Test probe card adjusting method, chip test method, device and storage medium

Abstract

The invention discloses a test pin card adjusting method, a chip test method, equipment and a storage medium. The method comprises the following steps: acquiring a target image containing a chip; performing test point detection on the target image to obtain the position of a test point on the chip; and controlling the test needle card to move to the position of the test point so as to be in contact with the test point. Through the above mode, the test probe card can be accurately contacted with the test point on the chip.

Description

Technical Field

[0001] This application relates to the field of chip technology, and in particular to a method for adjusting a test pin card, a chip testing method, an apparatus, and a storage medium. Background Technology

[0002] In current chip production testing processes, testing unpackaged chips involves using specialized test probes to contact test points on the chip. Before testing, the probes must be manually adjusted to align with the test points. Because these test points are very small, a high-powered microscope is required to observe and adjust for any deviations. This process carries risks such as inaccurate adjustments and chip damage. Furthermore, after prolonged testing, the probes may shift, leading to test failures. All these factors contribute to a decrease in yield, causing good chips to be classified as defective, thus impacting production efficiency and costs. Summary of the Invention

[0003] The main technical problem addressed by this application is to provide a method for adjusting a test pin card, a chip testing method, an apparatus, and a storage medium that enables the test pin card to make accurate contact with the test points on the chip.

[0004] The first aspect of this application provides a method for adjusting a test pin card, the method comprising: acquiring a target image containing a chip; performing test point detection on the target image to obtain the position of the test point on the chip; and controlling the test pin card to move to the position of the test point so as to contact the test point.

[0005] The test probe card includes a pin; controlling the test probe card to move to the test point position to contact the test point includes: controlling the pin to move to the test point position so that the pin contacts the test point.

[0006] The process of controlling the ejector pin to move to the test point so that the ejector pin contacts the test point includes: controlling the ejector pin to move to align with the test point in the longitudinal direction; and controlling the ejector pin to move toward the test point.

[0007] The adjustment method for the test probe card, after controlling the test probe card to move to the test point position and make contact with the test point, also includes: determining whether the test probe card and the test point have made contact.

[0008] The conditions for successful contact include: the pressure generated by the test pin card meets the preset size requirement; and / or, the acquisition of the target image containing the chip and subsequent steps are executed by the controller, and the test pin card is connected to the controller; the conditions for successful contact include: the chip successfully communicating with the controller through the test pin card.

[0009] The conditions for successful contact include: the pressure generated by the test probe card meets the preset size requirement; determining whether the test probe card and the test point have made contact, including: acquiring pressure change information of the test probe card; based on the pressure change information, determining whether the pressure generated by the test probe card meets the preset size requirement; and in response to the pressure generated by the test probe card meeting the preset size requirement, determining that the test probe card and the test point have made contact.

[0010] The conditions for successful contact include that the pressure generated by the test pin card meets the preset requirements; the test pin card includes an interconnected pin and a pressure sensor, the test pin card contacts the test point through the pin, and the pressure sensor is used to detect the pressure of the pin to obtain the pressure change information of the test pin card.

[0011] The conditions for successful contact include: the chip successfully communicating with the controller via the test probe card; determining whether the test probe card and the test point have made contact, including: sending contact confirmation information to the chip; and confirming that the chip has successfully communicated with the controller via the test probe card in response to the feedback information received from the chip.

[0012] The test pin card consists of at least two pieces, and the chip includes at least two test points. Each test pin card is in contact with one test point. Determining whether the test pin card and the test point have made contact includes: determining whether each test pin card has made contact with its corresponding test point.

[0013] A second aspect of this application provides a chip testing method, the method comprising: controlling the test pin card to contact the test points of the chip using the above-mentioned test pin card adjustment method; sending a test signal to the chip; and receiving test feedback generated by the chip based on the test signal.

[0014] A third aspect of this application provides a chip testing device, which includes a controller and a test pin card connected to each other. The controller is used to perform the above-described test pin card adjustment method or the above-described chip testing method.

[0015] The chip testing equipment also includes an image acquisition device, which is connected to the processor and used to acquire images of the chip.

[0016] A fourth aspect of this application provides a computer-readable storage medium for storing program instructions that can be executed to implement the above-described test pin card adjustment method or the above-described chip testing method.

[0017] In the above technical solution, the position of the test points on the chip is determined by detecting the test points on a target image containing the chip, ensuring accuracy. The test probes of the testing equipment are moved to the test point positions, enabling precise contact between the test probes and the test points on the chip. This establishes a bridge between the controller of the testing equipment and the chip, allowing communication between the controller and the chip, thus enabling the controller to test the chip. Furthermore, the positioning of the test points on the chip and the movement of the test probes are automated, allowing for efficient and accurate adjustment of the test probes through automation. Attached Figure Description

[0018] Figure 1 This is a flowchart illustrating an embodiment of the test pin card adjustment method provided in this application;

[0019] Figure 2 This is a schematic diagram of the structure of an embodiment of the chip testing equipment provided in this application;

[0020] Figure 3 This is a schematic diagram of another embodiment of the chip testing equipment provided in this application;

[0021] Figure 4 This is a flowchart illustrating an embodiment of the chip testing method provided in this application;

[0022] Figure 5 This is a schematic diagram of an embodiment of the computer-readable storage medium provided in this application. Detailed Implementation

[0023] The embodiments of this application will now be described in detail with reference to the accompanying drawings.

[0024] In the following description, specific details such as particular system architectures, interfaces, and technologies are presented for illustrative purposes rather than for limiting purposes, in order to provide a thorough understanding of this application.

[0025] In this document, the term "and / or" is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " generally indicates that the preceding and following related objects have an "or" relationship. Furthermore, "many" in this document means two or more. Moreover, the term "at least one" in this document means any combination of at least two of any one or more of a plurality of objects. For example, including at least one of A, B, and C can mean including any one or more elements selected from the set consisting of A, B, and C.

[0026] Please see Figure 1 , Figure 1 This is a flowchart illustrating an embodiment of the test pin adjustment method provided in this application. It should be noted that if substantially the same result is achieved, this embodiment is not necessarily identical. Figure 1 The illustrated process sequence is limited. For example... Figure 1 As shown, this embodiment includes:

[0027] Step S11: Obtain the target image containing the chip.

[0028] The test probe card of a test equipment is a crucial component used in the semiconductor wafer testing process; it is considered the "fingertip" of the test equipment. The test probe card establishes electrical contact with the test points on the chip through its pins. In other words, the test probe card successfully establishes a bridge between the test equipment's controller and the chip through contact between its pins and the test points. This allows the controller to communicate normally with the chip, enabling it to perform tests, ensuring chip quality and performance, and reducing the risk of problems during chip use.

[0029] If the position of the test pin card in the test setup is not adjusted accurately, the test pin card of the test equipment cannot make accurate contact with the test points of the chip. On the one hand, this will cause the controller of the test equipment to fail to test the chip, resulting in a decrease in the yield rate, classifying good products as defective products, and thus affecting the efficiency and success of chip production. On the other hand, it will cause the test pin card of the test setup to damage the chip.

[0030] The method of this embodiment is used to automatically adjust the test pins of a test device. On the one hand, it can accurately adjust the test pins, ensuring that the adjusted test pins make precise contact with the test points of the chip, avoiding damage to the chip from contact with other parts of the chip; that is, it can improve the accuracy of test pin adjustment. On the other hand, it can quickly and accurately adjust the test pins, that is, it can improve the efficiency of test pin adjustment. Therefore, the automated test pin adjustment method provided in this application can improve the efficiency and accuracy of test pin adjustment, thereby improving the efficiency and accuracy of chip testing.

[0031] In this embodiment, a target image containing the chip is acquired.

[0032] In one implementation, such as Figure 2 As shown, Figure 2This is a schematic diagram of an embodiment of the chip testing equipment provided in this application. The chip testing equipment includes an image acquisition device, which can be used to take pictures and sample the chip to obtain a target image containing the chip.

[0033] In one specific implementation, such as Figure 2 As shown, the chip testing equipment also includes interconnected test pin cards and a controller. The test pin cards of the testing equipment are used to contact the test points of the chip to establish a bridge between the controller of the testing equipment and the chip, enabling the controller of the testing equipment to test the chip. The controller is used to execute the test pin card adjustment method provided in this application, which can accurately adjust the test pin cards of the testing equipment so that the test pin cards of the testing equipment can accurately contact the test points of the chip. In addition, the controller of the testing equipment is also used to test the chip after establishing a communication connection with the chip.

[0034] Of course, in other embodiments, the chip testing equipment may be configured to not include an image acquisition device, and an image acquisition device other than the chip testing equipment may be used to take pictures and sample the chip to obtain a target image containing the chip.

[0035] Step S12: Perform test point detection on the target image to obtain the position of the test point on the chip.

[0036] In this embodiment, test point detection is performed on the target image to obtain the location of the test points on the chip. Determining the location of the test points on the chip by detecting test points on the target image containing the chip is an automated method. Compared to manually determining the location of test points using a high-powered microscope, this method provides more accurate location information, allowing for precise contact between the test probes of the testing equipment and the test points on the chip.

[0037] When a chip has at least two (e.g., 2, 3, 4, 10, 15, etc.) test points, the testing equipment also requires at least two test probes. Each test probe needs to contact one test point to establish a bridge between the testing equipment's controller and the chip, allowing the controller to test the chip. Therefore, in one embodiment, the chip includes at least two test points. In this case, each test point on the target image is detected to obtain the position of each test point on the chip. Only after determining the position of each test point on the chip can each test probe of the testing equipment accurately contact one test point.

[0038] There is no limit to the number of test points set on the chip; the number can be set according to actual usage needs.

[0039] In one embodiment, the position of the test points on the chip is represented by their coordinates. That is, the position of the test points on the chip is characterized using coordinates. It should be noted that the chip is supported by a fixed tray, and the coordinates of the test points on the chip are relative to the test tray. After acquiring a target image containing the chip, the coordinates of the test points on the chip can be determined by analyzing the positional relationship between the test points on the chip and the tray.

[0040] Step S13: Control the test probe card to move to the position of the test point so as to make contact with the test point.

[0041] In this embodiment, the test probe card is controlled to move to the test point position to make contact with the test point. That is, the test probe card of the test equipment is automatically controlled to move to the test point position on the chip to make contact with the test point on the chip, thus establishing a bridge between the controller of the test equipment and the chip. The controller of the test equipment can communicate with the chip, thereby enabling the controller of the test equipment to test the chip.

[0042] The positions of the test points on the chip are determined by detecting test points on a target image containing the chip, ensuring accuracy. The test probes of the testing equipment are moved to the test point positions, enabling precise contact between the test probes and the chip. This establishes a bridge between the test equipment controller and the chip, allowing communication between the controller and the chip for chip testing. Furthermore, the positioning of the test points and the movement of the test probes are automated, allowing for automated adjustment of the test probes.

[0043] Specifically, the test probe card is controlled to move left, right, forward, and backward to align with the test points on the chip; then, the test probe card is controlled to move up and down to the test points on the chip to make contact with them.

[0044] In one embodiment, there are at least two test points on the chip (e.g., 2, 3, 4, 10, 15, etc.), which determine the position of each test point on the chip; there are at least two test pin cards (e.g., 2, 3, 4, 10, 15, etc.), which control each test pin card to contact a test point, so that a bridge can be established between the controller of the test equipment and the chip, and the controller of the test equipment can test the chip.

[0045] In one implementation, such as Figure 3 As shown, Figure 3 This is a schematic diagram of another embodiment of the chip testing equipment provided in this application. The test probe card includes a pin, and the test probe card is controlled to move to the position of the test point to make contact with the test point. Specifically, the pin is controlled to move to the position of the test point so that the pin makes contact with the test point. That is to say, in the actual chip testing process, the pin of the test probe card is actually controlled to move to the position of the test point on the chip to make contact with the test point on the chip, thereby establishing a bridge between the controller of the test equipment and the chip. The controller of the test equipment can communicate with the chip, so that the controller of the test equipment can test the chip.

[0046] In one embodiment, after the test probe card is moved to the position of the test point and makes contact with the test point, it is determined whether the test probe card and the test point have made contact, so as to determine whether the test probe card of the test device is in stable contact with the test point on the chip.

[0047] Since it takes time for the test probes of the test equipment to make contact with the test points on the chip, determining whether contact is complete during this process would lead to incorrect determinations. Therefore, a preset time can be set after the test probes move to the test point and make contact before determining whether contact is complete. The preset time is not fixed and can be set according to actual usage needs.

[0048] When a chip has at least two test points (e.g., 2, 3, 4, 10, 15, etc.), the test equipment also needs at least two test pins. Each test pin must make contact with one test point, and this contact must be complete, to establish a bridge between the test equipment's controller and the chip, allowing the controller to test the chip. Therefore, in one specific implementation, the test equipment has at least two test pins, the chip includes at least two test points, and each test pin makes contact with one test point. Determining whether the test pins have made complete contact with the test points specifically involves confirming whether each test pin has made complete contact with its corresponding test point.

[0049] In one specific embodiment, the conditions for successful contact include the pressure generated by the test probe card meeting a preset requirement. When the test probe card of the testing equipment contacts the test point on the chip, the test probe card of the testing equipment will generate pressure changes. When the pressure generated by the test probe card of the testing equipment gradually changes to meet the preset requirement, it can be considered that the test probe card of the testing equipment is in stable contact with the test point on the chip, and the contact between the test probe card of the testing equipment and the test point on the chip is determined to be successful.

[0050] There is no limit to the preset size requirement; it can be set according to actual usage needs.

[0051] In other specific embodiments, acquiring the target image containing the chip and subsequent steps are performed by the controller of the test equipment. The test probe card of the test equipment is connected to the controller of the test equipment, and the condition for successful contact includes the chip successfully communicating with the controller through the test probe card. The contact between the test probe card of the test equipment and the test points on the chip is to establish a bridge between the controller of the test equipment and the chip, enabling communication between the controller and the chip, and allowing the controller of the test equipment to test the chip. Therefore, when the chip successfully communicates with the controller through the test probe card, it indicates that the test probe card has successfully established a bridge between the controller of the test equipment and the chip, and the establishment of the bridge necessarily requires the test probe card of the test equipment to successfully contact the test points on the chip.

[0052] In one specific implementation, the conditions for successful contact include both successful communication between the chip and the controller via the test probe card and pressure generated by the test probe card meeting a preset requirement. In other words, both conditions must be met simultaneously for the test probe card of the testing equipment to be considered to have successfully contacted the test point on the chip. By setting two conditions for successful contact, dual confirmation can be achieved regarding whether contact has been successfully established between the test probe card and the test point.

[0053] In one embodiment, the conditions for successful contact include the chip successfully communicating with the controller via the test probe card. At this point, determining whether contact between the test probe card and the test point is complete involves: sending a contact confirmation message to the chip; and, in response to receiving feedback from the chip, confirming that the chip has successfully communicated with the controller via the test probe card. If the chip responds when the controller of the test equipment sends a contact confirmation message to the chip, it indicates that communication between the controller and the test equipment via the test probe card has been successfully established. This necessarily means that contact between the test probe card and the test point has been completed, thus establishing a bridge between the controller and the chip.

[0054] In one embodiment, the condition for successful contact includes the pressure generated by the test pin card meeting a preset requirement. At this point, determining whether contact between the test pin card and the test point is complete involves: acquiring pressure change information from the test pin card; determining whether the pressure generated by the test pin card meets the preset requirement based on the pressure change information; and confirming that contact between the test pin card and the test point is complete in response to the pressure meeting the preset requirement. When the test pin card of the testing equipment contacts the test point on the chip, the test pin card will generate pressure changes. When the pressure generated by the test pin card gradually changes to meet the preset requirement, it can be considered that the test pin card and the test point on the chip are in stable contact, and the contact between the test pin card and the test point on the chip is considered complete. Furthermore, determining whether contact between the test pin card and the test point is complete by using the pressure change information generated by the test pin card allows for monitoring of the pressure generated by the test pin card, preventing excessive pressure from damaging the chip.

[0055] In one embodiment, the condition for successful contact includes the pressure generated by the test probe holder meeting a preset requirement. That is, the pressure generated by the test probe holder is used to monitor whether contact between the test probe holder and the test point is complete. In this case, the test probe holder includes a pin and a pressure sensor connected to each other. The test probe holder contacts the test point via the pin, and the pressure sensor detects the pressure change of the pin to obtain pressure change information of the test probe holder. In other words, the test probe holder has a structure including a pin and a pressure sensor. The pin is controlled to move to the position of the test point to achieve contact, and the pressure sensor detects the pressure change generated by the contact between the pin and the test point, so that the controller of the testing equipment can determine whether the pin has successfully contacted the test point.

[0056] Please see Figure 4 , Figure 4 This is a schematic flowchart of an embodiment of the chip testing method provided in this application. It should be noted that if substantially the same result is obtained, this embodiment does not necessarily reflect that result. Figure 4 The illustrated process sequence is limited. For example... Figure 4 As shown, this embodiment includes:

[0057] Step S41: Control the test pin card to make contact with the test point of the chip.

[0058] In this embodiment, the test pin card is controlled to contact the test points of the chip, and the test pin card is controlled by the above-mentioned test pin card adjustment method.

[0059] The positions of the test points on the chip are determined by detecting test points on a target image containing the chip, ensuring accuracy. The test probes of the testing equipment are moved to these test point positions, enabling precise contact between the probes and the chip. This establishes a bridge between the testing equipment's controller and the chip, allowing communication between them and enabling chip testing. Furthermore, the positioning of the test points and the movement of the test probes are automated. This application automates the adjustment of the test probes, improving the accuracy and efficiency of probe adjustment, thereby enhancing the efficiency and accuracy of chip testing.

[0060] Step S42: Send a test signal to the chip.

[0061] In this embodiment, a test signal is sent to the chip.

[0062] Step S43: Receive test feedback generated by the chip based on the test signal.

[0063] In this embodiment, the receiving chip generates test feedback based on the test signal, and then the chip can be tested based on the received test feedback.

[0064] Please continue reading. Figure 2 The chip testing equipment includes test pin cards and a controller that are coupled to each other. Specifically, the controller controls itself to implement the steps of any of the above-mentioned test pin card adjustment methods or chip testing method embodiments. The controller can also be referred to as a CPU (Central Processing Unit). The controller may be an integrated circuit chip with signal processing capabilities. The controller can also be a general-purpose processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic devices, or discrete hardware components. The general-purpose processor can be a microprocessor or any conventional processor. In addition, the controller can be implemented by an integrated circuit chip.

[0065] In one embodiment, the chip testing equipment may further include an image acquisition device for taking pictures of the chip to obtain a target image containing the chip.

[0066] Please see Figure 5 , Figure 5 This is a schematic diagram of an embodiment of the computer-readable storage medium provided in this application. The computer-readable storage medium 50 of this application embodiment stores program instructions 51. When executed, these program instructions 51 implement the methods provided by any embodiment of the test pin card adjustment method or chip testing method of this application, as well as any non-conflicting combination thereof. The program instructions 51 can be formed into a program file and stored in the aforementioned computer-readable storage medium 50 in the form of a software product, so that a computer device (which may be a personal computer, server, or network device, etc.) executes all or part of the steps of the methods of various embodiments of this application. The aforementioned computer-readable storage medium 50 includes various media capable of storing program code, such as USB flash drives, mobile hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks, or terminal devices such as computers, servers, mobile phones, and tablets.

[0067] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.

Claims

1. A method for adjusting a test pin card, characterized in that, The method includes: Acquire the target image containing the chip; Test point detection is performed on the target image to obtain the position of the test point on the chip; Control the test probe card to move to the position of the test point so as to make contact with the test point.

2. The method according to claim 1, characterized in that, The test probe holder includes a pin; controlling the test probe holder to move to the position of the test point to contact the test point includes: Control the ejector pin to move to the position of the test point so that the ejector pin contacts the test point.

3. The method according to claim 2, characterized in that, The step of controlling the ejector pin to move to the position of the test point, so that the ejector pin contacts the test point, includes: Control the movement of the ejector pin until it is vertically aligned with the position of the test point; Control the movement of the ejector pin toward the test point.

4. The method according to claim 1, characterized in that, After the control test probe card moves to the position of the test point and contacts the test point, the method further includes: The process of determining whether the test probe card is in contact with the test point is complete.

5. The method according to claim 4, characterized in that, The conditions for the contact to be completed include that the pressure generated by the test needle card meets the preset size requirement; And / or, the acquisition of the target image containing the chip and subsequent steps are performed by the controller, and the test probe card is connected to the controller; the conditions for the contact to be completed include the chip successfully communicating with the controller through the test probe card.

6. The method according to claim 5, characterized in that, The conditions for successful contact include that the pressure generated by the test probe card meets a preset requirement; determining whether the test probe card and the test point have successfully made contact includes: Obtain the pressure change information of the test needle card; Based on the pressure change information, determine whether the pressure generated by the test needle card meets the preset size requirement; When the pressure generated by the test probe card meets the preset size requirement, it is determined that the test probe card has made contact with the test point.

7. The method according to claim 5, characterized in that, The conditions for the contact to be completed include that the pressure generated by the test needle card meets the preset size requirement; The test probe card includes a pin and a pressure sensor connected to each other. The test probe card contacts the test point through the pin, and the pressure sensor is used to detect the pressure of the pin to obtain the pressure change information of the test probe card.

8. The method according to claim 5, characterized in that, The conditions for successful contact include the chip successfully communicating with the controller via the test probe card; determining whether the test probe card has successfully made contact with the test point includes: Send contact confirmation information to the chip; In response to receiving feedback information from the chip, it is determined that the chip has successfully communicated with the controller through the test probe card.

9. The method according to claim 4, characterized in that, The test pin card is of at least two types, and the chip includes at least two test points. Each test pin card is in contact with one of the test points. Determining whether the contact between the test pin card and the test point is complete includes: The process of confirming whether each test pin card is in contact with the corresponding test point is completed.

10. The method according to claim 1, characterized in that, The test probe holder includes a pin; controlling the test probe holder to move to the position of the test point to contact the test point includes: Control the ejector pin to move to the position of the test point so that the ejector pin contacts the test point.

11. A chip testing method, characterized in that, The method includes: The test pin card adjustment method according to any one of claims 1-10 is used to control the contact between the test pin card and the test point of the chip; Send a test signal to the chip; Receive the test feedback generated by the chip based on the test signal.

12. A chip testing device, characterized in that, The chip testing equipment includes a controller and a test pin card that are interconnected. The controller is used to perform the test pin card adjustment method as described in any one of claims 1-10, or the chip testing method as described in claim 11.

13. The chip testing equipment according to claim 12, characterized in that, The chip testing equipment also includes an image acquisition device, which is connected to the processor and is used to acquire images of the chip.

14. A computer-readable storage medium, characterized in that, The computer-readable storage medium is used to store program instructions that can be executed to implement the test pin card adjustment method as described in any one of claims 1-10, or the chip testing method as described in claim 11.

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