Conductive cloth, conductive foam and electronic equipment

Abstract

The invention discloses conductive cloth, conductive foam and electronic equipment. The conductive cloth is formed by interweaving a plurality of strands of first wire harnesses and a plurality of strands of second wire harnesses. Each strand of first wire harness is a layer of first wire rod, the first wire rod comprises a plurality of first fiber yarns, each strand of second wire harness is a layer of second wire rod, and the second wire rod comprises a plurality of second fiber yarns. Or, each strand of first wire harness comprises two layers of first wires, each layer of first wires comprises a plurality of first fibers, each strand of second wire harness comprises two layers of second wires, and each layer of second wires comprises a plurality of second fibers. The conductive cloth is configured in a way that the effective contact area fraction of the conductive cloth and the device to be connected is greater than or equal to 50% under the condition that 0.2-0.4 N extrusion force is applied to the conductive cloth. According to the conductive fabric, the number of layers of the fibers forming the conductive fabric is reduced, the size and the weight of the conductive foam can be reduced, the surface of the conductive fabric is close to a plane, and the conductive fabric can be in full contact with a device to be connected under the condition of weak extrusion force.

Description

Conductive cloth, conductive foam and electronic device TECHNICAL FIELD

[0001] The present application relates to the technical field of electrical connectors, and more particularly, to a conductive cloth, a conductive foam and an electronic device. BACKGROUND

[0002] In electronic devices such as mobile phones, televisions, displays, notebook computers, tablet computers, and vehicle navigation systems, conductive foams are often used to fill gaps in electronic devices and connect to reference ground, or to electrically connect between shielding covers of electronic components inside electronic devices and reference ground, or to electrically connect between functional devices such as screens, camera modules, system on chips (SOC) and reference ground.

[0003] As electronic devices gradually develop towards miniaturization and thinness, the gap width in electronic devices for installing conductive foams is becoming smaller and smaller, making it difficult for existing conductive foam structures to be installed in gaps with a smaller width. In addition, when the conductive foam is applied to the grounding scheme of functional devices such as screens, applying a large extrusion force to the conductive foam can cause film printing on the screen and affect the texture. If the screen film printing is to be avoided, the extrusion force on the conductive foam needs to be weakened, and weakening the extrusion force will make the conductive cloth and the screen unable to fully contact, which can cause the third harmonic to easily occur at the contact interface, thereby bringing the risk of failing to pass the radiated spurious emission (RSE) regulation test.

[0004] Therefore, how to realize the thinness and full contact of the conductive foam under weak extrusion force is a problem that needs to be solved in the industry.

[0005] SUMMARY

[0006] The purpose of the present application is to provide a conductive cloth, a conductive foam and an electronic device. By reducing the number of layers of fiber filaments constituting the conductive cloth, the thickness of the conductive cloth can be reduced, and the amount of adhesive used for bonding can be reduced, thereby reducing the volume and weight of the conductive foam to realize the thinness and miniaturization of the conductive foam. After reducing the number of layers of fiber filaments, the surface of the conductive cloth tends to be planar, so that the conductive cloth can fully contact the device to be connected under weak extrusion force.

[0007] In a first aspect, the present application provides a conductive cloth, which is formed by interlacing a plurality of first strands and a plurality of second strands. Each first strand is a layer of first wire, and the first wire includes a plurality of first fiber filaments. Each second strand is a layer of second wire, and the second wire includes a plurality of second fiber filaments. Alternatively, each first strand is two layers of first wire, and each layer of first wire includes a plurality of first fiber filaments. Each second strand is two layers of second wire, and each layer of second wire includes a plurality of second fiber filaments.

[0008] The conductive cloth is configured such that, when the conductive cloth is subjected to a pressure of 0.2 N to 0.4 N, the effective contact area fraction of the conductive cloth with a device to be connected is greater than or equal to 50%.

[0009] The conductive cloth provided by the present application can reduce the thickness of the conductive cloth by thinning the first fiber filaments constituting the first strands to one or two layers and thinning the second fiber filaments constituting the second strands to one or two layers. The mass of the thinned conductive cloth is also reduced accordingly, thereby reducing the amount of adhesive used for bonding the conductive cloth. When the conductive cloth is applied to conductive foam, the volume and weight of the conductive foam can be reduced to achieve the lightness, thinness, and miniaturization of the conductive foam. In addition, due to the reduction in the number of layers of the first fiber filaments and the second fiber filaments, the overall surface of the conductive cloth tends to be planar. From a microscopic perspective, even under weak pressure, more first fiber filaments and second fiber filaments are drawn to the device to be connected, allowing more first fiber filaments and second fiber filaments to be deformed by the device to be connected. As a result, the conductive cloth has more contact area with the device to be connected, that is, the conductive cloth can fully contact the device to be connected under weak pressure. This increases the conductive path between the conductive cloth and the device to be connected, enhances the conductivity of the conductive cloth, and avoids screen printing on the screen connection scheme. In addition, the generation of third harmonic is weakened or even avoided, thereby ensuring the smooth passing of the radiation spurious test of the electronic device.

[0010] In a possible design, the plurality of first fiber filaments are not twisted with each other; and the plurality of second fiber filaments are not twisted with each other.

[0011] The plurality of first fiber filaments are arranged in a substantially side-by-side manner, and the plurality of second fiber filaments are also arranged in a substantially side-by-side manner. As a result, the portions of the first strands and the second strands other than the interlacing nodes tend to be planar, thereby improving the flatness of the conductive cloth. In addition, the conductive cloth can fully contact the device to be connected under weak pressure.

[0012] In a possible design, when each first strand includes one layer of first wire and each second strand includes one layer of second wire, the conductive cloth satisfies the following relationships: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R;

[0013] wherein a1 is the minimum distance from the cross-sectional center of the first fiber to the surface of the second fiber, a2 is the minimum distance from the cross-sectional center of the second fiber to the surface of the first fiber, and R is the cross-sectional radius of the first fiber and the second fiber.

[0014] In one possible design, when each strand of the first wire bundle includes two layers of the first wire and each strand of the second wire bundle includes two layers of the second wire, the conductive cloth satisfies the following relationship: 0.5R≤a1≤1.5R; 1.5R<b1≤3.5R; 0.5R≤a2≤1.5R; 1.5R<b2≤3.5R;

[0015] wherein a1 is the minimum distance from the cross-sectional center of the first fiber to the surface of the second fiber, b1 is the minimum distance from the cross-sectional center of the first fiber to the surface of the second fiber, a2 is the minimum distance from the cross-sectional center of the second fiber to the surface of the first fiber, b2 is the minimum distance from the cross-sectional center of the second fiber to the surface of the first fiber, and R is the cross-sectional radius of the first fiber and the second fiber.

[0016] In one possible design, the conductive cloth satisfies the following relationship:

[0017] n>m. Wherein n is the number of the first fiber in each layer of the first wire, and m is the number of the second fiber in each layer of the second wire.

[0018] Under the condition that the conductive cloth has the same area, the number of weaving nodes of the second wire bundle is reduced in the embodiment, thereby weakening the flatness problem of the conductive cloth caused by the recess at the weaving nodes, making the surface of the conductive cloth more close to a plane, making the conductive cloth better fit the device to be connected, and further making the conductive cloth maintain sufficient contact with the device to be connected to meet the use requirements of the conductive foam under weak extrusion pressure.

[0019] In one possible design, the conductive cloth further satisfies the following relationship: (n-m) / n≥50%.

[0020] The number of the first fiber in the first wire and the number of the second fiber in the second wire are further limited, and compared with the related art, under the condition that the conductive cloth has the same area, the number of weaving nodes can be reduced by 40%, so that the surface of the conductive cloth can be approximately a plane, and the effective contact area fraction can reach more than 65% when contacting the device to be connected.

[0021] In one possible design, the conductive cloth satisfies the following relationship:

[0022] m > n. Wherein, n is the number of first fiber filaments of each layer of first wire, and m is the number of second fiber filaments of each layer of second wire.

[0023] In the embodiment, the number of weaving nodes of the first wire bundle is reduced, so that the flatness problem of the conductive cloth caused by the recess at the weaving node is weakened, the surface of the conductive cloth is closer to a plane, the fit of the conductive cloth and the device to be connected is better, and the conductive cloth and the device to be connected are kept in sufficient contact to meet the use requirements of the conductive foam under weak extrusion pressure.

[0024] In a possible design, the conductive cloth further satisfies the following relationship: (m-n) / m≥50%.

[0025] The number of first fiber filaments in the first wire and the number of second fiber filaments in the second wire are further limited, and compared with related art, the number of weaving nodes can be reduced by 40% under the condition that the conductive cloth has the same area, so that the surface of the conductive cloth is approximately a plane, and the effective contact area fraction can reach more than 65% when contacting the device to be connected.

[0026] In a possible design, the conductive cloth has no first wire bundle in some areas.

[0027] The part of the area on the conductive cloth has no weaving node, so that the surface of the part of the area is closer to a plane, the fit of the conductive cloth and the device to be connected is better, and the conductive cloth and the device to be connected are kept in sufficient contact to meet the use requirements of the conductive foam under weak extrusion pressure.

[0028] In a possible design, the conductive cloth has no second wire bundle in some areas.

[0029] The part of the area on the conductive cloth has no weaving node, so that the surface of the part of the area is closer to a plane, the fit of the conductive cloth and the device to be connected is better, and the conductive cloth and the device to be connected are kept in sufficient contact to meet the use requirements of the conductive foam under weak extrusion pressure.

[0030] In a possible design, the surface of the conductive cloth is coated with a conductive paste.

[0031] The gap between the fiber filaments is filled by the conductive paste, and the recess at the weaving node of the first wire bundle and the second wire bundle is also filled, so that the surface of the conductive cloth is closer to a plane, the fit of the conductive cloth and the device to be connected is better, and the conductive cloth and the device to be connected are kept in sufficient contact to meet the use requirements of the conductive foam under weak extrusion pressure.

[0032] In a possible design, the conductive cloth satisfies the following relationship: d1>h1; d2>h2.

[0033] wherein d1 is the cross-sectional width of the first fiber, h1 is the cross-sectional height of the first fiber, d2 is the cross-sectional width of the second fiber, and h2 is the cross-sectional height of the second fiber.

[0034] The fiber is pre-processed to have a cross-sectional width greater than a cross-sectional height, that is, the fiber is flat and has an approximately elliptical cross section. Weaving such a fiber into a conductive cloth has two effects: first, a smaller number of fibers can be used to weave a larger conductive cloth; and second, the wider cross-sectional width of the fiber fills the pores formed by the reduction in the number of fiber layers, so that the surface of the conductive cloth is closer to a plane.

[0035] In a possible design, the conductive cloth further satisfies the following relationship: d1 / h1>130%; d2 / h2>130%.

[0036] The relationship between the cross-sectional width and the cross-sectional height of the fiber is further limited, so that the fiber can be used to weave a larger-area and smaller-pore conductive cloth with a smaller number of fibers.

[0037] In a possible design, the thickness of the conductive cloth is less than or equal to 20 microns.

[0038] In a possible design, the first fiber is a metal fiber; or the first fiber is formed by coating a non-metal fiber with a metal plating layer.

[0039] The second fiber is a metal fiber; or the second fiber is formed by coating a non-metal fiber with a metal plating layer.

[0040] In a possible design, the metal fiber is made of at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

[0041] In a possible design, the non-metal fiber is made of at least one of natural fiber, carbon fiber, ceramic fiber, silicon carbide fiber, glass fiber, polyamide fiber, polyester fiber, polyphenylsulfone terephthalamide fiber, aromatic polyamide fiber, and poly-p-phenylene benzobisoxazole fiber.

[0042] In a possible design, the first fiber and the second fiber are made of the same material or different materials.

[0043] In a possible design, the conductive paste is made of at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

[0044] In a second aspect, the present application also provides a conductive foam, comprising the conductive cloth of any one of the above.

[0045] The conductive foam in the present application comprises the conductive cloth, which can reduce the thickness of the conductive cloth by thinning the first fiber yarns constituting the first bundle to one or two layers and thinning the second fiber yarns constituting the second bundle to one or two layers, and the mass of the thinned conductive cloth is also reduced accordingly, thereby reducing the amount of adhesive used for bonding the conductive cloth, and thus reducing the volume and weight of the conductive foam to achieve the lightness and miniaturization of the conductive foam. In addition, due to the reduction in the number of layers of the first fiber yarns and the second fiber yarns, the overall surface of the conductive cloth tends to be planar, thereby enabling the conductive cloth to achieve sufficient contact with the device to be connected under weak extrusion pressure, thereby increasing the conductive path of the conductive cloth and the device to be connected, enhancing the conductivity of the conductive cloth, and avoiding screen printing when the conductive cloth is applied to the screen connection scheme. In addition, the generation of third harmonic is also weakened or even avoided, thereby ensuring the smooth passing of the radiation spurious test of the electronic device.

[0046] In a possible design, the conductive foam further comprises a bubble core and an adhesive, and the conductive cloth is bonded to the surface of the bubble core by the adhesive.

[0047] In a possible design, the conductive foam further comprises an insulating adhesive, which is arranged on the surface of the bubble core and used to bond the bubble core to the component to be connected.

[0048] The insulating adhesive is used to bond and fix the conductive foam as a whole to the component to be connected. In addition, the insulating adhesive is mainly selected to improve the bonding strength. In the related art, the conductive foam is usually bonded and fixed as a whole by using conductive adhesive. However, since the conductive adhesive mainly comprises two parts of conductive particles (for conducting) and adhesive (for bonding), and the insulating adhesive only has adhesive, the insulating adhesive contains more adhesive and thus has greater bonding strength under the premise that the conductive adhesive and the insulating adhesive have the same weight.

[0049] In a possible design, the insulating adhesive is located in the middle or adjacent to the edge of the surface of the bubble core.

[0050] When the insulating adhesive is located in the middle of the surface of the bubble core, the conductive foam is bonded to the component at the middle part, so that the fixed constraint point of the conductive foam is located in the middle and can be kept stable to improve the shock resistance of the conductive foam.

[0051] The insulating adhesive is adjacent to the edge of the bubble core, so that the fixed constraint point of the conductive foam is located at the edge, and this design can be used in some narrow special installation scenarios.

[0052] In a possible design, the surface of the foam core has an avoiding area where no conductive cloth is arranged.

[0053] The surface of the foam has an avoiding area where no conductive cloth is arranged, so as to avoid false connection to non-grounded components, and facilitate installation of the conductive foam.

[0054] In a possible design, the number of the conductive cloths is two, and the two conductive cloths are oppositely arranged on the surface of the foam core, and the pores of the foam core are filled with conductive paste.

[0055] Since only the two opposite surfaces of the foam core are provided with the conductive cloths, and no conductive cloth is arranged on the peripheral wall of the foam core, the volume of the conductive foam can be further reduced. In addition, the pores of the foam core are filled with the conductive paste, and the conductive paste can electrically connect the upper and lower conductive cloths when the conductive foam is pressed, so as to ensure that the conductive foam can be electrically connected.

[0056] In a third aspect, the present application also provides an electronic device comprising the conductive foam according to any one of the above.

[0057] The electronic device in the embodiment can be more easily installed in the electronic device due to the miniaturization and thinness of the conductive foam, so as to reduce the manufacturing difficulty of the electronic device. Meanwhile, the conductive foam occupies less internal space, which is beneficial to layout optimization of other functional components, so as to further reduce the manufacturing difficulty of the electronic device. In addition, the conductive foam can avoid screen printing and weaken or even avoid the generation of third harmonic when applied to the screen grounding scheme, so as to ensure that the electronic device can pass the radiation spurious test. BRIEF DESCRIPTION OF DRAWINGS

[0058] FIG. 1 is a schematic diagram of a conductive foam in the related art;

[0059] FIG. 2 is a real cross-sectional view of a conductive cloth in the related art;

[0060] FIG. 3 is a schematic diagram of a smart phone according to an embodiment of the present application;

[0061] FIG. 4 is a cross-sectional view of T-T in FIG. 3;

[0062] FIG. 5 is a cross-sectional view of an example of a camera module of a smart phone according to an embodiment of the present application;

[0063] FIG. 6 is a cross-sectional view of another example of a camera module of a smart phone according to an embodiment of the present application;

[0064] FIG. 7 is a cross-sectional view of four embodiments of a conductive foam according to an embodiment of the present application;

[0065] FIG. 8 is a cross-sectional view of another example of a conductive foam according to an embodiment of the present application;

[0066] Fig. 9 is a sectional view of another example of the conductive foam according to an embodiment of the present application;

[0067] Fig. 10 is a schematic diagram of the working principle of the conductive foam in Fig. 9;

[0068] Fig. 11 is a sectional view of another example of the conductive foam according to an embodiment of the present application;

[0069] Fig. 12 is a schematic diagram of an example of the conductive cloth according to an embodiment of the present application;

[0070] Fig. 13 is a sectional view of an example of E-E in Fig. 12;

[0071] Fig. 14 is a sectional view of an example of M-M in Fig. 12;

[0072] Fig. 15 is a schematic diagram of the conductive cloth and the screen in Fig. 13 being attached to each other;

[0073] Fig. 16 is a top view of the screen being grounded through the conductive foam according to an embodiment of the present application;

[0074] Fig. 17 is a sectional view of an example of U-U in Fig. 16;

[0075] Fig. 18 is a top view of the circuit board being grounded through the conductive foam according to an embodiment of the present application;

[0076] Fig. 19 is a sectional view of V-V in Fig. 18;

[0077] Fig. 20 is a sectional view of another example of E-E in Fig. 12;

[0078] Fig. 21 is a sectional view of another example of M-M in Fig. 12;

[0079] Fig. 22 is a schematic diagram of the first fiber and the second fiber according to an embodiment of the present application;

[0080] Fig. 23 is a schematic diagram of the conductive cloth and the screen in Fig. 20 being attached to each other;

[0081] Fig. 24 is a schematic diagram of another example of U-U in Fig. 16;

[0082] Fig. 25 is a schematic diagram of another example of the conductive cloth according to an embodiment of the present application;

[0083] Fig. 26 is a sectional view of an example of F-F in Fig. 25;

[0084] Fig. 27 is a sectional view of an example of G-G in Fig. 25;

[0085] Fig. 28 is a schematic diagram of another example of the conductive cloth according to an embodiment of the present application;

[0086] Fig. 29 is a cross-sectional view of an example of H-H in Fig. 28;

[0087] Fig. 30 is a cross-sectional view of an example of J-J in Fig. 28;

[0088] Fig. 31 is a schematic view of another example of the conductive cloth provided by the embodiments of the present application;

[0089] Fig. 32 is a cross-sectional view of an example of L-L in Fig. 31;

[0090] Fig. 33 is a schematic view of another example of the conductive cloth provided by the embodiments of the present application;

[0091] Fig. 34 is a cross-sectional view of an example of K-K in Fig. 33;

[0092] Fig. 35 is a cross-sectional view of another example of E-E in Fig. 12;

[0093] Fig. 36 is a cross-sectional view of another example of E-E in Fig. 12;

[0094] Fig. 37 is a cross-sectional view of another example of F-F in Fig. 25;

[0095] Fig. 38 is a cross-sectional view of another example of K-K in Fig. 33;

[0096] Fig. 39 is a cross-sectional view of another example of E-E in Fig. 12;

[0097] Fig. 40 is a cross-sectional view of another example of M-M in Fig. 12;

[0098] Fig. 41 is a cross-sectional view of another example of E-E in Fig. 12;

[0099] Fig. 42 is a cross-sectional view of another example of E-E in Fig. 12.

[0100] Reference signs:

[0101] 10', warp; 20', weft;

[0102] 10, first bundle of wires; 11, first wire; 111, first fiber wire;

[0103] 20, second bundle of wires; 21, second wire; 211, second fiber wire;

[0104] 30, conductive paste;

[0105] 100, conductive foam; 101, conductive cloth; 102, adhesive; 103, foam core; 103a, avoidance area; 104, insulating adhesive;

[0106] 200, screen;

[0107] 300, case; 301, middle frame; 302, battery cover;

[0108] 400, circuit board; 401, electronic component; 402, solder pad;

[0109] 500, shield case;

[0110] 600, camera module; 601, steel sheet support; 602, copper foil;

[0111] 700, antenna. DETAILED DESCRIPTION

[0112] The following will describe the related content that the embodiments of the present application can involve. Obviously, the described embodiments are only some of the embodiments of the present application, not all the embodiments.

[0113] In the description of the present application, it should be noted that unless otherwise explicitly specified and limited, the terms "mounting", "connection", "connecting" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be mechanically connected, or electrically connected, or can be in communication with each other; can be directly connected, or indirectly connected through an intermediate medium; can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meaning of the above terms in the present application can be understood according to the specific circumstances.

[0114] In the description of the present application, it should be understood that the terms "upper", "lower", "side", "inner", "outer", "top", "bottom" and the like indicate the orientation or positional relationship based on the installation, and are only used to facilitate the description of the present application and simplify the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation on the present application.

[0115] It should also be noted that the same reference signs in the embodiments of the present application represent the same component or the same part, and for the same parts in the embodiments of the present application, only one part or component may be labeled with reference signs in the drawing, and it should be understood that the reference signs are also applicable to other identical parts or components.

[0116] In the description of the present application, it should be noted that the term "and / or" is only a description of the association relationship between the associated objects, which means that there can be three relationships, for example, A and / or B, which can represent the three cases of A alone, A and B together, and B alone.

[0117] In electronic devices such as mobile phones, televisions, displays, notebook computers, tablet computers, and car navigation systems, conductive foam is often used to fill the gaps of electronic devices and connect the reference ground, or to electrically connect the shielding cover of electronic components inside the electronic device and the reference ground, or to electrically connect functional devices such as screens, camera modules, and system-on-chip devices and the reference ground.

[0118] FIG. 1 is a schematic diagram of a conductive foam 100 in the related art.

[0119] As shown in FIG. 1, the current conductive foam 100 is usually composed of a foam core 103, an adhesive 102, and a conductive cloth 101. The conductive cloth 101 is fixed to the outside of the foam core 103 by the adhesive 102. When the conductive foam 100 is in contact with the device to be connected, the current is mainly conducted through the conductive cloth 101.

[0120] When the conductive foam 100 is compressed, the overall deformation of the conductive foam 100 is mainly caused by the shrinkage of the pores of the foam core 103. The conductive cloth 101 is woven from warp and weft threads. At the microscopic level, the warp and weft threads can be slightly compressed, and the compression amount is relatively small.

[0121] In the industry, the main improvement ideas for the thinning design of the conductive foam 100 focus on changing the material properties of the foam core 103 and adjusting the use of the adhesive 102, and in addition, the structure of the conductive cloth 101 is improved. In this application, a new improvement scheme for the conductive cloth 101 will be proposed.

[0122] The current conductive cloth 101 is mostly plain weave conductive cloth, which is woven from multiple warp threads and multiple weft threads. Each warp thread or weft thread is usually composed of three or more layers of fiber filaments, and the overall thickness of the conductive cloth 101 is 30-100 pm. By using three or more layers of fiber filaments to form the warp threads or weft threads, the woven conductive cloth 101 can increase the weaving density and reduce the porosity. However, the overall thickness of the conductive cloth 101 with this structure is relatively large, which makes it difficult to install in a gap with a small width. In addition, the conductive cloth 101 formed by three or more layers of fiber filaments has an uneven surface, and the conductive foam 100 cannot achieve full contact between the conductive cloth 101 and the device to be connected under weak pressure. The use scenario is greatly limited. The following will be described in detail in conjunction with the accompanying drawings.

[0123] Figure 2 is a real cross-sectional view of the conductive cloth 101 in the related art. In Figure 2, the conductive cloth 101 is a real photograph taken by an electron microscope with a magnification of 500 times, and the conductive cloth 101 in Figure 2 is in a natural state without force. As shown in Figure 2, the warp 10' and weft 20' of the conductive cloth 101 can be seen from the cross-section of the conductive cloth 101, which are composed of three layers of fiber filaments, wherein the A layer fiber filament is defined as the outermost fiber filament, the C layer fiber filament is defined as the fiber filament in contact with the weft 20', and the B layer fiber filament is defined as the fiber filament between the A layer and the C layer. Figure 3 is a schematic diagram of a smart phone according to an embodiment of the present application. In Figure 3, (a) is a schematic diagram of the front of the smart phone; (b) is a schematic diagram of the back of the smart phone.

[0124] As shown in Figures 2 and 3, in Figure 2, the overall thickness of the conductive cloth 101 woven by the warp 10' and weft 20' composed of three layers of fiber filaments is large, and after it is applied to the conductive foam 100, it is not conducive to the lightness and thinness of the conductive foam 100. In addition, when the conductive foam 100 is applied in the scenario of the screen 200 grounding, the surface of the conductive cloth 101 facing the screen 200 presents a concave-convex form, especially at the weaving nodes between the warp 10' and the weft 20' (i.e. the position indicated by D1 in the figure), which is deeply concave, while the part of the warp 10' and the weft 20' closest to the screen 200 (i.e. the positions indicated by D2 and D3 in the figure) is obviously convex, and it can be seen that the warp 10' is significantly higher than the weft 20'. In this case, in order to make the conductive cloth 101 fully contact the screen 200, it is necessary to increase the extrusion force on the conductive foam 100, so that the surface of the conductive cloth 101 is extruded by the screen 200 to present a flat form, thereby increasing the effective contact area between the conductive cloth 101 and the screen 200, but excessive extrusion force will cause the screen 200 to appear to be imprinted. If the screen 200 film is to be avoided, the extrusion force on the conductive foam 100 needs to be weakened, and weakening the extrusion force will make the conductive cloth 101 unable to fully contact the screen 200. After analysis, under the condition of weak extrusion force, only the warp 10' at D2 is the main contact part of the conductive cloth 101, and the weft 20' at D3 and the weaving nodes at D1 are difficult to contact the screen 200. In the case that the conductive cloth 101 cannot fully contact the screen 200, it will cause the contact interface to easily produce third harmonic, thereby bringing the risk that the radiation spurious test cannot pass. The theoretical basis will be described in detail below.

[0125] According to the research theory, the key parameters that affect the third harmonic current value I of the conductive foam 100 are:

[0126] Wherein, k is the interface effective contact area fraction, F is the contact pressure, S is the size of the conductive foam, p is the resistivity, the third harmonic current value I is proportional to the above parameters.

[0127] As described above, the main factors affecting the third harmonic current I include the contact pressure F and the effective contact area fraction k. The contact pressure F is the extrusion force of the screen 200 on the conductive cloth 101 mentioned above, and the contact pressure F is negatively correlated with the third harmonic current I, that is, the greater the contact pressure F, the smaller the third harmonic current I, however, limited by the problem of screen 200 stamping, the extrusion force of the screen 200 on the conductive cloth 101 cannot be too large, that is, the value of the contact pressure F is limited; the effective contact area fraction k is the contact degree of the screen 200 and the conductive cloth 101 mentioned above, the greater the effective contact area fraction k, the more sufficient the contact between the screen 200 and the conductive cloth 101, and the effective contact area fraction k is also negatively correlated with the third harmonic current I, that is, the greater the effective contact area fraction k, the smaller the third harmonic current I. Therefore, in order to weaken the third harmonic at the contact interface between the conductive foam 100 and the screen 200, it is necessary to ensure that the screen 200 and the conductive cloth 101 can be in sufficient contact.

[0128] In summary, the conductive cloth 101 in the related art has two problems, one is that it cannot meet the light and thin requirements of the conductive foam 100, and the other is that it cannot be in sufficient contact with the device to be connected under weak extrusion force.

[0129] Therefore, in order to solve the above technical problems, the present application provides a conductive cloth, a conductive foam and an electronic device, by reducing the number of layers of the fiber yarn constituting the conductive cloth, the thickness of the conductive cloth can be thinned, and the amount of adhesive used for bonding can be reduced, thereby reducing the volume and weight of the conductive foam, to realize the lightness and thinness and miniaturization of the conductive foam; after reducing the number of layers of the fiber yarn, the surface of the conductive cloth tends to be planar, so that the conductive cloth can also be in sufficient contact with the device to be connected under weak extrusion force.

[0130] The electronic device can also be referred to as a mobile device, a terminal device, a mobile terminal, or a terminal. The electronic device includes, but is not limited to, a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing devices connected to a wireless modem. For example, the electronic device can include a smart watch, a smart wristband, a smart phone, a personal digital assistant (PDA) computer, a tablet computer, a notebook computer, a vehicle-mounted computer, smart glasses, a game console, and other electronic devices with the conductive foam 100 and a need for thin design.

[0131] To more conveniently describe the electronic device provided by the embodiments of the present application, as an example but not limitation, the technical solutions of the present application will be described in detail below with the electronic device being a smart phone. Meanwhile, for the convenience of description of each embodiment below, an XYZ coordinate system is established for the smart phone. Specifically, the extension direction of the short side of the smart phone is defined as the X direction, the extension direction of the long side of the smart phone is defined as the Y direction, and the thickness direction of the smart phone is defined as the Z direction, and the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0132] Continuing to refer to FIG. 3, the smart phone provided by the embodiments of the present application includes a screen 200, a casing 300, and the conductive foam 100 (not shown in FIG. 3). The casing 300 further includes a middle frame 301 and a battery cover 302. The front end surface of the middle frame 301 is fixedly provided with the screen 200, and the rear end surface of the middle frame 301 is fixedly provided with the battery cover 302. The screen 200, the middle frame 301, and the battery cover 302 jointly define a containing space of the smart phone, which is used to install various functional elements of the smart phone, such as the conductive foam 100, the camera module 600, the circuit board 400, and other functional elements mentioned below.

[0133] Optionally, the battery cover 302 can be covered on the middle frame 301 by screwing, clamping, or the like. A sealing ring can be arranged between the battery cover 302 and the middle frame 301 to improve the sealing and waterproof effect of the joint between the battery cover 302 and the middle frame 301. The sealing ring can be made of high-elasticity materials such as silica gel or rubber.

[0134] In addition, the smart phone can further include a processor, a universal serial bus (USB) interface, a charging management module, a power management module, a battery, a microphone, a mobile communication module, an antenna, a wireless communication module, an audio module, an earphone interface, a sensor module, a key, and a subscriber identification module (SIM) card interface.

[0135] The functional elements can be changed according to user needs, and it can be understood that the specific embodiments described above are only a specific implementation of the present application, and other ways that can implement the scheme of the present application are also within the scope of protection of the present application, and are not described here.

[0136] Fig. 4 is a sectional view of T-T in Fig. 3.

[0137] As shown in Fig. 4, in the scenario that the screen 200 of the smart phone is grounded, the inner side of the screen 200, i.e. the side of the screen 200 facing the inside of the phone, is connected with the conductive foam 100, and the side of the screen 200 facing the inside of the phone is also provided with the metal middle frame 301 at intervals, so that the conductive foam 100 is compressed between the screen 200 and the metal middle frame 301, thereby realizing the grounding of the screen 200.

[0138] Continuing to refer to Fig. 4, the circuit board 400 of the smart phone has various electronic components 401 such as resistors, capacitors, and chips, in order to shield the influence of external electromagnetic waves on the internal circuit and the external radiation of the internally generated electromagnetic waves, part of the electronic components 401 need to be covered with a shielding cover 500, and in the scenario that the shielding cover 500 is grounded, the metal middle frame 301, the conductive foam 100, and the shielding cover 500 are sequentially laminated, and the conductive foam 100 is compressed between the shielding cover 500 and the metal middle frame 301, thereby realizing the grounding of the shielding cover 500.

[0139] In addition to being used for the grounding of the screen 200 and the grounding of the shielding cover 500, the conductive foam 100 in the embodiments of the present application can also be used for electrical connection between other functional elements, for example, continuing to refer to Fig. 4, the antenna 700 is made on the battery cover 302 of the smart phone by laser direct structuring (LDS) technology or by a flexible circuit board, and the conductive foam 100 is arranged between the circuit board 400 and the battery cover 302, so that the antenna 700 on the circuit board 400 and the battery cover 302 is electrically connected through the conductive foam 100. Generally, two to four antennas 700 are needed for each signal frequency band, and each antenna 700 has two connection points to form a feed point, so two conductive foams 100 are needed for each antenna 700.

[0140] Figure 5 is a cross-sectional view of an example of the camera module 600 of the smart phone according to an embodiment of the present application.

[0141] As shown in Figure 5, in the grounding scenario of the camera module 600 of the smart phone, a copper foil 602 is arranged on the side of the camera module 600 away from the lens, a steel sheet support 601 is arranged above the copper foil 602, and a conductive foam 100 compressed and deformed is arranged in the gap between the copper foil 602 and the steel sheet support 601. The end of the steel sheet support 601 is fixed on the power terminal of the circuit board 400 by a screw, thereby realizing the grounding of the camera module 600.

[0142] Figure 6 is a cross-sectional view of another example of the camera module 600 of the smart phone according to an embodiment of the present application.

[0143] As shown in Figure 6, in another scenario, due to the limited internal space of the smart phone, the gap between the camera module 600 and the steel sheet support 601 can not be wide enough to provide sufficient layout space for the conductive foam 100. In this case, only the conductive cloth 101 can be arranged between the copper foil 602 and the steel sheet support 601, and the electrical connection between the copper foil 602 and the steel sheet support 601 is established through the conductive cloth 101, thereby realizing the grounding of the camera module 600.

[0144] Similarly to the above scenario, in other scenarios, for example, in the grounding scenario of the screen 200, only the conductive cloth 101 can be used to realize the electrical connection between the screen 200 and the metal middle frame 301, thereby realizing the grounding of the screen 200; for example, in the grounding scenario of the shielding cover 500, only the conductive cloth 101 can be used to realize the electrical connection between the shielding cover 500 and the metal middle frame 301, thereby realizing the grounding of the shielding cover 500; for example, the electrical connection between the circuit board 400 and the antenna 700, and the electrical connection between other functional elements, can all be realized only through the conductive cloth 101.

[0145] Figure 7 is a cross-sectional view of four embodiments of the conductive foam 100 according to an embodiment of the present application. In Figure 7, (a) is a D-shaped conductive foam; (b) is an L-shaped conductive foam; (c) is a T-shaped conductive foam; and (d) is a P-shaped conductive foam.

[0146] As shown in Figure 7, the present application further provides a conductive foam 100. The cross section of the conductive foam 100 includes but is not limited to D-shaped, L-shaped, T-shaped, P-shaped, etc. The conductive foam 100 includes a conductive cloth 101, a foam core 103, and an adhesive 102. The conductive cloth 101 is adhered to the outside of the foam core 103 by the adhesive 102.

[0147] Optionally, the material of the bubble core 103 includes, but is not limited to, foamed polyurethane, foamed polypropylene, foamed polyethylene, special rubber, ethylene-vinyl acetate copolymer (EVA), ethylene-propylene-diene rubber, etc.

[0148] Optionally, the adhesive 102 includes, but is not limited to, heat-curing adhesive, pressure-sensitive adhesive, light-sensitive adhesive, etc.

[0149] Optionally, in addition to the above-mentioned D-shaped, L-shaped, T-shaped, and P-shaped, the cross-sectional shape of the conductive bubble cotton 100 in the present application can also be triangular, circular, oval, polygonal, and other irregular special-shaped structures.

[0150] FIG. 8 is a sectional view of another example of the conductive bubble cotton 100 provided in an embodiment of the present application.

[0151] As shown in FIG. 8, in one embodiment provided in the present application, the conductive bubble cotton 100 further includes an insulating adhesive 104, which is arranged on the surface of the bubble core 103 and used to bond the bubble core 103 to the component to be connected.

[0152] In the present embodiment, the insulating adhesive 104 serves the purpose of bonding and fixing the conductive bubble cotton 100 as a whole to the component to be connected. In addition, the insulating adhesive 104 is mainly selected to improve the bonding strength. In the related art, the conductive bubble cotton 100 is usually bonded and fixed as a whole by using conductive adhesive. However, since the conductive adhesive is mainly composed of two parts, namely, conductive particles (for conducting electricity) and adhesive (for bonding), while the insulating adhesive 104 only has adhesive, under the premise that the conductive adhesive and the insulating adhesive 104 are of the same weight, the insulating adhesive 104 contains more adhesive and thus has greater bonding strength.

[0153] Optionally, the insulating adhesive 104 can be arranged on the top of the bubble core 103; or the insulating adhesive 104 can be arranged on the bottom of the bubble core 103, for example, as shown in FIG. 8; or the insulating adhesive 104 can also be arranged on the side of the bubble core 103.

[0154] As shown in FIG. 8, in one embodiment provided in the present application, the insulating adhesive 104 is located in the middle of the surface of the bubble core 103 having the insulating adhesive 104.

[0155] In the present embodiment, the insulating adhesive 104 is located in the middle of the side surface of the bubble core 103, which makes the conductive bubble cotton 100 as a whole bonded to the component at the middle part, so that the fixed constraint point of the conductive bubble cotton 100 is located in the middle and can be kept stable, thereby improving the shock resistance of the conductive bubble cotton 100.

[0156] Of course, in other embodiments, the insulating glue 104 can also be disposed at the edge of the bubble core 103. For example, FIG. 9 is a sectional view of another example of the conductive bubble cotton 100 provided in an embodiment of the present application. As shown in FIG. 9, in an embodiment provided in the present application, the insulating glue 104 is adjacent to the edge on the surface of the bubble core 103.

[0157] In the embodiment, the insulating glue 104 is adjacent to the edge of the bubble core 103, so that the fixed constraint point of the conductive bubble cotton 100 is located at the edge, which can be used in some special narrow installation scenarios.

[0158] As shown in FIG. 9, in an embodiment provided in the present application, the surface of the bubble core 103 has an avoiding area 103a where the conductive cloth 101 is not disposed.

[0159] In the embodiment, the surface of the bubble cotton has the avoiding area 103a where the conductive cloth 101 is not disposed, so as to avoid false connection to the non-grounded components, thereby facilitating the installation of the conductive bubble cotton 100. For example, if the installation space is narrow and the side of the installation site has a component that does not need to be grounded, the conductive bubble cotton 100 cannot avoid the component as a whole, and the avoiding area 103a can be used to stick to the component, thereby avoiding false connection to the component.

[0160] FIG. 10 is a schematic diagram of the working principle of the conductive bubble cotton 100 in FIG. 9.

[0161] Taking the screen 200 grounding scenario of a smart phone as an example, as shown in FIG. 10, the components at the top and bottom of the conductive bubble cotton 100 are the screen 200 and the metal middle frame 301 respectively. After the screen 200 and the metal middle frame 301 deform the conductive bubble cotton 100, the conductive cloth 101 of the conductive bubble cotton 100 is tightly attached to the opposite surfaces of the screen 200 and the metal middle frame 301. Under the skin effect, the static electricity and interference current accumulated on the screen 200 flow to the metal middle frame 301 through the conductive cloth 101, and then the metal middle frame 301 conducts the current to the user's hand or the external environment, so as to reduce the influence of the static electricity and the interference current on the screen 200 and ensure the normal work of the screen 200.

[0162] FIG. 11 is a sectional view of another example of the conductive bubble cotton 100 provided in an embodiment of the present application.

[0163] As shown in FIG. 11, in an embodiment provided in the present application, the number of the conductive cloth 101 is two, and the two conductive cloths 101 are oppositely disposed on the surface of the bubble core 103, and the pores of the bubble core 103 are filled with the conductive paste 30.

[0164] In the embodiment, the volume of the conductive foam 100 can be further reduced since the conductive cloth 101 is not arranged on the peripheral wall of the bubble core 103. Moreover, the bubble core 103 is filled with the conductive slurry 30, and the conductive foam 100 can realize the electrical connection between the upper and lower conductive cloths 101 when being extruded, thereby ensuring that the conductive foam 100 can be electrically connected.

[0165] It is mentioned above that the application will focus on the new improved scheme of the conductive cloth 101. The conductive cloth 101 provided by the embodiment of the application will be described in detail in combination with the drawings.

[0166] FIG. 12 is a schematic view of an example of the conductive cloth 101 provided by the embodiment of the application. FIG. 13 is a sectional view of an example of E-E in FIG. 12. FIG. 14 is a sectional view of an example of M-M in FIG. 12.

[0167] As shown in FIGS. 12-14, in an embodiment provided by the application, the conductive cloth 101 is formed by interlacing the plurality of first thread bundles 10 and the plurality of second thread bundles 20. Each first thread bundle 10 is a layer of first wire 11, and the first wire 11 includes a plurality of first fiber filaments 111. Each second thread bundle 20 is a layer of second wire 21, and the second wire 21 includes a plurality of second fiber filaments 211. In addition, the conductive cloth 101 is configured such that, under the condition of applying an extrusion force of 0.2 N to 0.4 N to the conductive cloth 101, the effective contact area fraction of the conductive cloth 101 with the device to be connected is greater than or equal to 50%.

[0168] It should be noted that, in the embodiment of the application, the first thread bundle 10 can be the warp, and the second thread bundle 20 corresponds to the weft. The first thread bundle 10 can be the weft, and the second thread bundle 20 corresponds to the warp.

[0169] As shown in FIGS. 13 and 14, in an embodiment provided by the application, the conductive cloth 101 satisfies the following relationship: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R;

[0170] wherein a1 is the minimum distance from the center of the cross section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 to the surface of the first fiber filament 111, and R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211.

[0171] The cross-sectional shape of the first fiber filaments 111 and the second fiber filaments 211 in the embodiment is circular, and the value range of R includes but is not limited to 5-10 μm. It should be noted that the layer number limitation of the conductive cloth 101 in the present application is the layer number when the conductive cloth 101 is in a natural state and is not pressed by the device to be connected; the value of R is the cross-sectional radius when the first fiber filaments 111 and the second fiber filaments 211 are in a natural state and are not pressed by the device to be connected.

[0172] In order to prevent the entanglement between the plurality of first fiber filaments 111 and the entanglement between the plurality of second fiber filaments 211, and to ensure the flatness of the surface of the conductive cloth 101, as shown in FIGS. 13 and 14, in an embodiment provided by the present application, the plurality of first fiber filaments 111 are not twisted with each other; and the plurality of second fiber filaments 211 are not twisted with each other.

[0173] In the present application, the twisting and the non-twisting refer to the twist processing of the fiber filaments in the textile process. The twisting is to rotate the fiber filaments so that the filaments are entangled together to form a certain twist, and the non-twisting refers to the fiber filaments that are not subjected to twist processing and the filaments are not entangled together.

[0174] In the embodiment, the plurality of first fiber filaments 111 are not twisted with each other, so that the plurality of first fiber filaments 111 are arranged in a substantially side-by-side manner, and the plurality of second fiber filaments 211 are also not twisted with each other, so that the plurality of second fiber filaments 211 are also arranged in a substantially side-by-side manner. Thus, the portions of the first wire bundle 10 and the second wire bundle 20 except the weaving nodes tend to be planar, thereby improving the flatness of the conductive cloth 101, and further enabling the conductive cloth 101 to be in full contact with the device to be connected under the condition of weak pressing force.

[0175] FIG. 15 is a schematic view of the conductive cloth 101 and the screen 200 in FIG. 13.

[0176] Taking the screen 200 of a smart phone as an example, FIG. 15 shows the scenario that the conductive cloth 101 and the screen 200 are attached to each other when the conductive foam 100 is not compressed. As shown in FIG. 15, the conductive cloth 101, the first wire bundle 10 and the second wire bundle 20 in the embodiment are all composed of one layer of fiber filaments. Compared with the conductive cloth 101 of the related art in FIG. 2, it can be seen that the surface of the conductive cloth 101 in the embodiment is closer to a plane, which enables the conductive cloth 101 to be in full contact with the screen 200 under the condition of weak pressing force.

[0177] FIG. 16 is a top view of the screen 200 grounded through the conductive foam 100, wherein FIG. 16 is a top view from the inner side of the screen 200. FIG. 17 is a cross-sectional view of an example of U-U in FIG. 16, wherein the foam core 103 is omitted in FIG. 17.

[0178] As shown in FIGS. 16-17, after the screen 200 applies the extrusion force to the conductive foam 100, the screen 200 extrudes the surface of the conductive cloth 101 into a substantially planar shape. Since the surface of the conductive cloth 101 is more planar in the initial stage, the screen 200 does not need to apply a large extrusion force. A weak extrusion force can make the surface of the conductive cloth 101 present a planar shape. From a microscopic perspective, more first fiber filaments 111 and second fiber filaments 211 move closer to the screen 200, and more first fiber filaments 111 and second fiber filaments 211 can be extruded and deformed by the screen 200, thereby having more contact area with the screen 200, i.e., the conductive cloth 101 and the screen 200 achieve sufficient contact.

[0179] Hereinafter, the contact area of the conductive cloth 101 and the screen 200 will be analyzed in detail by taking the conductive cloth 101 shown in FIG. 17 as an example. First, the following terms will be explained: nominal contact area, also known as surface contact area or geometric contact area, which is the area determined by the boundary of the macroscopic interface of two contacting objects; and real contact area, also known as effective contact area or actual contact area, which is the sum of the areas of the micro contact surfaces generated by the direct transmission of the interfacial interaction force between the two contacting objects through the micro asperities and the deformation thereof.

[0180] Continuing to refer to FIG. 17, the nominal contact area of the conductive cloth 101 and the screen 200 is S, and the effective contact area of the conductive cloth 101 and the screen 200 is the sum of the contact area of each first fiber filament 111 and the screen 200, plus the sum of the contact area of each second fiber filament 211 and the screen 200, i.e., s1+s2+s3+s4+s5+s6+s7.

[0181] After the conductive cloth 101 and the screen 200 contact each other, the ratio of the effective contact area to the nominal contact area, or the effective contact area fraction, is (s1+s2+s3+s4+s5+s6+s7) / S. The effective contact area fraction is an important indicator for measuring whether the conductive cloth 101 and the screen 200 achieve sufficient contact. When the effective contact area fraction is greater than or equal to 50%, the two objects can achieve sufficient contact, which can satisfy the grounding requirement and avoid the test risk of RSE. In the related art, when the screen 200 applies an extrusion force of 0.5 N to the conductive cloth 101, the effective contact area fraction of the conductive cloth 101 and the screen 200 is 40%-50%. However, when the screen 200 applies an extrusion force of about 0.3 N to the conductive cloth 101, the effective contact area fraction of the conductive cloth 101 and the screen 200 reaches 65% in the embodiment of the present application.

[0182] Further, the nominal contact area is further explained. With continued reference to Figs. 16-17, taking the case that the device to be connected is the screen 200, when the area of the screen 200 is greater than or equal to the area of the conductive cloth 101, the area of the conductive cloth 101 is taken as the nominal contact area, i.e., the area S in Fig. 17. Fig. 18 is a top view of the circuit board 400 grounded by the conductive foam 100 according to an embodiment of the present application, in which the conductive foam 100 in Fig. 18 appears slightly transparent in vision, which is for the purpose of contrasting the area difference between the ground pad 402 and the conductive foam 100, and in fact the conductive foam 100 is not transparent. Fig. 19 is a sectional view of V-V in Fig. 18, in which the foam core 103 is omitted in Fig. 19. As shown in Figs. 18-19, taking the case that the device to be connected is the ground pad 402, when the area of the ground pad 402 is less than the area of the conductive cloth 101, the area of the ground pad 402 is taken as the nominal contact area, i.e., the area S in Fig. 19, and the effective contact area is the sum of the contact areas of each of the first fiber filaments 111 with the ground pad 402, plus the sum of the contact areas of each of the second fiber filaments 211 with the ground pad 402, i.e., the area s1 + s2 + s3 + s4 + s5 in Fig. 19.

[0183] Fig. 20 is another example of a sectional view of E-E in Fig. 12. Fig. 21 is another example of a sectional view of M-M in Fig. 12.

[0184] As shown in Figs. 20 and 21, in an embodiment provided by the present application, the conductive cloth 101 is woven by the first strand bundles 10 and the second strand bundles 20 crossing each other. Each of the first strand bundles 10 is two layers of the first wire 11, and each layer of the first wire 11 includes a plurality of the first fiber filaments 111. Each of the second strand bundles 20 is two layers of the second wire 21, and each layer of the second wire 21 includes a plurality of the second fiber filaments 211. Further, the conductive cloth 101 is configured such that, under the condition that the conductive cloth 101 is subjected to an extrusion force of 0.2 N to 0.4 N, the effective contact area fraction of the conductive cloth 101 with the device to be connected is greater than or equal to 50%.

[0185] As shown in Figs. 20 and 21, in an embodiment provided by the present application, the conductive cloth 101 satisfies the following relationships: 0.5R≤a1≤1.5R; 1.5R

[0186] Wherein, a1 is the minimum distance from the cross-section center of the first fiber filament 111 to the surface of the second fiber filament 211 of the inner layer, b1 is the minimum distance from the cross-section center of the first fiber filament 111 to the surface of the second fiber filament 211 of the outer layer, a2 is the minimum distance from the cross-section center of the second fiber filament 211 to the surface of the first fiber filament 111 of the inner layer, b2 is the minimum distance from the cross-section center of the second fiber filament 211 to the surface of the first fiber filament 111 of the outer layer, and R is the cross-sectional radius of the first fiber filament 111 and the second fiber filament 211.

[0187] The cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 in the embodiment is circular, and the value range of R includes but is not limited to 5-10 μm. It should be noted that the layer number limitation of the conductive cloth 101 in the present application is the layer number when the conductive cloth 101 is in a natural state and is not pressed by the device to be connected; the value of R is the cross-sectional radius when the first fiber filament 111 and the second fiber filament 211 are in a natural state and are not pressed by the device to be connected.

[0188] Taking the cross-sectional radius R of the first fiber filament 111 and the second fiber filament 211 as an example, as shown in FIG. 20, when the minimum distance from the cross-sectional center of the first fiber filament 111 to the surface of the second fiber filament 211 is in the range of 2.5-7.5 μm (including the end point values 2.5 and 7.5 μm), this part of the first fiber filament 111 is the first wire 11 of the inner layer, or the first layer of the first wire 11; when the minimum distance from the cross-sectional center of the first fiber filament 111 to the surface of the second fiber filament 211 is in the range of 7.5-17.5 μm (not including the end point value 7.5 μm, including the end point value 17.5 μm), this part of the first fiber filament 111 is the first wire 11 of the outer layer, or the second layer of the first wire 11; as shown in FIG. 21, when the minimum distance from the cross-sectional center of the second fiber filament 211 to the surface of the first fiber filament 111 is in the range of 2.5-7.5 μm (including the end point values 2.5 and 7.5 μm), this part of the second fiber filament 211 is the second wire 21 of the inner layer, or the first layer of the second wire 21; when the minimum distance from the cross-sectional center of the second fiber filament 211 to the surface of the first fiber filament 111 is in the range of 7.5-17.5 μm (not including the end point value 7.5 μm, including the end point value 17.5 μm), this part of the second fiber filament 211 is the second wire 21 of the outer layer, or the second layer of the second wire 21.

[0189] The explanation of the numerical range of a1, b1, a2, b2 is as follows: Fig. 22 is a schematic diagram of the first fiber yarn 111 and the second fiber yarn 211 provided by the present application. Taking the second fiber yarn 211 in Fig. 22 as an example, if the weaving tension is too large when the conductive cloth 101 is woven, the first fiber yarn 111 may squeeze the second fiber yarn 211 in the inner layer into a flat shape, which may cause the cross section of the second fiber yarn 211 in the inner layer to be not a complete circle. Therefore, the minimum value of a2 is set to 0.5R. The second fiber yarn 211 in the inner layer may also be supported by the adjacent fiber yarns, so the maximum value of a2 is set to 1.5R. The second fiber yarn 211 in the outermost layer may be supported by the adjacent fiber yarns and also opposite to the center of the cross section of the second fiber yarn 211 directly below, so the maximum value of b2 is set to 3.5R.

[0190] Fig. 23 is a schematic diagram of the conductive cloth 101 and the screen 200 in Fig. 20 being attached.

[0191] Taking the screen 200 of a smart phone as an example, Fig. 23 shows the scenario of the conductive cloth 101 and the screen 200 being attached when the conductive foam 100 is not compressed. As shown in Fig. 23, the first wire bundle 10 and the second wire bundle 20 of the conductive cloth 101 in the present embodiment are both two layers of fiber yarns. Compared with the related art conductive cloth 101 in Fig. 2, it can be seen that the surface of the conductive cloth 101 in the present embodiment tends to be a plane, which makes the conductive cloth 101 be able to fully contact the screen 200 under the condition of weak extrusion force.

[0192] Fig. 24 is a schematic diagram of another example of U-U in Fig. 16, which is also a schematic diagram of the screen 200 in Fig. 23 extruding the conductive cloth 101.

[0193] As shown in Fig. 24, after the screen 200 applies extrusion force to the conductive foam 100, the surface of the conductive cloth 101 is extruded into a generally planar shape. Since the surface of the conductive cloth 101 tends to be a plane in the initial stage, the screen 200 does not need to apply a large extrusion force, and a very weak extrusion force can make the surface of the conductive cloth 101 present a planar shape.

[0194] Continuing to refer to FIG. 24, in the present embodiment, the nominal contact area of the conductive cloth 101 with the screen 200 is S, the effective contact area of the conductive cloth 101 with the screen 200 is the sum of the contact area of each first fiber filament 111 with the screen 200, plus the sum of the contact area of each second fiber filament 211 with the screen 200, i.e. s1 + s2 + s3 + s4 + s5 + s6 + s7 + s8 + s9, and the effective contact area fraction of the conductive cloth 101 with the screen 200 after mutual contact is: (s1 + s2 + s3 + s4 + s5 + s6 + s7 + s8 + s9) / S. Through simulation tests, when the screen 200 exerts a pressing force of about 0.4 N on the conductive cloth 101, the effective contact area fraction of the conductive cloth 101 with the screen 200 reaches 73%.

[0195] In summary, the conductive cloth 101 provided by the embodiments of the present application can reduce the thickness of the conductive cloth 101 by thinning the first fiber filaments 111 constituting the first bundle 10 to one or two layers, and thinning the second fiber filaments 211 constituting the second bundle 20 to one or two layers, and the mass of the thinned conductive cloth 101 is also reduced accordingly, thereby reducing the amount of adhesive 102 used for bonding the conductive cloth 101, and when the conductive cloth 101 is applied to the conductive foam 100, the volume and weight of the conductive foam 100 can be reduced to achieve the lightness and miniaturization of the conductive foam 100; and due to the reduction in the number of layers of the first fiber filaments 111 and the second fiber filaments 211, the overall surface of the conductive cloth 101 tends to be planar, and from a microscopic perspective, even under weak pressing force, more first fiber filaments 111 and second fiber filaments 211 can be drawn towards the device to be connected, so that more first fiber filaments 111 and second fiber filaments 211 can be deformed by being pressed by the device to be connected, thereby enabling the conductive cloth 101 to have more contact area with the device to be connected, i.e. enabling the conductive cloth 101 to achieve sufficient contact with the device to be connected under weak pressing force, thereby increasing the conductive path of the conductive cloth 101 with the device to be connected, and enhancing the conductivity of the conductive cloth 101, and when the conductive cloth 101 is applied to the screen 200 connection scheme, the screen 200 can be prevented from being imprinted, and in addition, the generation of third harmonic waves can be weakened or even avoided, thereby ensuring that the radiation spurious test of the electronic device can be successfully passed.

[0196] Through simulation tests, under the same weak extrusion force condition, for example, 0.5 N of extrusion force is applied to the conductive cloth 101, the effective contact area fraction of the conductive cloth 101 in the embodiment of the present application to the device to be connected can reach more than 70%, while the effective contact area fraction of the conductive cloth 101 in the related art to the device to be connected is only 40%-50%. Compared with the related art, the conductive cloth 101 in the embodiment of the present application can reduce the third harmonic current by 20%-30%. If the same effective contact area fraction is achieved as the premise, the conductive cloth 101 in the embodiment of the present application can reduce the extrusion force by 40%-50%, which can effectively avoid the screen 200 printing problem in the screen 200 grounding scenario. If the same extrusion force and the same third harmonic current are achieved as the premise, the nominal contact area of the conductive cloth 101 in the embodiment of the present application can be reduced by 40%-50%, that is, the size of the conductive cloth 101 required is reduced, and in addition, the amount of adhesive 102 required by the small size conductive cloth 101 is also reduced, so that the volume and weight of the conductive foam 100 finally formed are reduced.

[0197] In an embodiment provided by the present application, the thickness of the conductive cloth 101 is ≤20 μm, for example, it can be 20 μm, 19 μm, 18 μm, 17 μm, etc. Wherein, the thickness of the conductive cloth 101 can be understood as the Z direction length in FIG. 13.

[0198] In the embodiment, the thickness range of the conductive cloth 101 is further limited, so that the conductive cloth 101 can meet the miniaturization design requirement of the conductive foam 100.

[0199] As mentioned above, the conductive cloth 101 in the related art is deeply recessed at the weaving node (i.e. at D1 in FIG. 2), so that the conductive cloth 101 presents a concave-convex form, which affects the flatness of the conductive cloth 101. Therefore, it can be considered to improve the flatness of the conductive cloth 101 by reducing the weaving nodes, that is, the improvement as described in the following embodiments.

[0200] In the conductive cloth 101 provided by the embodiment of the present application, the first wire bundle 10 and the second wire bundle 20 satisfy the following relationship:

[0201] n≠m.

[0202] Wherein, n is the number of first fiber filaments 111 of each layer of first wire 11, and m is the number of second fiber filaments 211 of each layer of second wire 21.

[0203] When n≠m, there are two cases, one is n>m, and the other is m>n. The two embodiments will be described in detail below.

[0204] Fig. 25 is a schematic view of another example of the conductive cloth 101 according to an embodiment of the present application. Fig. 26 is a sectional view of an example of F-F in Fig. 25. Fig. 27 is a sectional view of an example of G-G in Fig. 25.

[0205] As shown in Figs. 25-27, in one embodiment of the present application, n > m, i.e., the number of the first fiber filaments 111 in the first wire 11 is greater than the number of the second fiber filaments 211 in the second wire 21.

[0206] In the embodiment, the relationship between the number of the first fiber filaments 111 in the first wire 11 and the number of the second fiber filaments 211 in the second wire 21 is defined. As can be seen from Fig. 12 and Fig. 25, under the condition that the conductive cloth 101 has the same area, the number of the weaving nodes in the extension direction of the second wire bundle 20 is reduced in the embodiment, i.e., the number of the weaving nodes in the X direction in Fig. 25 is reduced, so that the flatness problem of the conductive cloth 101 caused by the recess at the weaving nodes is weakened, the surface of the conductive cloth 101 is closer to a plane, the fit of the conductive cloth 101 with the device to be connected is better, and the conductive cloth 101 is kept in sufficient contact with the device to be connected, so as to meet the use requirement of the conductive foam 100 under weak extrusion force.

[0207] Further, in one embodiment of the present application, (n-m) / n≥50%.

[0208] Optionally, the value range of n and m can be 2-50.

[0209] Specifically, m can be 3, and n can be 6, 7, 8, 9, …; or m can be 5, and n can be 10, 11, 12, 13, …; or m can be 7, and n can be 14, 15, 16, 17, ….

[0210] In the embodiment, the relationship between the number of the first fiber filaments 111 in the first wire 11 and the number of the second fiber filaments 211 in the second wire 21 is further defined. Compared with the related art, under the condition that the conductive cloth 101 has the same area, the number of the weaving nodes can be reduced by 40%, so that the surface of the conductive cloth 101 is close to a plane, and the effective contact area can reach 100% when the conductive cloth 101 contacts with the device to be connected.

[0211] Fig. 28 is a schematic view of another example of the conductive cloth 101 according to an embodiment of the present application. Fig. 29 is a sectional view of an example of H-H in Fig. 28. Fig. 30 is a sectional view of an example of J-J in Fig. 28.

[0212] As shown in FIGS. 28-30, in an embodiment provided by the present application, m>n, i.e., the number of second fiber filaments 211 in the second wire 21 is greater than the number of first fiber filaments 111 in the first wire 11.

[0213] In the embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is defined. As can be seen from FIG. 12 and FIG. 28, under the condition that the conductive cloth 101 has the same area, the number of weaving nodes in the extension direction of the first wire bundle 10 is reduced in the embodiment, i.e., the number of weaving nodes in the Y direction in FIG. 28 is reduced, thereby weakening the flatness problem of the conductive cloth 101 caused by the recess at the weaving node, making the surface of the conductive cloth 101 more close to a plane, making the conductive cloth 101 better fit the device to be connected, and further making the conductive cloth 101 maintain sufficient contact with the device to be connected to meet the use requirements of the conductive foam 100 under weak extrusion pressure.

[0214] Further, in an embodiment provided by the present application, (m-n) / m≥50%.

[0215] Alternatively, the value range of n and m can be 2-50.

[0216] Specifically, n can be 3, and m can be 6, 7, 8, 9, …; or n can be 6, and m can be 12, 13, 14, 15, …; or n can be 8, and m can be 16, 17, 18, 19, ….

[0217] In the embodiment, the relationship between the number of first fiber filaments 111 in the first wire 11 and the number of second fiber filaments 211 in the second wire 21 is further defined. Compared with related technologies, under the condition that the conductive cloth 101 has the same area, the number of weaving nodes can be reduced by 40%, so that the surface of the conductive cloth 101 can be approximately a plane, and the effective contact area can reach 100% when contacting the device to be connected.

[0218] FIG. 31 is a schematic view of another example of the conductive cloth 101 provided by the embodiment of the present application. FIG. 32 is a cross-sectional view of an example of L-L in FIG. 31.

[0219] As shown in FIGS. 31-32, in an embodiment provided by the present application, the conductive cloth 101 has no first wire bundle 10 in some areas.

[0220] The second wire bundle 20 on the knitted conductive cloth 101 can be pulled out, or the first wire bundle 10 is not knitted in a certain area during the knitting process of the conductive cloth 101, so that the conductive cloth 101 in this embodiment has only the second wire bundle 20 in a certain area and does not have the first wire bundle 10, so that this area of the conductive cloth 101 does not have a knitting node, so that the surface of this area tends to be flat, and the conductive cloth 101 can better fit the device to be connected, and further makes the conductive cloth 101 fully contact the device to be connected, so as to meet the use requirements of the conductive foam 100 under weak extrusion pressure.

[0221] FIG. 33 is a schematic view of another example of the conductive cloth 101 provided in the present application. FIG. 34 is a cross-sectional view of an example of K-K in FIG. 33.

[0222] As shown in FIGS. 33-34, in an embodiment provided in the present application, the conductive cloth 101 has no second wire bundle 20 in a certain area.

[0223] The second wire bundle 20 on the knitted conductive cloth 101 can be pulled out, or the first wire bundle 10 is not knitted in a certain area during the knitting process of the conductive cloth 101, so that the conductive cloth 101 in this embodiment has only the second wire bundle 20 in a certain area and does not have the first wire bundle 10, so that this area of the conductive cloth 101 does not have a knitting node, so that the surface of this area tends to be flat, and the conductive cloth 101 can better fit the device to be connected, and further makes the conductive cloth 101 fully contact the device to be connected, so as to meet the use requirements of the conductive foam 100 under weak extrusion pressure.

[0224] FIG. 35 is another example of a cross-sectional view of E-E in FIG. 12.

[0225] As shown in FIG. 35, in an embodiment provided in the present application, each first wire bundle 10 is a layer of first wire 11, and the first wire 11 includes a plurality of first fiber filaments 111 that are not twisted with each other. Each second wire bundle 20 is a layer of second wire 21, and the second wire 21 includes a plurality of second fiber filaments 211 that are not twisted with each other. After the first wire bundle 10 and the second wire bundle 20 are knitted into the conductive cloth 101, the conductive paste 30 is coated on the surface of the conductive cloth 101.

[0226] In the embodiment, the electrically conductive paste 30 is coated on the surface of the conductive cloth 101. The electrically conductive paste 30 can fill the gaps between the fiber filaments and also fill the recesses at the weaving nodes of the first wire bundle 10 and the second wire bundle 20, so that the surface of the conductive cloth 101 is closer to a plane, the conductive cloth 101 can better fit the device to be connected, and the conductive cloth 101 further maintains sufficient contact with the device to be connected to meet the use requirements of the conductive foam 100 under weak extrusion pressure. In addition, the first wire bundle 10 and the second wire bundle 20 formed by one layer of fiber filaments reduce the thickness of the conductive cloth 101 to the extreme, and the electrically conductive paste 30 is coated thereon to increase the conductive path and enhance the conductivity of the conductive cloth 101.

[0227] FIG. 36 is another example of a cross-sectional view of E-E in FIG. 12.

[0228] As shown in FIG. 36, in an embodiment provided by the present application, each first wire bundle 10 is two layers of first wire 11, and each layer of first wire 11 includes a plurality of first fiber filaments 111 that are not twisted with each other. Each second wire bundle 20 is two layers of second wire 21, and each layer of second wire 21 includes a plurality of second fiber filaments 211 that are not twisted with each other. After the first wire bundle 10 and the second wire bundle 20 are woven into the conductive cloth 101, the electrically conductive paste 30 is coated on the surface of the conductive cloth 101.

[0229] FIG. 37 is another example of a cross-sectional view of F-F in FIG. 25.

[0230] As shown in FIG. 37, in an embodiment provided by the present application, each first wire bundle 10 is one layer of first wire 11, and the first wire 11 includes a plurality of first fiber filaments 111 that are not twisted with each other. Each second wire bundle 20 is one layer of second wire 21, and the second wire 21 includes a plurality of second fiber filaments 211 that are not twisted with each other. The number of first fiber filaments 111 in the first wire 11 is greater than the number of second fiber filaments 211 in the second wire 21. After the first wire bundle 10 and the second wire bundle 20 are woven into the conductive cloth 101, the electrically conductive paste 30 is coated on the surface of the conductive cloth 101.

[0231] FIG. 38 is another example of a cross-sectional view of K-K in FIG. 33.

[0232] As shown in FIG. 38, in an embodiment provided by the present application, each first wire bundle 10 is one layer of first wire 11, and the first wire 11 includes a plurality of first fiber filaments 111 that are not twisted with each other. Each second wire bundle 20 is one layer of second wire 21, and the second wire 21 includes a plurality of second fiber filaments 211 that are not twisted with each other. After the first wire bundle 10 and the second wire bundle 20 are woven into the conductive cloth 101, part of the plurality of second wire bundles 20 is removed so that the conductive cloth 101 has no second wire bundle 20 in some areas. The electrically conductive paste 30 is coated on the surface of the conductive cloth 101.

[0233] In the embodiment, the conductive paste 30 not only fills the gaps between the fiber filaments to enhance the conductivity of the conductive cloth 101, but also bonds adjacent fiber filaments to improve the connection reliability of the fiber filaments and avoid disconnection between the fiber filaments, thereby avoiding current circuit breaking.

[0234] FIG. 39 is another example of a cross-sectional view of E-E in FIG. 12. FIG. 40 is another example of a cross-sectional view of M-M in FIG. 12.

[0235] As shown in FIGS. 39-40, in an embodiment provided by the present application, the conductive cloth 101 satisfies the following relationship: d1>h1; d2>h2.

[0236] wherein d1 is the cross-sectional width of the first fiber filament 111, h1 is the cross-sectional height of the first fiber filament 111, d2 is the cross-sectional width of the second fiber filament 211, and h2 is the cross-sectional height of the second fiber filament 211.

[0237] In the embodiment, the fiber filaments are pre-processed to have a cross-sectional width greater than a cross-sectional height, i.e., the fiber filaments are flat and have an approximately elliptical cross-section. Such fiber filaments have two effects when woven into the conductive cloth 101: first, a smaller number of fiber filaments can be used to weave a larger size conductive cloth 101; and second, the wider cross-sectional width of the fiber filaments fills the pores formed by the reduction in the number of fiber filament layers, thereby making the surface of the conductive cloth 101 more planar.

[0238] In the embodiment, the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is elliptical. For the number of layers of the conductive cloth 101, reference can be made to the case where the cross-sectional shape of the first fiber filament 111 and the second fiber filament 211 is circular in the foregoing embodiment, and the details are as follows.

[0239] When each of the first wire bundle 10 is one layer of the first wire 11 and each of the second wire bundle 20 is one layer of the second wire 21, the conductive cloth 101 satisfies the following relationship: 0.5R’≤a1≤1.5R’; 0.5R’≤a2≤1.5R’.

[0240] wherein a1 is the minimum distance from the center of the cross-section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross-section of the second fiber filament 211 to the surface of the first fiber filament 111, and R’ is half of the minor axis of the cross-sectional ellipse of the first fiber filament 111 and the second fiber filament 211, and R’ has a numerical value of R’=1 / 2×h1=1 / 2×h2.

[0241] When each first wire bundle 10 is two layers of first wire 11 and each second wire bundle 20 is two layers of second wire 21, the conductive cloth 101 satisfies the following relationship: 0.5R'≤a1≤1.5R'; 1.5R'<b1≤3.5R'; 0.5R'≤a2≤1.5R'; 1.5R'<b2≤3.5R'.

[0242] wherein a1 is the minimum distance from the center of the cross section of the first fiber filament 111 to the surface of the second fiber filament 211, a2 is the minimum distance from the center of the cross section of the second fiber filament 211 to the surface of the first fiber filament 111, and R' is half of the short axis of the cross section ellipse of the first fiber filament 111 and the second fiber filament 211, and R' is numerically equal to 1 / 2×h1=1 / 2×h2.

[0243] Alternatively, the fiber filament is processed into a flat shape in this embodiment, which can be achieved in two ways, one is to directly form a flat fiber filament in the spinning stage, and the other is to perform secondary processing on the circular cross section fiber filament to extrude it into a flat fiber filament.

[0244] Alternatively, in order to ensure that the flat fiber filament can be regularly arranged transversely, the fiber filament is lightly pressed by a pressing plate during weaving, or a height limiting plate is installed on the weaving machine to limit the position of the fiber filament.

[0245] The cross section shape of the first fiber filament 111 and the second fiber filament 211 is elliptical, which can be used on the conductive cloth 101 woven by one layer of fiber filament, for example, as shown in FIGS. 39-40, the first wire bundle 10 is composed of one layer of flat first fiber filament 111, and the second wire bundle 20 is composed of one layer of flat second fiber filament 211.

[0246] The cross section shape of the first fiber filament 111 and the second fiber filament 211 is elliptical, which can also be used on the conductive cloth 101 woven by two layers of fiber filament, FIG. 41 is another example of the cross section view of E-E in FIG. 12, for example, as shown in FIG. 41, the first wire bundle 10 is composed of two layers of flat first fiber filament 111, and the second wire bundle 20 is composed of two layers of flat second fiber filament 211.

[0247] Further, in an embodiment provided in the present application, the first wire bundle 10 and the second wire bundle 20 also satisfy the following relationship: d1 / h1≥130%; d2 / h2≥130%.

[0248] In this embodiment, the relationship between the cross section width and the cross section height of the fiber filament is further limited, so that the fiber filament can be woven into a conductive cloth 101 with larger area and smaller porosity in a smaller number.

[0249] FIG. 42 is another example of the cross section view of E-E in FIG. 12.

[0250] As shown in FIG. 42, in an embodiment provided by the present application, the conductive cloth 101 is woven by flat fiber yarns, and the surface is coated with conductive paste 30.

[0251] In an embodiment provided by the present application, the first fiber yarn 111 is a metal fiber, and the second fiber yarn 211 is a metal fiber.

[0252] In an embodiment provided by the present application, the first fiber yarn 111 is formed by a non-metal fiber coated with a metal plating layer on the surface, and the second fiber yarn 211 is formed by a non-metal fiber coated with a metal plating layer on the surface.

[0253] In an embodiment provided by the present application, the first fiber yarn 111 is formed by a non-metal fiber coated with a metal plating layer on the surface, and the second fiber yarn 211 is a metal fiber.

[0254] In an embodiment provided by the present application, the first fiber yarn 111 is a metal fiber, and the second fiber yarn 211 is formed by a non-metal fiber coated with a metal plating layer on the surface.

[0255] Optionally, in the above-mentioned embodiments, the metal fiber is made of at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

[0256] Optionally, in the above-mentioned embodiments, the non-metal fiber is made of at least one of natural fiber, carbon fiber, ceramic fiber, silicon carbide fiber, glass fiber, polyamide fiber (nylon), polyester fiber (polyester), polyphenylsulfone terephthalamide fiber (PSA), aramid fiber, and poly-p-phenylene-benzobisoxazole fiber (PBO).

[0257] Specifically, the natural fiber can be at least one of cotton fiber, hemp fiber, wool fiber, and silk fiber.

[0258] Optionally, the metal plating layer can be coated on the above-mentioned non-metal fiber by physical vapor deposition (PVD) and chemical vapor deposition (CVD).

[0259] In an embodiment provided by the present application, the first fiber yarn 111 and the second fiber yarn 211 can be made of the same material, for example, both can be copper metal fiber yarns, both can be silver metal fiber yarns, both can be copper-coated glass fiber, or both can be copper-coated aramid fiber.

[0260] In an embodiment provided by the application, the material of the first fiber 111 and the second fiber 211 can be different, for example, the first fiber 111 is a copper metal fiber, and the second fiber 211 is a silver metal fiber; the first fiber 111 is a silver metal fiber, and the second fiber 211 is a copper-plated glass fiber; the first fiber 111 is a copper-plated aramid fiber, and the second fiber 211 is a copper-plated glass fiber.

[0261] In an embodiment provided by the application, the material of the conductive paste 30 includes at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

[0262] The conductive paste 30 is a mixture of conductive substances suspended or dispersed in a liquid medium, commonly used for manufacturing electronic components 401 and circuit boards 400. It is mainly composed of two components: conductive particles and medium. The conductive particles are usually silver, copper, aluminum and other metal materials, which have high electrical conductivity and mechanical strength. The medium plays a role in stabilizing the conductive particles and improving the conductivity. The difference between the conductive silver paste, the conductive copper paste, the conductive nickel paste and the conductive graphene paste is the difference in the conductive particles, and the medium can all be organic matter.

[0263] In addition, a dispersant can also be added to the conductive paste 30. The dispersant refers to a substance added to the medium to improve the affinity between the particle surface and the medium, so that the particles can be easily wetted and remain dispersed in the medium; or a substance that can produce steric hindrance on the surface of the particles to form a complete covering layer and prevent the particles from agglomerating. In the present application, the dispersant can effectively improve the wettability, suspension stability and rheological properties of the conductive particles, prevent agglomeration and precipitation, make the conductive particles uniformly dispersed, and make the conductive paste 30 have a suitable viscosity.

[0264] Optionally, the dispersant includes, but is not limited to, aqueous borate, sodium polyacrylate, glycerol, polyethylene glycol, triethanolamine, sodium hexametaphosphate, etc.

[0265] Finally, it should be noted that the above description is only a specific implementation of the application, but the protection scope of the application is not limited thereto. Any changes or replacements within the technical scope disclosed by the application should be covered within the protection scope of the application. Therefore, the protection scope of the application should be subject to the protection scope of the claims.

Claims

1. An electrically conductive cloth, characterized in that, The plurality of first strands (10) and the plurality of second strands (20) are interlaced to form the conductive cloth (101); Each of the first strands (10) is a layer of first wire (11), and the first wire (11) includes a plurality of first fiber filaments (111); each of the second strands (20) is a layer of second wire (21), and the second wire (21) includes a plurality of second fiber filaments (211); Alternatively, each of the first strands (10) is two layers of first wire (11), and each layer of the first wire (11) includes a plurality of first fiber filaments (111); each of the second strands (20) is two layers of second wire (21), and each layer of the second wire (21) includes a plurality of second fiber filaments (211). The conductive cloth (101) is configured such that, under the condition of an extrusion force of 0.2N-0.4N, the effective contact area fraction of the conductive cloth (101) with a device to be connected is greater than or equal to 50%.

2. The conductive cloth according to claim 1, wherein The plurality of first fiber filaments (111) are not twisted with each other; and the plurality of second fiber filaments (211) are not twisted with each other.

3. The conductive cloth according to claim 1, wherein When each of the first strands (10) is a layer of the first wire (11) and each of the second strands (20) is a layer of the second wire (21), the conductive cloth (101) satisfies the following relationship: 0.5R≤a1≤1.5R; 0.5R≤a2≤1.5R; wherein a1 is the minimum distance from the cross-sectional center of the first fiber filament (111) to the surface of the second fiber filament (211), a2 is the minimum distance from the cross-sectional center of the second fiber filament (211) to the surface of the first fiber filament (111), and R is the cross-sectional radius of the first fiber filament (111) and the second fiber filament (211).

4. The conductive cloth according to claim 1, wherein When each of the first strands (10) is two layers of the first wire (11) and each of the second strands (20) is two layers of the second wire (21), the conductive cloth (101) satisfies the following relationship: 0.5R≤a1≤1.5R; 1.5R<b1≤3.5R; 0.5R≤a2≤1.5R; 1.5R<b2≤3.5R; wherein a1 is the minimum distance from the cross-sectional center of the first fiber filament (111) in the inner layer to the surface of the second fiber filament (211), b1 is the minimum distance from the cross-sectional center of the first fiber filament (111) in the outer layer to the surface of the second fiber filament (211), a2 is the minimum distance from the cross-sectional center of the second fiber filament (211) in the inner layer to the surface of the first fiber filament (111), b2 is the minimum distance from the cross-sectional center of the second fiber filament (211) in the outer layer to the surface of the first fiber filament (111), and R is the cross-sectional radius of the first fiber filament (111) and the second fiber filament (211).

5. The conductive cloth according to claim 1, wherein The conductive cloth (101) satisfies the following relationship: n>m; Wherein, n is the number of the first fiber filaments (111) of the first wire (11) of each layer, and m is the number of the second fiber filaments (211) of the second wire (21) of each layer.

6. The conductive cloth according to claim 5, wherein The conductive cloth (101) also satisfies the following relationship: (n-m) / n≥50%.

7. The conductive cloth according to claim 1, wherein The conductive cloth (101) satisfies the following relationship: m>n. Wherein, n is the number of the first fiber filaments (111) of the first wire (11) of each layer, and m is the number of the second fiber filaments (211) of the second wire (21) of each layer.

8. The conductive cloth according to claim 7, wherein The conductive cloth (101) also satisfies the following relationship: (m-n) / m≥50%.

9. The conductive cloth according to any one of claims 1 to 8, wherein, Part of the conductive cloth (101) does not have the first wire bundle (10).

10. The conductive cloth according to any one of claims 1 to 8, wherein, Part of the conductive cloth (101) does not have the second wire bundle (20).

11. The conductive cloth according to any one of claims 1 to 10, wherein, The surface of the conductive cloth (101) is coated with a conductive paste (30).

12. The conductive cloth according to any one of claims 1 to 2, 5 to 11, wherein, The conductive cloth (101) satisfies the following relationship: d1>h1; d2>h2. Wherein, d1 is the cross-sectional width of the first fiber filament (111), h1 is the cross-sectional height of the first fiber filament (111), d2 is the cross-sectional width of the second fiber filament (211), and h2 is the cross-sectional height of the second fiber filament (211).

13. The conductive cloth according to claim 12, wherein, The conductive cloth (101) also satisfies the following relationship: d1 / h1≥130%; d2 / h2≥130%.

14. The conductive cloth according to any one of claims 1 to 13, wherein, The thickness of the conductive cloth (101) is ≤20μm.

15. The conductive cloth according to any one of claims 1 to 14, wherein, The first fiber filament (111) is a metal fiber; or, the first fiber filament (111) is formed by a non-metallic fiber coated with a metal plating layer on the surface. The second fiber filament (211) is a metal fiber; or, the second fiber filament (211) is formed by a non-metallic fiber coated with a metal plating layer on the surface.

16. The conductive cloth of claim 15, wherein, The material of the metal fiber includes at least one of copper, aluminum, silver, gold, magnesium, zinc, iron, lead, nickel, cobalt, tin, bismuth, palladium, platinum, ruthenium, and rhodium.

17. The conductive cloth of claim 15, wherein, The material of the non-metallic fiber includes at least one of natural fiber, carbon fiber, ceramic fiber, silicon carbide fiber, glass fiber, polyamide fiber, polyester fiber, polyphenylsulfone terephthalamide fiber, aromatic polyamide fiber, and poly-p-phenylene benzobisoxazole fiber.

18. The conductive cloth of claim 11, wherein, The material of the conductive paste (30) includes at least one of conductive silver paste, conductive copper paste, conductive nickel paste, and conductive graphene paste.

19. An electrically conductive foam, characterized in that, The conductive cloth (101) as claimed in any one of claims 1-18 is included.

20. The electrically conductive foam of claim 19, wherein, A bubble core (103) and an adhesive (102) are also included, and the conductive cloth (101) is bonded to the surface of the bubble core (103) by the adhesive (102).

21. The electrically conductive foam of claim 20, wherein, An insulating adhesive (104) is also included, and the insulating adhesive (104) is arranged on the surface of the bubble core (103) to bond the bubble core (103) to the component to be connected.

22. The electrically conductive foam of claim 21, wherein, On the surface of the bubble core (103) with the insulating adhesive (104), the insulating adhesive (104) is located in the middle or adjacent to the edge.

23. The electrically conductive foam of claim 20, wherein, The surface of the bubble core (103) has an avoiding area (103a) which does not set the conductive cloth (101).

24. The electrically conductive foam of claim 20, wherein, The number of the conductive cloth (101) is two, and the two conductive cloths (101) are oppositely set on the surface of the bubble core (103), and the pores of the bubble core (103) are filled with conductive paste (30).

25. An electronic device, comprising: The conductive bubble cotton (100) as claimed in any one of claims 19-24.

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