Hot pressing device for semiconductor processing

Abstract

The invention relates to the technical field of hot pressing devices, and discloses a hot pressing device for semiconductor processing, which comprises a hot press body, dispensing frames and a positioning clamping assembly, one side of each dispensing frame is provided with a glue injection machine, and each dispensing frame is provided with a matched dispensing device. The matched dispensing device and the glue injection machine can be matched with the positioning clamping assembly to conduct dispensing on the corresponding positions on the substrate according to the shape of the chip, one side of each dispensing opening is provided with an air outlet, and one side of each dispensing frame is provided with a dispensing uniform laying device. The adhesive dispensing and uniform spreading device is matched with the air outlet hole, so that the adhesive dispensing can be uniformly spread by utilizing the flowing of gas before the chip and the substrate are hot-pressed, and the flowing range of the adhesive dispensing to the outer side during the hot-pressing of the chip and the substrate is inhibited; according to the invention, when the hot-pressing bonding operation is carried out on the special-shaped chip, the glue coating range is guaranteed, and meanwhile, the hot-pressing glue overflow condition is avoided.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of hot pressing devices, in particular to a hot pressing device for semiconductor processing. BACKGROUND

[0002] In the patent application with the application publication number CN118919451A, the application publication date is November 8, 2024, and the name is "a hot pressing device for semiconductor processing", the application discloses a hot pressing device for semiconductor processing, which belongs to the technical field of hot pressing devices, and the technical scheme is as follows: a hot pressing device for semiconductor processing, comprising a processing table and a pressing mechanism, a support matched with the pressing mechanism is fixedly arranged on the processing table, a positioning mold for placing a semiconductor is arranged on the processing table, a plurality of placing grooves for placing the semiconductor are formed in the positioning mold, a supporting plate is arranged in the placing groove, a first spring is arranged between the supporting plate and the placing groove, a limiting mechanism matched with the supporting plate is arranged on the positioning mold, and a reset mechanism is arranged between the processing table and the positioning mold. The semiconductor is subjected to hot pressing treatment through the setting of the pressing mechanism and the hot pressing plate. The limiting mechanism is used for limiting the supporting plate and the semiconductor carried thereby. When the processing is completed, the limiting mechanism cancels the limiting of the supporting plate, so that the semiconductor is separated from the placing groove, the difficulty of collection is reduced, and the processing efficiency of the hot pressing device is improved. In the prior art including the above-mentioned patent, the existing semiconductor hot pressing device needs to be coated with glue on the bonding surface of the substrate and the chip. The heat and the viscosity of the glue are used to realize the hot pressing bonding of the substrate and the chip. However, the traditional gluing method is usually the whole coating type, the coverage range of the glue is large, and since the glue has a certain thickness, when the chip and the substrate are subjected to hot pressing, there is a possibility that the glue will overflow from the edge between the chip and the substrate. The overflowed adhesive is easy to adhere to the key areas such as chip pins and substrate circuits, which causes circuit short circuit, poor contact, directly affects the electrical connection reliability of the semiconductor device, and even causes device failure. At the same time, the adhesive residue will pollute the workpiece surface and interfere with the subsequent detection, packaging and other processes. There is a lack of a device that can guarantee the gluing range while avoiding the hot pressing overflow of glue when the hot pressing bonding operation is performed on the special-shaped chip. SUMMARY

[0003] The problem to be solved by the application is to solve the problem that the existing hot pressing device is easy to produce overflow of glue when controlling the hot pressing bonding of the chip and the substrate.

[0004] To solve the above technical problems, the technical scheme of the present application is as follows: a hot pressing device for semiconductor processing, comprising: The lower part of the hot press body is provided with a workbench, the top of the workbench is provided with a heating plate for limiting and heating the chip, and the workbench is provided with a mechanical hand on one side. Further, the hot press body is vertically provided with a hot press cylinder at the upper part of the hot press body, and the output end of the bottom of the hot press cylinder is provided with a mounting plate; the two sides of the bottom of the mounting plate are respectively provided with a horizontal moving assembly and a longitudinal moving assembly, and the output ends of the horizontal moving assembly and the longitudinal moving assembly are respectively provided with a positioning and clamping assembly; the two positioning and clamping assemblies are stacked up and down and cross-shaped; the horizontal moving assembly and the longitudinal moving assembly can drive the two positioning and clamping assemblies to position and clamp chips of different shapes; the two ends of the bottom of one of the positioning and clamping assemblies are respectively provided with two glue dispensing racks on the same horizontal line; the two ends of the bottom of the other positioning and clamping assembly are respectively provided with two glue dispensing racks on the same horizontal line; the two groups of glue dispensing racks are stacked up and down and cross-shaped; a plurality of glue dispensing openings are equidistantly arranged in the middle of the bottom of each glue dispensing rack; one glue injection machine is arranged on one side of each glue dispensing rack; one matching glue dispensing device is arranged on each glue dispensing rack; the matching glue dispensing device and the glue injection machine can cooperate with the positioning and clamping assembly to dispense glue on the corresponding position of the chip on the substrate according to the shape of the chip; one air outlet is arranged on one side of each glue dispensing opening; one glue dispensing and leveling device is arranged on one side of each glue dispensing rack; the glue dispensing and leveling device and the air outlet can cooperate to level the glue dispensing before the chip and the substrate are hot pressed by using the flow of gas, so as to inhibit the flow range of the glue dispensing to the outside when the chip and the substrate are hot pressed.

[0005] Further, the horizontal moving assembly and the longitudinal moving assembly are the same in structure, the horizontal moving assembly comprises a lead screw sliding table arranged on one side of the bottom of the mounting plate, the other side of the bottom of the mounting plate is provided with a limiting rod and the limiting rod is located on the opposite side of the lead screw sliding table, and the lower part of the mounting plate is provided with a positioning plate, one end of the positioning plate is connected with the output end of the lead screw sliding table, and the other end of the positioning plate is slidingly connected with the limiting rod; the two positioning plates in the horizontal moving assembly and the longitudinal moving assembly are stacked up and down and cross-shaped.

[0006] Further, the positioning plate is hollow and provided with openings on the two sides of the bottom of the positioning plate; each positioning plate is internally provided with a positioning and clamping assembly; the positioning and clamping assembly comprises a first motor arranged in the middle of the inside of the positioning plate, the output end of the first motor is provided with a positioning gear, the two ends of the inside of the positioning plate are respectively provided with two positioning gear slot plates slidingly connected with the positioning plate in the horizontal direction, the gear slot ends of the two positioning gear slot plates are respectively engaged with the two ends of the positioning gear, and the ends of the two positioning gear slot rods correspond to the positions of the two openings of the bottom of the positioning plate.

[0007] Further, the matching point glue device comprises a second motor vertically arranged at the bottom of one end of the positioning tooth groove plate, a first docking shaft is vertically arranged at the bottom output end of the second motor, one end of the point glue frame is vertically arranged with a second docking shaft, the bottom of the first docking shaft is provided with a protruding part and the top of the second docking shaft is provided with a recessed part, when the first docking shaft moves to the top of the second docking shaft, the two are docked through the protruding part and the recessed part, and after docking, the first docking shaft rotates to drive the second docking shaft to rotate synchronously, when the first docking shaft moves to the middle part of the positioning plate, the first docking shaft and the second docking shaft are separated from each other.

[0008] Further, the inside of the point glue frame is provided with a glue injection groove, the bottom of the glue injection groove is communicated with a plurality of point glue openings, the top of the glue injection groove is provided through the top of the point glue frame, the glue injection end of the glue injection machine passes through the side end of the point glue frame and is located in the inside of the glue injection groove, one end of the inside of the glue injection groove close to the first docking shaft is provided with a sealing block, the sealing block is slidingly connected with the glue injection groove in the horizontal direction, and when the sealing block slides, the point glue openings located at the bottom of the sealing block and the gaps between the two sides of the sealing block and the two sides of the glue injection groove are sealed, the top of the sealing block is located above the point glue frame, the side end of the first docking shaft is provided with a mounting block, the bottom of the mounting block is connected with the top of the sealing block, and the side of the mounting block away from the first docking shaft is horizontally provided with a clamping block for clamping and limiting the side end of the chip; the clamping blocks in the four matching point glue devices are at the same horizontal height.

[0009] Further, the top of the glue injection groove is provided with a flexible sealing cloth, one end of the flexible sealing cloth is connected with the side wall of the glue injection groove, and the other end of the flexible sealing cloth is connected with the side end of the sealing block.

[0010] Further, the point glue uniform distribution device comprises a gas injection groove arranged in the inside of the point glue frame, the gas injection groove is located on one side of the glue injection groove, the top of the gas injection groove is provided in an open manner, a plurality of air bags are equidistantly arranged in the inside of the gas injection groove, the air outlets at the bottom of the air bags are respectively communicated with an air outlet hole, and the air outlet hole is inclinedly arranged towards the point glue opening.

[0011] Further, one side of the point glue frame is vertically and rotatably provided with a first bevel gear, the bottom of the second docking shaft is horizontally provided with a second bevel gear, the first bevel gear is engaged with the second bevel gear, one side of the second bevel gear is horizontally provided with a matching gear, the matching gear is engaged with the second bevel gear and the top of the matching gear is connected with one end of the positioning plate, a driving gear is rotatably arranged in the middle part of one side of the point glue frame, a plurality of teeth are arranged on the outside of the driving gear, a pressing plate is slidingly connected to the top of the gas injection groove, the bottom of the pressing plate is in contact with the top of the plurality of air bags, a gear slot rod is vertically arranged on the side of the driving gear close to the first bevel gear, the gear slot rod is engaged with the driving gear, the top of the gear slot rod and the top of the pressing plate are connected through a connecting piece, a belt pulley is arranged at the rotatable connection between the driving gear and the first bevel gear, and a transmission belt is sleeved on the two belt pulleys.

[0012] Further, the middle part of the bottom of the positioning plate in the longitudinal moving assembly is vertically provided with a suction cup cylinder for adsorbing the top surface of the chip and driving the chip to rise and fall.

[0013] Further, one side of the suction cup cylinder is provided with a heating module for heating the chip.

[0014] Compared with the prior art, the technical scheme of the present application has the following advantages: (1) The present application utilizes the flow of gas to evenly spread the glue before the chip and the substrate are hot-pressed, inhibits the flow range of the glue to the outside during the hot-pressing of the chip and the substrate, and gradually solidifies under the action of the heating plate, so that the glue flows and spreads evenly in a non-pressing manner, replacing the extrusion of the glue during the hot-pressing of the chip and the substrate. When the chip and the substrate are hot-pressed and bonded, the flowability of the glue caused by the extrusion has been weakened, the flow range is limited, and since the glue has not completely solidified, it has the adhesion to bond the chip and the substrate. The possibility of glue overflow during the hot-pressing and bonding of the chip and the substrate is fundamentally eliminated, effectively ensuring the yield of the semiconductor after hot-pressing. (2) The present application adopts the interval glue dispensing method to coat the surface of the substrate. Compared with the traditional all-around glue brushing method, the glue dispensing method uses less glue and has the same advantage of uniform coating range, and the glue dispensing position can be adjusted according to the shape of the chip, which to some extent avoids the problem of glue overflow caused by the extrusion of the glue during hot-pressing, since the amount of glue is relatively large and part of the glue exists at the edge of the hot-pressing area of the substrate and the chip. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 is a schematic view of the three-dimensional structure of the present application; Figure 2 is a schematic view of the three-dimensional structure of the mechanical hand and the heating plate in the present application; Figure 3 is a schematic view of the local structure of the present application Figure 1 ; Figure 4 is a schematic view of the local structure of the present application Figure 2 ; Figure 5 is a schematic view of the three-dimensional structure of the mounting plate, the horizontal moving assembly and the longitudinal moving assembly in the present application; Figure 6 is a side view of the mounting plate, the horizontal moving assembly and the longitudinal moving assembly in the present application; Figure 7 is a schematic view of the three-dimensional structure of the positioning plate and the positioning and clamping assembly in the present application; Figure 8 is a sectional view of the positioning plate and the positioning and clamping assembly in the present application; Figure 9 Partial structure diagram of the present application Figure 3 ; Figure 10 Partial structure diagram of the present application Figure 9 Enlarged view of A in the present application Figure 11 Bottom view of the transverse moving assembly, longitudinal moving assembly and dispensing frame in the present application Figure 12 Partial structure diagram of the dispensing frame, glue injection machine and matching dispensing device in the present application Figure 13 Top view of the dispensing frame, glue injection machine and matching dispensing device in the present application Figure 14 Three-dimensional structure diagram of the positioning plate, dispensing frame and dispensing and leveling device in the present application Figure 15 Partial structure diagram of the dispensing and leveling device and matching dispensing device in the present application Figure 16 Partial structure sectional view of the dispensing frame and dispensing and leveling device in the present application In the figure: 1, hot press body; 11, workbench; 12, heating plate; 13, mechanical hand; 14, hot pressing air cylinder; 15, mounting plate; 2, transverse moving assembly; 21, screw slide; 22, limiting rod; 23, positioning plate; 3, longitudinal moving assembly; 4, positioning and clamping assembly; 41, first motor; 42, positioning gear; 43, positioning gear slot plate; 5, dispensing frame; 51, dispensing port; 52, glue injection machine; 6, matching dispensing device; 61, second motor; 62, first butt joint shaft; 63, second butt joint shaft; 64, glue injection groove; 65, sealing block; 66, mounting block; 67, clamping block; 68, flexible sealing cloth; 69, air outlet hole; 7, dispensing and leveling device; 70, air injection groove; 71, air bag; 72, first bevel gear; 73, second bevel gear; 74, matching gear; 75, driving gear; 76, pressing plate; 77, gear slot rod; 78, belt pulley; 79, transmission belt; 8, suction cup air cylinder; 9, heating module. DETAILED DESCRIPTION

[0016] So that the purposes, technical solutions and advantages of the embodiments of the present disclosure are clearer, the technical solutions of the embodiments of the present disclosure will be described clearly and completely below in combination with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, rather than all the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by a person of ordinary skill in the art without any creative effort fall within the protection scope of the present disclosure.

[0017] Unless otherwise defined, the technical or scientific terms used in this disclosure shall have the ordinary meaning understood by one of ordinary skill in the art to which this disclosure pertains. The terms "comprising" or "including," and similar terms used in this disclosure, mean that an element or object preceding the term encompasses the elements or objects listed following the term and their equivalents, without excluding other elements or objects. Terms such as "connected" or "linked" are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. Terms such as "upper," "lower," "left," and "right" are used only to indicate relative positional relationships; these relative positional relationships may change accordingly when the absolute position of the described objects changes.

[0018] like Figures 1 to 16 As shown, the present invention provides a hot pressing apparatus for semiconductor processing, comprising: The hot press body 1 has a worktable 11 at its lower part and a heating plate 12 at its top for limiting and heating the chip. A robotic arm 13 is located on one side of the worktable 11. The robotic arm 13 can drive the heating plate 12 and the chip to move horizontally to assist in positioning the chip and the mounting position on the substrate. The hot press body 1 also includes a hot press cylinder 14 vertically mounted on its upper part. A mounting plate 15 is located at the bottom output end of the hot press cylinder 14. A horizontal moving component 2 and a vertical moving component 3 are respectively located on both sides of the bottom of the mounting plate 15. A positioning clamping component 4 is located at the output end of both the horizontal moving component 2 and the vertical moving component 3. The two positioning clamping components 4 are stacked vertically and arranged in a cross shape. The horizontal moving component 2 and the vertical moving component 3 can drive the two positioning clamping components 4 to position and clamp chips of different shapes. One of the positioning clamping components 4 has a bottom... Two dispensing racks 5 are provided at both ends of the part and at the same horizontal line. Two dispensing racks 5 are provided at both ends of the bottom of another positioning and clamping component 4. The two sets of dispensing racks 5 are stacked on top of each other and arranged in a cross shape. Several dispensing ports 51 are provided at equal intervals in the middle of the bottom of each dispensing rack 5. A dispensing machine 52 is provided on one side of each dispensing rack 5. A matching dispensing device 6 is provided on each dispensing rack 5. The matching dispensing device 6 and the dispensing machine 52 can cooperate with the positioning and clamping component 4 to dispense glue at the corresponding position on the substrate according to the shape of the chip. A vent 69 is provided on one side of each dispensing port 51. A dispensing spreading device 7 is provided on one side of each dispensing rack 5. The dispensing spreading device 7 and the vent 69 cooperate to spread the glue evenly by the flow of gas before the chip and the substrate are hot-pressed, and suppress the outward flow range of the glue during the hot-pressing of the chip and the substrate. The lateral moving assembly 2 and the longitudinal moving assembly 3 are structurally identical, the lateral moving assembly 2 comprises a lead screw sliding table 21 arranged at one side of the bottom of a mounting plate 15, the other side of the bottom of the mounting plate 15 is provided with a limiting rod 22 and the limiting rod 22 is located at the opposite side of the lead screw sliding table 21, a positioning plate 23 is arranged below the mounting plate 15, one end of the positioning plate 23 is connected with the output end of the lead screw sliding table 21, and the other end of the positioning plate 23 is slidably connected with the limiting rod 22; the two positioning plates 23 in the lateral moving assembly 2 and the longitudinal moving assembly 3 are arranged in a stacked manner and are arranged in a cross shape; The positioning plate 23 is hollow and the two sides of the bottom of the positioning plate 23 are provided with openings, and one positioning and clamping assembly 4 is arranged in each positioning plate 23; the positioning and clamping assembly 4 comprises a first motor 41 arranged in the middle of the inside of the positioning plate 23, a positioning gear 42 is arranged at the output end of the first motor 41, two positioning gear slot plates 43 are arranged at the two ends of the inside of the positioning plate 23 and are slidably connected with the positioning plate 23 in the horizontal direction, the gear slot ends of the two positioning gear slot plates 43 are engaged with the two ends of the positioning gear 42, and the ends of the two positioning gear slot rods 77 correspond to the two opening positions of the bottom of the positioning plate 23; The matching point glue device 6 comprises a second motor 61 vertically arranged at the bottom of one end of the positioning gear slot plate 43, a first docking shaft 62 is vertically arranged at the bottom output end of the second motor 61, one end of the point glue frame 5 is vertically provided with a second docking shaft 63, the bottom of the first docking shaft 62 is provided with a protruding portion and the top of the second docking shaft 63 is provided with a recessed portion, when the first docking shaft 62 moves to the top of the second docking shaft 63, the two are docked through the protruding portion and the recessed portion, and after docking, the first docking shaft 62 rotates to drive the second docking shaft 63 to rotate synchronously, when the first docking shaft 62 moves to the middle of the positioning plate 23, the first docking shaft 62 and the second docking shaft 63 are separated from each other; The inside of the point glue frame 5 is provided with a glue injection groove 64, the bottom of the glue injection groove 64 is communicated with a plurality of glue injection ports 51, the top of the glue injection groove 64 is provided through the top of the point glue frame 5, the glue injection end of the glue injection machine 52 passes through the side end of the point glue frame 5 and is located in the inside of the glue injection groove 64, one end of the inside of the glue injection groove 64 close to the first docking shaft 62 is provided with a sealing block 65, the sealing block 65 is slidably connected with the glue injection groove 64 in the horizontal direction, and when the sealing block 65 slides, the gap between the two sides of the sealing block 65 and the glue injection groove 64 and the glue injection port 51 located at the bottom of the sealing block 65 is sealed, the top of the sealing block 65 is located above the point glue frame 5, the side end of the first docking shaft 62 is provided with a mounting block 66, the bottom of the mounting block 66 is connected with the top of the sealing block 65, and the side of the mounting block 66 away from the first docking shaft 62 is horizontally provided with a clamping block 67 for clamping and limiting the side end of the chip; the clamping blocks 67 in the four matching point glue devices 6 are at the same horizontal height; The top of the glue injection groove 64 is provided with a flexible sealing cloth 68, one end of the flexible sealing cloth 68 is connected with the side wall of the glue injection groove 64, and the other end of the flexible sealing cloth 68 is connected with the side end of the sealing block 65; The glue injection and uniform distribution device 7 comprises an air injection groove 70 arranged in the interior of the glue injection frame 5, the air injection groove 70 is located at one side of the glue injection groove 64, the top of the air injection groove 70 is arranged in an open manner, a plurality of air bags 71 are equidistantly arranged in the interior of the air injection groove 70, the air outlets at the bottom of the air bags 71 are respectively communicated with an air outlet hole 69, and the air outlet hole 69 is arranged in an inclined manner towards the glue injection opening 51; A first bevel gear 72 is vertically and rotatably arranged at one side of the glue injection frame 5, a second bevel gear 73 is horizontally arranged at the bottom of the second connecting shaft 63, the first bevel gear 72 is engaged with the second bevel gear 73, a matching gear 74 is horizontally arranged at one side of the second bevel gear 73, the matching gear 74 is engaged with the second bevel gear 73, the top of the matching gear 74 is connected with one end of the positioning plate 23, a driving gear 75 is rotatably arranged at the middle of one side of the glue injection frame 5, a plurality of gear teeth are arranged on the outer side of the driving gear 75, a pressing plate 76 is slidably connected to the top of the air injection groove 70, the bottom of the pressing plate 76 is in contact with the top of the plurality of air bags 71, a gear slot rod 77 is vertically arranged at the side of the driving gear 75 close to the first bevel gear 72, the gear slot rod 77 is engaged with the driving gear 75, the top of the gear slot rod 77 is connected with the top of the pressing plate 76 through a connecting piece, a belt pulley 78 is arranged at the rotatable connection between the driving gear 75 and the first bevel gear 72 of the glue injection frame 5, and a transmission belt 79 is sleeved on the two belt pulleys 78; The positioning plate 23 is vertically provided with an adsorption disc air cylinder 8 for adsorbing the top surface of the chip and driving the chip to ascend and descend; The adsorption disc air cylinder 8 is provided with a heating module 9 for heating the chip.

[0019] The working principle and usage process of this invention are as follows: Before hot pressing the chip and the substrate, the chip is first placed between four clamping blocks 67. At this time, according to the shape of the chip, the lead screw slide 21 in the horizontal moving component 2 and the vertical moving component 3 is controlled to work, thereby driving the two positioning plates 23 and the two sets of dispensing frames 5 in the positioning clamping component 4 to move synchronously. The shape of the chip is adaptively adjusted so that the dispensing ports 51 on the two sets of dispensing frames 5 are evenly distributed under the chip. The first motor 41 in the positioning clamping component 4 is controlled to work to drive the positioning gear 42 to rotate, thereby driving the two positioning toothed plates 43 to move synchronously towards the opposite side. The first docking shaft 62 and the second docking shaft 63 separate until the four clamping blocks 67 clamp and fix the chip on all four sides. After the chip is clamped, as the clamping blocks 67 move, the sealing block 65 moves synchronously and the flexible sealing cloth 68 folds synchronously, thereby reducing the glue injection groove according to the shape of the chip. The capacity of the dispensing tank 64 is reduced, and the number of dispensing ports 51 that can be used is reduced simultaneously. At this time, the amount of dispensing in the dispensing tank 64 and the dispensing ports 51 are adaptively matched according to the shape of the chip. The four dispensing racks 5 are controlled to descend close to the top of the substrate by the hot pressing cylinder 14, and the mounting position of the substrate is controlled to correspond with the chip position with the help of the robot arm 13. The dispensing machine 52 is controlled to work to inject glue into the dispensing tank 64, and inject the corresponding amount of glue onto the surface of the substrate through the dispensing ports 51, completing the dispensing work before hot pressing. The present invention adopts the intermittent dispensing method to coat the substrate surface. Compared with the traditional all-round brushing method, the dispensing method uses less glue and also has the advantage of uniform coating range. The dispensing position can be adjusted according to the shape of the chip, which to a certain extent avoids the problem of glue overflow during hot pressing due to the large amount of glue and some glue existing at the edge of the hot pressing area of ​​the substrate and the chip. After the dispensing of the substrate is completed, the output end of the suction cup cylinder 8 is controlled to descend to adsorb and clamp the top surface of the chip, the clamping blocks 67 located on the four sides of the chip are controlled to reset through the positioning and clamping assembly 4, the first docking shaft 62 and the second docking shaft 63 are re-docked, the second motor 61 is controlled to work to drive the four dispensing frames 5 to rotate away from the bottom of the chip with the first docking shaft 62 and the second docking shaft 63 as the shaft, so as to avoid the occlusion caused by the hot pressing of the chip and the substrate, and at the same time, with the slow rotation of the dispensing frame 5, the second bevel gear 73 rotates under the action of the matching gear 74, thereby driving the first bevel gear 72 to rotate synchronously, and the driving gear 75 rotates under the transmission of the belt pulley 78 and the transmission belt 79, at this time, the teeth on the side end of the driving gear 75 are engaged with and disengaged from the toothed groove rod 77, so that the toothed groove rod 77 descends and drives the pressing plate 76 to descend to press the plurality of air bags 71, so that the gas flows from the inside of the air outlet hole 69 to the dispensing direction, thereby uniformly blowing and spreading the dispensing, and gradually solidifying under the action of the heating plate 12, so that the dispensing is uniformly spread in a non-pressing manner, replacing the extrusion of the glue during the hot pressing of the chip and the substrate, when the chip and the substrate are hot-pressed and bonded, the flowability of the dispensing caused by extrusion has been weakened, and the flow range is limited, since the glue has not completely solidified, the chip and the substrate are bonded with the viscosity, the chip is heated through the heating module 9, and the chip is controlled to descend and hot-press and bond with the substrate through the suction cup cylinder 8.

[0020] The above examples are only exemplary embodiments of the present application and are not used to limit the present application, and the protection scope of the present application is defined by the claims. Those skilled in the art can make various modifications or equivalent replacements to the present application within the spirit and protection scope of the present application, and such modifications or equivalent replacements should also be considered to fall within the protection scope of the present application.

Claims

1. A hot pressing apparatus for semiconductor processing, characterized in that, The utility model relates to a hot-pressing machine for chip and substrate, which comprises: a hot-pressing machine body (1), a workbench (11) is arranged at the lower part of the hot-pressing machine body (1), a heating plate (12) for limiting and heating the chip is arranged at the top of the workbench (11), a mechanical hand (13) is arranged at one side of the workbench (11), the mechanical hand (13) can drive the heating plate (12) and the chip to move horizontally to assist the positioning of the chip and the mounting position on the substrate; characterized in that a hot-pressing cylinder (14) is vertically arranged at the upper part of the hot-pressing machine body (1), an installation plate (15) is arranged at the output end of the bottom of the hot-pressing cylinder (14); two transverse moving assemblies (2) and longitudinal moving assemblies (3) are arranged at the two sides of the bottom of the installation plate (15), respectively, a positioning and clamping assembly (4) is arranged at the output end of each of the transverse moving assemblies (2) and longitudinal moving assemblies (3), the two positioning and clamping assemblies (4) are arranged in a stacked manner and in a cross shape, the transverse moving assemblies (2) and longitudinal moving assemblies (3) can drive the two positioning and clamping assemblies (4) to position and clamp chips of different shapes, two glue dispensing racks (5) in the same horizontal line are arranged at the two ends of the bottom of one of the positioning and clamping assemblies (4), respectively, two glue dispensing racks (5) in the same horizontal line are arranged at the two ends of the bottom of the other positioning and clamping assembly (4), respectively, the two groups of glue dispensing racks (5) are arranged in a stacked manner and in a cross shape, a plurality of glue dispensing holes (51) are equidistantly arranged at the middle of the bottom of each glue dispensing rack (5), a glue injection machine (52) is arranged at one side of each glue dispensing rack (5), and a matching glue dispensing device (6) is arranged on each glue dispensing rack (5); the glue dispensing device (6) and the glue injection machine (52) can cooperate with the positioning and clamping assembly (4) to dispense glue at the corresponding position of the chip on the substrate according to the shape of the chip; one air outlet hole (69) is arranged at one side of each glue dispensing hole (51), and a glue dispensing and leveling device (7) is arranged at one side of each glue dispensing rack (5); the glue dispensing and leveling device (7) can cooperate with the air outlet hole (69) to level the glue by using the flow of gas before the chip and the substrate are hot-pressed, so that the flow range of the glue to the outside during the hot-pressing of the chip and the substrate is inhibited.

2. The hot press apparatus for semiconductor processing according to claim 1, wherein: The transverse moving assemblies (2) and longitudinal moving assemblies (3) are the same in structure, the transverse moving assembly (2) comprises a lead screw sliding table (21) arranged at one side of the bottom of the installation plate (15), a limiting rod (22) is arranged at the other side of the bottom of the installation plate (15) and located at the opposite side of the lead screw sliding table (21), a positioning plate (23) is arranged below the installation plate (15), one end of the positioning plate (23) is connected with the output end of the lead screw sliding table (21), and the other end of the positioning plate (23) is slidably connected with the limiting rod (22); the two positioning plates (23) in the transverse moving assemblies (2) and longitudinal moving assemblies (3) are arranged in a stacked manner and in a cross shape.

3. The hot press apparatus for semiconductor processing according to claim 2, wherein: The positioning plate (23) is hollow, and both sides of the bottom of the positioning plate (23) are provided with openings. Each positioning plate (23) is internally provided with a positioning and clamping assembly (4). The positioning and clamping assembly (4) comprises a first motor (41) arranged in the middle of the inside of the positioning plate (23). The output end of the first motor (41) is provided with a positioning gear (42). Both ends of the inside of the positioning plate (23) are respectively provided with two positioning gear slot plates (43) which are slidingly connected with the positioning plate (23) in the horizontal direction. The gear slot ends of the two positioning gear slot plates (43) are respectively engaged with both ends of the positioning gear (42). The ends of the two positioning gear slot rods (77) are respectively corresponding to the two opening positions of the bottom of the positioning plate (23).

4. The hot press apparatus for semiconductor processing according to claim 3, wherein: The matching point glue device (6) comprises a second motor (61) vertically arranged at the bottom of one end of the positioning gear slot plate (43). The bottom output end of the second motor (61) is vertically provided with a first docking shaft (62). One end of the point glue frame (5) is vertically provided with a second docking shaft (63). The bottom of the first docking shaft (62) is provided with a protruding part, and the top of the second docking shaft (63) is provided with a recessed part. When the first docking shaft (62) moves to the top of the second docking shaft (63), the two are docked through the protruding part and the recessed part. After docking, the first docking shaft (62) rotates to drive the second docking shaft (63) to rotate synchronously. When the first docking shaft (62) moves to the middle of the positioning plate (23), the first docking shaft (62) and the second docking shaft (63) are separated from each other.

5. The hot press apparatus for semiconductor processing according to claim 4, wherein: The inside of the point glue frame (5) is provided with a glue injection groove (64). The bottom of the glue injection groove (64) is communicated with a plurality of point glue holes (51). The top of the glue injection groove (64) is provided through the top of the point glue frame (5). The glue injection end of the glue injection machine (52) passes through the side end of the point glue frame (5) and is located in the inside of the glue injection groove (64). One end of the inside of the glue injection groove (64) close to the first docking shaft (62) is provided with a sealing block (65). The sealing block (65) is slidingly connected with the glue injection groove (64) in the horizontal direction. When the sealing block (65) slides, the point glue hole (51) located at the bottom of the sealing block (65) and the gap between the two sides of the sealing block (65) and the two sides of the glue injection groove (64) are sealed. The top of the sealing block (65) is located above the point glue frame (5). The side end of the first docking shaft (62) is provided with a mounting block (66). The bottom of the mounting block (66) is connected with the top of the sealing block (65). The side of the mounting block (66) away from the first docking shaft (62) is horizontally provided with a clamping block (67) for clamping and limiting the side end of the chip.

6. The hot press apparatus for semiconductor processing according to claim 5, wherein: The top of the glue injection groove (64) is provided with a flexible sealing cloth (68). One end of the flexible sealing cloth (68) is connected with the side wall of the glue injection groove (64). The other end of the flexible sealing cloth (68) is connected with the side end of the sealing block (65).

7. The hot press apparatus for semiconductor processing according to claim 6, wherein: The point glue uniform distribution device (7) comprises an air injection groove (70) arranged in the point glue frame (5), the air injection groove (70) is located on one side of the glue injection groove (64), the top of the air injection groove (70) is arranged in an open mode, a plurality of air bags (71) are equidistantly arranged in the air injection groove (70), the air outlet at the bottom of each air bag (71) is communicated with an air outlet hole (69), and the air outlet hole (69) is arranged in an inclined mode towards the point glue nozzle (51).

8. The hot press apparatus for semiconductor processing according to claim 7, wherein: The first bevel gear (72) is vertically arranged on one side of the point glue frame (5), the second bevel gear (73) is horizontally arranged at the bottom of the second connecting shaft (63), the first bevel gear (72) is engaged with the second bevel gear (73), the matching gear (74) is horizontally arranged on one side of the second bevel gear (73), the matching gear (74) is engaged with the second bevel gear (73), one end of the matching gear (74) is connected with the positioning plate (23), the driving gear (75) is rotatably arranged on the middle part of one side of the point glue frame (5), a plurality of gear teeth are arranged on the outer side of the driving gear (75), the pressing plate (76) is slidably connected to the top of the air injection groove (70), the bottom of the pressing plate (76) is in contact with the top of the plurality of air bags (71), the tooth groove rod (77) is vertically arranged on the side, close to the first bevel gear (72), of the driving gear (75), the tooth groove rod (77) is engaged with the driving gear (75), the top of the tooth groove rod (77) is connected with the top of the pressing plate (76) through a connecting piece, the driving gear (75) and the first bevel gear (72) are rotatably connected with the point glue frame (5), and one belt wheel (78) is arranged at the rotatable connection position of each of the driving gear (75) and the first bevel gear (72).

9. The hot press apparatus for semiconductor processing according to claim 8, wherein: The positioning plate (23) is vertically arranged in the longitudinal movement assembly (3), and the middle part of the bottom of the positioning plate (23) is provided with the suction cup air cylinder (8) for adsorbing the top surface of the chip and driving the chip to ascend and descend.

10. The hot press apparatus for semiconductor processing according to claim 9, wherein: The suction cup air cylinder (8) is provided with the heating module (9) on one side for heating the chip.

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