Single-chip tactile or stress induction active array and application thereof

Abstract

The invention discloses a single-chip tactile or stress sensing active array and application thereof, and belongs to the field of chip application, the single-chip tactile or stress sensing active array comprises a single chip, the chip is provided with a stress sensing unit, the stress sensing unit is used for sensing stress changes and converting the stress changes into digital signals through an ADC, and the digital signals are output through a digital port of the chip; the circuit connection element has a circuit connection function and is used for realizing circuit connection; a plurality of chips form a chip array which is welded on the first surface of the circuit connecting element. The active array further comprises a reinforcing plate and a flexible covering layer, the reinforcing plate is located on the second face of the circuit connecting element, and the flexible covering layer covers the chip array and is used for sensing a stress field. When a finger touches the flexible covering layer, stress can be generated on the chip, signals are led out through the circuit connecting element and processed to perceive touch sense, each node in the chip array completes signal digitization on the single chip in the node, and signal interference caused by a lead is avoided.

Description

Technical Field

[0001] This invention relates to the field of chip application technology, and in particular to a single-chip active array for tactile or stress sensing and its applications. Background Technology

[0002] With the continuous development of robotics technology, humanoid robots are being used more and more widely in industries such as manufacturing, healthcare, and services. To improve the human-robot interaction experience, the robot's tactile perception capabilities are becoming increasingly important, directly affecting the robot's operational accuracy and safety.

[0003] Currently, well-known foreign robotics companies generally use capacitor arrays or resistor arrays to achieve human-like perception of touch and stress. The technical solution involves printing capacitor or resistor arrays in a multi-layered flexible cover plate, sensing pressure through the variable capacitor or resistor array, and then outputting the results through X+Y leads. An external measuring chip continuously scans the array to measure the values ​​of each capacitor or resistor to achieve the perception of touch and stress.

[0004] However, in traditional piezoresistive and piezoresistive passive arrays, each passive device is connected to the measurement chip via long leads, making the analog signal susceptible to interference, especially the capacitor array, which is easily affected by spatial electric fields. Measurement chips used for scanning detection arrays need to scan a large number of cells, and the scan update rate is easily limited by factors such as power consumption, cost, and parasitic capacitance of the connecting lines. Passive arrays generally can only achieve stress-sensitive tactile sensing and are unlikely to simultaneously achieve multimodal sensing of other information such as temperature. Summary of the Invention

[0005] The purpose of this invention is to provide a single-chip active array for tactile or stress sensing and its applications, in order to solve the problems in the prior art.

[0006] To address the aforementioned technical problems, this invention provides a single-chip active array for tactile or stress sensing, comprising: A single chip, wherein the chip is equipped with a stress sensing unit, which is used to sense stress changes and convert the stress changes into digital signals through an ADC, and then output them through the chip's digital port; Circuit connecting elements have circuit connecting functions and are used to realize circuit connections; A chip array, consisting of several chips, is soldered to the first side of the circuit connection element.

[0007] In one feasible implementation, the number of chips in the single-chip tactile or stress-sensing active array is greater than or equal to four.

[0008] In one feasible implementation, the number of chips in the single-chip tactile or stress-sensing active array is greater than or equal to nine.

[0009] In one feasible implementation, the number of chips in the single-chip haptic or stress-sensing active array is greater than or equal to 16.

[0010] In one feasible implementation, the electrical connection of the single-chip tactile or stress-sensing active array includes power lines and ground lines, which are connected to each chip to enable power supply to the chip. The digital output signal of each chip is output to the receiving chip through one or more buses, one or more daisy chains, or an array of row and column lines; Alternatively, the digital output of each chip can be output to the receiving chip completely independently.

[0011] In one feasible implementation, the single-chip tactile or stress-sensing active array further includes a grid support structure with grid holes in which the chip is located.

[0012] In one feasible implementation, the single-chip tactile or stress-sensing active array further includes a reinforcing plate located on the second side of the circuit connection element.

[0013] In one feasible implementation, the length of the reinforcing plate is greater than the width of the mesh hole, such that the mesh hole is supported at both ends of the reinforcing plate.

[0014] In one feasible implementation, the single-chip tactile or stress-sensing active array further includes a flexible overlay layer for covering the chip array.

[0015] In one feasible implementation, a rigid structural member is provided below the grid support structure to support the grid support structure.

[0016] In one feasible implementation, the depth of the mesh aperture is greater than the thickness of the chip, so that the chip remains in a non-contact state with the surface of the rigid structure.

[0017] In one feasible implementation, the reinforcing plate is made of materials including, but not limited to, thin sheets of organic polymer materials, thin sheets of glass fiber or carbon fiber reinforced organic polymer materials, and steel plates.

[0018] In one feasible implementation, a layer of flexible material is pasted or injected onto the side of the chip to prevent the chip from directly contacting the rigid support surface under stress.

[0019] In one feasible implementation, the chip is connected to the circuit connection element via solder ball or other chip soldering or bonding processes.

[0020] In one feasible implementation, the circuit connection element includes, but is not limited to, flexible circuit boards and flexible films.

[0021] In one feasible implementation, the chips are arranged in one direction on a plane, or in different directions.

[0022] In one feasible implementation, the chip can also simultaneously measure temperature, enabling temperature sensing at various points along the array's coverage area.

[0023] In one feasible implementation, the single-chip haptic or stress-sensing active array is used in haptic electronic skin.

[0024] This invention provides a single-chip tactile or stress-sensing active array and its application. It includes a single chip with a stress-sensing unit for sensing stress changes and converting these changes into digital signals via an ADC, which are then output through the chip's digital port. A circuit connection element with circuit connection function is used to implement circuit wiring. Several chips form a chip array, soldered to the first side of the circuit connection element. The active array also includes a reinforcing plate and a flexible covering layer. The reinforcing plate is located on the second side of the circuit connection element, and the flexible covering layer covers the chip array for sensing the stress field. When a finger touches the flexible covering layer, stress is generated on the chip. The signal is transmitted and processed through the circuit connection element to perceive the touch. Each node in the chip array digitizes the signal on a single chip within the node, avoiding signal interference caused by leads. Because the circuit connection element is a flexible circuit board or flexible film, and the reinforcing plate has high rigidity, it can better conduct stress to the chip. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 This is a schematic diagram of a single-chip active array provided by the present invention.

[0027] Figure 2 This is a schematic diagram of the structure of the grid substrate provided by the present invention.

[0028] Figure 3 This is a schematic diagram illustrating the application of a single-chip active array in tactile sensing provided by the present invention. Detailed Implementation

[0029] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0030] Unless otherwise specified, the terms "connection" and "linkage" used in this application are not limited to physical or mechanical connections, but can include electrical communication connections, whether direct or indirect. In the description of this application, it should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "middle," "between," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0031] In this application, unless otherwise expressly specified and limited, "above" or "below" the second feature can mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" of the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature. Moreover, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion.

[0032] This invention provides a single-chip active array for tactile or stress sensing, the cross-sectional structure of which is as follows: Figure 1 As shown, it includes a rigid structural component 1, on which a mesh support structure 2 is laid. The rigid structural component 1 is used to support the mesh support structure 2. The mesh support structure 2 is provided with mesh holes, and the chip is located in the mesh holes.

[0033] A circuit connection element 3 is provided above the grid support structure 2. The material of the circuit connection element 3 can be a flexible circuit board, a flexible film, or other components with circuit connection functions, used to realize circuit wiring. The electrical connection of the single-chip tactile or stress-sensing active array includes power lines and ground lines, connected to each chip to realize the power supply to the chip; the digital output signal of each chip is output to the receiving chip through one or more buses, or one or more daisy chains, or an array composed of row lines and column lines; or the digital output of each chip can also be output to the receiving chip completely independently.

[0034] The circuit connection element 3 is connected to the chip 4 on the side near the rigid structure 1 by solder balls or other chip soldering or bonding processes. The chip 4 is suspended in the mesh hole of the mesh support structure 2. Since the thickness of the mesh support structure 2 (i.e. the depth of the mesh hole) is not less than the thickness of the chip 4, the chip 4 is kept in a non-contact state with the rigid structure 1, so as to avoid the chip 4 from hitting the rigid structure 1 and breaking when subjected to stress.

[0035] A reinforcing plate 5 is located on the side of the circuit connection element 3 away from the rigid structural component 1. The reinforcing plate 5 is made of a thin sheet of organic polymer material, a thin sheet of organic polymer material reinforced with glass fiber or carbon fiber, or a steel plate. The length of the reinforcing plate 5 is greater than the width of the mesh holes, so that the mesh holes are supported at both ends of the reinforcing plate 5. The reinforcing plate 5 can be suspended on the mesh holes of the mesh support structure 2. The reinforcing plate 5 and the chip 4 are located on both sides of the circuit connection element 3, respectively.

[0036] If the mesh support structure 2 is not used, a layer of flexible material can be pasted or injected on the side of the chip 4 close to the rigid structure 1 to prevent the chip 4 from directly contacting the surface of the rigid structure 1 under stress.

[0037] Above the reinforcing plate 5 is a flexible covering layer 6 for sensing the stress field. The single-chip active array can be applied to tactile electronic skin, such as... Figure 3 As shown, when a finger touches the flexible cover layer 6, stress is generated on the chip 4. The signal is transmitted and processed through the circuit connection element 3 to perceive the touch. Each node in the chip array digitizes the signal on a single chip within the node, avoiding signal interference caused by leads. Since the circuit connection element 3 is made of flexible material, while the reinforcing plate 5 has high rigidity, it can be used to prevent the chip 4 from cracking under stress.

[0038] In this embodiment, in addition to sensing stress changes, the chip can also measure temperature simultaneously, enabling temperature sensing at various points along the array coverage area.

[0039] This invention does not limit the number of chips in the active array. From the perspective of array construction, at least 4 chips are required to form a minimum 2×2 chip array; or at least 9 chips are required to form a 3×3 chip array. This embodiment uses 16 chips as an example to form a 4×4 chip array. Correspondingly, the grid support structure 2 has 4 rows and 4 columns. Figure 2 As shown.

[0040] Chip 4 can be arranged entirely along one axis (x-axis or y-axis) on the horizontal plane (xy-axis), or arranged along two perpendicular directions (x-axis and y-axis) on the horizontal plane. Both arrangements can sense stress in the vertical direction (z-axis); however, the former arrangement can only sense stress in one axis (x-axis or y-axis) on the horizontal plane, while the latter arrangement can sense stress in both axes (x-axis and y-axis) on the horizontal plane.

[0041] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0042] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A single-chip active array for tactile or stress sensing, characterized in that, include: A single chip, wherein the chip is equipped with a stress sensing unit, which is used to sense stress changes and convert the stress changes into digital signals through an ADC, and then output them through the chip's digital port; Circuit connecting elements have circuit connecting functions and are used to realize circuit connections; A chip array, consisting of several chips, is soldered to the first side of the circuit connection element.

2. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The number of chips in the single-chip tactile or stress-sensing active array is greater than or equal to four.

3. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The number of chips in the single-chip tactile or stress-sensing active array is greater than or equal to nine.

4. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The number of chips in the single-chip tactile or stress-sensing active array is greater than or equal to 16.

5. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The electrical connections of the single-chip tactile or stress-sensing active array include power lines and ground lines, which are connected to each chip to provide power to the chip. The digital output signal of each chip is output to the receiving chip through one or more buses, one or more daisy chains, or an array of row and column lines; Alternatively, the digital output of each chip can be output to the receiving chip completely independently.

6. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The single-chip tactile or stress-sensing active array also includes a grid support structure, which has grid holes in which the chip is located.

7. The single-chip tactile or stress-sensing active array as described in claim 6, characterized in that, The single-chip tactile or stress-sensing active array also includes a reinforcing plate located on the second side of the circuit connection element.

8. The single-chip tactile or stress-sensing active array as described in claim 7, characterized in that, The length of the reinforcing plate is greater than the width of the mesh holes, so that the mesh holes are supported at both ends of the reinforcing plate.

9. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The single-chip tactile or stress-sensing active array also includes a flexible cover layer for covering the chip array.

10. The single-chip tactile or stress-sensing active array as described in claim 6, characterized in that, A rigid structural member is provided below the grid support structure to support the grid support structure.

11. The single-chip tactile or stress-sensing active array as described in claim 10, characterized in that, The depth of the mesh holes is greater than the thickness of the chip, so that the chip remains in a non-contact state with the surface of the rigid structure.

12. The single-chip tactile or stress-sensing active array as described in claim 7, characterized in that, The reinforcing plate is made of materials including, but not limited to, thin sheets of organic polymer materials, thin sheets of glass fiber or carbon fiber reinforced organic polymer materials, and steel plates.

13. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, A layer of flexible material is pasted or injected onto one side of the chip for bonding, which prevents the chip from directly contacting the rigid support surface under stress.

14. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The chip is connected to the circuit connection element by solder ball or other chip soldering or bonding processes.

15. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The circuit connection elements include, but are not limited to, flexible circuit boards and flexible films.

16. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The chips can be arranged in one direction or in different directions on a plane.

17. The single-chip tactile or stress-sensing active array as described in claim 1, characterized in that, The chip can also measure temperature simultaneously, enabling temperature sensing at various points along the array's coverage area.

18. A single-chip tactile or stress-sensing active array based on any one of claims 1-17, characterized in that, Application of the single-chip tactile or stress-sensing active array in tactile electronic skin.

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