Conductive foam self-adaptive attaching device and pressure control method

Abstract

The application discloses a conductive foam self-adaptive attaching device and a pressure control method, relates to the technical field of battery packaging, and is composed of multiple groups of double-stage action assemblies arranged in a linear direction in sequence. Each group of assemblies comprises a primary active assembly, a secondary active assembly and a corresponding frame. A gas suction platform is slidingly installed in the secondary frame. A pressure sensing assembly is arranged between the platform and the frame. The control method is associated with the double-stage active assembly through the pressure sensing assembly, a pressure closed-loop feedback system comprising an action and detection signal, an elastic stress cross-linking analysis and a global autonomous learning analysis module is constructed, a stroke deviation degree is calculated based on a pressure deformation fitting formula, a correction coefficient is generated through a multi-point common linkage deviation model, the action stroke of the double-stage assembly is dynamically adjusted, the attaching pressure can be accurately controlled, the flexible characteristics of the conductive foam are adapted, performance failure or bubble problems caused by improper pressure are avoided, and the attaching quality and consistency are improved.

Description

Technical Field

[0001] This invention relates to the field of battery packaging technology, specifically to an adaptive bonding device for conductive foam and a pressure control method. Background Technology

[0002] Conductive foam plays a primary role in electromagnetic shielding (EMI) and grounding connection in battery packaging, while also providing auxiliary functions such as buffering and sealing. Essentially, it forms a conductive continuum by wrapping the foam substrate with a metal coating (such as nickel / copper, silver / copper, etc.) or conductive cloth, effectively blocking electromagnetic interference between the internal circuitry of the battery pack and the external environment.

[0003] The key steps in the overall bonding process are the vision positioning system and the closed-loop pressure control system. The former uses machine vision analysis to locate the gripping / releasing position, while the latter is mainly used to control the bonding quality of the conductive foam. Regarding pressure control, it's important to note that both excessive and insufficient pressure will affect bonding quality. For example, insufficient labeling pressure or improper pressure roller arrangement can prevent air from escaping, forming air bubbles. However, it's crucial to understand that the conductive foam's flexibility causes it to deform under pressure. Excessive pressure may lead to over-compression, affecting its conductivity and resilience; insufficient pressure may prevent effective contact, resulting in poor shielding or grounding. However, insufficient overall bonding pressure can also cause the aforementioned air bubble problem.

[0004] In view of the above, the present invention proposes a solution. Summary of the Invention

[0005] The purpose of this invention is to provide an adaptive bonding device and pressure control method for conductive foam. Due to the special properties of conductive foam, if it is subjected to high pressure, it will undergo excessive deformation, which will affect the performance. Conversely, if it is subjected to relatively low pressure, the reduced contact flow will also affect the shielding effect.

[0006] The objective of this invention can be achieved through the following technical solution: a conductive foam adaptive attachment device, which consists of multiple sets of dual-stage action components. The dual-stage action components are arranged sequentially along a linear direction according to the attachment position of the conductive foam. The dual-stage action components include a primary active component, a secondary active component, a primary frame, and a secondary frame. The primary active component drives the primary frame to slide along a linear direction, and the secondary active component is installed in the primary frame and drives the secondary frame to slide along a linear direction.

[0007] An air suction platform is slidably installed in the secondary frame along a linear direction, and a pressure sensing component is provided between the air suction platform and the secondary frame.

[0008] The pressure sensing component obtains the application stroke of the air suction platform driving the conductive foam along the linear direction, and adjusts the stroke of the first-level active component and the second-level active component according to the stroke.

[0009] Further configuration: Conductive foam attachment is performed through multiple sets of dual-stage action components, and a pressure closed-loop feedback module is constructed by connecting the pressure sensing component to the primary active component and the secondary active component. The pressure closed-loop feedback module generates action and detection signal modules, elastic stress crosslinking analysis modules, and global autonomous learning analysis modules.

[0010] Further configuration: The action signals of the primary active component and the secondary active component, the pressure signal of the pressure sensing component, and the action source data of the conductive foam are acquired in the action and detection signal module, and the action signals, pressure signals, and action source data are sent to the elastic stress crosslinking analysis module.

[0011] In the elastic stress crosslinking analysis module, a pressure deformation fitting formula is established based on the motion source data, and the stroke deviation is obtained from the pressure deformation fitting formula.

[0012] In the global autonomous learning analysis module, the travel deviation of multiple multi-level motion components is obtained, and a multi-point common deviation model is established based on the multiple travel deviations. In the multi-point common deviation model, position correction commands are sent to the two-level motion components at a single point position and correction coefficients are input. The motion signals of the first-level active component and the second-level active component are adjusted through the correction coefficients.

[0013] Further settings include: L1 and L2 representing the stroke of the primary active component and the secondary active component respectively, No representing the deformation fitting amount, LH representing the initial height, and Lio representing the deformation stroke of the conductive foam, and establishing the calculation formula for the stroke deviation: Xi = 1 - LH / (LH + Lio).

[0014] Further settings include: using No and Lio to generate the actual travel calculation method in the attachment action, represented by No=k*Lio, where K represents a relative constant value and No represents a relative variable value.

[0015] Further settings include: using i to represent the position number of the conductive foam, generating a deformation deviation curve based on No=k*Lio and substituting it into the multi-point common deviation model, obtaining the upper and lower peak values ​​of the deformation fitting amount in a single time in a single deformation deviation curve, using the difference between the upper and lower peak values ​​as the fluctuation amplitude of the deformation deviation curve, and further obtaining the average value of the fluctuation amplitude and stroke deviation for each dual-stage action component, and further generating the calculation method of the correction coefficient λ: λ=1 / (1+X).

[0016] Further settings: When Xi≤0.05, the adhesion is deemed qualified;

[0017] When 0.05 < Xi ≤ 0.1, perform minor correction;

[0018] When Xi > 0.1, pause the attachment and alarm;

[0019] The primary active component and the secondary active component can be increased or raised according to λ, represented by one of the calculation methods L1*(1 + λ), L1*(1 - λ), L2*(1 + λ), L2*(1 - λ).

[0020] The present invention has the following beneficial effects:

[0021] The key of the present invention lies in the pressure control process during the vertical movement in the attachment action. By using the pressure sensing component to collect the attachment stroke and pressure signals in real time, combined with the stroke deviation degree calculation formula and the correction coefficient adjustment mechanism, the dynamic closed-loop control of the attachment pressure is achieved, avoiding problems such as excessive compression of the foam caused by too much pressure, damage to the electrical conductivity and resilience performance, or poor contact and shielding / grounding effects caused by too little pressure. There is no obvious improvement in the structure. The key lies in: relying on the multi-point co-connected deviation model to associate multiple groups of dual-stage action components, comprehensively analyzing the stroke deviation and fluctuation amplitude at each position, synchronously correcting the single-point deviation, solving the problem of uneven attachment caused by the material difference and mechanical wear of the conductive foam, reducing the generation of bubbles, and ensuring the uniform attachment quality in the whole area;

[0022] Considering that a single attachment action can complete the attachment process of multiple conductive foams, an autonomous adaptability learning model is added, a stroke deviation degree grading determination mechanism is set, and when the standard is exceeded, it will automatically pause and alarm, avoiding the batch production of unqualified attachment products, reducing production losses. At the same time, the grading drive design of the dual-stage action component improves the flexibility of stroke adjustment and the operation stability of the equipment, can accumulate historical attachment data, update the initial action parameters, and gradually optimize the stroke control accuracy, without the need for frequent manual adjustment, adapting to the attachment requirements of different specifications of conductive foams, and improving the versatility and automation level of the equipment. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0024] Figure 1 It is a schematic structural diagram of the conductive foam self-adaptive attachment device proposed by the present invention;

[0025] Figure 2 It is a schematic structural diagram of the dual-stage action component in the conductive foam self-adaptive attachment device proposed by the present invention;

[0026] Figure 3 for Figure 2 A cross-sectional view of a local location in the middle;

[0027] Figure 4 This is a system operation block diagram of the pressure control method for the adaptive bonding device of conductive foam proposed in this invention.

[0028] In the diagram: 1. Primary active component; 2. Secondary active component; 3. Air suction platform; 4. Primary frame; 5. Secondary frame; 6. Pressure sensing component. Detailed Implementation

[0029] The technical solution of the present invention will be clearly and completely described below with reference to the embodiments. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0030] Example 1: Due to the special properties of conductive foam material, excessive deformation under high pressure can affect its performance; conversely, relatively low pressure leading to reduced contact flow can also affect the shielding effect. The following technical solution is proposed to address this:

[0031] Reference Figures 1-3 The conductive foam adaptive attachment device in this embodiment consists of multiple sets of two-stage action components. The two-stage action components are arranged sequentially along the linear direction according to the attachment position of the conductive foam. The two-stage action components include a primary active component 1, a secondary active component 2, a primary frame 4, and a secondary frame 5. The primary active component 1 drives the primary frame 4 to slide along the linear direction, and the secondary active component 2 is installed in the primary frame 4 and drives the secondary frame 5 to slide along the linear direction.

[0032] A suction platform 3 is slidably installed in the secondary frame 5 along a linear direction, and a pressure sensing component 6 is provided between the suction platform 3 and the secondary frame 5.

[0033] The pressure sensing component 6 obtains the application stroke of the air suction platform 3 driving the conductive foam along the linear direction, and adjusts the stroke of the first-level active component 1 and the second-level active component 2 according to the stroke.

[0034] Basic principle: A brief explanation of the automatic conductive foam attaching equipment: It is mainly an automated device that adopts a suction-then-place action. The key is that the air suction platform 3 suctions a single conductive foam and then moves it to the designated position to attach the conductive foam to the designated position on the product.

[0035] The lateral translation process in the above-mentioned adsorption-then-placement action will not be discussed in detail. The key point is the process of attaching the conductive foam to the product. According to automation design standards, the vertical translation stroke can be preset according to product specifications. However, considering that conductive foam is a flexible material with elastic deformation, the accuracy of the stroke is more critical. Therefore, refer to... Figure 2 To explain, the present invention controls the stroke by moving the air suction platform 3 during two displacement processes. For example, the primary active component 1 moves the primary frame 4 downward, while the secondary active component 2 has three actions: moving upward, remaining stationary, or moving downward. Its essence is to actively change the stroke of the primary active component 1 on the air suction platform.

[0036] The pressure sensing component 6 is installed between the air suction platform 3 and the secondary frame 5. It is essentially a high-precision pressure sensor. After the adsorbed conductive foam is attached to the product, the high-precision pressure sensor indirectly feeds back the additional negative stroke, and based on this, indirectly controls the movement stroke of the primary active component 1 and the secondary active component 2.

[0037] Example 2: Based on Example 1, a supplementary explanation is provided regarding the pressure control method during the operation of the bonding equipment:

[0038] Reference Figure 4 The conductive foam is attached by multiple sets of dual-stage action components. The pressure sensing component 6 is connected to the first-level active component 1 and the second-level active component 2 to form a pressure closed-loop feedback module. The pressure closed-loop feedback module generates an action and detection signal module, an elastic stress cross-linking analysis module, and a global autonomous learning analysis module. The action and detection signal module obtains the action signals of the first-level active component 1 and the second-level active component 2, the pressure signal of the pressure sensing component 6, and the action source data of the conductive foam. The action signal, pressure signal and action source data are then sent to the elastic stress cross-linking analysis module.

[0039] In the elastic stress crosslinking analysis module, a pressure deformation fitting formula is established based on the motion source data, and the stroke deviation is obtained from the pressure deformation fitting formula.

[0040] In the global autonomous learning analysis module, the travel deviation of multiple multi-level motion components is obtained, and a multi-point common deviation model is established based on the multiple travel deviations. In the multi-point common deviation model, a position correction command is sent to the two-level motion component at a single point position and a correction coefficient is input. The motion signals of the first-level active component 1 and the second-level active component 2 are adjusted through the correction coefficient.

[0041] Solution Description: (e.g.) Figure 1As shown, a single attachment action completes the attachment of multiple conductive foams simultaneously. Theoretically, each attachment action is completely identical. However, in reality, due to differences in the material of the conductive foam, resulting in variations in deformation, there may be differences in the attachment contact force. To address this, the present invention specifically incorporates a pressure closed-loop feedback module, which is described in detail below:

[0042] S1: The motion source data includes the initial height between the air suction platform 3 and the product, and the thickness of the conductive foam. The motion signals represent the stroke of the primary active component 1 and the secondary active component 2, respectively. The stroke includes positive and negative values ​​depending on the movement direction of the primary active component 1 and the secondary active component 2. Therefore, the sum of the stroke of the primary active component 1 and the secondary active component 2 should equal the initial thickness. The pressure signal represents the deformation fitting amount of the air suction platform 3.

[0043] S2: The elastic stress crosslinking analysis module mainly performs stroke analysis on the conductive foam attachment action at a single point. For this purpose, a pressure deformation fitting formula is specially added. L1 and L2 represent the stroke of the primary active component 1 and the secondary active component 2, respectively, while the deformation fitting amount is represented by No. The initial height is represented by LH, and the thickness of the conductive foam is represented by L3. Theoretically, L1 + L2 = LH. However, in actual cases, if the conductive foam undergoes a small deformation under pressure, the entire dual-stage action component will form an additional deformation. It should also be noted that L1, L2, LH, and L3 are all length units, while the deformation fitting amount No is a pressure unit. Therefore, the pressure deformation fitting formula in this embodiment is mainly converted from the deformation fitting amount to the length unit and incorporated into L1 + L2 = LH.

[0044] It is understandable that due to the deformation process of the conductive foam, the total stroke should be LH + Lio, where Lio represents the deformation stroke of the conductive foam in the vertical direction. Therefore, the actual formula for stroke L1 + L2 = LH + Lio is: Xi = 1 - LH / (LH + Lio). Referring to Hooke's Law for elastic bodies, F = K * X is converted. This can be understood as: F represents the elastic reaction force, K represents the stiffness coefficient of the material, and X represents the elastic deformation caused by compression. This generates the simple formula No = k * Lio and substitutes it into L1 + L2 = LH + Lio. Here, K is limited by the material of the conductive foam and is represented as a relative constant value in this invention, while No is a relative variable value.

[0045] S3: Further explanation of the global autonomous learning analysis module based on the above: As shown above, a single attachment action will simultaneously complete the attachment process of multiple conductive foams, but the travel deviation in each attachment process is different. The key content of this embodiment is to link the attachment actions of the entire area together, the purpose of which is to synchronously correct one or more two-stage actions, specifically including the following:

[0046] S3-1: Mainly based on the attachment action at a single point position, first obtain the travel deviation degree Xi in the single point position, where i only represents the position number of the conductive foam, and further generate No by referring to the deformation fitting quantity No i , and establish a deformation deviation curve according to F = K * X. Since K is a relatively fixed value, essentially F = K * X is a proportional function. However, in actual situations, due to considerations such as mechanical wear, the deformation deviation curve is not a balanced curve but shows irregular fluctuations. In essence, the multi-point co-connection deviation model is a two-dimensional coordinate composed of deformation deviation curves in multiple double-stage action components, and each deformation deviation curve corresponds to its travel deviation degree;

[0047] S3-2: First obtain the upper peak value and the lower peak value of the deformation fitting quantity in a certain time period for a single deformation deviation curve, and use the difference between the upper peak value and the lower peak value as the fluctuation amplitude of this deformation deviation curve. Perform the above processing on the deformation deviation curves of all double-stage action components to obtain the fluctuation amplitude and the average value of the travel deviation degree corresponding to each double-stage action component;

[0048] S3-3: According to these fluctuation amplitudes and the average values of the travel deviation degrees, determine the position correction coefficient of each double-stage action component in the multi-point co-connection deviation model. This correction coefficient is associated with the fluctuation amplitude and the average value of the travel deviation degree. The greater the fluctuation amplitude or the more the average value of the travel deviation degree deviates from the preset value, the greater the correction coefficient; Finally, send a position correction command to the corresponding double-stage action component through the global autonomous learning analysis module, and input the determined position correction coefficient into the control system of the double-stage action component to adjust the action signals of the primary active component and the secondary active component, so that the entire attachment device can more accurately control the attachment pressure and position of the conductive foam in subsequent attachment actions, improving the attachment quality and consistency;

[0049] For example: The global autonomous learning analysis module receives the Xi data sent by the elastic stress cross-linking analysis module, and at the same time retrieves the Xi values of all double-stage action components in this attachment to calculate the average deviation degree Xo. The calculation method for the correction coefficient is: λ = 1 / (1 + X). After generating the correction coefficient λ, mainly adjust the travel amounts of the primary and secondary active components according to the correction coefficient λ. The actual determination method is: when Xi ≤ 0.05, it is determined that the attachment is qualified; when 0.05 < Xi ≤ 0.1, perform minor correction; when Xi > 0.1, pause the attachment and alarm. If Xi is too large (pressure is too high), then reduce the secondary travel L2 (such as referring to L2' = L2 * λ); if Xi is too small (pressure is too low), then slightly increase the secondary travel L2 to ensure that the final attachment pressure falls within the compliance range;

[0050] The overall pressure closed-loop feedback module also includes the following actions: extracting the most recent multiple sets of grid attachment data from multiple attachment actions, removing outliers, calculating the average value of the first-level stroke L1 and the average value of the second-level stroke L2 in 100 sets of data, and setting them as new initial action parameters (replacing the original parameters) to ensure that the initial stroke of subsequent attachments is closer to the actual requirements.

[0051] In summary, by linking pressure sensing components with two-stage active components, a pressure closed-loop feedback system is constructed, incorporating modules for motion and detection signals, elastic stress cross-linking analysis, and global autonomous learning analysis. The stroke deviation is calculated based on a pressure deformation fitting formula, and a correction coefficient is generated through a multi-point common deviation model to dynamically adjust the stroke of the two-stage components. This device and method can precisely control the bonding pressure, adapt to the flexible characteristics of conductive foam, avoid performance failures or air bubble problems caused by improper pressure, and improve bonding quality and consistency.

[0052] The above description is merely an example and illustration of the structure of the present invention. Those skilled in the art can make various modifications or additions to the specific embodiments described, or use similar methods to replace them, as long as they do not deviate from the structure of the invention or exceed the scope defined in the claims, all of which should fall within the protection scope of the present invention.

[0053] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0054] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A pressure control method for a conductive foam adaptive bonding device, comprising a conductive foam adaptive bonding device, characterized in that, The conductive foam adaptive attachment device consists of multiple sets of dual-stage action components. The dual-stage action components are arranged sequentially along the linear direction according to the attachment position of the conductive foam. The dual-stage action components include a primary active component (1), a secondary active component (2), a primary frame (4), and a secondary frame (5). The primary active component (1) drives the primary frame (4) to slide along the linear direction. The secondary active component (2) is installed in the primary frame (4) and drives the secondary frame (5) to slide along the linear direction. An air suction platform (3) is slidably installed in the secondary frame (5) along a linear direction, and a pressure sensing component (6) is provided between the air suction platform (3) and the secondary frame (5). The pressure sensing component (6) obtains the application stroke of the air suction platform (3) along the linear direction of the conductive foam, and adjusts the stroke of the first-level active component (1) and the second-level active component (2) according to the stroke. The conductive foam is attached by multiple sets of dual-level action components, and the pressure is connected to the first-level active component (1) and the second-level active component (2) through the pressure sensing component (6) to build a pressure closed-loop feedback module. The pressure closed-loop feedback module generates action and detection signal module, elastic stress crosslinking analysis module and global autonomous learning analysis module. The motion signals of the primary active component (1) and the secondary active component (2), the pressure signal of the pressure sensing component (6), and the motion source data of the conductive foam are obtained in the motion and detection signal module, and the motion signals, pressure signals and motion source data are sent to the elastic stress crosslinking analysis module. In the elastic stress crosslinking analysis module, a pressure deformation fitting formula is established based on the motion source data, and the stroke deviation is obtained from the pressure deformation fitting formula. In the global autonomous learning analysis module, the travel deviation of multiple multi-level motion components is obtained, and a multi-point common deviation model is established based on the multiple travel deviations. In the multi-point common deviation model, a position correction command is sent to the dual-level motion component in the single-point position and the correction coefficient is input. The motion signals of the first-level active component (1) and the second-level active component (2) are adjusted by the correction coefficient.

2. The pressure control method for the conductive foam adaptive bonding device according to claim 1, characterized in that, L1 and L2 represent the stroke of the primary active component (1) and the secondary active component (2) respectively, No represents the deformation fitting amount, LH represents the initial height, and Lio represents the deformation stroke of the conductive foam. The formula for calculating the stroke deviation is Xi=1-LH / (LH+Lio).

3. The pressure control method for the conductive foam adaptive bonding device according to claim 2, characterized in that, The actual travel calculation method in the attachment action is generated using No and Lio, denoted as No=k*Lio, where K represents a relative constant value and No represents a relative variable value.

4. The pressure control method for the conductive foam adaptive bonding device according to claim 3, characterized in that, Let i represent the position number of the conductive foam, and generate a deformation deviation curve according to No=k*Lio and substitute it into the multi-point common deviation model. In a single deformation deviation curve, obtain the upper peak value and lower peak value of the deformation fitting amount in a single time. The difference between the upper peak value and the lower peak value is used as the fluctuation amplitude of the deformation deviation curve. Furthermore, obtain the average value of the fluctuation amplitude and stroke deviation for each two-stage action component, and further generate the calculation method of the correction coefficient λ: λ=1 / (1+X).

5. The pressure control method for the conductive foam adaptive bonding device according to claim 4, characterized in that, When Xi ≤ 0.05, it is judged that the attachment is qualified; When 0.05 < Xi ≤ 0.1, minor correction is carried out; When Xi > 0.1, the attachment is paused, an alarm is given, and emergency adjustment is carried out; The primary active component (1) and the secondary active component (2) can be increased or raised according to λ, which is expressed as one of the calculation methods of L1*(1 + λ), L1*(1 - λ), L2*(1 + λ), L2*(1 - λ).

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