog module disposed on the bare die; the bare die is provided with a power supply port and a switch port, the switch port being used to transmit RF signals; the analog module includes an oscillator and a clock drive unit, the oscillator being connected to the clock drive unit, the oscillator being used to provide a clock signal to the clock drive unit; A first connector is connected between the power supply port and the substrate; as well as A second connector is connected between the switch port and the substrate; The radio frequency switch chip further includes a first filtering module, which is connected between the power supply port and the power supply terminal of the clock driving unit, and is used to suppress the ripple signal generated by the clock driving unit from coupling into the switch port and affecting the radio frequency signal.

2. The radio frequency front-end module according to claim 1, characterized in that, The first connector and the second connector are spatially coupled; The first filtering module is used to suppress the ripple signal from being coupled into the switch port through the spatial coupling.

3. The radio frequency front-end module according to claim 1, characterized in that, The RF switch chip also includes a decoupling capacitor, which is disposed on the bare chip; one end of the decoupling capacitor is connected to the power supply port, and the other end is grounded.

4. The radio frequency front-end module according to claim 3, characterized in that, The absolute value of the difference between the resonant frequency of the equivalent inductance of the first connector and the decoupling capacitor and the signal frequency of the ripple signal is less than or equal to 300MHz.

5. The radio frequency front-end module according to claim 1, characterized in that, The power supply port and the switch port are two adjacent ports on the bare core; or... The distance between the power supply port and the switch port is less than or equal to 150 μm.

6. The radio frequency front-end module according to claim 1, characterized in that, The radio frequency switch chip is disposed on the substrate using a wire bonding process, and both the first connector and the second connector are bonding wires; or... The radio frequency switch chip is disposed on the substrate using an inverted die process, and both the first connector and the second connector are metal bumps.

7. The radio frequency front-end module according to any one of claims 1 to 6, characterized in that, The first filtering module includes a first resistor and a first capacitor; Wherein, the first end of the first resistor is connected to the power supply port, and the second end of the first resistor is connected to the power supply terminal of the clock drive unit; one end of the first capacitor is connected to the second end of the first resistor, and the other end of the first capacitor is grounded.

8. The radio frequency front-end module according to claim 7, characterized in that, The resistance value of the first resistor is greater than or equal to 20Ω and less than or equal to 500Ω; or / and, The capacitance value of the first capacitor is greater than or equal to 10pF and less than or equal to 200pF.

9. The radio frequency front-end module according to any one of claims 1 to 6, characterized in that, The first filtering module includes a second resistor, a third resistor, and a second capacitor; Wherein, the first end of the second resistor is connected to the power supply port, and the second end of the second resistor is connected to the power supply terminal of the clock drive unit; the first end of the third resistor is grounded, and the second end of the third resistor is connected to the ground terminal of the clock drive unit; the second capacitor is connected between the second end of the second resistor and the second end of the third resistor.

10. The radio frequency front-end module according to any one of claims 1 to 6, characterized in that, The power supply terminal of the oscillator and the power supply terminal of the clock driving unit are connected to form a first designated node; The first filtering module is connected between the power supply port and the first designated node. The first filtering module is also used to suppress the ripple signal generated by the oscillator from being coupled into the switching port to affect the radio frequency signal.

11. The radio frequency front-end module according to claim 10, characterized in that, The radio frequency switch chip further includes a second filtering module, which is connected between the power supply terminal of the oscillator and the power supply terminal of the clock driving unit, so that the power supply terminal of the clock driving unit is connected to the power supply terminal of the oscillator through the second filtering module. The second filtering module is used to suppress the ripple signal generated by the clock driving unit from being coupled into the switching port and affecting the radio frequency signal.

12. The radio frequency front-end module according to claim 11, characterized in that, The second filter module includes a fourth resistor and a third capacitor; The first end of the fourth resistor is connected to the power supply terminal of the oscillator, and the second end of the fourth resistor is connected to the power supply terminal of the clock drive unit; one end of the third capacitor is connected to the second end of the fourth resistor, and the other end of the third capacitor is grounded.

13. The radio frequency front-end module according to any one of claims 1 to 6, characterized in that, The clock drive unit includes one or both of the charge pump and the frequency divider.

14. The radio frequency front-end module according to any one of claims 1 to 6, characterized in that, The simulation module also includes a bandgap reference voltage unit and a low-dropout linear regulator. The bandgap reference voltage unit is connected to the low-dropout linear regulator, and the bandgap reference voltage unit is used to provide a reference voltage to the low-dropout linear regulator. The power supply terminal of the bandgap reference voltage unit and the power supply terminal of the low dropout linear regulator are respectively connected to the power supply port, and the first filter module is connected between the voltage output terminal of the low dropout linear regulator and the power supply terminal of the clock drive unit.

15. The radio frequency front-end module according to claim 14, characterized in that, The RF switch chip also includes a third filtering module, which is connected between the power supply port and the power supply terminal of the bandgap reference voltage unit, and is used to suppress the flow of the RF signal coupled in through the power supply port to the bandgap reference voltage unit.

16. The radio frequency front-end module according to claim 15, characterized in that, The power supply port is connected to the power supply terminal of the bandgap reference voltage unit to form a first power supply branch, the power supply port is connected to the power supply terminal of the low dropout linear regulator to form a second power supply branch, and the third filter module is connected in the first power supply branch.

17. The radio frequency front-end module according to claim 15, characterized in that, The third filtering module includes a fifth resistor and a fourth capacitor; The first end of the fifth resistor is connected to the power supply port, and the second end of the fifth resistor is connected to the power supply terminal of the bandgap reference voltage unit; one end of the fourth capacitor is connected to the second end of the fifth resistor, and the other end of the fourth capacitor is grounded.

18. The radio frequency front-end module according to claim 17, characterized in that, The resistance value of the fifth resistor is greater than or equal to 0.5kΩ and less than or equal to 5kΩ; or / and, The capacitance value of the fourth capacitor is greater than or equal to 0.5pF and less than or equal to 5pF.

19. The radio frequency front-end module according to claim 15, characterized in that, The third filtering module includes a sixth resistor, a seventh resistor, and a fifth capacitor; The first end of the sixth resistor is connected to the power supply port, and the second end of the sixth resistor is connected to the power supply terminal of the bandgap reference voltage unit; the first end of the seventh resistor is grounded, and the second end of the seventh resistor is connected to the ground terminal of the bandgap reference voltage unit; the fifth capacitor is connected between the second end of the sixth resistor and the second end of the seventh resistor.

20. A radio frequency switch chip, characterized in that, include: The bare chip has a power supply port and a switch port, the switch port being used to transmit radio frequency signals; The simulation module is located in the bare core; The analog module includes an oscillator and a clock driving unit. The oscillator is connected to the clock driving unit and is used to provide a clock signal to the clock driving unit. as well as The first filtering module is connected between the power supply port and the power supply terminal of the clock driving unit, and is used to suppress the ripple signal generated by the clock driving unit from coupling into the switching port and affecting the radio frequency signal.

21. The radio frequency switch chip according to claim 20, characterized in that, The radio frequency switch chip is applied to a radio frequency front-end module. The radio frequency front-end module includes a substrate, a first connector, and a second connector. The radio frequency switch chip is disposed on the substrate. The first connector is connected between the power supply port and the substrate. The second connector is connected between the switch port and the substrate. The first connector and the second connector are spatially coupled; the first filtering module is used to suppress the ripple signal from being coupled into the switch port through the spatial coupling.

22. The radio frequency switch chip according to claim 21, characterized in that, The RF switch chip also includes a decoupling capacitor, which is disposed on the bare die; one end of the decoupling capacitor is connected to the power supply port, and the other end is grounded; The absolute value of the difference between the resonant frequency of the equivalent inductance of the first connector and the decoupling capacitor and the signal frequency of the ripple signal is less than or equal to 300MHz.

23. The radio frequency switch chip according to claim 21, characterized in that, The radio frequency switch chip is disposed on the substrate using a wire bonding process, and both the first connector and the second connector are bonding wires; or... The radio frequency switch chip is disposed on the substrate using an inverted die process, and both the first connector and the second connector are metal bumps.

24. The radio frequency switch chip according to any one of claims 20 to 23, characterized in that, The power supply port and the switch port are two adjacent ports on the bare core; or... The distance between the power supply port and the switch port is less than or equal to 150 μm.

25. The radio frequency switch chip according to any one of claims 20 to 23, characterized in that, The first filtering module includes a first resistor and a first capacitor; Wherein, the first end of the first resistor is connected to the power supply port, and the second end of the first resistor is connected to the power supply terminal of the clock drive unit; one end of the first capacitor is connected to the second end of the first resistor, and the other end of the first capacitor is grounded.

26. The radio frequency switch chip according to claim 25, characterized in that, The resistance value of the first resistor is greater than or equal to 20Ω and less than or equal to 500Ω; or / and, The capacitance value of the first capacitor is greater than or equal to 10pF and less than or equal to 200pF.

27. The radio frequency switch chip according to any one of claims 20 to 23, characterized in that, The simulation module also includes a bandgap reference voltage unit and a low-dropout linear regulator. The bandgap reference voltage unit is connected to the low-dropout linear regulator, and the bandgap reference voltage unit is used to provide a reference voltage to the low-dropout linear regulator. The power supply terminal of the bandgap reference voltage unit and the power supply terminal of the low dropout linear regulator are respectively connected to the power supply port, and the first filter module is connected between the voltage output terminal of the low dropout linear regulator and the power supply terminal of the clock drive unit.

28. An electronic device, characterized in that, include: The radio frequency front-end module as described in any one of claims 1 to 19; or, The radio frequency switch chip as described in any one of claims 20 to 27.

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