Bonding device and method and storage medium

Abstract

The invention provides a bonding device and method and a storage medium. The bonding device comprises a first camera, a second camera and a controller. The first camera is used for collecting a first image of a first mark located in a first area of a first to-be-bonded piece and a first image of a third mark located in a first area of a second to-be-bonded piece. The second camera is used for collecting a second mark located in a second area of the first to-be-bonded piece and collecting a second image of a fourth mark located in a second area of the second to-be-bonded piece. The controller is configured to determine that the first to-be-bonded piece and the second to-be-bonded piece are aligned in response to the alignment of the first mark and the third mark and the alignment of the second mark and the fourth mark. The method can be used for reducing the requirement of the view field of a single camera, so that the hardware configuration cost is reduced while the optical precision of the camera is improved, and the alignment precision is further improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of semiconductor device processing, and in particular, to a bonding device, a bonding method, and a computer readable storage medium. BACKGROUND

[0002] In the field of high-end manufacturing such as chip packaging, the precise alignment between the chip and the substrate wafer is a core process step that directly affects the yield of the product. At present, there is a scheme in the industry that uses a single camera to align the chip and the substrate wafer. However, if the single camera is to cover the marks on the chip, it needs to have a large enough field of view. However, under the condition that the camera hardware parameters are fixed, the larger the field of view, the lower the pixel density per unit area under the same pixel condition, resulting in a significant decrease in the optical precision of mark positioning, which is difficult to meet the needs of high-precision assembly. In addition, the single camera can only detect marks in a single direction and cannot simultaneously obtain the position information of multiple point marks, which is prone to problems such as misalignment or rotation deviation between chips, seriously affecting the assembly quality.

[0003] In order to overcome the above-mentioned defects existing in the prior art, the technical field urgently needs an improved bonding method for reducing the demand for the field of view of a single camera, thereby improving the optical precision of the camera while reducing the hardware configuration cost, and further improving the alignment accuracy. SUMMARY

[0004] The following presents a simplified summary of one or more aspects in order to provide a basic understanding of such aspects. This summary is not an extensive overview of all contemplated aspects, and is intended to neither identify key or critical elements of all aspects nor delineate the scope of any or all aspects. Its sole purpose is to present some concepts of one or more aspects in a simplified form as a prelude to the more detailed description that is presented later.

[0005] In order to overcome the above-mentioned defects existing in the prior art, the present application provides a bonding device, a bonding method and a computer readable storage medium, which can simultaneously detect multiple marks on two pieces to be bonded by two cameras for alignment, for reducing the demand for the field of view of a single camera, thereby improving the optical precision of the camera while reducing the hardware configuration cost, and further improving the alignment accuracy.

[0006] In particular, the bonding device according to the first aspect of the present application comprises a first camera, a second camera and a controller. The first camera is configured to capture a first image of a first mark on a first region of a first piece to be bonded and a third mark on a first region of a second piece to be bonded. The second camera is configured to capture a second image of a second mark on a second region of the first piece to be bonded and a fourth mark on a second region of the second piece to be bonded. The controller is configured to determine that the first piece to be bonded and the second piece to be bonded are aligned in response to the first mark being aligned with the third mark and the second mark being aligned with the fourth mark.

[0007] Further, in some embodiments of the present application, the field of view of the first camera and the second camera is smaller than the first distance between the first mark and the second mark and smaller than the second distance between the third mark and the fourth mark.

[0008] Further, in some embodiments of the present application, the first mark is located at a first end of the first piece to be bonded. The second mark is located at a second end of the first piece to be bonded opposite to the first end. The third mark is located at a first end of the second piece to be bonded. The fourth mark is located at a second end of the second piece to be bonded opposite to the first end.

[0009] Further, in some embodiments of the present application, the first piece to be bonded comprises a wafer to be bonded. The second piece to be bonded comprises a chip to be bonded. The first camera comprises a first infrared camera and is located at a back surface of the first piece to be bonded for penetrating the first piece to be bonded to capture the first image with the first mark and the third mark. The second camera comprises a second infrared camera and is located at the back surface of the first piece to be bonded for penetrating the first piece to be bonded to capture the second image with the second mark and the fourth mark.

[0010] Further, in some embodiments of the present application, the first piece to be bonded is provided with a plurality of pairs of first marks and a plurality of pairs of second marks. A vertical projection of the third mark is located between the plurality of pairs of first marks. A vertical projection of the fourth mark is located between the plurality of pairs of second marks.

[0011] Further, in some embodiments of the present application, the controller is further configured to determine a first deviation between the first bonding target and the second bonding target according to a difference between a distance between each of the third marks and its adjacent first mark, determine a second deviation between the first bonding target and the second bonding target according to a difference between a distance between each of the fourth marks and its adjacent second mark, and determine that no deflection occurs between the first bonding target and the second bonding target in response to the first deviation being equal to the second deviation.

[0012] Further, in some embodiments of the present application, the controller is further configured to determine a first deviation between the first bonding target and the second bonding target according to a difference between a distance between each of the third marks and its adjacent first mark, determine a second deviation between the first bonding target and the second bonding target according to a difference between a distance between each of the fourth marks and its adjacent second mark, and determine that no deflection occurs between the first bonding target and the second bonding target in response to the first deviation being equal to the second deviation.

[0013] Further, in some embodiments of the present application, the bonding device further comprises a chuck and a motion assembly. The chuck is configured to hold the first bonding target. The motion assembly is connected to the chuck and configured to control the chuck to translate and rotate so as to align the second bonding target with the first bonding target.

[0014] Further, in some embodiments of the present application, the bonding device further comprises an infrared light source. The chuck is a transparent chuck, and the infrared light source is configured to project a detection light through the transparent chuck to an imaging surface of the first camera and the second camera.

[0015] Further, in some embodiments of the present application, the bonding device further comprises a bonding head configured to bond the first bonding target to the second bonding target in response to the first bonding target and the second bonding target being aligned.

[0016] Further, the bonding method according to the second aspect of the present application comprises the following steps: capturing, via the first camera of the bonding device according to the first aspect of the present application, a first image of the first marks located on the first region of the first bonding target and the third marks located on the first region of the second bonding target; capturing, via the second camera, a second image of the second marks located on the second region of the first bonding target and the fourth marks located on the second region of the second bonding target; and determining that the first bonding target and the second bonding target are aligned in response to the first marks being aligned with the third marks and the second marks being aligned with the fourth marks.

[0017] Further, the computer readable storage medium according to the third aspect of the present application has computer instructions stored thereon. The computer instructions, when executed by a controller, implement the bonding method according to the first aspect of the present application. BRIEF DESCRIPTION OF DRAWINGS

[0018] The above features and advantages of the present application will be better understood by reading the detailed description of the embodiments of the present application in conjunction with the drawings, in which:

[0019] Figure 1 A structural schematic diagram of a bonding device according to some embodiments of the present application is shown.

[0020] Figure 2 A schematic diagram of a first mark and a second mark according to some embodiments of the present application is shown.

[0021] Figure 3 A schematic diagram of a third mark and a fourth mark according to some embodiments of the present application is shown.

[0022] Figure 4 A schematic diagram of a principle of mark alignment according to some embodiments of the present application is shown.

[0023] Figure 5 A flowchart of a bonding method according to some embodiments of the present application is shown.

[0024] Figure 6 A schematic diagram of an initial state according to some embodiments of the present application is shown. DETAILED DESCRIPTION

[0025] The specific embodiments of the present application will be described in the following detailed description, which should be taken in conjunction with the accompanying drawings. While the description will focus on preferred embodiments of the application, it will be understood that the application is not limited to such embodiments. Rather, the present application is intended to cover all alternatives, modifications, and equivalents falling within the scope of the claims based on the present application. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present application. The present application can be practiced without the specific details. In other instances, well-known methods, procedures, components, and circuits have not been described in detail since not pertinent to the knowledge of the present application. Furthermore, the description can omit certain features in order not to obscure the general nature of the present application.

[0026] In the description of the present application, it is to be understood that the terms "mounting", "connected", "connecting" should be interpreted broadly, for example, can be fixed connection, can also be detachable connection, or integrally connected; can be mechanical connection, can also be electrical connection; can be directly connected, can also be indirectly connected through an intermediate medium, can be the internal communication of two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0027] In addition, "upper", "lower", "left", "right", "top", "bottom", "horizontal", "vertical" used in the following description and shown in the drawings should be understood as the orientation shown in the drawing and relative to the article being described. These relative terms are used only to facilitate the description of the application and are not intended to limit the application to a particular orientation of the article being described.

[0028] It is to be understood that, although the terms "first", "second", "third", etc. can be used herein to describe various components, regions, layers and / or sections, these components, regions, layers and / or sections should not be limited by these terms. These terms are only used to distinguish one component, region, layer or section from another. Therefore, the first component, region, layer and / or section discussed below can be referred to as the second component, region, layer and / or section without departing from some embodiments of the application.

[0029] As described above, a single camera needs to have a large enough field of view to cover the marks on the chip, but in the case of fixed camera hardware parameters, the larger the field of view, the lower the pixel density per unit area under the same pixel conditions, resulting in a significant decrease in optical accuracy of mark positioning, making it difficult to meet the needs of high-precision assembly. In addition, a single camera can only detect marks in a single direction and cannot simultaneously obtain position information of multiple point marks, which can easily cause misalignment or rotation deviation between chips, seriously affecting assembly quality.

[0030] In order to overcome the above-mentioned defects of the prior art, the present application provides a bonding device, a bonding method and a computer readable storage medium, which can simultaneously detect multiple marks on two pieces to be bonded by two cameras for alignment, thereby reducing the need for a single camera to have a large field of view, thereby improving the optical accuracy of the camera while reducing the hardware configuration cost, and further improving the alignment accuracy.

[0031] In some non-limiting embodiments, the above-mentioned bonding device provided by the first aspect of the present application can be implemented based on the above-mentioned bonding method provided by the second aspect of the present application.

[0032] Reference is made to Figure 1 . Reference is made to Figure 1 The structure of the bonding device provided by some embodiments of the present application is shown.

[0033] In Figure 1In the illustrated embodiment, the bonding device provided by the first aspect of the present application comprises a first camera 11, a second camera 12 and a controller. Here, the first camera 11 is configured to capture a first image of a first mark located at a first region of a first piece 13 to be bonded and a third mark located at a first region of a second piece 14 to be bonded. The second camera 12 is configured to capture a second image of a second mark located at a second region of the first piece 13 to be bonded and a fourth mark located at a second region of the second piece 14 to be bonded.

[0034] Further, in Figure 1 In the illustrated embodiment, the field of view of the first camera 11 and the second camera 12 is smaller than the first distance between the first mark and the second mark and smaller than the second distance between the third mark and the fourth mark.

[0035] In this way, the bonding device provided by the first aspect of the present application can reduce the field of view of the first camera 11 and the second camera 12 by arranging two cameras to cover the first regions of the first piece 13 to be bonded and the second piece 14 to be bonded and the second regions of the first piece 13 to be bonded and the second piece 14 to be bonded, thereby improving the optical accuracy of the cameras while reducing the hardware configuration cost and further improving the alignment accuracy of the first piece 13 to be bonded and the second piece 14 to be bonded.

[0036] In addition, in some preferred embodiments, the first mark is located at a first end of the first piece 13 to be bonded. The second mark is located at a second end of the first piece 13 to be bonded opposite to the first end.

[0037] Similarly, the third mark is located at a first end of the second piece 14 to be bonded. The fourth mark is located at a second end of the second piece 14 to be bonded opposite to the first end.

[0038] In this way, the bonding device provided by the first aspect of the present application can determine whether the first piece 13 to be bonded and the second piece 14 to be bonded are misaligned or deviated in rotation by arranging two cameras to detect the marks located at the two ends of the first piece 13 to be bonded and the second piece 14 to be bonded. Only when the two pairs of marks are aligned, the first piece 13 to be bonded and the second piece 14 to be bonded will not be misaligned or deviated in rotation, thereby further improving the alignment accuracy of the first piece 13 to be bonded and the second piece 14 to be bonded.

[0039] Further, in Figure 1 In the illustrated embodiment, the first piece 13 to be bonded comprises a wafer to be bonded and the second piece 14 to be bonded comprises a chip to be bonded. Here, the first camera 11 comprises a first infrared camera and is located at the back of the first piece 13 to be bonded, configured to penetrate the first piece 13 to be bonded to capture the first image of the first mark and the third mark.

[0040] Similarly, the second camera 12 comprises a second infrared camera and is located on the back of the first object 13 for penetrating the first object 13 to capture a second image with the second mark and the fourth mark.

[0041] Reference will be made to Figures 2-4 . Figure 2 A schematic diagram of the first mark and the second mark is shown according to some embodiments of the present application. Figure 3 A schematic diagram of the third mark and the fourth mark is shown according to some embodiments of the present application. Figure 4 A schematic diagram of the mark alignment is shown according to some embodiments of the present application.

[0042] In Figure 2 the shown embodiment, the surface of the first object 13 is provided with a plurality of pairs of first marks and a plurality of pairs of second marks. Figure 3 In the shown embodiment, the surface of the second object 14 is provided with a third mark and a fourth mark.

[0043] As Figure 4 shown, the vertical projection of the third mark is located between the plurality of first marks, and the vertical projection of the fourth mark is located between the plurality of second marks.

[0044] In addition, in Figure 1 the shown embodiment, the above bonding device provided by the first aspect of the present application further comprises a suction disc 15 and a motion assembly. Here, the suction disc 15 is used to adsorb the first object 13. The motion assembly is connected to the suction disc 15 for controlling the translation and rotation of the suction disc 15 to align the second object 14 with the first object 13.

[0045] In addition, in Figure 1 the shown embodiment, the above bonding device provided by the first aspect of the present application further comprises an infrared light source 16. Here, the suction disc 15 is a transparent suction disc, and the detection light of the infrared light source 16 is transmitted through the suction disc 15 to the imaging surface of the first camera 11 and the second camera 12.

[0046] In addition, in Figure 1 the shown embodiment, the above bonding device provided by the first aspect of the present application further comprises a bonding head 17 for bonding the first object 13 to the second object 14 in response to the alignment of the first object 13 and the second object 14.

[0047] Further, the above second object 14 is attached to a film 18. Here, the film 18 is preferably a UV (Ultraviolet Curing) film, which is irradiated by ultraviolet light to reduce the adhesion.

[0048] Those skilled in the art can understand that,Figure 1 The embodiment shown, in which the first camera 11 and the second camera 12 are disposed on the back of the first component to be bonded 13 and the first component to be bonded 13 and the second component to be bonded 14 are imaged through the suction cup via the infrared light source 16, is only a few non-limiting implementations provided by the present invention. It is intended to clearly demonstrate the main concept of the present invention and provide some specific solutions that are easy for the public to implement, rather than to limit the scope of protection of the present invention.

[0049] Alternatively, in other embodiments, those skilled in the art may also place the first camera 11, the second camera 12 and the light source on the front side of the first component to be bonded 13, and allow the light source to penetrate the film 18 to image the first component to be bonded 13 and the second component to be bonded 14.

[0050] Furthermore, in some non-limiting embodiments, the bonding apparatus provided in the first aspect of the present invention includes a memory and a controller. Here, the memory includes, but is not limited to, the computer-readable storage medium provided in the third aspect, on which computer instructions are stored. The controller is connected to the memory and configured to execute the computer instructions stored in the memory to implement the bonding method as provided in the first aspect of the present invention.

[0051] Please refer to Figure 5 . Figure 5 A schematic flowchart of a bonding method provided according to some embodiments of the present invention is shown.

[0052] like Figure 5 As shown, the bonding apparatus provided in the first aspect of the present invention can first acquire a first image of a first mark located in a first region of a first component to be bonded 13 and a third mark located in a first region of a second component to be bonded 14 via a first camera 11.

[0053] Subsequently, the bonding device can then use the second camera 12 to capture a second image of a second mark located in a second region of the first component to be bonded 13, and a second image of a fourth mark located in a second region of the second component to be bonded 14.

[0054] Please refer to Figure 6 . Figure 6 A schematic diagram of an initial state provided according to some embodiments of the present invention is shown.

[0055] In addition, such as Figure 6 As shown, before acquiring the first and second images, the bonding device can first send the first bonding component 13 and the second bonding component 14 to the initial position via the motion component, and directly lift the film 18 directly via the bonding head. At this time, a certain amount of gap is left between the second bonding component 14 and the first bonding component 13.

[0056] Afterwards, in response to the first mark aligning with the third mark, the bonding device can determine that the first bonding piece 13 and the second bonding piece 14 are aligned.

[0057] Specifically, please continue to refer to Figure 4 . As shown in Figure 4 , in the process of determining whether the first bonding piece 13 and the second bonding piece 14 are aligned, the bonding device can determine, via the controller, a first deviation of the first bonding piece 13 and the second bonding piece 14 according to the difference between the interval of each third mark to its adjacent first mark, and determine a second deviation of the first bonding piece 13 and the second bonding piece 14 according to the difference between the interval of each fourth mark to its adjacent second mark.

[0058] Afterwards, in response to the first deviation being equal to the second deviation, the controller can determine that no deflection occurs between the first bonding piece 13 and the second bonding piece 14.

[0059] Afterwards, the bonding device can translate, via the motion assembly, the second bonding piece 14 according to the first deviation and the second deviation, so as to align the second bonding piece 14 with the first bonding piece 13.

[0060] Alternatively, in some embodiments, in response to the first deviation being not equal to the second deviation, the controller can also determine that deflection occurs between the first bonding piece and the second bonding piece.

[0061] Afterwards, the bonding device can rotate, via the motion assembly, the second bonding piece 14, so as to make the second bonding piece 14 parallel to the first bonding piece 13.

[0062] Afterwards, the bonding device can translate, via the motion assembly, the second bonding piece 14 according to the first deviation and the second deviation, so as to align the second bonding piece 14 with the first bonding piece 13.

[0063] Afterwards, in response to the first bonding piece 13 and the second bonding piece 14 being aligned, the bonding device can bond, via the bonding head 17, the first bonding piece 13 to the second bonding piece 14.

[0064] In summary, the above bonding device, bonding method and computer readable storage medium provided by the present application can simultaneously detect multiple marks on two bonding pieces by two cameras for alignment, which can reduce the requirement for the field of view range of a single camera, thereby improving the optical precision of the camera while reducing the hardware configuration cost, further improving the alignment precision, and avoiding deflection between the two bonding pieces when a single camera aligns the marks, which affects the bonding precision.

[0065] Although the above-described methods are illustrated and described as a series of actions, it is to be understood and appreciated that the methods are not limited by the order of actions, as some actions can, in accordance with one or more embodiments, occur in different orders and / or concurrently with other actions from that illustrated and described herein or in an order that is not illustrated and described herein but that is appreciated and / or understood by one skilled in the art.

[0066] The steps of a method or algorithm described in connection with the embodiments disclosed herein can be embodied directly in hardware, in a software module executed by a processor, or in a combination of the two. A software module can reside in RAM memory, flash memory, ROM memory, EPROM memory, EEPROM memory, registers, hard disk, a removable disk, a CD-ROM, or any other form of storage medium known in the art. An exemplary storage medium is coupled to the processor such that the processor can read information from, and write information to, the storage medium. In the alternative, the storage medium can be integral to the processor. The processor and the storage medium can reside in an ASIC. The ASIC can reside in a user terminal. In the alternative, the processor and the storage medium can reside as discrete components in a user terminal.

[0067] In one or more exemplary embodiments, the functions described can be implemented in hardware, software, firmware, or any combination thereof. If implemented in software as a computer program product, the functions can be stored on or transmitted over as one or more instructions or code on a computer-readable medium. Computer-readable media includes both computer storage media and communication media including any medium that facilitates transfer of a computer program from one place to another. A storage media can be any available media that can be accessed by a computer. By way of example, and not limitation, such computer-readable media can comprise RAM, ROM, EEPROM, CD-ROM or other optical disk storage, magnetic disk storage or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of instructions or data structures and that can be accessed by a computer. Also, any connection is properly termed a computer-readable medium. For example, if the software is transmitted from a website, server, or other remote source using a coaxial cable, fiber optic cable, twisted pair, digital subscriber line (DSL), or wireless technologies such as infrared, radio, and microwave, then the coaxial cable, fiber optic cable, twisted pair, DSL, or wireless technologies such as infrared, radio, and microwave are included in the definition of medium. Disk and disc, as used herein, include compact disc (CD), laser disc, optical disc, digital versatile disc (DVD), floppy disk and Blu-ray® disc where disks usually reproduce data magnetically, while discs reproduce data optically with lasers. Combinations of the above should also be included within the scope of computer-readable media.

[0068] The previous description of the disclosure is provided to enable any person skilled in the art to make or use the disclosure. Modifications to various implementations of the disclosure will be apparent to those skilled in the art, and the instant disclosure is intended to include all such modifications that are within its spirit and scope. Thus, the disclosure is not intended to be limited to the examples described herein and the person of ordinary skill in the art will be able to devise alterations and variations that are within the scope of the disclosure as defined by the claims.

Claims

1. A bonding device, characterized in that, include: A first camera is used to acquire first images of a first mark located in a first region of a first component to be bonded, and a third mark located in a first region of a second component to be bonded; The second camera is used to capture a second mark located in the second region of the first component to be bonded, and to capture a second image of a fourth mark located in the second region of the second component to be bonded; as well as The controller is configured to determine that the first bonding element and the second bonding element are aligned in response to the alignment of the first mark with the third mark and the alignment of the second mark with the fourth mark.

2. The bonding apparatus as claimed in claim 1, characterized in that, The field of view of the first camera and the second camera is smaller than the first distance between the first mark and the second mark, and smaller than the second distance between the third mark and the fourth mark.

3. The bonding apparatus as described in claim 1, characterized in that, The first mark is located at a first end of the first component to be bonded, and the second mark is located at a second end of the first component to be bonded opposite to the first end. The third mark is located at the first end of the second component to be bonded, and the fourth mark is located at the second end of the second component to be bonded, opposite to the first end.

4. The bonding apparatus as claimed in claim 1, characterized in that, The first bonding component includes a wafer to be bonded, and the second bonding component includes a chip to be bonded, wherein... The first camera includes a first infrared camera and is located on the back of the first component to be bonded, for penetrating the first component to be bonded to acquire a first image with the first mark and the third mark. The second camera includes a second infrared camera and is located on the back of the first component to be bonded, for penetrating the first component to be bonded to acquire a second image with the second mark and the fourth mark.

5. The bonding apparatus as described in claim 4, characterized in that, The surface of the first component to be bonded is provided with a plurality of paired first marks and a plurality of paired second marks, wherein the vertical projection of the third mark is located between the plurality of first marks, and the vertical projection of the fourth mark is located between the plurality of second marks.

6. The bonding apparatus as described in claim 5, characterized in that, The controller is also configured to: The first deviation between the first component to be bonded and the second component to be bonded is determined based on the difference in the distance between each of the third marks and each of the adjacent first marks; Based on the difference in spacing between each of the fourth marks and each of its adjacent second marks, a second deviation between the first component to be bonded and the second component to be bonded is determined; and In response to the first deviation being equal to the second deviation, it is determined that no deflection has occurred between the first component to be bonded and the second component to be bonded.

7. The bonding apparatus as claimed in claim 6, characterized in that, The controller is further configured to: In response to the fact that the first deviation and the second deviation are not equal, it is determined that a deflection has occurred between the first component to be bonded and the second component to be bonded.

8. The bonding apparatus as claimed in claim 1, characterized in that, Also includes: The suction cup adsorbs the first component to be bonded; as well as A motion component, connected to the suction cup, is used to control the translation and rotation of the suction cup so that the second component to be bonded is aligned with the first component to be bonded.

9. The bonding apparatus as claimed in claim 8, characterized in that, The bonding device further includes an infrared light source, wherein the suction cup is a transparent suction cup, so that the detection light of the infrared light source is projected onto the imaging surfaces of the first camera and the second camera through the suction cup.

10. The bonding apparatus as claimed in claim 1, characterized in that, Also includes: The bonding head, in response to the alignment of the first bonding member and the second bonding member, bonds the first bonding member to the second bonding member.

11. A bonding method, characterized in that, Includes the following steps: The bonding apparatus as described in any one of claims 1 to 10 acquires a first image of a first mark located in a first region of a first component to be bonded and a first image of a third mark located in a first region of a second component to be bonded. A second image of a second mark located in a second region of the first component to be bonded is acquired via a second camera, and a second image of a fourth mark located in a second region of the second component to be bonded is acquired. as well as In response to the alignment of the first mark with the third mark and the alignment of the second mark with the fourth mark, it is determined that the first component to be bonded and the second component to be bonded are aligned.

12. A computer-readable storage medium storing computer instructions thereon, characterized in that, When the computer instructions are executed by the controller, the bonding method as described in claim 11 is implemented.

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