Preparation process and production equipment of intracranial cortex electrode and electrode

Abstract

The invention belongs to the technical field of physiological electric signals, and particularly relates to a preparation process of an intracranial cortex electrode, production equipment and an electrode, and the process steps are divided into four process steps of preparing an electrode plate, preparing a connecting part, welding an electrode wire and a lead wire, and sealing a welding position. Wherein the preparation of the electrode plate and the preparation of the connecting part can be an independent production process, then the electrode plate and the connecting part are assembled into a whole by means of the welding of an electrode wire and a lead wire, and finally, silica gel is injected at the welding part for wrapping to obtain the intracranial cortex electrode. According to the process, the matching problem of the positions of the channels and the electrode contacts is solved, the independence between the process steps can be effectively improved, quality inspection, management and control, tracing and process improvement can be conveniently carried out on semi-finished products of all the process steps, the consistency of the products can be effectively improved, and therefore batch production is achieved.

Description

Technical Field

[0001] This invention belongs to the field of physiological electrical signal technology, specifically relating to the preparation process, production equipment, and electrode of an intracranial cortical electrode. Background Technology

[0002] Intracranial cortical electrodes consist of an insulated flexible substrate, electrode contacts embedded in the flexible substrate, electrode wires embedded in the flexible substrate, an electrode sheath that collects the electrode wires, and connecting ends. Traditional fabrication processes typically involve first forming the electrode wires and contacts using laser cutting, then forming the flexible substrate through silicone injection molding, and finally welding the electrode wires to the electrode ring at the connecting end to transmit EEG signals. However, as the number of channels increases, the welding space between the electrode wires and the electrode ring decreases, making welding difficult.

[0003] To address the aforementioned issues, an improved manufacturing process has been employed in related technologies. This involves welding leads to the electrode rings at the electrode connection ends, and then welding the leads to the corresponding electrode wires one-to-one. For example, patent number CN202311323269.9 discloses a method for manufacturing an electrode sheet, a preparation apparatus, and an implanted electrode. The electrode sheet preparation apparatus first completes the conductive circuit of the electrode through laser cutting to obtain an arrangement of multiple electrode wires. Multiple shaping grooves are formed on the inner side of the shaping mold to place the multiple electrode wires one-to-one, forming an arrangement of multiple electrode wires. A fixing component is used to fix the electrode connection ends of the multiple electrode wires. When the fixing component and the shaping mold are detachably assembled, the arrangement of multiple electrode wires is shaped. When the fixing component and the first mold are detachably assembled, the arrangement of multiple electrode wires is maintained. When the second mold and the first mold are detachably assembled, the electrode contacts of the multiple electrode wires are stamped to obtain a cap-shaped structure. When the third mold and the first mold are detachably assembled, silicone is injected. This process, involving multiple mold matching modifications, sequentially completes the electrode wire arrangement and shaping, electrode contact stamping, and overall silicone injection molding, enabling the electrode to be injection molded in one step and saving process steps. However, due to the presence of electrode contacts and their connected electrode wires, as well as electrode rings and their connected leads, a new challenge arises in this manufacturing process: how to weld the electrode wires and leads one-to-one to ensure the correspondence between the electrode contacts and the channels. Summary of the Invention

[0004] This invention provides a process, production equipment, and electrode for preparing an intracranial cortical electrode, in order to solve the problem of difficulty in matching the positions of the channel and the electrode contact during the lead wire welding process.

[0005] To address the aforementioned technical problems, this invention provides an electrode fabrication process, comprising: fabricating an electrode sheet to obtain a flexible substrate and a cover layer, a plurality of electrode contacts located between the two, and electrode wires connected to and led out from each electrode contact; fabricating a connecting portion to obtain a connecting end, a packaging tube, and a plurality of leads located inside the packaging tube and electrically insulated from each other, wherein the first end of each lead is welded to each channel of the connecting end in a corresponding manner; welding the electrode wires to the leads of at least one connecting portion in a corresponding manner; and sealing the welded joints between the electrode wires and the leads.

[0006] Furthermore, welding the electrode wires to the leads of at least one connection part one by one includes: placing the electrode sheet and the connection part on the processing table respectively; detachably fastening the leads, that is, arranging each lead according to the channel number and extending its second end through the welding station on the processing plate to the fixed position, so as to detachably fasten the second end of each lead to the processing table using fasteners; welding the electrode wires to the leads one by one at the welding station; and removing the leads between the welding station and the fixed position.

[0007] Furthermore, the fastener includes: a processing plate mounted on a processing table for placing electrode sheets; a plurality of independently arranged magnetic blocks placed on the electrode sheets; the magnetic blocks and the processing plate exert an attractive force to press the second end of each lead wire onto the processing plate respectively.

[0008] Furthermore, the step of sorting the leads according to the channel number includes: setting a label on each magnetic block; finding the corresponding leads one by one according to the channel number order; and using the magnetic block corresponding to the channel number to press the second end of the lead.

[0009] Furthermore, the top of the magnetic block is provided with the label; the bottom of the magnetic block is provided with a through-hole limiting groove, the width and / or depth of the limiting groove being less than the diameter of the lead wire.

[0010] Furthermore, the process of welding the electrode wires and leads one by one at the welding station includes: matching the electrode wires with the labels to record the electrode contact positions corresponding to the channels; connecting the free ends of the electrode wires to the leads at the welding station; and setting up a hollow area at the welding station and using a welding head to weld from the upper and lower sides of the hollow area respectively.

[0011] Furthermore, the preparation of the electrode sheet includes: injection molding, which combines the substrate layer with the lower surface of the metal layer; metal layer structuring, which involves laser cutting the metal layer from the upper surface to form electrode contacts and their corresponding electrode lines and solder pads at the ends of the electrode lines; spin coating, which involves spin coating a cover layer onto the upper surface of the metal layer; exposing the electrode contacts and the soldering area on the electrode lines, which involves laser cutting the cover layer on the upper surface of the electrode contacts and the soldering area; cutting grooves, which involves laser cutting the cover layer at the location of the grooves; wherein the thickness of the metal layer is 0.001-0.2 mm.

[0012] Furthermore, the preparation of the connection part includes: welding the first end of the lead wire to each channel of the connection end in a one-to-one correspondence; integrating the middle part of the lead wire into the encapsulation tube; and exposing the second end of the lead wire to form a corresponding relationship with the electrode wire.

[0013] The present invention also provides a production device for implementing the aforementioned preparation process, comprising: a processing table, wherein fasteners are provided above the processing table to detachably fasten the second ends of each lead wire; and a welding machine, wherein a welding head is provided on the machine to weld the electrode wires and the lead wires one by one at the welding station.

[0014] The present invention also provides an electrode produced using the aforementioned manufacturing process, comprising: an electrode sheet; a sealing layer located at the welding point between the electrode wire and the lead wire; and at least one connecting portion.

[0015] The beneficial effects of this invention are that the preparation process, production equipment, and electrode of the intracranial cortical electrode of this invention are divided into four process steps: electrode sheet preparation, connector preparation, electrode wire and lead wire welding, and weld joint sealing. The electrode sheet preparation and connector preparation can be independent production processes. Then, by welding the electrode wire and lead wire, the electrode sheet and connector are assembled into a whole. Finally, silicone injection molding or spin coating is used to seal the weld joint, resulting in the intracranial cortical electrode. This process, by solving the matching problem between the channel and electrode contact positions, effectively improves the independence between each process step, facilitating quality inspection, control, traceability, and process improvement of the semi-finished products from each process step. This effectively improves product consistency, thereby enabling mass production.

[0016] Other features and advantages of the invention will be set forth in the following description, and will be apparent in part from the description, or may be learned by practicing the invention. To make the foregoing objects, features, and advantages of the invention more apparent and understandable, preferred embodiments are described in detail below with reference to the accompanying drawings. Attached Figure Description

[0017] To more clearly illustrate the specific embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0018] Figure 1 This is a flowchart of the preparation process.

[0019] Figure 2 This is a schematic diagram of the production equipment.

[0020] Figure 3 This is a structural diagram of the production equipment.

[0021] Figure 4 This is a front view of the processing board.

[0022] Figure 5 This is a side view of the processing plate.

[0023] Figure 6 This is a structural diagram of a fastener.

[0024] Figure 7 This is a side view of the welding position.

[0025] Figure 8 This is a front view of the welded area.

[0026] Figure 9 This is a schematic diagram of a fixed position structure.

[0027] Figure 10 This is a schematic diagram of the electrode head fixing plate.

[0028] Figure 11 This is a schematic diagram of the structure of an electrode sheet.

[0029] Figure 12 yes Figure 11 A magnified view of part A in the image.

[0030] Figure 13 This is a schematic diagram of another type of electrode sheet.

[0031] In the picture: Electrode 1, electrode sheet 11, cover layer 111, trench 1111, electrode contact 112, small hole 1121, direction mark 1122, electrode wire 113, pad 13, connector 12, connector end 121, encapsulation tube 122, lead wire 123. Mold 2, upper mold 21, lower mold 22; Laser cutting machine 3; Welding device 4, processing table 41, main mounting plate 411, motion platform adjustment plate 412, first slot 4121, XY motion platform 413, processing plate 414, guide column 4141, second slot 4142, positioning line 4143, magnetic block 415, label 4151, limit slot 4152, electrode head clearance plate 416, third slot 4161, electrode head fixing plate 417, mounting hole 4171, welding machine 42, upper welding head 421, lower welding head 422; Spin coating device 5. Detailed Implementation

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0033] See Figures 1-13 This embodiment provides a fabrication process for electrode 1, including but not limited to the following steps: Step S1, fabricating electrode sheet 11 to obtain a flexible substrate (located below the metal layer, obscured and not shown) and a cover layer 111, a plurality of electrode contacts 112 located between the flexible substrate and the cover layer 111, and electrode wires 113 connected to each electrode contact 112 and led out from the side of electrode sheet 11; Step S2, fabricating connecting portion 12 to obtain connecting end 121, encapsulation tube 122, and a plurality of leads 123 located inside the encapsulation tube 122 and electrically insulated from each other, wherein the first end of each lead 123 is welded to each channel of connecting end 121 in a corresponding manner; Step S3, welding electrode wires 113 to at least one lead 123 of connecting portion 12 in a corresponding manner; Step S4, sealing the welding joint (i.e., solder pad 13) between electrode wires 113 and lead 123. Steps S1 and S2 are not sequential and can be performed independently.

[0034] In some embodiments, the preparation of the electrode sheet in step S1 includes, but is not limited to, the following processes.

[0035] In step S11, the base layer and the metal layer are bonded together by injection molding using mold 2, and the entire assembly is attached to the mechanical carrier.

[0036] The base layer is formed by injection molding and bonded to the metal layer, forming a base layer-metal layer. Utilizing the strength of the base layer, and with the aid of a mechanical carrier, the problem of difficult cutting due to an excessively thin metal layer can be avoided, minimizing the metal layer thickness and improving the flexibility of the electrode sheet. The base layer material is selected from one or more of medical-grade silicone, polyurethane, and polyethylene; the metal layer material is selected from one or more of medical-grade stainless steel, platinum-iridium alloy, gold, titanium alloy, and nickel-titanium alloy, with a thickness generally between 0.001-0.2 mm, and selectable thicknesses of 0.02 mm, 0.05 mm, 0.08 mm, 0.1 mm, and 0.15 mm.

[0037] The detailed injection molding process is as follows: A metal foil is laid flat on the upper mold 21. A base layer material is coated around the metal foil. The metal foil is then fixed to the surface of the upper mold 21 by high-temperature baking. The upper mold 21 and lower mold 22 are then closed to injection mold the base layer onto the lower surface of the metal foil. Alternatively, a polymer mesh can be added to the base layer as a reinforcing layer through secondary injection molding. Reinforcing layer materials include, but are not limited to, PET, PC, PVC, PS, and PE, significantly enhancing the overall tensile strength of the electrode. Placement blocks are set at the positions corresponding to the solder pads on the lower surface of the metal foil to create through-holes in the pre-defined welding area during injection molding, reserving operating space for subsequent precision welding.

[0038] The mold 2 contains a mechanical carrier and a spacer block. The mechanical carrier has through holes. When the spacer block engages with the through holes, its height is higher than the upper surface of the mechanical carrier and level with the upper surface of the substrate layer. This allows for the formation of through holes in the substrate layer after injection molding, exposing the lower surface of the solder pad 13 (the welding point between the lead and electrode wire). The mechanical carrier provides a smooth and flat platform for the substrate layer. The entire product is attached to the mechanical carrier, preventing subsequent laser etching from causing undesirable laser cutting results due to product deformation.

[0039] Step S12: Use a laser cutter 3 to cut the metal layer from the upper surface, structuring the metal layer to form electrode contacts 112, conductive paths (i.e., electrode lines 113), small holes 1121, and direction marks 1122.

[0040] Precision femtosecond laser cutting technology is used to cut the metal layer from the top surface to form electrode contacts, conductive paths (i.e., electrode lines), and orientation markings 1122 (see...). Figure 11 Generally, since both the base layer and the capping layer are elastic materials, and the reinforcing layer can also undergo partial deformation, both will undergo elastic deformation when the electrode is subjected to external tensile force. However, the conductive path is made of metal, which does not have tensile strength, and its width and strength are generally small. Without a special structure, the conductive path is easily damaged when the electrode is subjected to external tensile force. Therefore, the conductive path is set as a wavy structure to improve its tensile resistance. The orientation mark 1122 is set as an asymmetrical letter, number, or graphic engraved on the metal layer. When in use, the correct placement orientation of the electrode can be identified by the asymmetrical letter, number, or graphic. The edges of the electrode contacts 112 are cut with evenly distributed small holes 1121 by laser scanning (see...). Figure 12 No material needs to be dropped; the laser vaporizes the metal inside the small hole. During or after cutting, because the lower surface of the metal layer remains bonded to the base layer, the electrode contacts and their corresponding conductive paths adhere to the mechanical carrier through the base layer, preventing them from becoming disordered or falling off. Furthermore, there is no need for rearrangement or fixation, facilitating process flow.

[0041] Step S13: A coating layer is formed by spin coating.

[0042] Using spin coating device 5, a cover layer is spin-coated on the upper surface of the metal layer, so that the electrode sheet as a whole is similar to a sandwich-like layered stacked structure, namely, base layer-metal layer-cover layer; wherein the cover layer material is selected from one or more of medical silicone, polyurethane, and polyethylene.

[0043] During spin coating, the spin coating material is applied to the entire surface of the metal layer. Therefore, the electrode contacts, electrode lines, pads, pinholes, orientation marks, and other metal layer surfaces are all covered with the spin coating material, forming a capping layer. The spin coating material also exists in the cut seams of the metal layer to ensure the overall sealing of the electrode sheet and the insulation between the electrode lines. Of course, the spin coating material also flows into the base layer through the pinhole 1121 in step S12. After the capping layer material cures, it fuses with the base layer to form an "I-shaped structure." This structure can reliably fix the intermediate metal layer without the assistance of other chemical reagents.

[0044] Step S14 involves using laser cutting to expose the electrode contacts and welding area, forming the outline of the groove and electrode sheet. Steps S141, S142, and S143 do not have a strict required order and can be adjusted according to the actual situation.

[0045] Step S141: Using laser cutting, the electrode contacts 112 and pads 13 are exposed on the front side of the electrode sheet by covering the electrode contacts and pads with a coating layer.

[0046] Step S142: A groove 1111 is formed by laser-cutting part of the covering layer at the groove location. A series of grooves are formed on and around the electrode contact 112. These grooves can be unidirectional or crisscrossed, and are used to drain tissue fluid between the intracranial cortical electrode and the brain tissue, allowing it to better adhere to the brain tissue and resulting in stronger and more accurate EEG signals acquired by the electrode. The groove 1111 does not penetrate the covering layer, and the depth of the groove 1111 does not exceed 1 / 2 of the total thickness of the covering layer; otherwise, it will affect the overall product strength and may also cause the electrode wires to be exposed. Preferably, the intersection of the grooves 1111 is located on each electrode contact 112 or at the interval between two adjacent electrode contacts 112. This way, after implantation, tissue fluid near any electrode contact 112 can be drained to the outside of the bonding area. Since it does not penetrate the thickness direction of the electrode sheet, it has less impact on the overall strength of the electrode. It also does not drain tissue fluid from the front to the back of the electrode sheet, nor does it cause tissue growth on both sides of the electrode sheet, embedding the electrode sheet in the tissue and making it difficult to replace, remove, or adjust the position of the electrode sheet later.

[0047] Step S143: The outer contour of the electrode sheet is formed by laser cutting the cover layer and the base layer.

[0048] In some embodiments, the preparation of the connecting portion 12 in step S2 includes, but is not limited to, the following processes.

[0049] The connection end 121 is configured as, for example but not limited to, a number of conductive rings, each of which corresponds to a channel number. The lead wire 123 is welded to the conductive rings one by one using the welding device 4.

[0050] In some embodiments, the welding of the electrode wire 113 to the lead wire 123 of at least one connection portion 12 in step S3 can be achieved using the welding device 4, including but not limited to the following processes.

[0051] Step S31, place electrode plate 1.

[0052] See Figure 3 The electrode plate 11 and the connecting part 12 are placed on the processing table 41, so that the solder pad 13 of the electrode plate 11 is in the open position of the processing plate 414 (corresponding to the hollow area of ​​the welding station). The processing plate 414 is a flat plate that generates an attractive force with the magnetic block 415, or the area where its fixing position is located is provided with a material that generates an attractive force with the magnetic block, forming a fastener with the magnetic block 415, so that the second end of the lead wire 123 can be detachably fastened.

[0053] Step S32, detachable fastening lead wire.

[0054] See Figure 6 , Figure 7 , Figure 8 , Figure 9 The diameter of the magnetic block 415 is only 1-2 mm, and the thickness is unlimited. It can be a cylindrical neodymium iron boron strong magnet. See Figure 9 The top of magnetic block 415 is marked with a number 4151, and each number 4151 corresponds to a channel number. These numbers can be identical or contrasting numbers, letters, images, markings, etc. See [link / reference]. Figure 6 The bottom of the magnetic block 415 is provided with a limiting groove 4152 that is slightly smaller than the diameter of the lead wire, which is used to accommodate the lead wire 123 and prevent it from shifting. The limiting groove 4152 is through, and its width and / or depth is smaller than the diameter of the lead wire.

[0055] See Figure 8 One by one, identify each lead 123 of the connecting part 12, then extend its second end through the welding station on the processing plate 414 to the fixed position, and finally attach the magnetic block corresponding to the channel number to the processing plate 414, pressing the second end of the lead 123 tightly (see...). Figure 9While tightening the lead wire 123, it is necessary to tension the lead wire 123 and ensure that the lead wire 123 is parallel to the pad 13 and roughly passes through the center of the pad 13. At the same time, the channel number is marked, which is conducive to the welding operation of the electrode wire 113 and the lead wire 123. The second end of the lead wire can also be detached after welding, which is convenient for subsequent injection molding and sealing.

[0056] Step S33: Adjust the XY motion platform 413 below the processing plate 414 so that the welding station is inside the precision electrode head. Find the electrode contact corresponding to the channel number, connect the free end of its electrode wire 113 to the lead wire 123 at the welding station, and start the welding switch to complete the welding of a single lead wire 123. Continuously adjust the XY motion platform 413 to complete the welding of all leads 123.

[0057] In some embodiments, step S4, which seals the weld between electrode wire 113 and lead wire 123, includes, but is not limited to, the following processes.

[0058] Using polymers for injection molding or spin coating sealing includes insulating weld points within a welded area from each other, as well as sealing the entire welded area relative to the external environment. The polymer may be selected from one or more of silicone, polyurethane, and polyethylene, and the sealing layer may be formed using a spin coating process.

[0059] In some embodiments, see Figure 11 , Figure 13 Since the width of the electrode pad 11 is limited by the surgical conditions, although setting the pads 13 to a fan shape can increase the distance between the leads, generally, when N>32, the distance between the leads 123 is no longer suitable for soldering operations. Therefore, the leads 123 can be divided into at least two groups according to the total number of channels N, with each group corresponding to a connection part 12. Generally speaking, each group has 32 leads 123 that need to be soldered, although uneven distribution is also possible. In this way, the electrode pad 11 corresponds to multiple pads 13, and each pad 13 can be distributed in a straight line or staggered to improve the soldering operation space.

[0060] In some embodiments, a production apparatus is also provided for carrying out the preparation process described above. See Figure 3 The welding device 4 includes, but is not limited to, the following components.

[0061] The processing table 41 includes, but is not limited to: a main mounting plate 411, a motion platform adjustment plate 412, and an X / Y axis precision motion platform 413; a processing plate 414 and a magnetic block 415 are provided above the X / Y axis precision motion platform 413 to detachably fasten the second end of each lead wire 23; the X / Y axis precision motion platform 413 is used to drive the processing table 41 to achieve planar motion; the welding machine 42 is provided with an upper welding head 421 and a lower welding head 422 to weld the electrode wire 113 and the lead wire 23 one by one at the welding station 416.

[0062] Optional, see Figure 2 The production equipment includes, but is not limited to, a laser cutting machine 3, a mold 2, and a spin coating device 5. The welding machine 42 is, for example, but not limited to, a precision resistance welding machine. The laser cutting machine 3 is, for example, but not limited to, a precision femtosecond laser cutting machine.

[0063] Optional, see Figure 3 The main mounting plate 411 provides a mounting platform for the precision resistance welding machine and other accessories. The motion platform adjustment plate 412 is mounted on the main mounting plate 411 and has a first slot 4121 inside, allowing for X-axis adjustment to compensate for insufficient X / Y-axis precision motion adjustment when welding larger electrodes. The X / Y-axis precision motion platform 413 is mounted on the motion platform adjustment plate 412, and its adjustment knob allows for sliding in the X and Y axes.

[0064] Optional, see Figure 4 , Figure 5 The processing plate 414 is made of ordinary carbon steel or silicon steel, and its purpose is to cooperate with the magnet 415 to form a large magnetic force to secure the lead wire. At the same time, the surface of the processing plate 414 needs to be mirror polished to prevent unevenness or dirt from contaminating the electrode sheet. Four guide posts 4141 and a second slot 4142 are provided below the processing plate 414. The guide posts 4141 are used to cooperate with the X / Y axis precision motion platform 413 below, and the second slot 4142 is used to provide clearance for the lower electrode head of the precision resistance welding machine. At the same time, the side without guide posts 4142 should be provided with special positioning lines 4143 according to the different specifications and shapes of the electrode sheet 1, which is generally achieved by laser cutting.

[0065] Optional, see Figure 3 The electrode head clearance plate 416 is installed on the main mounting plate 411 to fix the electrode head fixing plate 417. At the same time, its edge is provided with a third groove 4161 to allow clearance when the lower electrode head 422 is adjusted in the Y-axis direction.

[0066] Optional, see Figure 10The electrode head fixing plate 417 is provided with a mounting hole 4171 for clamping the lower electrode head 422 and adjusting its position in the Y-axis direction. The lower electrode head 422 can be locked by rotating its fixing screw; the upper electrode head 421 is fixed on the precision resistance welding machine.

[0067] In some embodiments, an electrode 1 manufactured using the aforementioned fabrication process is also provided, see Figure 3 It includes: an electrode sheet 11; a sealing layer located at the welding point (i.e., solder pad 13) between the electrode wire 113 and the lead wire 123; and at least one connecting portion 12.

[0068] Optional, see Figure 7 , Figure 8 , Figure 11 , Figure 13 The electrode sheet 11 includes: a flexible substrate (covered by a metal layer, not shown in the figure) and a cover layer, a plurality of electrode contacts 112 located between the two, electrode lines 113 connected to each electrode contact 112 and led out to the side of the electrode sheet 11, and a pad 13 located at the end of the electrode line 113; the connection part 12 includes: a connection end 121, a packaging tube 122 and a plurality of leads 123 located inside the packaging tube 122 and electrically insulated from each other, and the first end of each lead 123 is respectively welded to each channel of the connection end 121.

[0069] Optionally, the surface of the cover layer 111 is provided with a plurality of grooves 1111. See Figure 13 The diagram does not show the distribution of conductive circuits or electrode lines 113, but emphasizes that the intersecting trenches 1111 and electrode contacts 112 are located on the same side of the cover layer 111 and form a grid, with their intersections located at the electrode contacts 112. Alternatively, see... Figure 11 The figure shows the distribution of conductive circuits or electrode lines 113. The intersecting grooves 1111 and electrode contacts 112 are located on the same side of the cover layer 111, in the gap between two adjacent electrode contacts 112 (see figure). Figure 11 ).

[0070] Optionally, the groove 1111 connects any row (including longitudinal, transverse, and diagonal) of electrode contacts 112 and extends to the edge of the cover layer 111. Preferably, the groove 1111 is arranged longitudinally and transversely while avoiding passing through the weld joint, so as to prevent the sealing layer at the weld joint from blocking the groove.

[0071] Optional, see Figure 11 and Figure 13 The lead wires 123 are divided into at least two groups, each group corresponding to a connecting part 12.

[0072] In the description of the embodiments of the present invention, unless otherwise explicitly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention based on the specific circumstances.

[0073] In the description of this invention, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the invention and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the invention. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0074] In the several embodiments provided in this application, it should be understood that the disclosed systems, apparatuses, and methods can be implemented in other ways. The apparatus embodiments described above are merely illustrative. For example, the division of units is only a logical functional division, and there may be other division methods in actual implementation. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed.

[0075] Based on the above-described preferred embodiments of the present invention, and through the above description, those skilled in the art can make various changes and modifications without departing from the technical concept of the present invention. That is, the technical scope of the present invention is not limited to the contents of the specification.

Claims

1. A process for preparing an electrode, characterized in that, include: An electrode sheet is prepared to obtain a flexible substrate and a capping layer, several electrode contacts located between the two, and electrode lines connected to and led out from each electrode contact; Prepare the connecting part to obtain the connecting end, the encapsulation tube and several leads located inside the encapsulation tube and electrically insulated from each other. The first end of each lead is welded to each channel of the connecting end one by one. Solder the electrode wires to the leads of at least one of the connecting parts one by one; Seal the weld between the electrode wire and the lead wire.

2. The preparation process according to claim 1, characterized in that, Soldering the electrode wires to the leads of at least one of the connecting parts one by one includes: Place the electrode sheet and the connecting part on the processing table respectively; The detachable fastening leads are arranged according to the channel number and their second ends are passed through the welding station on the processing plate and extended to the fixed position, so that the second ends of each lead can be detachably fastened to the processing table using fasteners. At the welding station, the electrode wires and leads are welded one by one in correspondence. Remove the lead wire between the welding station and the fixed position.

3. The preparation process according to claim 2, characterized in that, The fasteners include: A processing plate, mounted on a processing table, is used to place electrode sheets; Several independently configured magnetic blocks are placed on the electrode plates; The magnetic block and the processing plate exert an attractive force to press the second end of each lead wire firmly onto the processing plate.

4. The preparation process according to claim 3, characterized in that, The step of sorting the leads according to the channel number includes: Label each magnetic block; Find the corresponding lead wires one by one according to the channel number sequence; Use the magnetic block corresponding to the channel number to press the second end of the lead wire.

5. The preparation process according to claim 4, characterized in that, The label is provided on the top of the magnetic block; The bottom of the magnetic block is provided with a through-hole limiting groove, the width and / or depth of which is less than the diameter of the lead wire.

6. The preparation process according to claim 4, characterized in that, Also includes: The welding process at the welding station involves welding the electrode wires and leads one-to-one, including: Preset the electrode contact positions for each channel; Match the electrode wires with the leads corresponding to the labels according to the preset information; Connect the free end of the electrode wire to the lead wire at the welding station; A perforated area is set up at the welding station, and welding is performed from the top and bottom sides of the perforated area using welding heads.

7. The preparation process according to claim 1, characterized in that, The preparation of the electrode sheet includes: Injection molding is the process of bonding the base layer to the lower surface of the metal layer. Metal layer structuring involves laser cutting a metal layer from the upper surface to form electrode contacts and their corresponding electrode lines and pads at the ends of the electrode lines. Spin coating, also known as spin coating, involves spin-coating a coating layer onto the upper surface of a metal layer. Exposed electrode contacts and soldering areas on electrode lines, i.e., the cover layer on the surface of laser-cut electrode contacts and solder pads; The cutting groove refers to the covering layer at the location of the laser-cut groove; among which... The thickness of the metal layer is 0.001-0.2 mm.

8. The preparation process according to claim 1, characterized in that, The preparation of the connecting part includes: Solder the first end of the lead wire to each channel of the connection end one by one; The middle part of the lead wire is integrated into the encapsulation tube; Expose the second end of the lead to correspond with the electrode line.

9. A production apparatus for implementing the preparation process as described in claim 1, characterized in that, include: A processing table, wherein fasteners are provided to detachably fasten the second end of each lead wire; A welding machine equipped with a welding head to weld electrode wires and lead wires one-to-one at the welding station.

10. An electrode produced using the preparation process described in claim 1, characterized in that, include: Electrode plates; The sealing layer is located at the welding point between the electrode wire and the lead wire; At least one connecting part.

Images