Lead frame and current sensor

Abstract

The invention provides a lead frame and a current sensor. The lead frame comprises a base island and at least two primary side pins, the base island comprises a first part and a second part, the first part and the second part are arranged in the second direction, and the first part protrudes out of the second part in the first direction; the second part extends along the first direction on at least one side of the first direction to form an extension part; the size of the extension portion in the first direction is in a decreasing trend along the second direction and away from the direction of the first portion. And the at least two primary side pins are connected with the end part, deviating from the second part, of the first part and are arranged at intervals along the first direction. The impedance of the lead frame can be reduced, and the current range of the current sensor is improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of semiconductor technology, and in particular to a lead frame and a current sensor. BACKGROUND

[0002] As a key component in modern electrical systems, the current sensor converts the current signal into a measurable electrical signal output, and is widely used in new energy vehicles, industrial automation, smart grids, household appliances, aerospace, etc.

[0003] In related technologies, the current sensor usually adopts a lead frame as a current path and a mechanical support structure. The base island of the lead frame is not only used to fix the sensor die (such as a Hall element), but also connected with the primary pin to form an input loop of the measured current.

[0004] However, the current lead frame has a large impedance, which further causes a small current range of the current sensor. SUMMARY

[0005] In view of the above problems, embodiments of the present application provide a lead frame and a current sensor, which can reduce the impedance of the lead frame and improve the current range of the current sensor.

[0006] To achieve the above purpose, embodiments of the present application provide the following technical solutions:

[0007] In a first aspect, the present application provides a lead frame, comprising:

[0008] a base island, the base island comprising a first part and a second part, the first part and the second part are arranged along a second direction, and the first part protrudes from the second part along a first direction; the second part extends along the first direction on at least one side of the first direction to form an extension; wherein the size of the extension in the first direction along the second direction and away from the first part direction shows a decreasing trend, and the first direction and the second direction intersect;

[0009] at least two primary pins, the at least two primary pins are connected with the end of the first part away from the second part, and are arranged at intervals along the first direction.

[0010] In a possible implementation, the number of the extension includes two, and the two extensions are respectively located on both sides of the second part along the first direction;

[0011] and the size of the extension in the first direction along the second direction and away from the first part direction shows a gradually decreasing trend.

[0012] In a possible implementation, the base island is further provided with a first slot and a second slot, the first slot and the second slot are arranged in the second direction,

[0013] The first slot penetrates the second part in a direction away from the first part, and the second slot penetrates the first part in a direction away from the second part, and communicates with the area between the two adjacent original edge pins.

[0014] In a possible implementation, the first slot has a first slot wall in the shape of a circular arc, and the second slot has a second slot wall in the shape of a circular arc, and the first slot wall and the second slot wall are arranged opposite to each other in the second direction.

[0015] In a possible implementation, the first slot includes a first segment and a second segment in communication with each other, the first segment has a cross-sectional shape in the shape of a circular arc, the second segment has a cross-sectional shape in the shape of a rectangle, and a slot wall of the first segment away from the second segment constitutes the first slot wall.

[0016] The second slot includes a third segment, a fourth segment and a fifth segment in communication with each other, the third segment is adjacent to the first segment, the third segment has a cross-sectional shape in the shape of a circular arc, and a slot wall of the third segment toward the first segment constitutes the second slot wall, the fourth segment and the fifth segment have cross-sectional shapes in the shape of a rectangle, and a size of the fourth segment in the first direction is different from a size of the fifth segment in the first direction.

[0017] In a possible implementation, the second segment of the first slot has a size in the first direction equal to a thickness of the base island.

[0018] In a possible implementation, a gap is formed between the first part and the original edge pin.

[0019] In a possible implementation, the lead frame further includes a secondary edge pin arranged on a side of the base island away from the original edge pin, for electrical connection with a die.

[0020] In a second aspect, the embodiments of the present application provide a current sensor, including an insulating member, a die, and the lead frame of the first aspect.

[0021] The insulating member is arranged on the lead frame, and a normal projection of the insulating member on a plane in which the lead frame is located covers at least a part of the first slot, a part of the second slot, and an area between the first slot and the second slot.

[0022] The die is disposed on the insulating component, and the die includes two Hall devices, one of which has its orthographic projection on the plane of the lead frame located in the first slot, and the other of which has its orthographic projection on the plane of the lead frame located in the second slot.

[0023] In one possible implementation, the current sensor further includes a molding compound and a support member, the molding compound encapsulating the insulator, the die, and a portion of the lead frame, such that portions of the primary and secondary leads of the lead frame are exposed; the molding compound includes a first surface opposite to a first portion of the lead frame in a first direction, the distance between the first surface and the first portion being greater than the thickness of the lead frame;

[0024] The support member passes through the plastic encapsulation and is opposite to the second part of the lead frame, and the minimum distance between the support member and the second part is greater than or equal to the creepage distance.

[0025] In the lead frame and current sensor provided in this application embodiment, by extending the second part with a smaller cross-sectional area along the first direction to form an extension, the cross-sectional area of ​​the lead frame relative to the second part is increased through the extension. In this way, when the current enters the base island through one of the primary side pins and is transmitted, the current can flow in the additionally provided extension. This allows the base island to have a wider current conduction path, which helps to reduce the impedance of the base island, thereby reducing the heat generation of the lead frame and preventing the heat generation from exceeding the heat resistance temperature of the current sensor die, thus increasing the current range of the current sensor.

[0026] Furthermore, the edge of the extension away from the second part is inclined relative to the second direction, which makes the base island present a trapezoidal structure, so as to ensure that there is sufficient creepage distance between the extension and other conductive parts of the current sensor to meet the packaging withstand voltage requirements.

[0027] In addition to the technical problems solved by the embodiments of this application, the technical features constituting the technical solutions, and the beneficial effects brought about by the technical features of these technical solutions described above, other technical problems that can be solved by the lead frame and current sensor provided by the embodiments of this application, other technical features included in the technical solutions, and the beneficial effects brought about by these technical features will be further explained in detail in the specific implementation. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 A schematic diagram of the lead frame provided in an embodiment of this application;

[0030] Figure 2 A perspective view of the current sensor provided in an embodiment of this application;

[0031] Figure 3 This is a partial schematic diagram of a current sensor provided in an embodiment of this application;

[0032] Figure 4 The curve showing the change in magnetic gain of the lead frame provided in the application embodiment.

[0033] Explanation of reference numerals in the attached figures:

[0034] 10: Lead frame;

[0035] 100: Base island; 110: First part; 120: Second part; 130: Extension; 140: First slot; 141: First slot wall; 142: First section; 143: Second section;

[0036] 150: Second slot opening; 151: Second slot wall; 152: Third section; 153: Fourth section; 154: Fifth section;

[0037] 200: Primary-side pin;

[0038] 300: Gap;

[0039] 400: Secondary side pin;

[0040] 20: Insulating components;

[0041] 30: Die; 31: Hall effect device;

[0042] 40: Support component. Detailed Implementation

[0043] As described in the background section, current lead frames have high impedance, resulting in a small current range for the current sensor. The inventors discovered that this problem arises because the current lead frame has a shape resembling a "convex" shape, and slots are provided in the smaller cross-sectional area of ​​the lead frame to accommodate the current sensor die in the area opposite the slots. This results in a narrow current path when current flows through the portion of the lead frame corresponding to the current sensor die, increasing the impedance of the lead frame. Consequently, the heat generated by the lead frame increases, potentially exceeding the heat resistance temperature of the Hall effect device. Therefore, it is necessary to reduce the current of the lead frame, thus reducing the current range of the current sensor.

[0044] To address the aforementioned technical problems, this application provides a lead frame and a current sensor. By extending a smaller second portion along a first direction to form an extension, the cross-sectional area of ​​the lead frame relative to the second portion is increased through the extension. In this way, when current enters the base island through one of the primary pins and is transmitted, the current can flow in the additionally provided extension. This allows the base island to have a wider current conduction path, which helps to reduce the impedance of the base island, thereby reducing the heat generation of the lead frame and preventing the heat generation from exceeding the heat resistance temperature of the current sensor die. This, in turn, can increase the current range of the current sensor.

[0045] Furthermore, the edge of the extension away from the second part is inclined relative to the second direction, which makes the base island present a trapezoidal structure, so as to ensure that there is sufficient creepage distance between the extension and other conductive parts of the current sensor to meet the packaging withstand voltage requirements.

[0046] To make the above-mentioned objectives, features, and advantages of the embodiments of this application more apparent and understandable, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of them. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0047] Please refer to Figure 1 This application provides a lead frame 10, which can be applied to a current sensor to provide a current flow path.

[0048] The lead frame 10 includes a base island 100, which serves as the main component of the lead frame and provides a mounting carrier for some components of the current sensor.

[0049] The base island 100 includes a first portion 110 and a second portion 120. It should be understood that the base island 100 is typically integrally formed; therefore, the first portion 110 and the second portion 120 simply divide different regions of the base island 100. The first portion 110 and the second portion 120 are arranged along a second direction, and the first portion 110 protrudes from the second portion 120 along a first direction, forming a U-shaped structure. In this embodiment, the first direction and the second direction intersect.

[0050] The second portion 120 extends along at least one side of the first direction to form an extension 130. In other words, the second portion 120 has a first end and a second end disposed opposite each other in the first direction, and at least one of the first end and the second end extends along the first direction and away from the second portion 120 to form the extension 130. This increases the size of the second portion 120 in the first direction. In this embodiment, the first direction and the second direction intersect, and the shape of the base island 100 is trapezoidal. The first direction can be the length direction of the base island 100, i.e. Figure 1 The first direction is the X-direction. The second direction can be the width direction of the base island 100, i.e. Figure 1 Center Y direction.

[0051] The lead frame 10 also includes at least two primary side pins 200, which are connected to the end of the first portion 110 away from the second portion 120 and are spaced apart along a first direction.

[0052] It should be noted that, please refer to Figure 2 and Figure 3 The current sensor die 30 is mounted on the second part 120.

[0053] When current is applied through the primary pin 200, the current flows through the first portion 110 of the base island 100 and then through the second portion 120. The die 30 is used to detect the current and form a magnetic field at the second portion 120. Given that in this embodiment, the second portion 120 extends along at least one side of the first direction to form an extension 130, compared to the single second portion 120, the sum of the dimensions of the extension 130 and the second portion 120 in the first direction is greater than the single second portion 120 in the first direction. This is equivalent to widening a portion of the base island 100, allowing current to flow through the additionally provided extension 130. This provides a wider current conduction path for the base island 100, which helps reduce the impedance of the base island 100, thereby reducing the heat generation of the lead frame 10 and preventing the heat generation from exceeding the heat resistance temperature of the current sensor die. This, in turn, increases the current range of the current sensor.

[0054] Please continue to refer to this. Figure 1The extension 130 is inclined relative to the second direction at its edge away from the second portion 120, and the dimension of the extension 130 in the first direction decreases along the second direction away from the first portion 110. Alternatively, the edge of the extension 130 away from the second portion 120 has a first endpoint and a second endpoint. The first endpoint is connected to the first portion 110, and the second endpoint is located between the first endpoint and the axis of the base island 100 extending along the second direction. This allows the base island 100 to have a trapezoidal structure, ensuring sufficient creepage distance between the extension 130 and other conductive components of the current sensor to meet the packaging withstand voltage requirements.

[0055] In some embodiments, the number of extensions 130 includes two, with the two extensions 130 located on both sides of the second portion 120 along the first direction. That is, the second portion 120 extends along the first direction on both sides. The two extensions 130 are symmetrically arranged with respect to the axis of the base island 100 along the second direction. This balances the stress on the lead frame 10, preventing deformation or breakage caused by stress concentration on one side. Furthermore, the primary current can be conducted in parallel through the two extensions 130, which helps reduce the impedance of the base island 100. This reduces the heat generation of the lead frame, preventing the heat generation from exceeding the heat resistance temperature of the current sensor die, thereby increasing the current range of the current sensor.

[0056] It should be noted that the dimension of the extension 130 in the first direction decreases along the second direction and away from the first part 110. Whether it decreases gradually or decreases overall is acceptable as long as sufficient creepage distance is ensured.

[0057] For example, the dimension of the extension 130 in the first direction gradually decreases along the second direction away from the first portion. Alternatively, the shape of the extension 130 can be triangular. In this way, while satisfying the requirements of reducing the impedance of the base island 100 and increasing the current range of the current sensor, sufficient creepage distance can also be ensured between the extension and other conductive parts of the current sensor to meet the requirements of the package withstand voltage.

[0058] In some embodiments, the base island 100 is further provided with a first slot 140 and a second slot 150, which are spaced apart along a second direction. Alternatively, the first slot 140 is provided on the second portion 120, and the second slot 150 is provided on the first portion 110.

[0059] The first slot 140 penetrates the second part 120 in a direction away from the first part 110, and the second slot 150 penetrates the first part 110 in a direction away from the second part 120, and is interconnected with the area between the two adjacent primary edge pins 200.

[0060] When the lead frame is applied to a current sensor, the orthographic projection of one of the two Hall devices on the die is located within the first slot 140 on the plane of the lead frame 10, and the orthographic projection of the other Hall device is located within the second slot 150 on the plane of the lead frame 10.

[0061] In this embodiment, by setting a first slot 140 and a second slot 150 on the base island 100 and rationally planning their through-path and connection with the primary side pin 200, when the current sensor is working, the magnetic field generated by the current flowing through a specific area can be effectively guided into the first slot 140 and the second slot 150. This allows the two Hall devices of the die to detect the magnetic field more directly and accurately, reducing the influence of external interference on the detection results, thereby improving the accuracy and stability of the current sensor detection.

[0062] It should be noted that the shortest distance between the first slot 140 and the second slot 150 in the second direction can be determined based on the structure and manufacturing error of the two Hall devices.

[0063] In some embodiments, the first slot 140 has an arc-shaped first slot wall 141, and the second slot 150 has an arc-shaped second slot wall 151, with the first slot wall 141 and the second slot wall 151 disposed opposite to each other in a second direction. Alternatively, the first slot wall 141 is the wall surface of the first slot 140 away from its opening, and the second slot wall 151 is the wall surface of the second slot 150 away from its opening.

[0064] During the flow of current in the base island 100, its flow path is similar to an arc. In this embodiment, by setting both the first groove wall 141 and the second groove wall 151 to be arc-shaped, it is closer to the current flow path. Compared with rectangular groove walls, arc-shaped groove walls have a shorter flow path, which is beneficial to reduce the impedance of the lead frame base island, thereby reducing the heat generation of the lead frame and preventing the heat generation from exceeding the heat resistance temperature of the current sensor die, thus increasing the current range of the current sensor.

[0065] This application embodiment also tests the performance of a current sensor, wherein the impedance of the arc-shaped slot lead frame is reduced by 10uΩ compared to the impedance of the square slot lead frame in related technologies. Meanwhile, the on-resistance of the lead frame 10 involved in this application embodiment is less than 0.15mΩ, and it can be used to detect a maximum current of 150A.

[0066] Please continue to refer to this.Figure 1 The first slot 140 includes a first segment 142 and a second segment 143 that are interconnected. The cross-sectional shape of the first segment 142 is arc-shaped, and the cross-sectional shape of the second segment 143 is rectangular. The slot wall of the first segment 142 facing away from the slot wall of the second segment 143 forms the first slot wall 141. It should be noted that when the area of ​​the first segment 142 increases, the cross-sectional shape of the first segment 142 can also be semi-circular.

[0067] The second slot 150 includes three interconnected segments: a third segment 152, a fourth segment 153, and a fifth segment 154. The third segment 152 is adjacent to the first segment 142, and its cross-sectional shape is arc-shaped. The slot wall of the third segment 152 facing the first segment 142 forms the second slot wall 151. The cross-sectional shapes of the fourth segment 153 and the fifth segment 154 are both rectangular, and the dimensions of the fourth segment 153 and the fifth segment 154 in the first direction are not equal. For example, the dimension of the fourth segment 153 in the first direction is smaller than the dimension of the fifth segment 154 in the first direction. It should be noted that the cross-sectional shape of the third segment 152 can also be semi-circular.

[0068] The embodiments of this application, through the arrangement of the second segment 143, the fourth segment 153, and the fifth segment 154, ensure that the current can flow along the arc of the first groove wall 141 and the second groove wall 151 without excessively increasing the first segment 142 and the third segment 152. This ensures the safe creepage distance between the base island 100 and other conductors, improves the safety performance of the current sensor, and reduces the probability of electrical faults and safety hazards.

[0069] Please continue to refer to this. Figure 1 The second segment 143 of the first slot 140 has a dimension in the first direction equal to the thickness of the base island 100. This avoids excessively increasing the dimension of the second segment 143 of the first slot 140 in the first direction, making the slot structure more stable, enhancing the overall structural strength of the base island, and ensuring the reliability and stability of the current sensor during long-term use.

[0070] In some embodiments, a notch 300 is formed between the first portion 110 and the primary side pin 200. Alternatively, the connection position between the first portion 110 and the primary side pin 200 is recessed to form the notch 300. In this way, when the lead frame and die are subsequently packaged, the molding compound can be inserted into the notch 300, which is equivalent to a riveting effect between the molding compound and the lead frame 10. This greatly enhances the mechanical bonding strength between the molding compound and the lead frame 10, making the package structure more stable and reliable. It effectively resists the impact of external mechanical stress on the internal die and lead frame, and reduces the risk of package damage and die failure due to mechanical vibration or collision.

[0071] In some embodiments, the lead frame 10 further includes a secondary side pin 400, which is disposed on the side of the base island 100 opposite to the primary side pin 200 and is used for electrical connection with the die.

[0072] The number of secondary-side pins 400 can be multiple. For example, there can be eight secondary-side pins 400, with four secondary-side pins 400 combined together as the current input terminal and the other four secondary-side pins 400 combined together as the current output terminal.

[0073] Please refer to Figure 2 and Figure 3 This application also provides a current sensor, including an insulating element 20, a die 30, and a lead frame 10 as described in any of the above embodiments.

[0074] The insulating element 20 is disposed on the lead frame 10, and the orthographic projection of the insulating element 20 on the plane of the lead frame 10 covers at least the first slot 140 and the second slot 150 and the area located between the first slot 140 and the second slot 150.

[0075] The die 30 is disposed on the insulating member 20, and the die 30 includes two Hall devices 31. The insulating member 20 can realize the insulation between the die 30 and the base island 100 of the lead frame 10, and the orthographic projection of one Hall device 31 on the plane of the lead frame 10 is located in the first slot 140, and the orthographic projection of the other Hall device 31 on the plane of the lead frame 10 is located in the second slot 150. This allows the die 30 to better detect the magnetic field formed by the current flowing through the first slot 140 and the second slot 150.

[0076] Given that the current sensor provided in this application includes the lead frame 10 described in any of the above embodiments, during the process of current being transmitted to the lead frame 10 via the primary side pin 200, the second portion 120 is widened so that the second portion 120 extends along the first direction at least on one side of the first direction to form an extension portion 130. In this way, the current can flow in the additionally provided extension portion 130. Thus, the base island 100 can have a wider current conduction path, which is beneficial to reduce the impedance of the base island 100, thereby reducing the heat generation of the lead frame and preventing the heat generation from exceeding the heat resistance temperature of the current sensor die, thereby increasing the current range of the current sensor.

[0077] It should be noted that the insulating component 20 involved in this embodiment can be made of conventional materials with insulating functions, and this embodiment will not elaborate further here.

[0078] The current sensor provided in this application embodiment also includes a molding compound that encapsulates the insulating component 20, the die 30, and a portion of the lead frame 10, so that portions of the primary side pins 200 and the secondary side pins 400 of the lead frame 10 are exposed for electrical connection with other conductive components.

[0079] It is important to understand that the materials used in molding compounds include epoxy resin, phenolic resin, polyimide, silicone, or spin-coated silicone glass. These materials possess excellent insulation, thermal conductivity, and mechanical strength, effectively protecting against external dust, moisture, and mechanical shocks. They also ensure the safe and stable operation of the current sensor, effectively dissipate heat, improve the reliability of the current sensor, and extend its service life.

[0080] In the first direction, the molding compound includes a first surface opposite to the first portion 110 of the lead frame 10 in the first direction. The distance between the first surface and the first portion 110 is greater than the thickness of the lead frame 10. For example, the distance between the first surface and the first portion 110 is greater than 0.5 mm. This ensures the thickness of the molding compound at its thinnest position and guarantees the molding effect of the molding compound.

[0081] The current sensor also includes a support member 40, which is inserted through the plastic package and is opposite to the second part 120 of the lead frame 10. The minimum distance between the support member 40 and the second part 120 is greater than or equal to the creepage distance, so that the current sensor can meet the package withstand voltage requirements.

[0082] In this embodiment, the orthographic projection of one of the Hall devices 31 of the die 30 onto the plane of the lead frame 10 is located within the first slot 140, and the orthographic projection of the other Hall device 31 onto the plane of the lead frame 10 is located within the second slot 150. The first slot wall 141 of the first slot 140 and the second slot wall 151 of the second slot 150 are both arc-shaped, which helps to confine the magnetic lines of force within the slot area, reduce leakage, enhance magnetic gain, and optimize the signal-to-noise ratio of the current sensor.

[0083] Meanwhile, the mounting positions of the two Hall devices 31 of the die 30 can also be optimized. For example, when the mounting positions of the two Hall devices 31 of the die 30 are slightly offset, for example, under the same die mounting offset of 50µm, this embodiment detects the magnetic gain of the current sensor for the arc-shaped slot and the square slot, and the results are as follows. Figure 4 As shown.

[0084] from Figure 4It is evident that the fluctuation of the magnetic gain variation curve of the lead frame 10 with the arc-shaped slot is significantly smaller than that of the lead frame 10 with the rectangular slot. In other words, the magnetic loss fluctuation within the arc-shaped slot region is significantly smaller than that of the square slot, and the maximum magnetic gain loss is also lower. This indicates that the arc-shaped slot provides better magnetic field uniformity, and a stable and uniform magnetic field distribution is beneficial for reducing magnetic parameter fluctuations and simplifying the installation process during current sensor manufacturing.

[0085] The various embodiments or implementation methods described in this specification are presented in a progressive manner. Each embodiment focuses on the differences from other embodiments, and the same or similar parts between the embodiments can be referred to each other.

[0086] It should be noted that the terms "one embodiment," "embodiment," "exemplary embodiment," "some embodiments," etc., mentioned in the specification indicate that the described embodiment may include a specific feature, structure, or characteristic, but not every embodiment necessarily includes that specific feature, structure, or characteristic. Furthermore, such phrases do not necessarily refer to the same embodiment. Moreover, when a specific feature, structure, or characteristic is described in connection with an embodiment, implementing such a feature, structure, or characteristic in conjunction with other embodiments, whether explicitly described or not, is within the knowledge scope of those skilled in the art.

[0087] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A lead frame (10), characterized in that, include: A base island (100) includes a first portion (110) and a second portion (120), the first portion (110) and the second portion (120) being arranged along a second direction, and the first portion (110) protruding from the second portion (120) along a first direction; the second portion (120) extending along the first direction at least on one side of the first direction to form an extension (130); wherein the dimension of the extension (130) in the first direction decreases along the second direction and away from the first portion (110), and the first direction and the second direction intersect; At least two primary edge pins (200) are connected to the end of the first portion (110) away from the second portion (120) and are spaced apart along the first direction.

2. The lead frame (10) according to claim 1, characterized in that, The number of the extensions (130) includes two, and the two extensions (130) are respectively located on both sides of the second part (120) along the first direction; Furthermore, the dimension of the extension (130) in the first direction gradually decreases along the second direction and away from the first portion (110).

3. The lead frame (10) according to claim 2, characterized in that, The base island (100) is also provided with a first slot (140) and a second slot (150), the first slot (140) and the second slot (150) being spaced apart along the second direction. The first slot (140) penetrates the second part (120) in a direction away from the first part (110), and the second slot (150) penetrates the first part (110) in a direction away from the second part (120) and is interconnected with the area between the two adjacent primary edge pins.

4. The lead frame (10) according to claim 3, characterized in that, The first slot (140) has an arc-shaped first slot wall (141), and the second slot (150) has an arc-shaped second slot wall (151). The first slot wall (141) and the second slot wall (151) are arranged opposite to each other in the second direction.

5. The lead frame according to claim 4, characterized in that, The first slot (140) includes a first segment (142) and a second segment (143) that are connected to each other. The cross-sectional shape of the first segment (142) is arc-shaped, and the cross-sectional shape of the second segment (143) is rectangular. The slot wall of the first segment (142) away from the second segment (143) forms the first slot wall (141). The second slot (150) includes a third segment (152), a fourth segment (153), and a fifth segment (154) that are interconnected. The third segment (152) is adjacent to the first segment (142). The cross-sectional shape of the third segment (152) is arc-shaped, and the slot wall of the third segment (152) facing the first segment (142) forms the second slot wall (151). The cross-sectional shapes of the fourth segment (153) and the fifth segment (154) are both rectangular, and the dimensions of the fourth segment (153) in the first direction are not equal to the dimensions of the fifth segment (154) in the first direction.

6. The lead frame (10) according to claim 3, characterized in that, The second segment (143) of the first slot (140) has a dimension in the first direction equal to the thickness of the base island (100).

7. The lead frame (10) according to any one of claims 1-6, characterized in that, A notch (300) is formed between the first portion (110) and the primary side pin (200).

8. The lead frame (10) according to any one of claims 1-6, characterized in that, The lead frame (10) also includes a secondary side pin (400), which is located on the side of the base island (100) away from the primary side pin (200) and is used for electrical connection with the die (30).

9. A current sensor, characterized in that, Includes an insulating component (20), a core (30), and a lead frame (10) as described in any one of claims 1-8; The insulating element (20) is disposed on the lead frame (10), and the orthographic projection of the insulating element (20) on the plane where the lead frame (10) is located covers at least a portion of the first slot (140) and a portion of the second slot (150) of the lead frame (10) and the area located between the first slot (140) and the second slot (150). The die (30) is disposed on the insulating member (20), and the die (30) includes two Hall devices (31), one of which has its orthographic projection on the plane of the lead frame (10) located in the first slot (140), and the other Hall device (31) has its orthographic projection on the plane of the lead frame (10) located in the second slot (150).

10. The current sensor according to claim 9, characterized in that, The current sensor also includes a molding compound and a support (40), the molding compound encapsulating the insulating component (20), the die (30) and a portion of the lead frame (10) so that portions of the primary side pins (200) and the secondary side pins (400) of the lead frame (10) are exposed; The molding compound includes a first surface opposite a first portion of the lead frame (10) in a first direction, the distance between the first surface and the first portion being greater than the thickness of the lead frame (10); The support member (40) passes through the plastic seal and is opposite to the second part (120) of the lead frame (10), and the minimum distance between the support member (40) and the second part (120) is greater than or equal to the creepage distance.

Images