New energy vehicle combined circuit board and method thereof
By adopting a sliding connection structure for the base plate and heat sink in new energy vehicles, combined with a temperature-sensing buffer and quick-release mechanism, the problems of loose connection between the base plate and heat sink and cracked solder joints are solved, achieving effective absorption of vibration energy and efficient heat dissipation, thus improving the stability and ease of maintenance of the equipment.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- DONGGUAN HETONG ELECTRONICS CO LTD
- Filing Date
- 2025-12-05
- Publication Date
- 2026-07-07
AI Technical Summary
In new energy vehicles, the traditional bolt fastening method for the base plate and heat sink is difficult to effectively buffer vibration energy, leading to problems such as loose connections and fatigue cracking of solder joints.
The upper and lower substrates are connected by a sliding connection. Combined with a heat dissipation mechanism, a buffer mechanism and a quick-release mechanism, the buffer gap is automatically triggered by temperature changes to absorb vibration and shock, and efficient heat dissipation is achieved through graphene heat sinks and heat dissipation strips.
It effectively absorbs vibration and shock, avoids hard contact damage, improves equipment stability and service life, and achieves efficient heat dissipation and convenient maintenance.
Smart Images
Figure CN121586155B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of circuit board technology, and in particular to a combined circuit board for new energy vehicles and its method. Background Technology
[0002] New energy vehicles refer to vehicles that use unconventional vehicle fuels (such as electricity and hydrogen energy) as their power source. Against this backdrop, the complexity of vehicle electronic and electrical systems has increased significantly. As a highly integrated and flexibly configurable circuit board design, modular circuit boards are widely used in various electronic control units of new energy vehicles.
[0003] During operation, automobiles face complex mechanical dynamic conditions. If the traditional bolt fastening method is used between the substrate and the heat sink, the rigid connection structure is difficult to effectively buffer vibration energy, which can easily lead to stress concentration at the fastening point. Under long-term action, this may not only cause the connection to loosen, but may also cause fatigue cracking of the circuit board solder joints. Therefore, this application proposes a combined circuit board for new energy vehicles and its method. Summary of the Invention
[0004] The purpose of this invention is to address the problem of loosening and cracking at the connection between the substrate and the heat sink in the prior art, and to propose a combined circuit board for new energy vehicles and its method.
[0005] In a first aspect, the present invention provides a modular circuit board for new energy vehicles, comprising an upper substrate and a lower substrate, wherein a power heat dissipation plate is slidably connected between the upper substrate and the lower substrate, and a support plate is fixedly connected to the inner wall of the power heat dissipation plate, and further comprising:
[0006] The heat dissipation mechanism is connected to the support plate and is used to absorb the temperature around the support plate and transfer the temperature to achieve the purpose of cooling the upper and lower substrates.
[0007] At least four sets of device slots are provided at the top and bottom of the power heat sink. The four sets of device slots are symmetrically distributed. Each of the four sets of device slots is equipped with a buffer mechanism to reduce the hard impact force generated by the vibration of the vehicle during operation on the upper and lower substrates.
[0008] The quick-release mechanism, connected to the buffer mechanism, is used for quickly assembling and disassembling the connection between the buffer mechanism and the upper and lower substrates.
[0009] Optionally, the heat dissipation mechanism includes four sets of graphene heat dissipation blocks, three sets of graphene heat dissipation strips, and mounting holes. The four sets of graphene heat dissipation blocks are all installed at the top and bottom of the support plate, and the three sets of graphene heat dissipation strips are all installed inside the graphene heat dissipation blocks. The mounting holes are opened on the outside of the power heat dissipation plate, and the end of the graphene heat dissipation strip away from the graphene heat dissipation block is installed inside the mounting hole.
[0010] Optionally, the buffer mechanism includes two pairs of sliders, a sliding groove, a sliding rod, shape memory alloy sheets, a fixing plate, a fixing groove, and a fixing rod. The two pairs of sliders are symmetrically fixed to the inner wall of the power heat sink. The sliding groove is opened inside the slider. The sliding rod is slidably connected to the inside of the sliding groove. The shape memory alloy sheets are fixed to the outside of the sliding rod. The fixing plate is fixed between the two sets of shape memory alloy sheets. The fixing groove is opened inside the fixing plate. The fixing rod is fixed to the inner wall of the fixing groove.
[0011] Optionally, the quick-release mechanism includes a connecting hole, a connecting rod, two pairs of connecting slots, a guide block, and a miniature spring. The connecting hole is opened inside the fixed rod, and the connecting rod is slidably connected inside the connecting hole. The two pairs of connecting slots are respectively opened at opposite ends of the upper and lower substrates. The guide block is slidably connected to the inner wall of the connecting slot, and the miniature spring is fixed between the inner wall of the connecting slot and the guide block.
[0012] Optionally, threaded holes are provided on both sides of the upper substrate and the lower substrate. The threaded holes are on the same horizontal plane as the connecting rod, and the diameter of the threaded holes is smaller than the diameter of the connecting holes.
[0013] Optionally, the power heat sink has multiple sets of air vents on both sides, and multiple sets of baffles at the top and bottom of the power heat sink. The air vents and baffles are interconnected. Multiple sets of L-shaped baffles are fixed to the opposite ends of the upper and lower substrates. The multiple sets of L-shaped baffles correspond one-to-one with the multiple sets of baffles, and the L-shaped baffles slide inside the baffles.
[0014] Optionally, guide tubes are fixedly connected to the top and bottom of the power heat sink around the perimeter, and guide grooves corresponding to multiple sets of guide tubes are opened inside the upper and lower base plates, and the guide tubes slide inside the guide grooves.
[0015] Optionally, a flow groove is provided at the top of the guide tube, and a flow hole is provided on the outer side of the guide tube, with the flow groove and the flow hole communicating internally.
[0016] Optionally, the surface of the power heat sink is coated with a graphene composite ceramic coating.
[0017] Secondly, the present invention provides a method for assembling a circuit board, applied to a new energy vehicle assembled circuit board as described in the first aspect, the method comprising the following steps:
[0018] S1. The upper substrate and the lower substrate are respectively installed at the top and bottom of the power heat sink and slide along the inside of the power heat sink. When the heat dissipation mechanism is running, the internal temperature of the power heat sink is reduced. The buffer mechanism senses the temperature reduction and then runs. The operation of the buffer mechanism will drive the upper substrate and the lower substrate to move a distance in opposite directions.
[0019] S2. At this time, there is a certain gap between the upper substrate and the lower substrate and the power heat sink.
[0020] S3. When the vehicle's operation causes the upper and lower base plates to vibrate, the upper and lower base plates can move up and down along the inner side of the power heat sink under the action of the buffer mechanism.
[0021] Compared with the prior art, this application includes at least one of the following beneficial technical effects:
[0022] This invention, through the structural design of the buffer mechanism, enables the buffer mechanism to be automatically triggered by temperature changes, forming a buffer gap between the upper and lower substrates and the power heat sink, effectively absorbing vibration and impact during operation, avoiding damage from hard contact, and automatically resetting after the temperature returns to normal, without the need for external intervention, thus significantly improving the stability and service life of the equipment.
[0023] Furthermore, through the structural design of the L-shaped baffle and the vent, the L-shaped baffle is automatically driven to move when the upper or lower substrate moves, thereby opening and closing the vent. Under normal conditions, it effectively seals and prevents dust; when dissipating heat, it automatically opens to ensure that hot air is smoothly discharged, thus combining protection and efficient heat dissipation. Attached Figure Description
[0024] Figure 1 This is a schematic diagram of the overall structure of a modular circuit board for new energy vehicles.
[0025] Figure 2 An exploded view of a modular circuit board for new energy vehicles;
[0026] Figure 3 This is a vertical schematic diagram of an electric heat sink.
[0027] Figure 4 for Figure 3 A magnified structural diagram at point A;
[0028] Figure 5 This is a schematic diagram of the structure of a graphene heat sink and a graphene heat sink strip;
[0029] Figure 6 for Figure 5 A magnified structural diagram at point B;
[0030] Figure 7 This is an exploded view of the upper substrate.
[0031] Reference numerals: 1. Upper substrate; 2. Lower substrate; 3. Power heat sink; 4. Support plate; 5. Device slot; 6. Graphene heat sink block; 7. Graphene heat sink strip; 8. Mounting hole; 9. Slider; 10. Slide groove; 11. Slide rod; 12. Shape memory alloy sheet; 13. Fixing plate; 14. Fixing groove; 16. Fixing rod; 17. Connecting hole; 18. Connecting rod; 19. Connecting groove; 20. Guide block; 21. Miniature spring; 22. Threaded hole; 23. Vent hole; 24. Baffle groove; 26. L-shaped baffle; 27. Guide tube; 28. Guide groove; 29. Flow groove; 30. Flow hole. Detailed Implementation
[0032] To make the objectives, features, and advantages of this invention more apparent and understandable, the technical solutions of the embodiments of this invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the embodiments described below are only some embodiments of this invention, and not all embodiments. Based on the embodiments of this invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this invention.
[0033] In the description of this invention, it should be understood that the terms "upper," "lower," "top," "bottom," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention. It should be noted that when a component is considered to be "connected" to another component, it can be directly connected to the other component or there may be a component positioned centrally in the connection.
[0034] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0035] like Figure 1 and Figure 2As shown, the present invention proposes a new energy vehicle combined circuit board, including an upper substrate 1 and a lower substrate 2. A power heat sink 3 is slidably connected between the upper substrate 1 and the lower substrate 2. The upper substrate 1 and the lower substrate 2 can slide at the top and bottom of the power heat sink 3. A support plate 4 is fixedly connected to the inner wall of the power heat sink 3. A heat dissipation mechanism is connected to the support plate 4 to absorb the temperature around the support plate 4 and transfer the temperature, so that the upper substrate 1 and the lower substrate 2 can achieve the purpose of cooling. The support plate 4 provides installation space for the heat dissipation mechanism. When the upper substrate 1 and the lower substrate 2 are running, they will dissipate heat. At this time, the power heat sink 3 can cool the inside (the power heat sink 3 is a conventional technology in existing heat dissipation devices, which will not be elaborated on). The operation of the heat dissipation mechanism absorbs the heat inside the power heat sink 3, that is, the heat between the upper substrate 1 and the lower substrate 2, and transfers the heat to the outside of the power heat sink 3, thereby achieving the function of rapid cooling and heat dissipation.
[0036] As one implementation method, such as Figure 3 - Figure 6 As shown, the circuit board in this embodiment also includes at least four sets of device slots 5 formed at the top and bottom of the power heat sink 3. The four sets of device slots 5 are symmetrically distributed. The device slots 5 provide installation space for the internal components. Each of the four sets of device slots 5 is equipped with a buffer mechanism to reduce the hard impact force generated by the vibration of the vehicle during operation on the upper substrate 1 and the lower substrate 2. When the heat dissipation mechanism is running, the internal temperature of the power heat sink 3 decreases. At this time, the buffer mechanism senses the temperature decrease and then operates. When the buffer mechanism is running, it will drive the upper substrate 1 and the lower substrate 2 to move in opposite directions by a certain distance. The distance can be determined according to the actual situation. At this time, there is a certain gap between the upper substrate 1 and the lower substrate 2 and the power heat sink 3. When the vehicle runs and causes the upper substrate 1 and the lower substrate 2 to vibrate, the upper substrate 1 and the lower substrate 2 can move up and down along the inner side of the power heat sink 3 under the action of the buffer mechanism, avoiding damage caused by hard contact and improving the service life of the device. When the heat dissipation mechanism stops running, the internal temperature of the power heat sink 3 gradually returns to normal temperature, and the buffer mechanism will drive the upper substrate 1 and the lower substrate 2 to reset, so that the upper substrate 1 and the lower substrate 2 are tightly attached to the power heat sink 3 again.
[0037] Furthermore, such as Figure 5 and Figure 6 As shown, in this embodiment, the quick-release mechanism is connected to the buffer mechanism for quick disassembly and assembly of the buffer mechanism and the upper substrate 1 and the lower substrate 2. This ensures that the buffer mechanism can drive the upper substrate 1 and the lower substrate 2 to move synchronously during operation. It also ensures that the quick-release mechanism can quickly separate the power heat sink 3 from the upper substrate 1 and the lower substrate 2 during maintenance of the upper substrate 1 and the lower substrate 2, thus improving the convenience of device maintenance.
[0038] As one implementation method, such as Figure 2 and Figure 5 As shown, the heat dissipation mechanism includes four sets of graphene heat sinks 6, three sets of graphene heat sinks 7, and mounting holes 8. The heat dissipation mechanism is described in detail below:
[0039] Four sets of graphene heat sinks 6 are installed at the top and bottom of the support plate 4. The support plate 4 provides installation space for the graphene heat sinks 6. When the power heat sink 3 operates to cool the interior, the graphene heat sinks 6 absorb heat. Three sets of graphene heat dissipation strips 7 are installed inside the graphene heat sinks 6, and the absorbed heat is transferred to the interior and surface of the graphene heat dissipation strips 7. The mounting holes 8 are opened on the outside of the power heat sink 3. The end of the graphene heat dissipation strip 7 away from the graphene heat sink 6 is installed inside the mounting hole 8. The opening of the mounting hole 8 provides installation space for the graphene heat dissipation strip 7. Since the end of the graphene heat dissipation strip 7 away from the graphene heat sink 6 is exposed on the outside of the power heat sink 3, the graphene heat dissipation strip 7 can transfer the heat inside the power heat sink 3 to the outside. With the power heat sink 3 cooling the interior, the cooling speed is faster. It should be noted that the graphene heat sinks 6 and graphene heat dissipation strips 7 are existing technologies and are mature, so they will not be elaborated further.
[0040] Furthermore, such as Figure 3 - Figure 6 As shown, the buffer mechanism includes two pairs of sliders 9, a sliding groove 10, a sliding rod 11, a shape memory alloy sheet 12, a fixing plate 13, a fixing groove 14, and a fixing rod 16. The buffer mechanism is described in detail below:
[0041] Two pairs of sliders 9 are symmetrically fixed to the inner wall of the power heat sink 3. A groove 10 is formed inside the slider 9, and a sliding rod 11 is slidably connected inside the groove 10. The size of the sliding rod 11 matches the internal size of the groove 10, allowing it to slide along the opening of the groove 10. A shape memory alloy sheet 12 is fixed to the outside of the sliding rod 11. The shape memory alloy sheet 12 is of type TiNi-03, which is existing and mature technology, and will not be elaborated further. When the internal temperature of the power heat sink 3 decreases, the shape memory alloy sheet 12 senses the temperature... The shape memory alloy sheet 12 changes shape and deforms when the temperature is between 0 and 10°C. It should be noted that the working environment of the shape memory alloy sheet 12 in this embodiment is a conventional area of a car (cabin, body control, etc.). The deformation of the shape memory alloy sheet 12 will bend at a preset angle, which can be determined according to the actual situation. The bending of the shape memory alloy sheet 12 will drive the slide rod 11 to move along the inside of the slide groove 10. The fixing plate 13 is fixed between the two sets of shape memory alloy sheets 12. At this time, the slide rod 11 will move towards the fixing plate 13, and the two sets of shape memory alloy sheets... When 12 bends simultaneously, it will cause the fixing plate 13 to move vertically. The fixing groove 14 is opened inside the fixing plate 13, and the fixing rod 16 is fixed to the inner wall of the fixing groove 14. The movement of the fixing plate 13 will drive the fixing rod 16 to move through the fixing groove 14. The movement of the fixing rod 16 will eventually drive the upper substrate 1 and the lower substrate 2 to move through the quick release mechanism, so that there is a movable gap between the upper substrate 1 and the lower substrate 2 and the power heat sink 3, avoiding hard contact. When the temperature returns to the initial temperature, the shape memory alloy sheet 12 will naturally reset. The reset of the shape memory alloy sheet 12 will drive the fixing plate 13 to reset, and finally drive the upper substrate 1 and the lower substrate 2 to reset to the initial position. Through the structural design of the buffer mechanism, the buffer mechanism is automatically triggered by temperature change. In the static state, there is no gap between the upper substrate 1, the lower substrate 2 and the power heat sink 3, which can prevent dust and impurities in the static state from entering through the gap. When the temperature changes and the buffer mechanism is running, a buffer gap is formed between the upper substrate 1, the lower substrate 2 and the power heat sink 3, which effectively absorbs the vibration and impact during operation and avoids damage from hard contact.
[0042] Furthermore, such as Figure 5 and Figure 6 As shown, the quick-release mechanism includes a connecting hole 17, a connecting rod 18, two pairs of connecting slots 19, a guide block 20, and a miniature spring 21. The quick-release mechanism is described in detail below:
[0043] A connecting hole 17 is formed inside the fixing rod 16, and a connecting rod 18 is slidably connected inside the connecting hole 17. Initially, the connecting rod 18 is inside the connecting hole 17. When the fixing rod 16 moves vertically, it will drive the connecting rod 18 to move through the connecting hole 17. The movement of the connecting rod 18 will then drive the upper substrate 1 or the lower substrate 2 to move. Two pairs of connecting grooves 19 are respectively formed at opposite ends of the upper substrate 1 and the lower substrate 2. A guide block 20 is slidably connected to the inner wall of the connecting groove 19. When it is necessary to detach the upper substrate 1 and the lower substrate 2 from the fixing rod 16, simply move the guide block 20 away from the connecting rod 18. The guide block 20 will then drive the connecting rod 18 to move synchronously along the inside of the connecting groove 19. The movement of the connecting rod 18 will detach it from the connecting hole 17, allowing the upper substrate 1 or the lower substrate 2 to be separated from the fixing rod 16. To achieve quick disassembly, the miniature spring 21 is fixed between the inner wall of the connecting groove 19 and the guide block 20. During the movement of the guide block 20, the guide block 20 will also squeeze the miniature spring 21 (the size of the miniature spring 21 can be adjusted according to the actual situation), causing the miniature spring 21 to deform and generate elastic potential energy. When installing the upper substrate 1 or the lower substrate 2 with the fixing rod 16, simply align the connecting rod 18 with the connecting hole 17. At this time, release the guide block 20, and the miniature spring 21 will release its elastic potential energy after the force is exhausted. The miniature spring 21 will then push the guide block 20 to reset. The reset of the guide block 20 will then drive the connecting rod 18 to reset inside the connecting hole 17. At this time, when the fixing rod 16 moves, it can drive the connecting rod 18 to move through the connecting hole 17, so that the fixing rod 16 can control the movement of the upper substrate 1 or the lower substrate 2 again, realizing the function of quickly installing the upper substrate 1 or the lower substrate 2.
[0044] In addition, such as Figure 6 As shown, this embodiment also has another way of connecting the upper substrate 1 and the lower substrate 2 to the fixing rod 16. Both sides of the upper substrate 1 and the lower substrate 2 are provided with threaded holes 22. It is only necessary to rotate an external bolt that conforms to the size of the threaded hole 22 to the threaded hole 22 (the bolt is not marked in the figure, and any bolt that matches the threaded hole 22 can be used). The bolt will then move gradually along the inside of the threaded hole 22 toward the fixing rod 16. The threaded hole 22 and the connecting rod 18 are on the same horizontal plane. The bolt will eventually enter the inside of the connecting hole 17, thereby connecting the upper substrate 1 or the lower substrate 2 to the fixing rod 16. The diameter of the threaded hole 22 is smaller than the diameter of the connecting hole 17, which can ensure that the bolt will not get stuck in the connecting hole 17.
[0045] As one implementation method, such as Figure 7As shown, multiple sets of vent holes 23 are provided on both sides of the power heat sink 3, and multiple sets of baffle grooves 24 are provided at the top and bottom of the power heat sink 3. The vent holes 23 and the baffle grooves 24 are interconnected. Multiple sets of L-shaped baffles 26 are fixed to the opposite ends of the upper substrate 1 and the lower substrate 2. In the initial state, the L-shaped baffles 26 are closed to the vent holes 23 to prevent the entry of external dust. The multiple sets of L-shaped baffles 26 correspond one-to-one with the multiple sets of baffle grooves 24, and the L-shaped baffles 26 slide inside the baffle grooves 24. When the upper substrate 1 or the lower substrate 2 moves, the L-shaped baffles 26 will move synchronously. The movement of the L-shaped baffles 26 will gradually break away from the vent holes 23 along the baffle grooves 24. At this time, the hot air inside the power heat sink 3 can be discharged through the vent holes 23, thereby realizing the function of discharging hot air.
[0046] Furthermore, such as Figure 1 and Figure 7 As shown, guide tubes 27 are fixed around the top and bottom of the power heat sink 3. Guide grooves 28 corresponding to multiple sets of guide tubes 27 are opened inside the upper substrate 1 and the lower substrate 2. The opening of the guide tubes 27 can provide guidance for the installation of the upper substrate 1 and the lower substrate 2. The guide grooves 28 can be aligned with the guide tubes 27 in advance, and the guide tubes 27 can slide inside the guide grooves 28. Then, the guide grooves 28 can be slid outside the guide tubes 27 to complete the installation. In addition, the setting of guide tubes 27 and guide grooves 28 can also ensure that the upper substrate 1 or the lower substrate 2 is more stable when moving vertically and will not shake.
[0047] Furthermore, such as Figure 7 As shown, a flow groove 29 is provided at the top of the guide tube 27, and a flow hole 30 is provided on the outside of the guide tube 27. In the initial state, when the upper substrate 1 or the lower substrate 2 is attached to the power heat sink 3, the flow hole 30 is in a closed state, and the flow groove 29 and the flow hole 30 are connected. When the upper substrate 1 or the lower substrate 2 moves vertically, the upper substrate 1 or the lower substrate 2 stops blocking the flow hole 30, and the flow hole 30 will be exposed. At this time, the hot air inside the power heat sink 3 can enter the interior of the flow groove 29 through the flow hole 30, and finally exit the interior of the power heat sink 3 from the flow groove 29.
[0048] In addition, the surface of the power heat sink 3 is coated with a graphene composite ceramic coating, which has heat dissipation properties and is suitable for the scenario required in this embodiment.
[0049] A method for assembling a circuit board, the method comprising the following steps:
[0050] S1, the upper substrate 1 and the lower substrate 2 are respectively installed at the top and bottom of the power heat sink 3 and can slide along the inside of the power heat sink 3. When the heat dissipation mechanism is running, the internal temperature of the power heat sink 3 is reduced. The buffer mechanism senses the temperature reduction and then runs. The operation of the buffer mechanism will drive the upper substrate 1 and the lower substrate 2 to move a distance in opposite directions.
[0051] S2. At this time, there is a certain gap between the upper substrate 1 and the lower substrate 2 and the power heat sink 3.
[0052] S3. When the vehicle operation causes the upper substrate 1 and the lower substrate 2 to vibrate, the upper substrate 1 and the lower substrate 2 can move up and down along the inner side of the power heat sink 3 under the action of the buffer mechanism.
[0053] In this embodiment, when the power heat sink 3 operates to cool its interior, the graphene heat sink 6 absorbs heat, and the absorbed heat is transferred to the interior and surface of the graphene heat sink 7. Since the end of the graphene heat sink 7 away from the graphene heat sink 6 is exposed on the outside of the power heat sink 3, the graphene heat sink 7 can transfer the heat inside the power heat sink 3 to the outside. The shape memory alloy sheet 12 senses the temperature change and deforms when the temperature is between 0 and 10°C. The deformation of the shape memory alloy sheet 12 will bend at a preset angle. The bending of the shape memory alloy sheet 12 will drive the slide rod 11 to move along the inside of the slide groove 10. At this time, the slide rod 11 will move towards the solid. When the fixed plate 13 moves in the direction and the two sets of shape memory alloy sheets 12 bend at the same time, the fixed plate 13 will move vertically. The movement of the fixed plate 13 will drive the fixed rod 16 to move through the fixed groove 14. The movement of the fixed rod 16 will eventually drive the connecting rod 18 to move through the connecting hole 17. The movement of the connecting rod 18 can drive the upper substrate 1 or the lower substrate 2 to move, so that there is a movable gap between the upper substrate 1 and the lower substrate 2 and the power heat sink 3 to avoid hard contact. When the temperature returns to the initial temperature, the shape memory alloy sheet 12 will naturally reset. The reset of the shape memory alloy sheet 12 will drive the fixed plate 13 to reset, and finally drive the upper substrate 1 and the lower substrate 2 to reset to the initial position.
[0054] Initially, the connecting rod 18 is inside the connecting hole 17. When the fixing rod 16 moves vertically, it drives the connecting rod 18 through the connecting hole 17. The movement of the connecting rod 18 then moves the upper substrate 1 or the lower substrate 2. When it is necessary to detach the upper substrate 1 or the lower substrate 2 from the fixing rod 16, simply move the guide block 20 away from the connecting rod 18. The guide block 20 will then move the connecting rod 18 synchronously along the inside of the connecting groove 19. The movement of the connecting rod 18 will detach it from the connecting hole 17, allowing the upper substrate 1 or the lower substrate 2 to be separated from the fixing rod 16, achieving a quick-release function. Furthermore, the movement of the guide block 20... During the process, the guide block 20 will also compress the micro spring 21, causing the micro spring 21 to deform and generate elastic potential energy. When installing the upper substrate 1 or the lower substrate 2 with the fixing rod 16, it is only necessary to align the connecting rod 18 with the connecting hole 17. At this time, the guide block 20 is released, the micro spring 21 is no longer under force, and the elastic potential energy is released. The micro spring 21 will then push the guide block 20 to reset. The reset of the guide block 20 will drive the connecting rod 18 to reset inside the connecting hole 17. At this time, when the fixing rod 16 moves, it can drive the connecting rod 18 to move through the connecting hole 17, so that the fixing rod 16 can control the movement of the upper substrate 1 or the lower substrate 2 again, realizing the function of quickly installing the upper substrate 1 or the lower substrate 2.
[0055] In the initial state, the L-shaped baffle 26 is closed over the vent 23, preventing the entry of external dust. When the upper substrate 1 or the lower substrate 2 moves, the L-shaped baffle 26 moves synchronously. As the L-shaped baffle 26 moves, it gradually moves away from the vent 23 along the baffle groove 24. At this time, the hot air inside the power heat sink 3 can be discharged through the vent 23. In the initial state, when the upper substrate 1 or the lower substrate 2 is attached to the power heat sink 3, the flow hole 30 is closed, and the flow groove 29 is connected to the interior of the flow hole 30. When the upper substrate 1 or the lower substrate 2 moves vertically, the upper substrate 1 or the lower substrate 2 stops blocking the flow hole 30, and the flow hole 30 is exposed. At this time, the hot air inside the power heat sink 3 can enter the interior of the flow groove 29 through the flow hole 30 and finally be discharged from the interior of the power heat sink 3 through the flow groove 29.
[0056] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A modular circuit board for new energy vehicles, comprising an upper substrate (1) and a lower substrate (2), wherein a power heat sink (3) is slidably connected between the upper substrate (1) and the lower substrate (2), and a support plate (4) is fixedly connected to the inner wall of the power heat sink (3), characterized in that, Also includes: The heat dissipation mechanism is connected to the support plate (4) and is used to absorb the temperature around the support plate (4) and transfer the temperature so that the upper substrate (1) and the lower substrate (2) can achieve the purpose of cooling. At least four sets of device slots (5) are opened at the top and bottom of the power heat sink (3). The four sets of device slots (5) are symmetrically distributed. Each of the four sets of device slots (5) is equipped with a buffer mechanism to reduce the hard impact force generated by the upper substrate (1) and lower substrate (2) caused by the vibration during vehicle operation. The buffer mechanism includes two pairs of sliders (9), a groove (10), a slide rod (11), a shape memory alloy sheet (12), a fixing plate (13), a fixing groove (14), and a fixing rod (16). The two pairs of sliders (9) are symmetrically fixed to the inner wall of the power heat sink (3). The groove (10) is opened inside the slider (9). The slide rod (11) is slidably connected to the inside of the groove (10). The shape memory alloy sheet (12) is fixed to the outside of the slide rod (11). The shape memory alloy sheet (12) senses the temperature change and deforms when the temperature is between 0 and 10°C. The fixing plate (13) is fixed between the two sets of shape memory alloy sheets (12). The fixing groove (14) is opened inside the fixing plate (13). The fixing rod (16) is fixed to the inner wall of the fixing groove (14). The quick-release mechanism is connected to the buffer mechanism and is used to quickly detach and assemble the connection between the buffer mechanism and the upper substrate (1) and the lower substrate (2).
2. The new energy vehicle combined circuit board according to claim 1, characterized in that, The heat dissipation mechanism includes four sets of graphene heat sinks (6), three sets of graphene heat sink strips (7), and mounting holes (8). The four sets of graphene heat sinks (6) are all installed at the top and bottom of the support plate (4). The three sets of graphene heat sink strips (7) are all installed inside the graphene heat sinks (6). The mounting holes (8) are opened on the outside of the power heat sink plate (3). The end of the graphene heat sink strip (7) away from the graphene heat sink (6) is installed inside the mounting hole (8).
3. The new energy vehicle combined circuit board according to claim 1, characterized in that, The quick-release mechanism includes a connecting hole (17), a connecting rod (18), two pairs of connecting grooves (19), a guide block (20), and a miniature spring (21). The connecting hole (17) is opened inside the fixed rod (16). The connecting rod (18) is slidably connected inside the connecting hole (17). The two pairs of connecting grooves (19) are respectively opened at opposite ends of the upper substrate (1) and the lower substrate (2). The guide block (20) is slidably connected to the inner wall of the connecting groove (19). The miniature spring (21) is fixed between the inner wall of the connecting groove (19) and the guide block (20).
4. A new energy vehicle modular circuit board according to claim 3, characterized in that, Both sides of the upper substrate (1) and the lower substrate (2) are provided with threaded holes (22). The threaded holes (22) are on the same horizontal plane as the connecting rod (18), and the diameter of the threaded holes (22) is smaller than the diameter of the connecting holes (17).
5. A new energy vehicle modular circuit board according to claim 1, characterized in that, The power heat sink (3) has multiple sets of air vents (23) on both sides, and multiple sets of baffles (24) on the top and bottom ends of the power heat sink (3). The air vents (23) and the baffles (24) are connected internally. Multiple sets of L-shaped baffles (26) are fixed to the opposite ends of the upper substrate (1) and the lower substrate (2). The multiple sets of L-shaped baffles (26) correspond one-to-one with the multiple sets of baffles (24), and the L-shaped baffles (26) slide inside the baffles (24).
6. A new energy vehicle modular circuit board according to claim 1, characterized in that, The power heat sink (3) has guide tubes (27) fixed around its top and bottom edges. The upper substrate (1) and lower substrate (2) have guide grooves (28) that correspond one-to-one with the multiple sets of guide tubes (27). The guide tubes (27) slide inside the guide grooves (28).
7. A new energy vehicle modular circuit board according to claim 6, characterized in that, The top end of the guide tube (27) is provided with a flow groove (29), and the outside of the guide tube (27) is provided with a flow hole (30). The flow groove (29) and the flow hole (30) are connected internally.
8. A new energy vehicle modular circuit board according to claim 1, characterized in that, The surface of the power heat sink (3) is coated with graphene composite ceramic.
9. A method for assembling a circuit board, applied to a new energy vehicle assembled circuit board as described in any one of claims 1-8, characterized in that, The method includes the following steps: S1. The upper substrate (1) and the lower substrate (2) are respectively installed at the top and bottom of the power heat sink (3) and slide along the inside of the power heat sink (3). When the heat dissipation mechanism is running, the internal temperature of the power heat sink (3) decreases. The buffer mechanism senses the decrease in temperature and then runs. The operation of the buffer mechanism will drive the upper substrate (1) and the lower substrate (2) to move a distance in opposite directions. S2. At this time, there is a certain gap between the upper substrate (1) and the lower substrate (2) and the power heat sink (3); S3. When the vehicle operation causes the upper substrate (1) and lower substrate (2) to vibrate, the upper substrate (1) and lower substrate (2) can move up and down along the inner side of the power heat sink (3) under the action of the buffer mechanism.