Integrated circuit chip packaging processing device and method

Abstract

The invention discloses an integrated circuit chip packaging processing device, and relates to the technical field of chip packaging, the integrated circuit chip packaging processing device comprises a workbench, a glue injection mechanism, a conveying mechanism and a bearing disc, the top end of the workbench is fixedly connected with a fixing frame, the fixing frame is provided with a moving table capable of horizontally reciprocating, the glue injection mechanism is arranged between the workbench and the moving table, and the conveying mechanism is arranged on the bearing disc. The conveying mechanism is arranged on the workbench, and the bearing disc is arranged on the workbench in a displacement mode through the conveying mechanism. By means of the arrangement mode that the moving table, the glue injection mechanism and the conveying mechanism are matched, glue injection operation can be sequentially conducted in the mold grooves in the bearing disc through the glue injection mechanism, and meanwhile the bearing disc can be driven to conduct reciprocating displacement in the horizontal direction when the conveying mechanism conducts displacement; therefore, the glue solution can be uniformly coated in the mold groove, the mechanical strength, the electrical performance and the long-term reliability of the chip are improved, and the defect rate of an integrated circuit chip packaging process is effectively reduced.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of chip packaging, in particular to an integrated circuit chip packaging device and method. BACKGROUND

[0002] In the integrated circuit chip packaging, after the chip mounting and fine wire bonding are completed, the bare chip and the fragile wire are completely exposed, which are easily damaged physically, corroded and contaminated. Therefore, the epoxy resin or other molding compound must be injected into the mold and solidified to form a solid protective shell through the glue injection process, which not only provides mechanical support and sealing for the chip, but also ensures its long-term reliable operation, and is a key step to determine the product life.

[0003] The current glue injection process generally uses a driving mechanism to control the movement of the glue dispenser to a predetermined position for glue dispensing. However, this method cannot achieve continuous or trajectory movement of glue injection along the surface of the semiconductor chip during glue dispensing, resulting in uneven distribution of glue on the chip surface, forming local accumulation or incomplete coverage. Such uneven glue layer will directly affect the adhesion strength and bonding consistency between the chip and the substrate, and further reduce the reliability of the packaging structure and the product yield. SUMMARY

[0004] The purpose of the present application is to provide an integrated circuit chip packaging device and method to solve the problems raised in the background.

[0005] To achieve the above purpose, the present application provides the following technical scheme: an integrated circuit chip packaging device, comprising:

[0006] A workbench, a fixed frame is fixedly connected to the top end of the workbench, and a movable table capable of horizontal reciprocating displacement is arranged on the fixed frame;

[0007] A glue injection mechanism is arranged between the workbench and the movable table;

[0008] A conveying mechanism is arranged on the workbench;

[0009] A carrier disc is arranged on the workbench by the conveying mechanism.

[0010] Preferably, the glue injection mechanism comprises:

[0011] A glue storage tank is fixedly connected to the outer wall of the workbench;

[0012] A glue injection pipe is arranged in the interior of the movable table;

[0013] A pump body is fixedly installed at the top end of the glue storage tank;

[0014] A delivery pipe, one end of which is fixedly connected with the output end of the pump body, and the other end of which is fixedly connected with the glue injection pipe;

[0015] A sliding rod, both sides of the inner wall of the moving table are provided with sliding grooves, and the end of the sliding rod is fixedly connected with the inner wall of the sliding groove;

[0016] A sliding block, which is slidingly connected with the sliding rod and is fixedly connected with both sides of the glue injection pipe;

[0017] A first compression spring, which is sleeved on the outside of the sliding rod;

[0018] A driving assembly, which is arranged in the inside of the moving table and is used for driving the displacement of the glue injection pipe;

[0019] A shaking assembly, which is arranged in the inside of the glue injection pipe and the sliding block and is used for eliminating the air bubbles in the glue solution.

[0020] Preferably, the driving assembly comprises:

[0021] A cylinder, which is fixedly installed at the top end of the inner wall of the moving table;

[0022] A pressing block, which is in transmission connection with the output end of the cylinder and is in cooperation with the glue injection pipe.

[0023] Preferably, the shaking assembly comprises:

[0024] A partition plate, which is fixedly connected with the inside of the glue injection pipe;

[0025] A rotating rod, one end of which is in rotating connection with the glue injection pipe, and the other end of which is in rotating connection with the partition plate;

[0026] A rotating plate, which is in fixed connection with the rotating rod;

[0027] A connecting rope, which is fixedly connected with the bottom end of the rotating plate;

[0028] A knocking ball, which is fixedly connected with the bottom end of the connecting rope.

[0029] Preferably, the shaking assembly further comprises:

[0030] A pressing plate, which is arranged in the inside of the sliding block and in the inside of the pressing groove;

[0031] A rack plate, which is in fixed connection with the pressing plate;

[0032] A roller, which is fixedly connected with one end of the rack plate, and one side of the inner wall of the sliding groove is provided with a wave groove, and the roller is used for abutting against the inner wall of the wave groove;

[0033] A gear is fixedly connected with the rotating rod, and the gear is in meshing connection with the rack plate.

[0034] A second compression spring is sleeved on the outside of the extruding rod, one end of the second compression spring is fixedly connected with the extruding plate, and the other end of the second compression spring is fixedly connected with the inner wall of the extruding groove.

[0035] Preferably, the conveying mechanism comprises:

[0036] A motor is fixedly installed on the outer wall of the workbench.

[0037] A driving rod, a groove is formed in the top end of the workbench, the end of the driving rod is in rotational penetrating connection with the inner wall of the groove, and the output end of the motor is in transmission connection with the driving rod.

[0038] A driving block is in screw transmission with the driving rod.

[0039] A conveying seat is fixedly connected to the top end of the driving block, and is used for conveying the bearing disc.

[0040] Preferably, the conveying mechanism further comprises:

[0041] A fixed plate is symmetrically fixedly connected to the top end of the workbench.

[0042] An extruding rod is in sliding penetrating connection with the two sides of the inner wall of the conveying seat, and a through groove for the sliding of the extruding rod is formed in one side of the fixed plate.

[0043] A guide block is fixedly connected to the top end and the bottom end of the extruding rod, and a guide groove for the displacement of the guide block is formed in the top end and the bottom end of the inner wall of the through groove.

[0044] A displacement plate is fixedly connected to one end of the extruding rod, and the displacement plate is located in the interior of the conveying seat.

[0045] A connecting assembly is arranged in the interior of the displacement plate, and is used for connecting the conveying seat and the bearing disc.

[0046] Preferably, the connecting assembly comprises:

[0047] A connecting plate, a connecting groove is formed in the top end of the displacement plate, and the connecting plate is in sliding penetrating connection with the inner cavity of the connecting groove.

[0048] A magnetic strip is fixedly connected to the top end of the connecting plate, and a fixed groove for matching the magnetic strip is symmetrically formed in the bottom end of the bearing disc.

[0049] The third compression spring has one end fixedly connected to the connecting plate and the other end fixedly connected to the bottom end of the inner wall of the connecting groove.

[0050] Preferably, a controller is fixedly connected to the outer wall of the workbench, and the controller is used to control the start and stop of the pump body, cylinder and motor.

[0051] The present invention also provides a method of using an integrated circuit chip packaging and processing apparatus, comprising the following specific steps:

[0052] Step 1: Place the carrier tray on the conveyor seat and fix it by magnetic adsorption of the connecting component. Start the device, and the motor of the conveyor mechanism will work to transport the carrier tray to the bottom of the glue injection station through the drive rod and drive block.

[0053] Step 2: The cylinder of the drive component is activated, pushing the extrusion block down to press the injection tube. The injection tube moves downward against the elastic force of the first compression spring, and its end precisely extends into the target mold groove of the carrier plate.

[0054] Step 3: During the descent of the glue injection tube, the vibration component works, the roller rolls along the wave groove, and drives the rotating rod to rotate forward and backward through the rack plate and gear, so that the striking ball swings and strikes the inner wall of the glue injection tube, physically vibrating the glue in the tube to achieve defoaming. At the same time, the pump body starts, pumping the glue in the glue storage tank into the glue injection tube through the delivery pipe to complete the glue injection operation.

[0055] Step 4: During or after glue injection, the conveying mechanism continues to work. During the linear motion of the conveying seat driven by the motor, the guide groove on the fixed plate, through cooperation with the guide block, forces the extrusion rod to drive the displacement plate and the bearing plate to reciprocate in the horizontal direction, so that the glue in the mold groove flows and is distributed more evenly.

[0056] Step 5: After the glue injection and even glue application are completed, the cylinder retracts, the extrusion block rises, and the glue injection tube automatically retracts into the moving table under the elastic force of the first compression spring. The conveying mechanism moves the carrier plate to the next glue injection station or unloading station, and repeats steps 2 to 4 for continuous automated production.

[0057] The technical effects and advantages of this invention are as follows:

[0058] (1) The present invention utilizes the combination of a moving stage, a glue injection mechanism and a conveying mechanism. Not only can the glue injection mechanism sequentially inject glue into the mold groove on the carrier plate, but the conveying mechanism can also drive the carrier plate to move back and forth in the horizontal direction when it moves. This allows the glue to be evenly applied into the mold groove, thereby improving the fluidity and filling consistency of the glue in the mold, avoiding the generation of air bubbles or cavities. The uniform glue layer ensures the integrity of the package structure and uniform heat dissipation, thereby improving the mechanical strength, electrical performance and long-term reliability of the chip, and effectively reducing the defect rate of the integrated circuit chip packaging process.

[0059] (2) The present invention utilizes a combination of a drive component and an oscillation component. The drive component can not only drive the dispensing tube to perform dispensing operations, but also the oscillation component can tap the inner wall of the dispensing tube at multiple points before and after dispensing. This physical oscillation causes air bubbles in the glue to rise and break, thus achieving defoaming treatment. This ensures uniform dispensing without air bubbles, fundamentally improving the compactness and electrical insulation performance of the encapsulated body and enhancing product reliability. Attached Figure Description

[0060] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used together with the embodiments of the invention to explain the invention, but do not constitute a limitation thereof. In the drawings:

[0061] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0062] Figure 2 This is a schematic diagram of the overall partial structure of the present invention;

[0063] Figure 3 This is one of the schematic diagrams of the overall partial frontal internal structure of the present invention;

[0064] Figure 4 This is a schematic diagram of the internal structure of the mobile station of the present invention from the front.

[0065] Figure 5 For the present invention Figure 4 Enlarged structural diagram at point A in the middle;

[0066] Figure 6 This is a second schematic diagram of the overall partial frontal internal structure of the present invention;

[0067] Figure 7 This is a top view of the internal structure of the conveying mechanism of the present invention;

[0068] Figure 8 For the present invention Figure 7 Enlarged structural diagram at point B;

[0069] Figure 9 For the present invention Figure 6 Enlarged structural diagram at point C.

[0070] In the attached image:

[0071] 1. Workbench; 2. Fixed frame; 3. Moving table; 4. Glue dispensing mechanism; 41. Glue storage tank; 42. Glue dispensing pipe; 43. Pump body; 44. Material conveying pipe; 45. Slide rod; 46. Slider; 47. First compression spring; 48. Drive assembly; 481. Cylinder; 482. Extrusion block; 49. Vibration assembly; 491. Partition plate; 492. Rotating rod; 493. Rotating plate; 494. Connecting rope; 495. Striking ball; 496. 497. Extrusion plate; 498. Rack plate; 499. Roller; 491. Gear; 4910. Second compression spring; 5. Conveying mechanism; 51. Motor; 52. Drive rod; 53. Drive block; 54. Conveying seat; 55. Fixing plate; 56. Extrusion rod; 57. Guide block; 58. Displacement plate; 59. Connecting assembly; 591. Connecting plate; 592. Magnetic strip; 593. Third compression spring; 6. Bearing plate; 7. Controller. Detailed Implementation

[0072] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0073] This invention provides, for example Figures 1-9 The integrated circuit chip packaging and processing apparatus shown includes a worktable 1, a dispensing mechanism 4, a conveying mechanism 5, and a carrier plate 6. A fixed frame 2 is fixedly connected to the top of the worktable 1. A movable stage 3 that can move horizontally back and forth is set on the fixed frame 2. The movable stage 3 is generally driven by a transmission component such as an electric screw or a tank chain to move horizontally on the fixed frame 2. The dispensing mechanism 4 is set between the worktable 1 and the movable stage 3. The conveying mechanism 5 is set on the worktable 1. The carrier plate 6 is moved and set on the worktable 1 by the conveying mechanism 5. The dispensing mechanism 4 sequentially dispenses glue into the mold groove on the carrier plate 6. At the same time, when the conveying mechanism 5 moves, it can also drive the carrier plate 6 to move horizontally back and forth, so that the glue can be evenly applied into the mold groove, thereby improving the flowability and filling consistency of the glue in the mold, avoiding the generation of air bubbles or cavities. The uniform glue layer ensures the integrity of the package structure and uniform heat dissipation, thereby improving the mechanical strength, electrical performance and long-term reliability of the chip, and effectively reducing the defect rate of the integrated circuit chip packaging process.

[0074] Specifically, the glue dispensing mechanism 4 includes a glue storage tank 41, a glue dispensing pipe 42, a pump body 43, a material conveying pipe 44, a slide bar 45, a slider 46, a first compression spring 47, a drive assembly 48, and a vibration assembly 49. The glue storage tank 41 is fixedly connected to the outer wall of the worktable 1; the glue dispensing pipe 42 is disposed inside the movable table 3; the pump body 43 is fixedly installed on the top of the glue storage tank 41; one end of the material conveying pipe 44 is fixedly connected to the output end of the pump body 43, and the other end of the material conveying pipe 44 is fixedly inserted and connected to the glue dispensing pipe 42. The material conveying pipe 44 is made of flexible hose, which can adapt to the lifting and lowering movement of the glue dispensing pipe 42. The relative displacement within the system avoids stress damage and leakage risks caused by rigid connections. Simultaneously, the hose effectively buffers fluid pulses and mechanical vibrations generated by the pump body 43, ensuring stable and uniform dispensing. It also simplifies internal wiring and maintenance / replacement processes, reduces the load and inertia of moving parts, and improves the response accuracy and lifespan of the actuator. Furthermore, the specialized hose material has good chemical compatibility with the adhesive, ensuring fluid purity and smooth delivery. This comprehensively improves the reliability, accuracy, and ease of operation of the dispensing process. The pump body 43 can extract the adhesive from the storage tank 41 and... The material is conveyed through the conveying pipe 44 to the inside of the dispensing pipe 42, and the dispensing operation is realized through the end of the dispensing pipe 42; both sides of the inner wall of the moving table 3 are provided with sliding grooves, and the end of the sliding rod 45 is fixedly connected to the inner wall of the sliding groove; the slider 46 is slidably inserted and connected to the sliding rod 45, and the slider 46 is fixedly connected to both sides of the dispensing pipe 42; the first compression spring 47 is sleeved on the outside of the sliding rod 45, and the first compression spring 47 always provides a stable upward elastic force to the dispensing pipe 42 through the slider 46, so that the top of the dispensing pipe 42 can be stably stored inside the moving table 3 when not in use. The dispensing mechanism 4 facilitates the displacement of the dispensing tube 42 by means of the drive component 48, which is located inside the moving stage 3. The drive component 48 is located inside the dispensing tube 42 and the slider 46 to eliminate air bubbles in the adhesive. The dispensing mechanism 4 integrates the sealed storage, quantitative pumping and precise application of the adhesive. The elastic reset system composed of the slide bar 45, the slider 46 and the first compression spring 47 ensures that the dispensing tube 42 can automatically retract when not in use, avoiding accidental collisions or contamination, and improving the safety, lifespan and ease of cleaning of the equipment.

[0075] Furthermore, the drive assembly 48 includes a cylinder 481 and an extrusion block 482. The cylinder 481 is fixedly installed on the top of the inner wall of the moving table 3. The output end of the cylinder 481 is connected to the extrusion block 482. The extrusion block 482 cooperates with the injection tube 42. The cylinder 481 drives the extrusion block 482 to move vertically, which facilitates the extrusion block 482 to extrude the injection tube 42. This allows the injection tube 42 to overcome the elastic force of the first compression spring 47 and extend into the interior of the bearing plate 6 to realize the injection operation. The cylinder 481 provides linear drive, which is direct, precise, and responsive. This ensures that the injection tube 42 is inserted into the mold with constant pressure and speed, achieving stable injection depth and starting conditions, and laying the foundation for obtaining a consistent glue shape.

[0076] Furthermore, the vibration assembly 49 includes a partition 491, a rotating rod 492, a rotating plate 493, a connecting rope 494, a striking ball 495, a pressing plate 496, a rack plate 497, a roller 498, a gear 499, and a second compression spring 4910. The partition 491 is fixedly connected to the inside of the glue injection tube 42; one end of the rotating rod 492 is rotatably inserted into the glue injection tube 42, and the other end of the rotating rod 492 is rotatably inserted into the partition 491; the rotating plate 493 is fixedly inserted into the rotating rod 492; the connecting rope 494 is fixedly connected to the bottom end of the rotating plate 493; and the striking ball 495 is fixedly connected to the bottom end of the connecting rope 494. The slider 46 has an extrusion groove inside, and the extrusion plate 496 is located inside the extrusion groove. The rack plate 497 is fixedly inserted and connected to the extrusion plate 496. The roller 498 is fixedly connected to one end of the rack plate 497. A wave groove is formed on one side of the inner wall of the groove, and the roller 498 is used to fit against the inner wall of the wave groove. The gear 499 is fixedly inserted and connected to the rotating rod 492, and the gear 499 is meshed with the rack plate 497. The second compression spring 4910 is sleeved on the outside of the extrusion rod 56. One end of the second compression spring 4910 is fixedly connected to the extrusion plate 496, and the other end of the second compression spring 4910 is fixedly connected to the inner wall of the extrusion groove. The second compression spring 4910 always provides a stable elastic force to the rack plate 497 through the extrusion plate 496, thereby enabling... This design allows the roller 498 to fit snugly against the inner wall of the corrugated groove. As the dispensing tube 42 moves vertically, the roller 498, under the elastic force of the second compression spring 4910, drives the gear 499 to rotate in both directions via the rack plate 497. This rotation in both directions causes the striking ball 495 under the rotating plate 493 to swing, thereby striking the inner wall of the dispensing tube 42 at multiple points. Through physical vibration, air bubbles in the glue rise and burst, achieving defoaming treatment. This ensures uniform dispensing without air bubbles, fundamentally improving the density and electrical insulation performance of the encapsulated body, and enhancing product reliability. The design cleverly utilizes the lifting and lowering motion of the dispensing tube 42 itself as a power source, eliminating the need for an additional drive or control system. The structure is ingenious, highly reliable, and cost-controllable.

[0077] Specifically, the conveying mechanism 5 includes a motor 51, a drive rod 52, a drive block 53, and a conveying seat 54. The motor 51 is fixedly installed on the outer wall of the worktable 1. A groove is provided at the top of the worktable 1, and the end of the drive rod 52 is rotatably inserted into the inner wall of the groove. The output end of the motor 51 is connected to the drive rod 52 for transmission. The drive block 53 and the drive rod 52 form a screw drive. The conveying seat 54 is fixedly connected to the top of the drive block 53 and is used to convey the carrier plate 6. The motor 51 can drive the drive rod 52 to rotate in both directions, thereby driving the carrier plate 6 fixed on the conveying seat 54 to move through the drive block 53, which facilitates the dispensing tube 42 to perform dispensing operations on chips at different positions.

[0078] Furthermore, the conveying mechanism 5 also includes a fixed plate 55, a pressing rod 56, a guide block 57, a displacement plate 58, and a connecting assembly 59. The fixed plate 55 is symmetrically fixedly connected to the top of the worktable 1; the pressing rod 56 is slidably inserted into both sides of the inner wall of the conveying seat 54, and a through groove for the sliding of the pressing rod 56 is provided on one side of the fixed plate 55; the guide block 57 is fixedly connected to the top and bottom ends of the pressing rod 56, and guide grooves for the displacement of the guide block 57 are provided at both the top and bottom ends of the through groove; the displacement plate 58 is fixedly connected to one end of the pressing rod 56, and the displacement plate 58 is located inside the conveying seat 54. The specific shape of the guide groove is as follows: Figure 7 As shown, when the conveyor seat 54 is displaced, the guide block 57 slides inside the guide groove, and the extrusion rod 56 drives the carrier plate 6 on the displacement plate 58 to move back and forth in the horizontal direction, so that the adhesive can be evenly applied to the mold cavity, thereby improving the fluidity and filling consistency of the adhesive in the mold, avoiding the generation of air bubbles or cavities. The uniform adhesive layer ensures the integrity of the package structure and uniform heat dissipation, thereby improving the mechanical strength, electrical performance and long-term reliability of the chip, and effectively reducing the defect rate of integrated circuit chip packaging process. The connecting component 59 is set inside the displacement plate 58 to connect the conveyor seat 54 and the carrier plate 6. It helps the adhesive to fill complex cavities or corners, reduces the problem of local missing adhesive or uneven adhesive thickness, and can further assist in the discharge of air bubbles in the mold cavity. The adhesive spreading function is seamlessly integrated into the linear conveyor, without the need for independent drive, simplifying the complexity of the equipment.

[0079] Furthermore, the connecting assembly 59 includes a connecting plate 591, a magnetic strip 592, and a third compression spring 593. The top of the displacement plate 58 has a connecting groove, and the connecting plate 591 is slidably inserted into the inner cavity of the connecting groove. The magnetic strip 592 is fixedly connected to the top of the connecting plate 591, and the bottom of the bearing plate 6 has symmetrically provided fixing grooves for cooperating with the magnetic strip 592. One end of the third compression spring 593 is fixedly connected to the connecting plate 591, and the other end of the third compression spring 593 is fixedly connected to the bottom of the inner wall of the connecting groove. By utilizing the magnetic force of the magnetic strip 592 on the bearing plate 6, the bearing plate 6 can be stably fixed on the conveyor seat 54 and can be moved with the displacement plate 58. The magnetic fixation provides sufficient holding force and is convenient for loading and unloading, facilitating the loading, unloading, and maintenance of the mold.

[0080] Furthermore, a controller 7 is fixedly connected to the outer wall of the workbench 1. The controller 7 is used to control the start and stop of the pump body 43, the cylinder 481 and the motor 51.

[0081] How to use this invention:

[0082] Step 1: Place the carrier plate 6 on the conveyor seat 54 and fix it by magnetic strip 592 of the connecting component 59. Start the device and the motor 51 of the conveying mechanism 5 will work. The carrier plate 6 will be conveyed to the bottom of the glue injection station through the drive rod 52 and drive block 53.

[0083] Step 2: The cylinder 481 of the drive assembly 48 is activated, pushing the extrusion block 482 to press down the injection tube 42. The injection tube 42 moves downward against the elastic force of the first compression spring 47, and its end precisely extends into the target mold groove of the support plate 6.

[0084] Step 3: During the descent of the glue injection tube 42, the vibration component 49 works, the roller 498 rolls along the wave groove, and drives the rotating rod 492 to rotate forward and backward through the rack plate 497 and the gear 499, so that the striking ball 495 swings and strikes the inner wall of the glue injection tube 42, physically vibrating the glue in the tube to achieve defoaming. At the same time, the pump body 43 starts, pumping the glue in the glue storage tank 41 into the glue injection tube 42 through the conveying pipe 44 to complete the glue injection operation.

[0085] Step 4: During or after glue injection, the conveying mechanism 5 continues to work. During the linear motion of the conveying seat 54 driven by the motor 51, the guide groove on the fixed plate 55, through cooperation with the guide block 57, forces the extrusion rod 56 to drive the displacement plate 58 and the bearing plate 6 to reciprocate in the horizontal direction, so that the glue liquid in the mold groove flows and distributes more evenly.

[0086] Step 5: After the glue injection and even glue application are completed, the cylinder 481 retracts, the extrusion block 482 rises, and the glue injection tube 42 automatically retracts into the moving table 3 under the elastic force of the first compression spring 47. The conveying mechanism 5 moves the bearing plate 6 to the next glue injection station or unloading station, and repeats steps 2 to 4 to carry out continuous automated production.

[0087] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An integrated circuit chip package processing apparatus, characterized by comprising: Include: Workbench (1), the top end of the workbench (1) is fixedly connected with a fixed frame (2), and the fixed frame (2) is provided with a movable table (3) which can horizontally reciprocate; Glue injection mechanism (4), the glue injection mechanism (4) is arranged between the workbench (1) and the movable table (3); Conveying mechanism (5), the conveying mechanism (5) is arranged on the workbench (1); The carrier disc (6) is displaced on the workbench (1) by the conveying mechanism (5).

2. The integrated circuit chip packaging processing apparatus according to claim 1, wherein The glue injection mechanism (4) comprises: Glue storage tank (41), the glue storage tank (41) is fixedly connected to the outer wall of the workbench (1); Glue injection pipe (42), the glue injection pipe (42) is arranged in the movable table (3); Pump body (43), the pump body (43) is fixedly installed at the top end of the glue storage tank (41); The one end of the material conveying pipe (44) is fixedly connected with the output end of the pump body (43), and the other end of the material conveying pipe (44) is fixedly inserted into the glue injection pipe (42); Slide rod (45), the two sides of the inner wall of the movable table (3) are provided with a sliding groove, and the end of the slide rod (45) is fixedly connected with the inner wall of the sliding groove; The sliding block (46) is slidably connected with the slide rod (45), and the sliding block (46) is fixedly connected to the two sides of the glue injection pipe (42); The first compression spring (47) is sleeved outside the slide rod (45); The driving assembly (48) is arranged in the movable table (3) and is used for driving the glue injection pipe (42) to displace; The oscillation assembly (49) is arranged in the glue injection pipe (42) and the sliding block (46), and is used for eliminating bubbles in the glue solution.

3. The integrated circuit chip packaging processing apparatus according to claim 2, wherein The driving assembly (48) comprises: Air cylinder (481), the air cylinder (481) is fixedly installed at the top end of the inner wall of the movable table (3); The output end of the air cylinder (481) is in transmission connection with the extrusion block (482), and the extrusion block (482) is in cooperation with the glue injection pipe (42).

4. The integrated circuit chip packaging processing apparatus according to claim 2, wherein The oscillation assembly (49) comprises: Partition plate (491), the partition plate (491) is fixedly connected to the inside of the glue injection pipe (42); Rotating rod (492), one end of the rotating rod (492) is rotatably connected with the glue injection pipe (42), and the other end of the rotating rod (492) is rotatably connected with the partition plate (491); Rotating plate (493), the rotating plate (493) is fixedly connected with the rotating rod (492); Connecting rope (494), the connecting rope (494) is fixedly connected to the bottom end of the rotating plate (493); Knocking ball (495), the knocking ball (495) is fixedly connected to the bottom end of the connecting rope (494).

5. The integrated circuit chip packaging processing apparatus according to claim 4, wherein The oscillation assembly (49) further comprises: Extrusion plate (496), the inside of the sliding block (46) is provided with an extrusion groove, and the extrusion plate (496) is located in the inside of the extrusion groove; Rack plate (497), the rack plate (497) is fixedly connected with the extrusion plate (496); Roller (498), one end of the rack plate (497) is fixedly connected, one side of the inner wall of the chute is provided with a wave groove, and the roller (498) is used for fitting the inner wall of the wave groove; Gear (499), the gear (499) is fixedly connected with the rotating rod (492), and the gear (499) is engaged with the rack plate (497); Second compression spring (4910), the second compression spring (4910) is sleeved on the outside of the extrusion rod (56), one end of the second compression spring (4910) is fixedly connected with the extrusion plate (496), and the other end of the second compression spring (4910) is fixedly connected with the inner wall of the extrusion groove.

6. The integrated circuit chip packaging processing apparatus according to claim 3, wherein The conveying mechanism (5) comprises: Motor (51), the motor (51) is fixedly installed on the outer wall of the workbench (1); Drive rod (52), the top of the workbench (1) is provided with a groove, the end of the drive rod (52) is rotatably inserted into the inner wall of the groove, and the output end of the motor (51) is in transmission connection with the drive rod (52); Drive block (53), the drive block (53) and the drive rod (52) form a screw drive; Conveying seat (54), the conveying seat (54) is fixedly connected to the top of the drive block (53), and is used for conveying the bearing disc (6).

7. The integrated circuit chip packaging processing apparatus according to claim 6, wherein The conveying mechanism (5) further comprises: Fixed plate (55), the fixed plate (55) is fixedly connected to the top of the workbench (1); Extrusion rod (56), the extrusion rod (56) is slidably inserted into the inner wall of the conveying seat (54) on both sides, and the fixed plate (55) is provided with a through groove on one side for the sliding of the extrusion rod (56); Guide block (57), the guide block (57) is fixedly connected to the top and bottom of the extrusion rod (56), and the top and bottom of the inner wall of the through groove are provided with guide grooves for the displacement of the guide block (57); Displacement plate (58), the displacement plate (58) is fixedly connected to one end of the extrusion rod (56), and the displacement plate (58) is located in the inside of the conveying seat (54); Connecting assembly (59), the connecting assembly (59) is arranged in the inside of the displacement plate (58), and is used for connecting the conveying seat (54) and the bearing disc (6).

8. The integrated circuit chip packaging processing apparatus according to claim 7, wherein The connecting assembly (59) comprises: Connecting plate (591), the top of the displacement plate (58) is provided with a connecting groove, and the connecting plate (591) is slidably inserted into the inner cavity of the connecting groove; Magnetic stripe (592), the magnetic stripe (592) is fixedly connected to the top of the connecting plate (591), and the bottom of the bearing disc (6) is symmetrically provided with a fixed groove matched with the magnetic stripe (592); Third compression spring (593), one end of the third compression spring (593) is fixedly connected with the connecting plate (591), and the other end of the third compression spring (593) is fixedly connected with the bottom of the inner wall of the connecting groove.

9. The integrated circuit chip packaging processing apparatus of claim 1, wherein The outer wall of the workbench (1) is fixedly connected with a controller (7), and the controller (7) is used for controlling the start and stop of the pump body (43), the air cylinder (481) and the motor (51).

10. A method of using an integrated circuit chip package processing apparatus according to any one of claims 1 to 9, wherein, The following specific use steps are included: Step one: the carrier plate (6) is placed on the conveying seat (54), and is fixed by the magnetic strip (592) of the connecting assembly (59). The motor (51) of the conveying mechanism (5) is started to work, and the carrier plate (6) is conveyed to the position below the glue injection station through the driving rod (52) and the driving block (53); Step two: the cylinder (481) of the driving assembly (48) is started, and the extrusion block (482) is pushed to press down the glue injection pipe (42). The glue injection pipe (42) moves downward to accurately extend into the target mold groove of the carrier plate (6) by overcoming the elastic force of the first compression spring (47); Step three: during the descending process of the glue injection pipe (42), the oscillation assembly (49) works. The roller (498) rolls along the wave groove, and the rotating rod (492) is driven to rotate forward and backward through the rack plate (497) and the gear (499), so that the knocking ball (495) swings and knocks the inner wall of the glue injection pipe (42) to realize defoaming. At the same time, the pump body (43) is started to pump the glue liquid in the glue storage tank (41) into the glue injection pipe (42) through the feed pipe (44), and the glue injection operation is completed; Step four: during or after the glue injection, the conveying mechanism (5) continues to work. During the linear motion of the motor (51) driven conveying seat (54), the guide groove on the fixed plate (55) forces the extrusion rod (56) to drive the displacement plate (58) and the carrier plate (6) to produce reciprocating motion in the horizontal direction through the cooperation with the guide block (57), so that the glue liquid in the mold groove is more evenly distributed; Step five: after the glue injection and glue distribution are completed, the cylinder (481) is retracted, the extrusion block (482) is lifted, the glue injection pipe (42) is automatically retracted into the moving table (3) and reset under the elastic force of the first compression spring (47), the conveying mechanism (5) moves the carrier plate (6) to the next glue injection station, and steps two to four are repeated for continuous automatic production.

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