Air-cooled chip test temperature control device

Abstract

The present application relates to chip testing technical field, especially a kind of air-cooled chip test temperature control equipment, including frame body and the air inlet being opened in the top side of frame body, it is characterized by further comprising: guide rail, vertical linear array is arranged in frame body interior, multiple are set, interval certain distance, for placing chip;Exhaust fan, installation is in the end of frame body away from air inlet;Air deflector, rotation is installed in the end of frame body close to air inlet, multiple are set, located in guide rail side;Slot, open in the end of frame body close to air deflector;Swing component, is arranged in slot interior, for driving air deflector swing.The chip test temperature control equipment provided in the present application drives air deflector reciprocating swing by swing component, can dynamically adjust the coverage range of airflow, force airflow to be evenly distributed on the surface of each layer chip, reduce the wind speed difference of upper and lower layer chip, chip different area, avoid local heat accumulation problem, effectively improve the heat dissipation efficiency in chip testing process.

Description

Technical Field

[0001] This invention relates to the field of chip testing technology, and in particular to an air-cooled chip testing temperature control device. Background Technology

[0002] A chip, also known as an integrated circuit, is a miniature electronic device that integrates a large number of electronic components such as transistors, resistors, and capacitors onto a semiconductor substrate such as a silicon wafer through processes such as photolithography and etching. It is the core component of electronic devices.

[0003] In the integrated circuit industry, chip testing is a key link in ensuring product quality and reliability. Temperature control directly affects the accuracy and validity of test data. Air-cooled testing equipment is widely used in chip performance testing, aging testing and other scenarios due to its advantages such as simple structure, convenient maintenance and no risk of water leakage. Its core is to guide the direction of cold air through the partition so that the airflow accurately flows through the chip surface to achieve cooling.

[0004] In existing technologies, the cold air guiding baffles in chip air-cooled testing equipment generally adopt a fixed installation structure. This means that the angle and position of the baffle are fixed once assembled, allowing only a single orientation to guide airflow. This results in poor airflow uniformity and makes it difficult to adapt to multi-layer, multi-chip testing layouts. Fixed baffles only form a single airflow channel. When cold air flows along a fixed path inside the equipment, it is easily obstructed by the multi-layer chip racks, causing wind speed attenuation. This leads to excessively high wind speeds in the upper chip areas and insufficient wind speeds in the lower chip areas, even creating localized "dead air zones." Especially in high-density multi-chip parallel testing scenarios, the heat intensity of each chip varies. Fixed baffles cannot adjust the airflow distribution according to the heat dissipation requirements of different layers and chips. This results in some chips overheating due to insufficient heat dissipation, while others deviate from the set temperature threshold due to excessive airflow, severely affecting the consistency and accuracy of multi-layer chip testing. Summary of the Invention

[0005] Therefore, it is necessary to provide an air-cooled chip testing temperature control device that can improve heat dissipation efficiency to address the aforementioned technical problems.

[0006] This invention provides an air-cooled chip testing temperature control device, comprising a frame and an air inlet located on one side of the top of the frame, characterized in that it further comprises:

[0007] The guide rails, arranged in a vertical linear array inside the frame, are multiple in number and spaced at a certain distance, for placing chips;

[0008] An exhaust fan is installed at the end of the frame away from the air inlet;

[0009] Multiple air guide plates are rotatably mounted on one side of the frame near the air inlet and located on one side of the guide rail.

[0010] The slot is formed at one end of the frame near the air guide plate;

[0011] A swing assembly is located inside the slot and is used to drive the air guide plate to swing.

[0012] In one embodiment, the oscillating assembly includes a rotating cylinder, one end of which is fixedly connected to one side of the air guide plate, and the other end of which moves away from the air guide plate through the side wall of the slot, with its end located inside the slot.

[0013] In one embodiment, a fixing block is fixedly installed on the inner wall of the slot near the rotating cylinder. The end of the rotating cylinder away from the air guide plate is movably connected to the fixing block. An arc-shaped groove is opened on the outer side of the rotating cylinder. A movable rod is movably installed inside the fixing block. The end of the movable rod away from the fixing block is slidably connected to the arc-shaped groove.

[0014] In one embodiment, a rotating rod is movably disposed inside the rotating cylinder. One end of the rotating rod is rotatably connected to the inner wall of the slot. A curved groove is formed on the outer side of the rotating rod, and the end of the movable rod away from the fixed block slides and fits into the curved groove.

[0015] In one embodiment, a portion of one side of the rotating rod is located outside the rotating cylinder, and the plurality of rotating rods are connected by belt drive.

[0016] In one embodiment, the upper surface of the air guide plate has a plurality of grooves arranged in a horizontal linear array, a crossbar is rotatably installed in the groove, and an air baffle is fixedly sleeved on the outside of the crossbar.

[0017] In one embodiment, the windbreak plate has axially symmetrical circular grooves on both sides, the crossbar is fixedly inserted through the circular groove and its end is rotatably connected to the inner wall of the groove, and a torsion spring is movably sleeved on the outside of the crossbar, one end of the torsion spring is fixedly connected to the inner wall of the circular groove and the other end is fixedly connected to the inner wall of the groove.

[0018] In one embodiment, a fixed cylinder is fixedly disposed in the groove, and a movable rod is movably disposed in the fixed cylinder, with the top of the movable rod fixedly connected to the bottom of one side of the windbreak plate.

[0019] In one embodiment, a positioning spring is fixedly installed at one end of the windbreak plate on one side of the moving rod, and the end of the positioning spring away from the windbreak plate is fixedly connected to the inner wall of the groove.

[0020] In one embodiment, a vertical rod is rotatably mounted on the top of one end of the windbreak plate near the movable rod, and multiple fan blades are fixedly sleeved on the outside of the vertical rod.

[0021] In one embodiment, the end of the vertical rod away from the fan blade moves through the wind baffle and the movable rod, and the end is located inside the fixed cylinder. A limiting groove is formed on the outer side of the vertical rod, and a limiting rod is fixedly provided on the inner wall of the fixed cylinder. One end of the limiting rod slides and fits into the limiting groove.

[0022] In one embodiment, a vertical groove is provided on one side of the fixed cylinder, and a through groove is provided in the middle of the air guide plate. The through groove is connected to the groove. A fixed rod is movably arranged in the through groove. Both ends of the fixed rod are fixedly connected to the frame. Multiple limiting rings are fixedly sleeved in a horizontal linear array on the outside of the fixed rod. A baffle is fixedly arranged on the side of the limiting rings toward the vertical groove. A limiting plate is fixedly arranged at one end of the moving rod. The limiting plate is slidably connected to the vertical groove, and one end is movably abutting against the baffle.

[0023] The aforementioned air-cooled chip testing temperature control device uses a swing assembly to drive the air guide plate to swing back and forth, dynamically adjusting the airflow coverage and forcing the airflow to be evenly distributed on the surface of each chip layer. This reduces the wind speed differences between upper and lower chips and between different areas of the chip, avoiding localized heat accumulation and effectively improving heat dissipation efficiency during chip testing. The tilting of the baffle plate can divide the concentrated airflow from the right vertical guide channel into multiple parallel narrow airflow streams, further improving heat dissipation efficiency. The rotation of the fan blades can further cut the airflow streams divided by the baffle plate into fine vortices. These vortices can directly penetrate the thermal boundary layer on the chip surface, breaking the steady-state heat transfer bottleneck formed by the fixed airflow, allowing for more sufficient contact between the cold air and the chip's heating surface, further improving heat dissipation efficiency. Attached Figure Description

[0024] To more clearly illustrate the technical solutions in this invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0026] Figure 2 This is a top-view structural diagram of the overall structure of the present invention;

[0027] Figure 3 This is a frontal view structural diagram of the overall structure of the present invention;

[0028] Figure 4 This is a schematic diagram of the air inlet structure in this invention;

[0029] Figure 5 This is a schematic diagram of the structure of the fixing block in this invention;

[0030] Figure 6 for Figure 5 Enlarged diagram of part A in the middle;

[0031] Figure 7 This is a schematic diagram of the rotating rod in this invention;

[0032] Figure 8 This is a schematic diagram of the curved groove in this invention;

[0033] Figure 9 This is a schematic diagram of the movable rod in this invention;

[0034] Figure 10 This is a schematic diagram of the through groove in the present invention;

[0035] Figure 11 This is a schematic diagram of the circular groove in the present invention;

[0036] Figure 12 This is a schematic diagram of the fan blade structure in this invention;

[0037] Figure 13 This is a schematic diagram of the limiting groove in the present invention.

[0038] Figure label:

[0039] 1. Frame; 101. Air inlet; 102. Groove; 2. Guide rail; 3. Exhaust fan; 4. Swing assembly; 41. Rotating cylinder; 42. Fixing block; 43. Arc groove; 44. Movable rod; 45. Rotating rod; 46. Curved groove; 5. Belt; 6. Air guide plate; 61. Groove; 62. Through groove; 7. Horizontal bar; 8. Air baffle plate; 81. Circular groove; 9. Torsion spring; 10. Moving rod; 11. Fixing cylinder; 111. Vertical groove; 12. Positioning spring; 13. Vertical rod; 131. Limiting groove; 14. Fan blade; 15. Fixing rod; 16. Limiting ring; 17. Baffle; 18. Limiting plate; 19. Limiting rod. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on the other component or there may be an intermediate component. When a component is considered to be "connected to" another component, it can be directly connected to the other component or there may be an intermediate component present. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this specification are for illustrative purposes only and do not represent the only possible implementation.

[0042] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this invention, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0043] In this invention, unless otherwise explicitly specified and limited, "above" or "below" the second feature can mean that the first feature is in direct contact with the second feature, or that the first feature and the second feature are in indirect contact through an intermediate medium. Furthermore, "above," "over," and "on top" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.

[0044] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0045] The following is combined with Figures 1-13 This invention describes an air-cooled chip testing temperature control device.

[0046] like Figures 1-9 As shown, in one embodiment, a wind-cooled chip testing temperature control device includes a frame 1 and an air inlet 101 opened on one side of the top of the frame 1, characterized in that it further includes:

[0047] Guide rail 2, a vertical linear array is set inside the frame 1, with multiple rails spaced at a certain distance, for placing chips;

[0048] Exhaust fan 3 is installed at the end of the frame 1 away from the air inlet 101;

[0049] The air guide plate 6 is rotatably installed on one end of the frame 1 near the air inlet 101. Multiple plates are set and located on one side of the guide rail 2.

[0050] The slot 102 is located at one end of the frame 1 near the air guide plate 6;

[0051] The swing assembly 4 is located inside the slot 102 and is used to drive the air guide plate 6 to swing.

[0052] Specifically, multiple chips are placed on guide rails 2, arranged sequentially from top to bottom. A ventilation system is installed at the top of the rack 1, generating a large amount of cool air. The cool air flows from top to bottom along one side of the rack 1 through the air inlet 101. An exhaust fan 3 is installed on the other side of the rack 1. The rotation of the exhaust fan 3 generates negative pressure, allowing the cool air to move laterally along each layer of guide rails 2. The air is then exhausted through exhaust vents on one side of the exhaust fan 3. Guided by the air guide plates 6 on one side of each layer of guide rails 2, the cool air moves laterally along the guide rails 2, flowing over the surface of each layer of chips. After heat exchange between the airflow and the chips, the heat carried is extracted by the exhaust fan 3 on one side, effectively cooling the chips during the testing process. If the air guide plates 6 continuously... Maintaining a fixed angle, in a multi-layer pull-out chip testing device, the airflow path of the fixed-angle air guide plate 6 is fixed, which is easily obstructed by the chip rack, resulting in wind speed attenuation: the wind speed of the upper chip is too high due to its proximity to the air inlet 101, while the wind speed of the lower chip is insufficient; at the same time, the airflow is sufficient in the edge area of ​​the chip, while the core heat-generating area may form a "dead air zone". At this time, the air guide plate 6 can be driven to swing back and forth by the swing component 4 set in the slot 102. The air guide plate 6 swings back and forth, and the airflow coverage can be dynamically adjusted by the periodic change of the angle, forcing the airflow to be evenly distributed on the surface of each chip layer, reducing the wind speed difference between the upper and lower chips and different areas of the chip, avoiding local heat accumulation problems, and effectively improving the heat dissipation efficiency during the chip testing process.

[0053] See Figures 6-9 As shown, in this embodiment, the swing assembly 4 includes a rotating cylinder 41. One end of the rotating cylinder 41 is fixedly connected to one side of the air guide plate 6, and the end of the rotating cylinder 41 away from the air guide plate 6 moves through the side wall of the slot 102, with the end located inside the slot 102.

[0054] Specifically, rotating the rotating cylinder 41 clockwise and counterclockwise causes the air guide plate 6 to swing back and forth. The swing amplitude should not be too large and can be set between 70° and 50° (referring to the angle between the air guide plate 6 and the vertical direction). Angle of 70° (closer to horizontal): the airflow channel is wider and the air volume is larger, which can meet the heat dissipation needs of high-heat chips. Angle of 50° (closer to vertical): the airflow channel is narrowed, which can avoid excessive diversion of the upper airflow and force some airflow to flow downward, improving the uniformity of airflow distribution to the lower chips.

[0055] See Figures 6-9 As shown, in this embodiment, a fixing block 42 is fixedly installed on the inner wall of the slot 102 near the rotating cylinder 41. The end of the rotating cylinder 41 away from the air guide plate 6 is movably connected to the fixing block 42. An arc-shaped groove 43 is opened on the outer side of the rotating cylinder 41. A movable rod 44 is movably installed inside the fixing block 42. The end of the movable rod 44 away from the fixing block 42 is slidably connected to the arc-shaped groove 43.

[0056] Specifically, the movable rod 44 moves laterally back and forth along the fixed block 42. The end of the movable rod 44 away from the fixed block 42 moves back and forth along the arc groove 43, which will drive the rotating cylinder 41 to rotate clockwise and counterclockwise relative to the fixed block 42, thereby realizing the back and forth swing of the air guide plate 6, which can improve the heat dissipation efficiency.

[0057] See Figures 6-9 As shown, in this embodiment, a rotating rod 45 is movably arranged inside the rotating cylinder 41. One end of the rotating rod 45 is rotatably connected to the inner wall of the slot 102. A curved groove 46 is opened on the outer side of the rotating rod 45. The end of the movable rod 44 away from the fixed block 42 slides and fits against the curved groove 46.

[0058] Specifically, the rotation of the rotating rod 45 will drive the curved groove 46 to rotate, the rotation of the curved groove 46 will drive the movable rod 44 to move laterally back and forth, and the back and forth movement of the movable rod 44 will drive the rotating cylinder 41 to rotate back and forth through the cooperation of the arc groove 43, thereby realizing the back and forth swing of the air guide plate 6, which can control the flow of air and achieve the purpose of improving heat dissipation efficiency.

[0059] See Figure 6 and Figure 7 As shown, in this embodiment, a portion of one side of the rotating rod 45 is located outside the rotating cylinder 41, and multiple rotating rods 45 are connected by a belt 5 for transmission.

[0060] Specifically, the rotation of one of the rotating rods 45 will drive the belt 5 to rotate, thereby enabling multiple rotating rods 45 to rotate synchronously together. The initial tilt angles of the upper and lower air guide plates 6 can be designed to be different, and the swing amplitude of the air guide plates 6 is also asynchronous. This can prevent the lower air guide plates 6 from having the same tilt angle when the uppermost air guide plate 6 has the largest tilt angle, which would affect the transmission of cold air from top to bottom.

[0061] See Figures 5-7 and Figure 10 As shown, in this embodiment, the upper surface of the air guide plate 6 has a plurality of grooves 61 arranged in a horizontal linear array. A crossbar 7 is rotatably installed in the groove 61, and an air baffle plate 8 is fixedly sleeved on the outside of the crossbar 7.

[0062] Specifically, when the angle of the air guide plate 6 increases (from 50° to 70°), corresponding to the increased airflow demand, the end of the baffle plate 8 near the air inlet 101 tilts upwards and extends beyond the groove 61. This divides the concentrated airflow from the right vertical guide channel into multiple parallel narrow airflow streams. Without the baffle plate 8, the airflow easily diffuses to both sides on the surface of the air guide plate 6, resulting in sufficient airflow at the chip edge area and reduced airflow at the core area. The tilted baffle plate 8 acts as a miniature guide dam, restricting the lateral diffusion of airflow and forcing the airflow streams to flow precisely to the heat-generating core area of ​​the chip (such as the CPU). The design improves airflow utilization in the core and power chip die areas. Secondly, the raised baffle 8 and the groove 61 form a staggered flow channel structure. As airflow passes through, it generates micro-vortices on the upper and lower sides of the baffle 8, breaking the original stable laminar flow and creating controllable turbulence. This turbulence can directly tear apart the static thermal boundary layer on the chip surface that hinders heat exchange, allowing for more thorough contact between the cold air and the chip's heating surface, thus improving heat exchange efficiency. This design is linked to the angle of the air guide plate 6, achieving "angle - baffle 8 raised height - The adaptive adjustment of "air volume distribution" means that when the air guide plate 6 has a small angle (50°, low air volume condition), the baffle plate 8 is completely housed in the groove 61, the surface of the air guide plate 6 is flat, reducing airflow resistance and ensuring that the basic air volume flows stably over the chip surface. When the air guide plate 6 has a large angle (70°, high air volume condition), the height of the baffle plate 8 increases with the angle, which not only divides the airflow but also improves the heat exchange efficiency by utilizing the vortex effect, avoiding the "through wind" type of ineffective heat dissipation caused by the excessively fast airflow velocity under high air volume (the airflow is discharged before sufficient heat exchange).

[0063] See Figure 10 and Figure 11 As shown, in this embodiment, the windbreak plate 8 has axially symmetrical circular grooves 81 on both sides. The crossbar 7 is fixedly inserted through the circular groove 81 and its end is rotatably connected to the inner wall of the groove 61. A torsion spring 9 is movably sleeved on the outside of the crossbar 7. One end of the torsion spring 9 is fixedly connected to the inner wall of the circular groove 81, and the other end is fixedly connected to the inner wall of the groove 61.

[0064] Specifically, when the air guide plate 6 swings, the rotating rod 45 and the air baffle plate 8 also rotate adaptively. When one side of the air baffle plate 8 tilts upward and extends to the outside of the groove 61, the torsion spring 9 will twist and store energy during this process. When the air baffle plate 8 rotates in the opposite direction into the groove 61 and the top is flush with the groove 61, the torsion spring 9 will drive the air baffle plate 8 to rotate in the opposite direction during the process of returning to its original state. The torsion spring 9 can ensure the stability of the air baffle plate 8 during rotation and can also ensure that the air baffle plate 8 can return to its initial state.

[0065] See Figure 10 and Figure 11 As shown, in this embodiment, a fixed cylinder 11 is fixedly installed in the groove 61, and a movable rod 10 is movably installed in the fixed cylinder 11. The top of the movable rod 10 is fixedly connected to the bottom of one side of the windbreak plate 8.

[0066] Specifically, when one side of the windbreak plate 8 tilts upward, it will cause the moving rod 10 to move upward relative to the fixed cylinder 11. The cooperation between the moving rod 10 and the fixed cylinder 11 can ensure the stability of the windbreak plate 8 during its movement.

[0067] See Figure 11 As shown, in this embodiment, a positioning spring 12 is fixedly installed at one end of the wind baffle plate 8 on one side of the moving rod 10, and the end of the positioning spring 12 away from the wind baffle plate 8 is fixedly connected to the inner wall of the groove 61.

[0068] Specifically, during the process of the baffle plate 8 tilting up or returning to its original state, the moving rod 10 will move up and down relative to the fixed cylinder 11. During this process, the state of the positioning spring 12 will change. The deformation of the positioning spring 12 can ensure the stability of the baffle plate 8 during rotation.

[0069] See Figure 12 As shown, in this embodiment, a vertical rod 13 is rotatably installed on the top of the windbreak plate 8 near the moving rod 10, and multiple fan blades 14 are fixedly sleeved on the outside of the vertical rod 13.

[0070] Specifically, the rotation of the vertical rod 13 will drive the fan blade 14 to rotate. The rotating fan blade 14 will further cut the airflow bundle divided by the baffle plate 8 into fine vortices. These vortices can directly penetrate the thermal boundary layer on the chip surface, break the steady-state heat exchange bottleneck formed by the fixed airflow, and allow the cold air to have more sufficient contact with the chip's heat-generating surface, thereby improving heat dissipation efficiency.

[0071] See Figures 12-13 As shown, in this embodiment, the end of the vertical rod 13 away from the fan blade 14 movably passes through the wind baffle plate 8 and the moving rod 10, and the end is located inside the fixed cylinder 11. A limiting groove 131 is opened on the outside of the vertical rod 13, and a limiting rod 19 is fixedly installed on the inner wall of the fixed cylinder 11. One end of the limiting rod 19 slides and fits against the limiting groove 131.

[0072] Specifically, during the process of the baffle plate 8 tilting up or returning to its original state, the moving rod 10 moves up and down relative to the fixed cylinder 11, and the vertical rod 13 also moves synchronously. During the up and down movement of the vertical rod 13, the limiting rod 19 remains stationary. The limiting rod 19 moves relative to the limiting groove 131, which will drive the vertical rod 13 to rotate back and forth. The rotation of the vertical rod 13 will drive the rotation of the fan blade 14, which can further improve the heat dissipation efficiency.

[0073] See Figures 10-13As shown, in this embodiment, a vertical groove 111 is provided on one side of the fixed cylinder 11, and a through groove 62 is provided in the middle of the air guide plate 6. The through groove 62 is connected to the groove 61. A fixed rod 15 is movably arranged in the through groove 62. The two ends of the fixed rod 15 are fixedly connected to the frame 1. Multiple limiting rings 16 are fixedly sleeved in a horizontal linear array on the outside of the fixed rod 15. A baffle 17 is fixedly arranged on the side of the limiting ring 16 facing the vertical groove 111. A limiting plate 18 is fixedly arranged on one end of the moving rod 10. The limiting plate 18 is slidably connected to the vertical groove 111, and one end is movably abutting against the baffle 17.

[0074] Specifically, when the air guide plate 6 is tilted at a large angle, one end of the air baffle 8 tilts upwards. At this time, the positioning spring 12 is in its normal extension and contraction state. When the surface of the air baffle 8 is flush with the surface of the air guide plate 6, the air baffle 8 is located inside the groove 61. At this time, the tilt angle of the air guide plate 6 is small, and the limiting plate 18 and the baffle 17 are in abutting state. When the tilt angle of the air guide plate 6 changes from large to small, the air guide plate 6 rotates counterclockwise. During the rotation of the air guide plate 6, the fixing rod 15 remains stationary, and the through groove 62 provides a space for the fixing rod 15. During the rotation of the air guide plate 6, the limiting plate 18 also rotates around the limiting ring 16. When the limiting plate 18 rotates to... After contacting the baffle 17, the limiting plate 18 moves downward relative to the vertical groove 111 under the limiting action of the baffle 17, causing the moving rod 10 to move downward relative to the fixed cylinder 11, thereby pulling the tilted end of the baffle 8 downward to rotate, making the baffle 8 flush with the surface of the air guide plate 6, which will compress the positioning spring 12. At this time, the tilt angle of the air guide plate 6 is the smallest. Similarly, when it is necessary to increase the tilt angle of the air guide plate 6, the air guide plate 6 rotates clockwise, and the limiting plate 18 no longer contacts the baffle 17. Under the action of the positioning spring 12 returning to its original state, it will push one end of the baffle 8 to tilt upward again, which can divide the cold air and improve the heat dissipation efficiency.

[0075] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0076] The above-described embodiments are merely illustrative of several implementations of the present invention, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of the invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these modifications and improvements all fall within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the appended claims.

Claims

1. A wind-cooled chip testing temperature control device, comprising a frame and an air inlet located on one side of the top of the frame, characterized in that, Also includes: The guide rails, arranged in a vertical linear array inside the frame, are multiple in number and spaced at a certain distance, for placing chips; An exhaust fan is installed at the end of the frame away from the air inlet; Multiple air guide plates are rotatably mounted on one side of the frame near the air inlet and located on one side of the guide rail. The slot is formed at one end of the frame near the air guide plate; A swaying assembly, disposed inside the slot, is used to drive the air guide plate to oscillate. The swaying assembly includes a rotating cylinder, one end of which is fixedly connected to one side of the air guide plate. The end of the rotating cylinder away from the air guide plate movably penetrates the side wall of the slot, with its end located inside the slot. A fixing block is fixedly disposed on the inner wall of the slot near the rotating cylinder. The end of the rotating cylinder away from the air guide plate is movably connected to the fixing block. An arc-shaped groove is formed on the outer side of the rotating cylinder. A movable rod is movably disposed within the fixing block. The end of the movable rod away from the fixing block is slidably connected to the arc-shaped groove. A rotating rod is movably disposed inside the rotating cylinder. One end of the rotating rod is rotatably connected to the inner wall of the slot. A curved groove is formed on the outer side of the rotating rod. The end of the movable rod away from the fixing block is slidably fitted with the curved groove. A portion of one side of the rotating rod is located outside the rotating cylinder, and multiple... The rotating rods are connected by belt drive. Multiple grooves are arranged in a horizontal linear array on the upper surface of the air guide plate. A crossbar is rotatably installed within each groove. An air baffle is fixedly sleeved on the outside of each crossbar. Circular grooves are symmetrically formed on both sides of the air baffle. The crossbar is fixedly inserted through each circular groove and its end is rotatably connected to the inner wall of the groove. A torsion spring is movably sleeved on the outside of the crossbar. One end of the torsion spring is fixedly connected to the inner wall of the circular groove, and the other end is fixedly connected to the inner wall of the groove. A fixed cylinder is fixedly installed within the groove. A movable rod is movably installed within the fixed cylinder. The top of the movable rod is fixedly connected to the bottom of one side of the air baffle. A positioning spring is fixedly installed at one end of the air baffle located on the side of the movable rod. The end of the positioning spring away from the air baffle is fixedly connected to the inner wall of the groove. A vertical rod is rotatably installed at the top of the end of the air baffle near the movable rod. Multiple fan blades are fixedly sleeved on the outside of the vertical rod.

2. The air-cooled chip testing temperature control device according to claim 1, characterized in that, The vertical rod extends through the wind baffle and the movable rod at the end away from the fan blade, and its end is located inside the fixed cylinder. A limiting groove is formed on the outer side of the vertical rod, and a limiting rod is fixedly provided on the inner wall of the fixed cylinder. One end of the limiting rod slides and fits into the limiting groove.

3. The air-cooled chip testing temperature control device according to claim 1, characterized in that, A vertical groove is provided on one side of the fixed cylinder, and a through groove is provided in the middle of the air guide plate. The through groove and the groove are interconnected. A fixed rod is movably arranged in the through groove. Both ends of the fixed rod are fixedly connected to the frame. Multiple limiting rings are fixedly sleeved in a horizontal linear array on the outside of the fixed rod. A baffle is fixedly arranged on the side of the limiting rings toward the vertical groove. A limiting plate is fixedly arranged on one end of the moving rod. The limiting plate is slidably connected to the vertical groove, and one end is movably abutting against the baffle.

Images