Display panel, preparation method thereof and display device

Abstract

The invention relates to a display panel, a preparation method thereof and a display device. The display panel is provided with a display area and a binding area located on at least one side of the display area. The display panel comprises a plurality of binding pads distributed in the binding area at intervals and protection parts arranged on the peripheral sides of the binding pads respectively. The display panel further comprises a pixel definition layer located in the display area. Wherein the protection part and the pixel definition layer are arranged on the same layer. The method is used for improving the binding reliability of the display panel.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a display panel, a method for manufacturing the same, and a display device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are widely used in various display devices due to their characteristics such as active light emission, high contrast, ultra-thinness, low-temperature resistance, fast response speed, low power consumption, wide viewing angle, and strong shock resistance. However, in the display panel of an OLED display device, the display panel is bonded to the driver chip through a bonding area. The reliability of the bonding between the display panel and the driver chip can significantly affect the display effect of the display panel and the display device. Summary of the Invention

[0003] Therefore, it is necessary to address the aforementioned technical problems by providing a display panel, its manufacturing method, and a display device, so as to effectively improve the bonding reliability of the display panel while increasing the resolution of the displayed image, thereby improving the display effect of the display panel and the display device.

[0004] In a first aspect, this application provides a display panel. The display panel has a display area and a bonding area located on at least one side of the display area. The display panel includes: a plurality of bonding pads spaced apart in the bonding area, and protective portions respectively disposed around each bonding pad.

[0005] According to some embodiments, the protective portion is a closed ring structure surrounding the periphery of the bonding pad. The inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad.

[0006] According to some embodiments, the protective part includes a first layer structure and a second layer structure; wherein the second layer structure is located on the side of the first layer structure away from the substrate, and the orthogonal projection of the first layer structure on the substrate is located within the orthogonal projection of the second layer structure on the substrate.

[0007] According to some embodiments, the first layer structure and the second layer structure are arranged concentrically.

[0008] According to some embodiments, the outer walls of the first layer structure and the outer walls of the second layer structure are flush in the direction perpendicular to the substrate.

[0009] According to some embodiments, the height of the first layer structure along the direction perpendicular to the substrate is the same as the height of the bonding pads along the direction perpendicular to the substrate.

[0010] According to some embodiments, the second layer structure covers the portion of the top surface of the bonding pads that is away from the substrate.

[0011] According to some embodiments, the protective portion is disposed in a discontinuous ring around the periphery of the bonding pad.

[0012] According to some embodiments, the display panel further includes a pixel definition layer located in the display area; wherein the protective portion is disposed on the same layer as the pixel definition layer.

[0013] According to some embodiments, the height of the protective portion along the vertical substrate direction is the same as the height of the pixel definition layer along the vertical substrate direction.

[0014] According to some embodiments, a first isolation groove is provided between adjacent protective parts.

[0015] According to some embodiments, a second isolation groove is provided between the protective portion and the pixel definition layer.

[0016] According to some embodiments, the protective portion is made of the same material as the pixel definition layer.

[0017] According to some embodiments, the material of the protective part includes inorganic light-transmitting materials.

[0018] According to some embodiments, the material of the protective part includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

[0019] According to some embodiments, the pixel definition layer has multiple pixel openings. The display panel also includes an isolation structure. The isolation structure encloses multiple isolation openings, which communicate with the pixel openings.

[0020] According to some embodiments, the isolation structure is located on the side of the pixel definition layer away from the substrate.

[0021] According to some embodiments, the isolation structure includes a first isolation portion and a second isolation portion; wherein the second isolation portion is located on the side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate.

[0022] According to some embodiments, the material of the first isolation portion includes at least one of aluminum, copper, or silver.

[0023] According to some embodiments, the material of the second isolation portion includes at least one of titanium or molybdenum.

[0024] According to some embodiments, the isolation structure further includes a third isolation portion. The third isolation portion is located on the side of the first isolation portion facing the substrate, and the orthographic projection of the first isolation portion on the substrate lies within the orthographic projection of the third isolation portion on the substrate.

[0025] According to some embodiments, the material of the third isolation section includes at least one of titanium or molybdenum.

[0026] According to some embodiments, the materials for bonding pads include one or more of silver, copper, aluminum, titanium, molybdenum, and their alloys.

[0027] According to some embodiments, the bonding pads include a stacked structure of titanium-aluminum-titanium or molybdenum-aluminum-titanium.

[0028] Secondly, this application also provides a method for manufacturing a display panel, used to manufacture the display panel in some of the above embodiments. The display panel has a display area and a bonding area located on at least one side of the display area. The method for manufacturing the display panel includes the following steps.

[0029] Multiple bonding pads are formed at intervals on the substrate located in the bonding region.

[0030] A protective portion is formed on the periphery of each of the aforementioned bonding pads.

[0031] According to some embodiments, forming protective portions on the periphery of each of the bonding pads may include the following steps.

[0032] A protective material layer is formed to cover each bonded pad.

[0033] A patterned protective material layer is formed to create various protective portions; wherein the protective portions are arranged in a closed ring structure around the periphery of the corresponding bonding pads, and the inner area of ​​the protective portion exposes at least a portion of the top surface of the corresponding bonding pads; or, the protective portions are arranged in a discontinuous ring around the periphery of the corresponding bonding pads.

[0034] According to some embodiments, forming protective portions on the periphery of each of the bonding pads may include the following steps.

[0035] A pixel definition material layer is formed; wherein, the pixel definition material layer located in the bonding area covers each bonding pad.

[0036] A patterned pixel definition material layer is formed in the display area of ​​the substrate, and each of the aforementioned protective portions is formed in the bonding area of ​​the substrate; wherein, the protective portion is arranged in a closed ring structure around the periphery of the corresponding bonding pad, and the inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; or, the protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad.

[0037] According to some embodiments, the pixel-defining material layer is patterned using a dry etching process.

[0038] According to some embodiments, a first isolation groove is formed between adjacent protective parts.

[0039] According to some embodiments, a second isolation groove is provided between the protective portion and the pixel definition layer.

[0040] According to some embodiments, the material of the pixel-defined material layer includes inorganic light-transmitting materials.

[0041] According to some embodiments, the material of the pixel defining material layer includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

[0042] Thirdly, this application also provides a display device, including: a display panel as described in any of the preceding embodiments, and a driver chip bonded to and connected to the display panel.

[0043] The aforementioned display panel, its manufacturing method, and display device have at least one of the following advantages:

[0044] In this embodiment, an independent protective part is provided around each bonding pad located in the bonding area of ​​the display panel. The protective part can protect and isolate the bonding pad, effectively avoiding stress concentration or even film cracking and peeling in the bonding area due to the shrinkage or expansion of the display panel, the accumulation or overflow of anisotropic conductive film (ACF), IC pad (including dummy pad) design, etc., during the bonding process of the corresponding bonding pad. This helps to improve the bonding reliability of the display panel while improving the display image resolution, thereby improving the display effect of the display panel and display device. Attached Figure Description

[0045] The accompanying drawings, which form part of this application, are used to provide a further understanding of this application. The illustrative embodiments of this application and their descriptions are used to explain the invention and do not constitute an undue limitation of this application.

[0046] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0047] Figure 1 This is a top view schematic diagram of a display panel in some embodiments;

[0048] Figure 2 This is a top view of a binding area in a display panel in some embodiments;

[0049] Figure 3 This is a partially enlarged schematic diagram of a bonding area in a display panel according to some embodiments;

[0050] Figure 4 for Figure 3 The diagram shows a cross-sectional view of a bonding area along the MM direction in the display panel.

[0051] Figure 5 This is a partially enlarged schematic diagram of the binding area in another display panel in some embodiments;

[0052] Figure 6 This is a cross-sectional schematic diagram of a display panel in some embodiments;

[0053] Figure 7 This is a cross-sectional schematic diagram of another display panel in some embodiments;

[0054] Figure 8 This is a cross-sectional schematic diagram of another display panel in some embodiments;

[0055] Figure 9 This is a flowchart illustrating a method for manufacturing a display panel in some embodiments;

[0056] Figure 10 This is a flowchart illustrating another method for manufacturing a display panel in some embodiments;

[0057] Figure 11 This is a flowchart illustrating another method for manufacturing a display panel in some embodiments.

[0058] Explanation of reference numerals in the attached figures:

[0059] 1-Display panel, AA-Display area, COP-Binding area, 10-Substrate, 2-Binding pad, 3-Protective part, 31-First layer structure, 32-Second layer structure, 30-Sub-part, G1-First isolation trench, G2-Second isolation trench, PDL-Pixel definition layer, 4-Isolation structure, 41-First isolation part, 42-Second isolation part, 43-Third isolation part, 5-Light emission device, 51-Anode, 52-First functional layer, 53-Light emission layer, 54-Second functional layer, 55-Cathode. Detailed Implementation

[0060] The following specific examples illustrate the implementation of the present invention. Those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific embodiments, and various details in this specification can also be modified or changed based on different viewpoints and applications without departing from the spirit of the present invention. It should be noted that, unless otherwise specified, the following embodiments and features described therein can be combined with each other.

[0061] Some exemplary embodiments of the invention have been described for illustrative purposes. It should be understood that the invention may be implemented in other ways not specifically shown in the accompanying drawings.

[0062] Please see Figure 1 and Figure 2This application provides a display panel 1. The display panel 1 has a display area AA and a bonding area COP located on at least one side of the display area AA. The display panel 1 includes: a plurality of bonding pads 2 spaced apart in the bonding area COP, and protective portions 3 respectively disposed on the periphery of each bonding pad 2.

[0063] In this embodiment, an independent protective part 3 is provided around each bonding pad 2 located in the bonding area COP of the display panel 1. The protective part 3 can protect and isolate the bonding pad 2. During the bonding process of the corresponding bonding pad 2, it can effectively avoid stress concentration or even film cracking and peeling damage in the bonding area COP due to the shrinkage or expansion of the display panel 1, the accumulation or overflow of anisotropic conductive film (ACF), IC pad (including dummy pad) design, etc. This helps to improve the bonding reliability of the display panel while improving the resolution of the displayed image, and thus improves the display effect of the display panel and the display device.

[0064] In some embodiments of this application, please refer to Figure 3 and Figure 4 It is understood that the protection part 3 is a closed ring structure surrounding the corresponding bonding pad 2. The area inside the ring of the protection part 3 exposes at least part of the top surface of the corresponding bonding pad 2. In this way, the protection part 3 can enclose the bonding pad 2 to the greatest extent without affecting the electrical bonding effect of the bonding pad 2, so as to protect and effectively isolate the bonding pad 2.

[0065] For example, the orthographic projection shape of the protective part 3 on the substrate 10 matches the orthographic projection shape of the bonding pad 2 on the substrate 10, such as a rectangular ring, a circular ring, an elliptical ring, or other arbitrary shape.

[0066] Please refer to some embodiments of this application. Figure 4 The protective part 3 includes a first layer structure 31 and a second layer structure 32; wherein the second layer structure 32 is located on the side of the first layer structure 31 away from the substrate 10, and the orthogonal projection of the first layer structure 31 on the substrate 10 is located within the orthogonal projection of the second layer structure 32 on the substrate 10.

[0067] For example, the first layer structure 31 and the second layer structure 32 can be an integral structure.

[0068] In some embodiments of this application, please refer to Figure 3 and Figure 4 It is understood that the first layer structure 31 and the second layer structure 32 are set concentrically.

[0069] Here, the first layer structure 31 and the second layer structure 32 are set concentrically, which means that the geometric centers of their orthographic projection contours on the substrate can coincide or approximately coincide.

[0070] Please refer to some embodiments of this application. Figure 4 The outer walls of the first layer structure 31 and the second layer structure 32 are flush in the direction perpendicular to the substrate 10 (e.g., the Z direction). This allows for etching after the formation of the corresponding material layers of the first layer structure 31 and the second layer structure 32 using the same patterning process, thus simplifying the fabrication process of the protective part 3.

[0071] Please refer to some embodiments of this application. Figure 4 The height of the first layer structure 31 along the direction perpendicular to the substrate 10 (e.g., the Z direction) is the same as the height of the bonding pad 2 along the direction perpendicular to the substrate 10 (e.g., the Z direction).

[0072] Please refer to some embodiments of this application. Figure 4 The second layer 32 also covers the top surface of the bonding pad 2 away from the substrate 10.

[0073] Here, the proportion of the area of ​​the second layer structure 32 covering the top surface of the bonding pad 2 to the total area of ​​the top surface of the bonding pad 2 should not be too large; the specific value can be selected and set according to the requirements. This application embodiment does not limit this.

[0074] Please refer to [link / reference needed] for further information. Figure 5 In other embodiments of this disclosure, the protective portion 3 may also be disposed in a discontinuous ring around the periphery of the corresponding bonding pad 2. That is, the protective portion 3 may also adopt a segmented structure, for example, the protective portion 3 may be composed of a plurality of sub-parts 30 spaced apart along the circumferential direction. The embodiments of this disclosure do not specifically limit the segmented structure of the protective portion 3, and the segmented structure of the protective portion 3 may be set to match the morphology of the bonding pad 2.

[0075] In this embodiment, the protection part 3 adopts a discontinuous structure, which can further avoid stress concentration or even film cracking and peeling in the bonding area COP due to the shrinkage or expansion of the display panel 1, the accumulation or overflow of anisotropic conductive film (ACF), IC Pad (including dummy Pad) design, etc. during the bonding process of the corresponding bonding pad 2, thereby further improving the display image resolution and the bonding reliability of the display panel.

[0076] Please refer to some embodiments of this application. Figures 6-8The display panel 1 also includes a pixel definition layer (PDL) located in the display area AA; wherein the protective part 3 is disposed in the same layer as the pixel definition layer (PDL). Here, "disposed in the same layer" means that it can be formed in the same manufacturing process. This effectively simplifies the manufacturing process of the display panel 1, effectively improves production efficiency and yield, and also helps to reduce production costs.

[0077] Please refer to some embodiments of this application. Figure 6 The height of the protective portion 3 along the direction perpendicular to the substrate 10 (e.g., the Z direction) is the same as the height of the pixel definition layer PDL along the direction perpendicular to the substrate 10 (e.g., the Z direction); that is, the surface of the protective portion 3 away from the substrate 10 and the surface of the pixel definition layer PDL away from the substrate 10 can be located on the same plane.

[0078] In some embodiments of this application, please refer to Figure 3 , Figure 4 and Figure 6 It is understood that adjacent protective portions 3 have a first isolation groove G1 between them. In this way, it is advantageous to obtain each protective portion 3 by forming the same protective portion material layer and then patterning and etching to form the first isolation groove G1, so as to effectively simplify the fabrication process of the protective portion 3.

[0079] Optionally, the multiple first isolation slots G1 are distributed at equal intervals; that is, the distance between any two adjacent first isolation slots G1 can be a fixed value.

[0080] Please refer to some embodiments of this application. Figure 6 There is no isolation groove between the protective part 3 and the pixel definition layer PDL; that is, the pixel definition layer PDL and the protective part 3 can not only be patterned using the same material layer (pixel definition material layer), but the pixel definition layer PDL can also be disposed adjacent to the adjacent protective part 3, or the edge portion of the pixel definition layer PDL can also be used as the edge portion of the adjacent protective part 3.

[0081] In some embodiments of this application, please refer to Figure 7 and Figure 8 It is understood that the protection section 3 has a second isolation slot G2 between it and the pixel definition layer PDL.

[0082] For example, the material of the protection section 3 is the same as that of the pixel definition layer PDL.

[0083] For example, the material of the protective part 3 includes inorganic light-transmitting materials.

[0084] For example, the material of the protective part 3 includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

[0085] In this embodiment, it is advantageous to obtain the pixel definition layer PDL and each protective part 3 by forming a pixel definition material layer and then patterning and etching to form the second isolation trench G2 and the first isolation trench G1, so as to effectively simplify the manufacturing process of the display panel 1.

[0086] In some embodiments of this application, the material of the bonding pad 2 includes one or more of silver, copper, aluminum, titanium, molybdenum and their alloys.

[0087] For example, the bonding pad 2 includes a stacked structure of titanium aluminum titanium or molybdenum aluminum titanium.

[0088] Please refer to some embodiments of this application. Figures 6-8 The pixel definition layer (PDL) has multiple pixel openings. The display panel also includes an isolation structure 4. The isolation structure 4 encloses and forms multiple isolation openings, which are connected to the pixel openings.

[0089] For example, the isolation structure 4 is located on the side of the pixel definition layer PDL away from the substrate 10.

[0090] For example, please continue reading Figures 6-8 The display panel 1 further includes light-emitting devices 5 located within the openings of each pixel. The light-emitting device 5 includes, for example, a stacked first electrode 51, a first functional layer 52, a light-emitting layer 53, a second functional layer 54, and a second electrode 55; wherein the first functional layer 52 includes, for example, a hole injection layer, a hole transport layer, and an electron blocking layer; and the second functional layer 54 includes, for example, an electron injection layer, an electron transport layer, and a hole blocking layer. The first electrode 51 is, for example, an anode. The second electrode 55 is, for example, a cathode.

[0091] Here, it can be understood that the main function of the isolation structure 4 is to isolate the light-emitting material in the light-emitting device 5, thereby omitting the evaporation process of the fine metal mask (FMM). The composition and preparation of the isolation structure 4 mentioned here and below are further described in patents PCT / CN2023 / 134518, 202310759370.2, 202310740412.8, 202310707209.0, and 202311346196.5, which can be referenced. This disclosure does not limit the specific structure of the isolation structure 4. For example, the isolation structure 4 can be integral or layered; for example, the isolation structure 4 can be an inverted trapezoid, an I-shape, or other shapes, with an overall shape that is wider at the top and narrower at the bottom, limited to achieving the isolation effect.

[0092] Figure 6 and Figure 7 The isolation structure 4 is illustrated using an example, which includes a first isolation section 41 and a second isolation section 42 covering the first isolation section 41.

[0093] For example, please refer to Figure 6 and Figure 7 The isolation structure 4 includes a first isolation portion 41 and a second isolation portion 42; wherein the second isolation portion 42 is located on the side of the first isolation portion 41 away from the substrate 10, and the orthogonal projection of the first isolation portion 41 on the substrate 10 is located within the orthogonal projection of the second isolation portion 42 on the substrate 10.

[0094] For example, the material of the first isolation section 41 includes at least one of aluminum, copper, or silver.

[0095] For example, the material of the second isolation section 42 includes at least one of titanium or molybdenum.

[0096] But it's not limited to this, for example Figure 8 As shown, in some examples, the isolation structure 4 further includes a third isolation portion 43. The third isolation portion 43 is located on the side of the first isolation portion 41 facing the substrate 1, and the orthographic projection of the first isolation portion 41 on the substrate 1 is located within the orthographic projection of the third isolation portion 43 on the substrate 1.

[0097] For example, the material of the third isolation section 43 includes at least one of titanium or molybdenum.

[0098] In addition, for example, please continue to refer to Figures 6-8 The first isolation part 41 of the isolation structure 4 can be connected to the cathode Cathode, or can be used directly as part of the cathode Cathode.

[0099] In this embodiment, an isolation structure 4 is used in the display panel 1, which can effectively improve the image resolution of the display panel 1 and reduce the power consumption of the display panel 1.

[0100] This application also provides a method for manufacturing a display panel, used to manufacture the display panel described in some of the above embodiments. The display panel has a display area and a bonding area located on at least one side of the display area. This method for manufacturing the display panel also possesses all the technical advantages of the aforementioned display panels.

[0101] Please see Figure 9 The method for preparing the display panel includes the following steps.

[0102] S100, a plurality of bonding pads are formed on the substrate located in the bonding region at intervals.

[0103] S200, protective portions are formed on the periphery of each bonding pad.

[0104] It is understood that in some embodiments, the substrate is a substrate on which the driving circuitry is fabricated. Optionally, the bonding pads can be formed in the same step as any conductive structure of the driving circuitry in the substrate.

[0105] Please refer to some embodiments of this application. Figure 10 In step S200, protective portions are formed on the periphery of each bonding pad, which may include the following steps S210 to S220.

[0106] S210 forms a protective material layer covering each bonded pad.

[0107] For example, the material of the protective layer includes inorganic light-transmitting materials.

[0108] For example, the material of the protective layer includes one or more of silicon oxide, silicon nitride, or silicon oxynitride. The protective layer can be, for example, a single-layer structure or a multilayer structure.

[0109] S220, a patterned protective material layer is formed to form each protective portion; wherein the protective portion is arranged in a closed ring structure around the periphery of the corresponding bonding pad, and the inner area of ​​the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; or, the protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad.

[0110] The structure of the protection section can be found in the relevant descriptions in some of the foregoing embodiments, and will not be repeated here.

[0111] In other embodiments of this application, please refer to Figure 11 In step S200, protective portions are formed on the periphery of each bonding pad, which may include the following steps S210'~S220'.

[0112] S210', forming a pixel definition material layer; wherein, the pixel definition material layer located in the bonding area covers each bonding pad.

[0113] S220', a patterned pixel definition material layer is formed in the display area of ​​the substrate, and each of the protective portions is formed in the bonding area of ​​the substrate; wherein, the protective portion is arranged in a closed ring structure around the periphery of the corresponding bonding pad, and the inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; or, the protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad.

[0114] Optionally, the height of the protective portion along the vertical substrate direction is the same as the height of the pixel definition layer along the vertical substrate direction.

[0115] Optionally, the pixel-defined material layer is patterned using a dry etching process.

[0116] Optionally, a first isolation groove is formed between adjacent protective sections.

[0117] Optionally, a second isolation groove is provided between the protection section and the pixel definition layer.

[0118] Optionally, the material of the pixel-defined material layer includes inorganic light-transmitting materials.

[0119] Optionally, the material of the pixel-defined material layer includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

[0120] It should be noted that the patterning process mentioned in this article generally refers to processes such as photolithography used to form predetermined patterns.

[0121] For example, the pixel definition material layer can be patterned using a photolithography process, which is a process of forming a pattern using tools or equipment such as photoresist, mask, and exposure machine, and includes steps such as film formation, exposure, development, and etching.

[0122] Furthermore, in conjunction with the display panel structure in some of the foregoing embodiments, the method for fabricating the display panel may also include other steps, such as: a step of fabricating an isolation structure, a step of fabricating a light-emitting device, etc. This application will not elaborate on these steps, and is limited to the methods and steps used to fabricate the aforementioned isolation structure and light-emitting device.

[0123] This application also provides a display device, including a display panel as described in some of the preceding embodiments.

[0124] For example, in a display device, a bonding process can be used to bond the two ends of a flexible circuit board to the bonding area of ​​the display panel and the bonding area of ​​the driving printed circuit board, respectively, so as to realize the connection of electrical signals between the driving printed circuit board and the display panel.

[0125] For example, common bonding connection methods for display panel bonding areas include, but are not limited to: FPC (Flexible Printed Circuit), FFC (Flexible Flat Cable), COG (Chip On Glass, i.e., the chip is directly bonded to the glass) and COF (Chip On Film, i.e., the chip is directly mounted on the flexible printed circuit board).

[0126] For example, the display device provided in this application embodiment can be any display device with display function, such as wearable products, computers, televisions, or vehicle-mounted display devices. This application embodiment does not impose specific limitations on this. The display device provided in this application embodiment has the beneficial effects of the display panel provided in this application embodiment. For details, please refer to the specific descriptions of the display panel in the above embodiments. This embodiment will not repeat them here.

[0127] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0128] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A display panel, characterized in that, It has a display area and a binding area located on at least one side of the display area; The display panel includes: a plurality of bonding pads spaced apart in the bonding area, and protective portions disposed on the periphery of each bonding pad.

2. The display panel according to claim 1, characterized in that, The protective portion is a closed ring structure disposed around the periphery of the corresponding bonding pad; the inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; Preferably, the protective portion includes a first layer structure and a second layer structure; wherein the second layer structure is located on the side of the first layer structure away from the substrate, and the orthographic projection of the first layer structure on the substrate is located within the orthographic projection of the second layer structure on the substrate; Preferably, the first layer structure and the second layer structure are concentrically arranged; Preferably, the outer walls of the first layer structure and the outer walls of the second layer structure are flush in the direction perpendicular to the substrate; Preferably, the height of the first layer structure along the direction perpendicular to the substrate is the same as the height of the bonding pad along the direction perpendicular to the substrate; Preferably, the second layer structure also covers the portion of the top surface of the bonding pads away from the substrate.

3. The display panel according to claim 1, characterized in that, The protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad.

4. The display panel according to claim 1, characterized in that, Also includes: A pixel definition layer located in the display area; wherein the protective part is disposed on the same layer as the pixel definition layer; Preferably, the height of the protective portion along the direction perpendicular to the substrate is the same as the height of the pixel definition layer along the direction perpendicular to the substrate; Preferably, a first isolation groove is provided between adjacent protective parts; Preferably, a second isolation groove is provided between the protective portion and the pixel definition layer; Preferably, the protective portion is made of the same material as the pixel definition layer; Preferably, the material of the protective part includes an inorganic light-transmitting material; Preferably, the material of the protective part includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

5. The display panel according to claim 4, characterized in that, The pixel definition layer has multiple pixel openings; the display panel also includes an isolation structure; the isolation structure encloses and forms multiple isolation openings, and the isolation openings are connected to the pixel openings; Preferably, the isolation structure is located on the side of the pixel definition layer away from the substrate; Preferably, the isolation structure includes a first isolation portion and a second isolation portion; wherein the second isolation portion is located on the side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate; Preferably, the material of the first isolation portion includes at least one of aluminum, copper, or silver; Preferably, the material of the second isolation portion includes at least one of titanium or molybdenum; Preferably, the isolation structure further includes a third isolation portion, which is located on the side of the first isolation portion facing the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate; Preferably, the material of the third isolation portion includes at least one of titanium or molybdenum.

6. The display panel according to any one of claims 1 to 5, characterized in that, The materials of the bonding pads include one or more of the following: silver, copper, aluminum, titanium, molybdenum, and their alloys; Preferably, the bonding pads comprise a stacked structure of titanium-aluminum-titanium or molybdenum-aluminum-titanium.

7. A method for manufacturing a display panel, characterized in that, The display panel has a display area and a bonding area located on at least one side of the display area; the manufacturing method includes: A plurality of bonding pads are formed at intervals on the substrate located in the bonding region; A protective portion is formed on the periphery of each of the aforementioned bonding pads.

8. The method for manufacturing a display panel according to claim 7, characterized in that, The provision of protective portions formed around the periphery of each of the bonding pads includes: A protective material layer is formed covering each of the bonding pads; The protective material layer is patterned to form each of the protective portions; wherein the protective portion is arranged in a closed ring structure around the periphery of the corresponding bonding pad, and the inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; or, the protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad.

9. The method for manufacturing a display panel according to claim 7, characterized in that, The provision of protective portions formed around the periphery of each of the bonding pads includes: A pixel definition material layer is formed; wherein the pixel definition material layer located in the bonding area covers each of the bonding pads; The pixel definition material layer is patterned to form a pixel definition layer in the display area of ​​the substrate, and each of the protective portions is formed in the bonding area of ​​the substrate; wherein, the protective portion is arranged in a closed ring structure around the periphery of the corresponding bonding pad, and the inner region of the protective portion exposes at least a portion of the top surface of the corresponding bonding pad; or, the protective portion is arranged in a discontinuous ring around the periphery of the corresponding bonding pad. Preferably, the pixel definition material layer is patterned using a dry etching process; Preferably, a first isolation groove is formed between adjacent protective parts; Preferably, a second isolation groove is provided between the protective portion and the pixel definition layer; Preferably, the pixel-defining material layer comprises an inorganic light-transmitting material; Preferably, the material of the pixel defining material layer includes one or more of silicon oxide, silicon nitride, or silicon oxynitride.

10. A display device, characterized in that, include: The display panel as described in any one of claims 1 to 6, and the driver chip bonded to the display panel.

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