Communication signal transmitting method and device, communication chip and equipment

Abstract

The invention relates to a communication signal transmitting method and device, a communication chip and equipment, and the method comprises the steps: obtaining a target optical signal based on a radio frequency signal and carrier light modulation; performing power division processing on the target optical signal to obtain a first optical signal and a second optical signal; transmitting a first optical signal through the optical antenna array; combining the second optical signal and local oscillation light to obtain a third optical signal; performing beat frequency processing on the third optical signal to obtain a terahertz electric signal; terahertz electric signals are transmitted through the terahertz antenna array. By adopting the method, the communication distance of the communication signal transmitting device can be improved.

Description

Technical Field

[0001] This application relates to the field of wireless communication technology, and in particular to a communication signal transmission method, apparatus, communication chip, and device. Background Technology

[0002] With the development of applications such as cloud computing, telemedicine, remote conferencing, and short videos, as well as technologies like artificial intelligence and the Internet of Things, wireless communication traffic has experienced explosive growth, placing higher demands on wireless communication bandwidth. One way to improve wireless communication bandwidth is to increase the carrier frequency.

[0003] The terahertz (THz) band possesses continuous and vast spectrum resources due to its carrier frequency being much higher than that of traditional microwaves. Among related technologies, photon-assisted terahertz antenna array transmission technology can fully utilize the ultra-wide bandwidth characteristics of the terahertz band, providing the system with tens or even hundreds of GHz (gigahertz) of usable bandwidth.

[0004] However, communication signal transmitting devices using terahertz antenna arrays in related technologies have relatively short communication distances. Summary of the Invention

[0005] Therefore, it is necessary to provide a communication signal transmission method, apparatus, communication chip, and device that can improve communication distance in response to the above-mentioned technical problems.

[0006] Firstly, a method for transmitting communication signals is provided, including: The target optical signal is obtained based on radio frequency signal and carrier optical modulation; The target optical signal is power divided to obtain the first optical signal and the second optical signal; The first optical signal is transmitted through an optical antenna array; The second optical signal and the local oscillator light are combined to obtain the third optical signal; The third optical signal is subjected to beat frequency processing to obtain a terahertz electrical signal; Terahertz electrical signals are transmitted through a terahertz antenna array.

[0007] In one embodiment, the target optical signal is obtained based on radio frequency signals and carrier light modulation, including: The radio frequency signal and the carrier light are modulated to obtain the initial optical signal; The initial optical signal is processed with true time delay to obtain multiple target optical signals, each with a different time delay relative to the initial optical signal.

[0008] Secondly, it provides a communication signal transmitting device, including: An optical signal generation module is used to obtain a target optical signal based on radio frequency signals and carrier light modulation. The first power divider module is used to perform power divider processing on the target optical signal to obtain the first optical signal and the second optical signal. An optical antenna array is used to transmit the first optical signal; The combiner module is used to combine the second optical signal and the local oscillator light to obtain the third optical signal. The photoelectric detection module is used to perform beat frequency processing on the third optical signal to obtain a terahertz electrical signal; Terahertz antenna arrays are used to transmit terahertz electrical signals.

[0009] In one embodiment, the optical signal generation module includes: The optoelectronic modulation module is used to modulate the radio frequency signal and the carrier light to obtain the initial optical signal; The true delay control module is used to perform true delay processing on the initial optical signal to obtain multiple target optical signals, each with a different delay relative to the initial optical signal; The device also includes: a second power divider module, used to perform power divider processing on the local oscillator light to obtain multiple local oscillator lights; The combining module is used to combine each second optical signal and each local oscillator light to obtain multiple third optical signals; The photoelectric detection module is used to perform beat frequency processing on each third optical signal to obtain multiple terahertz electrical signals.

[0010] In one embodiment, the device further includes: The first end-face coupler is used to couple the carrier light to the optical signal generation module; The second end-face coupler is used to couple the local oscillator light to the combining module.

[0011] In one embodiment, the device further includes a microstrip line; The photoelectric detection module is connected to the terahertz antenna array via microstrip line coupling.

[0012] Thirdly, this application provides a communication chip. This communication chip is based on the communication signal transmitting device provided in the second aspect above.

[0013] In one embodiment, the communication chip further includes: a thin-film lithium niobate substrate; The optoelectronic modulation module, true time delay control module, first power divider module, optical antenna array, beam combining module and terahertz antenna array are fabricated on a thin-film lithium niobate substrate.

[0014] In one embodiment, the photodetector module is an indium phosphide-based photodetector integrated on a thin-film lithium niobate substrate.

[0015] Fourthly, this application provides a communication device. This communication device includes the communication signal transmitting device provided in the second aspect.

[0016] The aforementioned communication signal transmission method, apparatus, communication chip, and device, wherein the communication signal transmission method obtains a target optical signal based on radio frequency signal and carrier light modulation; performs power division processing on the target optical signal to obtain a first optical signal and a second optical signal; transmits the first optical signal through an optical antenna array; performs combination processing on the second optical signal and local oscillator light to obtain a third optical signal; performs beat frequency processing on the third optical signal to obtain a terahertz electrical signal; and transmits the terahertz electrical signal through a terahertz antenna array. In related technologies, the power of the terahertz electrical signal generated by beat frequency is relatively low due to the limited output power of the photodetector, resulting in a short communication distance for the terahertz antenna array. This is especially true in rainy weather or other environments with high humidity, where the attenuation of the terahertz electrical signal is significant, further shortening the communication distance. The aforementioned communication signal transmission method utilizes the characteristic that terahertz electrical signals require combining optical signals and local oscillator light before beat frequency generation, and the characteristic that optical antenna arrays can directly transmit optical signals, with signal power not limited by photodetectors and radiation signal intensity not easily attenuated by high humidity. Before combining the target optical signal and local oscillator light, the target optical signal is split into two parts. One part is transmitted through the optical antenna array, while the other part continues the process of generating a terahertz electrical signal with the local oscillator light and is also transmitted through the terahertz antenna array. This integrates terahertz wireless communication and optical wireless communication, fully utilizing the advantages of both methods, overcoming the communication distance limitation caused by using only terahertz wireless communication, and increasing the communication distance of the communication signal transmitting device. Attached Figure Description

[0017] To more clearly illustrate the technical solutions in the embodiments or related technologies of this application, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A schematic diagram illustrating the application environment of a communication signal transmission method provided in one embodiment; Figure 2 A flowchart illustrating a communication signal transmission method provided in one embodiment; Figure 3 This is a flowchart illustrating the steps for obtaining the target optical signal in one embodiment; Figure 4 This is a structural block diagram of a communication signal transmitting device in one embodiment; Figure 5This is a schematic diagram of the structure of an optical antenna array in one embodiment; Figure 6 This is a schematic diagram of the structure of a terahertz antenna array in one embodiment; Figure 7 This is a structural block diagram of a communication signal transmitting device in another embodiment; Figure 8 This is a structural block diagram of the communication signal transmitting device in yet another embodiment; Figure 9 This is a structural block diagram of the communication signal transmitting device in another embodiment; Figure 10 This is a schematic diagram of the structure of a true time-delay optical waveguide network in one embodiment; Figure 11 This is a schematic diagram of the end-face coupler in one embodiment. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

[0021] It is understood that the terms "first," "second," etc., used herein may be used to describe various elements, but these elements are not limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of this application, a first resistor may be referred to as a second resistor, and similarly, a second resistor may be referred to as a first resistor. Both the first resistor and the second resistor are resistors, but they are not the same resistor.

[0022] It is understood that the term "connection" in the following embodiments should be understood as "electrical connection," "communication connection," etc., if the connected circuits, modules, units, etc., have electrical signal or data transmission with each other.

[0023] When used herein, the singular forms of “a,” “an,” and “the” may also include the plural forms unless the context clearly indicates otherwise. It should also be understood that the terms “comprising / including” or “having,” etc., specify the presence of the stated features, wholes, steps, operations, components, parts, or combinations thereof, but do not preclude the possibility of the presence or addition of one or more other features, wholes, steps, operations, components, parts, or combinations thereof. Meanwhile, the term “and / or” as used in this specification includes any and all combinations of the associated listed items.

[0024] The communication method provided in this application embodiment can be applied to, for example... Figure 1 The application environment shown depicts a scenario where the transmitter and receiver communicate via a communication channel. The transmitter and receiver can be two identical communication devices, such as both being terminal devices; alternatively, they can be different types of communication devices, such as one being a base station and the other a terminal device. The terminal device can be various mobile devices, such as mobile phones (or cellular phones), computers with mobile terminals, portable, pocket-sized, handheld, computer-embedded, or vehicle-mounted mobile devices, or various Internet of Things (IoT) devices. Base station equipment can be used to communicate with communication terminal equipment. For example, it can be a base station (gNB) in the 5th Generation New Radio (5G NR) system, or a base station used in the future 6G system; it can also be a base station (BTS) in the Global System for Mobile Communications (GSM) system or Code Division Multiple Access (CDMA) system, or a base station (NB) in the Wideband Code Division Multiple Access (WCDMA) system, or an evolved base station (eNB or eNodeB) in the Long Term Evolution (LTE) system.

[0025] In one exemplary embodiment, such as Figure 2 As shown, a method for transmitting communication signals is provided, which is applied to... Figure 1 The transmitting end in the process includes the following steps 202 to 212. Wherein: Step 202: Obtain the target optical signal based on the radio frequency signal and carrier light modulation.

[0026] In this context, radio frequency (RF) signals refer to signals that include communication data; for example, the frequency range of RF signals is 10 GHz to 100 GHz; for example, RF signals can be single-frequency continuous wave signals, modulated data signals, or millimeter-wave signals; carrier light is a narrow-linewidth continuous wave optical signal output from a laser, belonging to optical frequencies, generally located in the C-band or L-band, with a frequency range of 180 THz to 230 THz. Electro-optic modulation technology is used to load the input RF signal onto the optical carrier, realizing the mapping of communication data from the electrical domain to the optical domain.

[0027] For example, a Mach-Zehnder electro-optic modulator is used to modulate the intensity or phase of the carrier light.

[0028] Step 204: Perform power division processing on the target optical signal to obtain the first optical signal and the second optical signal.

[0029] Power division refers to dividing a signal into multiple branches with equal or unequal power. Each branch outputs a signal with the same frequency and modulation as the original signal, but with reduced power, for different purposes based on the different branches. The first and second optical signals have the same frequency and modulation as the target optical signal.

[0030] For example, power splitting can be implemented using an optical power splitter.

[0031] Step 206: Transmit the first optical signal through the optical antenna array.

[0032] The optical antenna array is used to convert the input first optical signal from the optical domain into a radiable free-space optical signal, thereby enabling the spatial transmission of the optical signal.

[0033] Step 208: Combine the second optical signal and the local oscillator light to obtain the third optical signal.

[0034] The local oscillator light is used to provide a reference light source for subsequent photoelectric detection. Similar to the carrier light, the local oscillator light is a narrow-linewidth continuous wave optical signal output by a laser. The local oscillator light and the carrier light have different wavelengths, and the frequency difference between them is the carrier frequency of the terahertz electrical signal.

[0035] In this context, combining refers to merging two or more signals with the same or different frequencies. If the input signal frequencies are different, the combined signal will contain the carrier frequencies of all input signals. If the combined signals have the same frequency, the amplitude or power at that frequency will change. The third optical signal contains the frequency components corresponding to the second optical signal and the frequency components corresponding to the local oscillator light.

[0036] Step 210: Perform beat frequency processing on the third optical signal to obtain a terahertz electrical signal.

[0037] Beat frequency processing refers to the photoelectric conversion of optical signals containing different frequency components through a photodetector, causing photoelectric interference between the different frequency light waves inside the detector, thereby generating an electrical signal equal to the frequency difference between the two light signals. The third optical signal simultaneously contains frequency components of the second optical signal and the local oscillator light. These two components exhibit a beat frequency effect in the photosensitive region of the photodetector, and the frequency of the output electrical signal is equal to the frequency difference between the two optical signals. By selecting an appropriate light source frequency difference, an electrical signal within the terahertz frequency range can be obtained in the electrical domain, realizing the frequency conversion from light to terahertz waves.

[0038] Step 212: Transmit terahertz electrical signals through a terahertz antenna array.

[0039] The communication signal transmission method provided in the above embodiments obtains a target optical signal based on radio frequency signal and carrier optical modulation, performs power division processing on the target optical signal to obtain a first optical signal and a second optical signal, transmits the first optical signal through an optical antenna array, combines the second optical signal and the local oscillator light to obtain a third optical signal, performs beat frequency processing on the third optical signal to obtain a terahertz electrical signal, and transmits the terahertz signal through a terahertz antenna array. In related technologies, the power of the terahertz electrical signal generated by beat frequency is relatively low due to the limited output power of the photodetector, resulting in a short communication distance for the terahertz antenna array. This is especially true in rainy weather or other environments with high humidity, where the attenuation of the terahertz electrical signal is significant, further shortening the communication distance. The communication signal transmission method provided in the above embodiment utilizes the characteristic that terahertz electrical signals need to be generated by combining optical signals and local oscillator light before beat frequency generation, and the characteristic that optical antenna arrays can directly transmit optical signals, where the signal power is not limited by the photodetector and the radiation signal intensity is not easily attenuated by high humidity. Before combining the target optical signal and local oscillator light, the target optical signal is divided into two parts. One part is transmitted through the optical antenna array, while the other part continues the process of generating a terahertz electrical signal with the local oscillator light and is transmitted through the terahertz antenna array. This integrates terahertz wireless communication and optical wireless communication, fully utilizing the advantages of both methods, overcoming the problem of limited communication distance caused by using only terahertz wireless communication, and improving the communication distance of the communication signal transmitting device.

[0040] In the above embodiments, the number of various optical signals can be one or multiple, depending on which processing node performs true delay control processing on the optical signals. For example, if true delay control processing is performed on the optical antenna array and the terahertz antenna array after power division processing, the number of target optical signals is one. During the transmission of the first optical signal through the optical antenna array, true delay processing is required on the first optical signal to obtain multiple transmitted optical signals. At each processing node from obtaining the second optical signal to performing beat frequency processing, true delay processing can be performed on the optical signals of the corresponding branches of the terahertz antenna array to obtain multiple optical signals with different delays, thereby realizing beamforming of the terahertz antenna array.

[0041] In one exemplary embodiment, based on Figure 2 The embodiment shown provides a communication signal transmission method involving a process of obtaining a target optical signal based on radio frequency signals and carrier optical modulation. Please refer to... Figure 3 The process includes steps 302 and 304, wherein: Step 302: Modulate the radio frequency signal and the carrier light to obtain the initial optical signal.

[0042] Step 303: Perform true time delay processing on the initial optical signal to obtain multiple target optical signals, wherein the time delay of each target optical signal is different relative to the initial optical signal.

[0043] In this process, after the radio frequency signal and carrier light are modulated to obtain the optical signal, and before the optical signal is split into two parts, true time delay processing is performed on the optical signal to complete the beamforming of the signal. In this way, the transmitted signal waveforms of the antenna array and the terahertz antenna array are made consistent with each other by performing true time delay processing only once, reducing the hardware area occupied by the true time delay control module.

[0044] In this embodiment, the process of performing power division processing on the target optical signal to obtain the first optical signal and the second optical signal includes: performing power division processing on multiple target optical signals respectively to obtain multiple first optical signals and multiple second optical signals.

[0045] The process of combining the second optical signal and the local oscillator light to obtain the third optical signal includes: performing power division processing on the local oscillator light to obtain multiple local oscillator lights; and performing combination processing on each second optical signal and each local oscillator light to obtain multiple third optical signals.

[0046] The process of performing beat frequency processing on the third optical signal to obtain the terahertz optical signal includes: performing beat frequency processing on each third optical signal to obtain each terahertz electrical signal.

[0047] In other embodiments, based on Figure 2In the embodiment shown, the communication signal transmission method provides that after power-dividing the target optical signal to obtain a first optical signal and a second optical signal, true time delay control processing is performed based on the first optical signal and the second optical signal respectively to complete the transmission beamforming for the optical antenna array and the terahertz antenna array.

[0048] In this process, the first optical signal is subjected to true time delay processing to obtain multiple transmitted optical signals. Each transmitted optical signal has a different time delay relative to the first optical signal, and each transmitted optical signal is transmitted through an optical antenna array.

[0049] The true time delay processing based on the second optical signal can be performed after the second optical signal and the local oscillator light are combined, or the second optical signal can be processed with true time delay first, the local oscillator light can be processed with power divider, and then combined with the multiple optical signals output after true time delay processing respectively.

[0050] Based on the same inventive concept, this application also provides a communication signal transmitting device for implementing the communication signal transmitting method described above. The solution provided by this device is similar to the implementation described in the above method; therefore, the specific limitations in one or more communication signal transmitting device embodiments provided below can be found in the limitations of the communication signal transmitting method described above, and will not be repeated here.

[0051] Please refer to Figure 4 In one exemplary embodiment, the provided communication signal transmitting device includes: an optical signal generation module 410, a first power divider module 420, an optical antenna array 430, a combining module 440, a photoelectric detection module 450, and a terahertz antenna array 460, wherein: The optical signal generation module 410 is used to obtain the target optical signal based on radio frequency signal and carrier light modulation.

[0052] The first power divider module 420 is used to perform power divider processing on the target optical signal to obtain a first optical signal and a second optical signal.

[0053] Optical antenna array 430 is used to transmit the first optical signal.

[0054] Optionally, the optical antenna array 430 is composed of n×m grating antennas 431, where m gratings form a group and are connected to the output optical waveguide of the first power divider module 420 through a multi-stage combiner. Each group of gratings connects to m gratings to radiate the same signal, and the gratings between each group have different time delays, so as to control the radiation angle of the optical antenna array 430 by controlling the delay.

[0055] Please refer to Figure 5This is a schematic diagram of an optical antenna array 430 consisting of 4×4 grating antennas 431. The four grating antennas 431 form a group and are connected to an optical waveguide through a two-stage combiner 432.

[0056] The combining module 440 is used to combine the second optical signal and the local oscillator light to obtain the third optical signal.

[0057] The photoelectric detection module 450 is used to perform beat frequency processing on the third optical signal to obtain a terahertz electrical signal.

[0058] The photoelectric detection module 450 includes a single-row carrier photodetector array. Each single-row carrier photodetector corresponds to one optical signal.

[0059] Terahertz antenna array 460 is used to transmit the terahertz electrical signal.

[0060] Optionally, the terahertz antenna array 460 is composed of n×m microstrip patch antennas 461, where m microstrip patch antennas 461 form a group and are connected to the output of the photoelectric detection module 450 through a multi-stage combiner. Each group of microstrip patch antennas 461 is connected to m antennas that radiate the same signal. The radiated signals between each group have different time delays, so as to control the radiation angle of the terahertz antenna array 460 by controlling the delay.

[0061] Please refer to Figure 6 The diagram shows the structure of a terahertz antenna array 460 consisting of 4×4 grating antennas. The four microstrip patch antennas form a group, connected to a single microstrip line via a two-stage combiner.

[0062] In one exemplary embodiment, please refer to Figure 7 The optical signal generation module 410 includes an optoelectronic modulation module 411 and a true delay control module 412. The optoelectronic modulation module 411 modulates the radio frequency signal and the carrier light to obtain an initial optical signal. The true delay control module 412 performs true delay processing on the initial optical signal to obtain multiple target optical signals, each with a different delay relative to the initial optical signal.

[0063] The number of output optical signals of the true delay control module 412 is the same as the number of antenna groups of the terahertz antenna array 460 and the optical antenna array 430.

[0064] In one possible implementation, the true delay control module 412 can employ an n-channel true delay optical waveguide network; please refer to [reference needed]. Figure 10This is a schematic diagram of a 4-channel true time-delay optical waveguide network; the true time-delay optical waveguide network acquires data including an optical switch 4121 and a delay line 4122 with a proportional delay sequence; one optical carrier is... Figure 8 The left end of the input is a true time-delay optical waveguide network. After passing through two stages of beam splitters, it is divided into four optical carriers. Optical switches switch the optical carriers between the upper and lower branches to achieve delay selection. By adjusting the state of the optical switch in each channel, the delay of each optical signal can be adjusted.

[0065] In this embodiment, the first power splitting module 420 employs a beam splitter array to split multiple target optical signals into multiple first optical signals and multiple second optical signals. The optical antenna array 430 is used to transmit the multiple first optical signals.

[0066] In this embodiment, please continue to refer to Figure 7 The communication signal transmitting device also includes a second power divider module 470, which is used to perform power division processing on the local oscillator light to obtain multiple local oscillator lights.

[0067] In this embodiment, the combining module adopts a beam combiner array; the combining module is used to combine each second optical signal and each local oscillator light to obtain multiple third optical signals; the photoelectric detection module 450 is used to perform beat frequency processing on each third optical signal to obtain multiple terahertz electrical signals.

[0068] In other embodiments, please refer to Figure 8 and Figure 9 The optical signal generation module 410 includes an optoelectronic modulation module 411 but does not include a true delay control module 412. The true delay control module 412 can be located after the output of the first power divider module 420. In these embodiments, the number of true delay control modules 412 is two: one true delay control module 412 is located between the first power divider module 420 and the optical antenna array 430, and the other true delay control module 412 is located at a position between the first power divider module 420 and the optoelectronic detection module 450. For example, Figure 8 As shown, another true delay control module 412 is disposed between the combining module 440 and the photoelectric detection module 450; and, by way of example, Figure 9 As shown, another true delay control module 412 is located between the first power divider module 420 and the combiner module 440.

[0069] In one exemplary embodiment, please continue to refer to Figure 7 The provided communication signal transmitting device also includes a first end-face coupler 480 and a second end-face coupler 490. The first end-face coupler 480 is used to couple carrier light to the optical signal generation module 410, and the second end-face coupler 490 is used to couple local oscillator light to the combining module.

[0070] Please refer to Figure 11 , Figure 11 Schematic diagrams of end-face couplers in some embodiments are shown. In some embodiments, the end-face coupler can be divided into three segments to couple light rays in a small-mode-field fiber. The first segment is a waveguide designed on the dielectric layer SiO2 (silicon dioxide) to achieve mode field matching between the SiO2 waveguide and the fiber, reducing coupling loss between the end-face coupler and the fiber. The second segment is a tapered, fully etched thin-film lithium niobate waveguide to achieve adiabatic evanescent wave coupling between the SiO2 waveguide and the fully etched thin-film lithium niobate waveguide, improving coupling efficiency. The third segment is a tapered, shallowly etched thin-film lithium niobate waveguide to achieve adiabatic evanescent wave coupling from the fully etched thin-film lithium niobate waveguide to the shallowly etched thin-film lithium niobate waveguide, achieving high-efficiency optical coupling.

[0071] In one exemplary embodiment, please continue to refer to Figure 4 and Figure 7 The provided communication signal transmitting device also includes a microstrip line, wherein the photoelectric detection module 450 is coupled to the terahertz antenna array 460 via the microstrip line. Figure 4 and Figure 7 The dashed connecting lines in the diagram represent microstrip lines.

[0072] In other embodiments, a coplanar waveguide can be used to connect the photoelectric detection module 450 and the terahertz antenna array 460; or, a waveguide transition structure such as a metal waveguide cavity can be used to connect the photoelectric detection module 450 and the terahertz antenna array 460.

[0073] In one exemplary embodiment, please refer to Figure 7The provided communication signal transmitting device includes: a first end-face coupler 480, a second end-face coupler 490, an optoelectronic modulation module 411, a true delay control module 412, a first power divider module 420, an optical antenna array 430, a second power divider module 470, a combining module, an optoelectronic detection module 450, and a terahertz antenna array 460; wherein, the first end-face coupler 480 is used to couple carrier light to the optical signal generation module 410, and the second end-face coupler 490 is used to couple local oscillator light to the second power divider module 470; the optoelectronic modulation module 411 is used to modulate the radio frequency signal and the carrier light to obtain an initial optical signal; the true delay control module 412 is used to convert the initial optical signal... True time delay processing is performed to obtain multiple target optical signals, each with a different time delay relative to the initial optical signal. The first power divider module 420 is used to perform power division processing on the multiple target signals to obtain multiple first optical signals and multiple second optical signals. The optical antenna array 430 is used to transmit multiple first optical signals. The combiner module is used to combine each second optical signal and each local oscillator light to obtain multiple third optical signals. The photoelectric detection module 450 is used to perform beat frequency processing on each third optical signal to obtain multiple terahertz electrical signals, which are then transmitted to the terahertz antenna array 460 through multiple microstrip lines. The terahertz antenna array 460 is used to transmit multiple terahertz electrical signals.

[0074] The communication signal transmitting device provided in the above embodiments designs a true time-delay optical waveguide network for both optical wireless communication and terahertz wireless communication within the same device. By integrating optical wireless communication and terahertz wireless communication, the advantages of both technologies can be fully utilized, overcoming the drawbacks of either single optical or terahertz wireless communication. This achieves complementarity between optical and terahertz wireless communication systems, enhances the communication rate and reliability of the communication system, and provides a reliable solution for next-generation wireless communication technology.

[0075] The aforementioned communication signal transmitting device simultaneously transmits optical signals and terahertz electrical signals. In rainy or humid weather conditions, the terahertz electrical signals are attenuated, while the optical signals maintain a longer transmission distance and signal power, allowing the receiver and transmitter to communicate via optical signals. In weather conditions with large particle size or low visibility, the optical signals are attenuated, and the receiver and transmitter communicate via terahertz electrical signals.

[0076] In the application environment of this application embodiment, the receiving end has the ability to receive optical signals and terahertz electrical signals.

[0077] In one exemplary embodiment, a communication chip is provided. The communication chip includes a communication signal transmitting device as provided in the above embodiments.

[0078] In one exemplary embodiment, the communication chip further includes a thin-film lithium niobate substrate. The optoelectronic modulation module 411, the true delay control module 412, the first power divider module 420, the optical antenna array 430, the beam combiner module, and the terahertz antenna array 460 are fabricated on the thin-film lithium niobate substrate. In this embodiment, the communication chip uses a thin-film lithium niobate substrate, and the optoelectronic modulation module 411 is fabricated on the thin-film lithium niobate substrate, which can achieve a wider modulation bandwidth.

[0079] In one possible implementation, the thin-film lithium niobate substrate includes a carrier substrate, a silicon dioxide isolation layer, and a lithium niobate thin film layer.

[0080] In one possible implementation, the terahertz antenna array 460 and the microstrip line are deposited on a thin-film lithium niobate substrate by electron beam evaporation.

[0081] In one possible implementation, the photodetector module 450 is an indium phosphide (InP)-based photodetector integrated on a thin-film lithium niobate substrate.

[0082] For example, the photodetector module 450 is fabricated on an InP-based material and integrated onto a thin-film lithium niobate substrate via microtransfer.

[0083] In other embodiments, the communication chip is based on a silicon substrate, and the optoelectronic modulation module 411, the true delay control module 412, the first power divider module 420, the optical antenna array 430, the beam combiner module, and the terahertz antenna array 460 are fabricated on the silicon substrate.

[0084] This application also provides a communication device. This communication device includes the communication signal transmitting apparatus provided in the above embodiments.

[0085] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0086] The above embodiments merely illustrate several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A method for transmitting communication signals, characterized in that, The method includes: The target optical signal is obtained based on radio frequency signal and carrier optical modulation; The target optical signal is power divided to obtain a first optical signal and a second optical signal; The first optical signal is transmitted through an optical antenna array; The second optical signal and the local oscillator light are combined to obtain the third optical signal; The third optical signal is subjected to beat frequency processing to obtain a terahertz electrical signal; The terahertz electrical signal is transmitted through a terahertz antenna array.

2. The method according to claim 1, characterized in that, The method of obtaining the target optical signal based on radio frequency signal and carrier optical modulation includes: The radio frequency signal and the carrier light are modulated to obtain an initial optical signal; The initial optical signal is subjected to true time delay processing to obtain multiple target optical signals, each with a different time delay relative to the initial optical signal.

3. A communication signal transmitting device, characterized in that, The device includes: An optical signal generation module is used to obtain a target optical signal based on radio frequency signals and carrier light modulation. The first power divider module is used to perform power divider processing on the target optical signal to obtain a first optical signal and a second optical signal. An optical antenna array is used to transmit the first optical signal; The combining module is used to combine the second optical signal and the local oscillator light to obtain the third optical signal; A photoelectric detection module is used to perform beat frequency processing on the third optical signal to obtain a terahertz electrical signal; A terahertz antenna array for transmitting the terahertz electrical signal.

4. The apparatus according to claim 3, characterized in that, The optical signal generation module includes: An optoelectronic modulation module is used to modulate the radio frequency signal and the carrier light to obtain an initial optical signal; The true delay control module is used to perform true delay processing on the initial optical signal to obtain multiple target optical signals, each of which has a different delay relative to the initial optical signal; The device further includes: a second power divider module, used to perform power divider processing on the local oscillator light to obtain multiple local oscillator lights; The combining module is used to combine each of the second optical signals and each of the local oscillator light to obtain multiple third optical signals; The photoelectric detection module is used to perform beat frequency processing on each of the third optical signals to obtain multiple terahertz electrical signals.

5. The apparatus according to claim 3, characterized in that, The device further includes: A first end-face coupler is used to couple the carrier light to the optical signal generation module; The second end-face coupler is used to couple the local oscillator light to the combining module.

6. The apparatus according to claim 3, characterized in that, The device also includes microstrip lines; The photoelectric detection module is coupled to the terahertz antenna array via the microstrip line.

7. A communication chip, characterized in that, The communication chip includes a communication signal transmitting device as described in any one of claims 3-6.

8. The communication chip according to claim 7, characterized in that, The communication chip also includes: a thin-film lithium niobate substrate; The electrical modulation module, true time delay control module, first power divider module, optical antenna array, beam combining module and terahertz antenna array are fabricated on a thin-film lithium niobate substrate.

9. The communication chip according to claim 8, characterized in that, The photoelectric detection module is an indium phosphide-based photodetector, which is integrated on the thin-film lithium niobate substrate.

10. A communication device, characterized in that, The communication device includes a communication signal transmitting device as described in any one of claims 3-6.

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