Vapor chamber and preparation method thereof

Abstract

The invention provides a vapor chamber and a preparation method thereof. The vapor chamber comprises a lower cover, an upper cover, a capillary structure and a liquid working medium, the capillary structure comprises a plate body, the plate body is defined to be divided into a first area, a second area and a third area, and two opposite side surfaces of the plate body are a first surface and a second surface; the third area comprises a plurality of first ribs and a plurality of second ribs; the first area comprises a plurality of first protruding structures, a plurality of first through holes and a plurality of third ribs. Each first convex structure comprises a plurality of first convex points; and each third rib is connected with the adjacent second rib into a whole. According to the vapor chamber, a three-dimensional structure with the capillary being 3D can be manufactured on the plate body, the capillary force of the first area and the capillary force of the third area can be improved, rapid backflow of the liquid working medium can be improved, the evaporation capacity of the liquid working medium is reduced, and the effect that steam entrains the liquid working medium to a condensation area is reduced.

Description

Technical Field

[0001] This invention relates to the field of temperature riser technology, and more particularly to a temperature riser and its preparation method. Background Technology

[0002] With the rapid development of electronic components and integrated circuits, electronic components generate a large amount of heat during operation. For example, computer CPUs and semiconductor lasers generate a significant amount of heat during operation. The reliability of electronic devices is extremely sensitive to temperature. When the temperature of electronic components reaches 70-80℃, the reliability of the electronic device decreases by 5% for every 1℃ increase. Therefore, heat dissipation has become a key issue in the miniaturization of electronic devices. To ensure that electronic components operate at normal temperatures, heat sinks are typically installed on them for heat dissipation. Additionally, a vapor chamber with good thermal conductivity is placed between the heat sink and the electronic components. The vapor chamber's function is to distribute the heat from the heated electronic components evenly before it is dissipated through the heat sink.

[0003] The vapor chamber mainly includes a lower cover, an upper cover, a capillary structure fixed to the lower cover and located inside the upper and lower covers, and a liquid working fluid contained in the upper and lower covers. Among them, the capillary structure is the main structure, and the capillary force and permeability of the capillary structure directly affect the heat dissipation performance of the vapor chamber. In related technologies, the capillary structure of a vapor chamber mainly includes an evaporation region near the heat source, a condensation region away from the heat source, and a transition region between the evaporation and condensation regions for liquid recirculation. The capillary structure is formed by interlacing metal wires, which creates an angle between the wires and the lower cover, thus generating capillary force. Although the capillary structure formed by interlacing metal wires can generate capillary force, it is still relatively weak. Furthermore, the transition region in the capillary structure has gaps and pores, which increases the evaporation rate of the liquid working medium in the transition region. This improves the effect of steam carrying liquid to the condensation region, but the water storage capacity is weak, and it cannot achieve a better recirculation effect. Summary of the Invention

[0004] To address the shortcomings of the aforementioned related technologies, this invention proposes a novel heat spreader and its preparation method. This addresses the problem that in related technologies, the capillary structure of the heat spreader is formed by interlacing metal wires, resulting in relatively weak capillary force in the transition region of the capillary structure. This leads to an increase in the evaporation of the liquid working fluid, improving the effect of steam carrying liquid to the condensation zone. Additionally, it reduces the water storage capacity of the third region, making it impossible to achieve a better reflux effect.

[0005] To solve the above-mentioned technical problems, in a first aspect, the present invention provides a heat spreader for dissipating heat from a heat source, comprising a lower cover, an upper cover fixed to the lower cover and forming a receiving space together with the lower cover, a capillary structure fixed in the receiving space, and a liquid working fluid contained in the receiving space. The capillary structure includes a plate, and the region of the plate near the heat source is defined as a first region, the region of the plate away from the heat source is defined as a second region, and the region of the plate between the first region and the second region is defined as a third region. The plate has two opposite sides along its thickness direction, namely a first surface and a second surface; the first surface faces the lower cover, and the second surface faces the upper cover; the third region includes a plurality of first ribs formed by stamping from the second surface toward the first surface and spaced apart, and a plurality of second ribs formed by stamping from the first surface toward the second surface and spaced apart; the first ribs and the second ribs extend along a first direction, and the plurality of first ribs and the plurality of second ribs are spaced apart and staggered along a second direction, the second direction being perpendicular to the first direction; the first ribs are fixed to the lower cover; The first region includes a plurality of first protruding structures formed by stamping from the second surface toward the first surface and spaced apart, a plurality of first through holes penetrating the plate and spaced apart, and a plurality of third ribs formed by stamping from the first surface toward the second surface and spaced apart; each first protruding structure includes a plurality of first protrusions spaced apart along the first direction, the third ribs extending along the first direction, the plurality of first protruding structures and the plurality of third ribs being spaced apart along the second direction and arranged in an alternating manner; the first protrusions are fixed to the lower cover; each third rib is connected integrally with its adjacent second rib.

[0006] Preferably, the receiving space includes a first space formed by the plate and the lower cover and a second space formed by the plate and the lower cover; in the thickness direction of the plate, the third region blocks the communication between the first space and the second space and is used for the reflux of the liquid working fluid.

[0007] Preferably, each of the third ribs and the lower cover forms a raised space that is connected to the adjacent second rib and the lower cover forming a transmission channel for the flow of the liquid working fluid.

[0008] Preferably, the second region includes a plurality of second protruding structures formed by stamping from the second surface toward the first surface and spaced apart, and a plurality of second through holes that penetrate the plate and are structurally configured therethrough; each of the second protruding structures includes a plurality of second protrusions spaced apart.

[0009] Preferably, the second region further includes a plurality of third protrusions formed by stamping from the first surface toward the second surface and spaced apart; each of the third protrusions includes a plurality of third protrusions spaced apart along the first direction, a plurality of second protrusions spaced along the first direction, and the plurality of second protrusions and the plurality of third protrusions spaced apart along the second direction and arranged in an alternating manner.

[0010] Preferably, the first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations extending through it.

[0011] Preferably, the second region is covered with a second film on the side near the top cover; the second film has a plurality of second perforations extending through it.

[0012] Preferably, the third region is covered with a third film on the side closest to the top cover.

[0013] Preferably, the first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations therethrough; the second region is covered with a second film on the side near the top cover, and the second film has a plurality of second perforations therethrough; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations therethrough; the porosity of the first film and the porosity of the second film are both greater than or equal to the porosity of the third film; or, The first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations therethrough; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations therethrough; the porosity of the first film is greater than or equal to the porosity of the third film; or, The second region is covered with a second film on the side near the top cover, and the second film has a plurality of second perforations through it; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations through it; the porosity of the second film is greater than or equal to the porosity of the third film.

[0014] Preferably, the distance between the first surface and the second surface along the thickness direction of the plate is 0.005~0.025mm.

[0015] Preferably, along the thickness direction of the plate, the distance between the end of the first protrusion away from the first surface and the end of the third rib away from the second surface is 0.03~0.6mm.

[0016] Preferably, the plurality of first through holes are respectively disposed within the first protrusion and within the third rib.

[0017] Preferably, the plurality of first through holes are respectively disposed outside the first protrusion and outside the third rib.

[0018] Preferably, the diameter of the first through hole is 0.01~0.08mm.

[0019] Preferably, the distance between two adjacent first through holes is 0.1~0.3mm.

[0020] Secondly, the present invention provides a method for preparing a heat spreader, the heat spreader being used to dissipate heat from a preset heat source, comprising the following steps: Obtain a plate having a first surface and a second surface that are relatively arranged; the plate has a plurality of preset first regions, a plurality of second regions, and a third region located between adjacent first regions and second regions; The plate is stamped so that all the first regions, all the second regions and all the third regions have protrusions that protrude from the first surface; The plate is perforated such that all the first regions and all the second regions have through holes therethrough. The outer surface of the plate is roughened to form a rough surface on at least a portion of the outer surface of the plate. The plate is subjected to a hydrophilic treatment to make its surface hydrophilic. The plate is cut into the desired shape to obtain a capillary structure; each capillary structure has an integrally formed first region, a second region, and a third region; Assemble the upper cover, lower cover, and capillary structure so that the first region is close to the preset heat source; A liquid working fluid is injected into the containment space formed by the upper cover and the lower cover to obtain the temperature equalization plate.

[0021] Compared with related technologies, the capillary structure of the present invention, by providing a plurality of first ribs formed by stamping in the direction from the second surface toward the first surface and spaced apart in the third region, and a plurality of second ribs formed by stamping in the direction from the first surface toward the second surface and spaced apart, and further providing a plurality of first protruding structures formed by stamping in the direction from the second surface toward the first surface and spaced apart in the first region, a plurality of first through holes penetrating the plate and spaced apart, and a plurality of third ribs formed by stamping in the direction from the first surface toward the second surface and spaced apart, defines each first protruding structure as including a plurality of first protrusions spaced apart along the first direction, and each third rib is integrally connected with its adjacent second rib. Thus, a 3D capillary structure can be fabricated on the plate, which not only enhances the capillary force in the first and third regions, but also improves the rapid reflux of the liquid working fluid, reduces the evaporation of the liquid working fluid, and reduces the effect of vapor carrying the liquid working fluid to the condensation zone. Attached Figure Description

[0022] The present invention will now be described in detail with reference to the accompanying drawings. The above and other aspects of the present invention will become clearer and more readily understood through the detailed description following the accompanying drawings. In the drawings: Figure 1 This is a cross-sectional view of a module portion of a heat spreader provided in an embodiment of the present invention; Figure 2 A perspective view of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 3 for Figure 2 Enlarged view of the structure of part A in the middle; Figure 4 This is a right view of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 5 This is a partial top view of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 6 This is a front view of the structural portion of the first region of the first type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 7 Figure (a) shows the upper and lower covers using perforated welding, and Figure (b) shows the upper and lower covers using surface welding. Figure 8 This is a front view of the second type of capillary structure in the heat spreader provided in an embodiment of the present invention; Figure 9 for Figure 8 Enlarged view of the structure of section B; Figure 10The first and second regions of the second type of capillary structure in the heat spreader provided in the embodiment of the present invention are partially covered by thin films, wherein (c) is a partial structural diagram of the second region covered by the second thin film, and (d) is a partial structural diagram of the first region covered by the first thin film.

[0023] Among them, 100 is a heat spreader; 1 is a lower cover; 10 is a receiving space; 2 is an upper cover; 21 is a protrusion; 3 is a welded part; 4 is a capillary structure; 41 is a plate; 411 is a first region; 4111 is a first protruding structure; 41111 is a first protrusion; 4112 is a first through hole; 4113 is a third rib; 4114 is a first film; 412 is a second region; 4121 is a second protruding structure; 41211 is a second protrusion; 4122 is a second through hole; 4123 is a third protruding structure; 41231 is a third protrusion; 4124 is a second film; 413 is a third region; 4131 is a first rib; 4132 is a second rib; 414 is a first surface; and 415 is a second surface. Detailed Implementation

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains; the terminology used herein in the specification of the application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application; the terms "comprising" and "having," and any variations thereof, in the specification, claims, and foregoing drawings of this application, are intended to cover non-exclusive inclusion. The terms "first," "second," etc., in the specification, claims, or foregoing drawings of this application are used to distinguish different objects, not to describe a particular order.

[0025] In this document, the term "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of this application. The appearance of this phrase in various places throughout the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Example 1 This invention provides a heat spreader 100, combined with... Figures 1 to 10 As shown, it includes a lower cover 1, an upper cover 2 that is fixed to the lower cover 1 and together with the lower cover 1 forms a receiving space 10, a capillary structure 4 that is fixed to the receiving space 10, and a liquid working fluid that is received in the receiving space 10.

[0028] The heat spreader 100 is used to dissipate heat from the heat source, which is the electronic component that generates heat.

[0029] The upper cover 2 has a protrusion on the side near the lower cover 1 that abuts against the end of the second rib 4132 away from the first surface 414.

[0030] The protrusion is formed by extending from the side of the upper cover 2 near the lower cover 1 or by stamping from the side of the upper cover 2 away from the lower cover 1 toward the lower cover 1. Of course, depending on actual needs, the protrusion can also be formed by extending from the side of the upper cover 2 near the lower cover 1. In this embodiment, the protrusion includes a plurality of spaced protrusions, which allows the heat spreader 100 to have more receiving space 10 to receive the liquid working fluid.

[0031] like Figure 7 As shown, the upper cover 2 is fixed to the lower cover 1 by welding. The welding position is the welding part 3, which has two welding methods: one is through-hole welding, such as... Figure 7 As shown in (a), another type is surface welding, such as Figure 7 As shown in (b) of the diagram.

[0032] The capillary structure 4 includes a plate 41. The region of the plate 41 near the heat source is defined as the first region 411, the region of the plate 41 away from the heat source is defined as the second region 412, and the region of the plate 41 between the first region 411 and the second region 412 is defined as the third region 413. The two opposite sides of the plate 41 along its thickness direction are the first surface 414 and the second surface 415, respectively. The first surface 414 faces the lower cover 1, and the second surface 415 faces the upper cover 2.

[0033] The material of plate 41 is SUS316L (316L stainless steel) or C1020 (oxygen-free copper or tough copper). Of course, depending on the actual needs, plate 41 can also be made of non-metallic materials.

[0034] The first region 411 can be called the hot zone or evaporation zone, which has the functions of evaporation and liquid working fluid reflux; the second region 412 can be called the cold zone or condensation zone, which has the functions of condensation and liquid working fluid reflux; the third region 413 can be called the cold-hot transition zone or transition zone, which has the function of liquid working fluid reflux.

[0035] The third region 413 includes a plurality of first ribs 4131 stamped from the second surface 415 toward the first surface 414 and spaced apart, and a plurality of second ribs 4132 stamped from the first surface 414 toward the second surface 415 and spaced apart; the first ribs 4131 and the second ribs 4132 extend along a first direction, and the plurality of first ribs 4131 and the plurality of second ribs 4132 are spaced apart and staggered along a second direction, the second direction being perpendicular to the first direction; the first ribs 4131 are fixed to the lower cover 1. The first direction is... Figure 2 or Figure 8 The X-axis is in the middle, and the second direction is... Figure 2 or Figure 8 The Y-axis in the equation.

[0036] In related technologies, the diameter of the metal wires used in capillary structures is generally 0.022mm, 0.025mm, 0.03mm, etc., resulting in an overall thickness of generally 0.04~0.8mm. For example... Figure 5 As shown, in order to reduce the thickness of its capillary structure 4, this embodiment limits the thickness H1 of the plate 41 to 0.005~0.025mm, that is, along the thickness direction of the plate 41, the distance between the first surface 414 and the second surface 415 is 0.005~0.025mm, preferably 0.01mm, and along the thickness direction of the plate 41, the distance H2 between the end of the first protrusion 41111 away from the first surface 414 and the end of the third rib 4113 away from the second surface 415 is 0.03~0.6mm. Of course, according to actual needs, the distance H2 can also be limited to the range of 0.02~0.2mm.

[0037] The containment space 10 includes a first partition space formed by the plate 41 and the lower cover 1, and a second partition space formed by the plate 41 and the lower cover 1. In the thickness direction of the plate 41, a third region 413 blocks the communication between the first and second partition spaces and is used for the reflux of the liquid working fluid. Blocking the communication between the first and second partition spaces enhances the water storage capacity of the third region 413, giving it a better reflux effect.

[0038] The first region 411 includes a plurality of first protruding structures 4111 formed by stamping from the second surface 415 toward the first surface 414 and spaced apart, a plurality of first through holes 4112 penetrating the plate 41 and spaced apart, and a plurality of third ribs 4113 formed by stamping from the first surface 414 toward the second surface 415 and spaced apart; each first protruding structure 4111 includes a plurality of first protrusions 41111 spaced apart along the first direction, and the third ribs 4113 extend along the first direction; the plurality of first protruding structures 4111 and the plurality of third ribs 4113 are respectively spaced apart along the second direction and arranged in an alternating manner; the first protrusions 41111 are fixed to the lower cover 1.

[0039] The spacing between any two adjacent first protrusions 41111, the spacing between any two adjacent first protrusions 4111, the spacing between any two adjacent first ribs 4131, the spacing between any two adjacent second ribs 4132, and the spacing between any two adjacent third ribs 4113 in each first protruding structure 4111 are all the same. Of course, depending on actual requirements, the spacing between any two adjacent first protrusions 41111, the spacing between any two adjacent first protrusions 4111, the spacing between any two adjacent first ribs 4131, the spacing between any two adjacent second ribs 4132, and the spacing between any two adjacent third ribs 4113 in each first protruding structure 4111 can all be set to different values.

[0040] like Figure 6 As shown, the diameter R of the first through hole 4112 is 0.01~0.08mm. Since the liquid working fluid in the capillary structure 4 evaporates and overflows through the first through hole 4112, if the diameter of the first through hole 4112 is too small, the steam cannot diffuse in time, reducing the steam pressure in the heat spreader 100100, and preventing the steam from quickly reaching the condensation zone for condensation and reflux. If the diameter of the first through hole 4112 is too large, the capillary structure 4 will shrink, resulting in a decrease in the liquid storage capacity of the capillary structure 4, thereby affecting the ultimate power of the capillary structure 4. It will also cause a decrease in the pressure-bearing capacity of the capillary structure 4, making the capillary structure 4 unable to withstand the pressure transmitted to the capillary by the receiving space 10 of the upper cover 2 and the lower cover 1 after vacuuming, damaging the capillary microstructure, and affecting the capillary force and liquid storage capacity, etc.

[0041] like Figure 6 As shown, the distance L between two adjacent first through holes 4112 is 0.1~0.3mm. If the distance between two adjacent first through holes 4112 is too small, the requirements for mold precision and material strength are higher, and molding is more difficult; if the distance between two adjacent second through holes 4122 is too large, the area ratio of the first through holes 4112 is reduced, the amount of steam overflow channel is reduced, the steam pressure in the heat spreader 100 is reduced, and the steam cannot quickly reach the condensation zone for condensation and reflux.

[0042] Multiple first through holes 4112 are respectively disposed inside the first protruding structure 4111 and the third rib 4113; of course, according to actual needs, multiple first through holes 4112 are respectively disposed outside the first protruding structure 4111 and the third rib 4113.

[0043] Each third rib 4113 is integrally connected to its adjacent second rib 4132. This design improves the reflux effect of the liquid working fluid, resulting in less evaporation.

[0044] Each of the raised spaces formed by the third rib 4113 and the lower cover 1 is connected to the raised spaces formed by the adjacent second rib 4132 and the lower cover 1, and together they form a transmission channel for the flow of liquid working fluid. This design can better provide a flow path for the liquid working fluid, thereby further improving the reflux effect of the liquid working fluid and reducing its evaporation.

[0045] Alternatively, the distance by which the third rib 4113 protrudes from the second surface 415 can be set to be greater than the distance by which the first protrusion 41111 protrudes from the first surface 414. Although this design will increase the thickness of the capillary structure 4, it can increase the storage capacity of the liquid working fluid, resulting in a higher maximum flow rate.

[0046] The second region 412 includes a plurality of second protruding structures 4121 formed by stamping from the second surface 415 toward the first surface 414 and spaced apart, and a plurality of second through holes 4122 that penetrate the plate 41 and are structurally provided; each second protruding structure 4121 includes a plurality of second protrusions 41211 spaced apart.

[0047] The spacing between two adjacent second protrusions 41211 in each second protrusion structure 4121 is the same as the spacing between two adjacent second protrusions 4121, and both are smaller than the spacing between two adjacent first protrusions 4111. This design allows for a denser 3D structure in the second region 412, enhancing the capillary force in this region and enabling the liquid working fluid to rapidly condense and reflux. Of course, depending on actual needs, the spacing between two adjacent second protrusions 41211 in each second protrusion structure 4121 can also be different from the spacing between two adjacent second protrusions 4121, or it can be no less than the spacing between two adjacent first protrusions 4111.

[0048] Multiple second through holes 4122 are respectively disposed within the second protruding structure 4121; of course, according to actual needs, multiple second through holes 4122 are respectively disposed outside the fifth protruding structure 4121 and outside the sixth protruding structure 4122.

[0049] like Figure 3As shown, the structures of the first protrusion 41111 and the second protrusion 41211 are basically the same, such as the height of the protrusion and the diameter of the protrusion; the structure and position of the second through hole 4122 are also basically the same as the structure and position of the first through hole 4112, such as the diameter of the through hole, the spacing between adjacent through holes, and the setting position of the through hole; examples will not be given here.

[0050] Compared with related technologies, the capillary structure 4 of the present invention provides a plurality of first ribs 4131 formed by stamping in the direction from the second surface 415 toward the first surface 414 and spaced apart in the third region 413, and a plurality of second ribs 4132 formed by stamping in the direction from the first surface 414 toward the second surface 415 and spaced apart in the first region 411. It also provides a plurality of first protruding structures 4111 formed by stamping in the direction from the second surface 415 toward the first surface 414 and spaced apart in the first region 411, a plurality of first through holes 4112 penetrating the plate 41 and spaced apart in the first region 411, and a plurality of third ribs 4113 formed by stamping in the direction from the first surface 414 toward the second surface 415 and spaced apart in the first region 411. Each first protruding structure 4111 includes a plurality of first protrusions 41111 spaced apart along the first direction, and each third rib 4113 is connected to its adjacent second rib 4132 as a whole. This allows for the creation of a 3D capillary structure on plate 41, which not only enhances the capillary force of the first region 411 and the third region 413, but also improves the rapid reflux of the liquid working fluid, reduces the evaporation of the liquid working fluid, and reduces the effect of vapor carrying the liquid working fluid to the condensation zone.

[0051] In this embodiment, the capillary structure 4 also provides a plurality of first protruding structures 4111 formed by stamping from the second surface 415 toward the first surface 414 and spaced apart, and a plurality of third ribs 4113 formed by stamping from the first surface 414 toward the second surface 415 and spaced apart, in a first region 411 near the heat source end of the plate 41. The plurality of first protruding structures 4111 and the plurality of third ribs 4113 are respectively spaced apart along the second direction and arranged in an alternating manner, which is equivalent to stamping a 3D capillary structure on the plate 41. This not only allows the aperture of the first through hole 4112 to be smaller, but also takes into account the capillary force and permeability of the capillary structure 4. In addition, the setting position of the first through hole 4112 can be selected in a targeted manner to ensure that there is only liquid reflux in the non-heat input area, thereby reducing the problem of slowed liquid return speed and reduced liquid return volume caused by liquid working fluid evaporation.

[0052] In this embodiment, the structure of the second region 412, in conjunction with the structures of the first region 411 and the second region 412, allows for the design of different flow channels according to different needs, such as different thicknesses and special structures, which can enhance the adaptability of the capillary structure 4. At the same time, it can also enable different regions to have different functions and design the capillary reflux speed according to needs.

[0053] Example 2 In this embodiment, as Figures 7 to 9 As shown, the third region 413 includes a plurality of first ribs 4131 formed by stamping from the second surface 415 toward the first surface 414 and spaced apart, and a plurality of second ribs 4132 formed by stamping from the first surface 414 toward the second surface 415 and spaced apart; the first ribs 4131 and the second ribs 4132 extend along a first direction, and the plurality of first ribs 4131 and the plurality of second ribs 4132 are spaced apart along a second direction and arranged in an alternating manner, the second direction being perpendicular to the first direction; the first ribs 4131 are fixed to the lower cover 1.

[0054] The first region 411 includes a plurality of first protruding structures 4111 formed by stamping from the second surface 415 toward the first surface 414 and spaced apart, a plurality of first through holes 4112 penetrating the plate 41 and spaced apart, and a plurality of third ribs 4113 formed by stamping from the first surface 414 toward the second surface 415 and spaced apart; each first protruding structure 4111 includes a plurality of first protrusions 41111 spaced apart along the first direction, and the third ribs 4113 extend along the first direction; the plurality of first protruding structures 4111 and the plurality of third ribs 4113 are respectively spaced apart along the second direction and arranged in an alternating manner; the first protrusions 41111 are fixed to the lower cover 1; each third rib 4113 is connected to its adjacent second rib 4132 as a whole.

[0055] Unlike Example 1, as Figure 8 and Figure 9 As shown, the second region 412 also includes a plurality of third protrusions 4123 formed by stamping from the first surface 414 toward the second surface 415 and spaced apart; each third protrusion 4123 includes a plurality of third protrusions 41231 spaced apart along the first direction, a plurality of second protrusions 41211 spaced along the first direction, and the plurality of second protrusions 4121 and the plurality of third protrusions 4123 spaced apart along the second direction and arranged in an alternating manner.

[0056] The spacing between two adjacent third protrusions 41231, the spacing between two adjacent third protrusions 4123, and the spacing between two adjacent second protrusions 4121 in each third protrusion structure 4123 are the same. Of course, depending on actual needs, the spacing between two adjacent third protrusions 41231, the spacing between two adjacent third protrusions 4123, and the spacing between two adjacent second protrusions 4121 in each third protrusion structure 4123 can also be different.

[0057] By adding a third protruding structure 4123, the density of the 3D capillary structure 4 in the second region 412 can be further improved, resulting in better capillary force and allowing the working fluid to condense and reflux rapidly.

[0058] Example 3 Unlike Embodiment 1, in the capillary structure 4 of this embodiment, as shown in the example... Figure 10 As shown in (d), the first region 411 is covered with a first film 4114 on the side near the upper cover 2, and the first film 4114 is provided with a plurality of first perforations passing through it; the first film 4114 covers the end point of the third rib 4113.

[0059] like Figure 10 As shown in (c), the second region 412 is covered with a second film 4124 on the side near the top cover 2; the second film 4124 is provided with a plurality of second perforations passing through it; the second film 4124 covers the end point of the third protrusion 41231.

[0060] The third region 413 is covered with a third film on the side near the top cover 2; the third film covers the end point of the second rib 4132.

[0061] The porosity of the first film 4114 and the porosity of the second film 4124 are both greater than or equal to the porosity of the third film.

[0062] Of course, depending on actual needs, the film can also be set in only one or two of the first region 411, the second region 412 and the third region 413.

[0063] Since the capillary structure 4 in this embodiment only adds a thin film to any one or more of the first region 411, the second region 412 and the third region 413, and sets corresponding perforations on the thin film, it can also achieve the technical effect achieved by the capillary structure 4 in embodiment 1, and will not be elaborated here.

[0064] Example 4 This embodiment provides a method for preparing a heat spreader, which includes the following steps: S1. Obtain a plate having a first surface and a second surface that are set relative to each other; the plate has a plurality of preset first regions, a plurality of second regions, and a third region located between adjacent first regions and second regions.

[0065] S2. Stamp the plate so that all first regions, all second regions and all third regions have protruding structures protruding from the first surface.

[0066] The protruding structures protruding from the first surface are the first rib, the first protrusion, and the second protrusion; if all first regions, all second regions, and all third regions also have protruding structures protruding from the second surface, the protruding structures protruding from the second surface are the second rib, the third rib, and the third protrusion.

[0067] Both the first and second protrusions are precision stamped.

[0068] S3. Make holes in the plate so that all first regions and all second regions have through holes.

[0069] The through hole is the aforementioned first through hole and second through hole.

[0070] Through holes can be formed by one of the following methods: laser drilling, etching, or precision punching.

[0071] If etching is used to create holes, a rough surface can be etched around the holes and on the inner walls of the holes to enhance vaporization and boiling heat transfer in the corresponding areas. Other methods to increase roughness include sandblasting, chemical etching, mechanical polishing, or using abrasive rolling wheels during the rolling of the raw material of the plate. The ultimate goal is to increase the hydrophilicity of the plate.

[0072] S4. Roughen the outer surface of the plate to make at least part of the outer surface of the plate rough.

[0073] The outer surface includes at least a portion of the first surface and / or at least a portion of the second surface.

[0074] Roughness treatment methods include: rolling with an abrasive rolling wheel after obtaining the plate; and / or, etching when making holes in the plate; and / or, sandblasting, chemical etching or mechanical polishing when hydrophilic treatment of the plate.

[0075] S5. Perform hydrophilic treatment on the board to make the surface of the board hydrophilic.

[0076] Before hydrophilic treatment, the sheet material needs to be rolled up to facilitate the process. Hydrophilic treatment can be performed after the sheet material is obtained, after stamping, or after drilling.

[0077] The hydrophilic treatment method can be any one of the following: high-temperature atmosphere immersion, laser texturing, chemical deposition, hydrophilic treatment of aluminum film, micro-etching, or graphene or carbon nanotube coating. The high-temperature atmosphere in the high-temperature immersion method includes, but is not limited to, an oxygen-containing environment; the immersion uses a special aqueous solution, including but not limited to water; and the laser texturing method includes femtosecond lasers, etc.

[0078] S6. Cut the plate into the desired shape to obtain a capillary structure; the capillary structure has an integrally formed first region, a second region, and a third region.

[0079] S7. Assemble the upper cover, lower cover, and capillary structure so that the first area is close to the preset heat source.

[0080] S8. Inject liquid working fluid into the containment space formed by the upper and lower covers to obtain a temperature equalization plate.

[0081] Of course, if it is necessary to add a film to any one or more of the first, second, and third regions, the method further includes the step of: obtaining a film, and during the assembly of the upper cover, lower cover, and capillary structure, making the film cover one or more of the first, second, and third regions.

[0082] The method for preparing the heat spreader in this embodiment is used to prepare the heat spreader of the above embodiment. Therefore, it can also achieve the technical effect achieved by the heat spreader in the above embodiment. It will not be described in detail here. Moreover, compared with the capillary structure formed by interlacing metal wires in related technologies, the process is simpler and the preparation efficiency is higher.

[0083] It should be noted that the various embodiments described above with reference to the accompanying drawings are merely illustrative of the present invention and not intended to limit its scope. Those skilled in the art should understand that any modifications or equivalent substitutions made to the present invention without departing from its spirit and scope should be included within the scope of the present invention. Furthermore, unless the context otherwise requires, words appearing in the singular include those in the plural, and vice versa. Additionally, unless specifically stated otherwise, all or part of any embodiment may be used in conjunction with all or part of any other embodiment.

Claims

1. A heat spreader for dissipating heat from a heat source, comprising a lower cover, an upper cover fixed to the lower cover and forming a receiving space together with the lower cover, a capillary structure receiving and fixed within the receiving space, and a liquid working fluid receiving within the receiving space; characterized in that, The capillary structure includes a plate, and the region of the plate near the heat source is defined as a first region, the region of the plate away from the heat source is defined as a second region, and the region of the plate between the first region and the second region is defined as a third region. The plate has two opposite sides along its thickness direction, namely a first surface and a second surface; the first surface faces the lower cover, and the second surface faces the upper cover; the third region includes a plurality of first ribs formed by stamping from the second surface toward the first surface and spaced apart, and a plurality of second ribs formed by stamping from the first surface toward the second surface and spaced apart; the first ribs and the second ribs extend along a first direction, and the plurality of first ribs and the plurality of second ribs are spaced apart and staggered along a second direction, the second direction being perpendicular to the first direction; the first ribs are fixed to the lower cover; The first region includes a plurality of first protruding structures formed by stamping from the second surface toward the first surface and spaced apart, a plurality of first through holes penetrating the plate and spaced apart, and a plurality of third ribs formed by stamping from the first surface toward the second surface and spaced apart; each first protruding structure includes a plurality of first protrusions spaced apart along the first direction, the third ribs extending along the first direction, the plurality of first protruding structures and the plurality of third ribs being spaced apart along the second direction and arranged in an alternating manner; the first protrusions are fixed to the lower cover; each third rib is connected integrally with its adjacent second rib.

2. The temperature distribution plate as described in claim 1, characterized in that, The containment space includes a first space formed by the plate and the lower cover, and a second space formed by the plate and the lower cover; in the thickness direction of the plate, the third region blocks the communication between the first space and the second space and is used for the reflux of the liquid working fluid.

3. The temperature distribution plate as described in claim 1, characterized in that, Each of the third ribs and the lower cover forms a raised space that is connected to the adjacent second rib and the lower cover, and together they form a transmission channel for the flow of the liquid working fluid.

4. The temperature distribution plate as described in claim 1, characterized in that, The second region includes a plurality of second protruding structures formed by stamping from the second surface toward the first surface and spaced apart, and a plurality of second through holes that penetrate the plate and are structurally configured therethrough; each of the second protruding structures includes a plurality of second protrusions spaced apart.

5. The temperature distribution plate as described in claim 4, characterized in that, The second region further includes a plurality of third protrusions formed by stamping from the first surface toward the second surface and spaced apart; each of the third protrusions includes a plurality of third protrusions spaced apart along the first direction, a plurality of second protrusions spaced along the first direction, and the plurality of second protrusions and the plurality of third protrusions spaced apart along the second direction and arranged in an alternating manner.

6. The temperature distribution plate as described in claim 1, characterized in that, The first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations extending through it.

7. The temperature distribution plate as described in claim 1, characterized in that, The second region is covered with a second film on the side near the top cover; the second film has a plurality of second perforations extending through it.

8. The temperature distribution plate as described in claim 1, characterized in that, The third region is covered with a third film on the side closest to the top cover.

9. The temperature distribution plate as described in claim 1, characterized in that, The first region is covered with a first film on the side near the top cover, and the first film has multiple first perforations through it; the second region is covered with a second film on the side near the top cover, and the second film has multiple second perforations through it; the third region is covered with a third film on the side near the top cover, and the third film has multiple third perforations through it; the porosity of the first film and the porosity of the second film are both greater than or equal to the porosity of the third film; or, The first region is covered with a first film on the side near the top cover, and the first film has a plurality of first perforations therethrough; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations therethrough; the porosity of the first film is greater than or equal to the porosity of the third film; or, The second region is covered with a second film on the side near the top cover, and the second film has a plurality of second perforations through it; the third region is covered with a third film on the side near the top cover, and the third film has a plurality of third perforations through it; the porosity of the second film is greater than or equal to the porosity of the third film.

10. The temperature distribution plate as described in claim 1, characterized in that, Along the thickness direction of the plate, the distance between the first surface and the second surface is 0.005~0.025mm.

11. The temperature distribution plate as described in claim 1, characterized in that, Along the thickness direction of the plate, the distance between the end of the first protrusion away from the first surface and the end of the third rib away from the second surface is 0.03~0.6mm.

12. The temperature distribution plate as described in claim 1, characterized in that, Multiple first through holes are respectively disposed within the first protrusion and within the third rib.

13. The temperature distribution plate as described in claim 1, characterized in that, Multiple first through holes are respectively disposed outside the first protrusion and outside the third rib.

14. The temperature distribution plate as described in claim 1, characterized in that, The diameter of the first through hole is 0.01~0.08mm.

15. The temperature distribution plate as described in claim 1, characterized in that, The distance between two adjacent first through holes is 0.1~0.3mm.

16. A method for preparing a heat spreader, wherein the heat spreader is used to dissipate heat from a preset heat source, characterized in that, The method for preparing the heat spreader includes the following steps: Obtain a plate having a first surface and a second surface that are relatively arranged; the plate has a plurality of preset first regions, a plurality of second regions, and a third region located between adjacent first regions and second regions; The plate is stamped so that all the first regions, all the second regions and all the third regions have protrusions that protrude from the first surface; The plate is perforated such that all the first regions and all the second regions have through holes therethrough. The outer surface of the plate is roughened to form a rough surface on at least a portion of the outer surface of the plate. The plate is subjected to a hydrophilic treatment to make its surface hydrophilic. The plate is cut into the desired shape to obtain a capillary structure; each capillary structure has an integrally formed first region, a second region, and a third region; Assemble the upper cover, lower cover, and capillary structure so that the first region is close to the preset heat source; A liquid working fluid is injected into the containment space formed by the upper cover and the lower cover to obtain the temperature equalization plate.

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