Intelligent monitoring, regulating and controlling liquid supply system and method for photoelectrochemical mechanical polishing liquid

Abstract

The invention discloses an intelligent monitoring, regulating and controlling liquid supply system and method for photoelectrochemical mechanical polishing liquid. The system comprises a base, a liquid storage system, a stirring system, a polishing liquid component detection system, a polishing liquid component supplementing system, a filtering system and a polishing liquid conveying system. The device is specially designed for PECMP waste liquid recovery, the components of the waste liquid are accurately regulated and controlled by integrating a synchronous monitoring and dynamic supplementing mechanism for multiple parameters including the pH value, the resistivity and the light transmittance so as to meet the reuse standard, and the strict requirement of the PECMP technology for multi-parameter coupling of a polishing solution is met; the system adopts a graded filtering structure of'rough filtration by a water filter and fine filtration by a water purifier ', and impurity particles and coagulation pollutants in the waste liquid are efficiently removed. By means of the process of rough filtration pretreatment, component monitoring, intelligent supplementing, circulation regulation and control and fine filtration reuse, intelligent monitoring and circulation reuse of the polishing solution are achieved, and the consumption of the polishing solution is reduced on the premise that the polishing quality is guaranteed.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor polishing technology, and specifically relates to an intelligent monitoring and control system and method for supplying photoelectrochemical mechanical polishing slurry. Background Technology

[0002] Wide-bandgap semiconductors, as an emerging category of semiconductor materials, possess high hardness, excellent chemical stability, wear resistance, ultra-high thermal conductivity, and superior dielectric properties. They are widely used in various fields such as high-precision radar systems, radio detection equipment, 5G communication base stations, and smart grids. Due to the extremely high processing precision required, wafers made from wide-bandgap semiconductors must minimize surface damage and defects. Therefore, ultra-smooth, near-damage-free surfaces are crucial in wafer fabrication.

[0003] Chemical mechanical polishing (CMP) is currently the only mature method for achieving global planarization of substrates without damage. However, due to the high hardness and strong chemical stability of wide-bandgap semiconductors, the material removal rate of CMP is extremely low, severely limiting its application. To improve the oxidation rate, researchers have studied photoelectrochemical mechanical polishing (PECMP). As an emerging polishing technology, PECMP improves the material removal rate by 40 times compared to traditional CMP, making it one of the advanced processes in this field.

[0004] However, PECMP has high requirements for the concentration and dosage of polishing slurry, and existing slurry supply systems have significant bottlenecks that restrict the large-scale application of the process: First, traditional PECMP slurry supply systems adopt a "one-time supply-direct discharge" model. Because the polishing slurry is consumed quickly, excessive supply is often used to ensure optimal results, leading to excessive consumption and high usage. Furthermore, the production cost of specialized polishing slurries is high due to the need for photo-electro-chemical coupling reactions. This not only results in high production costs but also increases environmental protection pressure due to wastewater discharge. Second, CMP slurry supply systems are typically basic filtration and circulation devices, capable of only simple filtration and powder replenishment. They lack multi-parameter monitoring functions designed for PECMP and cannot capture dynamic fluctuations in key parameters such as pH, resistivity, and transmittance, easily leading to imbalances in polishing slurry performance and causing wafer defects. Summary of the Invention

[0005] In order to overcome the problems in the prior art, the present invention provides an intelligent monitoring and control system and method for PECMP polishing slurry that can be recycled and reused, has multi-parameter monitoring function, and is environmentally friendly.

[0006] To solve the above-mentioned technical problems, the technical solution adopted by the present invention is as follows: An intelligent monitoring and control system for the supply of photoelectrochemical mechanical polishing slurry includes a base, a storage system, a stirring system, a polishing slurry component detection system, a polishing slurry component replenishment system, a filtration system, and a polishing slurry transport system. The storage system, the polishing slurry component replenishment system, and the polishing slurry transport system are all fixedly mounted on the base. The polishing slurry component detection system is mounted on the stirring system. The filtration system is mounted between the storage system and the polishing slurry transport system. The stirring system is mounted on the storage system. The lower part of the liquid storage system is connected to a sampling valve via a pipeline. The liquid storage system is connected to the polishing fluid component replenishment system via an input pipeline and a solenoid valve. The liquid storage system delivers polishing fluid to the polishing work area via an output pipeline and a polishing fluid transportation system.

[0007] Furthermore, the liquid storage system, stirring system, polishing liquid component detection system, polishing liquid component replenishment system, filtration system, and polishing liquid transportation system are all connected to an intelligent computer.

[0008] Furthermore, the polishing fluid transport system is a peristaltic pump.

[0009] Furthermore, the liquid storage system includes an upper cover plate, an open cover, a liquid storage tank, a liquid storage tank base plate, a water filter, a level gauge, and a sampling valve; the water filter is installed on the upper cover plate, and the water filter is directly below the waste polishing liquid tap; the level gauge and the open cover are installed on the upper cover plate; the sampling valve is connected to the liquid storage tank base plate through a pipe.

[0010] Furthermore, the polishing fluid composition detection system integrates a resistivity meter, a pH meter, and a transmittance detection module. The resistivity meter and pH meter are respectively fixed on the upper cover plate and are used to detect the resistivity and pH value of the polishing fluid in the storage tank, and to feed the information back to the intelligent computer in a timely manner. The transmittance detection module is located on the pipe between the upper cover plate and the filtration system. The transmittance detection module includes a detection glass tube, a light shield, and a transmittance tester. It detects the transmittance by measuring the change in laser light intensity after the polishing fluid passes through the pipe, and feeds the information back to the intelligent computer in a timely manner.

[0011] Furthermore, the stirring system is installed on the upper cover plate of the liquid storage system.

[0012] Furthermore, the polishing slurry replenishment system includes a solution tank support, an H2SO4 solution tank, a K2SO4 solution tank, a KOH solution tank, a silica sol solution tank, a solenoid valve, and an input pipe. The solution tank support, H2SO4 solution tank, K2SO4 solution tank, KOH solution tank, and silica sol solution tank are all fixed on the solution tank support. The H2SO4 solution tank, K2SO4 solution tank, KOH solution tank, and silica sol solution tank are respectively connected to the input pipe through their respective pipes and solenoid valves.

[0013] Furthermore, the filtration system is a water purifier.

[0014] Furthermore, the stirring system includes a motor, a stirring rod, and a coupling. The motor is fixed on the upper cover plate, and one end of the stirring rod is connected to the motor, while the other end extends into the liquid storage tank.

[0015] A method for intelligent monitoring and regulating the supply of a photoelectrochemical mechanical polishing slurry, utilizing the aforementioned intelligent monitoring and regulating supply system for the photoelectrochemical mechanical polishing slurry, includes the following steps: S1. Coarse filtration pretreatment Turn on the waste polishing fluid tap, and the waste polishing fluid flows out, passing through the water filter on the top cover of the storage system for coarse filtration pretreatment. The built-in filter screen in the water filter removes large-sized wafer fragments and aggregated particles from the polishing fluid. After pretreatment, the polishing fluid flows into the storage tank, and the liquid level is monitored in real time by a level gauge to ensure that the amount of polishing fluid in the storage tank is appropriate.

[0016] S2, Component Analysis After the waste polishing slurry is poured into the storage tank, the target parameters of each component of the slurry, i.e., the reuse standard, are input into the intelligent computer. The stirring system is activated to maintain a uniform concentration of the polishing slurry components. At the same time, the polishing slurry component detection system is activated, and the intelligent computer simultaneously receives the detection values ​​from the resistivity meter, pH meter, transmittance detection module, and level gauge.

[0017] S3, Intelligent Polishing Fluid Refill An intelligent computer automatically controls the polishing slurry replenishment system to adjust various parameters of the polishing slurry in the storage tank. The H₂SO₄ and KOH solution tanks are used to change the pH value of the collected polishing slurry, the K₂SO₄ solution tank and the original solution are used to change the resistivity of the collected polishing slurry, and the silica sol solution tank is used to change the light transmittance of the collected polishing slurry. The solutions in these tanks are fed into the storage tank through their respective pipelines, and the input volume is determined by the opening and closing of electromagnetic valves controlled by the intelligent computer. S4, Cyclic Regulation After this adjustment process is completed, the intelligent computer performs another test. If the data for each component reaches the target parameters, the polishing solution is output. If the component data does not meet the standards, the cycle of component replenishment and component testing is repeated until the data for each component of the polishing solution reaches the target parameters.

[0018] S5, Fine filtration reuse Once the polishing fluid meets the reuse standards, the corresponding filter element of the filtration system is selected according to the type of polishing fluid to perform fine filtration. The polishing fluid transport system is then started to deliver the polishing fluid to the polishing work area through the spray pipe.

[0019] Compared with the prior art, the beneficial effects of the present invention are: 1. This invention is specifically designed for PECMP waste liquid recycling. By integrating a multi-parameter synchronous monitoring and dynamic replenishment mechanism for pH, resistivity, and transmittance, it precisely controls the waste liquid composition to meet reuse standards, solving the stringent requirements of the PECMP process for the coupling of multiple parameters in the polishing fluid. The system adopts a staged filtration structure of "coarse filtration in a water filter + fine filtration in a water purifier," efficiently removing impurities and aggregated pollutants from the waste liquid. In practical use, it not only reduces polishing fluid consumption and waste discharge, lowering environmental treatment pressure, but also meets the PECMP reuse requirements, combining process adaptability with environmental friendliness.

[0020] 2. This invention achieves intelligent monitoring and recycling of polishing fluid through a process of "coarse filtration pretreatment - component monitoring - intelligent replenishment - circulation regulation - fine filtration reuse". It reduces the consumption of polishing fluid while ensuring polishing quality, and takes into account both economy and practicality. It is suitable for large-scale application of photoelectrochemical mechanical polishing process. Attached Figure Description

[0021] Figure 1 This is an overall schematic diagram of the device of the present invention; Figure 2 This is a partial schematic diagram of the liquid storage system and some parts of the present invention; Figure 3 This is a partial schematic diagram of the stirring system of the present invention; Figure 4 This is a partial schematic diagram of the transmittance detection module in the polishing fluid composition detection system of the present invention; Figure 5 This is a partial schematic diagram of the polishing fluid component replenishment system of the present invention; Figure 6 This is a partial schematic diagram of the filtration system, polishing fluid transport system, and base of the present invention.

[0022] In the diagram: 1. Polishing fluid transport system; 2. Storage system; 3. Filtration system; 4. Stirring system; 5. Polishing fluid component detection system; 6. Polishing fluid component replenishment system; 7. Base; 8. Top cover; 9. Waste polishing fluid tap; 10. Water filter; 11. pH meter; 12. Resistivity meter; 13. Opening cover; 14. Sampling valve; 15. Storage tank base plate; 16. Storage tank; 17. Level gauge; 18. Motor; 19. Coupling; 20. Stirring rod; 21. Detection glass tube; 22. Light shield; 23. Transmittance meter; 24. Silica sol solution tank; 25. K2SO4 solution tank; 26. KOH solution tank; 27. H2SO4 solution tank; 28. Solution tank support; 29. ​​Solenoid valve; 30. Input pipe; 31. Spray pipe; 32. Water purifier; 33. Peristaltic pump. Detailed Implementation

[0023] The present invention will be further described below with reference to the accompanying drawings and embodiments. The accompanying drawings are for illustrative purposes only, representing schematic diagrams only, not actual physical objects, and should not be construed as limiting the scope of this patent. To better illustrate the embodiments of the present invention, some components in the drawings may be omitted, enlarged, or reduced, and do not represent the actual dimensions of the product. It is understandable to those skilled in the art that some well-known structures and their descriptions may be omitted in the drawings.

[0024] In the accompanying drawings of the embodiments of the present invention, the same or similar reference numerals correspond to the same or similar components. In the description of the present invention, it should be understood that if terms such as "upper," "lower," "left," "right," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, the terms used to describe positional relationships in the drawings are only for illustrative purposes and should not be construed as limiting the present patent. For those skilled in the art, the specific meaning of the above terms can be understood according to the specific circumstances.

[0025] Example 1 like Figure 1-6 As shown, the intelligent computer in this invention can identify data from the polishing fluid composition detection system 5 and intelligently control the electromagnetic valve 29 to add four solutions to the reuse standard based on the target data. A pulley is provided below the base 7 for easy system movement. A drain valve is also located on its edge for discharging waste liquid from inside the base 7.

[0026] First, the intelligent monitoring and control liquid supply system consists of a polishing slurry transportation system 1, a storage system 2, a filtration system 3, a stirring system 4, a polishing slurry component detection system 5, a polishing slurry component replenishment system 6, and a base 7. All systems are directly or indirectly fixed to the base 7. Used waste polishing slurry flows from a pipe through a water filter 10 into the storage system 2. The polishing slurry component detection system 5, the polishing slurry component replenishment system 6, and the stirring system 4 are all connected to the storage module. After the raw liquid enters the storage system 2, the stirring system 4 continuously stirs to maintain a uniform concentration of the polishing slurry components. The polishing slurry component detection system 5 detects the pH value, transmittance, and resistivity of the polishing slurry. Then, the detection data is transmitted to the polishing slurry component replenishment system 6. Among them, the H2SO4 solution tank 27 and the KOH solution tank 26 can change the pH value of the collected polishing slurry, the K2SO4 solution tank 25 and the raw liquid can change the resistivity of the collected polishing slurry (the raw liquid has low resistivity), and the silica sol solution tank 24 can change the transmittance of the collected polishing slurry. These solutions are fed into the storage tank 16 through pipelines, and the input amount is determined by the opening and closing of the solenoid valve 29 controlled by the intelligent computer, so as to meet the standard for reuse. Finally, the prepared polishing liquid is further filtered by the filtration system 3 and then driven to be put back into use by the polishing liquid transportation system 1. S1: Open the waste polishing fluid tap 9. The waste polishing fluid flows out and passes through the filter 10 on the cover plate 8 of the liquid storage system 2 for coarse filtration pretreatment. Its built-in filter screen removes large-sized wafer fragments and aggregated particles from the polishing fluid. After pretreatment, the polishing fluid flows into the liquid storage tank 16, and the liquid level is monitored in real time by the level gauge 17 to ensure that the amount of polishing fluid in the liquid storage tank 16 is appropriate.

[0027] S2: After the waste polishing liquid is placed in the tank, the target parameters and reuse standards of each component of the polishing liquid are input into the intelligent computer. The stirring system 4 is started to maintain the uniform concentration of the polishing liquid components. At the same time, the polishing liquid component detection system 5 is started, and the intelligent computer simultaneously receives the detection values ​​from the resistivity meter 12, pH meter 11, transmittance detection module, and level gauge 17.

[0028] S3: The intelligent computer automatically controls the polishing slurry replenishment system 6 to adjust various parameters of the polishing slurry in the storage tank 16. Specifically, the H2SO4 solution tank 27 and KOH solution tank 26 can change the pH value of the collected polishing slurry; the K2SO4 solution tank 25 and the original solution can change the resistivity of the collected polishing slurry (the original solution has low resistivity); and the silica sol solution tank 24 can change the light transmittance of the collected polishing slurry. These solutions are fed into the storage tank 16 through pipelines, and the input amount is determined by the opening and closing of the solenoid valve 29 controlled by the intelligent computer.

[0029] S4: After this adjustment process is completed, the intelligent computer will perform another test. If the data for each component reaches the target parameters, the polishing fluid can be output. If the component data does not meet the standards, the cycle of component replenishment and component testing will begin again until the data for each component of the polishing fluid reaches the target parameters.

[0030] S5: After meeting the reuse standard, select the corresponding filter element of filtration system 3 according to the type of polishing fluid to perform fine filtration of the polishing fluid. Start polishing fluid transport system 1 to drive the polishing fluid back into the process.

[0031] Example 2: Parameter configuration of polishing slurry for rough polishing process The core requirement of rough polishing is to quickly remove excess machining allowance from the workpiece surface, shorten the initial processing time, and lay the foundation for subsequent fine machining. Therefore, 500nm alumina abrasive grains are selected to construct the polishing slurry system, and the key parameters are selected as follows: Abrasive parameters: The abrasive type is determined to be alumina, and the particle size is fixed at 500nm. This particle size can reduce the risk of agglomeration and scratches while ensuring mechanical cutting force. The abrasive concentration is set to a high level to enhance mechanical removal capability and meet the needs of efficiently removing redundant materials on the surface during the rough polishing stage.

[0032] pH value parameter: The overall pH is controlled to be slightly alkaline. The amount of KOH solution added is controlled by the KOH solution tank in the polishing fluid component replenishment system 6. The slightly alkaline environment can help improve the material removal efficiency and at the same time avoid corrosion of equipment pipelines.

[0033] Resistivity parameter: Controlled at a medium to low level, the K2SO4 solution is supplied from the K2SO4 solution tank 25 by adding K2SO4 solution to the polishing slurry. This resistivity range can meet the electrochemical reaction intensity required for rough polishing and ensure processing efficiency.

[0034] Transmittance parameter: Maintained at a medium-low level, no additional silica sol needs to be added from silica sol solution tank 24. This transmittance state matches the dispersion requirements of alumina abrasive particles, ensuring the uniformity of polishing slurry composition.

[0035] Example 3: Parameter configuration of polishing fluid for fine polishing process The fine polishing process aims to achieve an ultra-smooth, near-damage-free flattening of the workpiece surface. This requires minimizing mechanical damage to the surface and enhancing the fine removal capabilities of the polishing slurry. Therefore, a 100nm particle size silica abrasive polishing slurry system is used, with specific parameters configured as follows: Abrasive parameters: 100nm spherical silica abrasive grains are selected, and the abrasive grain concentration is set to a low level. The mechanical cutting action of spherical abrasive grains is gentler, which can significantly reduce plastic deformation and scratch damage on the workpiece surface; the lower concentration configuration can further reduce collision friction between abrasive grains, avoid excessive surface roughness caused by high concentration abrasive grains, and fully meet the high surface quality requirements of the fine polishing stage; pH value parameter: Set to near neutral, fine-tuned using H2SO4 solution container 27 or KOH solution container. A near-neutral environment inhibits excessive oxidation of the workpiece surface, preventing surface defects caused by excessively thick or uneven oxide layers, while also ensuring the chemical stability of the silica abrasive grains and preventing abrasive grain dissolution failure from affecting the fine polishing effect. Resistivity parameter: Controlled at a medium-high level, adjusted by adding new raw material with low resistivity. Compared to the rough polishing process, the fine polishing stage needs to reduce the intensity of the electrochemical reaction to avoid violent reactions that could corrode the workpiece surface; a medium-high resistivity can balance the reaction rate and surface protection, ensuring that the integrity of the workpiece surface is not damaged while removing material precisely. Transmittance parameter: Improved to a high level, achieved by replenishing the silica sol solution in container 24. High transmittance corresponds to the excellent dispersion of silica abrasive particles in the polishing slurry, ensuring uniform distribution of the polishing slurry on the workpiece surface and avoiding uneven polishing caused by excessively high or low local abrasive particle concentration, ultimately achieving ultra-high flatness and low roughness of the workpiece surface.

[0036] Example 4: Parameter configuration of polishing slurry for semi-fine polishing process Semi-fine polishing is a process between coarse and fine polishing, requiring a balance between material removal efficiency and surface quality to lay a good foundation for subsequent fine polishing. Therefore, a polishing slurry system of 200-300nm mixed abrasive alumina and silica at a mass ratio of 1:1 is used, with specific parameters configured as follows: Abrasive parameters: A 200-300nm mixed abrasive of alumina and silica, in a 1:1 mass ratio, is selected, with a medium abrasive concentration. This mixed abrasive combines the high removal efficiency of alumina with the low-damage properties of silica. The 200-300nm particle size can quickly repair surface scratches after rough polishing, while avoiding the low efficiency of the fine polishing stage. The medium concentration ensures processing efficiency while preventing excessive accumulation of surface damage, making it suitable for the "bridging" process of semi-fine polishing. pH value parameter: set to weakly alkaline, fine-tuned using a KOH solution tank. A weakly alkaline environment can moderately assist in material removal while avoiding corrosion of the workpiece surface by strong alkalinity, balancing the efficiency and quality requirements of the semi-finish polishing stage, and reducing the surface treatment burden for subsequent finish polishing. Resistivity parameter: Controlled at a medium level, adjusted by mixing the K2SO4 solution in tank 25 with the original solution. This resistivity range lies between coarse and fine polishing, enabling a moderate-intensity electrochemical reaction. This ensures a certain material removal rate without causing surface defects due to excessive reaction, meeting the needs of semi-fine polishing as a "transitional process." Transmittance parameter: Maintained at a medium level, achieved by supplementing with a small amount of silica sol solution, approximately 1 / 3 to 1 / 3 of the amount used in the fine polishing stage. This transmittance corresponds to a reasonable dispersion of the mixed abrasive particles, ensuring that the polishing slurry removes rough polishing scratches without introducing new surface unevenness issues, thus providing a high-quality surface substrate for subsequent fine polishing processes.

[0037] This invention is not limited to this embodiment. Any equivalent concept or modification within the technical scope disclosed in this invention shall be included within the protection scope of this invention.

Claims

1. An intelligent monitoring and control liquid supply system for a photoelectrochemical mechanical polishing liquid, characterized in that: The application relates to a polishing liquid preparation system, which comprises a base (7), a liquid storage system (2), a stirring system (4), a polishing liquid component detection system (5), a polishing liquid component supplementing system (6), a filtering system (3) and a polishing liquid conveying system (1), wherein the liquid storage system (2), the polishing liquid component supplementing system (6) and the polishing liquid conveying system (1) are fixedly installed on the base (7); the polishing liquid component detection system (5) is installed on the stirring system (4); the filtering system (3) is installed between the liquid storage system (2) and the polishing liquid conveying system (1); and the stirring system (4) is installed on the liquid storage system (2). ​ The lower part of the liquid storage system (2) is connected with a sampling valve (14) through a pipeline; the liquid storage system (2) is connected with the polishing liquid component supplementing system (6) through an input pipeline (30) and an electromagnetic valve (29); and the liquid storage system (2) sends polishing liquid to a polishing work area through an output pipeline and the polishing liquid conveying system (1). 2.The system for intelligent monitoring and control of supply of photoelectrochemical mechanical polishing solution according to claim 1, wherein: The liquid storage system (2), the stirring system (4), the polishing liquid component detection system (5), the polishing liquid component supplementing system (6), the filtering system (3) and the polishing liquid conveying system (1) are connected with an intelligent computer. 3.The system of claim 1, wherein the system further comprises: a pH sensor configured to measure the pH of the photoelectrochemical mechanical polishing solution; and a temperature sensor configured to measure the temperature of the photoelectrochemical mechanical polishing solution. The polishing liquid conveying system (1) is a peristaltic pump (32). 4.The system for intelligent monitoring and control of supply of photoelectrochemical mechanical polishing solution according to claim 1, wherein: The liquid storage system (2) comprises an upper cover plate (8), an opening cover (13), a liquid storage barrel (16), a liquid storage barrel base plate (15), a water filter (10), a liquid level meter (17) and the sampling valve (14); the water filter (10) is installed on the upper cover plate (8) and is located directly below a waste polishing liquid faucet (9); the liquid level meter (17) and the opening cover (13) are installed on the upper cover plate (8); and the sampling valve (14) is connected with the liquid storage barrel base plate (15) through a pipeline. 5.The system of claim 1, wherein the system further comprises: a pH sensor configured to measure the pH of the photoelectrochemical mechanical polishing solution; and a temperature sensor configured to measure the temperature of the photoelectrochemical mechanical polishing solution. The polishing liquid component detection system (5) is integrated with a resistivity detector (12), a pH value detector (11) and a light transmittance detection module; the resistivity detector (12) and the pH value detector (11) are fixed on the upper cover plate (8) and are used for detecting the resistivity and the pH value of polishing liquid in the liquid storage barrel (16) and feeding back information to an intelligent computer in time; the light transmittance detection module is located on a pipeline between the upper cover plate (8) and the filtering system (3); the light transmittance detection module comprises a detection glass tube (21), a light shield cover (22) and a light transmittance tester (23); the light transmittance is detected by measuring the change of laser light intensity after the laser light transmits through the polishing liquid in the pipeline, and information is fed back to the intelligent computer in time. 6.The system for intelligent monitoring and control of supply of photoelectrochemical mechanical polishing solution according to claim 1, wherein: The stirring system (4) is installed on the upper cover plate (8) of the liquid storage system (2). 7.The system of claim 1, wherein the system further comprises: a pH sensor configured to measure the pH of the photoelectrochemical mechanical polishing solution; and a temperature sensor configured to measure the temperature of the photoelectrochemical mechanical polishing solution. The polishing liquid component supplement system (6) comprises a solution barrel support (28), an H2SO4 solution barrel (27), a K2SO4 solution barrel (25), a KOH solution barrel (26), a silica sol solution barrel (24), solenoid valves (29) and an input pipeline (30); the solution barrel support (28), the H2SO4 solution barrel (27), the K2SO4 solution barrel (25), the KOH solution barrel (26) and the silica sol solution barrel (24) are all fixed on the solution barrel support (28), and the H2SO4 solution barrel (27), the K2SO4 solution barrel (25), the KOH solution barrel (26) and the silica sol solution barrel (24) are respectively connected with the input pipeline (30) through respective pipelines and solenoid valves (29). 8.The system of claim 1, wherein the system further comprises: a pH sensor configured to measure a pH of the photoelectrochemical mechanical polishing solution; and a temperature sensor configured to measure a temperature of the photoelectrochemical mechanical polishing solution. The filtering system (3) is a water purifier (32). 9.The system of claim 1, wherein the system further comprises: a pH sensor configured to measure the pH of the photoelectrochemical mechanical polishing solution; and a temperature sensor configured to measure the temperature of the photoelectrochemical mechanical polishing solution. The stirring system (4) comprises a motor (18), a stirring rod (20) and a coupling (19), the motor (18) is fixed on the upper cover plate (8), one end of the stirring rod (20) is connected with the motor (18) and the other end extends into the liquid storage barrel (16).

10. An intelligent monitoring and control method for supplying photoelectrochemical mechanical polishing liquid, which is performed by using the intelligent monitoring and control system for supplying photoelectrochemical mechanical polishing liquid according to any one of claims 1-9, and comprises the following steps: S1, coarse filtration pretreatment The waste polishing liquid flows out of the waste polishing liquid faucet (9), flows through the water filter (10) on the upper cover plate (8) of the liquid storage system (2), is subjected to coarse filtration pretreatment, and the filter screen in the water filter (10) filters out large-size wafer debris and agglomerated particles in the polishing liquid; after the pretreatment, the polishing liquid flows into the liquid storage barrel (16) and the liquid level is monitored in real time by the liquid level meter (17) to ensure that the polishing liquid in the liquid storage barrel (16) is appropriate; S2, component detection After the waste polishing liquid enters the liquid storage barrel (16), the target parameters of each component of the polishing liquid, i.e., the recycling standard, are input to the intelligent computer; the stirring system (4) is started to maintain the uniformity of the component concentration of the polishing liquid; at the same time, the polishing liquid component detection system (5) is started, and the intelligent computer simultaneously receives the detection values of the resistivity detection meter (12), the pH value detection meter (11) and the light transmittance detection module and the monitoring value of the liquid level meter (17); S3, intelligent supplement of polishing liquid The intelligent computer automatically controls the polishing liquid component supplement system (6) to adjust each parameter of the polishing liquid in the liquid storage barrel (16) after calculation; the H2SO4 solution barrel (27) and the KOH solution barrel (26) are used to change the pH value of the collected polishing liquid, the K2SO4 solution barrel (25) and the stock solution are used to change the resistivity of the collected polishing liquid, and the silica sol solution barrel (24) is used to change the light transmittance of the collected polishing liquid; the solutions in these solution barrels are input into the liquid storage barrel (16) through respective pipelines, and the input amount is determined by the opening and closing of the solenoid valves (29) controlled by the intelligent computer; S4, cyclic control After the adjustment process, the intelligent computer detects again, if the data of each component reaches the target parameter, the polishing liquid is output; if the component data does not reach the standard, the component supplement and component detection cycle are carried out again until the data of each component of the polishing liquid reaches the target parameter; S5, fine filtration reuse After reaching the reuse standard, according to the type of the polishing liquid, the filter core corresponding to the filter system (3) is selected, and the polishing liquid is subjected to fine filtration treatment; the polishing liquid transportation system (1) is started to transport the polishing liquid to the polishing working area through the liquid spraying pipeline (31).

Images