Feeding and discharging assembly of wafer scribing machine

Abstract

The invention provides a feeding and discharging assembly of a wafer scribing machine, and relates to the technical field of semiconductor manufacturing. The wafer scribing machine feeding and discharging assembly comprises a positioning table arranged on one side of a scribing machine, a first conveying belt and a wafer box, the positioning table is fixedly installed on one side of the scribing machine, the first conveying belt is arranged on the positioning table, the wafer box is arranged on the first conveying belt, a first inclined face is arranged on the outer wall of the wafer box, and a second inclined face is arranged on the outer wall of the first inclined face. A plurality of groups of positioning structures are arranged on the first conveying belt, the positioning structures are used for clamping and positioning wafer boxes, wafer lifting mechanisms are arranged on the wafer boxes and the positioning table, and the wafer lifting mechanisms are used for sequentially lifting wafers in the wafer boxes to specified heights. The feeding and discharging assembly of the wafer scribing machine has the advantages that the feeding and discharging assembly can adapt to wafers of different sizes, physical isolation and temporary storage can be conducted on wafer boxes of different specifications and batches, and new materials can be supplemented without shutdown.

Description

Technical Field

[0001] This invention relates to the field of semiconductor manufacturing technology, and in particular to a wafer dicing machine loading and unloading assembly. Background Technology

[0002] Wafer dicing machines are core precision processing equipment in the semiconductor back-end packaging and testing process. Their core function is to precisely cut wafers that have completed front-end processes such as photolithography, etching, and coating into individual chips according to the chip division route, laying the foundation for subsequent bonding, packaging, testing and other processes. They are widely used in the manufacturing of silicon-based wafers, compound semiconductors, sensors and other products.

[0003] In traditional wafer dicing machines, the chucks are typically fixed in place during loading and unloading. Their positions cannot be flexibly adjusted according to the wafer diameter. Due to the differences in wafer size, the fixed chucks cannot ensure that all chucks accurately adhere to the effective adsorption area of ​​the wafer when gripping wafers of different sizes. This results in smaller wafers being unable to form effective adsorption beyond the wafer edge, while larger wafers are concentrated in the center area of ​​the wafer. This lack of uniform support at the wafer edge leads to stress concentration, edge chipping, surface scratches, and other damage to the wafer.

[0004] Therefore, it is necessary to provide a wafer dicing machine loading and unloading assembly to solve the above-mentioned technical problems. Summary of the Invention

[0005] The technical problem solved by this invention is to provide a wafer dicing machine loading and unloading component that can adapt to wafers of different sizes, physically isolate and temporarily store wafer cassettes of different specifications and batches, and replenish new materials without stopping the machine.

[0006] To solve the above-mentioned technical problems, the present invention provides a wafer dicing machine loading and unloading assembly, comprising: a positioning platform, a first conveyor belt, and a wafer cassette disposed on one side of the dicing machine; the positioning platform is fixedly installed on one side of the dicing machine; the first conveyor belt is disposed on the positioning platform; the wafer cassette is disposed on the first conveyor belt; the outer wall of the wafer cassette has a first inclined surface; the first conveyor belt has multiple sets of positioning structures for clamping and positioning the wafer cassette; the wafer cassette and the positioning platform have wafer lifting mechanisms for sequentially lifting the wafers in the wafer cassette to a specified height; a rotating rod is rotatably installed on the outer wall of the dicing machine near the positioning platform; a first motor is fixedly installed on one side of the dicing machine and is connected to the rotating rod; a rotating disk is fixedly installed on the outer wall of the rotating rod; the rotating disk has multiple sets of loading and unloading mechanisms, each set of loading and unloading mechanisms including a gripping structure and a limiting structure; the gripping structure is used to grip or release the wafer; and the limiting structure is used to limit the position of the gripping structure when gripping the wafer.

[0007] Preferably, any set of the positioning structures includes four limiting plates, four dual-axis guide frames, four contact plates, and multiple third springs. The four limiting plates are fixedly installed on the outer wall of the first conveyor belt. The four dual-axis guide frames are respectively installed through and slidably on the four limiting plates. The four contact plates are respectively fixedly installed on one end of the four dual-axis guide frames, and each of the four contact plates has a second inclined surface on the side that is close to each other. The multiple third springs are respectively sleeved on the four dual-axis guide frames, and the two ends of the multiple third springs are respectively fixedly connected to the contact plates and the limiting plates.

[0008] Preferably, the wafer lifting mechanism includes two first cylinders, two fixed lifting plates, a placement box, and multiple flange plates. The two first cylinders are fixedly mounted on the top of the positioning stage. The two fixed lifting plates are slidably mounted on the top of the positioning stage. The telescopic ends of the two first cylinders are respectively fixedly connected to the two fixed lifting plates. Two telescopic lifting plates are slidably mounted on the ends of the two fixed lifting plates that are close to each other. The placement box is slidably mounted inside the wafer box. The multiple flange plates are respectively fixedly mounted on the outer walls of both sides of the placement box, and the multiple flange plates extend outside the wafer box. One end of a second spring is fixedly mounted on the bottom of the placement box, and the other end of the second spring is fixedly connected to the wafer box. The inner wall of the placement box is provided with multiple blind slots. Telescopic partitions are slidably mounted in the multiple blind slots, and the multiple telescopic partitions extend outside the blind slots. One end of a first spring is fixedly mounted on the side of the multiple telescopic partitions away from the second spring, and the other end of the first spring is fixedly connected to the blind slot.

[0009] Preferably, the gripping and releasing structure includes two second cylinders, a positioning plate, four expansion clamps, four suction cups, and an air pump. A fixed base is fixedly installed on the rotating plate. The two second cylinders are both fixedly installed on the top of the fixed base. The telescopic ends of the two second cylinders extend to the bottom of the fixed base and are fixedly installed on the same annular plate. The positioning plate is slidably installed on the bottom of the annular plate. A cross-shaped groove is provided in the positioning plate. One end of each of the four expansion clamps is slidably installed in the cross-shaped groove, and the other end extends outside the positioning plate. One end of a plurality of fifth springs is fixedly installed in the cross-shaped groove, and the other end of the plurality of fifth springs is respectively connected to the four... The expansion clamps are fixedly connected, and the bottom of each of the four expansion clamps is fixedly installed with a limiting cylinder. Each of the four limiting cylinders extends to the bottom of the positioning plate and is slidably connected to the positioning plate. Each of the four limiting cylinders has a movable column slidably installed inside it. The bottom end of each of the four movable columns extends outside the limiting cylinder, and each of the four suction cups is fixedly installed at the bottom end of the four movable columns. One end of a sixth spring is fixedly installed at the top of each movable column, and the other end of the sixth spring is fixedly connected to the limiting cylinder. The air pump is fixedly installed at the top of the annular plate, and one end of an air pipe is fixedly installed at the top of each of the four suction cups. The other end of the air pipe is fixedly connected to the air inlet of the air pump.

[0010] Preferably, the four expansion clamps are distributed in a 90-degree rotational symmetry, and each of the four expansion clamps has a third inclined surface at the bottom of the end away from the positioning plate.

[0011] Preferably, the limiting structure includes an electromagnetic chuck, locking holes, and multiple metal locking strips. The top of the positioning disk is provided with a mounting groove, and the electromagnetic chuck is fixedly installed in the mounting groove. The bottom of the positioning disk is provided with multiple guide grooves, and the top of each of the multiple guide grooves is provided with multiple locking holes, which are all connected to the mounting grooves. Multiple mounting plates are fixedly installed on the outer walls of the four movable columns, and one end of each of the multiple mounting plates extends outside the limiting cylinder. The bottom ends of the multiple metal locking strips are respectively fixedly installed on the top of the multiple mounting plates, and the top ends of the multiple metal locking strips respectively extend into the multiple guide grooves.

[0012] Preferably, the top of the positioning stage is provided with a feeding device, which includes two sets of delivery mechanisms and a pressing mechanism. A second support is fixedly installed on the top of the positioning stage, and multiple sets of buffer transfer mechanisms are provided in the second support. The buffer transfer mechanisms are used to sequentially transfer multiple wafer cassettes into the two sets of delivery mechanisms.

[0013] Preferably, any set of the delivery mechanism includes two first supports, a second conveyor belt, two rollers, a second motor, and multiple transfer plates. The two first supports are fixedly installed on the top of the positioning platform. Two rotating shafts are rotatably installed inside the first supports. The two rollers are respectively fixedly installed on the outer walls of the two rotating shafts. The second conveyor belt is sleeved on the outer walls of the two rollers, and the multiple transfer plates are fixedly installed on the outer wall of the second conveyor belt. The second motor is fixedly installed on one side of the outer wall of the first support, and the output shaft of the second motor is fixedly connected to one of the rotating shafts.

[0014] Preferably, the pressing mechanism includes a pressure plate, two guide rods, two gears, and two racks. The two guide rods are respectively fixedly installed on the tops of the two first supports. The pressure plate is slidably installed on the two guide rods. A seventh spring is sleeved on the outer side of each of the two guide rods. The two ends of the seventh spring are respectively fixedly connected to the first support and the pressure plate. The two racks are respectively fixedly installed on the outer walls of both sides of the pressure plate. The two gears are respectively fixedly installed on the output shafts of the two second motors, and the two gears mesh with the two racks respectively.

[0015] Preferably, each set of the buffer transfer mechanism includes a third cylinder, a support plate, an opening and closing plate, a pressure sensor, and a flashing light. The support plate is fixedly installed inside the second support, and multiple rollers are rotatably installed on the support plate. The opening and closing plate is rotatably installed on the side of the second support away from the first support. The third cylinder is fixedly installed on one side of the opening and closing plate. The output shaft of the third cylinder extends into the second support and is fixedly installed with a top plate. Limiting grooves are provided on both inner walls of the second support. Guide limiting protrusions are integrally formed on both sides of the top plate. One end of the guide limiting protrusion extends into the limiting groove and is slidably connected to the limiting groove. The pressure sensor is fixedly installed in the limiting groove. The flashing light is fixedly installed on one outer wall of the second support.

[0016] Compared with related technologies, the wafer dicing machine loading and unloading assembly provided by the present invention has the following beneficial effects: This invention provides a wafer dicing machine loading and unloading assembly. Through the cooperation of a positioning structure, a wafer lifting mechanism, and various internal components, the second inclined surface of the contact plate, combined with the elastic clamping force of the third spring, can quickly perform four-point positioning of the wafer cassette, thereby effectively avoiding deviation during transport. The fixed lifting plate and the telescopic lifting plate are driven by the first cylinder, which can adapt to wafer cassettes of different specifications. With the help of the flange plate, the lifting seat is gradually lifted, thereby realizing the orderly lifting of wafer layers. Only a single wafer to be gripped is exposed at a time, avoiding friction and collision between multiple layers of wafers. Furthermore, the telescopic partition can automatically separate the wafers under the action of the first spring. Through the coordinated use of the gripping and releasing structure, the limiting structure, and various internal components, four expansion clamps that are rotated 90 degrees apart achieve elastic expansion and gripping through the third and first inclined surfaces and under the action of the fifth spring. Combined with the negative pressure adsorption of the suction cup, wafers of different sizes can be adsorbed and gripped. Furthermore, the movable column, in conjunction with the sixth spring, can buffer the pressure during gripping and prevent damage to the wafer surface. The limiting structure uses an electromagnetic suction cup to adsorb a metal clip, fixing the position of the movable column and the suction cup, further improving gripping accuracy and preventing deviation during gripping, as well as sudden retraction during wafer adsorption that could damage the wafer. Through the coordinated operation of the delivery mechanism, pressing mechanism, and buffer transfer mechanism, the multi-layer support plates within the second support can achieve physical isolation and temporary storage of wafer cassettes of different specifications and batches. Combined with the rear opening and closing plate, new materials can be replenished without stopping the machine, and categorized storage avoids wafer confusion. The opposing rotation of the two second conveyor belts sequentially delivers the wafers from the multi-layer support plates to the first conveyor belt. The meshing of gears and racks drives the pressure plate to achieve cyclic lifting, pressing the wafer cassettes into the positioning structure for positioning, eliminating the need for manual pressing. When the wafer cassettes on the support plates within the buffer transfer mechanism have been delivered, it can remind operators to add wafer cassettes promptly. Pressure sensors and flashing lights provide real-time feedback on the storage status of each layer of wafer cassettes; when a single layer is depleted, the corresponding flashing light illuminates, allowing operators to promptly grasp the timing of material replenishment. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the first embodiment of the wafer dicing machine loading and unloading assembly provided by the present invention; Figure 2 for Figure 1 The diagram shows the structure of the wafer cassette after it has been separated from the first conveyor belt. Figure 3 for Figure 2 The diagram shows a cross-sectional view of the wafer box, placement box, and second spring, among other structures. Figure 4 for Figure 2 The diagram shown is a structural schematic of the placement box and the wafer box after they have been separated. Figure 5 for Figure 2 The diagram shown is an enlarged view of the structure of part A. Figure 6 for Figure 1 The diagram shows a partial structural representation. Figure 7 for Figure 6 A partial structural assembly cross-sectional view is shown. Figure 8 for Figure 7 The diagram shows the structure after the positioning plate and the electromagnetic chuck are separated. Figure 9 for Figure 8 The diagram shows a cross-sectional view of the positioning disk. Figure 10 for Figure 7 The diagram shows a cross-sectional view of the positioning disk and the electromagnetic chuck. Figure 11 for Figure 7 The diagram shows the assembly of the expansion clamp, limiting cylinder, and suction cup. Figure 12 for Figure 11 The diagram shows a partial sectional view of the structure. Figure 13 This is a schematic diagram of a second embodiment of the wafer dicing machine loading and unloading assembly provided by the present invention; Figure 14 for Figure 13 A schematic diagram of the structure from another perspective; Figure 15 for Figure 13 The diagram shows the structure after the first and second supports have been separated. Figure 16 for Figure 15 The schematic diagram of the second support section shown; Figure 17 for Figure 15 The diagram shows the structure after the pressure plate and the first support are separated. Figure 18 for Figure 17 The diagram shows a partial structural schematic.

[0018] The diagram shows the following components: 1. Dicing machine; 2. Positioning stage; 3. First conveyor belt; 4. First motor; 5. Fixed base; 6. Wafer box; 7. Telescopic partition; 8. First spring; 9. Placement box; 10. Second spring; 11. Flange plate; 12. First cylinder; 13. Fixed lifting plate; 14. Telescopic lifting plate; 15. Positioning structure; 151. Limiting plate; 152. Dual-axis guide frame; 153. Contact plate; 154. Third spring; 16. Roller; 17. Transfer plate; 18. Second cylinder; 19. Rotary disk; 20. Rotating rod; 21. Expansion clamp; 22. Air pump; 23. Guide bolt. 24. Fourth spring; 25. Positioning plate; 26. Electromagnetic chuck; 27. Annular plate; 28. Air pipe; 29. ​​Locking hole; 30. Fifth spring; 31. Suction cup; 32. Limiting cylinder; 33. Metal locking strip; 34. Movable column; 35. Sixth spring; 36. Pressure plate; 37. First support; 38. Second support; 39. Third cylinder; 40. Opening and closing plate; 41. Second conveyor belt; 42. Second motor; 43. Gear; 44. Seventh spring; 45. Guide rod; 46. Rack; 47. Support plate; 48. Flashing light; 49. Roller; 50. Pressure sensor; 51. Top plate. Detailed Implementation

[0019] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0020] First embodiment: Please refer to the following: Figures 1-12 In the first embodiment of the present invention, the wafer dicing machine loading and unloading assembly includes: a positioning table 2, a first conveyor belt 3, and a wafer cassette 6 disposed on one side of the dicing machine 1. The positioning table 2 is fixedly installed on one side of the dicing machine 1. The first conveyor belt 3 is disposed on the positioning table 2. A support plate is fixedly installed at the bottom of the positioning table 2 to support the bottom of the first conveyor belt 3. The wafer cassette 6 is disposed on the first conveyor belt 3. The outer wall of the wafer cassette 6 is provided with a first inclined surface. Multiple sets of positioning structures 15 are provided on the first conveyor belt 3. The positioning structures 15 are used to clamp and position the wafer cassette 6. The positioning stage 2 is equipped with a wafer lifting mechanism, which is used to lift the wafers in the wafer box 6 to a specified height in sequence. A rotating rod 20 is rotatably installed on the outer wall of the dicing machine 1 near the positioning stage 2. A first motor 4 is fixedly installed on one side of the dicing machine 1. The first motor 4 is connected to the rotating rod 20 for transmission. A rotating disk 19 is fixedly installed on the outer wall of the rotating rod 20. The rotating disk 19 is equipped with multiple sets of loading and unloading mechanisms. Each set of loading and unloading mechanisms includes a gripping and releasing structure and a limiting structure. The gripping and releasing structure is used to grip or release the wafers, and the limiting structure is used to limit the position of the gripping and releasing structure when gripping the wafers.

[0021] Each positioning structure 15 includes four limiting plates 151, four dual-axis guide frames 152, four contact plates 153, and multiple third springs 154. The four limiting plates 151 are fixedly installed on the outer wall of the first conveyor belt 3. The four limiting plates 151 are arranged in a rectangular symmetrical pattern to form a balanced clamping force from all sides, preventing the fully loaded wafer cassette 6 from tilting due to force on one side. The four dual-axis guide frames 152 are respectively installed through and slidably on the four limiting plates 151. The four contact plates 153 are respectively fixedly installed on one end of the four dual-axis guide frames 152. The sides of the four contact plates 153 that are close to each other are provided with a second inclined surface. The second inclined surface forms a dual function of "guiding and calibration". The second inclined surface first contacts and guides the wafer cassette 6 to automatically correct the horizontal offset. The contact plates 153 are adapted to the size deviation of wafer cassettes 6 of different specifications. The multiple third springs 154 are respectively sleeved on the four dual-axis guide frames 152, and the two ends of the multiple third springs 154 are respectively fixedly connected to the contact plates 153 and the limiting plates 151.

[0022] The wafer lifting mechanism includes two first cylinders 12, two fixed lifting plates 13, a placement box 9, and multiple flange plates 11. The two first cylinders 12 are fixedly mounted on the top of the positioning stage 2, and the two fixed lifting plates 13 are slidably mounted on the top of the positioning stage 2. The telescopic ends of the two first cylinders 12 are respectively fixedly connected to the two fixed lifting plates 13. Two telescopic lifting plates 14 are slidably mounted on the ends of the two fixed lifting plates 13 that are close to each other. A return spring is fixedly mounted on the side of each telescopic lifting plate 14 near the first cylinder 12, allowing for effective telescopic extension and retraction. The telescopic lifting plates 14 can flexibly adjust their support position according to the spacing of the flange plates 11. When the first cylinder 12 drives the lifting, the telescopic lifting plates 14... 4. The wafers are fed to a designated height layer by layer by the flange plate 11 in contact with each other. The placement box 9 is slidably installed inside the wafer box 6. Multiple flange plates 11 are fixedly installed on the outer walls of both sides of the placement box 9, and the multiple flange plates 11 extend outside the wafer box 6. One end of the second spring 10 is fixedly installed at the bottom of the placement box 9, and the other end of the second spring 10 is fixedly connected to the wafer box 6. Multiple blind slots are provided on the inner wall of the placement box 9. Telescopic partitions 7 are slidably installed in the multiple blind slots, and the multiple telescopic partitions 7 extend outside the blind slots. One end of the first spring 8 is fixedly installed on the side of the multiple telescopic partitions 7 away from the second spring 10, and the other end of the first spring 8 is fixedly connected to the blind slot.

[0023] The gripping and releasing structure includes two second cylinders 18, a positioning plate 25, four expansion clamps 21, four suction cups 31, and an air pump 22. A fixed base 5 is fixedly installed on the rotating plate 19. Both second cylinders 18 are fixedly installed on the top of the fixed base 5. The telescopic ends of the two second cylinders 18 extend to the bottom of the fixed base 5 and are fixedly installed on the same annular plate 27. The positioning plate 25 is slidably installed on the bottom of the annular plate 27. Four first fixing ears are fixedly installed on the outer wall of the annular plate 27, and each of the four first fixing ears is provided with a guide bolt 23 at its top. The bottom end of the guide bolt 23 extends through to the bottom of the first fixing ear and is fixedly connected to the positioning plate 25. The four guide bolts 23 are slidably connected to the four first fixing ears respectively. A fourth spring 24 is sleeved on the outer side of each of the four guide bolts 23. The two ends of the fourth spring 24 are fixedly connected to the positioning plate 25 and the first fixing ears respectively. The positioning plate 25 has a cross-shaped groove. One end of each of the four expansion clamps 21 is slidably installed in the cross-shaped groove, and the other end extends outside the positioning plate 25. During the descent of the positioning plate 25, the fourth spring 24... The three inclined surfaces first contact the edge of the wafer cassette 6, and expand outward along the cross-shaped groove as the pressure decreases. The suction cup 31 also moves together with the expansion clamp 21, and the fifth spring 30 is compressed until the suction cup 31 is completely attached to the wafer surface. One end of multiple fifth springs 30 is fixedly installed in the cross-shaped groove, and the other end of multiple fifth springs 30 is fixedly connected to the four expansion clamps 21 respectively. The bottom of each of the four expansion clamps 21 is fixedly installed with a limiting cylinder 32, and the four limiting cylinders 32 extend to the bottom of the positioning plate 25 and slide against the positioning plate 25. The four limiting cylinders 32 are slidably installed with movable columns 34 inside each of them. The bottom ends of the four movable columns 34 extend outside the limiting cylinders 32. The four suction cups 31 are respectively fixedly installed at the bottom ends of the four movable columns 34. The top end of the movable column 34 is fixedly installed with one end of the sixth spring 35. The other end of the sixth spring 35 is fixedly connected to the limiting cylinder 32. The air pump 22 is fixedly installed on the top of the annular plate 27. The top of each of the four suction cups 31 is fixedly installed with one end of the air pipe 28. The other end of the air pipe 28 is fixedly connected to the air inlet end of the air pump 22.

[0024] The four expansion clamps 21 are symmetrically distributed at a 90-degree rotation. Each of the four expansion clamps 21 has a third inclined surface at the bottom of the end away from the positioning disk 25. The third inclined surface of the four expansion clamps 21 first contacts the edge of the wafer box 6. As the pressure decreases, it expands outward along the cross-shaped groove. The suction cup 31 also moves with the expansion clamps 21, so that the suction cup 31 can adsorb wafers of different sizes.

[0025] The limiting structure includes an electromagnetic chuck 26, a locking hole 29, and multiple metal locking strips 33. The top of the positioning plate 25 is provided with a mounting groove, and the electromagnetic chuck 26 is fixedly installed in the mounting groove. The bottom of the positioning plate 25 is provided with multiple guide grooves, and the top of each guide groove is provided with multiple locking holes 29. The multiple locking holes 29 are all connected to the mounting groove. Multiple mounting plates are fixedly installed on the outer walls of the four movable columns 34. One end of each mounting plate extends to the outside of the limiting cylinder 32. The bottom ends of the multiple metal locking strips 33 are fixedly installed on the top of the multiple mounting plates, and the top ends of the multiple metal locking strips 33 extend into the multiple guide grooves. The metal locking strips 33 rise with the movable column 34 and are locked into the locking holes 29 at the top of the guide grooves. The electromagnetic chuck 26 adsorbs the metal locking strips 33, fixing the position of the movable column 34 and the chuck 31 to prevent displacement during gripping and the retraction of the expansion clamp 21.

[0026] In this embodiment: The wafers to be processed are placed in layers in the placement box 9. The telescopic partition 7 automatically pops out under the action of the first spring 8 to separate adjacent wafers. Then, the worker places the wafer box 6 in one of the positioning structures 15 on the first conveyor belt 3. After the contact plate 153 is squeezed by the wafer box 6, it slides along the limiting plate 151 through the dual-axis guide frame 152. The third spring 154 is compressed and generates a reverse elastic force. The four contact plates 153 together clamp the wafer box 6 to prevent it from shifting during transportation. Then, the first conveyor belt 3 is started, which moves the wafer box 6 to the designated position. The first motor 4 is started, which drives the rotating rod 20 to rotate through the output shaft, causing the rotating disk 19 to rotate. This aligns one set of loading and unloading mechanisms with the wafer box 6 on the positioning table 2. The two first cylinders 12 are started, and the telescopic ends of the first cylinders 12 drive the fixed lifting plate 13 to rise. At this time, the telescopic lifting plate 14 on the fixed lifting plate 13 adapts to the size of the wafer box 6 and fits the bottom of the flange plate 11. The first cylinders 12 continue to extend, and the fixed lifting plate 13 drives the placement box 9 to move upward through the flange plate 11, raising the top wafer to the designated gripping height. The second cylinder 18 is activated, which drives the annular plate 27 and the positioning plate 25, expansion clamping plate 21, and suction cup 31 to move downwards via the telescopic end until the suction cup 31 is close to the wafer surface. At this time, the electromagnetic chuck 26 is energized to generate magnetic force. During the descent of the positioning plate 25, the third inclined surfaces of the four expansion clamping plates 21 first contact the edge of the wafer box 6, and expand outwards along the cross-shaped groove with the downward pressure. The suction cup 31 also moves with the expansion clamping plates 21, and the fifth spring 30 is compressed until the suction cup 31 is completely in contact with the wafer surface. When the suction cup 31 is in contact, the movable column 34 slides upwards along the limiting cylinder 32 to avoid damaging the wafer. At the same time, the metal clip 33 moves with the movement. The column 34 rises and engages with the card hole 29 at the top of the guide slide. The electromagnetic chuck 26 adsorbs the metal card strip 33, fixing the position of the movable column 34 and the chuck 31 to prevent deviation during gripping and to allow the expansion clamp 21 to retract. The air pump 22 is started, and the air pump 22 draws air from the chuck 31 through the air pipe 28 to form a negative pressure to adsorb the wafer. After confirming that the adsorption is firm, the second cylinder 18 retracts, driving the wafer to rise. The rotary disk 19 rotates to the processing station of the dicing machine 1. After one layer of wafer gripping is completed, the first cylinder 12 gradually extends, lifting the lower layer of wafers in sequence to ensure that only one wafer to be gripped is exposed each time. When lifting the lower layer of wafers, the upper telescopic partition 7 retracts into the blind slot to avoid obstructing the gripping of the lower layer of wafers. Subsequently, the rotating disk 19 carries the adsorbed wafer to the upper part of the processing station. The second cylinder 18 extends to send the wafer to the designated placement position. The air pump 22 is turned off, and the suction cup 31 returns to normal pressure, releasing the adsorption of the wafer. The electromagnetic chuck 26 is de-energized, and the metal clip 33 disengages from the clip hole 29 under the elastic force of the sixth spring 35. The movable column 34 resets, the second cylinder 18 retracts, and the expansion clamp 21 resets under the action of the fifth spring 30, completing a single loading. After processing is completed, the rotating disk 19 drives another set of loading and unloading mechanisms to move to the processing station and repeat the above gripping steps. When all the wafers in a wafer box 6 have been processed, the processed wafers are placed back into the placement box 9 by the loading and unloading mechanism. At this time, the first cylinder 12 retracts, the placement box 9 is reset by the action of the second spring 10, and the telescopic partition 7 is reset by the first spring 8, so that the processed wafers can be separated again.

[0027] Second embodiment: The second embodiment of the present invention will be further described below with reference to the accompanying drawings and embodiments.

[0028] Please refer to the following: Figures 13-18In the wafer dicing machine loading and unloading assembly provided in this embodiment, the top of the positioning stage 2 is provided with a feeding device, which includes two sets of delivery mechanisms and a pressing mechanism. The top of the positioning stage 2 is fixedly installed with a second support 38, and the second support 38 is provided with multiple sets of buffer transfer mechanisms. The buffer transfer mechanisms are used to sequentially transfer multiple wafer boxes 6 into the two sets of delivery mechanisms.

[0029] Each delivery mechanism includes two first supports 37, a second conveyor belt 41, two rollers 16, a second motor 42, and multiple transfer plates 17. The two first supports 37 are fixedly installed on the top of the positioning platform 2. Two rotating shafts are rotatably installed inside the first supports 37. The two rollers 16 are respectively fixedly installed on the outer walls of the two rotating shafts. The second conveyor belt 41 is sleeved on the outer walls of the two rollers 16, and the multiple transfer plates 17 are fixedly installed on the outer walls of the second conveyor belt 41. The second motor 42 is fixedly installed on one side of the outer wall of the first support 37, and the output shaft of the second motor 42 is fixedly connected to one of the rotating shafts.

[0030] The pressing mechanism includes a pressure plate 36, two guide rods 45, two gears 43, and two racks 46. The two guide rods 45 are fixedly mounted on the tops of the two first supports 37. The pressure plate 36 is slidably mounted on the two guide rods 45. A seventh spring 44 is sleeved on the outer side of each guide rod 45, with both ends of the seventh spring 44 fixedly connected to the first support 37 and the pressure plate 36, respectively. The two racks 46 are fixedly mounted on the outer walls of both sides of the pressure plate 36. The two gears 43 are fixedly mounted on the output shafts of the two second motors 42, and the two gears 43 are respectively connected to… Two racks 46 mesh with each other, and the gear 43 on the output shaft of the second motor 42 meshes with the racks 46 on both sides of the pressure plate 36. As the output shaft of the second motor 42 rotates, it synchronously drives the gear 43, which has only half a tooth, to rotate. When the tooth meshes with the rack 46, the pressure plate 36 slides down along the guide rod 45. The seventh spring 44 compresses and lightly presses the top of the wafer cassette 6. When the gear 43 rotates to the toothless area, it disengages from the rack 46. The pressure plate 36 rises and resets under the action of the spring force. The second motor 42 continues to run, and the pressure plate 36 repeatedly rises and falls and presses multiple wafer cassettes 6 in sequence.

[0031] Each set of buffer transfer mechanisms includes a third cylinder 39, a support plate 47, an opening and closing plate 40, a pressure sensor 50, and a flashing light 48. The support plate 47 is fixedly installed inside the second support 38, and multiple rollers 49 are rotatably mounted on the support plate 47. The support plate 47 serves as the supporting base for the wafer cassette 6. The multiple sets of rollers 49 rotatably mounted on the surface convert the sliding friction between the wafer cassette 6 and the support plate 47 into rolling friction, avoiding significant wear on the bottom of the wafer cassette 6. The opening and closing plate 40 is rotatably installed on the side of the second support 38 away from the first support 37. The end of the opening and closing plate 40 away from the hinge is provided with a second fixing lug. The second support 38 A third fixing ear is fixedly installed on the side near the second fixing ear. The second and third fixing ears share the same fixing bolt. When placing a wafer cassette 6, the operator first manually opens the hinged plate 40 on the rear side of the second support 38, and places the wafer cassettes 6 containing different wafers one by one onto the multi-layer support plates 47 inside the second support 38. This ensures that different types of wafer cassettes 6 are placed on different support plates 47, achieving classified temporary storage. After placement, the hinged plate 40 is closed and locked. A third cylinder 39 is fixedly installed on one side of the hinged plate 40, and the output shaft of the third cylinder 39 extends into the second support 38. A top plate 51 is fixedly installed. Limiting grooves are provided on both inner walls of the second support 38. Guide limiting protrusions are integrally formed on both sides of the top plate 51. One end of the guide limiting protrusion extends into the limiting groove and is slidably connected to it. A large space is provided between the limiting groove and the guide limiting protrusion, allowing the top plate 51 and guide limiting protrusion to rotate outwards when the opening / closing plate 40 is rotated. A pressure sensor 50 is fixedly installed in the limiting groove. A flashing light 48 is fixedly installed on one outer wall of the second support 38. When the last wafer cassette 6 in a buffer transfer mechanism is pushed into the feeding mechanism, the top plate 51 and the pressure sensor 50... When the force sensor 50 contacts, the corresponding flashing light 48 on the side illuminates red, reminding the operator that there is no wafer cassette 6 on the support plate 47 in this buffer transfer mechanism and that wafer cassette 6 needs to be placed. After the operator confirms, the system switches to another buffer transfer mechanism and continues to push the wafer cassette 6 in the other buffer transfer mechanism into the unloading mechanism. Then, the extension end of the third cylinder 39 in the buffer transfer mechanism is retracted after the push is completed, the flashing light 48 goes out, the opening and closing plate 40 on the corresponding side is opened, and the wafer cassette 6 containing different wafers is placed on the support plate 47 again. The opening and closing plate 40 is then closed to complete the work.

[0032] In this embodiment: The staff first manually opened the hinged plate 40 on the back of the second support 38, and placed the wafer boxes 6 containing different wafers one by one onto the multi-layer support plates 47 inside the second support 38 to ensure that different types of wafer boxes 6 are placed on different support plates 47, so as to achieve classified temporary storage. After the placement is completed, the hinged plate 40 is closed and locked. When any one of the buffer transfer mechanisms is activated, the third cylinder 39 drives the top plate 51 to slide forward along the limiting grooves on both sides of the second support 38 via its telescopic end. The top plate 51 pushes multiple wafer cassettes 6 toward the unloading mechanism. The two second motors 42 are activated, and the two second motors 42 drive two rollers 16 to rotate in opposite directions via their output shafts. The two second conveyor belts 41 rotate accordingly. The top plate 51 pushes multiple wafer cassettes 6 onto multiple transfer plates 17 in sequence. The multiple transfer plates 17 then feed multiple wafer cassettes 6 into multiple positioning structures 15 on the first conveyor belt 3. The gear 43 on the output shaft of the second motor 42 meshes with the racks 46 on both sides of the pressure plate 36, causing the pressure plate 36 to slide down along the guide rod 45. The seventh spring 4... 4. Compression: The pressure plate 36 presses the top of the wafer box 6, pressing the wafer box 6 into the positioning structure 15. After the contact plate 153 is squeezed by the wafer box 6, the third spring 154 is compressed and generates a reverse elastic force. The four contact plates 153 together clamp the wafer box 6. As the output shaft of the second motor 42 rotates, it synchronously drives the gear 43 with only half a tooth to rotate. When the tooth meshes with the rack 46, the pressure plate 36 slides down along the guide rod 45. The seventh spring 44 compresses and lightly presses the top of the wafer box 6. When the gear 43 rotates to the toothless area, it disengages from the rack 46. The pressure plate 36 rises and resets under the action of the spring force. The second motor 42 continues to run. The pressure plate 36 repeatedly rises and falls and presses multiple wafer boxes 6 in sequence. When the last wafer cassette 6 in a buffer transfer mechanism is pushed into the unloading mechanism, the top plate 51 contacts the pressure sensor 50, and the corresponding flashing light 48 turns red, reminding the operator that there is no wafer cassette 6 on the support plate 47 in this buffer transfer mechanism and that a wafer cassette 6 needs to be placed. After the operator confirms, the operator switches to another buffer transfer mechanism through the control system and continues to push the wafer cassette 6 in the other buffer transfer mechanism into the unloading mechanism. Then, the extension end of the third cylinder 39 in the buffer transfer mechanism is retracted after the pushing is completed, the flashing light 48 turns off, the opening and closing plate 40 on the corresponding side is opened, and the wafer cassette 6 containing different wafers is placed on the support plate 47 again. The opening and closing plate 40 is then closed to complete the work.

[0033] The above are merely embodiments of the present invention and do not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A wafer dicing machine loading and unloading assembly, comprising: A positioning table (2), a first conveyor belt (3), and a wafer cassette (6) are arranged on one side of a dicing machine (1). The positioning table (2) is fixedly installed on one side of the dicing machine (1). The first conveyor belt (3) is arranged on the positioning table (2), and the wafer cassette (6) is arranged on the first conveyor belt (3). The wafer cassette (6) has a first inclined surface on its outer wall. The first conveyor belt (3) has multiple sets of positioning structures (15) for clamping and positioning the wafer cassette (6). The wafer cassette (6) and the positioning table (2) are provided with a wafer lifting mechanism for lifting the wafer cassette (6). The wafers in the round box (6) are sequentially lifted to a specified height. A rotating rod (20) is rotatably installed on the outer wall of the dicing machine (1) near the positioning table (2). A first motor (4) is fixedly installed on one side of the dicing machine (1). The first motor (4) is connected to the rotating rod (20) in a transmission. A rotating disk (19) is fixedly installed on the outer wall of the rotating rod (20). The rotating disk (19) is provided with multiple sets of loading and unloading mechanisms. Each set of loading and unloading mechanisms includes a gripping and releasing structure and a limiting structure. The gripping and releasing structure is used to grip or release the wafers. The limiting structure is used to limit the position of the gripping and releasing structure when gripping the wafers.

2. The wafer dicing machine loading and unloading assembly according to claim 1, characterized in that, Each of the positioning structures (15) includes four limiting plates (151), four dual-axis guide frames (152), four contact plates (153), and multiple third springs (154). The four limiting plates (151) are fixedly installed on the outer wall of the first conveyor belt (3). The four dual-axis guide frames (152) are respectively installed through and slidably on the four limiting plates (151). The four contact plates (153) are respectively fixedly installed on one end of the four dual-axis guide frames (152), and the side of the four contact plates (153) that are close to each other is provided with a second inclined surface. The multiple third springs (154) are respectively sleeved on the four dual-axis guide frames (152), and the two ends of the multiple third springs (154) are respectively fixedly connected to the contact plates (153) and the limiting plates (151).

3. The wafer dicing machine loading and unloading assembly according to claim 2, characterized in that, The wafer lifting mechanism includes two first cylinders (12), two fixed lifting plates (13), a placement box (9), and multiple flange plates (11). The two first cylinders (12) are fixedly mounted on the top of the positioning stage (2), and the two fixed lifting plates (13) are slidably mounted on the top of the positioning stage (2). The telescopic ends of the two first cylinders (12) are respectively fixedly connected to the two fixed lifting plates (13). Two telescopic lifting plates (14) are slidably mounted on the ends of the two fixed lifting plates (13) that are close to each other. The placement box (9) is slidably mounted inside the wafer box (6), and the multiple flange plates (11) are respectively fixedly mounted on the wafer box. On both outer walls of the placement box (9), and multiple flange plates (11) extend to the outside of the wafer box (6), one end of a second spring (10) is fixedly installed at the bottom of the placement box (9), and the other end of the second spring (10) is fixedly connected to the wafer box (6). Multiple blind slots are provided on the inner wall of the placement box (9), and telescopic partitions (7) are slidably installed in the multiple blind slots. The multiple telescopic partitions (7) extend to the outside of the blind slots. One end of a first spring (8) is fixedly installed on the side of the multiple telescopic partitions (7) away from the second spring (10), and the other end of the first spring (8) is fixedly connected to the blind slot.

4. The wafer dicing machine loading and unloading assembly according to claim 1, characterized in that, The gripping and releasing structure includes two second cylinders (18), a positioning plate (25), four expansion clamps (21), four suction cups (31), and an air pump (22). A fixed seat (5) is fixedly installed on the rotating plate (19). The two second cylinders (18) are fixedly installed on the top of the fixed seat (5). The telescopic ends of the two second cylinders (18) extend through to the bottom of the fixed seat (5) and are fixedly installed on the same annular plate (27). The positioning plate (25) is slidably installed on the bottom of the annular plate (27). A cross-shaped groove is provided in the positioning plate (25). One end of each of the four expansion clamps (21) is slidably installed in the cross-shaped groove, and the other end extends to the outside of the positioning plate (25). One end of a plurality of fifth springs (30) is fixedly installed in the cross-shaped groove, and the other end of the plurality of fifth springs (30) is fixed to the four expansion clamps (21) respectively. The four expansion clamps (21) are connected, and the bottom of each of the four expansion clamps (21) is fixedly installed with a limiting cylinder (32). The four limiting cylinders (32) extend to the bottom of the positioning plate (25) and are slidably connected to the positioning plate (25). Each of the four limiting cylinders (32) is slidably installed with a movable column (34). The bottom end of each of the four movable columns (34) extends to the outside of the limiting cylinder (32). The four suction cups (31) are respectively fixedly installed at the bottom of the four movable columns (34). The top of each movable column (34) is fixedly installed with one end of a sixth spring (35). The other end of the sixth spring (35) is fixedly connected to the limiting cylinder (32). The air pump (22) is fixedly installed on the top of the annular plate (27). The top of each of the four suction cups (31) is fixedly installed with one end of an air pipe (28). The other end of the air pipe (28) is fixedly connected to the air inlet of the air pump (22).

5. The wafer dicing machine loading and unloading assembly according to claim 4, characterized in that, The four expansion clamps (21) are distributed in a 90-degree rotational symmetry, and each of the four expansion clamps (21) has a third inclined surface at the bottom of the end away from the positioning disk (25).

6. The wafer dicing machine loading and unloading assembly according to claim 4, characterized in that, The limiting structure includes an electromagnetic chuck (26), a locking hole (29), and multiple metal locking strips (33). The top of the positioning disk (25) is provided with an installation groove, and the electromagnetic chuck (26) is fixedly installed in the installation groove. The bottom of the positioning disk (25) is provided with multiple guide grooves, and the top of each of the multiple guide grooves is provided with multiple locking holes (29). The multiple locking holes (29) are all connected to the installation groove. The outer walls of the four movable columns (34) are all fixedly installed with multiple mounting plates. One end of each of the multiple mounting plates extends to the outside of the limiting cylinder (32). The bottom ends of the multiple metal locking strips (33) are respectively fixedly installed on the top of the multiple mounting plates, and the top ends of the multiple metal locking strips (33) respectively extend into the multiple guide grooves.

7. The wafer dicing machine loading and unloading assembly according to claim 2, characterized in that, The top of the positioning platform (2) is provided with a feeding device, which includes two sets of delivery mechanisms and a pressing mechanism. The top of the positioning platform (2) is fixedly installed with a second support (38), which is provided with multiple sets of buffer transfer mechanisms. The buffer transfer mechanisms are used to transfer multiple wafer boxes (6) sequentially into the two sets of delivery mechanisms.

8. The wafer dicing machine loading and unloading assembly according to claim 7, characterized in that, Each delivery mechanism includes two first supports (37), a second conveyor belt (41), two rollers (16), a second motor (42), and multiple transfer plates (17). The two first supports (37) are fixedly installed on the top of the positioning platform (2). Two rotating shafts are rotatably installed inside the first support (37). The two rollers (16) are respectively fixedly installed on the outer walls of the two rotating shafts. The second conveyor belt (41) is sleeved on the outer walls of the two rollers (16), and the multiple transfer plates (17) are fixedly installed on the outer walls of the second conveyor belt (41). The second motor (42) is fixedly installed on one side of the outer wall of the first support (37), and the output shaft of the second motor (42) is fixedly connected to one of the rotating shafts.

9. The wafer dicing machine loading and unloading assembly according to claim 8, characterized in that, The pressing mechanism includes a pressure plate (36), two guide rods (45), two gears (43), and two racks (46). The two guide rods (45) are fixedly installed on the top of the two first supports (37), and the pressure plate (36) is slidably installed on the two guide rods (45). A seventh spring (44) is sleeved on the outer side of each of the two guide rods (45). The two ends of the seventh spring (44) are fixedly connected to the first support (37) and the pressure plate (36) respectively. The two racks (46) are fixedly installed on the outer walls of both sides of the pressure plate (36), and the two gears (43) are fixedly installed on the output shafts of the two second motors (42) respectively, and the two gears (43) mesh with the two racks (46) respectively.

10. The wafer dicing machine loading and unloading assembly according to claim 8, characterized in that, Each set of the buffer transfer mechanism includes a third cylinder (39), a support plate (47), an opening and closing plate (40), a pressure sensor (50), and a flashing light (48). The support plate (47) is fixedly installed inside the second support (38), and multiple rollers (49) are rotatably mounted on the support plate (47). The opening and closing plate (40) is rotatably installed on the side of the second support (38) away from the first support (37). The third cylinder (39) is fixedly installed on one side of the opening and closing plate (40). The output shaft of the third cylinder (39) extends into the second support (38) and is fixedly installed with a top plate (51). The inner walls of both sides of the second support (38) are provided with limiting grooves. The top plate (51) is integrally formed with guide limiting protrusions on both sides. One end of the guide limiting protrusion extends into the limiting groove and is slidably connected with the limiting groove. The pressure sensor (50) is fixedly installed in the limiting groove. The flashing light (48) is fixedly installed on one side of the outer wall of the second support (38).

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