Dual-mode HPLC + HRF broadband power line carrier communication chip and design and manufacturing method

Abstract

The invention belongs to the technical field of energy, and discloses a dual-mode HPLC + HRF broadband power line carrier communication chip and a design and manufacturing method thereof, and the chip comprises an II acquisition module, a single-phase module, a concentrator module, a three-phase module, a measurement switch module, a carrier module plug-in, an object three-phase module, an object single-phase module, an energy controller module and a photovoltaic protocol module. All the modules work cooperatively, and intelligent communication and management of a power system and a photovoltaic system are achieved. The chip not only can improve the stability and reliability of power line communication, but also can provide flexible communication solutions in different communication environments to meet the requirements of various scenes. Finally, the chip realizes efficient management of energy and intelligent monitoring of a system, and provides powerful technical support for an intelligent power grid and a photovoltaic power generation system.

Description

Technical Field

[0001] This invention belongs to, but is not limited to, the field of energy technology, and particularly relates to a dual-mode HPLC+HRF broadband power line carrier communication chip and its design and manufacturing method. Background Technology

[0002] As of the end of June 2022, the total installed capacity of photovoltaics in China reached 253GW, of which the cumulative installed capacity of distributed photovoltaics was approximately 126.78GW. It is conservatively estimated that the installed capacity of distributed photovoltaics will reach 218GW in 2024.

[0003] The power grid exhibits significant variations in load impedance during different electricity consumption periods, leading to more severe signal attenuation. To address impedance mismatch and time-varying channel attenuation, a channel adaptive technology based on neural network algorithms, combined with a high-gain dynamic analog front-end, can handle signal attenuation depths exceeding 105dB, resulting in more robust networking and communication performance. However, existing chip products lack this functionality.

[0004] As the carrier communication module in the radio station ages, the frequency stability of its crystal oscillator varies significantly under different temperature conditions. Under conditions of large frequency deviation, existing chip products cannot establish initial network clock synchronization, resulting in failure to successfully connect to the network. Summary of the Invention

[0005] To address the problems existing in the prior art, this invention provides a dual-mode HPLC+HRF broadband power line carrier communication chip and its design and manufacturing method.

[0006] The present invention is implemented as follows: a dual-mode HPLC+HRF broadband power line carrier communication chip, which includes: a secondary sampling module, a single-phase module, a concentrator module, a three-phase module, a measurement switch module, a carrier module plug-in, a three-phase module, a single-phase module, an energy controller module, and a photovoltaic protocol module.

[0007] The measurement switch module is used to measure physical quantities such as current, voltage, and temperature, and control the opening and closing of the switch based on the measurement results. These measurement data can help the system monitor and adjust the power usage in real time to ensure the stability and safety of the power system. When certain parameters (such as current or voltage) exceed the preset threshold, the measurement switch module will immediately cut off the circuit to prevent equipment damage or power grid failure.

[0008] The carrier module is responsible for switching between power line communication (HPLC) and high-frequency wireless communication (HRF). The HPLC module transmits data via power lines and is suitable for long-distance communication scenarios. The HRF module transmits data via radio waves and is suitable for applications requiring high data transmission rates and low latency.

[0009] The energy controller module is used to receive data from various sensors, such as electricity, water pressure, and air pressure, and execute complex control algorithms to optimize energy usage efficiency.

[0010] The photovoltaic protocol module is responsible for converting these protocols into instructions and data formats that the photovoltaic system needs to follow specific communication protocols (such as Modbus, IEC 61850, etc.) to realize data exchange and control between devices, enabling remote monitoring, fault diagnosis and performance optimization of the photovoltaic system.

[0011] Furthermore, the measurement switch module continuously collects various data from the system through a built-in high-precision sensor. The sensor converts the collected physical quantity data into electrical signals and transmits them to the processing unit inside the chip. The control logic inside the chip compares these data with preset thresholds. If certain physical quantities, such as current or voltage, are detected to exceed the safety threshold, the module will immediately trigger a switch control signal to cut off the relevant circuits to prevent possible equipment damage or power grid failures. This real-time response mechanism ensures the stability and safety of the power system.

[0012] Furthermore, the energy controller module receives various data from different sensors, such as electricity, water pressure, and air pressure, through multiple sensor interfaces. The sensors transmit the data from the physical environment to the energy controller module in the form of electrical signals. The efficient processing unit within the module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm.

[0013] Furthermore, the HPLC module modulates electrical signals onto power lines, enabling them to be transmitted through existing power infrastructure; when short-distance, high-bandwidth communication is required, the system automatically switches to the HRF module.

[0014] Furthermore, the photovoltaic protocol module is primarily responsible for the communication needs of the photovoltaic system, especially in scenarios requiring adherence to specific communication protocols such as Modbus and IEC 61850. This module first receives communication data from the photovoltaic system, which typically includes equipment status, power generation, and fault information. The module's built-in protocol processing unit converts this data into instructions and data formats that the power system or communication equipment can understand. For example, it converts IEC 61850 protocol data into a format that can be transmitted over power lines, or converts Modbus data into a format that can be transmitted through the HRF module. Through this data conversion and protocol adaptation, the photovoltaic system can be seamlessly integrated with the power line carrier communication chip, thereby enabling remote monitoring, fault diagnosis, and performance optimization of the photovoltaic system. The photovoltaic protocol module can also send the processed data back to the central control system, further optimizing the management of photovoltaic power generation.

[0015] Furthermore, the high-efficiency processing unit in the energy control module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm, specifically including:

[0016] When an increase in load is detected in certain areas, the energy controller will automatically increase the power supply to those areas to ensure that the system's power demand is met. At the same time, the controller will reduce unnecessary energy waste and improve the system's energy efficiency based on the overall load of the system.

[0017] Furthermore, the carrier module integrates high-frequency transmitting and receiving circuits to ensure efficient wireless data communication over short distances; the intelligent switching mechanism built into the carrier module can automatically switch between HPLC and HRF based on communication distance, data volume, and real-time network conditions to ensure the stability and efficiency of data transmission.

[0018] Another objective of this invention is to provide a design method for a dual-mode HPLC+HRF broadband power line carrier communication chip, the method comprising:

[0019] S1: Module Design and Integration: Based on the requirements of power line carrier communication and high-frequency wireless communication, design HPLC and HRF modules and integrate them onto the same chip; at the same time, design II sampling modules, single-phase modules, three-phase modules, etc., and ensure that these modules can work together in the chip.

[0020] S2: Functional Testing and Optimization: Perform functional testing on the completed chip design, focusing on testing the performance of the measurement switch module, energy controller module, and carrier module plug-in to ensure they can operate stably in different communication environments; adjust the chip's operating parameters, such as frequency and power consumption, to optimize the overall system performance;

[0021] S3: Protocol Adaptation and Photovoltaic Integration: Based on the requirements of the photovoltaic system, design the photovoltaic protocol module and adapt it to other communication modules of the chip; test the performance of the photovoltaic protocol module under various photovoltaic protocols to ensure that it can correctly parse and process communication data, and realize remote monitoring and fault diagnosis of the system.

[0022] S4: Manufacturing and Mass Production: Sending tested and optimized chip designs to the manufacturing process for mass production; using standard semiconductor manufacturing processes to ensure high chip quality and consistency.

[0023] Another objective of this invention is to provide a method for manufacturing a dual-mode HPLC+HRF broadband power line carrier communication chip, the method comprising:

[0024] S21: Semiconductor process selection: Select appropriate semiconductor materials and processes according to design requirements to ensure that the chip performance meets expectations;

[0025] S22: Chip Packaging and Testing: After chip manufacturing is completed, the chips are packaged and performance tests are performed on each batch to ensure that the mass-produced chips meet the design specifications.

[0026] S23: Quality Control and Verification: Through a rigorous quality control process, defects that may occur during the manufacturing process are detected and corrected to ensure the reliability and long lifespan of the final product.

[0027] Another object of the present invention is to provide a computer device, the computer device including a memory and a processor, the memory storing a computer program, the computer program being executed by the processor causing the processor to perform the steps of the design method of the dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 7.

[0028] Based on the above technical solutions and the technical problems solved, the advantages and positive effects of the technical solution to be protected by this invention are as follows:

[0029] First, anti-attenuation technology: The power grid exhibits significant changes in load impedance during different electricity consumption periods, leading to more severe signal attenuation. Addressing characteristics such as impedance mismatch and time-varying channel attenuation, a channel adaptive technology based on neural network algorithms, combined with a high-gain dynamic analog front-end, can handle deep signal attenuation exceeding 105dB, resulting in more robust networking and communication performance.

[0030] Anti-noise interference technology: The Siju Micro power line carrier chip employs interference identification and cancellation technology based on neural network algorithms. Besides fixed-form interference such as single-tone and square wave interference in the laboratory, it can adaptively identify and suppress various forms of interference, such as Gaussian-distributed pulses and narrowband interference, significantly improving the communication success rate of network deployment in actual field applications. The latest dual-mode broadband chip product has undergone technological upgrades in anti-narrowband interference and anti-pulse interference, with laboratory interference suppression performance exceeding 100dB (measured in band 2).

[0031] Anti-frequency offset and precise time synchronization technology: As the carrier communication module in the radio station ages, the frequency stability of its crystal oscillator varies significantly under different temperature environments. Under conditions of large frequency offset, many competitors' chips cannot establish initial network clock synchronization, resulting in unsuccessful network access. Our carrier and dual-mode chips incorporate dual algorithms for adaptive time-frequency synchronization and NTB-based network clock synchronization, achieving robust frequency offset estimation and synchronization performance even in environments with a signal-to-noise ratio below -10dB. The anti-frequency offset capability reaches 500PPM, significantly reducing the requirements for external crystal oscillators. The adaptive time-frequency synchronization technology also provides high-precision timing output with a synchronization error of less than 1µs, offering high-precision time synchronization services.

[0032] Transformer Area Topology Identification and Ranging Technology: Several unique transformer area identification algorithms have been designed to automatically identify the phase and transformer area of ​​the electricity meter without interrupting power supply to users. Compared to competitors, it features an original transformer area topology network identification function, incorporating a power line node ranging algorithm within the chip. This algorithm accurately measures the distance between every two nodes, ultimately obtaining the topology network of the entire transformer area. A patent was applied for in 2017 and granted in 2021. These technological innovations provide a reliable guarantee for the refined management of transformer areas and line loss assessment.

[0033] High-efficiency, low-cost RF transmission technology: The State Radio Regulatory Commission imposes strict restrictions on the transmission power of broadband low-power wireless communication. If a wireless transmitter adopts a classic architecture, it will face challenges in power consumption and transmission efficiency. The dual-mode chip-based wireless transmitter achieves significantly higher output efficiency and smaller area cost compared to traditional architecture transmitters. Furthermore, it meets the State Grid's dual-mode standard testing requirements in key indicators such as EVM, out-of-band spurious emissions, and transmission power.

[0034] Ultra-low sensitivity RF receiver technology: The receiver physical layer processing units in dual-mode chips, including synchronization, channel tracking, and channel decoding, employ many innovative technologies. A highly parallel and robust synchronization detection algorithm designed for a layered structure can achieve a signal-to-noise ratio gain of 2–5 dB or more compared to traditional delay autocorrelation synchronization techniques in different operating scenarios. An adaptive channel tracking algorithm designed to address various time-varying characteristics that may occur in wireless IoT channels provides more robust networking and communication performance. These innovative physical layer technologies have been applied in the latest mass-produced dual-mode chips and have achieved excellent performance.

[0035] Low-cost, low-power chip design technology: Each chip adopts a unique chip architecture and multiplexing / gating / power control technology, which facilitates successful mass production at a lower mask cost and has significant advantages in wafer price, die size and power consumption.

[0036] The various modules of this invention work collaboratively to achieve intelligent communication and management of power systems and photovoltaic systems. This chip not only improves the stability and reliability of power line communication but also provides flexible communication solutions in different communication environments, meeting the needs of various scenarios. Ultimately, this chip enables efficient energy management and intelligent system monitoring, providing strong technical support for smart grids and photovoltaic power generation systems. Attached Figure Description

[0037] Figure 1 This is a structural diagram of the dual-mode HPLC+HRF broadband power line carrier communication chip provided in an embodiment of the present invention;

[0038] Figure 2 This is a flowchart of the design method for a dual-mode HPLC+HRF broadband power line carrier communication chip provided in this embodiment of the invention.

[0039] Figure 3 This is a flowchart of the manufacturing method of the dual-mode HPLC+HRF broadband power line carrier communication chip provided in the embodiments of the present invention. Detailed Implementation

[0040] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0041] like Figure 1 As shown, this embodiment of the invention provides a dual-mode HPLC+HRF broadband power line carrier communication chip, which includes: a II acquisition module, a single-phase module, a concentrator module, a three-phase module, a measurement switch module, a carrier module plug-in, a three-phase module, a single-phase module, an energy controller module, and a photovoltaic protocol module;

[0042] This dual-mode HPLC+HRF broadband power line carrier communication chip integrates multiple functional modules designed for broadband data communication over power lines. The chip enables stable data transmission and management over existing power infrastructure using both high-frequency wireless communication (HRF) and high-performance low-frequency power line carrier communication (HPLC) modes. These functional modules work together to allow for efficient and reliable data communication in complex power networks, making it widely applicable in smart grids, photovoltaic systems, and other related fields.

[0043] The secondary sampling module is one of the core components of the chip, responsible for performing secondary sampling of the power signal. Secondary sampling converts the power signal into a digital signal and adjusts the sampling rate as needed to match different communication modes. This module uses a precise ADC (Analog-to-Digital Converter) to convert the acquired analog signal into a digital signal, and then filters, amplifies, and quantizes these signals, providing a high-precision foundation for subsequent data transmission.

[0044] Single-phase and three-phase modules are used for data acquisition and communication management in single-phase and three-phase power systems, respectively. Single-phase modules are suitable for home or small business applications, while three-phase modules are suitable for industrial and large commercial applications. Both modules monitor key parameters such as voltage and current in the power system and transmit this data to the concentrator module. Through the collaboration of these modules, the chip can adapt to different types of power systems, ensuring broad applicability of communication.

[0045] The concentrator module is the core of the chip's data processing, responsible for collecting and processing signals from single-phase modules, three-phase modules, and other data sources. The concentrator module summarizes, analyzes, and performs preliminary processing on the received data before transmitting the processed data through the carrier module plug-in. It also coordinates communication between different modules to ensure efficient and accurate data transmission.

[0046] The measurement switch module is responsible for real-time monitoring of electrical quantities such as current and voltage in the power system and for controlling actions based on preset thresholds or conditions. When an abnormality is detected (such as overvoltage or overcurrent), the module triggers the corresponding switching operation to disconnect or adjust the circuit to protect system equipment. This module ensures the safe operation of the power system and can also feed the monitoring data back to the concentrator module in real time for further processing.

[0047] The carrier module is one of the core components for data communication within the chip. It integrates high-frequency transmitting and receiving circuits and supports both HPLC and HRF communication modes. The carrier module transmits data via power lines or wireless channels and can intelligently switch between HPLC and HRF modes based on communication distance, data volume, and real-time network conditions to ensure stable and efficient data transmission.

[0048] The IoT 3 module and IoT 1 module are IoT communication modules in three-phase and single-phase power systems, respectively, responsible for interacting with external IoT devices. The IoT 3 module is suitable for three-phase power systems, while the IoT 1 module is designed for single-phase systems. They can communicate with external sensors, controllers, or other devices through IoT protocols (such as LoRa, ZigBee, etc.), further expanding the application scenarios of the chip.

[0049] The energy controller module monitors and manages energy flow in the system in real time by connecting to multiple sensor interfaces. Based on a preset intelligent control algorithm, this module analyzes data such as electricity consumption, water pressure, and gas pressure, and dynamically adjusts energy distribution within the system to optimize energy utilization efficiency. It can also receive data from the photovoltaic protocol module to coordinate energy exchange between the photovoltaic power generation system and the power grid.

[0050] The photovoltaic protocol module is specifically designed for handling data communication related to photovoltaic power generation systems. This module supports multiple photovoltaic protocols (such as Modbus and IEC 61850) and can receive and process real-time data from the photovoltaic system, such as power generation, equipment status, and fault information. The photovoltaic protocol module converts this data into commands understandable to the power system and transmits them via a carrier module plug-in, enabling seamless integration of the photovoltaic system with the power grid and facilitating remote monitoring and fault diagnosis.

[0051] During the operation of this chip, the coordination between its various modules is crucial. The II acquisition module digitizes the power signal and sends it to the concentrator module for aggregation and processing via a single-phase or three-phase module. The measurement switch module monitors power parameters and performs protective operations when necessary to ensure system safety. The carrier module is responsible for transmitting the processed data to external systems via power lines or wireless channels. The energy controller module and the photovoltaic protocol module jointly manage and optimize energy, adjusting energy distribution strategies through real-time data feedback to achieve efficient system operation.

[0052] Through the close collaboration of its various functional modules, this dual-mode HPLC+HRF broadband power line carrier communication chip enables efficient and reliable data communication and energy management in complex power networks. It is suitable for various power system scenarios, especially in smart grids and photovoltaic systems, where it can significantly improve system stability, flexibility, and energy efficiency.

[0053] The measurement switch module is used to measure physical quantities such as current, voltage, and temperature, and control the opening and closing of the switch based on the measurement results. These measurement data can help the system monitor and adjust the power usage in real time to ensure the stability and safety of the power system. When certain parameters (such as current or voltage) exceed the preset threshold, the measurement switch module will immediately cut off the circuit to prevent equipment damage or power grid failure.

[0054] The carrier module is responsible for switching between power line communication (HPLC) and high-frequency wireless communication (HRF). The HPLC module transmits data via power lines and is suitable for long-distance communication scenarios. The HRF module transmits data via radio waves and is suitable for applications requiring high data transmission rates and low latency.

[0055] The energy controller module is used to receive data from various sensors, such as electricity, water pressure, and air pressure, and execute complex control algorithms to optimize energy usage efficiency.

[0056] The photovoltaic protocol module is responsible for converting these protocols into instructions and data formats that the photovoltaic system needs to follow specific communication protocols (such as Modbus, IEC 61850, etc.) to realize data exchange and control between devices, enabling remote monitoring, fault diagnosis and performance optimization of the photovoltaic system.

[0057] The measurement switch module continuously collects various data from the system through a built-in high-precision sensor. The sensor converts the collected physical quantity data into electrical signals and transmits them to the processing unit inside the chip. The control logic inside the chip compares these data with preset thresholds. If certain physical quantities, such as current or voltage, are detected to exceed the safety threshold, the module will immediately trigger a switch control signal to cut off the relevant circuits to prevent possible equipment damage or power grid failures. This real-time response mechanism ensures the stability and safety of the power system.

[0058] The energy controller module receives various data from different sensors, such as electricity, water pressure, and air pressure, through multiple sensor interfaces. The sensors transmit the data from the physical environment to the energy controller module in the form of electrical signals. The efficient processing unit within the module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm.

[0059] The HPLC module modulates electrical signals onto power lines, enabling them to be transmitted through existing power infrastructure; when short-distance, high-bandwidth communication is required, the system automatically switches to the HRF module.

[0060] The photovoltaic protocol module is primarily responsible for the communication needs of the photovoltaic system, especially in scenarios requiring adherence to specific communication protocols such as Modbus and IEC 61850. This module first receives communication data from the photovoltaic system, which typically includes equipment status, power generation, and fault information. The module's built-in protocol processing unit converts this data into instructions and data formats that the power system or communication equipment can understand. For example, it converts IEC 61850 protocol data into a format that can be transmitted over power lines, or converts Modbus data into a format that can be transmitted through the HRF module. Through this data conversion and protocol adaptation, the photovoltaic system can be seamlessly integrated with the power line carrier communication chip, thereby enabling remote monitoring, fault diagnosis, and performance optimization of the photovoltaic system. The photovoltaic protocol module can also send the processed data back to the central control system to further optimize the management of photovoltaic power generation.

[0061] The high-efficiency processing unit in the energy control module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm, specifically including:

[0062] When an increase in load is detected in certain areas, the energy controller will automatically increase the power supply to those areas to ensure that the system's power demand is met. At the same time, the controller will reduce unnecessary energy waste and improve the system's energy efficiency based on the overall load of the system.

[0063] The carrier module integrates high-frequency transmitting and receiving circuits to ensure efficient wireless data communication over short distances. The intelligent switching mechanism built into the carrier module can automatically switch between HPLC and HRF based on communication distance, data volume, and real-time network conditions to ensure the stability and efficiency of data transmission.

[0064] The chip design of this invention integrates multiple functional modules, including a measurement switch module, an energy controller module, an HPLC (wideband power line communication) module, an HRF (high-frequency wireless communication) module, a photovoltaic protocol module, and a carrier module plug-in. Each module, through its internal complex signal processing and data management system, enables real-time monitoring, intelligent control, and efficient communication of the power system.

[0065] First, the measurement switch module continuously monitors various physical quantities in the system, such as current, voltage, and temperature, using built-in high-precision sensors. The sensors convert the collected physical quantity data into analog electrical signals and transmit them to the chip's internal ADC (Analog-to-Digital Converter). After the analog signals are converted into digital signals, they are sent to the processing unit. The processing unit uses preset control logic to compare these data with preset safety thresholds in real time. For example, when the detected current or voltage exceeds the set safety threshold, the processing unit immediately generates a control signal, triggering the switch module's control circuit to cut off the corresponding circuit path, thereby preventing equipment damage or power grid failure. This module's real-time response mechanism, through rapid signal processing and execution, ensures the stability and safety of the power system.

[0066] Secondly, the energy controller module receives data from multiple sensor interfaces, including data on electricity, water pressure, and air pressure. The sensors convert physical data from the environment into electrical signals, which are then transmitted to the module's efficient processing unit. The processing unit analyzes the data using built-in intelligent control algorithms. For example, when an increase in load is detected in a certain area, the energy controller automatically increases the power supply to that area while adjusting energy distribution to other areas of the system to optimize energy efficiency. The data processing involves real-time acquisition of data from each sensor, digital signal processing, and dynamic adjustments based on predictive models. Through this intelligent management, the energy controller module can effectively reduce energy waste and improve the overall operating efficiency of the power system.

[0067] The HPLC and HRF modules are key components for achieving the communication function of this invention. The HPLC module uses modulation technology to directly modulate electrical signals onto power lines, enabling data transmission over existing power line infrastructure, suitable for wide-area coverage communication needs. When the system detects a need for short-range, high-bandwidth communication, the HRF module automatically takes over the communication task. The HRF module has built-in high-frequency transmitting and receiving circuits, enabling efficient data communication over short distances. The carrier module's built-in intelligent switching mechanism automatically switches between HPLC and HRF based on real-time monitoring of communication distance, data volume, and network conditions, ensuring data transmission stability and efficiency. This dynamic switching mechanism is managed by the chip's internal control logic, ensuring minimal communication latency and reliable data transmission under various operating conditions.

[0068] The photovoltaic (PV) protocol module is specifically designed for the communication needs of PV systems. This module is responsible for receiving and processing communication data from the PV system, such as equipment status, power generation, and fault information. First, the data received by the PV protocol module is converted into instructions and data formats that can be understood by the power system or other communication equipment through its built-in protocol processing unit. For example, the module can convert data conforming to the IEC 61850 protocol into a format suitable for power line communication, or convert Modbus protocol data into a format suitable for HRF module transmission. This process involves complex protocol parsing and data adaptation technologies to ensure seamless integration of the PV system with the power line carrier communication chip. Through this module, PV system data can be remotely monitored and fault diagnosed, and performance can be optimized through a central control system, thereby improving the overall intelligence and operational efficiency of the power system.

[0069] like Figure 2 As shown, this embodiment of the invention provides a design method for a dual-mode HPLC+HRF broadband power line carrier communication chip, the method comprising:

[0070] S1: Module Design and Integration: Based on the requirements of power line carrier communication and high-frequency wireless communication, design HPLC and HRF modules and integrate them onto the same chip; at the same time, design II sampling modules, single-phase modules, three-phase modules, etc., and ensure that these modules can work together in the chip;

[0071] S2: Functional Testing and Optimization: Perform functional testing on the completed chip design, focusing on testing the performance of the measurement switch module, energy controller module, and carrier module plug-in to ensure they can operate stably in different communication environments; adjust the chip's operating parameters, such as frequency and power consumption, to optimize the overall system performance;

[0072] S3: Protocol Adaptation and Photovoltaic Integration: Based on the requirements of the photovoltaic system, design the photovoltaic protocol module and adapt it to other communication modules of the chip; test the performance of the photovoltaic protocol module under various photovoltaic protocols to ensure that it can correctly parse and process communication data, and realize remote monitoring and fault diagnosis of the system.

[0073] S4: Manufacturing and Mass Production: Sending tested and optimized chip designs to the manufacturing process for mass production; using standard semiconductor manufacturing processes to ensure high chip quality and consistency.

[0074] The design method for a dual-mode HPLC+HRF broadband power line carrier communication chip provided in this invention aims to integrate power line carrier communication (HPLC) and high-frequency wireless communication (HRF) onto the same chip, achieving dual support for both power line carrier communication and high-frequency wireless communication. First, in the module design and integration stage (S1), HPLC and HRF modules are designed according to the requirements of power line carrier communication and high-frequency wireless communication, and integrated into the same chip. Simultaneously, to achieve broad adaptability of the chip in various application environments, auxiliary modules such as a second-phase acquisition module, a single-phase module, and a three-phase module are also designed. These modules, through a unified architecture design, ensure that they can work collaboratively within the chip, meeting the communication needs of different power environments.

[0075] In the functional testing and optimization phase (S2), the completed chip undergoes detailed functional testing. This phase focuses on testing the performance of the measurement switch module, energy controller module, and carrier module within the chip to ensure stable operation under various communication environments. To optimize the overall chip performance, operating parameters such as operating frequency and power consumption are adjusted during testing. Through optimization, the chip achieves its optimal operating state under different communication environments and power conditions, thereby improving system reliability and communication efficiency.

[0076] Next, in the protocol adaptation and photovoltaic integration phase (S3), a photovoltaic protocol module was designed to meet the specific needs of photovoltaic systems and adapted to the chip's other communication modules. This module is designed to parse and process communication data under various photovoltaic protocols, ensuring seamless communication between the chip and the photovoltaic system. This phase also includes testing the performance of the photovoltaic protocol module under various photovoltaic protocols, focusing on ensuring its reliability in remote monitoring and fault diagnosis. Through this protocol adaptation, the chip can achieve remote monitoring and efficient fault diagnosis functions in a wide range of photovoltaic applications.

[0077] Finally, the manufacturing and mass production stage (S4) involves sending the tested and optimized chip design to the manufacturing process for mass production. To ensure high chip quality and consistency, standard semiconductor manufacturing processes are used. The key to this stage is guaranteeing the chip's manufacturing precision and consistency to maintain the performance and reliability of each chip in large-scale production. Simultaneously, the mass production stage also involves optimizing the production process to improve production efficiency and reduce manufacturing costs, thereby achieving economical mass production of high-quality chips. Through these meticulous design and manufacturing steps, the resulting dual-mode HPLC+HRF broadband power line carrier communication chip can meet various communication needs and has broad application prospects.

[0078] like Figure 3 As shown, this embodiment of the invention provides a method for manufacturing a dual-mode HPLC+HRF broadband power line carrier communication chip, the method comprising:

[0079] S21: Semiconductor process selection: Select appropriate semiconductor materials and processes according to design requirements to ensure that the chip performance meets expectations;

[0080] S22: Chip Packaging and Testing: After chip manufacturing is completed, the chips are packaged and performance tests are performed on each batch to ensure that the mass-produced chips meet the design specifications.

[0081] S23: Quality Control and Verification: Through a rigorous quality control process, defects that may occur during the manufacturing process are detected and corrected to ensure the reliability and long lifespan of the final product.

[0082] Through the above design and manufacturing methods, the dual-mode HPLC+HRF broadband power line carrier communication chip of the present invention can maintain high performance and high reliability in complex and ever-changing communication environments, and is suitable for intelligent management and control in various scenarios such as power systems and photovoltaic systems.

[0083] In the chip design method of this invention, semiconductor process selection (S21) is a fundamental step in the entire manufacturing process. Based on the chip's design requirements, suitable semiconductor materials and manufacturing processes must first be selected. Different semiconductor materials, such as silicon and gallium arsenide, have different physical properties and are suitable for different types of circuit designs and application scenarios. Selecting appropriate materials and processes directly affects the chip's electrical performance, power consumption, and durability. In this step, process selection also needs to consider the chip's complexity, production costs, and the expected market performance of the final product to ensure that the chip's performance in design and practical applications reaches its optimal level.

[0084] Next comes the chip packaging and testing (S22) stage. After chip manufacturing, packaging is required. Packaging not only protects the chip from external environmental damage but also affects its heat dissipation performance and electrical characteristics. Therefore, choosing a suitable packaging type is crucial, such as plastic packaging or ceramic packaging. After packaging, each batch of chips undergoes comprehensive performance testing, including electrical parameter testing, functional testing, and environmental stress testing. The purpose of these tests is to ensure that the chip's performance indicators meet design specifications and maintain stable performance under different operating conditions. Through these tests, defective chips can be identified and rejected, ensuring that every chip leaving the factory meets high-standard quality requirements.

[0085] In the Quality Control and Verification (S23) phase, a rigorous quality control process is crucial to ensuring the reliability and long lifespan of the final product. During chip manufacturing, various defects may occur, such as impurity contamination, uneven doping concentration, and photolithography deviations. If these problems are not detected and corrected in a timely manner, they may affect the chip's performance and lifespan. Therefore, the quality control process includes inspections at various critical process nodes, such as checking pattern accuracy after photolithography and detecting doping uniformity after ion implantation. Through these inspection methods, potential problems in the manufacturing process can be identified early, and timely process adjustments can be made to ensure the overall quality of the product.

[0086] Finally, after the entire manufacturing process is completed, final verification and quality certification are required to ensure that all produced chips meet established quality standards. These verification steps include accelerated life testing and temperature cycling testing, used to simulate the chip's performance under various extreme conditions in real-world use. Through these rigorous tests, the chip's reliability and durability can be verified, ensuring that the product can operate stably over extended periods and meet customer application requirements. Through the detailed design and strict control of these stages, the quality and performance of the final product are effectively guaranteed, enabling the chip to perform its intended function in practical applications.

[0087] This invention provides a computer device, which includes a memory and a processor. The memory stores a computer program, and when the computer program is executed by the processor, the processor performs the steps of the design method for a dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 7.

[0088] Example 1: Smart Grid Management System Based on Dual-Mode HPLC+HRF Broadband Power Line Carrier Communication Chip

[0089] In smart grid applications, the reliability and speed of power line communication are crucial for grid monitoring and control. Traditional power line carrier communication is susceptible to signal attenuation and electromagnetic interference over long distances, while existing communication methods struggle to meet the requirements of low latency and high bandwidth for high-frequency data transmission.

[0090] System Design and Application:

[0091] This embodiment utilizes a dual-mode HPLC+HRF broadband power line carrier communication chip to construct a smart grid management system. The system installs intelligent terminal devices containing dual-mode chips at various nodes of the power grid. The HPLC module enables power line carrier communication for long-distance data transmission, ensuring stable monitoring of the power grid. Simultaneously, the HRF module is used for short-range, high-frequency wireless data transmission. In scenarios requiring high bandwidth and low latency (such as rapid response to power grid status changes), the system switches to HRF mode, thereby improving communication efficiency and response speed.

[0092] Effects and advantages:

[0093] Through the measurement switch module, the system can monitor the current, voltage and temperature of each node in the power grid in real time, and quickly cut off the circuit when an abnormality is detected to prevent accidents from occurring.

[0094] The energy controller module dynamically optimizes the distribution of electrical energy, reduces energy waste, and improves the overall operating efficiency of the power grid.

[0095] Dual-mode chips offer enhanced anti-interference capabilities and more stable communication connections, significantly improving the reliability and real-time performance of smart grid systems.

[0096] Example 2: Intelligent Photovoltaic Power Generation System Based on Dual-Mode HPLC + HRF Broadband Power Line Carrier Communication Chip

[0097] With the widespread application of distributed photovoltaic (PV) power generation systems, effective monitoring and management of multiple PV power generation units has become a crucial technical challenge. PV systems require real-time monitoring of the operating status, power generation, and fault information of each power generation unit, feeding the data back to the central control system for processing. Traditional communication methods are prone to communication delays and data loss in large-scale PV systems, impacting overall system performance.

[0098] System Design and Application:

[0099] This embodiment achieves intelligent management of a photovoltaic power generation system by integrating a dual-mode HPLC + HRF broadband power line carrier communication chip. The system installs a dual-mode communication chip in each photovoltaic power generation unit. The photovoltaic protocol module processes data from the photovoltaic power generation units and, according to communication protocols such as IEC 61850, uses the HPLC module to transmit the data via power line to the centralized management system for daily monitoring and management. When precise monitoring of specific power generation units or rapid response within the photovoltaic system is required, the HRF module provides high-frequency wireless communication to achieve low-latency data transmission.

[0100] Effects and advantages:

[0101] The system can monitor the power generation and status of photovoltaic power generation units in real time, and optimize the allocation of photovoltaic power generation and grid power supply through the energy controller module to achieve optimal energy utilization.

[0102] The photovoltaic protocol module ensures that communication and data exchange between devices in the photovoltaic system follow standard protocols, and enables remote monitoring, fault diagnosis, and performance optimization of the photovoltaic system through a dual-mode communication chip.

[0103] By adopting dual-mode communication technology, the overall communication performance of the system is significantly improved, ensuring the stability of data transmission in complex environments, reducing data loss and latency, and improving the operating efficiency and reliability of the photovoltaic system.

[0104] Through the two specific embodiments described above, the dual-mode HPLC+HRF broadband power line carrier communication chip of the present invention demonstrates broad application prospects in smart grids and smart photovoltaic power generation systems, and can significantly improve the communication capabilities and management efficiency of these systems.

[0105] It should be noted that embodiments of the present invention can be implemented in hardware, software, or a combination of both. The hardware portion can be implemented using dedicated logic; the software portion can be stored in memory and executed by a suitable instruction execution system, such as a microprocessor or dedicated-design hardware. Those skilled in the art will understand that the above-described devices and methods can be implemented using computer-executable instructions and / or included in processor control code, for example, such code provided on a carrier medium such as a disk, CD, or DVD-ROM, a programmable memory such as read-only memory (firmware), or a data carrier such as an optical or electronic signal carrier. The devices and modules of the present invention can be implemented by hardware circuitry such as very large-scale integrated circuits or gate arrays, semiconductors such as logic chips, transistors, or programmable hardware devices such as field-programmable gate arrays, programmable logic devices, etc., or by software executed by various types of processors, or by a combination of the above-described hardware circuitry and software, such as firmware.

[0106] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any modifications, equivalent substitutions, and improvements made by those skilled in the art within the scope of the technology disclosed in the present invention, and within the spirit and principles of the present invention, should be covered within the scope of protection of the present invention.

Claims

1. A dual-mode HPLC+HRF broadband power line carrier communication chip, characterized in that, The chip includes: The measurement switch module is used to measure physical quantities such as current, voltage, and temperature, and control the opening and closing of the switch based on the measurement results. These measurement data can help the system monitor and adjust the power usage in real time to ensure the stability and safety of the power system. When certain parameters exceed the preset threshold, the measurement switch module will immediately cut off the circuit to prevent equipment damage or power grid failure. The carrier module is responsible for switching between power line communication (HPLC) and high-frequency wireless communication (HRF); the HPLC module transmits data via power lines and is suitable for long-distance communication scenarios; the HRF module transmits data via radio waves and is suitable for applications requiring high data transmission rates and low latency. The energy controller module is used to receive data from various sensors and execute complex control algorithms to optimize energy usage efficiency. The photovoltaic protocol module is responsible for converting these protocols into instructions and data formats that the photovoltaic system needs to follow specific communication protocols to achieve data exchange and control between devices, enabling remote monitoring, fault diagnosis, and performance optimization of the photovoltaic system.

2. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The measurement switch module continuously collects various data from the system through a built-in high-precision sensor. The sensor converts the collected physical quantity data into electrical signals and transmits them to the processing unit inside the chip. The control logic inside the chip compares these data with preset thresholds. If certain physical quantities, such as current or voltage, are detected to exceed the safety threshold, the module will immediately trigger a switch control signal to cut off the relevant circuits to prevent possible equipment damage or power grid failures. This real-time response mechanism ensures the stability and safety of the power system.

3. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The energy controller module receives various data from different sensors, such as electricity, water pressure, and air pressure, through multiple sensor interfaces. The sensors transmit the data from the physical environment to the energy controller module in the form of electrical signals. The efficient processing unit within the module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm.

4. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The HPLC module modulates electrical signals onto power lines, enabling them to be transmitted through existing power infrastructure; when short-distance, high-bandwidth communication is required, the system automatically switches to the HRF module.

5. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The photovoltaic protocol module is primarily responsible for the communication needs of the photovoltaic system, especially in scenarios requiring adherence to specific communication protocols such as Modbus and IEC 61850. This module first receives communication data from the photovoltaic system, which typically includes equipment status, power generation, and fault information. The module's built-in protocol processing unit converts this data into instructions and data formats that the power system or communication equipment can understand. For example, it converts IEC 61850 protocol data into a format that can be transmitted over power lines, or converts Modbus data into a format that can be transmitted through the HRF module. Through this data conversion and protocol adaptation, the photovoltaic system can be seamlessly integrated with the power line carrier communication chip, thereby enabling remote monitoring, fault diagnosis, and performance optimization of the photovoltaic system. The photovoltaic protocol module can also send the processed data back to the central control system to further optimize the management of photovoltaic power generation.

6. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The high-efficiency processing unit in the energy control module analyzes this data and dynamically adjusts the energy distribution within the system according to a preset intelligent control algorithm, specifically including: When an increase in load is detected in certain areas, the energy controller will automatically increase the power supply to those areas to ensure that the system's power demand is met. At the same time, the controller will reduce unnecessary energy waste and improve the system's energy efficiency based on the overall load of the system.

7. The dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 1, characterized in that, The carrier module integrates high-frequency transmitting and receiving circuits to ensure efficient wireless data communication over short distances. The intelligent switching mechanism built into the carrier module can automatically switch between HPLC and HRF based on communication distance, data volume, and real-time network conditions to ensure the stability and efficiency of data transmission.

8. A design method for a dual-mode HPLC+HRF broadband power line carrier communication chip, characterized in that, The method includes: S1: Module Design and Integration: Based on the requirements of power line carrier communication and high-frequency wireless communication, design HPLC and HRF modules and integrate them onto the same chip; at the same time, design II sampling modules, single-phase modules, three-phase modules, etc., and ensure that these modules can work together in the chip; S2: Functional Testing and Optimization: Perform functional testing on the completed chip design, focusing on testing the performance of the measurement switch module, energy controller module, and carrier module plug-in to ensure they can operate stably in different communication environments; adjust the chip's operating parameters, such as frequency and power consumption, to optimize the overall system performance; S3: Protocol Adaptation and Photovoltaic Integration: Based on the requirements of the photovoltaic system, design the photovoltaic protocol module and adapt it to other communication modules of the chip; test the performance of the photovoltaic protocol module under various photovoltaic protocols to ensure that it can correctly parse and process communication data, and realize remote monitoring and fault diagnosis of the system; S4: Manufacturing and Mass Production: Sending tested and optimized chip designs to the manufacturing process for mass production; using standard semiconductor manufacturing processes to ensure high chip quality and consistency.

9. A method for manufacturing a dual-mode HPLC+HRF broadband power line carrier communication chip, characterized in that, The method includes: S21: Semiconductor process selection: Select appropriate semiconductor materials and processes according to design requirements to ensure that the chip performance meets expectations; S22: Chip Packaging and Testing: After chip manufacturing is completed, the chips are packaged and performance tests are performed on each batch to ensure that the mass-produced chips meet the design specifications. S23: Quality Control and Verification: Through a rigorous quality control process, defects that may occur during the manufacturing process are detected and corrected to ensure the reliability and long lifespan of the final product.

10. A computer device, characterized in that, The computer device includes a memory and a processor. The memory stores a computer program, which, when executed by the processor, causes the processor to perform the steps of the design method for the dual-mode HPLC+HRF broadband power line carrier communication chip as described in claim 8.

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