Stamping fixing positioning column

Abstract

The invention provides a stamping fixing positioning column which comprises a basic stand column, the basic stand column is located on a circuit board, a buckling cover is arranged on the basic stand column, and the buckling cover is of a geometric structure and is buckled on the surface of the circuit board through stamping. According to the stamping fixing positioning column, the basic stand column is machined on the fixing plate to obtain the buckling cover, then the circuit board and the fixing plate are subjected to integrated stamping forming through a punching machine, the process is simple, operation is convenient, flow assembly of the circuit board is facilitated, the production efficiency of an enterprise is improved, traditional screws and rivets are replaced with the basic stand column, and the cost is reduced. And products of different specifications are directly produced and formed, pairing according to requirements is not needed, the manufacturing cost is saved, and the economic benefits are effectively improved.

Description

Technical Field

[0001] This invention relates to a stamped fixed positioning post. Background Technology

[0002] Automotive cameras are widely used. They are mounted on a PCB board. The PCB board, as an important electronic component, needs to be fixed to the housing during use. Because automotive cameras are not conventional electronic devices and have limited space, there is not much space to spare during the design and installation process. Therefore, conventional installation processes are quite complex.

[0003] Traditional installation methods use BOSS posts and self-tapping screws for fixing. The BOSS posts are first inserted into the PCB board and the housing, and then the self-tapping screws are used for fastening. This requires custom screws based on the size of different PCB boards and the installation space. At the same time, the self-tapping screws need to be positioned and calibrated during the fastening process. If automated equipment is used, it may cause the screws to be over-tightened or loosened, affecting the assembly quality.

[0004] Therefore, such assembly methods can no longer meet the needs of increasingly automated production. Even with automatic fastening mechanisms, different sizes of screws are required for matching, increasing assembly processes and tooling, which affects production efficiency. If rivets are used for fixing, the rivet fixing method is air gun nailing. If the position and angle are slightly off, the rivet will be driven in crookedly, which can seriously damage the PCB board. Moreover, the rivet specifications are uniform. If the PCB board size is different, the rivets will be too long or too short, which will affect the efficiency of automated production. Summary of the Invention

[0005] The technical problem to be solved by the present invention is to provide a stamped fixed positioning post, which changes the traditional connection method. The fixed post is used to position and connect the PCB board. At the same time, the top of the fixed post is designed as a geometric structure and is pressed into the board by stamping to achieve fixation, eliminating the use of screws. Moreover, the size of the fixed post can be directly processed according to the requirements, reducing intermediate processes and lowering costs.

[0006] To solve the above-mentioned technical problems, the technical solution of the present invention is as follows: A stamped fixed positioning post connects a circuit board and a fixing plate, including a base column, which is integrally formed with the fixing plate and penetrates the circuit board. Its outer diameter matches the connection hole on the circuit board to achieve a tight connection. A snap-fit ​​cover is provided on the base column. The outer diameter of the snap-fit ​​cover is smaller than that of the base column. It has at least two slots along the axial direction to form a multi-lobed geometric structure that can be turned outward. The cover has a tapered inner hole that matches the punch. During the stamping assembly of the aforementioned snap-fit ​​cover, the stamping equipment is equipped with a first punch and a second punch. The first punch first causes each segment to flip outward to form the first deformed section. The second punch then presses the snap-fit ​​cover flat onto the surface of the circuit board along the axial direction of the base column to form the second deformed section, and makes the outer edge of the flipped snap-fit ​​cover avoid the hole wall of the connection hole and not contact the inner wall of the circuit board.

[0007] Furthermore, the snap-fit ​​cover has a four-lobed structure with mutually perpendicular slots.

[0008] Furthermore, the snap-fit ​​cover has a three-groove, six-lobed structure with the grooves evenly distributed around the perimeter.

[0009] Furthermore, the outer diameter of the snap-fit ​​cover is 60% to 90% of the outer diameter of the base column; the cone angle of the conical inner hole is 10° to 30°.

[0010] The press-fitting process of this positioning post is as follows: a matching stamping punch is used for stamping and fastening; the punch is equipped with a first punch and a second punch. The first step is to use a fixing plate to place the circuit board to be processed on the fixing plate. The connection holes on the circuit board are matched with the foundation column, and the snap-fit ​​cover extends upward through the circuit board. The second step is to install the assembled fixing plate on the punch press fixture, with the fastening cover facing upwards and opposite the punch. The third step is to start the punch press and move the punching head downwards. When the first punch touches the snap-fit ​​cover, continue to move it to punch and deform the snap-fit ​​cover, causing the four-lobed structure to flip outwards by 60 degrees. In the fourth step, the first punch stops moving, and the second punch continues to move downward, pressing the deformed snap-fit ​​cover onto the surface of the circuit board to complete the assembly.

[0011] Wherein: the first punch has an outwardly expanding boss end, used to realize a first deformation section with a flipping angle of 45° to 75°.

[0012] Furthermore, the second punch is a flat pressure head, and the pressing depth is equal to the thickness of the fastening cover ±0.1mm.

[0013] Furthermore, the outermost edge of the snap-fit ​​cover after flipping over maintains a gap of 0.05 to 0.3 mm with the wall of the connecting hole.

[0014] Furthermore, the final pressed state of the snap-fit ​​cover allows it to form a contact area of ​​at least 3 square millimeters with the contact surface of the circuit board.

[0015] Furthermore, the punching force generated during the stamping assembly process is less than the bending strength of the circuit board material.

[0016] Compared with existing technologies, the present invention provides a stamped fixed positioning column. By processing the base column on the fixed plate to obtain the snap-fit ​​cover, the circuit board and the fixed plate are integrally stamped using a punch press. The process is simple and easy to operate, which is conducive to the streamlined assembly of circuit boards and improves the production efficiency of enterprises. The base column replaces the traditional screws and rivets and can be directly produced on products of different specifications without the need for matching according to requirements, saving production costs and effectively improving economic benefits. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the positioning post of the present invention in its unpressed state.

[0018] Figure 2 This is a schematic diagram of the stamped state of the positioning post of the present invention.

[0019] Figure 3 This is a top view of the snap-fit ​​cover of the present invention.

[0020] Figure 4 This is a schematic diagram of the stamping process of the present invention.

[0021] The components are: 1. base column, 2. snap-fit ​​cover, 3. stamping punch, 4. first punch, and 5. second punch. Detailed Implementation

[0022] In one embodiment, such as Figure 1 As shown, a stamped fixed positioning column connects a circuit board and a fixing plate, including a base column 1. The base column 1 is integrally formed with the fixing plate and penetrates the circuit board. Its outer diameter matches the connection hole on the circuit board to achieve a tight connection. A fastening cover 2 is provided on the base column 1. The outer diameter of the fastening cover 2 is smaller than that of the base column 1. It has at least two slots along the axial direction to form a multi-lobed geometric structure that can be turned outward. The inside has a conical inner hole that matches the punch. During the stamping assembly of the aforementioned snap-fit ​​cover 2, the stamping equipment is equipped with a first punch and a second punch. The first punch first causes each petal to flip outward to form a first deformed section. like Figure 2 As shown, the second punch then presses the snap-fit ​​cover 2 flat onto the surface of the circuit board along the axial direction of the base column 1 to form the second deformed section, and makes the outer edge of the flipped snap-fit ​​cover 2 avoid the hole wall of the connection hole and not contact the inner wall of the circuit board.

[0023] In one embodiment, the snap-fit ​​cover 2 adopts a four-lobed structure with mutually perpendicular slots. This is the most cost-effective structure, as the number of slots and strength are suitable for manufacturing.

[0024] In one embodiment, the snap-fit ​​cover 2 adopts a six-lobed structure with the slots evenly distributed circumferentially. Although a smaller stamping force can be used to complete the processing, the overall strength of the snap-fit ​​cover is weakened, affecting product quality and increasing processing costs.

[0025] In one embodiment, the positioning post and the fixing plate are integrally formed by a mold, so that corresponding positioning posts can be produced according to different specifications and sizes, eliminating the need to match screws and rivets according to size, thus improving production efficiency.

[0026] In one embodiment, the outer diameter of the snap-fit ​​cover is 60% to 90% of the outer diameter of the base column, so that the snap-fit ​​cover does not affect the connection hole of the circuit board during the stamping process; the cone angle of the tapered inner hole is 10° to 30°, which facilitates the downward pressing of the punch and ensures the accuracy of the press fitting.

[0027] In one embodiment, the positioning post is fastened by a matching stamping punch 3 during stamping assembly; the stamping punch 3 is provided with a first punch 4 and a second punch 5, and the assembly process is as follows: The first step is to use a fixing plate to place the circuit board to be processed on the fixing plate. The connection holes on the circuit board are matched with the foundation column 1. The fastening cover 2 extends upward through the circuit board. The second step is to install the assembled fixing plate on the punching fixture, with the snap-fit ​​cover 2 facing upwards and opposite to the punching head 3. The third step is to start the punch press and move the punching head 3 downward. When the first punch 4 touches the snap-fit ​​cover 2, continue to move it to punch and deform the snap-fit ​​cover 2, and flip the four-lobed structure outward by 60 degrees. In the fourth step, the first punch 4 stops moving, and the second punch 5 continues to move downward, pressing the deformed snap-fit ​​cover 2 onto the surface of the circuit board to complete the assembly.

[0028] Wherein: the first punch 4 has an outwardly expanding boss end, used to realize a first deformation section with a flipping angle of 45° to 75°.

[0029] Furthermore, the second punch 5 is a flat pressing head, and the pressing depth is equal to the thickness of the fastening cover ±0.1mm.

[0030] Furthermore, the outermost edge of the snap-fit ​​cover 2 after being flipped up maintains a gap of 0.05 to 0.3 mm with the wall of the connecting hole.

[0031] Furthermore, the final pressed state of the snap-fit ​​cover 2 allows it to form a contact area of ​​at least 3 square millimeters with the contact surface of the circuit board.

[0032] In one embodiment, as shown in the figure, the shearing force of the stamping action is determined by the stamping perimeter (the outer circle length of the snap-fit ​​cover) and the stamping thickness. Taking aluminum as an example, its shear strength constant τ = 130 MPa, the actual stamping perimeter is L = Πd, where d is 2 mm, and the stamping thickness t is 1 mm. Then the shearing force is F = L × t × τ = 2Π × 1 × 130 = 816.4 N. Thus, when the circuit board material is FR-4, the contact area between the four-lobed stamping and the circuit board is approximately 3 square millimeters. Therefore, the pressure applied to the circuit board is P = 816.7 / 3 = 272.23 MPa, which is less than the material standard bending strength of 300 MPa. Therefore, this shearing force can be applied in the production of circuit boards.

[0033] In one embodiment, the snap-fit ​​cover 2 adopts a four-lobed structure, and its maximum expansion distance during stamping deformation is 0.0319mm. Within 1.7mm of its outer circumference, the stamping temperature reaches 130-140℃. Therefore, outside the 2mm range around the positioning post, the components on the circuit board will not be affected by the high temperature generated by the stamping deformation.

[0034] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit the technical solutions. Those skilled in the art should understand that any modifications or equivalent substitutions to the technical solutions of the present invention without departing from the spirit and scope of the present invention should be covered within the scope of the claims of the present invention.

Claims

1. A stamped fixed positioning post, connecting a circuit board and a fixing plate, characterized in that, include: The base column is integrally molded on the fixing plate, and its outer diameter is positioned to match the connection holes on the circuit board. A snap-fit ​​cover, with an outer diameter smaller than that of the foundation column, is installed at the top of the foundation column. The snap-fit ​​cover has at least two slots along the axial direction to form a multi-lobed geometric structure that can be turned outwards. Its interior has a conical inner hole that mates with a punch. in: During the stamping assembly of the aforementioned snap-fit ​​cover, the stamping equipment is equipped with a first punch and a second punch. The first punch first causes each segment to flip outward to form the first deformed section. The second punch then presses the snap-fit ​​cover flat onto the surface of the circuit board along the axial direction of the base column to form the second deformed section, and makes the outer edge of the flipped snap-fit ​​cover avoid the hole wall of the connection hole and not contact the inner wall of the circuit board.

2. The stamped fixed positioning post as described in claim 1, characterized in that, The snap-fit ​​cover has a four-lobed structure with mutually perpendicular slots.

3. The stamped fixed positioning post as described in claim 1, characterized in that, The snap-fit ​​cover has a three-groove, six-lobed structure with the grooves evenly distributed around the perimeter.

4. The stamped fixed positioning post as described in claim 1, characterized in that, The outer diameter of the fastening cover is 60% to 90% of the outer diameter of the base column.

5. The stamped fixed positioning post as described in claim 1, characterized in that, The cone angle of the tapered inner hole is 10° to 30°.

6. The stamped fixed positioning post as described in claim 1, characterized in that, The first punch has an outwardly expanding boss end for achieving a first deformation section with a flipping angle of 45° to 75°.

7. The stamped fixed positioning post as described in claim 1, characterized in that, The second punch is a flat pressure head, and the pressing depth is equal to the thickness of the snap-fit ​​cover ±0.1mm.

8. The stamped fixed positioning post as described in claim 1, characterized in that, The outermost edge of the snap-fit ​​cover after flipping over maintains a gap of 0.05 to 0.3 mm with the wall of the connecting hole.

9. The stamped fixed positioning post as described in claim 1, characterized in that, The final pressed state of the snap-fit ​​cover allows it to form a contact area of ​​at least 3 square millimeters with the contact surface of the circuit board.

10. The stamped fixed positioning post as described in claim 1, characterized in that, The punching force generated during the stamping and assembly process is less than the bending strength of the circuit board material.

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