Light source assembly of vehicle logo lamp, manufacturing method of light source assembly and vehicle logo lamp

Abstract

The invention discloses a light source assembly of a vehicle logo lamp, a manufacturing method thereof and the vehicle logo lamp, and relates to the technical field of vehicle logo lamps. The light source assembly of the vehicle logo lamp comprises a driving substrate, the driving substrate comprises a driving circuit, and the front face of the driving substrate is provided with a light-emitting area; the plurality of light-emitting chips are arranged on the driving substrate, are positioned in the light-emitting area and are electrically connected with the driving circuit; the transparent adhesive layer at least covers the light-emitting area; the fluorescent film layer is attached to the face, away from the driving substrate, of the transparent adhesive layer in a high-temperature press fit mode, the thickness of the fluorescent film layer is smaller than that of the transparent adhesive layer, and fluorescent powder is arranged in the fluorescent film layer. The thickness of the transparent adhesive layer is equal to the distance between the face, away from the driving substrate, of the transparent adhesive layer and the front face of the driving substrate. The thickness of the light source assembly is reduced, and the light emitting uniformity is improved.

Description

Technical Field

[0001] This application relates to the field of vehicle logo light technology, specifically to a light source component for a vehicle logo light and its manufacturing method, and a vehicle logo light. Background Technology

[0002] Car logos are the symbols of various car brands. A car logo light is an illuminated car brand logo that has a light source component that lights up the logo. Some light source components use LED beads for illumination. These LED beads, including their brackets, are relatively tall, increasing the overall thickness of the logo light. Furthermore, when the light emitted by the LED beads directly illuminates the logo, the uniformity of the light emission is poor. Summary of the Invention

[0003] This application provides a light source component and manufacturing method for a vehicle logo light, which can solve the problems of excessive thickness and poor light emission uniformity in vehicle logo lights.

[0004] According to one aspect of this application, one embodiment provides a light source assembly for a vehicle logo light, comprising:

[0005] A driving substrate, the driving substrate including a driving circuit, and a light-emitting area is provided on the front side of the driving substrate;

[0006] Multiple light-emitting chips are disposed on the driving substrate and located in the light-emitting area, and are electrically connected to the driving circuit;

[0007] A transparent adhesive layer, at least covering the light-emitting area;

[0008] A fluorescent film layer is bonded to the side of the transparent adhesive layer away from the driving substrate by high-temperature pressing. The thickness of the fluorescent film layer is less than the thickness of the transparent adhesive layer. The fluorescent film layer contains phosphor. The thickness of the transparent adhesive layer is the distance between the side of the transparent adhesive layer away from the driving substrate and the front side of the driving substrate.

[0009] In one embodiment, the transparent adhesive layer has a front side and a side side. The front side of the transparent adhesive layer corresponds to the front light-emitting surface of the light-emitting chip, and the side side of the transparent adhesive layer corresponds to the side light-emitting surface of the light-emitting chip. The fluorescent film layer extends from the front side of the transparent adhesive layer to the side side of the transparent adhesive layer, covering the side side of the transparent adhesive layer. The front light-emitting surface of the light-emitting chip is the side away from the driving substrate.

[0010] In one embodiment, the side surface of the transparent adhesive layer has an inclined surface, which is an inclined plane or an inclined arc surface, or an inclined surface composed of a plane and an arc surface; in cross-section, the inclined surface has a top end away from the driving substrate and a bottom end near the driving substrate, the bottom end of the inclined surface being away from the light-emitting chip relative to the top end of the inclined surface, and the cross-section being perpendicular to the front surface of the driving substrate; the fluorescent film layer has a side covering portion that covers the side surface of the transparent adhesive layer, and the shape of the side covering portion matches the side surface of the transparent adhesive layer.

[0011] In one embodiment, the side of the transparent adhesive layer further has a first plane, which is connected between the inclined surface and the side of the driving substrate. The fluorescent film layer does not cover the first plane, and the bottom end of the side covering portion is connected to the first plane. The height of the first plane is less than 1 / 2 of the thickness of the light-emitting chip.

[0012] In one embodiment, the bottom end of the inclined surface contacts the driving substrate, and the bottom end of the side cover contacts the driving substrate to completely cover the inclined surface.

[0013] In one embodiment, the fluorescent film layer further has an extension that is connected to the bottom end of the side cover and covers the front side of the driving substrate.

[0014] In one embodiment, the distance between the side of the transparent adhesive layer away from the driving substrate and the front surface of the driving substrate is a first distance, and the distance between the side of the light-emitting chip away from the driving substrate and the front surface of the driving substrate is a second distance, wherein the first distance is greater than the second distance.

[0015] In one embodiment, the driving substrate is a flexible substrate, the driving circuit has a plurality of pads disposed in the light-emitting area, the light-emitting chip is electrically connected to the pads through a highly thermally conductive material, and the flexible substrate has a reflective layer on the side where the light-emitting chip is disposed.

[0016] According to another aspect of this application, one embodiment provides a method for manufacturing a light source assembly for a vehicle logo light, comprising:

[0017] A driving substrate is provided, wherein a light-emitting area is provided on the front side of the driving substrate;

[0018] Multiple light-emitting chips are disposed in the light-emitting area of ​​the driving substrate;

[0019] A liquid transparent adhesive layer is provided, which at least covers the light-emitting area;

[0020] A fluorescent film layer is disposed on a liquid transparent adhesive layer, and the projected area of ​​the fluorescent film layer on the front side of the driving substrate is larger than the projected area of ​​the liquid transparent adhesive layer on the front side of the driving substrate.

[0021] The fluorescent film layer is bonded to the liquid transparent adhesive layer by high-temperature vacuum pressing, and the liquid transparent adhesive layer is thinned to the target thickness and then cured.

[0022] In one embodiment, the step of bonding the fluorescent film layer to the transparent adhesive layer by high-temperature vacuum pressing, and thinning the transparent adhesive layer to the target thickness and then curing it includes:

[0023] The fluorescent film layer is squeezed, causing the edge portion of the fluorescent adhesive film to bend and deform, and the transparent adhesive layer to become thinner, until the edge portion of the fluorescent adhesive film surrounds the edge of the transparent adhesive layer that has been thinned to the target thickness. The liquid transparent adhesive layer solidifies, forming the fluorescent film layer that extends from the front side of the transparent adhesive layer to the side side of the transparent adhesive layer and covers the side side of the transparent adhesive layer. The front side of the transparent adhesive layer is the side corresponding to the front light-emitting surface of the light-emitting chip, and the side side of the transparent adhesive layer is the side light-emitting surface of the light-emitting chip.

[0024] In one embodiment, squeezing the fluorescent film layer to bend and deform the edge portion of the fluorescent adhesive film and thin the transparent adhesive layer includes:

[0025] The fluorescent film layer is compressed towards the driving substrate by an airbag, making the transparent adhesive layer thinner. In areas where no transparent adhesive layer is provided, the airbag collapses towards the driving substrate, causing the edge portion of the fluorescent film layer to bend and deform.

[0026] According to another aspect of this application, one embodiment provides a vehicle logo light, including: a housing, and a light source assembly of the vehicle logo light as described above, the light source assembly being assembled inside the housing, the housing including a light-transmitting cover for emitting light emitted by the light source assembly.

[0027] According to the above embodiments, the light source assembly and manufacturing method of the vehicle logo light have multiple light-emitting chips on the front side of the driving substrate. A transparent adhesive layer covers at least the light-emitting area. A fluorescent film layer is bonded to the side of the encapsulating adhesive layer away from the driving substrate by high-temperature pressing. The thickness of the fluorescent film layer is less than the thickness of the transparent adhesive layer, and phosphor is contained within the fluorescent film layer. The overall size of the chips is small, which not only helps to reduce the thickness of the light source assembly to meet the ultra-thin requirements of the vehicle logo light, but also helps to improve the uniformity of light emission. Furthermore, the additional fluorescent film layer formed by high-temperature pressing, with phosphor contained within it, helps to avoid phosphor deposition during the manufacturing process of the light source assembly, further improving the uniformity of light emission. Attached Figure Description

[0028] Figure 1 This is a schematic diagram of the structure of the light source assembly of a vehicle logo light according to one embodiment;

[0029] Figure 2 As one embodiment Figure 1 View from direction A;

[0030] Figure 3 As one embodiment Figure 2 A partial structural schematic diagram of the BB cross section;

[0031] Figure 4 This is a schematic diagram of a driving substrate having a light-emitting region in one embodiment.

[0032] Figure 5 As one embodiment Figure 4 A schematic diagram of the first type of structure in a partial cross-section of the CC.

[0033] Figure 6 As one embodiment Figure 4 A schematic diagram of the second type of structure in the partial cross-section of CC;

[0034] Figure 7 As one embodiment Figure 4 A schematic diagram of the third structure of a partial cross-section of CC;

[0035] Figure 8 As one embodiment Figure 4 A schematic diagram of the fourth structure in a partial cross-section of CC;

[0036] Figure 9 As one embodiment Figure 4 A schematic diagram of the fifth structure in the partial cross-section of CC;

[0037] Figure 10 A flowchart illustrating a method for manufacturing a light source assembly for a vehicle logo light according to one embodiment;

[0038] Figure 11 This is a schematic diagram illustrating the manufacturing steps of a light source assembly for a vehicle logo light according to one embodiment.

[0039] Explanation of reference numerals in the attached figures:

[0040] 1-Fluorescent film layer; 101-Side cover portion; 102-Extension portion; 2-Driving substrate; 201-Side side of driving substrate; 202-Driving circuit; 203-Light emitting area; 204-Non-light emitting area; 3-Transparent adhesive layer; 301-Sloping surface; 302-First plane; 4-Light emitting chip; 5-Reflective layer; 6-Connector; 7-High thermal conductivity material; 8-Airbag. Detailed Implementation

[0041] The present application will now be described in further detail with reference to the accompanying drawings and specific embodiments. Similar elements in different embodiments are referred to by related similar element reference numerals. In the following embodiments, many details are described to facilitate a better understanding of the present application. However, those skilled in the art will readily recognize that some features may be omitted in different situations, or may be replaced by other elements, materials, or methods. In some cases, certain operations related to the present application are not shown or described in the specification. This is to avoid obscuring the core parts of the present application with excessive description. For those skilled in the art, detailed description of these related operations is not necessary; they can fully understand the related operations based on the description in the specification and general technical knowledge in the art.

[0042] Furthermore, the features, operations, or characteristics described in the specification can be combined in any suitable manner to form various embodiments. At the same time, the steps or actions in the method description can be rearranged or adjusted in a manner obvious to those skilled in the art. Therefore, the various orders in the specification and drawings are only for the clear description of a particular embodiment and do not imply a necessary order, unless otherwise stated that a particular order must be followed.

[0043] The serial numbers assigned to components in this document, such as "first" and "second," are used only to distinguish the described objects and have no sequential or technical meaning. The terms "connection" and "linkage" used in this application, unless otherwise specified, include both direct and indirect connections (linkages).

[0044] In related technologies, the light source component uses LED beads to emit light. The LED beads, including their brackets, are relatively tall, increasing the overall thickness of the car logo light. Furthermore, when the light emitted by the LED beads directly illuminates the car logo, the uniformity of light emission is poor. Some light source components, in order to reduce thickness and improve light emission uniformity, use chips placed on a substrate and then encapsulated with an integral encapsulating layer containing phosphor. However, because the phosphor in the integral encapsulating layer can settle, it affects the uniformity of light emission, and the uniformity of phosphor across different products is also poor, thus affecting product consistency.

[0045] Based on this, this application features multiple light-emitting chips on the front side of the driving substrate. A transparent adhesive layer covers at least the light-emitting area, and a fluorescent film layer is bonded to the side of the encapsulating adhesive layer away from the driving substrate via high-temperature pressing. The small overall size of the chips not only helps reduce the thickness of the light source component to meet the ultra-thin requirements of automotive logo lights but also improves the uniformity of light emission. Furthermore, the additional fluorescent film layer, formed by high-temperature pressing and incorporating phosphor, helps prevent phosphor deposition during manufacturing. The uniform distribution of phosphor on the surface of the transparent adhesive layer further enhances the uniformity of light emission. Moreover, the separately designed fluorescent film layer can be selected through testing before being applied to the transparent adhesive layer, which helps improve product yield.

[0046] The following description, in conjunction with the accompanying drawings, describes the light source assembly and manufacturing method of the vehicle logo light provided in this application, as well as some embodiments of the vehicle logo light.

[0047] Please see Figures 1 to 9 This application provides a light source assembly for a vehicle logo light, including a driving substrate 2, multiple light-emitting chips 4, a transparent adhesive layer 3, a fluorescent film layer 1, and other functional components as needed, which are described in detail below.

[0048] In this embodiment, the driving substrate 2 includes a driving circuit 202, and a light-emitting area 203 is provided on the front side of the driving substrate 2. Multiple light-emitting chips 4 are disposed on the driving substrate 2 and located within the light-emitting area 203, and are electrically connected to the driving circuit 202. A transparent adhesive layer 3 at least covers the light-emitting area 203. A fluorescent film layer 1 is bonded to the side of the transparent adhesive layer 3 away from the driving substrate 2 by high-temperature pressing. The thickness of the fluorescent film layer 1 is less than the thickness of the transparent adhesive layer 3. The fluorescent film layer 1 contains phosphor. The thickness of the transparent adhesive layer 3 is the distance between the side of the transparent adhesive layer 3 away from the driving substrate 2 and the front side of the driving substrate 2.

[0049] It is understood that the driving substrate 2 in this application can be a flexible board (such as an FPC, Flexible Printed Circuit) or a rigid board (such as a PCB, Printed Circuit Board). When the driving substrate 2 is a flexible board, the light source component can be matched with the curved surface, which is beneficial to improving the applicability of the light source component, reducing the shape restrictions of the car logo light, and the flexible board is also beneficial to reducing the overall height of the light source component, which can meet the ultra-thin requirements of the car logo light. The light-emitting chip 4 in this application can be a micro light-emitting chip. The small pixel distance of the micro light-emitting chip is beneficial to optimizing the light emission effect. For example, it can be a Mini LED (Mini Light Emitting Diode). This application does not limit the color of the light emitted by the light-emitting chip 4, which can be one or more of blue, purple, red, or green light. The light-emitting chip 4 can be set on the driving substrate 2 through COB (Chips on Board) packaging technology, which is beneficial to reducing the height of the light source component and meeting the ultra-thin requirements of the car logo light. This application does not limit the specific arrangement of the light-emitting chip 4 on the driving substrate 2, as long as uniform light emission can be achieved, such as, but not limited to, a rectangular array distribution. The driving circuit 202 in this application may be partially located within the driving substrate 2, partially located on the surface of the driving substrate 2, or entirely located on the surface of the driving substrate 2. The driving circuit 202 is made of a material with good conductivity, such as copper, silver, gold, aluminum, iron, etc. The two electrodes of the light-emitting chip 4 in this application may be located on the same side of the light-emitting chip 4, for example, both may be located on the bottom surface of the light-emitting chip 4, or both may be located on the top surface of the light-emitting chip 4. Flip-chip LEDs or conventional LEDs may be used. The driving substrate 2 in this application may conform to the shape of the car logo, or the driving substrate 2 may be a single piece of board, with the light-emitting area 203 on the single piece of board conforming to the shape of the car logo. When it is a single piece of board, the outer periphery of the driving substrate 2 may match the outer periphery of the car logo. In some embodiments, the driving substrate 2 may also be directly set to a common shape that is easy to manufacture or install, such as a rectangle or a circle, etc.

[0050] The transparent adhesive layer 3 in this application is made of transparent adhesive, allowing light emitted by the light-emitting chip 4 to pass through. It can be formed by curing liquid transparent adhesive, which may have a certain degree of viscosity to facilitate its connection with the driving substrate 2 and the placement of the fluorescent film layer 1. The transparent adhesive layer 3 at least covers the light-emitting area 203. After the fluorescent film layer 1 is placed on it, the fluorescent film layer 1 can completely cover the light-emitting area 203. In some embodiments, the transparent adhesive layer 3 may also cover the outer peripheral area outside the light-emitting area 203. The fluorescent film layer 1 contains phosphor, and the specific selection of phosphor can be set according to the emission color of the light-emitting chip 4 and the final emission color required by the light source component. For example, the light-emitting chip 4 may be a blue light chip, and the fluorescent film layer 1 may include yellow phosphor particles. The blue light emitted by the blue light chip excites the yellow phosphor particles to emit white light. In this application, the fluorescent film layer 1 is bonded to the transparent adhesive layer 3 by high-temperature pressing, which helps improve the thickness uniformity of the light source component. The fluorescent film layer 1 can be a semi-solid fluorescent film layer 1 formed by high-temperature pressing and curing, or it can be formed by softening and deforming a solid fluorescent film layer 1 in a high-temperature environment and then curing it. The fluorescent film layer 1 can be pre-fabricated, and phosphor can be placed in the fluorescent film layer 1. The phosphor can be evenly distributed above the light-emitting area, which helps to avoid the phosphor precipitation phenomenon that occurs when the phosphor is placed in a thicker transparent adhesive layer 3, thus improving the uniformity of light emission. The fluorescent film layer 1 is mainly used to provide fluorescent adhesive, and its thickness can be made thin enough to reduce the overall thickness of the light source component. In some embodiments, the fluorescent film layer 1 in this application may include a transparent substrate, in which phosphor is placed, and the phosphor is evenly distributed. In some applications, phosphors can also be applied to one side of a transparent substrate. The phosphors are mixed with an adhesive and uniformly coated onto the transparent substrate. After curing, a fluorescent film layer 1 is formed. The cured fluorescent film layer 1 can be used to manufacture light source components, which are then bonded to the transparent adhesive layer 3 via high-temperature pressing. In this application, the fluorescent film layer 1 can be prefabricated, tested, and screened before being used to manufacture light source components. This improves product yield and ensures better consistency in luminescence across different batches.

[0051] The light source component of the aforementioned car logo light has multiple light-emitting chips 4 on the front side of the driving substrate 2. A transparent adhesive layer 3 covers at least the light-emitting area 203. A fluorescent film layer 1 is bonded to the side of the adhesive layer 3 away from the driving substrate 2 by high-temperature pressing. The thickness of the fluorescent film layer 1 is less than the thickness of the transparent adhesive layer 3, and phosphor is contained within the fluorescent film layer 1. The small overall size of the chips not only helps reduce the thickness of the light source component to meet the ultra-thin requirements of the car logo light but also improves the uniformity of light emission. Furthermore, the additional fluorescent film layer 1, bonded by high-temperature pressing, with phosphor contained within it, helps prevent phosphor deposition during the manufacturing process of the light source component. The uniform distribution of phosphor on the surface of the transparent adhesive layer 3 further improves the uniformity of light emission. Moreover, the separately set fluorescent film layer 1 can be selected through testing before being applied to the transparent adhesive layer 3, which helps improve product yield.

[0052] In one embodiment, the transparent adhesive layer 3 has a front side and a side side. The front side of the transparent adhesive layer 3 corresponds to the front light-emitting surface of the light-emitting chip 4, and the side side of the transparent adhesive layer 3 corresponds to the side light-emitting surface of the light-emitting chip 4. The fluorescent film layer 1 extends from the front side of the transparent adhesive layer 3 to the side side of the transparent adhesive layer 3, covering the side side of the transparent adhesive layer 3. The front light-emitting surface of the light-emitting chip 4 is the side away from the driving substrate 2. The fluorescent film layer 1 covers the side side of the transparent adhesive layer 3, so that the light incident on the side side of the transparent adhesive layer 3 can also be converted by the fluorescent film layer 1, which helps to prevent the light emitted by the light-emitting chip 4 (such as blue light) from leaking out from the side and improves the uniformity of light emission.

[0053] In one embodiment, such as Figures 4-8As shown, the fluorescent film layer 1 covers the side surface of the transparent adhesive layer 3. The side surface of the transparent adhesive layer 3 has an inclined surface 301, which can be an inclined plane, an inclined arc surface, or a combination of a plane and an arc surface. In cross-section, the inclined surface 301 has a top end away from the driving substrate 2 and a bottom end close to the driving substrate 2. The bottom end of the inclined surface 301 is farther away from the light-emitting chip 4 relative to the top end of the inclined surface 301, and the cross-section is perpendicular to the front surface of the driving substrate 2. The fluorescent film layer 1 has a side covering portion 101 that covers the side surface of the transparent adhesive layer 3, and the shape of the side covering portion 101 matches the side surface of the transparent adhesive layer 3. The cross-section in this application can be the cross-section of the light source assembly. The inclined surface 301 on the side surface of the transparent adhesive layer 3 can improve the side emission angle of the light source assembly, making the side-emitted light closer to the front-emitted light, thus improving the light emission effect. In some embodiments, the inclined surface 301 can be composed of a combination of a flat surface and an arcuate surface. For example, the connection point on the front side of the transparent adhesive layer 3 can be an arcuate surface, with the bottom end of the arcuate surface connecting to the flat surface, forming a transition that improves the luminescence effect. In some embodiments, when the inclined surface 301 is an arcuate surface, it can be an outwardly convex arcuate surface, which is easier to manufacture. In some embodiments, the inclined surface 301 can also be a concave arcuate surface. During the manufacturing process, the inclined surface 301 of the transparent adhesive layer 3 and the side covering portion 101 of the fluorescent film layer 1 can be formed simultaneously. For example, the transparent adhesive layer 3 can be made to flow and the fluorescent film layer 1 can be deformed by high-temperature pressing to form the inclined surface 301 and the side covering portion 101 attached to the inclined surface 301. In some embodiments, the transparent adhesive layer 3 with the inclined surface 301 can be formed first, and then the fluorescent film layer 1 can be disposed on the transparent adhesive layer 3 to form the side covering portion 101 covering the inclined surface 301. In some applications, the side of the transparent adhesive layer 3 can also be a vertical surface perpendicular to the front surface of the driving substrate 2, where the front surface of the driving substrate 2 is where the light-emitting chip 4 is disposed. In this application, when the entire surface of the driving substrate 2 is the light-emitting area 203, such as... Figure 1 , Figure 2 As shown, the side surface of the transparent adhesive layer 3 is only the outer peripheral side surface of the transparent adhesive layer 3. If the light-emitting area 203 is only provided on a portion of the surface of the driving substrate 2, such as Figure 4 As shown, the side surface of the transparent adhesive layer 3 may include the outer peripheral side surface and the inner peripheral side surface of the transparent adhesive layer 3, and the inner peripheral side surface of the transparent adhesive layer 3 corresponds to the edge of the non-light-emitting area 204.

[0054] In one embodiment, such as Figure 7 , Figure 8As shown, the side of the transparent adhesive layer 3 also has a first plane 302, which is connected between the inclined surface 301 and the side surface 201 of the driving substrate. The fluorescent film layer 1 does not cover the first plane 302, and the bottom end of the side covering portion 101 is connected to the first plane 302. The height h of the first plane 302 is less than 1 / 2 of the thickness of the light-emitting chip 4. Because the light-emitting part of the light-emitting chip 4 is approximately in the middle of its thickness direction, the height h of the first plane 302 is less than 1 / 2 of the thickness of the light-emitting chip 4, thereby allowing the fluorescent film layer 1 to cover the light-emitting part of the light-emitting chip 4, which helps to prevent the light from the light-emitting chip 4 from leaking out from the side. The first plane 302 in this application can be formed by cutting. Depending on the cutting method, the first plane 302 can be a vertical plane or an inclined plane. When it is a vertical plane, the first plane 302 and the side surface 201 of the driving substrate can be on the same cutting plane. When it is an inclined plane, the first plane 302 and the side surface 201 of the driving substrate can be on different cutting planes.

[0055] In one embodiment, such as Figure 5 , Figure 6 As shown, the bottom end of the inclined surface 301 contacts the driving substrate 2, and the bottom end of the side cover portion 101 contacts the driving substrate 2 to completely cover the inclined surface 301. The fluorescent film layer 1 completely covers the surface of the transparent adhesive layer 3, which can prevent the light from the light-emitting chip 4 from leaking out from the side.

[0056] In one embodiment, such as Figure 5 As shown, when the bottom end of the inclined surface 301 contacts the driving substrate 2, the fluorescent film layer 1 may also have an extension 102. The extension 102 is connected to the bottom end of the side cover 101 and covers the front surface of the driving substrate 2. The extension 102 simplifies the manufacturing process. During manufacturing, the edge of the fluorescent film layer 1 can be extended to a sufficient length beyond the transparent adhesive layer 3, reducing the precision requirements of the manufacturing process.

[0057] In one embodiment, such as Figure 9 As shown, the fluorescent film layer 1 can also be applied only to the front of the transparent adhesive layer 3, with a light-shielding layer provided on the side of the transparent adhesive layer 3 to prevent blue light leakage from the side, or the blue light leakage from the outer edge of the light source assembly can be blocked by the other components of the vehicle logo light, excluding the light source assembly.

[0058] In one embodiment, such as Figure 6As shown, the distance between the side of the transparent adhesive layer 3 away from the driving substrate 2 and the front surface of the driving substrate 2 is the first distance H1, and the distance between the side of the light-emitting chip away from the driving substrate and the front surface of the driving substrate is the second distance H2. The first distance H1 is greater than the second distance H2. The fact that the first distance H1 is greater than the second distance H2 ensures that the front light-emitting surface of the light-emitting chip 4 is also protected by the transparent adhesive layer 3, and that the front surface of the transparent adhesive layer 3 is a complete, full-surface structure. This also facilitates high-temperature bonding of the transparent adhesive layer 3 and improves the thickness consistency of the light source assembly. In some embodiments, the first distance H1 can be 0.02mm-0.05mm larger than the second distance H2, the height of the light-emitting chip 4 can be 0.08mm-0.12mm, and the thickness of the fluorescent film layer 1 can be 0.05mm-0.15mm. In some application scenarios, the first distance H1, the height of the light-emitting chip 4, and the thickness of the fluorescent film layer 1 can also be set to values ​​within other ranges.

[0059] In one embodiment, such as Figure 3 , Figure 4 As shown, the driving substrate 2 is a flexible substrate. The driving circuit 202 has multiple pads disposed within the light-emitting area 203. The light-emitting chip 4 is electrically connected to the pads via a high thermal conductivity material. A reflective layer 5 is provided on the side of the flexible substrate where the light-emitting chip 4 is located. The flexible substrate can be, but is not limited to, an FPC (Flexible Printed Circuit) circuit board. The thickness of the flexible substrate is sufficiently thin, which allows the light source assembly to have a certain degree of bending adaptability, expanding the applicable scenarios of the car logo light light source assembly, such as curved surface mounting. It also helps to reduce the overall thickness of the light source assembly, meeting the ultra-thin requirements of the car logo light. The reflective layer 5 is provided on the flexible substrate. Through the reflection of light by the reflective layer 5, it helps to improve the luminous brightness of the light source assembly. The reflective layer 5 can be positioned away from the pad area. The material of the reflective layer 5 can be a metal material such as aluminum or silver. The thickness of the flexible substrate can be, but is not limited to, 0.1mm-0.2mm. In this embodiment, the high thermal conductivity material 7 can be, but is not limited to, conductive materials such as tin, gold, or alloy metals.

[0060] In one embodiment, the transparent adhesive layer 3 is a two-component curable adhesive, and a light-diffusing material is disposed within the transparent adhesive layer 3. The two-component curable adhesive can be a silicone rubber-based, silicone resin-based, or other high-reliability resin-based adhesive. The two-component curable adhesive has high adhesive strength, which facilitates the placement of the fluorescent film layer 1 and its placement on the driving substrate 2. The two-component curable adhesive can be a two-component silicone rubber, which has high reliability and helps extend the lifespan of the light source component. In some embodiments, the two-component curable adhesive can be an adhesive material composed of a mixture of adhesive A and adhesive B. Adhesive A may include platinum catalysts, vinyl silicone oil / vinyl MQ resin, or other additives, while adhesive B may include hydrogen-containing silicone oil / hydrogen-containing resin, vinyl silicone oil / resin, inhibitors, tackifiers, modified amine curing agents, or other curing agents. In some embodiments, the transparent adhesive layer 3 can also be other adhesive materials that allow light to pass through. The light-diffusing material disposed within the transparent adhesive layer 3 gives it a certain light-diffusing effect, which can further improve the uniformity of light emission.

[0061] The light source component of the aforementioned car logo light has multiple light-emitting chips 4 on the front side of the driving substrate 2. A transparent adhesive layer 3 covers at least the light-emitting area 203. A fluorescent film layer 1 is bonded to the side of the adhesive layer 3 away from the driving substrate 2 by high-temperature pressing. The thickness of the fluorescent film layer 1 is less than the thickness of the transparent adhesive layer 3, and phosphor is contained within the fluorescent film layer 1. The small overall size of the chips not only helps reduce the thickness of the light source component to meet the ultra-thin requirements of the car logo light but also improves the uniformity of light emission. Furthermore, the additional fluorescent film layer 1, bonded by high-temperature pressing, with phosphor contained within it, helps prevent phosphor deposition during the manufacturing process of the light source component. The uniform distribution of phosphor on the surface of the transparent adhesive layer 3 further improves the uniformity of light emission. Moreover, the fluorescent film layer 1 can be selected through testing before being applied to the transparent adhesive layer 3, which helps improve product yield.

[0062] Please see Figure 10 , Figure 11 This application also provides a method for manufacturing a light source component for a vehicle logo light, including the following steps:

[0063] S01: Provide a driving substrate, the front side of which has a light-emitting area.

[0064] In this embodiment, the driving substrate 2 can be a flexible substrate, such as an FPC circuit board.

[0065] S02: Multiple light-emitting chips are arranged in the light-emitting area of ​​the driving substrate.

[0066] The light-emitting chip 4 in this embodiment is the same as in the above embodiments, and will not be described again here. Figure 3 , Figure 4 , Figure 11As shown, the light-emitting area 203 has multiple pad groups, each pad group having two pads. The light-emitting chip 4 has a positive electrode and a negative electrode. One pad group is electrically connected to the positive and negative electrodes of one light-emitting chip 4, realizing the electrical connection between the driving circuit 202 and the light-emitting chip 4. Specifically, a high thermal conductivity material 7 can be printed on the pads in the light-emitting area 203 using a printing process, and the light-emitting chip 4 can be fixed on the pads by passing it through a reflow oven with a certain high temperature profile.

[0067] S03: Set a liquid transparent adhesive layer, which shall at least cover the light-emitting area.

[0068] In this embodiment, the liquid transparent adhesive layer 3 is an adhesive with certain flow properties. The liquid transparent adhesive layer 3 is formed by mixing adhesive A and adhesive B, adding light-diffusing powder, and stirring until homogeneous. The liquid transparent adhesive layer 3 can be deposited on the driving substrate 2 by coating. In some embodiments, the coating area of ​​the liquid transparent adhesive layer 3 can be significantly larger than the light-emitting area 203; in this case, the transparent adhesive layer 3 is in a liquid state with a certain viscosity and is not yet cured.

[0069] S04: A fluorescent film layer is set on a liquid transparent adhesive layer.

[0070] The frontal projection area of ​​the fluorescent film layer 1 on the driving substrate 2 is larger than that of the liquid transparent adhesive layer on the driving substrate 2, which facilitates subsequent high-temperature pressing molding. In this embodiment, to facilitate bonding, the fluorescent film layer 1 can be bonded from the middle of the light-emitting area 203 outwards. The fluorescent film layer 1 can be prefabricated, and phosphor is placed in the fluorescent film layer 1. The phosphor can be evenly distributed above the light-emitting area, which helps to avoid the phosphor precipitation phenomenon that occurs when the phosphor is placed in a thicker transparent adhesive layer 3, and improves the uniformity of light emission. The fluorescent film layer 1 is mainly used to provide the fluorescent adhesive, and its thickness can be made thin enough, which helps to reduce the overall thickness of the light source component. The fluorescent film layer 1 in this application can be prefabricated, and after being tested and screened, it can be used to manufacture the light source component, which helps to improve the product yield and the consistency of light emission between different batches of products.

[0071] S05: The fluorescent film layer is bonded to the liquid transparent adhesive layer by high-temperature vacuum pressing, and the liquid transparent adhesive layer is thinned to the target thickness and then cured.

[0072] This application employs a high-temperature vacuum pressing method to bond the driving substrate 2, transparent adhesive layer 3, and fluorescent film layer 1 together. This results in high structural integration, and the surface of the fluorescent adhesive layer after high-temperature vacuum pressing is smooth, forming a flat light-emitting surface that improves light emission performance. The fluorescent film layer 1 can be a semi-solid fluorescent film layer 1 formed by high-temperature pressing and curing, or it can be formed by softening and deforming a solid fluorescent film layer 1 in a high-temperature environment before curing. During the high-temperature pressing process, the liquid transparent adhesive layer is squeezed, making it thinner, and excess adhesive material overflows to the outer periphery.

[0073] In one embodiment, bonding the fluorescent film layer to the transparent adhesive layer by high-temperature vacuum pressing, and thinning the transparent adhesive layer to the target thickness and then curing it may include:

[0074] The fluorescent film layer is squeezed, causing the edge portion of the fluorescent adhesive film to bend and deform, and the transparent adhesive layer to become thinner, until the edge portion of the fluorescent adhesive film surrounds the edge of the transparent adhesive layer that has been thinned to the target thickness. The liquid transparent adhesive layer solidifies, forming a fluorescent film layer that extends from the front side of the transparent adhesive layer to the side side of the transparent adhesive layer, covering the side side of the transparent adhesive layer. The front side of the transparent adhesive layer corresponds to the front light-emitting surface of the light-emitting chip, and the side side of the transparent adhesive layer corresponds to the side light-emitting surface of the light-emitting chip.

[0075] Under vacuum and pressure, the liquid transparent adhesive layer 3 will flow to a certain extent, and at the same time, the edge of the fluorescent film layer 1 will bend and deform to surround the edge of the transparent adhesive layer 3. By controlling the process parameters, the fluorescent film layer 1 and the transparent adhesive layer 3 can be pressed into the target shape. After pressing, the transparent adhesive layer 3 achieves preliminary cross-linking and hardening. Afterwards, the pressed workpiece can be baked for a long time to completely cure the transparent adhesive layer 3. The curing conditions in this embodiment can be set as needed, for example, the curing conditions can be 150℃ / 3hr.

[0076] In one embodiment, such as Figure 11 As shown, squeezing the fluorescent film layer to cause the edge portion of the fluorescent adhesive film to bend and deform, and to thin the transparent adhesive layer includes:

[0077] By squeezing the fluorescent film layer 1 towards the driving substrate 2 with the airbag 8, the transparent adhesive layer becomes thinner. In the area where the transparent adhesive layer 3 is not provided (the non-light-emitting area), there is no support, and the airbag 8 will collapse towards the driving substrate 2, causing the edge of the fluorescent film layer 1 to bend and deform.

[0078] The airbag 8 has a certain deformation capability. When the airbag 8 squeezes the fluorescent film layer 1 towards the driving substrate 2, the height of the transparent adhesive layer 3 will decrease to a certain extent. Under the action of vacuum and pressure, some adhesive material is squeezed outward. This squeezed part is squeezed towards the driving substrate 2 by the collapsed part of the airbag 8, making the edge of the transparent adhesive layer 3 gradually thinner. At the same time, the edge of the fluorescent film layer 1 bends and deforms to surround the thinned edge of the transparent adhesive layer 3, forming a side cover 101. In the fluorescent film layer 1 and transparent adhesive layer 3 formed by the squeezing of the airbag 8, the side of the transparent adhesive layer 3 has an inclined surface 301. The inclined surface 301 can be composed of a combination of a flat surface and an arc surface. The side cover 101 of the fluorescent film layer 1 covers the inclined surface 301, and the shape of the side cover 101 matches the side of the transparent adhesive layer 3. The fabrication of the side cover 101 of the fluorescent film layer 1 and the inclined surface 301 of the transparent adhesive layer 3 is simple. This embodiment does not limit the specific settings of the high-temperature vacuum pressing, and can be set as needed, such as the pressing temperature being 125℃ and the pressure being 0.2MPa.

[0079] The transparent adhesive layer 3 has an inclined surface 301 on its side, which can improve the side-emitting angle of the light source component, making the side-emitting light closer to the front-emitting light, thus improving the light emission effect. In some embodiments, the inclined surface 301 can be composed of a combination of a flat surface and an arc-shaped surface. For example, the connection point on the front of the transparent adhesive layer 3 can be an arc-shaped surface, with the bottom end of the arc-shaped surface connecting to the flat surface, forming a transition through the arc-shaped surface, which is beneficial for improving the light emission effect. In some embodiments, when the inclined surface 301 is an arc-shaped surface, it can be an outwardly convex arc-shaped surface, which is easier to manufacture. In some embodiments, when the inclined surface 301 is an arc-shaped surface, it can also be an inwardly concave arc-shaped surface. During the manufacturing process, the inclined surface 301 of the transparent adhesive layer 3 and the side covering portion 101 of the fluorescent film layer 1 can be formed simultaneously. For example, the transparent adhesive layer 3 can be made to flow and the fluorescent film layer 1 can be deformed by high-temperature pressing to form the inclined surface 301 and the side covering portion 101 attached to the inclined surface 301. In some embodiments, a transparent adhesive layer 3 with an inclined surface 301 may be formed first, and then a fluorescent film layer 1 may be formed on the transparent adhesive layer 3 to form a side cover portion 101 covering the inclined surface 301. In this application, when the entire surface of the driving substrate 2 is a light-emitting area 203, such as Figure 1 , Figure 2 As shown, the side surface of the transparent adhesive layer 3 is only the outer peripheral side surface of the transparent adhesive layer 3. If the light-emitting area 203 is only provided on a portion of the surface of the driving substrate 2, such as Figure 4 As shown, the side surface of the transparent adhesive layer 3 may include the outer peripheral side surface and the inner peripheral side surface of the transparent adhesive layer 3, and the inner peripheral side surface of the transparent adhesive layer 3 corresponds to the edge of the non-light-emitting area 204.

[0080] In one embodiment, such as Figure 5 , Figure 6As shown, the bottom end of the inclined surface 301 contacts the driving substrate 2, and the bottom end of the side cover portion 101 contacts the driving substrate 2 to completely cover the inclined surface 301. The fluorescent film layer 1 completely covers the surface of the transparent adhesive layer 3, which can prevent the light from the light-emitting chip 4 from leaking out from the side.

[0081] In one embodiment, such as Figure 5 As shown, when the bottom end of the inclined surface 301 contacts the driving substrate 2, the fluorescent film layer 1 may also have an extension 102. The extension 102 is connected to the bottom end of the side cover 101 and covers the front surface of the driving substrate 2. The extension 102 simplifies the manufacturing process. During manufacturing, the edge of the fluorescent film layer 1 can be extended to a sufficient length beyond the transparent adhesive layer 3, reducing the precision requirements of the manufacturing process.

[0082] In one embodiment, during the high-temperature pressing process, the fluorescent film layer 1 can be extruded using a metal mold. The forming surface of the metal mold can be planar. In this embodiment, for example... Figure 9 As shown, the fluorescent film layer 1 thus formed can only cover the front side of the transparent adhesive layer 3. A light-shielding layer can then be provided on the side portion of the transparent adhesive layer 3 to prevent blue light leakage from the sides. Alternatively, the blue light leakage from the outer edge of the light source assembly can be blocked by other components of the vehicle logo light besides the light source assembly. In some embodiments, the outer edge of the forming surface of the metal mold can also have a curved arc surface to form the fluorescent film layer 1 with side coverings.

[0083] In one embodiment, after high-temperature pressing, the fluorescent film layer 1 can contact the driving substrate 2 and partially cover the front surface of the driving substrate 2. It can be cut to form a light source assembly of a target shape, for example, by die stamping or laser cutting. In some embodiments, such as... Figure 7 , Figure 8 As shown, a first plane 302 can be formed in the side of the transparent adhesive layer 3 by cutting. The first plane 302 is connected between the inclined surface 301 and the side surface 201 of the driving substrate. The fluorescent film layer 1 does not cover the first plane 302, and the bottom end of the side covering portion 101 is connected to the first plane 302. The height h of the first plane 302 is less than 1 / 2 of the thickness of the light-emitting chip 4. Because the light-emitting part of the light-emitting chip 4 is approximately in the middle of its thickness direction, the height h of the first plane 302 is less than 1 / 2 of the thickness of the light-emitting chip 4, thereby allowing the fluorescent film layer 1 to cover the light-emitting part of the light-emitting chip 4, which helps to prevent the light from the light-emitting chip 4 from leaking out from the side.

[0084] Depending on the cutting method, the first plane 302 can be a vertical plane or an inclined plane. When it is a vertical plane, the first plane 302 and the side surface 201 of the driving substrate can be on the same cutting plane; when it is an inclined plane, the first plane 302 and the side surface 201 of the driving substrate can be on different cutting planes. In some embodiments, the cutting line is controlled, such as... Figure 5 , Figure 6 As shown, the bottom end of the inclined surface 301 can also contact the driving substrate 2. In this case, the side of the transparent adhesive layer 3 does not have the first plane 302. The structure in which the bottom end of the inclined surface 301 contacts the driving substrate 2 is the same as in the above embodiment, and will not be described again here. In some embodiments, the cutting line is controlled, such as... Figure 9 As shown, the side of the transparent adhesive layer 3 after cutting can be perpendicular to the front of the driving substrate 2. This embodiment does not limit the structure after cutting.

[0085] After step S05, the connector 6 can be attached to the back of the driving substrate 2 using surface mount technology with medium-temperature solder paste, and the connector 6 is used to realize the electrical connection between the light source component and the outside.

[0086] The method for manufacturing the light source component of the car logo light provided in this embodiment includes multiple light-emitting chips 4 on the front side of the driving substrate 2. A transparent adhesive layer 3 covers at least the light-emitting area 203. A fluorescent film layer 1 is bonded to the side of the encapsulating adhesive layer 3 away from the driving substrate 2 by high-temperature pressing. The thickness of the fluorescent film layer 1 is less than the thickness of the transparent adhesive layer 3, and phosphor is contained within the fluorescent film layer 1. The small overall size of the chips not only helps to reduce the thickness of the light source component to meet the ultra-thin requirements of the car logo light, but also helps to improve the uniformity of light emission. Furthermore, the additional fluorescent film layer 1, which is bonded by high-temperature pressing and contains phosphor, helps to avoid phosphor deposition during the manufacturing process of the light source component. The uniform distribution of phosphor on the surface of the transparent adhesive layer 3 further improves the uniformity of light emission. Moreover, the fluorescent film layer 1 can be selected through testing before being applied to the transparent adhesive layer 3, which helps to improve the product yield.

[0087] This application embodiment also provides a vehicle logo light, including: a housing, and a light source assembly of the vehicle logo light as described above, the light source assembly being assembled inside the housing, the housing including a light-transmitting cover for allowing light emitted by the light source assembly to be emitted.

[0088] The specific structure of the light source component in this embodiment can be the same as that in the above embodiments, and the light source component can also be manufactured using the above method, which will not be described in detail here. The car logo light in this embodiment can be a car logo light, which can be lit by the light emitted by the light source component. The outer shell in this application can be made of metal or plastic, and the outer shell can have a bottom shell, with a light-transmitting cover connected to the bottom shell to form a receiving space, in which the light source component is located. The car logo light in this application can also have other functional components, which can be set as needed, and will not be described in detail here.

[0089] The aforementioned car logo light has multiple light-emitting chips 4 on the driving substrate 2. A transparent adhesive layer 3 covers at least the light-emitting area 203. A fluorescent film layer 1 covers the encapsulating adhesive layer, extending from the front side of the transparent adhesive layer 3 to its side side, covering the side side of the transparent adhesive layer 3. The small overall size of the chips not only helps reduce the thickness of the light source component to meet the ultra-thin requirements of the car logo light, but also helps improve the uniformity of light emission. Furthermore, the fluorescent film layer 1 not only enables surface light emission from the light source component, but also helps prevent light emitted by the light-emitting chips 4 from leaking out from the sides, further improving the uniformity of light emission. The fluorescent film layer 1 covers the transparent adhesive layer 3, ensuring uniform distribution of phosphor on the surface of the transparent adhesive layer 3. Moreover, the fluorescent film layer 1 can be selected through testing before being applied to the transparent adhesive layer 3, which helps improve product yield.

[0090] The above examples illustrate this application only to aid understanding and are not intended to limit its scope. Those skilled in the art to which this application pertains can make various simple deductions, modifications, or substitutions based on the ideas presented.

Claims

1. A light source assembly for a vehicle logo light, characterized in that, include: A driving substrate, the driving substrate including a driving circuit, and a light-emitting area is provided on the front side of the driving substrate; Multiple light-emitting chips are disposed on the driving substrate and located in the light-emitting area, and are electrically connected to the driving circuit; A transparent adhesive layer, at least covering the light-emitting area; A fluorescent film layer is bonded to the side of the transparent adhesive layer away from the driving substrate by high-temperature pressing. The thickness of the fluorescent film layer is less than the thickness of the transparent adhesive layer. The fluorescent film layer contains phosphor. The thickness of the transparent adhesive layer is the distance between the side of the transparent adhesive layer away from the driving substrate and the front side of the driving substrate.

2. The light source assembly of the vehicle logo light as described in claim 1, characterized in that, The transparent adhesive layer has a front side and a side side. The front side of the transparent adhesive layer corresponds to the front light-emitting surface of the light-emitting chip, and the side side of the transparent adhesive layer corresponds to the side light-emitting surface of the light-emitting chip. The fluorescent film layer extends from the front side of the transparent adhesive layer to the side side of the transparent adhesive layer, covering the side side of the transparent adhesive layer. The front light-emitting surface of the light-emitting chip is the side away from the driving substrate.

3. The light source assembly of the vehicle logo light as described in claim 2, characterized in that, The transparent adhesive layer has an inclined surface on its side, which is an inclined plane or an inclined arc surface, or an inclined surface composed of a plane and an arc surface; in cross-section, the inclined surface has a top end away from the driving substrate and a bottom end close to the driving substrate, the bottom end of the inclined surface being away from the light-emitting chip relative to the top end of the inclined surface, and the cross-section being perpendicular to the front side of the driving substrate; the fluorescent film layer has a side covering portion that covers the side of the transparent adhesive layer, and the shape of the side covering portion matches the side of the transparent adhesive layer.

4. The light source assembly of the vehicle logo light as described in claim 3, characterized in that, The side of the transparent adhesive layer also has a first plane, which is connected between the inclined surface and the side of the driving substrate. The fluorescent film layer does not cover the first plane, and the bottom end of the side covering portion is connected to the first plane. The height of the first plane is less than 1 / 2 of the thickness of the light-emitting chip.

5. The light source assembly of the vehicle logo light as described in claim 3, characterized in that, The bottom end of the inclined surface contacts the driving substrate, and the bottom end of the side cover contacts the driving substrate to completely cover the inclined surface.

6. The light source assembly of the vehicle logo light as described in claim 5, characterized in that, The fluorescent film layer also has an extension portion connected to the bottom end of the side cover portion, and the extension portion covers the front side of the driving substrate.

7. The light source assembly of the vehicle logo light as described in any one of claims 1-6, characterized in that, The distance between the side of the transparent adhesive layer away from the driving substrate and the front surface of the driving substrate is a first distance, and the distance between the side of the light-emitting chip away from the driving substrate and the front surface of the driving substrate is a second distance, wherein the first distance is greater than the second distance.

8. The light source assembly of the vehicle logo light as described in any one of claims 1-6, characterized in that, The driving substrate is a flexible substrate, the driving circuit has multiple pads disposed in the light-emitting area, the light-emitting chip is electrically connected to the pads through a highly thermally conductive material, and the flexible substrate has a reflective layer on the side where the light-emitting chip is disposed.

9. A method for manufacturing a light source component for a vehicle logo light, characterized in that, include: A driving substrate is provided, wherein a light-emitting area is provided on the front side of the driving substrate; Multiple light-emitting chips are disposed in the light-emitting area of ​​the driving substrate; A liquid transparent adhesive layer is provided, which at least covers the light-emitting area; A fluorescent film layer is disposed on a liquid transparent adhesive layer, and the projected area of ​​the fluorescent film layer on the front side of the driving substrate is larger than the projected area of ​​the liquid transparent adhesive layer on the front side of the driving substrate. The fluorescent film layer is bonded to the liquid transparent adhesive layer by high-temperature vacuum pressing, and the liquid transparent adhesive layer is thinned to the target thickness and then cured.

10. The method for manufacturing the light source assembly of the vehicle logo light as described in claim 9, characterized in that, The process of bonding the fluorescent film layer to the transparent adhesive layer via high-temperature vacuum pressing, and thinning the transparent adhesive layer to the target thickness and then curing it includes: The fluorescent film layer is squeezed, causing the edge portion of the fluorescent adhesive film to bend and deform, and the transparent adhesive layer to become thinner, until the edge portion of the fluorescent adhesive film surrounds the edge of the transparent adhesive layer that has been thinned to the target thickness. The liquid transparent adhesive layer solidifies, forming the fluorescent film layer that extends from the front side of the transparent adhesive layer to the side side of the transparent adhesive layer and covers the side side of the transparent adhesive layer. The front side of the transparent adhesive layer is the side corresponding to the front light-emitting surface of the light-emitting chip, and the side side of the transparent adhesive layer is the side light-emitting surface corresponding to the side light-emitting surface of the light-emitting chip.

11. The method for manufacturing the light source assembly of the vehicle logo light as described in claim 10, characterized in that, The step of squeezing the fluorescent film layer, causing the edge portion of the fluorescent adhesive film to bend and deform, and thinning the transparent adhesive layer includes: The fluorescent film layer is compressed towards the driving substrate by an airbag, making the transparent adhesive layer thinner. In areas where no transparent adhesive layer is provided, the airbag collapses towards the driving substrate, causing the edge portion of the fluorescent film layer to bend and deform.

12. A vehicle emblem light, characterized in that, include: The housing, and the light source assembly of the vehicle logo light as described in any one of claims 1-8, wherein the light source assembly is assembled within the housing, and the housing includes a light-transmitting cover for emitting light emitted by the light source assembly.

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