Solvent-free modified PI resin and preparation method thereof

By using a solvent-free method to prepare PI resin, and by utilizing reactive diluents and chemical bonding technology, the problems of volatile organic compound emissions and phase separation in the traditional polyimide resin processing have been solved, achieving rapid and environmentally friendly high-performance polyimide curing.

CN121609845APending Publication Date: 2026-03-06XJ INSULATION MATERIALS CO LTD
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Patent Information

Application Number
CN202512031028.2
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2025-12-30
Publication Date
2026-03-06

AI Technical Summary

Technical Problem

Traditional polyimide resin processing results in high emissions of volatile organic compounds and long thermosetting cycles. Photocurable polyimide systems also suffer from microphase separation, leading to a decline in mechanical properties and heat resistance.

Method used

Solvent-free modified PI resin is used, with acryloyl phosphate and isobornyl acrylate as reactive diluents. A uniform cross-linked network is formed by chemical bonding of isocyanate methacrylate with amino-terminated polyimide powder, avoiding solvent evaporation and phase separation.

Benefits of technology

It achieves zero volatile organic compound emissions and rapid photocuring, improves the tensile strength and glass transition temperature of the cured film, and maintains the excellent mechanical properties and heat resistance of polyimide.

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Abstract

The invention relates to the technical field of high polymer materials, and discloses a solvent-free modified PI resin and a preparation method thereof, and the solvent-free modified PI resin comprises amino-terminated polyimide powder, acryloyl line, isobornyl acrylate, isocyano ethyl methacrylate and a photoinitiator. The preparation method comprises the following steps: firstly, synthesizing amino-terminated polyimide powder from fluorine-containing diamine and dianhydride, then dissolving the amino-terminated polyimide powder in acryloyl line and isobornyl acrylate, adding isocyano ethyl methacrylate to enable an isocyanate group to react with an amino-terminated group so as to introduce photoactive double bonds, and finally mixing an initiator. The PI solubility is improved through the fluorine-containing structure design, and zero VOC emission is achieved by replacing an organic solvent with the reactive diluent; a uniform cross-linked network is constructed through chemical bonding, so that the microscopic phase separation problem of a physical blending system is solved, second-level photocuring is realized, and the tensile strength and heat resistance of the cured resin are obviously improved.
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