Display panel and manufacturing method thereof

Abstract

The invention provides a display panel and a manufacturing method thereof, and relates to the technical field of display panels, the display panel comprises a driving backboard, bonding pad groups and a light emitting device, at least one bonding pad group is located on one side of the driving backboard, at least one bonding pad group comprises two bonding pads, one side, away from the driving backboard, of each bonding pad is provided with an accommodating structure, and the two bonding pads are arranged in the accommodating structure. The accommodating structures of the two bonding pads of the same bonding pad group are matched to form an accommodating cavity; according to the structure, the light-emitting device can be limited by the containing cavity, deviation of the light-emitting device is avoided, the transfer success rate of the light-emitting device can be increased, the image quality problem of inconsistent light-emitting light patterns caused by deviation of the light-emitting device is solved, and the light-emitting device can be used for improving the image quality of the light-emitting device. Meanwhile, the production period can be shortened, and the production cost is reduced.

Description

Technical Field

[0001] This application relates to the field of display panel technology, and more specifically, to a display panel and a method for manufacturing the same. Background Technology

[0002] With the development of display device manufacturing technology, Mini LED and Micro-LED have been widely used due to their superior advantages in brightness, resolution, contrast, energy consumption, lifespan, response speed and thermal stability.

[0003] However, current Mini LEDs or Micro-LEDs may have misalignment issues after transfer. Summary of the Invention

[0004] In order to overcome the above-mentioned shortcomings in the prior art, the purpose of this application is to provide a display panel, the display panel comprising:

[0005] Drive backplane;

[0006] At least one pad group located on one side of the drive backplate; at least one pad group includes two pads, and the side of the pad away from the drive backplate is provided with a receiving structure, and the receiving structures of the two pads in the same pad group cooperate to form a receiving cavity;

[0007] A light-emitting device is disposed within the accommodating cavity and electrically connected to the pad.

[0008] In one possible implementation, the accommodating structure includes a recessed portion that is recessed into the drive backplate from the side of the pad away from the drive backplate, and the recessed portions of two pads in the same pad group are brought close to each other to form the accommodating cavity.

[0009] Preferably, the orthographic projection of the light-emitting device on the driving backplate is located within the orthographic projection of the accommodating structure on the driving backplate.

[0010] In one possible implementation, the accommodating structure includes a baffle layer disposed on the side of the pad away from the drive backplate, the baffle layer including an accommodating opening exposing the pad, and the accommodating openings of the baffle layer on two pads in the same pad group being disposed opposite to each other to form the accommodating cavity;

[0011] Preferably, the orthographic projection of the light-emitting device on the driving backplate is located within the orthographic projection of the accommodating structure on the driving backplate.

[0012] In one possible implementation, the accommodating structure includes a baffle disposed on the side of the pad away from the drive backplate, the baffles of two pads in the same pad group are disposed opposite to each other, and the accommodating cavity is formed between the baffles of the two pads;

[0013] Preferably, the orthographic projection of the light-emitting device on the driving backplate is located within the orthographic projection of the accommodating structure on the driving backplate.

[0014] In one possible implementation, preferably, the baffle layer or the baffle is reflective.

[0015] In one possible implementation, the depth of the accommodating cavity is greater than half the thickness of the light-emitting device in a direction perpendicular to the drive backplate.

[0016] Another object of this application is to provide a method for manufacturing a display panel, the method comprising:

[0017] Provide a drive backplane;

[0018] At least one pad group is provided on one side of the drive backplate. The at least one pad group includes two pads. The side of the pad away from the drive backplate is provided with a receiving structure. The receiving structures of the two pads in the same pad group cooperate to form a receiving cavity.

[0019] The light-emitting device is transferred into the accommodating cavity;

[0020] The pins of the light-emitting device are electrically connected to the pads by soldering or bonding.

[0021] In one possible implementation, the step of providing at least one pad group on one side of the drive backplane includes:

[0022] A metal layer is deposited on one side of the drive backplate;

[0023] The metal layer is etched to form a pad with a recessed portion. The recessed portion is recessed from the side of the pad away from the drive backplate toward the drive backplate. The recessed portions of two pads in the same pad group are brought close to each other to form the receiving cavity.

[0024] In one possible implementation, the step of providing at least one pad group on one side of the drive backplane includes:

[0025] A metal layer and a baffle layer are deposited on one side of the drive backplate, respectively;

[0026] The metal layer and the baffle layer are etched separately to form a pad with a receiving structure. The receiving structure includes a baffle layer disposed on the side of the pad away from the drive backplate. The baffle layer includes a receiving opening that exposes the pad. The receiving openings of the baffle layer on two pads in the same pad group are arranged opposite to each other to form the receiving cavity.

[0027] In one possible implementation, the step of providing at least one pad group on one side of the drive backplane includes:

[0028] A metal layer and a baffle layer are deposited on one side of the drive backplate, respectively;

[0029] The metal layer and the baffle layer are etched respectively to form a pad with a receiving structure. The receiving structure includes a baffle layer disposed on the side of the pad away from the drive backplate and a baffle disposed on the side of the pad away from the drive backplate. The baffles of two pads in the same pad group are disposed opposite to each other, and the receiving cavity is formed between the baffles of the two pads.

[0030] Compared with the prior art, this application has the following beneficial effects:

[0031] This application provides a display panel and its manufacturing method. By setting an accommodating structure on the side of the pads away from the driving backplate, and forming an accommodating cavity by cooperating the accommodating structures of two pads in the same pad group, the light-emitting device is transferred into the accommodating cavity. The accommodating cavity can limit the light-emitting device, which can prevent the light-emitting device from being misaligned, make the light-emitting device electrically connected to the pads, improve the transfer success rate of the light-emitting device, improve the image quality problem of inconsistent light emission pattern caused by the misalignment of the light-emitting device, and shorten the production cycle and reduce the production cost. Attached Figure Description

[0032] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0033] Figure 1a This is one of the schematic diagrams showing the offset of a light-emitting device in the prior art;

[0034] Figure 1b This is the second schematic diagram of the offset of a light-emitting device in the prior art;

[0035] Figure 2 This is a schematic diagram of the structure of the display panel provided in an embodiment of this application;

[0036] Figure 3 This is a schematic diagram of the structure of the accommodating cavity provided in an embodiment of this application;

[0037] Figure 4 This is a schematic diagram showing the connection between the light-emitting device and the pad provided in an embodiment of this application;

[0038] Figure 5 One of the schematic diagrams of the accommodating structure provided in the embodiments of this application;

[0039] Figure 6 One of the top views of the pads provided in the embodiments of this application;

[0040] Figure 7 A second top view of the pads provided in an embodiment of this application;

[0041] Figure 8 A second schematic diagram of the accommodating structure provided in the embodiments of this application;

[0042] Figure 9 One of the top views of the baffle layer provided in the embodiments of this application;

[0043] Figure 10 A second top view of the baffle layer provided in the embodiments of this application;

[0044] Figure 11 This is the third schematic diagram of the accommodating structure provided in the embodiments of this application;

[0045] Figure 12 One of the top views of the baffle provided in the embodiments of this application;

[0046] Figure 13 A second top view of the baffle provided in an embodiment of this application;

[0047] Figure 14 A third top view of the baffle provided for embodiments of this application;

[0048] Figure 15 Fourth top view of the baffle provided in the embodiments of this application;

[0049] Figure 16 A schematic flowchart illustrating the manufacturing method of the display panel provided in this application embodiment;

[0050] Figure 17 This is one of the schematic diagrams of a sub-step of step S200 provided in an embodiment of this application;

[0051] Figure 18 This is one of the manufacturing process diagrams of the receiving cavity provided in the embodiments of this application;

[0052] Figure 19The second process diagram for manufacturing the accommodating cavity provided in the embodiments of this application;

[0053] Figure 20 This is the second schematic diagram of a sub-step of step S200 provided in the embodiments of this application;

[0054] Figure 21 The third process diagram for manufacturing the accommodating cavity provided in the embodiments of this application;

[0055] Figure 22 Fourth of the manufacturing process diagrams for the accommodating cavity provided in the embodiments of this application;

[0056] Figure 23 The third schematic diagram of the sub-steps of step S200 provided in the embodiments of this application;

[0057] Figure 24 Fifth of the process diagrams for manufacturing the accommodating cavity provided in the embodiments of this application;

[0058] Figure 25 This is the sixth process diagram for manufacturing the accommodating cavity provided in the embodiments of this application.

[0059] Icons: 100-Driver backplane; 200-Pad; 210-Metal layer; 300-Light-emitting device; 410-Accommodation structure; 411-Recess; 412-Accommodation opening; 420-Accommodation cavity; 500-Baffle layer; 600-Baffle. Detailed Implementation

[0060] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0061] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0062] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0063] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0064] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0065] The inventor discovered through research that... (Please refer to...) Figure 1a and Figure 1b After the light-emitting device 300' (such as Mini LED or Micro-LED) is transferred to the driver backplane, the light-emitting device 300' may experience a positional misalignment. A large misalignment may lead to poor connection between the light-emitting device 300' and the pad 200', or may cause short circuits, image quality defects, and other problems, reducing the transfer success rate and increasing manufacturing costs.

[0066] In view of this, this embodiment provides a solution that can solve the above problems. The specific implementation of this application will be described in detail below with reference to the accompanying drawings.

[0067] Please refer to Figure 2 , Figure 2 This embodiment provides a schematic structural diagram of a display panel. In this embodiment, the display panel may include a driving backplane 100, a pad assembly, and a light-emitting device 300. The light-emitting device 300 may be a Micro-LED or Mini LED chip. In this embodiment, the size of the light-emitting device 300 is not specifically limited.

[0068] The number of pad groups can be one or more. The pad groups can be located on one side of the driving backplate 100. Each pad group can include two pads 200. Each pad 200 has a receiving structure 410 on the side away from the driving backplate 100. The receiving structures 410 of the two pads 200 in the same pad group can cooperate to form a receiving cavity 420. The receiving cavity 420 can be used to receive the light-emitting device 300.

[0069] In this embodiment, the two pads 200 in each pad group are arranged opposite to each other. Optionally, the two pads 200 in the same pad group can be rectangular in shape, and have the same size and shape. The material of the pads 200 can be metal. The shape of the receiving cavity 420 formed by the receiving structure 410 of the two pads 200 in the same pad group can be cuboid.

[0070] In one possible implementation, please refer to Figure 3 The opening width W1 of the accommodating cavity 420 on the side close to the driving back plate 100 can be smaller than the opening width W2 of the accommodating cavity 420 on the side away from the driving back plate 100. In this way, when transferring the light-emitting device 300, it is convenient to place the light-emitting device 300 into the accommodating cavity 420.

[0071] The light-emitting device 300 can be disposed in the accommodating cavity 420 and electrically connected to the pad 200.

[0072] For example, please refer to Figure 4 The light-emitting device 300 may include a first pin and a second pin, which can be electrically connected to two pads 200 in the same pad group, respectively. For example, if the first electrode of the light-emitting device 300 is a positive electrode and the second electrode is a negative electrode, and the two pads 200 in the same pad group can be a P electrode and an N electrode, then the first electrode of the light-emitting device 300 can be electrically connected to the P electrode, and the second electrode of the light-emitting device 300 can be electrically connected to the N electrode.

[0073] The light-emitting device 300 may include a first-color light-emitting device, a second-color light-emitting device, and a third-color light-emitting device. The first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device may be different from each other. For example, the light-emitting colors of the first-color light-emitting device, the second-color light-emitting device, and the third-color light-emitting device may be one of red, green, and blue, respectively.

[0074] In the above structure, by setting a receiving structure 410 on the side of the pad 200 away from the drive backplate 100, and by cooperating the receiving structures 410 of two pads 200 in the same pad group to form a receiving cavity 420, the light-emitting device 300 is transferred into the receiving cavity 420. The receiving cavity 420 can limit the light-emitting device 300, which can prevent the light-emitting device 300 from being misaligned, make the light-emitting device 300 electrically connected to the pad 200, improve the transfer success rate of the light-emitting device 300, improve the image quality problem of inconsistent light emission pattern caused by the misalignment of the light-emitting device 300, and at the same time shorten the production cycle and reduce the production cost.

[0075] In one possible implementation, please refer to Figure 5The accommodating structure 410 may include a recess 411 recessed from the side of the pad 200 away from the drive back plate 100 toward the drive back plate 100, and the recesses 411 of two pads 200 in the same pad group approach each other to form an accommodating cavity 420.

[0076] In this embodiment, in the direction perpendicular to the driving backplate 100, the depth of the accommodating cavity 420 can be greater than half the thickness of the light-emitting device 300, and the depth of the accommodating cavity 420 can be less than the thickness of the pad 200. Thus, while limiting the position of the light-emitting device 300, an electrical connection between the light-emitting device 300 and the pad 200 can be achieved. For example, when the thickness of the light-emitting device 300 is 8 micrometers, the depth of the accommodating cavity 420 can be greater than or equal to 4 micrometers.

[0077] In one possible implementation, please refer to Figure 6 The two pads 200 in the same pad group have the same shape and size of recess 411. The length of the accommodating cavity 420 formed by the two recesses 411 can be equal to the length of the light-emitting device 300. The width of the accommodating cavity 420 formed by the two recesses 411 can be greater than the width of the light-emitting device 300 (e.g., the width of the accommodating cavity 420 formed by the two recesses 411 can be equal to the width of the pad 200). The orthographic projection of the light-emitting device 300 on the driving backplate 100 can be located within the orthographic projection of the accommodating cavity 420 on the driving backplate 100. In this way, when the light-emitting device 300 is transferred into the accommodating cavity 420, the two recesses 411 can limit the light-emitting device 300 in the length direction of the light-emitting device 300, prevent the light-emitting device 300 from shifting, and ensure that the light-emitting device 300 is electrically connected to the first pad 201 and the second pad 202 through the first pin and the second pin.

[0078] In another possible implementation, please refer to Figure 7 The two pads 200 in the same pad group have the same shape and size of recess 411. The size and shape of the receiving cavity 420 formed by the two recesses 411 can be the same as the size and shape of the light-emitting device 300. The orthographic projection of the light-emitting device 300 on the driving back plate 100 coincides with the orthographic projection of the receiving cavity 420 on the driving back plate 100. The orthographic projection of the light-emitting device 300 on the driving back plate 100 can completely cover the orthographic projection of the two recesses 411 on the driving back plate 100. The orthographic projection area of ​​the light-emitting device 300 on the driving back plate 100 can be larger than the orthographic projection area of ​​the two recesses 411 on the driving back plate 100. In this way, when the light-emitting device 300 is transferred into the receiving cavity 420, the light-emitting device 300 can be limited to prevent the light-emitting device 300 from shifting.

[0079] In one possible implementation, please refer to Figure 8The accommodating structure 410 may include a baffle layer 500 disposed on the side of the pad 200 away from the drive backplate 100. The baffle layer 500 may include an accommodating opening 412 exposing the pad 200. The accommodating openings 412 on the baffle layers 500 on two pads 200 in the same pad group are disposed opposite to each other to form an accommodating cavity 420.

[0080] In this embodiment, the baffle layer 500 is reflective. Therefore, when the light-emitting device 300 is placed in the accommodating cavity 420, the baffle layer 500 can reflect the light emitted from the side of the light-emitting device 300, which can prevent the light emitted by the light-emitting device 300 from being too dispersed, thereby improving the light emission efficiency of the display panel.

[0081] In the direction perpendicular to the driving backplate 100, the thickness of the baffle layer 500 can be greater than half the thickness of the light-emitting device 300, and the thickness of the baffle layer 500 can be less than the thickness of the light-emitting device 300. For example, when the thickness of the light-emitting device 300 is 8 micrometers, the thickness of the baffle layer 500 can be greater than or equal to 4 micrometers and less than or equal to 8 micrometers.

[0082] In one possible implementation, please refer to Figure 9 The length of the cavity 420 formed by the accommodating opening 412 of the baffle layer 500 can be equal to the length of the light-emitting device 300, and the width of the cavity 420 formed by the accommodating opening 412 of the baffle layer 500 can be greater than the width of the light-emitting device 300 (e.g., the width of the cavity 420 formed by the accommodating opening 412 of the baffle layer 500 can be equal to the width of the pad 200). The orthographic projection of the light-emitting device 300 on the driving backplate 100 can be located within the orthographic projection of the cavity 420 on the driving backplate 100. Thus, when the light-emitting device 300 is transferred into the cavity 420, the baffle layer 500 can be located on two opposite sides of the light-emitting device 300 to limit the light-emitting device 300, prevent the light-emitting device 300 from shifting, and ensure that the light-emitting device 300 is electrically connected to the first pad 201 and the second pad 202 through the first pin and the second pin.

[0083] In another possible implementation, please refer to Figure 10 The size and shape of the receiving cavity 420 formed by the receiving opening 412 of the baffle layer 500 can be the same as the size and shape of the light-emitting device 300. The orthographic projection of the light-emitting device 300 on the driving back plate 100 coincides with the orthographic projection of the receiving cavity 420 on the driving back plate 100. In this way, when the light-emitting device 300 is transferred into the receiving cavity 420, the light-emitting device 300 can be limited to prevent the light-emitting device 300 from shifting.

[0084] In one possible implementation, please refer to Figure 11The accommodating structure 410 may include a baffle 600 disposed on the side of the pad 200 away from the drive backplate 100. The baffles 600 of two pads 200 in the same pad group are disposed opposite to each other, and an accommodating cavity 420 may be formed between the baffles 600 of the two pads 200.

[0085] In this embodiment, the baffle 600 is reflective. Therefore, when the light-emitting device 300 is placed in the accommodating cavity 420, the baffle layer 500 can reflect the light emitted from the side of the light-emitting device 300, which can prevent the light emitted by the light-emitting device 300 from being too dispersed, thereby improving the light emission efficiency of the display panel.

[0086] In the direction perpendicular to the drive backplate 100, the height of the baffle 600 can be greater than half the thickness of the light-emitting device 300, and the height of the baffle 600 can be less than the thickness of the light-emitting device 300. For example, when the thickness of the light-emitting device 300 is 8 micrometers, the height of the baffle 600 can be greater than or equal to 4 micrometers and less than or equal to 8 micrometers.

[0087] In one possible implementation, please refer to Figure 12 The shape of the baffles 600 of the two pads 200 in the same pad group on the drive back plate 100 can be straight, and the distance between the two baffles 600 can be equal to the length of the light-emitting device 300. The length of the baffle 600 in its extension direction can be greater than the width of the light-emitting device 300. The orthogonal projection of the light-emitting device 300 on the drive back plate 100 can be located between the orthogonal projections of the baffles 600 of the two pads 200 on the drive back plate 100. When the light-emitting device 300 is transferred into the receiving cavity 420, the baffles 600 of the two pads 200 in the same pad group can be located on two opposite sides of the light-emitting device 300 to limit the light-emitting device 300, prevent the light-emitting device 300 from shifting, and ensure that the light-emitting device 300 is electrically connected to the first pad 201 and the second pad 202 through the first pin and the second pin.

[0088] It should be noted that when the shape of the orthographic projection of the baffle 600 on the drive back plate 100 is a straight line, the length of the baffle 600 in its extension direction can be greater than the width of the light-emitting device 300, or it can be equal to or less than the width of the light-emitting device 300, as long as the baffle 600 can limit the light-emitting device 300, no specific limitation is made here.

[0089] In one possible implementation, please refer to Figure 13The baffles 600 of the two pads 200 in the same pad group can be located at opposite corners of the light-emitting device 300. The orthographic projections of the baffles 600 of the two pads 200 in the same pad group on the driving backplate 100 can both be L-shaped. The orthographic projection of the light-emitting device 300 on the driving backplate 100 can be located between the orthographic projections of the baffles 600 of the two pads 200 on the driving backplate 100.

[0090] In one possible implementation, please refer to Figure 14 Each of the two pads 200 in the same pad group is provided with two baffles 600. That is, the same pad group can include four baffles 600. The four baffles 600 can be located at the four corners of the light-emitting device 300. The orthographic projection of the four baffles 600 on the driving backplate 100 can be L-shaped. The orthographic projection of the light-emitting device 300 on the driving backplate 100 can be located between the orthographic projections of the baffles 600 of the two pads 200 on the driving backplate 100.

[0091] In one possible implementation, please refer to Figure 15 The shape of the orthographic projection of the baffles 600 of the two pads 200 in the same pad group onto the drive back plate 100 can both be U-shaped, and the size and shape of the accommodating cavity 420 formed between the two baffles 600 can be the same as the shape and size of the light-emitting device 300. The orthographic projection of the light-emitting device 300 onto the drive back plate 100 can be located between the orthographic projections of the baffles 600 of the two pads 200 onto the drive back plate 100. When the light-emitting device 300 is transferred into the accommodating cavity 420, the baffles 600 of the two pads 200 in the same pad group can limit the light-emitting device 300 to prevent the light-emitting device 300 from shifting.

[0092] It should be noted that, in the direction parallel to the drive backplane 100, the shape of the baffle 600 of the two pads 200 in the same pad group is not limited to the straight line, L-shape, or U-shape. The shape of the baffle 600 can be determined according to actual needs, as long as the baffle 600 can limit the light-emitting device 300. No specific limitation is made here.

[0093] This application also provides a method for manufacturing a display panel, please refer to... Figure 16 The method for manufacturing the display panel may include the following steps.

[0094] Step S100: Provide a drive backplane 100.

[0095] In this embodiment, the driving backplane 100 may include multiple film layer structures, such as a substrate, a buffer layer, an active layer, multiple metal layers, multiple insulating layers, and a planarization layer.

[0096] In step S200, at least one pad group is provided on one side of the drive backplate 100. The at least one pad group includes two pads 200. A receiving structure 410 is provided on the side of the pad 200 away from the drive backplate 100. The receiving structures 410 of the two pads 200 in the same pad group cooperate to form a receiving cavity 420.

[0097] In this embodiment, one or more pad groups can be provided on one side of the driving backplate 100. Each pad group includes two oppositely arranged pads 200. The accommodating structure 410 of the two oppositely arranged pads 200 can form an accommodating cavity 420, which can be used to place the light-emitting device 300. The two pads 200 of each pad group can be a P electrode and an N electrode, respectively.

[0098] Step S300: Transfer the light-emitting device 300 into the accommodating cavity 420.

[0099] In this embodiment, when transferring the light-emitting device 300 to the accommodating cavity 420, alignment can be performed first, and then the light-emitting device 300 can be transferred. In this way, it can be ensured that the light-emitting device 300 can be transferred into the accommodating cavity 420 and make contact with the pad 200.

[0100] In step S400, the pins of the light-emitting device 300 are electrically connected to the pad 200 by soldering or bonding.

[0101] In this embodiment, the two pins of the light-emitting device 300 can be electrically connected to the two pads 200 respectively by soldering or bonding.

[0102] It should be noted that during the transfer of the light-emitting device 300, if the picked-up light-emitting device 300 is misaligned, the light-emitting device 300 cannot be transferred into the receiving cavity 420, and the misaligned light-emitting device 300 cannot be bonded. Therefore, the misaligned light-emitting device 300 can be directly screened out, thereby reducing the detection time of the transferred light-emitting device 300, reducing the detection pressure at the back end, and improving production efficiency.

[0103] In the above design, the accommodating structures 410 of the two pads 200 in the same pad group can cooperate to form an accommodating cavity 420. The accommodating cavity 420 can fix the light-emitting device 300 after transfer, reduce the possibility of the light-emitting device 300 being misaligned after transfer, and thus improve the transfer success rate.

[0104] In one possible implementation, please refer to Figure 17 Step S200 may include the following sub-steps.

[0105] Step S211, deposit a metal layer 210 on one side of the drive backplate 100.

[0106] In step S212, the metal layer 210 is etched to form a pad 200 with a recess 411. The recess 411 is recessed from the side of the pad 200 away from the drive backplate 100 toward the drive backplate 100. The recesses 411 of two pads 200 in the same pad group are close to each other to form the receiving cavity 420.

[0107] In one possible implementation, please refer to Figure 18 First, a metal layer 210 can be deposited on one side of the driving backplate 100. The metal layer 210 can completely cover the surface of the driving backplate 100. Then, the metal layer 210 is etched to form multiple pad groups. Each pad group includes two pads 200. Finally, each pad 200 is etched to form a recess 411 on the pad 200 that is recessed from the side of the pad 200 away from the driving backplate 100 toward the driving backplate 100. The recesses 411 of the two pads 200 in the same pad group can form a receiving cavity 420 for placing the light-emitting device 300.

[0108] In another possible implementation, please refer to Figure 19 First, a metal layer 210 can be deposited on one side of the driving backplate 100. The metal layer 210 can completely cover the surface of the driving backplate 100. Then, the metal layer 210 is etched for the first time to form a plurality of recesses 411. Finally, the metal layer 210 is etched for the second time to form a plurality of pad groups. Each pad group includes two pads 200. Each pad 200 can include a recess 411 that is recessed into the driving backplate 100 from the side of the pad 200 away from the driving backplate 100. The recesses 411 of the two pads 200 in the same pad group can form a receiving cavity 420 for placing the light-emitting device 300.

[0109] In this embodiment, the etching depth can be controlled by adjusting the etching time, gas flow rate, gas concentration, etc. of the metal layer 210. For example, when the gas flow rate and gas concentration are the same, the etching time for etching the metal layer 210 to form the recess 411 can be less than the etching time for etching the metal layer 210 to form the pad 200.

[0110] In one possible implementation, please refer to Figure 20 Step S200 may include the following sub-steps.

[0111] Step S221: Deposit a metal layer 210 and a baffle layer 500 on one side of the drive backplate 100.

[0112] Step S222: Etch the metal layer 210 and the baffle layer 500 respectively to form a pad 200 with a receiving structure 410. The receiving structure 410 includes a baffle layer 500 disposed on the side of the pad 200 away from the drive backplate 100. The baffle layer 500 includes a receiving opening 412 that exposes the pad 200. The receiving openings 412 of the baffle layers 500 on two pads 200 in the same pad group are arranged opposite each other to form the receiving cavity 420.

[0113] In one possible implementation, please refer to Figure 21 First, a metal layer 210 can be deposited on one side of the driving backplate 100, and the metal layer 210 can be etched to form multiple pad groups, each pad group including two pads 200. Then, a baffle layer 500 material can be deposited on the side of the pad 200 away from the driving backplate 100 to form a baffle layer 500. Finally, the baffle layer 500 can be etched to form an accommodating opening 412 exposing the pad 200. The accommodating opening 412 of the baffle layer 500 on the two pads 200 in the same pad group can form an accommodating cavity 420 for placing the light-emitting device 300.

[0114] In another possible implementation, please refer to Figure 22 First, a metal layer 210 can be deposited on one side of the driving backplate 100. Then, a baffle layer 500 material can be deposited on the side of the metal layer 210 away from the driving backplate 100 to form a baffle layer 500. Next, the baffle layer 500 is etched to form multiple accommodating openings 412 that expose the metal layer 210. Finally, the metal layer 210 is etched to form multiple pad groups. Each pad group includes two pads 200. The accommodating openings 412 of the baffle layer 500 on the two pads 200 in the same pad group can form an accommodating cavity 420 for placing the light-emitting device 300.

[0115] In this embodiment, the material of the baffle layer 500 may include inorganic materials, organic materials, metals, etc. For different materials, the etching gas and etching equipment used when etching the baffle layer 500 may be different.

[0116] In one possible implementation, please refer to Figure 23 Step S200 may include the following sub-steps.

[0117] Step S231: Deposit a metal layer 210 and a baffle layer 500 on one side of the drive backplate 100.

[0118] Step S232: Etch the metal layer 210 and the baffle layer 500 respectively to form a pad 200 with a receiving structure 410. The receiving structure 410 includes a baffle layer 500 disposed on the side of the pad 200 away from the drive backplate 100, and a baffle 600 disposed on the side of the pad 200 away from the drive backplate 100. The baffles 600 of two pads 200 in the same pad group are disposed opposite to each other, and the receiving cavity 420 is formed between the baffles 600 of the two pads 200.

[0119] In one possible implementation, please refer to Figure 24 First, a metal layer 210 can be deposited on one side of the driving backplate 100, and the metal layer 210 can be etched to form multiple pad groups, each pad group including two pads 200. Then, a baffle layer 500 material can be deposited on the side of the pad 200 away from the driving backplate 100 to form a baffle layer 500. Finally, the baffle layer 500 can be etched to form a baffle 600. An accommodating cavity 420 for placing the light-emitting device 300 can be formed between the baffles 600 on the two pads 200 in the same pad group.

[0120] In another possible implementation, please refer to Figure 25 First, a metal layer 210 can be deposited on one side of the driving backplate 100. Then, a baffle layer 500 material can be deposited on the side of the metal layer 210 away from the driving backplate 100 to form a baffle layer 500. Next, the baffle layer 500 is etched to form a baffle 600. Finally, the metal layer 210 is etched to form multiple pad groups. Each pad group includes two pads 200. A receiving cavity 420 for placing the light-emitting device 300 can be formed between the baffles 600 on the two pads 200 in the same pad group.

[0121] In summary, the embodiments of this application provide a display panel and its manufacturing method. By setting an accommodating structure on the side of the pads away from the driving backplate, and forming an accommodating cavity by cooperating the accommodating structures of two pads in the same pad group, the light-emitting device is transferred into the accommodating cavity. The accommodating cavity can limit the light-emitting device, which can prevent the light-emitting device from being misaligned, make the light-emitting device electrically connected to the pads, improve the success rate of light-emitting device transfer, improve the image quality problem of inconsistent light emission patterns caused by light-emitting device misalignment, and shorten the production cycle and reduce production costs.

[0122] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0123] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized by, The application relates to a driving backboard and a method for manufacturing the same. The driving backboard comprises: at least one pad group arranged on one side of the driving backboard, wherein each pad group comprises two pads, and each pad is provided with a containing structure on the side away from the driving backboard, and the containing structures of the two pads in the same pad group are matched to form a containing cavity; a light-emitting device arranged in the containing cavity and electrically connected with the pads.

2. The display panel of claim 1, wherein, The containing structure comprises a recessed part recessed from the pad to the driving backboard on the side away from the driving backboard, and the recessed parts of the two pads in the same pad group are close to each other to form the containing cavity. Preferably, the orthographic projection of the light-emitting device on the driving backboard is located in the orthographic projection of the containing structure on the driving backboard.

3. The display panel of claim 1, wherein, The containing structure comprises a baffle layer arranged on the side of the pad away from the driving backboard, and the baffle layer comprises a containing opening exposing the pad, and the containing openings of the baffle layers on the two pads in the same pad group are oppositely arranged to form the containing cavity. Preferably, the orthographic projection of the light-emitting device on the driving backboard is located in the orthographic projection of the containing structure on the driving backboard.

4. The display panel of claim 1, wherein, The containing structure comprises a baffle arranged on the side of the pad away from the driving backboard, and the baffles of the two pads in the same pad group are oppositely arranged, and the containing cavity is formed between the baffles of the two pads. Preferably, the orthographic projection of the light-emitting device on the driving backboard is located in the orthographic projection of the containing structure on the driving backboard.

5. The display panel of claim 3 or 4, wherein, Preferably, the baffle layer or the baffle has a light-reflecting property.

6. The display panel of claim 1, wherein, In the direction perpendicular to the driving backboard, the depth of the containing cavity is greater than one half of the thickness of the light-emitting device.

7. A manufacturing method of a display panel, comprising: The method comprises: providing a driving backboard; arranging at least one pad group on one side of the driving backboard, wherein each pad group comprises two pads, and each pad is provided with a containing structure on the side away from the driving backboard, and the containing structures of the two pads in the same pad group are matched to form a containing cavity; transferring a light-emitting device into the containing cavity; electrically connecting the pins of the light-emitting device with the pads by welding or bonding.

8. The manufacturing method of a display panel according to claim 7, wherein, The step of arranging at least one pad group on one side of the driving backboard comprises: depositing a metal layer on one side of the driving backboard; etching the metal layer to form pads with recessed parts, wherein the recessed parts are recessed from the pads to the driving backboard on the side away from the driving backboard, and the recessed parts of the two pads in the same pad group are close to each other to form the containing cavity.

9. The manufacturing method of a display panel according to claim 7, wherein, The step of arranging at least one pad group on one side of the driving backboard comprises: depositing a metal layer and a baffle layer on one side of the driving backboard respectively; etching the metal layer and the baffle layer respectively to form pads with containing structures, wherein the containing structure comprises a baffle layer arranged on the side of the pad away from the driving backboard, and the baffle layer comprises a containing opening exposing the pad, and the containing openings of the baffle layers on the two pads in the same pad group are oppositely arranged to form the containing cavity.

10. The manufacturing method of a display panel according to claim 7, wherein, The step of arranging at least one pad group on one side of the driving backboard comprises: Depositing a metal layer and a baffle layer on one side of the driving backboard respectively; Etching the metal layer and the baffle layer respectively to form a pad with a containing structure, the containing structure comprising a baffle layer arranged on the side of the pad away from the driving backboard, the containing structure comprising a baffle arranged on the side of the pad away from the driving backboard, the baffles of two pads in the same pad group being arranged oppositely, and the containing cavity being formed between the baffles of the two pads.

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