SIP-based airborne anti-collision equipment miniaturization system

Abstract

The invention relates to the technical field of system integration, in particular to an SIP-based airborne anti-collision equipment miniaturization system, which comprises a power supply processing module and a receiving and transmitting module, and is characterized in that the power supply processing module and the receiving and transmitting module are in blind plugging butt joint through a high-low mixed connector and are used for discrete control, power supply and intermediate frequency signal crosslinking; the receiving and transmitting module is integrated with a receiving channel and a transmitting channel, and the receiving channel and the transmitting channel are cross-linked through a circulator, so that a link of radio frequency signal input and radio frequency signal output is shortest; the power supply processing module is integrated with a digital processing link and a power supply assembly. The SIP design is carried out on each module functional circuit, so that the weight and the size of the equipment can be effectively reduced on the basis of not reducing the functional performance of the equipment. For an equipment manufacturer, the method increases the flexibility of the equipment installation position and the installation platform, and for an aircraft platform, the fuel efficiency and the flight performance of an aircraft are improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of system integration, and particularly relates to a miniaturized system of airborne anti-collision equipment based on SIP. BACKGROUND

[0002] With the rapid development of modern aviation industry, the number of air routes and small aircrafts in airspace, such as unmanned aerial vehicles and light aircrafts, is increasing, but the traditional large airborne anti-collision equipment is large in size, heavy in weight and high in power consumption, and cannot be equipped on small aircrafts, which urgently needs miniaturized airborne anti-collision equipment.

[0003] The traditional airborne anti-collision equipment has a complex internal structure, contains multiple functional modules and a large number of discrete components, occupies a large space inside the aircraft, is not conducive to the compact layout and space utilization of the aircraft, limits the selection of the installation position of the anti-collision equipment on the aircraft, and may need to design special mounting brackets and structures, thereby increasing the difficulty and complexity of installation, and even the airborne anti-collision equipment cannot be installed on some small aircrafts. Meanwhile, the large number of components and large size result in a large weight of the equipment, increase the load of the aircraft, and affect the fuel efficiency and flight performance of the aircraft. SUMMARY

[0004] The present application aims to provide a miniaturized system of airborne anti-collision equipment based on SIP, which solves the problems in the prior art.

[0005] The present application is implemented by the following technical scheme:

[0006] A miniaturized system of airborne anti-collision equipment based on SIP, comprising a power supply processing module and a receiving and transmitting module, wherein:

[0007] The power supply processing module and the receiving and transmitting module are connected by a high-low mixed connector for blind insertion and docking, for discrete control, power supply and intermediate frequency signal crosslinking;

[0008] The receiving and transmitting module is integrated with a receiving channel and a transmitting channel, and the receiving channel and the transmitting channel are crosslinked by a circulator, so that the link of the radio frequency signal input and the radio frequency signal output is the shortest;

[0009] The power supply processing module is integrated with a digital processing link and a power supply component.

[0010] Preferably, the receiving and transmitting module has an upper and lower layered structure, the receiving channel is arranged in the upper layer, and the transmitting channel is arranged in the lower layer.

[0011] Preferably, the receiving channel comprises a plurality of SIP radio frequency front-end components, an SIP local oscillator source component and a plurality of SIP intermediate frequency components packaged by SIP technology.

[0012] Preferably, each SIP radio frequency front-end component comprises a limiting amplifier circuit, a radio frequency filter circuit and a low noise amplifier function circuit.

[0013] Preferably, each SIP intermediate frequency component comprises an intermediate frequency amplifier function circuit and an intermediate frequency filter circuit.

[0014] Preferably, the transmitting channel comprises a SIP transmitting up-conversion component, a SIP power amplifier component and a SIP switch switching component.

[0015] The SIP transmitting up-conversion component is configured to mix the transmitting intermediate frequency signal from the digital processing link to output a transmitting radio frequency signal.

[0016] The SIP power amplifier component is configured to amplify the transmitting radio frequency signal.

[0017] The SIP switch switching component is configured to complete selection of different antenna wave positions to realize multi-channel transmission.

[0018] Preferably, the digital processing link comprises an FPGA chip, a SIP data processing center, a SIP DA module and a SIP coding and decoding module.

[0019] The FPGA chip comprises an AD module configured to realize analog-digital conversion of an analog signal.

[0020] The SIP data processing center is configured to receive and process an output message of the FPGA chip to realize TCAS, ATC and ADS-B IN / OUT functions.

[0021] The SIP DA module is configured to receive a baseband signal of the SIP coding and decoding module and modulate the baseband signal into a transmitting intermediate frequency signal.

[0022] Preferably, the SIP data processing center further comprises:

[0023] A channel self-checking unit configured to inject a self-checking signal to the SIP DA module, the self-checking signal forms a closed loop through a transmitting link and a receiving link to verify completeness of a transmitting and receiving channel function.

[0024] A component monitoring unit configured to monitor key parameters of the power supply component, the SIP power amplifier component and each SIP function component, the key parameters at least include working voltage, working current and temperature.

[0025] A health status reporting unit configured to output self-checking and monitoring results through a USCAR BUS bus to an external avionics system.

[0026] Preferably, the power supply assembly comprises a power supply assembly, a first power conversion circuit and a second power conversion circuit, and is used for integrating power supply output and load end power consumption, stabilizing, filtering and converting the power supply, realizing simplified power supply architecture and reducing power supply ripple.

[0027] Preferably, the system further comprises:

[0028] A multi-channel filter ring assembly is used for packaging discrete component devices in front of the SIP radio frequency front-end assembly, and selects out-of-band signals through a high-power band-pass filter.

[0029] Compared with the prior art, the present application has the following advantages and beneficial effects:

[0030] By SIP design of the function circuit of each module, the weight and volume of the equipment can be effectively reduced without reducing the function performance of the equipment. For equipment manufacturers, this method increases the flexibility of the equipment installation position and installation platform, and for aircraft platforms, it increases the fuel efficiency and flight performance of the aircraft. BRIEF DESCRIPTION OF DRAWINGS

[0031] In order to more clearly illustrate the technical solutions of the exemplary embodiments of the present application, the drawings needed in the embodiments will be briefly introduced as follows, and it should be understood that the following drawings only show some embodiments of the present application, and therefore should not be regarded as a limitation on the scope, and for those skilled in the art, other related drawings can also be obtained without creative labor. In the drawings:

[0032] Figure 1 The structure diagram of the SIP-based airborne anti-collision device miniaturization system provided by the present application. DETAILED DESCRIPTION

[0033] In order to make the purpose, technical solutions and advantages of the present application clearer, the present application will be further described in detail below in combination with embodiments and drawings, and the exemplary embodiments of the present application and their descriptions are only used to explain the present application, and should not be regarded as a limitation on the present application.

[0034] It is to be noted that the relational terms herein, such as first and second, and the like, are used solely to distinguish one from another entity or action without necessarily requiring or implying any actual relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus. An element proceeded by "comprises... a" does not, without more constraints, exclude the existence of additional identical elements in the process, method, article, or apparatus that comprises the element.

[0035] It is to be noted that all the actions of acquiring signals, information or data in the present application are carried out in compliance with the corresponding data protection regulations policy of the place and with the authorization given by the owner of the corresponding device.

[0036] Embodiment 1

[0037] See Figure 1 The embodiment of the present application provides a miniaturized system of an airborne anti-collision device based on SIP, which comprises a power processing module and a receiving and transmitting module, wherein:

[0038] The power processing module and the receiving and transmitting module are connected through a high-low mixed connector blind insertion, and are used for discrete control, power supply and medium frequency signal crosslinking.

[0039] The receiving and transmitting module is integrated with a receiving channel and a transmitting channel, and the receiving channel and the transmitting channel are crosslinked through a circulator, so that the link of radio frequency signal input and radio frequency signal output is the shortest.

[0040] The power processing module is integrated with a digital processing link and a power supply component.

[0041] Specifically, in view of the problem of large volume, high weight and difficulty in adapting to small aircraft caused by the use of discrete components and modular layout in traditional airborne collision avoidance equipment, the embodiment proposes to reconstruct the equipment into two core units of power supply processing module and receiving and transmitting module based on the design principles of system integration and link optimization. In order to realize efficient interconnection between modules and reduce the space occupation and signal loss caused by cable connection, a high-low mixed connector is used to realize blind insertion and docking, so as to complete the stable transmission of control instructions, power and intermediate frequency signals. Inside the receiving and transmitting module, the receiving channel and the transmitting channel are further cross-linked through a circulator, so that the radio frequency signals received from the antenna directly enter the receiving link through the circulator, and the transmitting signals are guided to the antenna through the circulator, effectively shortening the radio frequency path length, reducing the insertion loss and impedance mismatch risk, and improving the signal integrity. The power supply processing module integrates the signal processing and power management functions by integrating the digital processing link and the power supply component, in which the digital processing link is responsible for the modulation and demodulation and protocol processing of the intermediate frequency signal, and the power supply component reduces the power supply types and ripple interference through unified power output and internal conversion circuit. Through the above module division and SIP integration method, each functional circuit is packaged as a subsystem with high cohesion and low coupling, which effectively reduces the volume and weight of the equipment under the premise of maintaining the full functions of TCAS, XPDR and ADS-B IN / OUT, and enhances the adaptability and overall performance consistency of the equipment in small size aviation platform.

[0042] In some embodiments, the receiving and transmitting module is an upper and lower layered structure, the receiving channel is disposed in the upper layer, and the transmitting channel is disposed in the lower layer.

[0043] Specifically, this layout is designed based on electromagnetic compatibility and thermal management requirements. By placing the high-sensitivity receiving channel above the transmitting channel, the harmonic radiation and conducted interference generated in the power amplification process of the transmitting link can be effectively isolated, avoiding the sensitivity decline of the receiver front end due to near-field coupling. At the same time, the heat generated by the transmitting channel can be conducted downward through the lower metal substrate or heat dissipation structure, avoiding the influence of the upward heat flow on the working point of temperature-sensitive devices such as low-noise amplifiers in the receiving channel, thereby improving the system temperature stability and channel isolation. This vertical partition architecture not only realizes compact arrangement of internal functions, but also takes into account signal integrity and thermal distribution optimization, providing a structural basis for long-term reliable operation of the equipment in a small airborne space.

[0044] In some embodiments, the receiving channel includes a plurality of SIP radio frequency front-end components, an SIP local oscillator source component and a plurality of SIP intermediate frequency components packaged through SIP technology.

[0045] Specifically, by integrating the functions of traditional discrete amplitude limiting amplification, radio frequency filtering and low noise amplification into the SIP radio frequency front-end component, the space occupation of the radio frequency front-end circuit is effectively compressed, and the parasitic parameters and path loss of high frequency signals during transmission between discrete components are reduced; the SIP local oscillator source component integrates the oscillation circuit, phase-locked loop and buffer amplifier in a single package, providing higher frequency stability and phase noise performance for the local oscillator signal, while avoiding the clock jitter introduced by multi-chip interconnection; a plurality of SIP intermediate frequency components are respectively responsible for gain control, filtering and secondary amplification of the down-converted intermediate frequency signal, and the integrated structure makes the impedance matching between intermediate frequency stages more accurate, reducing signal reflection and crosstalk caused by traditional PCB wiring. Through the cooperative packaging of the above SIP link, the receiving channel realizes significant reduction in system size and overall improvement in channel consistency on the basis of maintaining the independent performance of each functional module, providing a feasible technical path for the miniaturization and high-density integration of multi-channel receiving systems.

[0046] In some embodiments, each SIP radio frequency front-end component includes an amplitude limiting amplifier circuit, a radio frequency filter circuit, and a low noise amplifier function circuit.

[0047] Specifically, by integrating the above three types of functional circuits in a single cavity or laminated structure in the form of system-in-package, a highly cooperative front-end processing unit is constructed. Among them, the amplitude limiting amplifier circuit first controls the dynamic range of the radio frequency signal received by the antenna, preventing the subsequent circuit from being overloaded or damaged due to excessive power signals; the amplitude-limited signal enters the radio frequency filter circuit, which uses a miniaturized bandpass or bandstop structure integrated in the SIP to effectively suppress out-of-band interference and spurs; then the signal is preliminarily amplified by the low noise amplifier circuit, which is directly interconnected with the filter circuit in the package, avoiding the additional loss and impedance mismatch introduced by the transmission line in the traditional discrete layout, thereby improving the receiving sensitivity while maintaining the system noise figure at a low level. Such an integrated front-end structure not only significantly reduces the physical size of the radio frequency channel, but also reduces the overall insertion loss through the internal optimized signal link, enhancing the amplitude and phase consistency between multiple channels, providing a more pure and stable signal basis for subsequent down-conversion and intermediate frequency processing.

[0048] In some embodiments, the SIP local oscillator source component includes a plurality of discrete local oscillator sources.

[0049] Specifically, by integrating multiple independent local oscillator circuits with different frequency output capabilities in the same system-in-package, a local oscillator signal source array covering multiple frequency band requirements is constructed. The component adopts a shared reference clock and unified power supply architecture, so that the discrete local oscillator sources maintain a synchronous reference within the package, avoiding phase deviation caused by differences in clock distribution paths in traditional multi-chip separate layouts; each discrete local oscillator source corresponds to a specific radio frequency channel or operating mode, and through the integrated switching network, the on-demand routing and rapid switching of the local oscillator signal are realized, meeting the frequency agility requirements of the airborne collision avoidance system in multiple channels and multiple modes; the electromagnetic shielding compartment structure inside the package effectively suppresses mutual crosstalk between the local oscillator sources, ensuring the spectral purity of the output signal. This integrated local oscillator architecture significantly reduces the board area and interconnection complexity of the multi-channel local oscillator system while maintaining frequency flexibility and signal quality, providing a reliable frequency synthesis foundation for high-density integration of transceiver modules.

[0050] In some embodiments, each SIP intermediate frequency component includes an intermediate frequency amplification functional circuit and an intermediate frequency filtering circuit.

[0051] Specifically, by integrating the above two types of functional circuits in the same system-in-package, an intermediate frequency processing unit with gain control and frequency selection capability is formed. The intermediate frequency amplification functional circuit is responsible for stable gain amplification of the down-converted signal to improve the signal amplitude to the dynamic range suitable for subsequent sampling processing; the intermediate frequency filtering circuit uses an integrated LC network or a surface acoustic wave filter structure inside the package to shape the frequency band of the amplified intermediate frequency signal, effectively suppressing adjacent channel interference and mixing products. Since the amplification and filtering circuits are directly interconnected inside the package through miniaturized transmission lines, the influence of the distributed parameters introduced by the PCB traces in the traditional discrete layout is avoided, so that the out-of-band rejection characteristic of the filter and the gain flatness of the amplification circuit are improved. This integrated intermediate frequency structure reduces the impedance mismatch and signal reflection between multiple stages of circuits while ensuring channel selectivity and sensitivity, providing a lower interference and higher quality baseband signal source for the subsequent digital demodulation module.

[0052] In some embodiments, the transmit channel includes a SIP transmit up-conversion component, a SIP power amplifier component, and a SIP switch component.

[0053] The SIP transmit up-conversion component is configured to mix the transmit intermediate frequency signal from the digital processing link to output a transmit radio frequency signal.

[0054] The SIP power amplifier component is configured to amplify the transmit radio frequency signal.

[0055] The SIP switch component is configured to select different antenna wave positions to realize multi-channel transmission.

[0056] Specifically, by encapsulating the up-conversion, power amplification and antenna switching functions of the transmitting link into dedicated SIP modules respectively, a multi-channel transmitting system with high integration is constructed. Among them, the SIP transmitting up-conversion component receives the transmitting intermediate frequency signal from the digital processing link, uses the internal integrated mixer and local oscillator interface to up-convert the intermediate frequency signal to the target radio frequency, and optimizes the isolation of the local oscillator and the radio frequency port through the encapsulated internal matching network to reduce the spurious components in the conversion process. The transmitting radio frequency signal after up-conversion is sent to the SIP power amplifier component for power boosting. The component realizes the required output power and efficiency in a compact space through the internal integration of the power amplifier chip and the bias control circuit, and its packaging structure takes into account the heat dissipation path and electromagnetic shielding requirements. The amplified radio frequency signal is finally transmitted to the SIP switch component, which realizes fast switching between different antenna wave positions through an integrated single-pole multi-throw switch network to form spatial diversity or beam pointing capability. This kind of modular transmitting architecture maintains the performance independence of each functional unit, and through SIP integration significantly shortens the transmission path of high-frequency high-power signals, reduces the path loss, and improves the consistency of amplitude and phase between channels, providing a hardware foundation for the airborne collision avoidance system to realize reliable multi-target response and signal coverage.

[0057] In some embodiments, the digital processing link includes an FPGA chip, a SIP data processing center, a SIP DA module, and a SIP codec module.

[0058] The FPGA chip includes an AD module for realizing analog-digital conversion of analog signals.

[0059] The SIP data processing center is used to receive and process the output messages of the FPGA chip to realize TCAS, ATC and ADS-B IN / OUT functions.

[0060] The SIP DA module is used to receive the baseband signal of the SIP codec module and modulate it into a transmitting intermediate frequency signal.

[0061] Specifically, the modular integration of signal processing and protocol control functions in the airborne collision avoidance system is realized by constructing a digital processing link. The AD module built-in the FPGA chip is responsible for converting the intermediate frequency analog signal output by the receiving link into a digital signal, and the programmable logic resource facilitates the implementation of high-speed sampling and preprocessing algorithms. The SIP data processing center, as the system control core, receives and analyzes the digital messages output by the FPGA, and through the running of the protocol stack conforming to the DO-185B, DO-181F and DO-260C standards, completes the logical decision and data packaging of traffic warning and collision avoidance, air traffic control beacon response and broadcast automatic correlation monitoring functions. The SIP coding and decoding module encodes the data to be transmitted and generates the frame structure, and then the SIP DA module reconstructs the digital baseband signal into an analog intermediate frequency signal through interpolation filtering and digital up-conversion technology, and delivers it to the transmitting channel. Through the design of the digital link of division of labor and cooperation, while maintaining the processing flexibility and protocol compatibility, the control, operation and data conversion units are closely integrated through SIP technology, reducing the delay and power consumption of data exchange between modules, and providing an expandable hardware platform for the miniaturized comprehensive implementation of multi-mode avionics functions.

[0062] In some embodiments, the SIP data processing center further comprises:

[0063] A channel self-checking unit for injecting a self-checking signal to the SIP DA module, the self-checking signal forms a closed loop through the transmitting and receiving links to verify the integrity of the transceiver channel function;

[0064] A component monitoring unit for monitoring the key parameters of the power supply component, SIP power amplifier component and each SIP functional component, the key parameters at least including working voltage, working current and temperature;

[0065] A health status reporting unit for outputting the self-checking and monitoring results through the USCAR BUS bus to the external avionics system.

[0066] Specifically, by introducing a channel self-test unit, a self-test signal with known characteristics is injected into the SIP DA module. This signal passes sequentially through the transmit upconverter component, power amplifier component, circulator, and receive RF front-end component, and is finally demodulated by the receive link and sent back to the data processing center for feature comparison. This enables closed-loop verification of key indicators such as transmit and receive channel gain, linearity, and frequency response during system operation, effectively identifying performance degradation caused by device aging or environmental stress. The component monitoring unit, through a sensor network integrated into the power supply component, SIP power amplifier component, and each SIP functional component, collects their operating voltage, operating current, and junction temperature parameters in real time, and provides abnormal state warnings based on preset thresholds, offering multiple protection mechanisms for the system, including overcurrent, overvoltage, and overheating. The health status reporting unit integrates the self-test verification results and component monitoring data into a standardized status message, which is periodically sent to the external avionics main controller via the USCAR BUS bus. This built-in self-test and status monitoring architecture significantly improves the equipment's mission reliability, maintainability, and overall lifecycle management level without the need for external testing equipment.

[0067] In some embodiments, the power supply component includes a power supply component, a first power conversion circuit, and a second power conversion circuit. The power supply component is used to integrate power supply output and load power consumption, and to regulate, filter, and convert the power supply to achieve a simplified power supply architecture and reduce power supply ripple.

[0068] Specifically, a hierarchical power supply architecture is constructed to achieve integrated management and precise allocation of airborne power. The power supply component receives external aviation power input and performs primary filtering and surge suppression. The first power conversion circuit converts the voltage to multiple isolated or non-isolated regulated outputs based on the voltage and ripple requirements of the digital processing link. The second power conversion circuit converts the voltage to multiple isolated or non-isolated regulated outputs based on the voltage and ripple requirements of load units such as the RF front-end, optimizing power supply noise and dynamic response characteristics in a combination of linear and switching regulation applications. Through this hierarchical conversion and load matching design, the power supply component reduces the types of power supplies and the number of conversion stages while achieving unified management of the power demand of the load side. This simplifies the size and complexity of the power supply architecture and, through multi-stage filtering and voltage regulation mechanisms, suppresses output ripple within the tolerance range allowed by sensitive circuits, providing a stable and clean energy supply for the entire system.

[0069] In some embodiments, the system further includes:

[0070] A multi-channel filtering ring assembly is used to encapsulate discrete components at the front end of a SIP RF front-end assembly and select out-of-band signals using a high-power bandpass filter.

[0071] Specifically, the multi-channel filtering ring assembly includes a circulator, a high-power band-pass filter, an impedance matching network, an internal interconnection and packaging structure, etc. Through the adoption of the multi-channel filtering ring structure, the ring distribution and filtering processing of the radio frequency signal are realized in a single package. The high-power band-pass filter is designed based on a miniaturized cavity or a multi-layer ceramic structure, and can suppress the out-of-band interference signal in the receiving channel while effectively filtering the harmonic and stray components of the transmitting channel, under the premise of maintaining low insertion loss. The packaging integration mode of the assembly not only compresses the axial size of the distributed filtering circuit and the circulator in the traditional separate layout, but also reduces the coupling interference between channels through the internal electromagnetic shielding design of the module, so that the system maintains stable receiving and transmitting isolation and out-of-band suppression ratio in a complex electromagnetic environment.

[0072] The above specific embodiments further illustrate the purpose, technical solutions and beneficial effects of the present application. It should be understood that the above description is only a specific embodiment of the present application and is not intended to limit the protection scope of the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principles of the present application shall be included in the protection scope of the present application.

Claims

1. A miniaturized airborne collision avoidance system based on SIP, characterized in that, It includes a power processing module and a receiver / transmitter module, wherein: The power processing module and the receiving and transmitting module are blindly connected via a high-low mixed connector for discrete control, power supply and intermediate frequency signal cross-linking. The receiving and transmitting module integrates a receiving channel and a transmitting channel, which are interconnected through a circulator to minimize the link between the radio frequency signal input and the radio frequency signal output. The power processing module integrates a digital processing link and power supply components.

2. The system according to claim 1, characterized in that, The receiving and transmitting module has a hierarchical structure, with the receiving channel deployed on the upper layer and the transmitting channel deployed on the lower layer.

3. The system according to claim 1, characterized in that, The receiving channel includes multiple SIP RF front-end components, SIP local oscillator components, and multiple SIP intermediate frequency components encapsulated using SIP technology.

4. The system according to claim 3, characterized in that, Each SIP RF front-end component includes a limiting amplifier circuit, an RF filter circuit, and a low-noise amplifier circuit.

5. The system according to claim 3, characterized in that, Each SIP intermediate frequency component includes an intermediate frequency amplification circuit and an intermediate frequency filtering circuit.

6. The system according to claim 1 or 2, characterized in that, The transmission channel includes a SIP upconversion component, a SIP power amplifier component, and a SIP switch switching component; The SIP transmit upconversion component is used to mix the transmit intermediate frequency signal sent from the digital processing link and output the transmit radio frequency signal. The SIP power amplifier component is used to amplify the transmitted radio frequency signal; The SIP switch switching component is used to select different antenna waveforms to achieve multi-channel transmission.

7. The system according to claim 1, characterized in that, The digital processing link includes an FPGA chip, a SIP data processing center, a SIP DA module, and a SIP encoding / decoding module; The FPGA chip includes an AD module for implementing digital-to-analog conversion of analog signals; The SIP data processing center is used to receive and process the output messages of the FPGA chip, and to implement TCAS, ATC and ADS-BIN / OUT functions. The SIP DA module is used to receive the baseband signal from the SIP encoding / decoding module and modulate it into a transmit intermediate frequency signal.

8. The system according to claim 7, characterized in that, The SIP data processing center also includes: The channel self-test unit is used to inject a self-test signal into the SIP DA module. The self-test signal forms a closed loop through the transmit link and the receive link to verify the integrity of the transceiver channel function. The component monitoring unit is used to monitor the key parameters of the power supply component, the SIP power amplifier component and each SIP functional component. The key parameters include at least the operating voltage, operating current and temperature. The health status reporting unit is used to output self-test and monitoring results via the USCAR BUS bus and report them to the external avionics system.

9. The system according to claim 1, characterized in that, The power supply component includes a power supply assembly, a first power conversion circuit, and a second power conversion circuit. The power supply assembly is used to integrate power supply output and load power consumption, and to regulate, filter, and convert the power supply to achieve a simplified power supply architecture and reduce power ripple.

10. The system according to claim 1, characterized in that, The system also includes: A multi-channel filtering ring assembly is used to encapsulate discrete components at the front end of a SIP RF front-end assembly and select out-of-band signals using a high-power bandpass filter.

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