Tungsten filament cutting fluid as well as preparation method and application thereof

By using a polyol polyether composition as a lubricant and dispersant, the problems of environmentally unfriendly lubricating components and easy hydrolysis of ester bonds in water-based cutting fluids are solved, achieving a highly efficient and stable cutting fluid composition, thus improving the quality and environmental friendliness of silicon wafer cutting.

CN121538033APending Publication Date: 2026-02-17NANJING REGAL POLYMER
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Patent Information

Application Number
CN202511796766.X
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-02
Publication Date
2026-02-17

AI Technical Summary

Technical Problem

Existing water-based cutting fluids contain elements such as phosphorus, nitrogen, and boron in their lubricating components, which are not environmentally friendly. Furthermore, ester compounds are prone to hydrolysis at high temperatures, resulting in insufficient lubrication performance and system stability.

Method used

A polyol polyether composition is used as a lubricant and dispersant, containing a connector and polymer chain in a specific molar ratio. The polyol polyether is prepared by polymerization reaction, and a wetting agent, solubilizer and pH adjuster are added to form a stable cutting fluid composition.

Benefits of technology

It provides excellent lubricity and dispersibility, improves the yield of silicon wafer cutting, reduces wire marks, thickness unevenness and breakage rate, and ensures the environmental friendliness of the cutting fluid.

✦ Generated by Eureka AI based on patent content.

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Abstract

The invention provides tungsten filament cutting fluid as well as a preparation method and application thereof. The invention specifically provides a composition containing polyol polyether, which comprises 6-29 parts by weight of polyol polyether: A-(B) 2 or 3. The polyol polyether composition provided by the invention can be used for preparing a cutting fluid, and has good lubricating and dispersing effects.
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Description

Technical Field

[0001] This invention relates to a tungsten wire cutting fluid, its preparation method, and its application. Background Technology

[0002] As the photovoltaic industry continues to reduce costs, the process of making diamond wire thinner is accelerating. At the same time, environmental regulations are becoming increasingly stringent regarding the chemical oxygen demand (COD) and biochemical oxygen demand (BOD) in cutting wastewater. Therefore, cutting fluids are developing towards lower usage concentrations, which requires each component to possess greater efficiency.

[0003] Currently, the lubricating components widely used in water-based cutting fluids often contain elements such as phosphorus (P), nitrogen (N), and boron (B), which are not environmentally friendly. Another common type of lubricant is a compound containing ester bonds (-C(O)O-), but ester bonds are prone to hydrolysis. Both polyether esters (-OC=O) and phosphate esters (-OP=OO-) are susceptible to attack by nucleophiles such as water, especially at high temperatures. Therefore, developing a class of polyether lubricants has become a more reliable option to simultaneously ensure efficient lubrication performance and system stability. Summary of the Invention

[0004] The technical problem to be solved by this invention is to overcome the deficiency of limited types of cutting fluids in the prior art. Therefore, this invention provides a tungsten wire cutting fluid, its preparation method, and its application. The tungsten wire cutting fluid provided by this invention has good lubrication and dispersion effects and can be applied to cutting silicon wafers.

[0005] The present invention provides a composition containing polyol polyether, comprising 6-29 parts by weight of polyol polyether;

[0006] The polyol polyether is: A-(B) 2或3 ;

[0007] Where A is the connector: or , Connected to two or three Bs;

[0008] B is -(B1-B2) K -, k is 1 or 2;

[0009] B1 is a polymer chain, and the repeating unit is... ,in Connect to the connector;

[0010] B2 is a polymer chain, and the repeating unit is... ,in Connected to aggregate chain B1;

[0011] B1 repeating unit ( ) and B2 repeating unit ( The molar ratio of polyol polyether is (1-1.3):1; the weight average molecular weight of polyol polyether is 2000-5200.

[0012] In some embodiments, the dispersion factor of the polyol polyether is 1.0-1.3, for example 1.0-1.15, preferably 1.04, 1.13 or 1.12.

[0013] In some embodiments, the weight-average molecular weight of the polyol polyether is 2433, 3880, 4960, 5121, 2333, 3280, 4460, 4521 or 5000.

[0014] In some implementations, the molar ratio of the connector to the B2 repeating unit is 1:(15~50), for example 1:24, 1:35, 1:45, 1:20, 1:30 or 1:40.

[0015] In some implementations, the molar ratio of the connector to the B1 repeating unit is 1:(15~60), for example 1:28, 1:50, 1:40, 1:54, 1:25, 1:33 or 1:48.

[0016] In some embodiments, the molar ratio of the B1 repeating unit to the B2 repeating unit is 1.16, 1.14, 1.25, 1.10, or 1:1.2.

[0017] In some implementations, the parts by weight are percentages of each component.

[0018] In some embodiments, the polyol polyether is or Preferably, the polyol polyether is any of the following:

[0019] Option 1:

[0020] ;

[0021] Where u3, y3, u1, y1, u2, and y2 are positive integers from 20 to 50, z3, z1, z2, x1, x2, and x3 are positive integers from 20 to 60, and the ratio of (x3+x1+x2+z3+z2+z1) / (u3+u1+u2+y3+y2+y1) is 1.0-1.3, the weight-average molecular weight is 2000-5200, and the PDI is 1.0-1.3;

[0022] Option 2:

[0023] ;

[0024] Where o, t, and n are positive integers from 20 to 60, p, s, and m are positive integers from 20 to 50, and the molar ratio of (o+n+t) / (m+p+s) is 1.1-1.3; the weight-average molecular weight is 2000-5200, and the PDI is 1.0-1.3;

[0025] Preferably, the polyol polyether is any of the following:

[0026] .

[0027] In some embodiments, the composition containing polyol polyethers further comprises a wetting agent, a solubilizer, a pH adjuster, and one or more of water.

[0028] In some embodiments, the polyol-containing polyether is present in parts by weight of 10-20, for example 12, 16, 18 or 15 parts by weight.

[0029] In some embodiments, the wetting agent is present in parts by weight of 15 to 30, for example 20 or 25.

[0030] In this invention, the wetting agent is conventional in the art, preferably an isomeric alcohol ether, such as C9 or C6. 10 Or C 13 Alcohol ethers (e.g., W310), and alkynyl ethers (including C... 10 Or C 12 Any one or more of the following: acetylacetonate diol ethers.

[0031] In some embodiments, the solubilizer is 1 to 5 parts by weight, for example, 2 parts.

[0032] In this invention, the solubilizer is conventional in the art, preferably an alcohol solubilizer, and more preferably any one of pentanediol, isohexanediol, dipropylene glycol, or 2-(2-hydroxypropoxy)-1-propanol, such as isohexanediol.

[0033] In some embodiments, the pH adjuster is present in parts by weight of 0.01 to 0.1 parts, for example, 0.02 parts.

[0034] In this invention, those skilled in the art can adjust the amount of pH adjuster according to the intended use. The pH value of the composition containing polyol polyether is conventional in the art, preferably 6.5 to 7.5.

[0035] In this invention, the pH adjuster is conventional in the art, preferably an organic base pH adjuster, and more preferably any one, any two, or any three of triethanolamine, monoethanolamine, alkyl alcoholamine, cyclohexylamine ethoxylate, and monoisopropanolamine, such as triethanolamine.

[0036] In this invention, those skilled in the art can adjust the amount of water according to the intended use. For example, the water may be 50-70 parts by weight, such as 55-66 parts, preferably 57.98 or 62.98 parts.

[0037] In some embodiments, the composition comprises, by weight, 10-20 parts of a lubricating dispersant, 15-25 parts of a wetting agent, 1-3 parts of a solubilizer and pH adjuster, and water.

[0038] Preferably, the composition is any of the following:

[0039]

[0040] In some embodiments, the composition containing polyol polyether is a cutting fluid, preferably a tungsten wire carbon steel wire cutting fluid. For example, a silicon wafer (e.g., monocrystalline silicon) cutting fluid.

[0041] In some embodiments, the composition containing polyol polyether is a lubricant and / or a dispersant.

[0042] This invention provides a cutting fluid composition comprising the polyol polyether-containing composition described in any embodiment of the invention and water. Preferably, the mass ratio of the polyol polyether-containing composition to water is 1:(180-200), for example, 1:200. The cutting fluid is, for example, a silicon wafer (e.g., monocrystalline silicon) cutting fluid, or, for example, a tungsten wire carbon steel wire cutting fluid.

[0043] More preferably, the composition is a lubricant and / or a dispersant.

[0044] The present invention provides the use of the composition described in any embodiment of the present invention as a cutting fluid in silicon wafer cutting, preferably, the silicon wafer is monocrystalline silicon.

[0045] This invention provides a polyol polyether: A-(B) 2或3 Its structure is as described above.

[0046] This invention provides a method for preparing a composition containing polyol polyether, which includes the following steps;

[0047] The polyol polyether, wetting agent, solubilizer, pH adjuster and water are mixed to obtain the composition containing the polyol polyether, wherein the components and amounts of the polyol polyether, wetting agent, solubilizer, pH adjuster and water are as described above.

[0048] This invention provides a method for preparing the above-mentioned polyol polyether, which includes the following steps:

[0049] (1) The mixture of polyol and catalyst is dehydrated to obtain a dehydrated mixture;

[0050] (2) Polymerization mixture 1 is polymerized sequentially with propylene oxide, ethylene oxide and propylene oxide, or with propylene oxide to obtain polymerization mixture;

[0051] (3) The polymer mixture is polymerized with ethylene oxide to obtain polyol polyether.

[0052] In some embodiments, the polyol may be a diol or a triol, wherein the diol is preferably dipropylene glycol and diethylene glycol, and the triol is preferably glycerol.

[0053] In some embodiments, the preparation method further includes the following post-processing steps: (4) removing low-boiling substances, cooling (e.g., cooling to 80°C), adjusting pH (e.g., adding acetic acid to neutralize, preferably adding acetic acid to pH 5-7), to obtain the polyol polyether.

[0054] In some embodiments, the molar ratio of the polyol to the ethylene oxide is 1:(15~50), for example 1:(24~45), preferably 1:24, 1:35, 1:45, 1:20, 1:30 or 1:40.

[0055] In some embodiments, the molar ratio of the polyol to the propylene oxide is 1:(15~60), for example 1:(28~54), preferably 1:28, 1:40, 1:54, 1:25, 1:33 or 1:48.

[0056] In some implementations, when propylene oxide is added in two separate steps (2), the amount of propylene oxide added each time is 40%-60% of the total amount of propylene oxide, for example, 50%.

[0057] In some implementations, in step (2), the amount of ethylene oxide used is 40%-60% of the total amount of ethylene oxide, for example, 50%.

[0058] In some embodiments, the molar ratio of propylene oxide to ethylene oxide is (1-1.3):1, for example 1.16, 1.14, 1.25, 1.10 or 1:1.2.

[0059] In some embodiments, in step (1), the amount of catalyst used is 0.1-0.5% of the mass of the polyol, preferably 0.2%.

[0060] In some embodiments, the catalyst is an alkali metal or a salt of an alkali metal (e.g., an alkoxide or hydroxide), such as any one or a combination of two or more of K, Na, KOH, NaOH, potassium methoxide, and sodium methoxide, preferably potassium methoxide.

[0061] In some embodiments, in step (1), the polyol and catalyst are dehydrated in an inert gas environment, for example, nitrogen.

[0062] In some implementations, in step (1), the dehydration temperature is 100~120°C, for example 110°C.

[0063] In some embodiments, the polymerization reaction temperature is 120-140°C; preferably 130°C, 120°C or 140°C.

[0064] In some embodiments, the polymerization reaction pressure is 0.1-0.5 MPa; preferably 0.1 MPa.

[0065] In some implementations, the dehydration time in step (1) is 20 to 40 minutes, preferably 30 minutes.

[0066] In some embodiments, after adding propylene oxide in step (2), the reaction temperature is maintained (e.g., at 120-140°C; preferably 130°C) until the pressure remains unchanged.

[0067] In some implementations, in step (2), after the temperature is kept at a constant level until the pressure remains unchanged, the temperature and pressure are maintained for 60-100 minutes, for example, 80 minutes.

[0068] In some implementations, after adding ethylene oxide in step (3), the reaction temperature is maintained (e.g., at 120-140°C) until the pressure remains unchanged.

[0069] In some implementations, in step (3), after the temperature and pressure remain unchanged, the temperature and pressure are maintained for 60-100 minutes, for example, 80 minutes.

[0070] In some implementations, in step (4), the cooling is to cool to 60-100°C, for example, 80°C.

[0071] In some embodiments, the preparation method is method 1 or method 2:

[0072] Method 1 includes the following steps:

[0073] Step (1): In a nitrogen atmosphere, the mixture of glycerol and potassium methoxide is dehydrated at 100-120°C;

[0074] Step (2): At 120-140℃, add 50% of the total amount of propylene oxide and react at 0.1-0.5MPa until the pressure does not change. Then add 50% of the total amount of ethylene oxide and 50% of the total amount of propylene oxide in sequence and react at 0.1-0.5MPa until the pressure does not change.

[0075] Step (3): Add 50% of the total amount of ethylene oxide and react at a pressure of 0.1-0.5 MPa until the pressure no longer changes;

[0076] Step (4): Remove low-boiling-point substances, cool down, neutralize and discharge;

[0077] Method 2 includes the following steps:

[0078] Step (1): In a nitrogen atmosphere, the mixture of glycerol and potassium methoxide is dehydrated at 100-120°C;

[0079] Step (2): Add propylene oxide at 120-140℃ and react at a pressure of 0.1-0.5MPa until the pressure no longer changes;

[0080] Step (3): Add ethylene oxide and react at a pressure of 0.1-0.5 MPa until the pressure no longer changes;

[0081] Step (4): Remove low-boiling-point substances, cool down, neutralize and discharge.

[0082] This invention provides a polyol polyether prepared by the above preparation method.

[0083] This invention provides the application of polyol polyether in the preparation of cutting fluid, wherein the cutting fluid is as described in any embodiment of this invention.

[0084] This invention provides the application of polyol polyethers in the preparation of lubricants and / or dispersants.

[0085] Without violating common sense in the field, the above-mentioned preferred conditions can be combined arbitrarily to obtain various preferred embodiments of the present invention.

[0086] The reagents and raw materials used in this invention are all commercially available.

[0087] The positive and progressive effects of the present invention are as follows: the composition provided by the present invention has one or more of the following advantages:

[0088] (1) The composition provided by the present invention has good lubricity and / or dispersibility.

[0089] (2) The silicon wafers obtained by cutting the composition provided by the present invention have a high yield, preferably A+ grade yield > 95%.

[0090] (3) The silicon wafers cut by the composition provided by the present invention have fewer wire marks, preferably A-wire marks < 0.1%.

[0091] (4) The silicon wafers obtained by cutting the composition provided by the present invention have uniform thickness, preferably TTV < 0.1%.

[0092] (5) The composition provided by the present invention has a low breakage rate, preferably <5%.

[0093] (6) The silicon wafers obtained by cutting the composition provided by the present invention have a low contamination rate, preferably <1%.

[0094] (7) The silicon wafers cut by the composition provided by the present invention have low torque. Attached Figure Description

[0095] Figure 1 Infrared spectroscopy image of the polyol polyether generated in Example 1 Detailed Implementation

[0096] The present invention is further illustrated below by way of embodiments, but the invention is not limited to the scope of the embodiments described herein. Experimental methods in the following embodiments that do not specify specific conditions were performed according to conventional methods and conditions, or as selected according to the product instructions.

[0097] Method 1, Polyol Polyether: Add a measured amount of 1 mol glycerol to the reactor, replace with N2, add 0.2% potassium methoxide (by mass of the polyol), heat to 110℃, dehydrate for 30 min, then continue heating to 130℃, first introduce 50% propylene oxide, react under 0.1 MPa pressure, maintain the temperature until the pressure remains unchanged, and mature for 80 min, then introduce 50% ethylene oxide and 50% propylene oxide, react under 0.1 MPa pressure, maintain the temperature until the pressure remains unchanged, and mature for 80 min (maturation means maintaining this condition and continuing the reaction for a period of time), finally introduce 50% ethylene oxide, react under 0.1 MPa pressure, maintain the temperature until the pressure remains unchanged, and mature for 80 min, remove low-boiling substances, cool to 80℃, add acetic acid to neutralize and discharge (prepare a 1% aqueous solution of the product, adjust the pH to 5-7).

[0098] General structural formula:

[0099] ;

[0100] Where u3, y3, u1, y1, u2, and y2 are positive integers from 20 to 50, z3, z1, z2, x1, x2, and x3 are positive integers from 20 to 60, and the molar ratio of (x3+x1+x2+z3+z2+z1) / (u3+u1+u2+y3+y2+y1) is 1.0-1.3. The weight-average molecular weight of the generated polyol polyether is between 2000 and 5200, and the PDI is between 1.0 and 1.3.

[0101] Following the above operating steps, feed materials according to the material ratios in Table 1 below, and carry out the polymerization reaction under the conditions in Table 1 below.

[0102] Table 1

[0103]

[0104] Method 2: Add 1 mol of glycerol to the reactor, replace with N2, add 0.2% potassium methoxide (by mass of the polyol), heat to 110℃, dehydrate for 30 min, then continue heating to 130℃, first introduce propylene oxide, react under 0.1 MPa pressure, maintain the temperature until the pressure remains unchanged, mature for 80 min, then introduce ethylene oxide, react under 0.1 MPa pressure, maintain the temperature until the pressure remains unchanged, mature for 80 min, remove low-boiling substances, cool to 80℃, add acetic acid to neutralize and discharge (prepare a 1% aqueous solution of the product, adjust the pH to 5-7).

[0105] General structural formula:

[0106] ;

[0107] Where o, t, and n are positive integers from 20 to 50, p, s, and m are positive integers from 20 to 50, and the molar ratio of (o+n+t) / (m+p+s) is 1.1-1.3.

[0108] The resulting polyol polyether has a weight-average molecular weight of 2000-5200 and a PDI of 1.0-1.3. Following the above operating steps, the materials are fed according to the proportions in Table 2 below, and the polymerization reaction is carried out under the conditions in Table 2 below.

[0109] Table 2

[0110]

[0111] The molecular weight and PDI of polyol random polyethers were determined using Waters 1515 gel permeation chromatography (GPC) and a Waters 2414 refractive index detector. First, a polyol random polyether solution with a concentration of 1.5 mg / mL was prepared, using tetrahydrofuran (THF) as the mobile phase and polyethylene glycol (PEG) of different molecular weights as standard samples. The results of Examples 1, 2, 3, and 4 are shown in Table 3 below.

[0112] Table 3

[0113]

[0114] Comparative Example 2 is commercially available GPE-3000, purchased from Shandong Yousuo Chemical Technology Co., Ltd.

[0115] Infrared spectroscopy was performed using a Nicolet iG50 FTIR spectrometer. ATR mode was activated, and the air background was tested. A lubricant dispersant was dropped onto the diamond crystal on the ATR module, and the instrument was scanned 32 times in the 400cm⁻¹–4000cm⁻¹ region, with a resolution of 4cm⁻¹.

[0116] The polyol polyether generated in Example 1 was subjected to infrared testing, see [reference]. Figure 1 It can be known that 3502cm -1 It is a characteristic absorption of -OH, a characteristic absorption of water, 2865 cm⁻¹ -1 It is absorbed by the stretching vibrations of CH3 and CH2 in the main chain, 1348 cm. -1 The bending vibration of CH3 indicates the presence of propylene oxide, 1090 cm⁻¹ -1 The characteristic absorption of -O- indicates the formation of ether bonds, and the infrared spectrum indicates the formation of polyethers.

[0117] The infrared spectra of the polyol polyethers in Examples 2, 3, 4, 5, 6, 7, and 8 are similar to those in Example 1.

[0118] The dispersibility and lubricity of Examples 1-12 and Comparative Example 1 were evaluated, and the results are shown in Table 4.

[0119] The dispersibility test method is as follows: Prepare 100 mL of aqueous solution with a lubricant dispersant concentration of 0.5%, then add 3% 1-micron silica powder. Stir magnetically at 800 rpm for 5 minutes, then immediately filter using rapid filter paper while simultaneously starting a timer. The time is recorded as the filtration time when no watermark remains on the filter paper. Three groups are tested for each sample, and the average value is taken. The longer the filtration time, the better the dispersibility.

[0120] The lubricity test method was as follows: The testing instrument used was the German Microtap TTT thread machining torque testing system, and the test conditions were 10%-45# steel, 600 rpm, and 12mm depth. Three sets of tests were conducted for each sample, and the average value was taken. The lower the average torque value, the better the lubricity. The lubricity of 10% polyol polyether was also tested. The preparation method for 10% block polyether was as follows: First, weigh 90 grams of deionized water (resistance 18.25 ohms), add 10 grams of the block polyether from the examples, and stir until homogeneous.

[0121] Table 4

[0122]

[0123] The cutting fluid formula is shown in Table 5 below, based on mass percentages. In the specific experimental operation, a total of 4 kg of cutting fluid was prepared for the experiment.

[0124] The preparation method of the cutting fluid is as follows:

[0125] Weigh the lubricating dispersant into the mixing tank according to the formula order. While stirring, add the wetting agent at a speed of 200 rpm for 5 minutes. Then, while stirring, add the solubilizer at a speed of 200 rpm for 5 minutes. After the pH adjuster and the remaining water are mixed evenly, add them into the mixing tank and stir at a speed of 200 rpm for 10 minutes to obtain a stable cutting fluid.

[0126] Wetting agent W310 is selected from Shanghai Sanrui Polymer Materials Co., Ltd.

[0127] The solubilizer, isohexyl glycol, was selected from Shanghai Sokai Industrial Co., Ltd.

[0128] pH adjuster selected from Dow Chemical Company

[0129] Table 5

[0130]

[0131] The cutting fluids prepared in Examples 13-20 and Comparative Examples 3-5 were diluted with deionized water (the dilution ratio was 1:200 by mass of cutting fluid to deionized water). Under the same cutting parameters (using 20-micron tungsten-carbon steel wire (manufactured by Meichang New Materials Co., Ltd.), a cutting speed of 2400 m / min, and left and right wire tensions of approximately 3.0 N), 210 mm diameter monocrystalline silicon wafers for solar applications were cut. The A+ grade yield, A- line marks, TTV, breakage rate, and maximum torque were tested. Detailed data are shown in Table 6.

[0132] A+ yield: This refers to the percentage of silicon wafers that fully meet the factory quality standards out of the total number of silicon wafers cut. A higher value is better, with a target of >95%.

[0133] A-Line Marks: These refer to the percentage of silicon wafers with line marks that do not affect subsequent processing quality. The lower the value, the better; the target is <0.1%.

[0134] TTV: The thickness of multiple silicon wafers obtained from dicing is measured. TTV is the difference between the maximum and minimum thickness of a wafer. The TTV is measured using a five-point method, and the thickness variation of the same wafer should be less than 15% of its nominal thickness. The percentage of wafers with TTV exceeding this standard is the percentage of the total number of diced wafers. Lower values ​​are better; the target is <0.1%.

[0135] Wire breakage rate: This refers to the frequency of diamond wire breakage during the cutting process due to various reasons. A lower value is better; the target is <5%.

[0136] Contamination rate: This refers to the percentage of silicon wafers that fail to meet factory standards after water rinsing following cutting, out of the total number of cut silicon wafers. A lower value is better; the target is <1%.

[0137] Maximum torque: This refers to the torque experienced by the bearing housing during silicon wafer dicing. To ensure fairness, the data is corrected for the load. A lower value is better.

[0138] Table 6

[0139] .

Claims

1. A composition containing polyol polyether, characterized in that, It contains 6-29 parts by weight of polyol polyether; The polyol polyether is: A-(B) 2或3 ; Where A is the connector: or , Connected to two or three Bs; B is -(B1-B2) K -, k is 1 or 2; B1 is a polymer chain, and the repeating unit is... ,in Connect to the connector; B2 is a polymer chain, and the repeating unit is... ,in It is connected to polymer chain B1; the molar ratio of B1 repeating unit to B2 repeating unit is (1-1.3):1; the weight average molecular weight of polyol polyether is 2000-5200.

2. The composition containing polyol polyether as described in claim 1, characterized in that, It satisfies one or more of the following conditions: (1) The dispersion coefficient of the polyol polyether is 1.0-1.3, for example 1.0-1.15, preferably 1.04, 1.13 or 1.12; (2) The weight-average molecular weight of the polyol polyether is 2433, 3880, 4960, 5121, 2333, 3280, 4460, 4521 or 5000; (3) The molar ratio of the connector to the B2 repeating unit is 1:(15~50), for example 1:24, 1:35, 1:45, 1:20, 1:30 or 1:40; (4) The molar ratio of the connector to the B1 repeating unit is 1:(15~60), for example 1:28, 1:50, 1:40, 1:54, 1:30, 1:25, 1:33 or 1:48; (5) The molar ratio of the B1 repeating unit to the B2 repeating unit is 1.16, 1.14, 1.25, 1.10 or 1:1.2; (6) The weight parts are the percentage content of each component; (7) The polyol polyether is or .

3. The composition containing polyol polyether as described in claim 1 or 2, characterized in that, It satisfies one or more of the following conditions: (1) The polyol polyether is any of the following: ; (2) The composition containing polyol polyether further comprises a wetting agent, a solubilizer, a pH adjuster, and one or more of water; (3) The composition containing polyol polyether is a cutting fluid, preferably a tungsten wire carbon steel wire cutting fluid or a silicon wafer cutting fluid, wherein the silicon wafer is, for example, monocrystalline silicon; (4) The composition containing polyol polyether is a lubricant and / or a dispersant; (5) The composition containing polyol polyether has a pH value of 6.5-7.5; Preferably, the composition containing polyol polyether further satisfies one or more of the following conditions: (a) The polyol polyether is in the form of 10-20 parts by weight, for example 12, 16, 18 or 15 parts by weight; (b) The wetting agent is present in parts by weight of 15 to 30 parts by weight, for example 20 or 25 parts by weight; (c) The wetting agent is an isomeric alcohol ether, such as C9 or C6. 10 Or C 13 Any one or more of alcohol ethers and alkynyl alcohol ethers, such as W310; (d) The amount of the solubilizer is 1 to 5 parts by weight, for example 2 parts by weight; (e) The solubilizer is an alcohol solubilizer, preferably any one of pentanediol, isohexanediol, dipropylene glycol or 2-(2-hydroxypropoxy)-1-propanol, for example isohexanediol; (f) The pH adjuster is present in a weight ratio of 0.01 to 0.1 parts by weight, for example, 0.02 parts by weight; (g) The pH adjuster is an organic base pH adjuster, preferably any one, any two or any three of triethanolamine, monoethanolamine, alkyl alcoholamine, cyclohexylamine ethoxylate, and monoisopropanolamine, for example, triethanolamine; (h) The water is 50-70 parts by weight, for example 55-66 parts by weight, preferably 57.98 or 62.98 parts by weight; More preferably, the composition containing polyol polyether is any of the following: 。 4. A method for preparing a composition containing polyol polyether as described in any one of claims 1-3, characterized in that, It comprises the following steps: mixing the polyol polyether, wetting agent, solubilizer, pH adjuster and water to obtain the composition containing the polyol polyether, wherein the components and amounts of the polyol polyether, wetting agent, solubilizer, pH adjuster and water are as described in any one of claims 1-3.

5. A cutting fluid composition comprising the polyol polyether-containing composition according to any one of claims 1-3 and water, preferably, the mass ratio of the polyol polyether-containing composition to water is 1:(180-200), for example 1:200, and the cutting fluid is preferably a silicon wafer cutting fluid, or preferably a tungsten wire carbon steel wire cutting fluid.

6. A polyol polyether: A-(B) 2或3 The polyol polyether is as described in any one of claims 1-3, preferably, the polyol polyether is any one of the following: 。 7. A method for preparing the polyol polyether as described in claim 6, characterized in that, It includes the following steps: (1) The mixture of polyol and catalyst is dehydrated to obtain a dehydrated mixture; (2) Polymerization mixture 1 is polymerized sequentially with propylene oxide, ethylene oxide and propylene oxide, or with propylene oxide to obtain polymerization mixture; (3) The polymer mixture is polymerized with ethylene oxide to obtain polyol polyether.

8. The method for preparing polyol polyethers as described in claim 7, characterized in that, It satisfies one or more of the following conditions: (1) The polyol is a diol or a triol, wherein the diol is preferably dipropylene glycol and diethylene glycol, and the triol is preferably glycerol; (2) The preparation method further includes the following post-processing steps: (4) Extracting low-boiling substances, cooling, adjusting pH, and obtaining the polyol polyether; (3) The molar ratio of the polyol to the ethylene oxide is 1:(15~50), for example 1:(24~45), preferably 1:24, 1:35, 1:45, 1:20, 1:30 or 1:40; (4) The molar ratio of the polyol to the propylene oxide is 1:(15~60), for example 1:(28~54), preferably 1:28, 1:40, 1:54, 1:25, 1:33 or 1:48; (5) The molar ratio of propylene oxide to ethylene oxide is (1-1.3):1, for example 1.16, 1.14, 1.25, 1.10 or 1:1.2; (6) In step (1), the amount of catalyst used is 0.1-0.5% of the mass of the polyol, preferably 0.2%; (7) The catalyst is an alkali metal or a salt of an alkali metal, such as any one or a combination of two or more of K, Na, KOH, NaOH, potassium methoxide, and sodium methoxide, preferably potassium methoxide; (8) In step (1), the polyol and catalyst are dehydrated in an inert gas environment, for example, nitrogen gas; (9) In step (1), the dehydration temperature is 100~120℃, for example 110℃; (10) The polymerization reaction temperature is 120-140℃; preferably 130℃, 120℃ or 140℃; (11) The pressure of the polymerization reaction is 0.1-0.5 MPa; preferably 0.1 MPa; (12) In step (1), the dehydration time is 20-40 min, preferably 30 min; (13) In step (2), after adding propylene oxide, maintain the reaction temperature and react until the pressure does not change; (14) In step (2), after the temperature is kept at a constant level until the pressure does not change, maintain the temperature and pressure reaction for 60-100 min, for example 80 min; (15) In step (3), after adding ethylene oxide, maintain the reaction temperature and react until the pressure does not change; (16) In step (3), after the temperature is maintained until the pressure does not change, maintain the temperature and pressure for 60-100 minutes, for example, 80 minutes; (17) In step (4), the cooling is to cool to 60-100°C, for example, 80°C; (18) In step (2), when propylene oxide is added in two separate additions, the amount of propylene oxide added each time is 40%-60% of the total amount of propylene oxide, for example, 50%; (19) In step (2), the amount of ethylene oxide used is 40%-60% of the total amount of ethylene oxide, for example 50%.

9. The method for preparing polyol polyethers as described in claim 8, characterized in that, It can be either method 1 or method 2 as follows: Method 1 includes the following steps: Step (1): In a nitrogen atmosphere, the mixture of glycerol and potassium methoxide is dehydrated at 100-120°C; Step (2): At 120-140℃, add 50% of the total amount of propylene oxide and react at 0.1-0.5MPa until the pressure does not change. Then add 50% of the total amount of ethylene oxide and 50% of the total amount of propylene oxide in sequence and react at 0.1-0.5MPa until the pressure does not change. Step (3): Add 50% of the total amount of ethylene oxide and react at a pressure of 0.1-0.5 MPa until the pressure no longer changes; Step (4): Remove low-boiling-point substances, cool down, neutralize and discharge; Method 2 includes the following steps: Step (1): In a nitrogen atmosphere, the mixture of glycerol and potassium methoxide is dehydrated at 100-120°C; Step (2): Add propylene oxide at 120-140℃ and react at a pressure of 0.1-0.5MPa until the pressure no longer changes; Step (3): Add ethylene oxide and react at a pressure of 0.1-0.5 MPa until the pressure no longer changes; Step (4): Remove low-boiling-point substances, cool down, neutralize and discharge.

10. The use of the polyol polyether as described in claim 6 in the preparation of cutting fluids, and / or in the preparation of lubricants and / or dispersants.