Embedded copper block PCB and processing method thereof

Abstract

The invention discloses an embedded copper block PCB and a processing method thereof, and relates to the technical field of PCB processing, and the method comprises the steps: 1, processing a copper block into a required shape, including an input end and an output end which are formed through bending; 2, processing the core plate serving as a middle layer into a shape in which the copper block can be embedded; step 3, performing primary lamination on the copper block and the core plate of the middle layer, and forming a pretreated mixed substrate by using a single-sided high-temperature-resistant adhesive tape and plugging resin in a gap at a nesting position; and 4, processing the top layer single-sided board and the bottom layer single-sided board into required shapes. In the aspects of lamination of the copper block and the core plate, temperature and pressure control, grease overflow monitoring and local process adjustment, the ratio of the adhesive tape to the resin is optimized by accurately controlling the temperature, pressure and displacement data of the contact area of the copper block and the core plate, so that the resin fluidity in the lamination process can be fully controlled, and the production efficiency is improved. Therefore, the quality problem caused by non-uniform pressure or temperature fluctuation is avoided.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of PCB processing, in particular to an embedded copper block PCB and a processing method thereof. BACKGROUND

[0002] In electronic devices, PCB (Printed Circuit Board) as an important infrastructure to carry and connect various electronic components, has been widely used in computer, communication equipment, automotive electronics and other fields; with the continuous miniaturization and diversification of electronic products, the performance requirements of PCB are also gradually improved, especially in high power, high frequency and high stability applications, the traditional PCB technology has been difficult to meet the increasingly complex needs; And with the rapid development of electronic products, the device layout is more concentrated, the pitch is smaller, and the power of components is improved; at the same time, the line width of the design is getting thinner and thinner, and the copper surface is getting smaller and smaller, which makes it more difficult to conduct heat on the PCB, and overheating often leads to component aging, failure and shortened life; at the same time, due to the increase of power density of components, the heat dissipation of PCB is too large, which affects the service life of components, and even leads to component failure; therefore, it is urgent to solve the problem of PCB heat dissipation; The existing embedded copper block PCB technology usually embeds copper blocks inside the PCB to improve the overall performance of the board by using the thermal and electrical conductivity of copper; this technology can effectively solve the problems of high current density, uneven heat distribution and other problems in traditional PCBs; however, the traditional embedded copper block PCB manufacturing method still faces some challenges in the processing process, such as thermal expansion matching of copper block and PCB core plate, precision control of bending copper block shape, and stress release in the lamination process, etc., which will affect the long-term stability and reliability of the product; therefore, the present application provides an embedded copper block PCB and a processing method thereof. SUMMARY

[0003] The present application aims to provide an embedded copper block PCB and a processing method thereof to solve the problems mentioned in the background.

[0004] The present application can be implemented by the following technical scheme: a processing method of an embedded copper block PCB, comprising: Step one, process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Step two, process the core plate as an intermediate layer into a shape that can embed the copper block; Step three, once the copper block and the core plate of the intermediate layer are laminated, a single-sided high-temperature-resistant tape is used and resin is inserted into the gap at the nesting position to form a pretreated mixed substrate; Step four, process the top single-sided board and the bottom single-sided board into the required shape; Step five, the top layer of single-sided board and the bottom layer of single-sided board processed in step four are respectively laminated on the upper and lower sides of the hybrid substrate to obtain an embedded copper block PCB board; Step six, drilling holes on the corresponding positions of the laminated embedded copper block PCB board and plating copper in the holes to obtain copper plated holes.

[0005] Further technical improvements of the present application are that the copper blocks in step three are provided in two groups and are respectively located on the two sides of the hybrid substrate. And after the pretreatment is completed, the two groups of copper blocks are exposed on the two sides of the hybrid substrate.

[0006] Further technical improvements of the present application are that in step three, when the copper blocks are laminated with the core plate, the lamination process is divided into three regions of a central region, a transition region and an edge region, and the lamination is gradually implemented, so that the resin can realize orderly flow and actively release residual stress in the lamination process, including: S1, before the lamination of the copper blocks and the core plate, the lamination region is divided into three different regions, including: The central region is located in the core region of the copper block and the core plate, and is the main starting region of resin flow; The transition region is a transition zone between the central region and the edge region, and plays a role in smoothing the resin flow; The edge region is located in the outer edge region of the copper block and is the final lamination region of the closed structure; S2, the central region is laminated, and the lamination force is gradually applied from the middle to the edge of the region; At this time, the filling process of the resin in the central region is gradually completed, and the resin begins to expand to the transition region in the flow process; S3, the edge region is laminated, and in this process, the lamination force gradually expands from the transition region to the edge region, and the resin filling of the edge region is completely compacted to seal the entire structure; At this time, due to the limitation of the resin flow in the edge region, the lamination force and the resin filling need to be gradually pressurized to ensure that the edge resin is uniform and no gap or excessive flow occurs; By gradually laminating the edge region, the resin flow can be stabilized to form an effective closed structure to prevent the resin at the edge from flowing out too quickly and ensure the structural integrity between the entire copper block and the core plate; S4, the transition region is laminated, and in this process, a moderate lamination force is applied so that the resin of the transition region can smoothly join the resin of the central region and the edge region to form a uniform transition lamination structure; The stress of the transition region is gradually released in this step, which avoids the accumulation of stress in the transition region and ensures the flatness and structural stability of the entire lamination interface; The compression transition zone can balance the stress difference between different areas of the resin, effectively relieving the stress concentration problem of the transition zone caused by uneven compression; S5, after completing all the partition compression steps, enter the constant pressure holding phase; in this phase, a moderate constant pressure is maintained to ensure that the resin flows fully, distributes uniformly and solidifies completely; By controlling the constant temperature environment, the resin forms a uniform bonding layer in the entire PCB, further strengthening the bonding strength of the copper block and the core plate; Further technical improvements of the present application are that after step five, whether there is an overflow position of the copper block PCB in each production cycle is monitored, and the following steps are performed: A1, construction and collection of time series data: The overflow data of the copper block PCB in each production cycle is collected to establish the corresponding overflow position data time series; A2, sliding window method and cross feature extraction: A fixed length time window is set, and the overflow position data time series is divided by the sliding window method; Each time window contains overflow data in several time steps, including overflow position, overflow amount and position number information; And in each sliding window, the mutual relationship between the overflow position, the overflow amount and the position number is analyzed by cross feature extraction; A3, overflow hot area analysis and local production process adjustment: Based on the cross feature extraction result of the overflow data in step A2, the overflow hot spot area of the embedded copper block PCB is identified, and local process adjustment is performed on the corresponding area; Further technical improvements of the present application are that the cross feature extraction in step A2 includes: the ratio of overflow amount to position number, the correlation of overflow amount and overflow frequency, and the ratio of overflow position number to overflow amount.

[0007] Further technical improvements of the present application are that step three further includes: Z1, monitor the temperature, pressure and displacement data of the copper block and the core plate contact area, and perform standardization processing for subsequent analysis and use; Z2, based on the temperature, pressure and displacement data obtained in Z1, the optimal ratio of adhesive tape and resin is calculated in real time to ensure the optimal bonding quality of the copper block and the core plate under different working conditions; The method for obtaining the ratio includes weighted calculation according to the temperature, pressure and displacement data to obtain the optimized ratio of the adhesive tape and the resin; Z3, intelligent curing process control: During the curing process, the temperature, pressure and curing progress data are monitored in real time, and the temperature, pressure and time during the curing process are automatically adjusted to ensure complete curing of the adhesive tape and resin and optimize the bonding effect.

[0008] Further technical improvements of the present application are as follows: in step five, the following heat treatment process steps are used to optimize the stability of the embedded copper block PCB after pressing, including: B1, the copper block PCB after pressing is subjected to preliminary heating treatment, the heating temperature is controlled within a predetermined range, and the thermal matching between the copper block and the core plate of the intermediate layer is ensured; B2, the thermal expansion matching of the copper block and the core plate is controlled through the cooling process, the temperature is slowly reduced, the uneven material stress caused by temperature difference change is avoided, and the stability of the PCB is improved; B3, during the cooling process, directional heating is carried out on specific areas by using microwave radiation or infrared heating technology, and the irregular deformation of the copper block is ensured by monitoring the morphological changes of the copper block in real time; B4, after heat treatment, the deformation of the PCB is detected by tensile test to ensure that the adhesion strength of the copper block and the core plate meets the requirements.

[0009] The present application also discloses an embedded copper block PCB obtained by the above processing method.

[0010] Compared with the prior art, the present application has the following beneficial effects: The present application optimizes the ratio of adhesive tape and resin by precisely controlling the temperature, pressure and displacement data of the contact area between the copper block and the core plate, and can ensure that the resin flowability in the bonding process is fully controlled, thereby avoiding quality problems caused by uneven pressure or temperature fluctuations, effectively improving the thermal stability and mechanical stability of the embedded copper block PCB, and ensuring the high reliability of the product in complex environments. Moreover, the present application provides more accurate basis for quality control in the production process through intelligent curing process control and overflow monitoring, and through the analysis of the relationship between overflow phenomenon and local process by the sliding window method, the production process can be adjusted in real time to prevent the expansion of overflow problems, improve the consistency and stability of the product, not only improve the production efficiency, but also effectively reduce the material waste and cost in the production process. On the other hand, the present application adjusts the cooling rate dynamically to ensure that the thermal expansion between the copper block and the core plate is reasonably matched, and avoids deformation or cracks caused by thermal stress; in addition, the whole cooling process is more controllable by using the way of phased cooling and real-time monitoring, thereby improving the stability and long life of the PCB, especially suitable for high-frequency and high-power electronic equipment requiring high reliability. Attached Figure Description

[0011] To facilitate understanding by those skilled in the art, the present invention will be further described below with reference to the accompanying drawings.

[0012] Figure 1 This is a schematic diagram of the method logic of the present invention; Figure 2 This is a schematic diagram of the embedded copper block PCB board in this invention. Detailed Implementation

[0013] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided.

[0014] Example 1 Please see Figure 1 As shown, the present invention provides a method for processing an embedded copper block PCB board, comprising: Step 1: Process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Specifically, a forming machine is used to process copper plates, turning copper blocks into the required copper block body and bent copper blocks of the desired shape. Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Specifically, the core board is machined using a forming machine to create a cavity area that matches the copper block body and the bent copper block; Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Two sets of copper blocks are provided, located on both sides of the hybrid substrate; After pretreatment, the two sets of copper blocks are exposed on both sides of the hybrid substrate.

[0015] In practice, the two sets of bent copper blocks can be oriented in the same or opposite directions to meet the installation requirements of different relay positive and negative contact points. At the same time, the position of the bent copper blocks extending out of the hybrid substrate can meet the electrical performance input and output requirements. Furthermore, by first processing the copper block into the required shape and then folding the copper block for integral molding and pressing between PCB layers, this invention can achieve a higher production qualification rate and better data stability of irregularly shaped bent copper blocks, greatly improving the stability of PCB boards with embedded copper blocks.

[0016] Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

[0017] In this embodiment, the copper-plated holes drilled on the PCB board extend from the top core board to the bottom core board and pass through the copper block body. The copper-plated holes are used for component connector pin insertion and soldering. After the connector to be connected is inserted into the copper-plated holes, it is ensured that the pin connector can make electrical contact with the copper block body.

[0018] The copper-plated holes can be set in multiple groups, with each group containing multiple holes. The specific number can be designed according to actual needs to meet the insertion requirements of different components.

[0019] In this embodiment, the core board of the middle layer, the top single-sided board and the bottom single-sided board are all made of FR-4 core board, which is a glass fiber reinforced epoxy resin laminate with excellent mechanical properties, electrical insulation properties and heat resistance properties.

[0020] The embedded copper block PCB board in this embodiment is as follows: Figure 2 As shown, the process includes using a forming machine to process copper blocks into the required embedded copper block body, bending copper blocks 102 and 103, and countersunk grooves 6 are opened on the top single panel 3 and the bottom single panel 4. During the first bonding process, the embedded copper block body, bent copper blocks 102 and 103 are fitted with the core board of the intermediate layer according to their shapes. After applying high-temperature tape to one side and filling the gaps with resin, a pre-treated hybrid substrate is formed. During the second lamination, the top single-sided board 3, the pre-treated hybrid substrate, and the bottom single-sided board 4 are laminated together to form a PCB board.

[0021] Furthermore, the holes drilled on the PCB board are electroplated to form copper-plated holes 5, which extend from the top single-sided board 3 to the bottom single-sided board 4 and pass through the copper block body. The copper-plated hole 5 is used for component insertion. After the connector to be connected is inserted into the copper-plated hole 5, it ensures that the connector can be electrically connected to the copper block body. The copper-plated holes 5 can be in multiple groups, and each group can contain multiple holes of any number. For example... Figure 2 As shown, the copper-plated holes 5 include three groups, namely holes 501, 502 and 503. Each group of copper-plated holes 5 can be used to connect different components. The number of copper-plated holes 5 is determined according to design requirements to meet the insertion requirements of different components.

[0022] The countersunk groove 6 is positioned one-to-one with the position of the copper-plated hole 5 opened on the top single-sided panel 3, and the opening height of the countersunk groove 6 matches the length of the connector to be connected, so that the connector can make good contact after being inserted into the copper-plated hole. The PCB board also includes: fixing holes, including holes 701, 702, 703 and 704 opened on the top single-sided board 3 and the bottom single-sided board 4, holes 705 and 706 opened on the bent copper blocks 102 and 103, and half holes 707 on the edge of the board. Holes 701, 702, 703, 704, 705, and 706 are respectively connected to the positive and negative terminals of external connector-type functional modules; The 707 half-hole allows onboard signals to be soldered to the module board through a half-hole.

[0023] Example 2 A method for fabricating an embedded copper block PCB board includes: Step 1: Process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Compared to Example 1, in Example 2, when bonding the copper block to the core board, the bonding process is divided into three areas: the central area, the transition area, and the edge area. The bonding is performed step-by-step, allowing the resin to flow in an orderly manner during the bonding process and actively releasing residual stress. This includes: S1. Before bonding the copper block to the core board, the bonding area is divided into three different areas, including: Central area: Located in the core area between the copper block and the core board, it is the main starting area for resin flow; Transition zone: Located between the central zone and the edge zone, it serves to smooth the resin flow; Edge region: Located at the outer edge of the copper block, serving as the final pressing area for the closed structure; Specifically, before bonding the copper block to the core board, the initial pressing force needs to be determined; this initial pressure is calculated based on the following factors: Contact area size: The contact area between the copper block and the core board is an important factor in determining the initial pressing force; the larger the contact area, the greater the initial pressure required; the initial pressure value should be calculated according to the contact area and the needs of resin filling to ensure that the resin can start to flow smoothly and fill. Resin flowability and viscosity: The flow characteristics of different resins will affect the amount of pressure applied; if the resin viscosity is high, the required initial pressure will also be greater; in order to ensure that the resin can be filled smoothly and to avoid excessive pressure causing the resin to flow too quickly or overflow, the system will calculate an appropriate initial pressure based on the actual flowability of the resin. This embodiment includes the following steps: Obtain the contact area: Based on the actual geometric contours of the copper block to be bonded and the core board, measurements are taken according to the projected contact surface during bonding: Straight sections are calculated by multiplying their length by their effective width. The input and output ends of the bent shape adopt the unfolded projection method, only including the projection part that can form actual pressure with the cavity wall of the core board; The measured geometric area is corrected for effective contact rate: the effective contact rate is determined based on the surface roughness, pre-coated resin layer thickness, and core board cavity wall morphology of the same batch. Before production, the coverage of the indentation left by the sample test pressure is confirmed: if the coverage is insufficient, the effective contact rate is lowered; if the coverage is oversaturated, it is raised. The final output is the effective contact area.

[0024] Obtain the resin flowability grade: A pre-rheological test was performed on this batch of resin at the process reference temperature, and either the "expansion diameter / flow distance" or the "standard orifice outflow time" under fixed loading and fixed time was used as the flowability characterization value. The characterization values ​​are compared with the process baseline and divided into several flowability grades. The final output result is the resin flowability grade.

[0025] Establish a baseline for the comparison from area × liquidity to pressure: Before mass production, complete the calibration test: select three effective contact areas (small / medium / large) and three flow rates (low / medium / high), verify the bonding step by step, and record the initial usable pressure range that allows the resin to start from the center area and stably enter the transition area without overflowing at the edges.

[0026] Write the starting pressure range corresponding to each "area range × flowability range" into the process reference table. At the same time, record boundary phenomena such as "whether the startup time is too long / whether there is overflow" as a reference for subsequent fine-tuning.

[0027] Determine the initial pressure of the foundation during production: Locate the area range in the process reference table using the effective contact area; Use the resin flowability grade to locate the flowability level in the reference table; Read the starting pressure range corresponding to the cross unit; to avoid overshoot, use the lower edge of the starting pressure range as the base initial pressure; If the area or flow falls between two adjacent levels, instead of directly choosing the higher or lower level, the value is selected from the lower edge of the corresponding range of the two levels based on the distance of the landing point (i.e., the lower edge is closer to whichever level it is closer to, so the closer side is selected), to ensure a smooth transition.

[0028] S2. Press the central area together, applying the pressing force gradually from the middle to the edge of the area. At this point, the filling process of the resin in the central area is gradually completed, and the resin begins to expand to the surrounding transition area during the flow process. The pressing pressure needs to be precisely controlled to ensure that the resin's fluidity is fully released and to avoid the appearance of air bubbles or unfilled areas; Specifically, during the pressing of the central area, the applied pressure gradually increases from the initial pressure; the pressurization process follows a linear pressurization method, that is, the pressing force gradually increases at a certain pressurization rate. Every certain period of time (e.g., every 2 seconds), the pressing force increases by a fixed amount until the preset target pressure value is reached; The amount of pressure applied and the interval between pressure applications are dynamically adjusted by the system based on the resin's flowability and the actual pressing conditions. This ensures that the resin flows evenly in the central area, preventing uneven resin filling or air bubble formation caused by excessively rapid pressure increases.

[0029] S3. Press the edge area. During this process, the applied pressing force gradually extends from the transition area to the edge area. The resin filling in the edge area is completely compacted, sealing the entire structure. At this point, due to the restriction of resin flow in the edge area, both the pressing force and resin filling need to be gradually increased to ensure that the resin at the edge is uniform and that no voids or excessive flow are generated. By gradually pressing the edge area, the resin flow can be stabilized, forming an effective closed structure to prevent the resin at the edge from flowing out too quickly, thus ensuring the structural integrity between the entire copper block and the core board. Specifically, for the pressing of the edge region, the applied pressing force gradually extends from the transition region to the edge region; due to the restriction of resin flow in the edge region, the applied pressure should be gradually increased to ensure that the resin is completely filled and forms a stable structure; In this process, a step-by-step pressurization method is used, that is, the pressure is increased by a fixed amount at regular intervals.

[0030] S4. Press the transition zone together. During this process, apply an appropriate pressing force so that the resin in the transition zone can smoothly bond with the resin in the central and edge zones, thereby forming a uniformly transitioned pressed structure. The stress in the transition zone is gradually released in this step, avoiding the accumulation of stress in the transition zone and ensuring the flatness and structural stability of the entire bonding interface. The compression transition zone can balance the stress differences between different areas of the resin, effectively alleviating the stress concentration problem caused by uneven compression in the transition zone; through the precise control of this step, uniform resin transition and balanced stress release can be achieved, thereby improving the stability of the overall structure. Specifically, during the pressing process in the transition zone, the applied pressure does not increase at a fixed rate, but rather is non-linearly increased based on the actual resin flow and stress distribution requirements. That is, a smaller pressure is applied in the initial stage, and then gradually increased. The rate of pressure increase gradually slows down, and at intervals, the pressure increases by a certain amount, with the pressure increment gradually decreasing until the set target pressure value is reached. This method ensures that the resin in the transition zone can flow smoothly from the center area to the edge area and achieve uniform filling. The automated control system dynamically adjusts the pressure increase method based on actual pressure feedback to ensure the smoothness of resin flow and the uniformity of the pressing process.

[0031] S5. After completing all the partitioned pressing steps, proceed to the constant pressure holding stage; in this stage, maintain a moderate constant pressure to ensure that the resin flows fully, is evenly distributed, and is completely cured. By controlling the constant temperature environment, the resin forms a uniform adhesive layer throughout the PCB board, further strengthening the bond strength between the copper block and the core board. The constant pressure holding process eliminates any possible interface bubbles or uneven curing problems, ensuring a strong bond between the copper block and the core board, and effectively improving the service life and thermal stability of the entire PCB board.

[0032] Specifically, after all the partitions have been pressed, the constant pressure holding stage begins; The goal of this stage is to ensure complete resin curing and to ensure structural stability through constant pressure holding. To ensure consistent resin curing, a moderate constant pressure is maintained. The specific pressure range and holding time are adjusted according to the resin curing rate and material properties.

[0033] Furthermore, pressure and temperature are monitored in real time during the processing to ensure that the resin does not expand or deform during the curing process. Furthermore, during resin curing, the holding time and pressure are automatically adjusted based on the resin viscosity, layer thickness, and required curing time; the specific relationship between time and pressure is adjusted by the system based on real-time feedback. The processing system, through feedback mechanisms from pressure sensors and a temperature control system, ensures a stable pressure throughout the entire resin curing process, thereby guaranteeing the structural stability of the resin after curing.

[0034] Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

[0035] Example 3 A method for fabricating an embedded copper block PCB board includes: Step 1: Process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. Compared to Examples 1 and 2, Example 3, after step five, monitors whether there are any areas of grease overflow on the copper block PCB board in each production cycle, and performs the following steps: A1. Construction and Acquisition of Time Series Data: Data on grease overflow from copper block PCBs were collected during each production cycle, and a time series of data on the corresponding grease overflow locations was established. Specifically, the first step is to collect grease overflow data for the embedded copper block PCB boards in each production cycle, including: Grease overflow area data acquisition: The grease overflow area on each embedded copper block PCB board is collected in real time during the production cycle through high-precision sensors or vision recognition systems. Specifically, image processing technology or contact sensors are used to pinpoint the exact location and time of each seborrhea event, and record its physical location coordinates and corresponding timestamp. This process ensures the accuracy and timeliness of the seborrhea data and provides a foundation for subsequent data processing.

[0036] Sebum volume data acquisition: For each sebum discharge site, the sebum volume is measured in real time using a laser scanner, weight sensor, or other high-precision equipment; through the real-time feedback of these devices, the sebum volume of the sebum discharge site can be accurately obtained, and it can be continuously tracked and recorded at different time points; the sebum volume data of each sebum discharge site reflects the severity of sebum discharge and provides key basis for subsequent quality analysis and process optimization.

[0037] Location frequency data statistics: This involves tracking the frequency of oil spill events within each production cycle, i.e., the number of times each oil spill site occurs. By recording the frequency of oil spill occurrences, high-frequency locations more prone to oil spill problems during production can be identified. Location frequency data is helpful for subsequent oil spill risk assessment and process adjustments.

[0038] Finally, by integrating the collected data on the location, amount, and number of seborrhea sites, a corresponding time series of seborrhea site data was established to ensure the continuity and comprehensiveness of subsequent data analysis.

[0039] A2. Sliding window method and cross feature extraction: A fixed-length time window is set, and the time series of seborrhea data is divided using the sliding window method; Each time window contains seborrhea data within several time steps, including information on the location, amount, and number of locations of seborrhea; this step can capture the fluctuation characteristics of seborrhea within a local time period. Furthermore, within each sliding window, cross-feature extraction is used to analyze the relationships between the location of seborrhea, the amount of seborrhea, and the number of locations. Specifically, the implementation steps are as follows: Time window setting and sliding window method: Set a fixed-length time window, length N; each time window contains data on the location, amount, and number of locations of seborrhea; using the sliding window method, the entire seborrhea data time series is divided into multiple consecutive small windows, each containing data from N time steps, to help capture the local fluctuation characteristics of seborrhea within a specific time period.

[0040] Cross feature extraction, including: The ratio of sebum volume to the number of sites: This ratio is used to extract sebum density characteristics. It reflects the concentration of sebum production at various sites within a given time window. A high ratio indicates that sebum production is highly concentrated in a few sites, potentially causing localized process problems or quality fluctuations.

[0041] Correlation between seborrhea volume and frequency: Correlation analysis used the Pearson correlation coefficient, which was obtained using the following formula: In the formula, r is the correlation coefficient; X is the amount of seborrhea; and Y is the frequency of seborrhea. By correlating the amount and frequency of seborrhea, the scalability of the seborrhea phenomenon can be identified. If the increase in seborrhea amount is highly correlated with the increase in seborrhea frequency, it indicates that the seborrhea problem may continue to spread; conversely, if the correlation between the two is weak, it indicates that the seborrhea phenomenon is relatively stable. Through this feature, the system can dynamically predict the changing trend of seborrhea.

[0042] The ratio of the number of grease-producing sites to the amount of grease: The distribution characteristics of grease are extracted by calculating the ratio of the number of grease-producing sites to the amount of grease. This ratio measures the uniformity of the distribution of grease-producing events in multiple sites. If the ratio is high, it indicates that the grease phenomenon is widely distributed and there may be large quality fluctuations in the production process. If the ratio is low, it indicates that the grease phenomenon is concentrated in a few sites. By analyzing the ratio between the number of oil spill sites and the amount of oil spill, the extent of the oil spill phenomenon can be further assessed, thereby determining whether multiple parts of the production process need to be adjusted simultaneously to avoid a problem in one part leading to an overall quality problem. The calculation logic is as follows: Sebum distribution = number of sebum-producing sites / total amount of sebum.

[0043] A3. Analysis of Grease Overflow Hot Zones and Adjustment of Local Production Processes: Based on the cross-feature extraction results of the grease overflow data in step A2, the grease overflow hot spots of the copper block PCB are identified, and the corresponding local process adjustments are made. Specifically, the implementation method is as follows: Identification of Grease Hotspots: Based on the cross-feature extraction results of grease data in step A2, the processing system can identify grease hotspots on the embedded copper block PCB board. Specifically, based on the relationship between grease volume, grease frequency, and number of locations, areas with high grease volume and frequency are located. By comparing the grease performance of different areas, it is determined which areas have a greater impact on product quality and become grease hotspots that require special attention.

[0044] Implementation of localized process adjustments: After identifying areas of excessive sebum discharge, the system will perform localized process adjustments in these areas. This includes: Based on the grease overflow data of the hot spots, the production process parameters of that area are adjusted. For example, if the amount of grease overflow in a certain part is large and the frequency of grease overflow is high, the processing system will automatically reduce the heating temperature of that part or reduce the molding speed to reduce the occurrence of grease overflow.

[0045] By dynamically adjusting the production process based on real-time feedback data, we can ensure that the grease overflow phenomenon is effectively controlled and prevent over-adjustment of the overall process, thus avoiding unnecessary loss of production efficiency.

[0046] Adjusted process feedback and optimization: At the end of each production cycle, the processing system provides feedback based on the adjusted process results and grease overflow situation, automatically generating process adjustment suggestions for the next production cycle. This feedback mechanism helps optimize process parameters for subsequent production cycles, further reducing the negative impact of grease overflow on product quality.

[0047] Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

[0048] Example 4 A method for fabricating an embedded copper block PCB board includes: Step 1: Process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Step three of Example 4 further includes: Z1. Monitor the temperature, pressure, and displacement data of the contact area between the copper block and the core board, and standardize the data for subsequent analysis and use; Specifically, during the bonding process between the copper block and the core board, temperature, pressure, and displacement data of the contact area between the copper block and the core board are collected in real time using temperature, pressure, and displacement sensors. The collected data is updated every second and undergoes standardization processing. The standardized data facilitates subsequent calculations and ensures that each data point (temperature, pressure, and displacement) is within a uniform range, guaranteeing consistency in data collected by different sensors.

[0049] Z2. Based on the temperature, pressure, and displacement data obtained in Z1, the optimal ratio of tape to resin is calculated in real time to ensure the best bonding quality between the copper block and the core board under different working conditions. The method for obtaining the ratio includes weighted calculation based on temperature, pressure, and displacement data to obtain the optimized ratio of tape to resin. Specifically, based on the real-time temperature (T), pressure (P), and displacement (D) data obtained from Z1, the ratio of tape to resin is calculated through the following steps: Temperature effect: When the temperature T is high, the resin fluidity increases, and the system will increase the proportion of resin; when the temperature is low, the proportion of tape will be increased to enhance the bonding strength.

[0050] Pressure effect: When the pressure P in the contact area is high, the resin has good flowability, and the system increases the resin ratio; when the pressure is low, the system increases the tape ratio to enhance adhesion.

[0051] Displacement effect: When the displacement D exceeds the set threshold, it indicates that the contact between the copper block and the core board is not complete. The system will increase the proportion of resin to ensure tight bonding.

[0052] Finally, the method for calculating the resin ratio in this embodiment is as follows: Optimal ratio of tape to resin = ; in, Influence coefficients of temperature, pressure, and displacement; These are the weight coefficients for the corresponding items; In this embodiment, Based on existing production process experience and physical models, a mathematical relationship between temperature, pressure, displacement and resin ratio is established, and the estimated value of each coefficient is obtained through process simulation.

[0053] and Different factors are assigned different weights based on production experience or industry standards.

[0054] Z3. During the curing process, the temperature, pressure, and time are automatically adjusted based on real-time monitored temperature, pressure, and curing progress data to ensure complete curing of the tape and resin and optimize the bonding effect.

[0055] In this implementation, after the copper block and core board are bonded together and the curing process begins, the temperature, pressure, and curing status of the curing area are monitored in real time using temperature, pressure, and curing progress sensors. The specific process is as follows: Temperature adjustment: During the curing process, a temperature sensor monitors the temperature of the curing area in real time; When the curing temperature is lower than the preset curing temperature, the heating power is automatically increased by the heating equipment to ensure that the temperature gradually rises to the predetermined range; if the temperature exceeds the set upper limit, the heating power is reduced or heating is stopped to prevent overheating and keep the temperature in the optimal curing range.

[0056] Pressure adjustment: Pressure changes in the contact area are monitored in real time by a pressure sensor. If the pressure distribution is uneven during the curing process, the external pressure is adjusted according to the real-time monitoring data to ensure that the pressure is evenly distributed across the entire contact surface. If insufficient pressure is detected to ensure tight contact in the contact area, the applied pressure is increased appropriately to ensure that the tape and resin can cure evenly. Specifically, when the pressure detected in the contact area is lower than the set pressure threshold, it indicates that the pressure distribution in the contact area is uneven, and the applied external pressure needs to be increased. The specific increase is determined by the difference between the currently measured pressure and the preset pressure threshold; The processing system determines the applied pressure increment based on the difference between the current pressure and the preset threshold; the applied pressure increment should ensure that the pressure in the contact area can be evenly distributed across the entire contact surface; in this embodiment, the increased pressure, based on experimental results and actual needs, ensures that it can fill the gaps without causing excessive compression of the material, thereby affecting the curing effect; Furthermore, the applied pressure increment is carried out without exceeding the material yield limit to avoid damage to the tape or resin due to excessive pressure. In this embodiment, the applied pressure increment is controlled between 15% and 30% of the original pressure in the contact area. The specific value should be determined according to the actual production process requirements and material characteristics. After applying incremental pressure, continue to monitor the pressure changes in the contact area to ensure that the pressure is evenly distributed throughout the entire contact area; if the pressure distribution is still uneven, the system will continue to adjust until the pressure is evenly distributed and the set ideal curing conditions are achieved.

[0057] Curing progress calculation and adjustment: The curing progress is calculated based on real-time changes in temperature and pressure data, using the following formula: Curing progress = ; in, This is the lowest temperature at which curing begins; This is the highest temperature at the end of curing; Based on real-time curing progress data, the time and temperature during the curing process are dynamically adjusted to ensure that the resin and tape are fully cured under optimal conditions. If the curing progress is slow, the curing time is extended and heating or pressure is continued. If the curing progress is too fast, the heating power and pressure are reduced to avoid over-curing.

[0058] Finally, the processing system determines whether the curing process is complete based on feedback signals of temperature, pressure, and curing progress. Once the curing progress reaches the set standard and the temperature and pressure are within the expected range, the system automatically ends the curing process and reduces the temperature and pressure to prevent over-curing or damage to the tape and resin due to excessive temperature.

[0059] Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

[0060] Example 5 A method for fabricating an embedded copper block PCB board includes: Step 1: Process the copper block into the required shape, wherein the copper block includes a bent input end and an output end; Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. In step five of Example 5, the following heat treatment process steps are used to optimize the stability of the laminated embedded copper block PCB board, including: B1. Perform preliminary heating treatment on the copper block PCB board after lamination, control the heating temperature within the predetermined range, and ensure the thermal matching between the copper block and the core board of the intermediate layer. Specifically, the copper block PCB board after lamination undergoes preliminary heating treatment. The purpose is to ensure the thermal expansion matching between the copper block and the PCB core board by precisely controlling the heating temperature. Heating temperature setting: After heating to the target temperature, keep the copper block and core board within the predetermined temperature range to ensure uniform heating; Heating process control: The heating rate is controlled by a temperature control system to ensure that the thermal expansion of the copper block and the core board are matched, thus avoiding thermal stress caused by excessive temperature difference; This process ensures thermal expansion matching between the copper block and the core board, laying the foundation for the stability of the subsequent cooling process.

[0061] B2. By controlling the thermal expansion matching between the copper block and the core board during the cooling process, the temperature is slowly reduced to avoid uneven material stress caused by temperature difference changes, thereby improving the stability of the PCB board. Specifically, to ensure thermal expansion matching between the copper block and the core board, the rate of temperature change during the cooling process must be strictly controlled to avoid excessive temperature differences leading to uneven thermal stress. To achieve this goal, the entire cooling process needs to be adjusted based on the real-time temperature changes on the surface of the copper block, including: The copper block is divided into multiple specific regions, and the temperature data of each specific region is monitored. Through these real-time temperature data, the temperature change of the copper block at different time points can be calculated. Subsequently, by comparing temperature data at continuous time points, the temperature difference was calculated by dynamically adjusting the flow rate of the cooling medium or the cooling method based on the temperature difference and cooling target to ensure that the cooling rate of the copper block is within the set range. Based on the temperature difference and cooling target, the flow rate of the cooling medium or the cooling method is dynamically adjusted to ensure that the cooling rate of the copper block is within the set range; for example, when the surface temperature change of the copper block is greater than the preset cooling threshold, the cooling rate is slowed down to avoid excessive temperature difference and ensure that the cooling rate does not exceed the cooling threshold.

[0062] In this way, the cooling rate will adjust itself according to the actual temperature difference to ensure that the temperature change during the cooling process is not too fast and to avoid the problem of uneven thermal stress.

[0063] Furthermore, in this embodiment, in order to prevent the temperature difference from changing too quickly, a staged cooling method is adopted, which divides the entire cooling process into several stages, with the cooling rate of each stage gradually slowing down. Specifically, the cooling process is divided into an initial cooling stage, a mid-term cooling stage, and a final cooling stage, wherein: Initial cooling stage: At the start of cooling, the temperature of the copper block is still relatively high. At this time, the cooling rate is greater than that of the intermediate and final cooling stages, but it is necessary to ensure that the temperature change does not exceed the preset cooling rate. Mid-stage cooling: As the cooling process progresses, the cooling rate should be gradually reduced, less than the initial cooling rate, but greater than the final cooling rate. The specific temperature change control is obtained through experiments. The main purpose is to achieve thermal equilibrium between the copper block and the core board, and to avoid excessive thermal expansion of either side, which could lead to stress. Final cooling stage: This stage is at room temperature, where the temperature difference between the copper block and the core board is very small. The cooling rate at this stage is the lowest of the three stages. The purpose is to ensure that the temperature remains uniform across the entire surface of the copper block and the core board, and to avoid stress or deformation caused by excessively rapid cooling.

[0064] Furthermore, in this embodiment, by acquiring temperature data in real time and automatically adjusting the cooling rate based on the temperature difference changes on the surface of the copper block, the following steps are taken: When new temperature data is collected, it is compared with the set cooling rate target. If the temperature difference exceeds the set range, the system will automatically slow down or speed up the cooling rate to ensure that the temperature difference remains within the predetermined safe range. If the rate of temperature change in a specific area of ​​the copper block exceeds a preset cooling threshold, the cooling rate is reduced by slowing down the flow rate of the cooling medium in that area; conversely, the cooling flow rate is increased to accelerate the temperature reduction.

[0065] Meanwhile, in order to avoid deformation or cracks caused by thermal stress, this embodiment will also monitor and calculate the thermal stress generated during the cooling process; When the temperature difference changes significantly during the cooling process, stress will be generated between the copper block and the core plate. The thermal stress is calculated based on the coefficients of thermal expansion of the copper block and the core plate, as well as the temperature change. ; If the thermal stress exceeds the set allowable stress value, an alarm will be issued to facilitate adjustments by the processing personnel.

[0066] B3. During the cooling process, microwave radiation or infrared heating technology is used to directionally heat specific areas, and the shape changes of the copper block are monitored in real time to ensure that it does not produce irregular deformation. Specifically, the surface of the copper block is monitored by projecting an infrared array, and the acquired monitoring data is compared over time to determine whether the copper block has undergone irregular deformation, including: Infrared array projection: A monitoring array consisting of multiple infrared sensors is projected onto the surface of the copper block, especially in areas where thermal stress concentration may occur (as determined through production experience). Each infrared sensor acquires infrared information reflected from the copper block surface by emitting and receiving infrared signals. This information is used by the infrared sensor array to capture changes in the surface morphology of the copper block in real time.

[0067] Array coverage: The infrared array arrangement should ensure coverage of the entire copper block surface, especially its input and output ends, as well as any areas that may be subjected to significant stress. This arrangement allows for comprehensive monitoring of whether deformation occurs on the copper block surface, rather than being limited to a specific local area.

[0068] Data acquisition and transmission: The infrared array records the intensity of the reflected infrared signals in real time and converts these data into digital signals; the sensors transmit the monitoring data at each time point to the central control system for analysis and processing; these data represent the changes in the reflection intensity of the copper block surface at different time points, and the changes in reflection intensity directly reflect whether the copper block surface has undergone deformation.

[0069] Infrared data time series construction: Data transmitted from the infrared array at different time points are constructed into a time series; the infrared signal intensity at each time point represents the morphological changes on the surface of the copper block; For example, if the infrared signal strength at a certain moment is significantly lower than the signal strength at the previous moment, it may indicate that the region has undergone deformation, resulting in a change in the reflectance intensity.

[0070] Difference Calculation: The difference between two time points is calculated by comparing the changes in infrared signal intensity between adjacent time points; Deformation detection: A preset threshold for the change in reflected signal intensity is used; if the difference exceeds the set threshold, the area is considered to have undergone deformation.

[0071] When infrared array and time series comparative analysis determine that deformation has occurred in a certain area, the processing system activates an automatic feedback mechanism based on this information to adjust the heating process and prevent larger quality problems caused by localized deformation, including: Local deformation recognition: The machining system marks the areas where deformation is detected and records the coordinates of the area and the magnitude of the deformation; through real-time feedback, the deformation of the area will be displayed on the system interface for the operator's reference.

[0072] Heating adjustment: If a certain area is deformed, the processing system automatically adjusts the heating intensity of that area; for example, the processing system will reduce the heating power of the deformed area, or shift the heating focus to the undeformed area, to ensure that the temperature difference is balanced during the cooling process.

[0073] Finally, an analysis report on the deformation of the copper block is generated, including the following: Deformation location and amplitude: Based on the infrared array monitoring results, the processing system marks the specific location of the deformation on the surface of the copper block and calculates the deformation amplitude at each location.

[0074] Time series variation chart: Based on time series comparative analysis, a chart is generated showing the change in reflection intensity before and after deformation; the chart shows the trend of change between various time points, helping operators understand the deformation process.

[0075] Subsequent process adjustment recommendations: Based on the results of deformation testing, the report will provide recommendations for subsequent process adjustments, such as whether the heating temperature or heating time needs to be adjusted, or whether the heating rate needs to be slowed down.

[0076] B4. After heat treatment, a tensile test is used to detect the deformation of the PCB board to ensure that the adhesion strength between the copper block and the core board meets the requirements.

[0077] Specifically, the adhesion between the copper block and the core board is tested by selecting samples and conducting tensile tests. In the tensile test, the adhesion strength between the copper block and the core board is tested by applying gradually increasing tensile force; During the test, the tensile force was gradually increased until the copper block peeled off from the core board; The deformation and adhesion strength during the stretching process will be recorded and analyzed in real time; Deformation amount = (stretched length - initial length) / initial length; Adhesion strength = applied tensile force / contact area between copper block and core board.

[0078] Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

[0079] The above formulas are all dimensionless calculations. The formulas are derived from software simulations based on a large amount of collected data to obtain the most recent real-world results. The preset parameters and thresholds in the formulas are set by those skilled in the art according to the actual situation.

[0080] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention shall still fall within the scope of the present invention.

Claims

1. A method for processing an embedded copper block PCB board, characterized in that, include: Step 1: Process the copper block into the required shape, including the bent input end and output end; Step 2: Process the core board, which serves as the intermediate layer, into a shape that allows the copper block to be embedded. Step 3: Bond the copper block to the core board of the intermediate layer in one step, and use single-sided high-temperature resistant tape and fill the gaps at the nesting points with resin to form a pre-treated hybrid substrate. Step 4: Process the top and bottom single-sided panels into the required shapes; Step 5: Press the top single-sided board and the bottom single-sided board processed in Step 4 onto the upper and lower sides of the hybrid substrate respectively to obtain the embedded copper block PCB board. Step 6: Drill holes in the corresponding positions on the laminated embedded copper block PCB board and plate the holes with copper to create copper-plated holes.

2. The processing method of an embedded copper block PCB board according to claim 1, characterized in that, In step three, two sets of copper blocks are set up, and they are located on both sides of the hybrid substrate respectively; After pretreatment, the two sets of copper blocks are exposed on both sides of the hybrid substrate.

3. The processing method of an embedded copper block PCB board according to claim 2, characterized in that, In step three, when bonding the copper block to the core board, the bonding process is divided into three areas: the central area, the transition area, and the edge area. Pressing is performed step by step to allow the resin to flow in an orderly manner during the bonding process and actively release residual stress, including: S1. Before bonding the copper block to the core board, the bonding area is divided into three different areas, including: Central area: Located in the core area between the copper block and the core board, it is the main starting area for resin flow; Transition zone: Located between the central zone and the edge zone, it serves to smooth the resin flow; Edge region: Located at the outer edge of the copper block, serving as the final pressing area for the closed structure; S2. Press the central area together, applying the pressing force gradually from the middle to the edge of the area. At this point, the filling process of the resin in the central area is gradually completed, and the resin begins to expand to the surrounding transition area during the flow process. S3. Press the edge area, and gradually extend the pressing force from the transition area to the edge area. The resin filling in the edge area is completely compacted, sealing the entire structure. At this point, due to the restriction of resin flow in the edge area, the pressing force and resin filling are gradually increased to ensure that the resin at the edge is uniform and that no voids or excessive outflow are generated. S4. Press the transition zone and apply a preset pressing force to the transition zone so that the resin in the transition zone can smoothly bond with the resin in the center zone and the edge zone, thereby forming a uniformly transitioned pressed structure. S5. After completing all the partitioned pressing steps, proceed to the constant pressure holding stage. During this stage, maintain the preset constant pressure to ensure that the resin flows fully, is evenly distributed, and is completely cured.

4. The processing method of an embedded copper block PCB board according to claim 1, characterized in that, After step five, monitor for any grease overflow on the copper block PCB board in each production cycle, and perform the following steps: A1. Collect grease overflow data of copper block PCB boards in each production cycle and establish a time series of grease overflow data for the corresponding locations. A2. Set a fixed-length time window and divide the time series of seborrhea data using the sliding window method; Each time window contains seborrhea data for several time steps, including information on the location, amount, and number of locations of seborrhea. Furthermore, within each sliding window, cross-feature extraction is used to analyze the relationships between the location of seborrhea, the amount of seborrhea, and the number of locations. A3. Based on the cross-feature extraction results of the grease overflow data in step A2, identify the grease overflow hot spots of the copper block PCB board and make local process adjustments for the corresponding areas.

5. The processing method of an embedded copper block PCB board according to claim 4, characterized in that, The cross-feature extraction in step A2 includes: the ratio of sebum volume to the number of sites, the correlation between sebum volume and sebum frequency, and the ratio of the number of sebum sites to the sebum volume.

6. The processing method of an embedded copper block PCB board according to claim 1, characterized in that, Step three further includes: Z1. Monitor the temperature, pressure, and displacement data of the contact area between the copper block and the core board, and perform standardization processing; Z2. Based on the temperature, pressure and displacement data obtained in Z1, the optimal ratio of tape and resin is calculated in real time to ensure the best bonding quality between the copper block and the core board under different working conditions. The method for obtaining the ratio includes weighted calculation based on temperature, pressure, and displacement data to obtain the optimal ratio of tape to resin; Z3. During the curing process, the temperature, pressure, and time are automatically adjusted based on real-time monitored temperature, pressure, and curing progress data to ensure complete curing of the tape and resin and optimize the bonding effect.

7. The processing method of an embedded copper block PCB board according to claim 1, characterized in that, In step five, the following heat treatment process steps are used to optimize the stability of the laminated copper block PCB board, including: B1. Perform preliminary heating treatment on the copper block PCB board after lamination, control the heating temperature within the predetermined range, and ensure the thermal matching between the copper block and the core board of the intermediate layer. B2. During the heating and cooling process, in order to ensure the thermal expansion matching between the copper block and the core plate, the temperature is reduced at a preset rate to avoid uneven material stress caused by temperature difference changes. B3. During the cooling process, microwave radiation or infrared heating technology is used to directionally heat specific areas, and the shape changes of the copper block are monitored in real time to ensure that it does not produce irregular deformation. B4. After heat treatment, a tensile test is used to detect the deformation of the PCB board to ensure that the adhesion strength between the copper block and the core board meets the requirements.

8. An embedded copper block PCB board, characterized in that, The embedded copper block PCB board is manufactured using any one of the processing methods in claims 1-7.

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