Preparation method of medical operation electrode

Abstract

The invention provides a preparation method of a medical surgical electrode, and belongs to the field of medical instruments. The invention provides a preparation method of a medical operation electrode, which comprises the following steps: mixing silver particles and copper particles, and sequentially carrying out vacuum arc melting and annealing to obtain the medical operation electrode. And the high thermal conductivity of silver can quickly dissipate interface heat and reduce higher tissue adhesion formed by protein carbonization, so that the silver-silver composite electrode is suitable for medical surgical electrodes, and can improve the electrode cutting efficiency, reduce adhesion and reduce the risk of thermal injury. And by adding copper, the mechanical property of pure silver is improved, meanwhile, the electric conduction and heat conduction performance of the pure silver is reserved, the electrode cutting efficiency can be further improved, adhesion is relieved, and the thermal damage risk is reduced.

Description

Technical Field

[0001] This invention relates to the field of medical devices, and more specifically to a method for preparing a medical surgical electrode. Background Technology

[0002] With the rapid development of minimally invasive surgical techniques, medical surgical electrodes, as core instruments in high-frequency electrosurgery, can quickly perform operations such as tissue cutting and coagulation, helping doctors complete surgical tasks accurately and safely in a shorter time. However, the high temperature generated on the electrode surface during surgical cutting can cause the blood and body fluids in the tissue to vaporize, resulting in blood and soft tissue adhesion, forming eschar, and affecting the surgical outcome.

[0003] Existing stainless steel or alloy electrodes cause tissue carbonization due to high temperatures during cutting, forming eschar that adheres to the surface, increases resistance, reduces surgical efficiency, requires frequent cleaning, and prolongs surgical time. Summary of the Invention

[0004] This invention provides a method for preparing a medical surgical electrode. The electrode prepared by this invention has high surgical efficiency and low adhesion.

[0005] This invention provides a method for preparing a medical surgical electrode, comprising the following steps: The medical surgical electrode is obtained by mixing silver particles and copper particles and then sequentially performing vacuum arc melting and annealing.

[0006] Preferably, the mass of copper in the medical surgical electrode is 2.5 to 15% of the total mass of silver and copper.

[0007] Preferably, the vacuum arc melting is carried out in an inert atmosphere.

[0008] Preferably, the vacuum degree of the vacuum arc melting is 10. -2 Pa; The vacuum arc melting process includes: repeatedly melting at a current of 100 A for 1 minute and then melting at a current of 300 A for 1 minute; After each repetition, the resulting melt is flipped 180°.

[0009] Preferably, the repetition is performed 6 to 8 times.

[0010] Preferably, the annealing temperature is 720°C and the time is 4 hours.

[0011] Preferably, after annealing, the process further includes cooling the resulting product to room temperature.

[0012] Silver's high thermal conductivity allows for rapid dissipation of interfacial heat, reducing protein carbonization and strong tissue adhesion. This makes it suitable for medical surgical electrodes, improving cutting efficiency, reducing adhesion, and lowering the risk of thermal damage. The addition of copper improves the mechanical properties of pure silver (pure silver has very low hardness and is easily worn when used in surgical electrodes) while retaining its electrical and thermal conductivity, further enhancing cutting efficiency, reducing adhesion, and lowering the risk of thermal damage.

[0013] The preparation method of this invention is mature, the product has good performance, the process is simple, the cost is low, and it has broad application prospects. Attached Figure Description

[0014] Figure 1 The X-ray diffraction patterns of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown below. Figure 2 The images show the metallographic morphology of the AgCu alloys obtained in Examples 1-6. Figure 3 The images shown are SEM images of the AgCu alloys obtained in Examples 5 and 6. Figure 4 The hardness variation curves of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown. Figure 5 The stress-strain curves, strength variation curves, and strength variation diagrams of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown. Figure 6 The resistivity variation curves of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown. Figure 7 The thermal diffusivity of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1; Figure 8 The curves showing the change in thermal conductivity of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown. Figure 9 To simulate the results of a thermal cutting experiment. Detailed Implementation

[0015] This invention provides a method for preparing a medical surgical electrode, comprising the following steps: The medical surgical electrode is obtained by mixing silver particles and copper particles and then sequentially performing vacuum arc melting and annealing.

[0016] In this invention, the mass of copper in the medical surgical electrode is preferably 2.5-15% of the total mass of silver and copper. In specific embodiments of this invention, it can be 3%, 4%, 5%, 6%, 7%, 8%, 9%, 10%, 11%, 12%, 13%, or 14%.

[0017] In this invention, the vacuum arc melting is preferably carried out in an inert atmosphere; the vacuum degree of the vacuum arc melting is preferably 10. -2 Pa.

[0018] In this invention, the vacuum arc melting preferably includes: repeatedly melting at a current of 100 A for 1 minute and then melting at a current of 300 A for 1 minute; after each repetition, the resulting melt is preferably flipped 180°, and the number of repetitions is preferably 6 to 8 times. Vacuum arc melting can reduce impurities in the alloy composition, make the alloy composition more uniform, and reduce the weakening effect of the alloy composition on the resistance of the silver matrix.

[0019] In this invention, the annealing temperature is preferably 720°C and the annealing time is preferably 4 hours.

[0020] Annealing can eliminate residual stress in the ingot, improve the microstructure, refine the grains, increase the hardness and strength of the silver alloy, and eliminate defects such as uneven grain size, porosity, and internal stress caused during the smelting process. This can improve the thermal, electrical, and mechanical properties of the electrode and reduce the weakening effect of alloy composition on the resistance of the silver matrix.

[0021] After annealing, the present invention preferably further includes: cooling the resulting product to room temperature.

[0022] The following detailed description of the preparation method of the medical surgical electrode provided by the present invention, in conjunction with the embodiments, should not be construed as limiting the scope of protection of the present invention.

[0023] Example 1 (1) Copper particles and silver particles were mixed to obtain alloy particles with a total mass of 20 g (copper particles accounted for 2.5% of the mass). Each sample was prepared with 20 g of alloy particles. Considering the high melting temperature during subsequent arc melting, silver, copper, and nickel would experience some loss at high temperatures, with a loss rate of 10%. Therefore, the amount of each raw material should be accurately calculated based on the required alloy composition and loss rate during batching. This ensures that the required alloy composition is obtained during production and reduces losses due to inaccurate batching. The actual alloy batching mass M2 = M1 / ​​(1-10%), where M1 is the final sample mass.

[0024] (2) Vacuum arc melting All alloy samples were melted using a high-vacuum electric arc melting and suction casting system – DHL400. The batched metal particles were placed in a crucible, the cavity was closed, and a vacuum of 10... -2 The chamber is purged with argon gas to prevent oxygen and other gases from affecting the alloy composition during the melting process. After purging, the chamber is refilled with argon gas to a protective level of 10. -2 Pa, then smelting. The specific smelting process is as follows: Step 1: Melt the titanium ingot in crucible No. 5 using a high current (300 A) (to further consume any oxygen that may be present in the cavity), with a melting time of 30 seconds; Step 2: Pre-melt the metal particles in crucible No. 1 using a small current (100 A) until the metal particles are completely melted. Then increase the current to 300 A. At this point, the alloy melt can be seen spiraling through the observation window. Continue melting for 1 minute, then use a flipping robot to turn the alloy ingot 180 degrees and continue melting for another minute. Repeat this process 6-8 times to obtain a silver alloy sample with uniform composition and sufficient alloying.

[0025] (3) Homogenization annealing Because arc-melted ingots may contain casting defects such as porosity, compositional segregation, and stress, homogenization annealing is necessary. The molten silver-copper alloy was heat-treated using a Warwick 2VP-669 vacuum heat treatment furnace. After homogenization annealing at 720 °C for 4 hours, the ingots were water-cooled to room temperature to eliminate residual stress, improve microstructure, refine grains, and enhance the hardness and strength of the silver alloy. Example 2 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 5%.

[0026] Example 3 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 7.5%.

[0027] Example 4 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 10%.

[0028] Example 5 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 12.5%.

[0029] Example 6 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 15%.

[0030] Comparative Example 1 The only difference from Example 1 is that the mass fraction of copper particles in the alloy particles is 0%.

[0031] Figure 1 The X-ray diffraction patterns are those of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1.

[0032] from Figure 1It can be observed that due to the addition of copper, the diffraction peak of the (311) crystal plane with 2θ of 78.4° shifts to the right, reflecting that copper may exist in the silver matrix as a solid solution. The atomic radius of copper is known to be 0.128 nm, and that of silver is 0.144 nm. Since their atomic radii are similar, they theoretically possess mutual solubility and can form a substitutional solid solution. According to Bragg's equation 2dsinθ=λ, when copper atoms replace silver atoms in the face-centered cubic lattice, the lattice constant a decreases, leading to a decrease in the interplanar spacing d, which in turn causes a positive shift in the diffraction angle θ. Secondly, the figure shows that when the copper content does not exceed 10 wt%, all diffraction peaks are the four strongest peaks of silver, with no new characteristic peaks appearing. This indicates that the silver-copper alloy system may be in a single-phase solid solution state at this time, with copper atoms uniformly distributed in the silver matrix. At this point, the copper content in the system does not exceed the maximum solid solubility of copper in silver. When the copper content exceeds 10 wt%, the X-ray diffraction pattern shows typical phase transition characteristics. New diffraction peaks appear at 2θ = 43.8° and 50.6°, corresponding to the (111) and (200) crystal plane diffraction peaks of copper. At this point, the copper content in the silver matrix has exceeded the maximum solid solubility and exists in the silver matrix as a precipitate. Combined with the phase diagram analysis of the silver-copper binary alloy, when the copper content exceeds the solid solubility, the system enters the α-Ag+β-Cu dual-phase coexistence region. At this time, the copper phase and the silver phase coexist, and a small amount of copper precipitate is distributed in the silver matrix. Therefore, copper diffraction peaks appear at 43.8° and 50.6°. Finally, the silver diffraction peaks at 2θ = 38.2°, 44.4°, and 64.5° in the figure show an increasing trend with the addition of copper. This may be attributed to the secondary diffraction response generated by the precipitated copper-rich phase under the influence of lattice distortion, forming a composite peak superposition effect, which causes the diffraction peaks to be enhanced.

[0033] Figure 2 The images show the metallographic morphology of the AgCu alloys obtained in Examples 1-6. Figure 2 (a), (b), (c), (d), (e), and (f) are metallographic morphology diagrams of the AgCu alloys obtained in Examples 1 to 6, respectively.

[0034] Consistent with XRD analysis, when the copper content does not exceed 10 wt%, the metallographic structure exhibits typical single-phase solid solution characteristics: it consists of uniform equiaxed grains with clear and straight grain boundaries and no typical second-phase precipitates. Figure 2 Compared to the (c) alloy Figure 2(b) shows a grain refinement effect, confirming that copper atoms dissolved in the silver matrix form a substitutional solid solution. Simultaneously, the strain energy generated by lattice distortion caused by the dissolution of copper atoms promotes increased nucleation density during recrystallization, resulting in more and finer grains. When the copper content exceeds 10 wt%, phase transformation characteristics appear in the microstructure. First, dark dot-like and short rod-like particles are observed precipitating along grain boundaries and dendrites in the figure. Their volume fraction gradually increases with increasing copper content. Combined with XRD analysis, this dark structure may be a precipitated copper-rich phase. Second, the addition of copper leads to a significant evolution of the alloy microstructure. First, due to the high copper content, the grain boundaries of the alloy microstructure exhibit obvious blurring characteristics, such as... Figure 2 As shown in (f), this may be attributed to the decrease in interfacial energy caused by the precipitation of copper-rich phases along grain boundaries, leading to grain boundary blurring. Second, micron-sized black spots appear in areas with relatively dense precipitates, presumably pores, possibly due to dendrite shrinkage during rapid cooling of the alloy. The above microstructural evolution is consistent with the non-equilibrium solidification behavior of the silver-copper system. When the copper content exceeds the maximum solid solubility of copper in silver, metastable phase separation occurs in the alloy melt during cooling, causing the copper-rich phase to preferentially nucleate and precipitate from defect-rich areas such as grain boundaries.

[0035] According to the metallographic observation of silver-copper alloys, when the copper content is high, rod-shaped or granular copper-rich phases will precipitate from the grain boundaries of the silver alloy. After a large amount of copper-rich phases precipitate, they may form a continuous network precipitate phase structure in the alloy matrix.

[0036] Figure 3 The images shown are SEM images of the AgCu alloys obtained in Examples 5 and 6.

[0037] from Figure 3 A continuous and uniformly distributed network of dark structures can be observed on the surface of the silver matrix. Based on the phase diagram of the silver-copper binary alloy and the non-equilibrium solidification behavior of the silver-copper system, combined with the XRD and metallographic microstructure analysis mentioned above, it can be confirmed that the dark area is a copper-rich phase precipitate along the grain boundary. Figure 3 (a) and (c) are SEM images of the AgCu alloy obtained in Example 5, and (d) is an SEM image of the AgCu alloy obtained in Example 6. It can be seen that as the copper content increases, the precipitated continuous network of copper-rich phase becomes more and more dense, reflecting that the increase in copper content is directly related to the increase in the volume fraction of copper-rich phase.

[0038] In summary, copper content significantly affects the microstructure and morphology of silver-copper alloys. When the copper content does not exceed 10 wt%, the alloy exhibits single-phase solid solution characteristics, with copper atoms uniformly dissolved in the silver matrix. The addition of copper atoms causes lattice distortion, increasing the nucleation density during recrystallization and resulting in a grain refinement effect. When the copper content exceeds 10 wt%, the system enters a two-phase coexistence region of silver and copper-rich (β-Cu) phases. Combined with metallographic microstructure and SEM analysis, the copper-rich phase precipitates as dot-like or short rod-shaped particles along grain boundaries and dendrites, and its volume percentage increases with increasing copper content. With further increases in copper content, the copper-rich phase precipitated from grain boundaries and dendrites forms a continuous network structure in the silver matrix, which has a certain impact on the mechanical, electrical, and thermal conductivity of the alloy.

[0039] Figure 4 The hardness variation curves of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown.

[0040] Depend on Figure 4 It is evident that the addition of copper enhances the overall hardness of the alloy. With increasing copper content, the alloy hardness increases from 41 HV for pure silver to 101 HV. Analysis of the microstructure evolution reveals a three-stage hardness enhancement mechanism: First, when the copper content is between 0 wt% and 7.5 wt%, hardness enhancement is primarily driven by solid solution hardening, where copper atoms dissolve into the silver matrix to form a substitutional solid solution. On one hand, the addition of copper produces a grain refinement effect, making the alloy microstructure more uniform. Increased grain boundary density hinders dislocation movement, resulting in a hardening effect. On the other hand, the addition of copper induces lattice distortion, and the presence of distortion stress enhances the resistance to dislocation movement, thus hardening the alloy. Second, when the copper content is between 7.5 wt% and 10 wt%, the copper content in the silver matrix exceeds the maximum solid solubility, and the system enters a region where α-Ag and β-Cu coexist. At this point, the alloy hardening mechanism transforms into a synergistic effect of solid solution hardening and precipitate hardening. Supersaturated copper-rich phases precipitate along grain boundaries as dot-like or short rod-shaped particles, increasing dislocation slip resistance through pinning and producing a hardening effect. Finally, when the copper content is between 10 wt% and 15 wt%, precipitated phase hardening dominates, leading to increased alloy hardness. The copper-rich phase continues to precipitate along grain boundaries and dendrites, forming a continuous network structure. On one hand, the abundant copper-rich phase creates a pinning effect that hinders dislocation movement, increasing alloy hardness. On the other hand, the continuous network copper structure has a higher hardness than silver, contributing to the alloy's hardening effect.

[0041] Figure 5 The stress-strain curves, strength variation curves, and strength variation diagrams of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown.

[0042] Depend on Figure 5It can be seen that the strength of the alloy increases rapidly at first and then slowly after the addition of copper, increasing from 157 MPa for pure silver to 253 MPa. Consistent with the increase in hardness, the strength enhancement mechanism can also be divided into three stages. First, when the copper content is between 0 wt% and 7.5 wt%, the silver-copper alloy exhibits the fastest strength increase, with solid solution strengthening dominating the strengthening mechanism. On one hand, copper atoms form a substitutional solid solution in the silver matrix, resulting in uniform and refined grains within the alloy. The increased grain boundaries hinder dislocation movement, thus increasing the alloy strength. On the other hand, the addition of copper induces lattice distortion, generating distortion stress that further impedes dislocation slip, further enhancing the alloy strength. Secondly, when the copper content is between 7.5 wt% and 10 wt%, the rate of increase in silver-copper strength slows down, reflecting a shift in the strengthening mechanism from being dominated by solid solution strengthening to a synergistic effect of solid solution strengthening and precipitation strengthening. Based on solid solution strengthening, the increased copper content leads to the precipitation of supersaturated copper along grain boundaries and dendrites. The precipitated dot-like or short rod-shaped copper particles are distributed in the silver matrix. According to the Orowan mechanism, dislocations do not cross over but pass through the copper particles during their movement. This process requires energy, and the obstruction of dislocation movement increases the alloy strength. The slower rate of strength increase may be attributed to the stress concentration caused by micro-strain at the silver / copper phase boundary, which partially offsets the strengthening effect. This corresponds to the stepwise increase in hardness mentioned earlier. Finally, when the copper content is between 10 wt% and 15 wt%, the rate of increase in alloy strength slows down further, reflecting a shift in the strength enhancement mechanism to being dominated by precipitation strengthening. At this point, the copper-rich phase continues to precipitate along grain boundaries and interdendritic spaces, forming a continuous network structure. While this continuous network structure enhances the alloy's strength, it also has a certain cutting effect on the silver matrix, affecting further increases in alloy strength. Furthermore, as observed in the figure, the stress-strain curve narrows with increasing copper content, reflecting a decrease in alloy plasticity. This phenomenon is consistent with the strength-plasticity trade-off.

[0043] Figure 6 The resistivity variation curves of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown.

[0044] Depend on Figure 6It can be observed that when the copper content is 2.5 wt%, the resistivity decreases significantly, from 1.602 μΩ·m in pure silver to 1.895 μΩ·m, and then the rate of decrease slows down. This phenomenon is closely related to the short-range ordering of solute atoms and the evolution of defect density: at extremely low copper contents (<2.5 wt% Cu), copper atoms exhibit a short-range ordered distribution in the silver matrix, forming a local periodic potential field. This metastable structure weakens the scattering effect of lattice distortion through a dual mechanism of reducing the electron scattering cross section and filling dislocation core vacancies, resulting in a resistivity decrease of about 5% to 8% compared to pure silver. However, as the copper content gradually increases, the short-range ordered structure gradually disintegrates, and the random distribution of copper atoms regains dominance. The increased lattice distortion stress causes the electron scattering probability to rebound, while the dislocation density rebounds due to the intensified lattice distortion. The contribution of defect scattering gradually offsets the resistivity reduction effect of short-range ordering, resulting in a slower rate of resistivity decrease. When the copper content increases to 7.5 wt%, the synergistic effect of precipitation interface scattering and grain boundary scattering (such as the surge in β-Cu phase volume fraction and grain refinement) once again dominates the resistivity evolution. The inflection point of its growth rate is consistent with the phase transformation kinetics, confirming the multi-scale regulation mechanism of microstructure evolution on macroscopic electrical properties.

[0045] Figure 7 The thermal diffusivity of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 is given.

[0046] Figure 8 The curves showing the change in thermal conductivity of the AgCu alloys obtained in Examples 1-6 and Comparative Example 1 are shown.

[0047] Depend on Figures 7-8It is known that the thermal conductivity of pure silver is 0.419 W / (mm·K), which gradually decreases with increasing copper content. When the copper content is 15 wt%, the thermal conductivity of the alloy drops to 0.328 W / (mm·K). This change can be attributed to the scattering effect of copper on free electrons. When the copper content is low (<7.5% wt Cu), Cu atoms dissolve into the silver matrix to form a substitutional solid solution, causing the lattice constant to shrink. The local stress field generated by the lattice distortion significantly enhances the scattering of phonons and electrons, leading to a shortening of the mean free path of phonons and electrons. According to Matthiassen's rule, the suppressive effect of solid solution scattering on thermal conductivity is positively correlated with the square root of the copper concentration. The thermal conductivity of AgCu7.5 drops to 0.351 W / (mm·K), a decrease of 16.2%, which is highly consistent with theoretical predictions. When the Cu content exceeds the solid solubility critical value (7.5 wt%-10 wt% Cu), the copper-rich phase (β-Cu) precipitates in the form of nanoparticles or a continuous network. Interface scattering and grain boundary effects become dominant. A phonon scattering barrier is formed at the interface between the precipitated phase and the silver matrix. The interface density increases, but the single-interface scattering efficiency decreases due to the suppression of coarsening by rapid cooling. At the same time, the grains further refine, and grain boundary scattering further hinders heat transfer. The decrease in thermal conductivity slows down at this stage, reflecting the influence of the precipitated phase and grain boundaries on electron scattering. This is consistent with the upward trend of resistivity data, demonstrating a strong correlation between electro-thermal transport. In addition, the thermal conductivity of the alloy gradually decreases with increasing temperature. The thermal conductivity of pure silver decreases from 0.419 W / (mm·K) to 0.362 W / (mm·K), and the thermal conductivity of AgCu15 decreases from 0.328 W / (mm·K) to 0.288 W / (mm·K). This can be attributed to the increased lattice vibration anharmonicity due to rising temperature, which significantly increases the phonon-phonon scattering probability and shortens the phonon mean free path. At the same time, the difference in thermal expansion coefficients between the precipitated phase and the matrix induces interfacial micro-strain, further hindering heat conduction.

[0048] It is worth noting that the thermal conductivity of the alloy is less sensitive to temperature after the addition of copper, indicating that the introduction of copper buffers the dissipation path of lattice vibration energy through solid solution and precipitated phases. This characteristic has potential advantages in high-temperature medical device scenarios.

[0049] When the copper content is low, copper exists in solid solution form, enhancing the alloy's hardness and strength through solid solution strengthening and grain refinement. When the copper content is high, supersaturated β-Cu precipitates along grain boundaries, further strengthening the alloy's hardness and strength through precipitated phase reinforcement. At a copper content of 15 wt%, the alloy exhibits a maximum hardness of 101 HV and a tensile strength of 253 MPa. Its resistivity is 1.975 μΩ·m, and its thermal conductivity is 0.328 W / (mm·K), slightly lower than pure silver. However, it still far surpasses the thermal and electrical conductivity of stainless steel.

[0050] Blades made of silver alloys with different compositions were heated to 350°C using a temperature-controlled soldering iron to cut into pork belly tissue. Adhesion quality was tested, and anti-adhesion performance was evaluated. Results are as follows: Figure 9 As shown.

[0051] Figure 9 To simulate the results of a thermal cutting experiment. Figure 9 In the example, 01# is silver from Comparative Example 1, 02# and 12# are AgCu alloys from Example 1, 03# and 13# are AgCu alloys from Example 2, 04# and 14# are AgCu alloys from Example 3, 05# and 15# are AgCu alloys from Example 4, 06# and 16# are AgCu alloys from Example 5, 07# and 17# are AgCu alloys from Example 6, and 22# is a 304 stainless steel blade.

[0052] Depend on Figure 9 It is known that the tissue adhesion amount of silver alloy blades (12.36 mg–18.56 mg) is significantly lower than that of 304 stainless steel blades (95.2 mg). Silver's high thermal conductivity allows for rapid dissipation of interfacial heat, reducing protein carbonization and thus preventing strong tissue adhesion. Suitable for medical surgical electrodes, it can improve electrode cutting efficiency, reduce adhesion, and lower the risk of thermal damage. Its manufacturing process is mature, the product performs well, and it has broad application prospects.

[0053] The above description is only a preferred embodiment of the present invention. It should be noted that for those skilled in the art, several improvements and modifications can be made without departing from the principle of the present invention, and these improvements and modifications should also be considered within the scope of protection of the present invention.

Claims

1. A method of making a medical surgical electrode, comprising: The method comprises the following steps: The silver particles and the copper particles are mixed, and then vacuum arc melting and annealing are sequentially performed to obtain the medical surgical electrode.

2. The production method according to claim 1, characterized by, The mass of the copper element in the medical surgical electrode is 2.5-15% of the total mass of the silver element and the copper element.

3. The preparation method according to claim 1, characterized in that, The vacuum arc melting is performed in an inert atmosphere.

4. The production method according to claim 1, characterized by, The vacuum arc melting is performed at a vacuum of 10 -2 Pa; The vacuum arc melting comprises repeatedly melting for 1 min at a current of 100 A and then melting for 1 min at a current of 300 A. The obtained melt is turned by 180° after each repetition.

5. The preparation method according to claim 4, characterized in that, The number of repetitions is 6-8.

6. The method of claim 1, wherein, The annealing is performed at a temperature of 720 ℃ for 4 h.

7. The preparation method according to claim 1, characterized in that, After the annealing, the obtained product is cooled to room temperature.

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