Composite board and preparation method thereof, structural member of electronic equipment and electronic equipment

Abstract

The invention provides a composite board, a preparation method, a structural member of electronic equipment and the electronic equipment. The composite board comprises a first metal part and a second metal part, wherein the first metal part is made of an aluminum-based composite material; a bonding portion provided on one side of the first metal portion, the bonding portion including, by mass fraction, 60.5 wt% to 99 wt% of aluminum, 0.5 wt% to 7.0 wt% of zinc, 0.1 wt% to 10.0 wt% of silicon, 0.2 wt% to 6.0 wt% of manganese, and 0.2 wt% to 6.0 wt% of copper; the second metal part is arranged on the side, away from the first metal part, of the combination part, and the second metal part and the first metal part are made of different materials. The composite board provided by the invention has relatively high tensile bonding strength and shear bonding strength.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to a composite board and its preparation method, structural components for electronic devices, and electronic devices. Background Technology

[0002] Steel-aluminum and titanium-aluminum composites are commonly produced using rolling and extrusion methods. However, aluminum-based composites are difficult to combine with iron, titanium, magnesium and their alloys through rolling and extrusion. Existing processes are insufficient to produce composite plates with high bonding strength between aluminum-based composites and iron, titanium, magnesium and their alloys. Summary of the Invention

[0003] This application provides a composite board with high tensile strength and shear strength.

[0004] In a first aspect, embodiments of this application provide a composite board material, comprising:

[0005] The first metal part is made of aluminum-based composite material;

[0006] A bonding portion, disposed on one side of the first metal portion, comprising, by mass fraction: 60.5 wt% to 99 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 10.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper; and

[0007] The second metal part is disposed on the side of the joint opposite to the first metal part, and the second metal part is made of a different material than the first metal part.

[0008] Secondly, embodiments of this application provide a method for preparing a composite board, comprising:

[0009] The system provides a first metal portion, a bonding portion or metal powder forming the bonding portion, and a second metal portion, wherein the first metal portion is made of an aluminum-based composite material, and the materials of the first metal portion and the second metal portion are different; and

[0010] The composite plate is obtained by placing a bonding portion or metal powder forming the bonding portion between a first metal portion and a second metal portion, and then bonding them together. The bonding portion is disposed on one side of the first metal portion, and the bonding portion comprises, by mass fraction: 60.5 wt% to 99 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 10.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper.

[0011] Thirdly, embodiments of this application provide a structural component for an electronic device, the structural component including the composite material described in embodiments of this application.

[0012] Fourthly, embodiments of this application provide an electronic device, which includes:

[0013] Display screen;

[0014] The structural components of the electronic device described in the embodiments of this application; and

[0015] A processor, electrically connected to the display screen, is used to control the display screen to perform a display.

[0016] This application provides a composite sheet comprising a first metal part, a bonding part, and a second metal part. The first metal part is made of aluminum-based composite material. The bonding part comprises, by mass fraction, 60.5 wt% to 99 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 10.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper. The aluminum-based composite material includes a reinforcing phase, which is mostly composed of micron or submicron particles or fibers. The reinforcing phase has poor wettability with metals such as iron, magnesium, and titanium, making it difficult to form good interfacial bonding with these metals. Furthermore, the reinforcing phase is mostly a hard phase, which easily causes stress concentration at the interfacial bonding point, thus forming crack initiation sources and affecting the interfacial bonding strength. In this embodiment, through the design of the bonding part material, a strong bonding force is achieved between the first metal part, the bonding part, and the second metal part, thereby giving the composite sheet strong tensile and shear bonding strength. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a plan view of a composite material according to an embodiment of this application.

[0019] Figure 2 This is a plan view of a composite material according to another embodiment of this application.

[0020] Figure 3 This application Figure 2 A cross-sectional view of the composite board along the AA direction in the embodiment.

[0021] Figure 4This is a schematic flowchart illustrating a method for preparing a composite board according to an embodiment of this application.

[0022] Figure 5 This is a schematic flowchart of the composite process in the preparation method of a composite board according to an embodiment of this application.

[0023] Figure 6 This is a schematic flowchart illustrating a method for preparing a composite board according to another embodiment of this application.

[0024] Figure 7 This is a schematic diagram of the heat treatment process in the composite material of an embodiment of this application.

[0025] Figure 8 This is an optical microscope image of the composite material of Embodiment 1 of this application.

[0026] Figure 9 yes Figure 8 A magnified view of a portion of the optical microscope image.

[0027] Figure 10 yes Figure 8 Another magnified view of the optical microscope image.

[0028] Figure 11 This is a scanning electron microscope image of the composite material of Embodiment 1 of this application.

[0029] Figure 12 yes Figure 11 A magnified view of a portion of the scanning electron microscope image.

[0030] Figure 13 yes Figure 11 Another magnified view of the scanning electron microscope image.

[0031] Figure 14 This is a structural schematic diagram of a structural component according to an embodiment of this application.

[0032] Figure 15 This is a structural schematic diagram of another embodiment of the structural component of this application.

[0033] Figure 16 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0034] Figure 17 This is a partial exploded structural diagram of an electronic device according to an embodiment of this application.

[0035] Figure 18 This is a circuit block diagram of an electronic device according to an embodiment of this application.

[0036] Explanation of reference numerals in the attached figures:

[0037] 100-Composite sheet, 10-First metal part, 20-Joint part, 30-Second metal part, 200-Structural component, 300-Electronic device, 310-Display screen, 330-Processor, 350-Memory, 360-Housing, 361-Light-transmitting part, 370-Camera module. Detailed Implementation

[0038] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0039] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0040] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0041] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0042] Steel-aluminum and titanium-aluminum composites are commonly produced using rolling and extrusion methods. However, aluminum-based composites are difficult to combine with iron, titanium, magnesium and their alloys through rolling and extrusion. Existing processes are insufficient to produce composite plates with high bonding strength between aluminum-based composites and iron, titanium, magnesium and their alloys.

[0043] Please see Figures 1 to 3This application provides a composite sheet 100, which includes a first metal part 10, a connecting part 20, and a second metal part 30. The first metal part 10 is made of aluminum-based composite material. The connecting part 20 is disposed on one side of the first metal part 10 and includes, by mass fraction: 60.5 wt% to 99 wt% aluminum (Al), 0.5 wt% to 7.0 wt% zinc (Zn), 0.1 wt% to 10.0 wt% silicon (Si), 0.2 wt% to 6.0 wt% manganese (Mn), and 0.2 wt% to 6.0 wt% copper (Cu). The second metal part 30 is disposed on the side of the connecting part 20 opposite to the first metal part 10, and the material of the second metal part 30 is different from that of the first metal part 10.

[0044] In the embodiments of this application, when referring to the numerical range a to b, unless otherwise specified, the numerical value can be any value between a and b, including the endpoint value a and the endpoint value b. In the embodiments of this application, unless otherwise specified, content refers to mass content or mass fraction.

[0045] The composite material 100 of this application embodiment can be applied to portable electronic devices or foldable electronic devices such as mobile phones, tablets, laptops, desktop computers, smart bracelets, smartwatches, e-readers, and game consoles. The composite material 100 of this application embodiment can serve as a structural component of electronic devices, such as a support plate for foldable screens or a mid-frame for electronic devices.

[0046] It should be noted that the connecting portion 20 is used to connect the first metal portion 10 and the second metal portion 30; in other words, the first metal portion 10, the connecting portion 20, and the second metal portion 30 are connected sequentially, such as... Figure 1 As shown. In some embodiments, the first metal portion 10, the bonding portion 20, and the second metal layer are stacked sequentially, as shown. Figure 3 As shown.

[0047] Aluminum-based composite materials (abbreviated as aluminum-based composites) refer to aluminum alloys in which reinforcing phases are added to the aluminum matrix to improve certain properties, especially significantly improving the elastic modulus and strength of the material, while having a low density. This means that the material has high specific stiffness and specific strength, which is very beneficial for making mobile phones thinner and lighter.

[0048] Optionally, the second metal part 30 may include, but is not limited to, at least one of stainless steel, iron, ferroalloys, titanium, titanium alloys, magnesium, and magnesium alloys. In other words, the material of the second metal part 30 may be, but is not limited to, at least one of stainless steel, iron, ferroalloys, titanium, titanium alloys, magnesium, and magnesium alloys.

[0049] Specifically, the mass fraction of aluminum (Al) in the bonding part 20 can be, but is not limited to, 60.5 wt%, 63 wt%, 65 wt%, 68 wt%, 70 wt%, 75 wt%, 80 wt%, 83 wt%, 85 wt%, 88 wt%, 90 wt%, 93 wt%, 95 wt%, 97 wt%, 99 wt%, etc. Aluminum is the main element in the bonding part 20 because of its low melting point and atomic reactivity. During composite formation, it can undergo good atomic diffusion with the first metal part 10 and the second metal part 30, thus achieving metallurgical bonding. However, the aluminum content should not be too high (e.g., pure aluminum), and other elements need to be added. If the aluminum content is too high, the strength of the bonding part 20 itself will be low, making the composite plate 100 a weak link. In addition, aluminum easily reacts with the second metal part 30 at the interface, easily generating a large amount of intermetallic compounds such as Al-Fe (e.g., FeAl3), Al-Ti (e.g., Al3Ti), and Al-Mg (e.g., Al3Mg2), which will damage the intermetallic bonding force.

[0050] Specifically, the mass fraction of zinc (Zn) in the bonding portion 20 can be, but is not limited to, 0.5 wt%, 1.0 wt%, 1.5 wt%, 2.0 wt%, 2.5 wt%, 3.0 wt%, 3.5 wt%, 3.0 wt%, 3.5 wt%, 4.0 wt%, 4.5 wt%, 5.0 wt%, 5.5 wt%, 6.0 wt%, 6.5 wt%, and 7.0 wt%. When the bonding portion 20 contains magnesium (Mg), zinc can react with Mg in the bonding portion 20 to form compounds such as MgZn2 and Al2Mg3Zn. Zinc can also react with Cu in the bonding portion 20 to form compounds such as CuMgAl2. These metal compounds can significantly improve the strength of the bonding portion 20. However, if the zinc content in the bonding portion 20 is too high (e.g., exceeding 7 wt%), it can easily lead to coarse precipitates, reducing the strength of the bonding portion 20. When the material of the second metal part 30 is magnesium or a magnesium alloy, Zn diffuses to the interface between the bonding part 20 and the second metal part 30, forming MgZn, MgZn2, and AlMg4Zn at the interface. 11 The same toughness phase, while reducing Al3Mg2 and Al 12 Mg 17The content of brittle phases can improve the interfacial bonding strength between the bonding portion 20 and the second metal portion 30. However, when the Zn content in the bonding portion 20 is too high (e.g., exceeding 5.0 wt%), the precipitated phase is prone to agglomerate and grow at the interface, causing a decrease in interfacial bonding strength and reducing the interfacial bonding strength of the composite plate 100. When the material of the second metal portion 30 is stainless steel, iron, or iron alloy, Zn can improve the wettability between aluminum and steel and reduce the influence of the oxide layer. However, when the Zn content in the bonding portion 20 is too high (e.g., exceeding 5.0 wt%), the precipitated phase is prone to agglomerate and grow at the interface, causing a decrease in interfacial bonding strength and reducing the interfacial bonding strength of the composite plate 100.

[0051] Specifically, the mass fraction of silicon (Si) in the bonding portion 20 can be, but is not limited to, 0.1 wt%, 0.5 wt%, 1.0 wt%, 1.2 wt%, 1.5 wt%, 1.8 wt%, 2.0 wt%, 2.3 wt%, 2.5 wt%, 2.8 wt%, 3.0 wt%, 3.5 wt%, 4.0 wt%, 4.5 wt%, 5.0 wt%, 5.5 wt%, 6.0 wt%, 6.5 wt%, 7.0 wt%, 8.0 wt%, 9.0 wt%, 10.0 wt%, etc. When the second metal part 30 is made of stainless steel, iron, or an iron alloy, Si can enhance the affinity between the bonding part 20 and the second metal part 30. Simultaneously, Si can inhibit the growth of hard and brittle phases such as Al5Fe2, Al3Fe, Al2Fe5, and Al2Fe at the interface, thereby increasing the interfacial bonding strength. However, when the Si content is less than 8 wt%, the aluminum / steel interfacial bonding strength increases with increasing Si content. When the Si content is greater than or equal to 8 wt%, the aluminum / steel interfacial bonding strength decreases with increasing Si content. Si in aluminum alloys not only reduces the activity of aluminum atoms but also inhibits the movement of Al from the aluminum melt into the iron matrix, thereby eliminating the "tongue-like" morphology of the interface between the bonding part 20 and the first metal part 10 and the second metal part 30, making the aluminum / steel interface smoother, and ultimately improving the bonding strength of the composite plate 100. When the second metal part 30 is made of titanium or a titanium alloy, the presence of Si can preferentially generate Al5Si. 12 Ti7, Al 12 Si3Ti5, to a certain extent, inhibits the growth of hard and brittle phases such as TiAl3, thereby improving the interfacial bonding force between the bonding portion 20 and the second metal portion 30; however, when the silicon content in the bonding portion 20 is too high, it causes Al5Si 12The coarse Ti7, Al12Si3Ti5 content increases the stress corrosion tendency of the bonding part 20 and reduces the corrosion resistance of the composite plate 100. When the material of the second metal part 30 is magnesium or magnesium alloy, Si can improve the affinity between the bonding part 20 and the second metal part 30. However, if the Si content is too high, more Mg2Si phase will be formed at the interface between the bonding part 20 and the second metal part 30, thereby affecting the interfacial bonding force.

[0052] Specifically, the mass fraction of manganese (Mn) in the bonding portion 20 can be, but is not limited to, 0.2wt%, 0.5wt%, 1.0wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2.0wt%, 2.3wt%, 2.5wt%, 2.8wt%, 3.0wt%, 3.5wt%, 3.0wt%, 3.5wt%, 4.0wt%, 4.5wt%, 5.0wt%, 5.5wt%, and 6.0wt%. Manganese dissolved in aluminum can increase the recrystallization temperature and inhibit the growth of aluminum grains in the bonding portion 20 during composite formation, thereby improving the strength and toughness of the bonding portion 20. Furthermore, Mn reacts with Al to form Al6Mn, creating dispersed particles that can inhibit the growth of recrystallized grains at the bonding interface, thus improving the material strength at the interface. Moreover, manganese can participate in the interfacial reaction between Al and the second metal portion 30, inhibiting the growth of the hard and brittle phase, thereby improving the interfacial bonding force. When the second metal part 30 is made of stainless steel, iron, or an iron alloy, Mn participates in the interfacial reaction to generate Al6 (Fe, Mn), which can improve the bonding strength between the bonding part 20 and the stainless steel. When the second metal part 30 is made of magnesium or a magnesium alloy, the presence of Mn can make the hard and brittle Al8Mg5 phase dispersed and uniformly distributed, preventing Al8Mg5 from agglomerating and growing, and improving the interfacial bonding strength. Mn can, to a certain extent, change the morphology of the intermetallic compound at the composite interface, effectively suppressing the generation of needle-like phases on the aluminum matrix side and improving the interfacial bonding strength. However, when the Mn content is too high, it will form coarse, hard, and brittle Al6Mn compounds, which will damage the interfacial bonding strength. Therefore, the manganese content in the bonding part 20 should not be too high.

[0053] Specifically, the mass fraction of copper (Cu) in the bonding portion 20 can be, but is not limited to, 0.2wt%, 0.5wt%, 1.0wt%, 1.2wt%, 1.5wt%, 1.8wt%, 2.0wt%, 2.3wt%, 2.5wt%, 2.8wt%, 3.0wt%, 3.5wt%, 3.0wt%, 3.5wt%, 4.0wt%, 4.5wt%, 5.0wt%, 5.5wt%, and 6.0wt%. Copper can react with Al to form CuAl2, which can significantly improve the strength of the bonding portion 20; copper can also react with Al and Mn to form Al2O3. 20Cu2Mn3 can improve the strength and toughness of the bonding portion 20. When the second metal portion 30 is made of magnesium or a magnesium alloy, copper can generate uniformly distributed Al2Cu and Al2CuMg phases at the interface, improving the interfacial bonding strength. When the second metal portion 30 is made of stainless steel, iron, or an iron alloy, copper can generate Al7Cu2Fe and Al3CuFe, improving the interfacial bonding strength; Cu can also improve the wettability between aluminum and steel, reducing the influence of the oxide layer. When the second metal portion 30 is made of titanium or a titanium alloy, Cu can inhibit the formation of intermetallic compounds (Al3Ti) with high Al content, improving the interfacial bonding strength. However, if the Cu content in the bonding portion 20 is too high, the bonding portion 20 will have a more obvious tendency for intergranular corrosion, reducing the corrosion resistance of the material; at the same time, a large amount of CuAl2 compounds will be formed, which will damage the interfacial bonding strength.

[0054] This application provides a composite sheet 100 comprising a first metal part 10, a bonding part 20, and a second metal part 30. The first metal part 10 is made of aluminum-based composite material. The bonding part 20 comprises, by mass fraction: 60.5 wt% to 99 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 10.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper. The aluminum-based composite material includes a reinforcing phase, which is mostly composed of micron or submicron particles or fibers. The reinforcing phase has poor wettability with metals such as iron, magnesium, and titanium, making it difficult to form a good interfacial bond with them. Furthermore, the reinforcing phase is mostly a hard phase, which easily causes stress concentration at the interfacial bonding point, thereby forming a crack initiation source and affecting the interfacial bonding force. In this embodiment, by designing the material of the joint 20, a strong bonding force is achieved between the first metal part 10, the joint 20 and the second metal part 30, thereby giving the composite plate 100 a strong tensile bonding strength and shear bonding strength.

[0055] Furthermore, aluminum-based composite materials have high elastic modulus and strength, and low density, but low elongation, are not resistant to bending, and have a rough appearance, making them unsuitable for exterior parts. This application uses a bonding portion 20 to combine the first metal portion 10 and the second metal portion 30, allowing the area of ​​the composite sheet 100 corresponding to the first metal portion 10 to have high rigidity and strength, and the area corresponding to the second metal portion 30 to have good bending performance. This allows the composite sheet 100 to be used as a support plate for foldable screens. The first metal portion 10 corresponds to the non-bending area of ​​the foldable screen, and the second metal portion 30 corresponds to the bendable area of ​​the foldable screen, giving the support plate good support performance, good bending performance, and light weight. When the composite sheet 100 is applied to the mid-frame of electronic devices, the second metal portion 30 can serve as an exterior layer, giving the mid-frame a better appearance. The first metal portion 10, as a non-exterior part, improves the mechanical strength of the mid-frame while reducing its weight, allowing for better weight reduction when the mid-frame is used in mobile phones and other electronic devices.

[0056] In some embodiments, the bonding portion 20 comprises, by mass fraction: 77.5 wt% to 96.4 wt% aluminum, 1.5 wt% to 5.0 wt% zinc, 0.5 wt% to 6.0 wt% silicon, 0.5 wt% to 2.5 wt% manganese, and 0.5 wt% to 4.0 wt% copper.

[0057] For a description of the aluminum, zinc, silicon, manganese, copper, and other materials in the joint 20, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0058] In this embodiment, when the composite plate 100 is combined with aluminum comprising 77.5 wt% to 96.4 wt% by mass, zinc comprising 1.5 wt% to 5.0 wt% by mass, silicon comprising 0.5 wt% to 6.0 wt% by mass, manganese comprising 0.5 wt% to 2.5 wt% by mass, and copper comprising 0.5 wt% to 4.0 wt% by mass, the composite plate 100 can have better tensile bond strength and shear bond strength.

[0059] In some embodiments, the bonding portion 20 further includes magnesium (Mg), wherein the mass fraction of magnesium in the bonding portion 20 is 0 to 5 wt%.

[0060] Furthermore, the mass fraction of magnesium in the bonding portion 20 is from 0.03 wt% to 5 wt%.

[0061] Specifically, the mass fraction of magnesium (Mg) in the bonding portion 20 can be, but is not limited to, 0.03wt%, 0.05wt%, 0.08wt%, 0.1wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.8wt%, 1.0wt%, 1.2wt%, 1.4wt%, 1.6wt%, 1.8wt%, 2.0wt%, 2.2wt%, 2.4wt%, 2.6wt%, 2.8wt%, 3.0wt%, 3.5wt%, 4.0wt%, 4.5wt%, and 5wt%. Magnesium can react with Si in the bonding portion 20 to form the Mg₂Si phase, which can improve the strength of the bonding portion 20. When the second metal portion 30 is made of magnesium or a magnesium alloy, Si can increase the affinity between the bonding portion 20 and the second metal portion 30, promote atomic diffusion between the bonding portion 20 and the second metal portion 30, and enhance the interfacial bonding force. However, when the material of the second metal part 30 is magnesium or a magnesium alloy, if the magnesium content in the bonding part 20 is too high, a large amount of Al3Mg2 and Mg will be generated in the bonding part 20. 17 Al 12 The presence of hard and brittle phases, such as Fe-Mg and Ti-Mg, reduces the strength of the joint 20. When the material of the second metal part 30 is at least one of stainless steel, iron, iron alloy, titanium, or titanium alloy, excessive Mg content in the joint 20 can easily lead to the formation of hard and brittle phases such as Fe-Mg and Ti-Mg at the interface, which will affect the interfacial bonding force.

[0062] Furthermore, the magnesium content in the bonding portion 20 is 0.1 wt% to 3 wt%. This can better improve the bonding strength between the bonding portion 20 and the second metal portion 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0063] In one specific embodiment, the second metal part 30 is made of at least one of stainless steel, iron, iron alloy, titanium, or titanium alloy, and the magnesium mass fraction in the bonding part 20 is 0.1 wt% to 1.5 wt%. This can better improve the bonding strength between the bonding part 20 and the second metal part 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0064] In another specific embodiment, the second metal part 30 is made of magnesium or a magnesium alloy, and the mass fraction of magnesium in the bonding part 20 is 1.5 wt% to 3 wt%. This can better improve the bonding strength between the bonding part 20 and the second metal part 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0065] In some embodiments, the bonding portion 20 further includes titanium (Ti), wherein the mass fraction of titanium in the bonding portion 20 is 0 to 2 wt%.

[0066] Furthermore, the mass fraction of titanium in the joint 20 is from 0.01 wt% to 2 wt%.

[0067] Specifically, the mass fraction of titanium (Ti) in the bonding portion 20 can be, but is not limited to, 0.01wt%, 0.03wt%, 0.05wt%, 0.08wt%, 0.1wt%, 0.12wt%, 0.14wt%, 0.16wt%, 0.18wt%, 0.2wt%, 0.3wt%, 0.4wt%, 0.5wt%, 0.8wt%, 1.0wt%, 1.2wt%, 1.4wt%, 1.6wt%, 1.8wt%, 2.0wt%, etc. Titanium can refine the grains of the bonding portion 20 and improve its strength. When the second metal portion 30 is made of titanium or a titanium alloy, an appropriate amount of Ti in the bonding portion 20 can improve the affinity between the bonding portion 20 and the second metal portion 30, and enhance the interfacial bonding force. However, when the titanium content in the joint 20 is too high, brittle phases such as AlTi3, Al3Ti and TiAl will be generated, which will damage the strength of the joint 20.

[0068] Furthermore, the mass fraction of titanium in the bonding portion 20 is 0.01wt% to 0.5wt%. This can better improve the bonding strength between the bonding portion 20 and the second metal portion 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0069] In one specific embodiment, the second metal part 30 is made of at least one of stainless steel, iron, iron alloy, magnesium, or magnesium alloy, and the mass fraction of titanium in the bonding part 20 is 0.01wt% to 0.2wt%. This can better improve the bonding strength between the bonding part 20 and the second metal part 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0070] In another specific embodiment, the second metal part 30 is made of titanium or a titanium alloy, and the mass fraction of titanium in the bonding part 20 is 0.01wt% to 0.5wt%. This can better improve the bonding strength between the bonding part 20 and the second metal part 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0071] In some embodiments, the bonding portion 20 further includes chromium (Cr), wherein the mass fraction of chromium in the bonding portion 20 is 0 to 2 wt%.

[0072] Furthermore, the mass fraction of chromium in the joint 20 is from 0.01 wt% to 2 wt%.

[0073] Specifically, the mass fraction of chromium (Cr) in the bonding portion 20 can be, but is not limited to, 0.01wt%, 0.03wt%, 0.05wt%, 0.08wt%, 0.1wt%, 0.15wt%, 0.2wt%, 0.25wt%, 0.3wt%, 0.35wt%, 0.4wt%, 0.45wt%, 0.5wt%, 0.8wt%, 1.0wt%, 1.2wt%, 1.4wt%, 1.6wt%, 1.8wt%, 2.0wt%, etc. When the material of the second metal portion 30 is magnesium or a magnesium alloy, Al can be formed at the chromium interface with Al and Mg. 12 CrMg2+ can refine the grains of the bonding portion 20 and improve interfacial bonding strength. When the material of the second metal portion 30 is stainless steel, iron, or an iron alloy, chromium can react with Al and Fe at the interface to form Al7(CrFe), which can hinder the recrystallization and grain growth of the bonding portion 20 and improve interfacial bonding strength. In addition, chromium can also react with Al and Mn in the bonding portion 20 to form Al2O3. 12 (CrMn) is added to increase the strength of the joint 20.

[0074] Furthermore, the mass fraction of chromium in the bonding portion 20 is 0.01wt% to 0.5wt%. This can better improve the bonding strength between the bonding portion 20 and the second metal portion 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0075] In some embodiments, the bonding portion 20 further includes rare earth elements, wherein the mass fraction of the rare earth elements in the bonding portion 20 is 0 to 1.5 wt%.

[0076] Furthermore, the mass fraction of rare earth elements in the joint 20 is from 0.03 wt% to 1.5 wt%.

[0077] Specifically, the mass fraction of rare earth elements in the bonding portion 20 can be, but is not limited to, 0.03wt%, 0.05wt%, 0.08wt%, 0.1wt%, 0.15wt%, 0.2wt%, 0.25wt%, 0.3wt%, 0.35wt%, 0.4wt%, 0.45wt%, 0.5wt%, 0.8wt%, 1.0wt%, 1.2wt%, 1.4wt%, and 1.5wt%. Rare earth elements can enhance the affinity between the bonding portion 20 and the second metal portion 30, promote atomic diffusion, and improve interfacial bonding strength. Furthermore, rare earth elements can improve the distribution of precipitated phases, prevent their aggregation and growth, and indirectly improve interfacial bonding strength. Especially when the material of the second metal portion 30 is magnesium or a magnesium alloy, the effect of improving the distribution of precipitated phases, preventing their aggregation and growth, and improving interfacial bonding strength is more significant. Furthermore, when the material of the second metal part 30 is titanium or titanium alloy and the rare earth element is niobium, niobium can react with titanium and aluminum to form Ti2AlNb, and the resulting eutectic compound can improve the interfacial bonding strength. When the weight fraction of the rare earth element in the bonding part 20 increases to a certain extent, it will no longer improve the bonding strength between the bonding part 20 and the second metal part 30, but it will significantly increase the cost of the composite plate 100. Therefore, the mass fraction of the rare earth element in the bonding part 20 should not be too high.

[0078] Furthermore, the rare earth element in the bonding portion 20 has a mass fraction of 0.5 wt% to 1.0 wt%. This can better improve the bonding strength between the bonding portion 20 and the second metal portion 30, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0079] Optionally, the rare earth element may include, but is not limited to, at least one of yttrium (Y), samarium (Sm), scandium (Sc), and niobium (Nb). These rare earth elements can better improve the bonding strength between the bonding portion 20 and the second metal portion 30, improve the tensile bonding strength and shear bonding strength of the composite plate 100, and also have a lower cost compared to other rare earth elements.

[0080] In some embodiments, the second metal portion 30 is made of at least one of iron, stainless steel, or an iron alloy, and the bonding portion 20 comprises, by mass fraction: 63.5 wt% to 98.6 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.5 wt% to 10.0 wt% silicon, 0.2 wt% to 5.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper. The bonding portion 20 using the components of this embodiment can better improve the bonding strength between the first metal portion 10, the bonding portion 20, and the second metal portion 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0081] Further, the second metal part 30 is made of at least one of iron, stainless steel, or iron alloy, and the bonding part 20 comprises, by mass fraction: 79.8 wt% to 95.4 wt% aluminum, 2.0 wt% to 5.0 wt% zinc, 1.0 wt% to 6.0 wt% silicon, 0.2 wt% to 5.0 wt% manganese, and 0.5 wt% to 4.0 wt% copper. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0082] Furthermore, the second metal part 30 is made of at least one of iron, stainless steel, or iron alloy, and the bonding part 20 comprises, by mass fraction: 79.8 wt% to 95.4 wt% aluminum, 2.0 wt% to 5.0 wt% zinc, 1.0 wt% to 6.0 wt% silicon, 0.2 wt% to 5.0 wt% manganese, 0.5 wt% to 4.0 wt% copper, 0.1 wt% to 1.5 wt% magnesium, 0.01 wt% to 0.2 wt% titanium, 0.01 wt% to 0.5 wt% chromium, and 0.5 wt% to 1.0 wt% rare earth elements. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0083] In other embodiments, the second metal portion 30 is made of titanium or a titanium alloy, and the bonding portion 20 comprises, by mass fraction: 70.5 wt% to 98.6 wt% aluminum, 0.5 wt% to 5.0 wt% zinc, 0.5 wt% to 8.0 wt% silicon, 0.2 wt% to 3.0 wt% manganese, and 0.2 wt% to 5.0 wt% copper. The bonding portion 20 using the components of this embodiment can better improve the bonding strength between the first metal portion 10, the bonding portion 20, and the second metal portion 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0084] Furthermore, the second metal part 30 is made of titanium or a titanium alloy, and the bonding part 20 comprises, by mass fraction: 86.0 wt% to 95.9 wt% aluminum, 1.5 wt% to 3.0 wt% zinc, 1.0 wt% to 3.0 wt% silicon, 0.5 wt% to 1.5 wt% manganese, and 0.5 wt% to 3.0 wt% copper. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0085] Furthermore, the second metal part 30 is made of titanium or a titanium alloy, and the bonding part 20 comprises, by mass fraction: 86.0 wt% to 95.9 wt% aluminum, 1.5 wt% to 3.0 wt% zinc, 1.0 wt% to 3.0 wt% silicon, 0.5 wt% to 1.5 wt% manganese, 0.5 wt% to 3.0 wt% copper, 0.1 wt% to 1.5 wt% magnesium, 0.01 wt% to 0.5 wt% titanium, 0.01 wt% to 0.5 wt% chromium, and 0.5 wt% to 1.0 wt% rare earth elements. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0086] In some other embodiments, the second metal portion 30 is made of magnesium or a magnesium alloy, and the bonding portion 20 comprises, by mass fraction: 66.5 wt% to 98 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 5.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, 0.2 wt% to 5.0 wt% copper, and 1.0 wt% to 5.0 wt% magnesium. The bonding portion 20 using the components of this embodiment can better improve the bonding strength between the first metal portion 10, the bonding portion 20, and the second metal portion 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0087] Further, the second metal part 30 is made of magnesium or a magnesium alloy, and the bonding part 20 comprises, by mass fraction: 82.8 wt% to 94.5 wt% aluminum, 2.0 wt% to 5.0 wt% zinc, 0.5 wt% to 2.0 wt% silicon, 0.5 wt% to 2.5 wt% manganese, 0.5 wt% to 3.0 wt% copper, and 1.5 wt% to 3.0 wt% magnesium. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0088] Furthermore, the second metal part 30 is made of magnesium or a magnesium alloy, and the bonding part 20 comprises, by mass fraction: 82.8 wt% to 94.5 wt% aluminum, 2.0 wt% to 5.0 wt% zinc, 0.5 wt% to 2.0 wt% silicon, 0.5 wt% to 2.5 wt% manganese, 0.5 wt% to 3.0 wt% copper, 1.5 wt% to 3.0 wt% magnesium, 0.01 wt% to 0.2 wt% titanium, 0.01 wt% to 0.5 wt% chromium, and 0.5 wt% to 1.0 wt% rare earth elements. The bonding part 20 using the components of this embodiment can better improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, and better improve the tensile bonding strength and shear strength of the composite plate 100.

[0089] In some embodiments, the thickness of the joint 20 along the arrangement direction of the first metal portion 10, the joint portion 20, and the second metal portion 30 ranges from 0.01 mm to 5 mm. Specifically, the thickness of the joint 20 along the arrangement direction of the first metal portion 10, the joint portion 20, and the second metal portion 30 can be, but is not limited to, 0.01 mm, 0.05 mm, 0.08 mm, 0.1 mm, 0.2 mm, 0.4 mm, 0.5 mm, 0.6 mm, 0.8 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, 3 mm, 3.5 mm, 4 mm, 4.5 mm, and 5 mm.

[0090] In this embodiment, due to the difference in thermal expansion coefficients among the first metal part 10, the connecting part 20, and the second metal part 30, significant internal stress will be generated inside the composite plate 100 due to temperature changes (heating and cooling) when the first metal part 10, the connecting part 20, and the second metal part 30 are combined. This internal stress is mainly concentrated on both sides of the connecting part 20. Under the action of this internal stress, the connecting part 20 will undergo plastic deformation to absorb and coordinate the internal stress. This internal stress is related to the thickness of the connecting part 20; the thicker the connecting part 20, the greater the internal stress. When the thickness of the joint 20 is too small, the degree of plastic deformation of the joint 20 is limited and insufficient to fully absorb the internal stress, which may cause the composite plate 100 to deform or the joint 20 to break when the first metal part 10, the joint 20 and the second metal part 30 are combined. When the thickness of the joint 20 is too large, the internal stress generated by the combination of the first metal part 10, the joint 20 and the second metal part 30 increases significantly, which may exceed the ability of the joint 20 to absorb and coordinate internal stress, which may also cause the composite plate 100 to deform or the joint 20 to break when the first metal part 10, the joint 20 and the second metal part 30 are combined.

[0091] Furthermore, along the arrangement direction of the first metal part 10, the joint part 20, and the second metal part 30, the thickness of the joint part 20 ranges from 0.1 mm to 1 mm. This allows the joint part 20 to have suitable plastic deformation, which can better absorb the internal stress generated when the first metal part 10, the joint part 20, and the second metal part 30 are combined, making the resulting composite plate 100 less prone to deformation or breakage of the joint part 20.

[0092] In some embodiments, the aluminum-based composite material includes an aluminum matrix and a reinforcing phase, wherein the aluminum matrix is ​​aluminum or an aluminum alloy, and the reinforcing phase includes at least one of particles, fibers, or whiskers. Compared to fibers and whiskers, when the reinforcing phase is particles, the aluminum-based composite material can have a higher elastic modulus and strength, and a lower density.

[0093] Optionally, in the aluminum-based composite material, the mass fraction of the aluminum matrix ranges from 20 wt% to 99.9 wt%, and the mass fraction of the reinforcing phase ranges from 0.1 wt% to 80 wt%.

[0094] Understandably, the reinforcing phase is uniformly dispersed in the aluminum matrix.

[0095] Specifically, in aluminum-based composite materials, the mass fraction of the aluminum matrix can be, but is not limited to, 20wt%, 25wt%, 30wt%, 35wt%, 40wt%, 45wt%, 50wt%, 55wt%, 60wt%, 65wt%, 70wt%, 75wt%, 80wt%, 85wt%, 90wt%, 95wt%, 99.9wt%, etc.

[0096] Specifically, in the aluminum-based composite material, the mass fraction of the reinforcing phase ranges from 0.1 wt%, 0.5 wt%, 1 wt%, 3 wt%, 5 wt%, 10 wt%, 15 wt%, 20 wt%, 25 wt%, 30 wt%, 35 wt%, 40 wt%, 45 wt%, 50 wt%, 55 wt%, 60 wt%, 65 wt%, 70 wt%, 75 wt%, 80 wt%, etc.

[0097] In this embodiment, when the mass fraction of the aluminum matrix in the aluminum-based composite material ranges from 20 wt% to 99.9 wt%, and the mass fraction of the reinforcing phase ranges from 0.1 wt% to 80 wt%, the first metal part 10 can have a higher elastic modulus and strength, and a lower density.

[0098] Furthermore, in the aluminum-based composite material, the mass fraction of the aluminum matrix ranges from 30 wt% to 90 wt%, and the mass fraction of the reinforcing phase ranges from 10 wt% to 70 wt%. This allows the first metal portion 10 to have a higher elastic modulus and strength, and a lower density.

[0099] Optionally, the particles include at least one of silicon carbide, boron carbide, titanium carbide, zirconium carbide, silicon nitride, titanium nitride, boron nitride, zirconium oxide, aluminum oxide, silicon oxide, zirconium boride, hafnium boride, tantalum boride, titanium boride, elemental silicon, and carbon (such as diamond, graphite, graphene, carbon fiber, etc.). These materials can give the first metal portion 10 a higher elastic modulus and strength, and a lower density. When the particles are at least one of silicon carbide, boron carbide, aluminum oxide, zirconium oxide, and titanium boride, the first metal portion 10 can have a higher elastic modulus and strength, and a lower density.

[0100] Optionally, the tensile bond strength of the composite board 100 ranges from 150 MPa to 400 MPa. Specifically, the tensile bond strength of the composite board 100 can be, but is not limited to, 150 MPa, 180 MPa, 200 MPa, 220 MPa, 240 MPa, 260 MPa, 280 MPa, 300 MPa, 320 MPa, 340 MPa, 360 MPa, 380 MPa, 400 MPa, etc.

[0101] Optionally, the shear bond strength of the composite board 100 ranges from 100 MPa to 350 MPa. Specifically, the shear bond strength of the composite board 100 can be, but is not limited to, 100 MPa, 120 MPa, 140 MPa, 150 MPa, 180 MPa, 200 MPa, 220 MPa, 240 MPa, 260 MPa, 280 MPa, 300 MPa, 320 MPa, 340 MPa, 350 MPa, etc.

[0102] The composite plate 100 of this application embodiment has high tensile strength and shear strength, and is not prone to cracking or fissures at the interface of the first metal part 10, the joint part 20 and the second metal part 30, thus having a wider range of applications.

[0103] The composite board 100 of this application embodiment can be prepared by the methods described in the following embodiments of this application. In addition, it can also be prepared by other methods. The preparation methods of this application embodiment are merely one or more preparation methods of the composite board 100 of this application and should not be construed as limiting the composite board 100 provided in the embodiments of this application.

[0104] Please see Figure 4This application also provides a method for preparing a composite board 100, which includes:

[0105] S201, providing a first metal portion 10, a bonding portion 20 or metal powder forming the bonding portion 20, and a second metal portion 30, wherein the first metal portion 10 is made of an aluminum-based composite material, and the materials of the first metal portion 10 and the second metal portion 30 are different; and

[0106] S202, the bonding portion 20 or the metal powder forming the bonding portion 20 is disposed between the first metal portion 10 and the second metal portion 30, and composite is performed to obtain the composite plate 100, wherein the bonding portion 20 is disposed on one side of the first metal portion 10, and the bonding portion 20 comprises, by mass fraction: 60.5wt% to 99wt% aluminum, 0.5wt% to 7.0wt% zinc, 0.1wt% to 20.0wt% silicon, 0.2wt% to 6.0wt% manganese, and 0.2wt% to 6.0wt% copper.

[0107] For a detailed description of other aspects of the composite plate 100, the first metal part 10, the connecting part 20, and the second metal part 30, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0108] The composite plate 100 prepared by the method of this application embodiment includes a first metal part 10, a bonding part 20, and a second metal part 30. The first metal part 10 is made of aluminum-based composite material. The bonding part 20 includes, by mass fraction: 60.5 wt% to 99 wt% aluminum, 0.5 wt% to 7.0 wt% zinc, 0.1 wt% to 10.0 wt% silicon, 0.2 wt% to 6.0 wt% manganese, and 0.2 wt% to 6.0 wt% copper. The aluminum-based composite material includes a reinforcing phase, which is mostly composed of micron or submicron particles or fibers. The reinforcing phase has poor wettability with metals such as iron, magnesium, and titanium, making it difficult to form a good interfacial bond with them. In addition, the reinforcing phase is mostly a hard phase, which easily causes stress concentration at the interfacial bonding point, thereby forming a crack initiation source and affecting the interfacial bonding force. In this embodiment, by designing the material of the joint 20, when the first metal part 10, the joint 20 and the second metal part 30 are composite molded, the interface of the first metal part 10, the joint 20 and the second metal part 30 is less prone to cracking or cracking, and there is a strong bonding force between the first metal part 10, the joint 20 and the second metal part 30. The resulting composite plate 100 has a strong tensile bonding strength and shear bonding strength.

[0109] In some embodiments, in S201, providing the first metal portion 10 includes: performing a surface roughening treatment on the first metal portion 10 so that the surface roughness Ra1 of the first metal portion 10 is in the range of 0.1 μm ≤ Ra1 ≤ 10 μm, and the dyne value of the surface of the first metal portion 10 is greater than or equal to 38. In this embodiment, performing a surface roughening treatment on the first metal portion 10 can increase the contact area of ​​the interface between the first metal portion 10 and the bonding portion 20. In addition, it can also make the first metal portion 10 and the bonding portion 20 have a micro-mechanical interlocking structure, which helps to improve the bonding force between the first metal portion 10 and the bonding portion 20.

[0110] Optionally, the first metal part 10 is first roughened and then cleaned to remove surface impurities.

[0111] Optionally, the surface roughening treatment can be, but is not limited to, at least one of wire drawing, grinding, sandblasting, shot peening, pickling, alkaline washing, laser treatment, etc.

[0112] Optionally, the cleaning method can be, but is not limited to, at least one of ultrasonic cleaning, solvent cleaning, plasma cleaning, etc.

[0113] Specifically, the surface roughness Ra1 of the first metal part 10 after surface roughening can be, but is not limited to, 0.1μm, 0.3μm, 0.5μm, 0.6μm, 0.7μm, 0.8μm, 0.9μm, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. If the surface roughness Ra1 of the first metal part 10 after surface roughening is too small, it reduces the micro-mechanical interlocking structure and is not conducive to improving the bonding force between the first metal part 10 and the connecting part 20; if the surface roughness Ra1 of the first metal part 10 after surface roughening is too large, it will reduce the contact area of ​​the interface between the first metal part 10 and the connecting part 20, which is not conducive to improving the bonding force between the first metal part 10 and the connecting part 20.

[0114] Furthermore, the surface roughness Ra1 of the first metal part 10 after surface roughening is in the range of 0.5μm≤Ra1≤1μm. This can better increase the contact area of ​​the interface between the first metal part 10 and the connecting part 20, so that the first metal part 10 and the connecting part 20 have a better micro-mechanical interlocking structure, which helps to improve the bonding force between the first metal part 10 and the connecting part 20.

[0115] Specifically, the dyne value of the surface of the first metal part 10 after surface roughening can be, but is not limited to, 38, 39, 40, 41, 42, 43, 44, 45, etc. Further, the dyne value of the surface of the first metal part 10 after surface roughening is greater than or equal to 40. If the dyne value of the surface of the first metal part 10 after surface roughening is too small, it is not conducive to improving the bonding force between the first metal part 10 and the bonding part 20.

[0116] In some embodiments, in S201, providing the bonding portion 20 or the metal powder forming the bonding portion 20 includes: the bonding portion 20 being a plate, and the bonding portion 20 undergoing surface roughening treatment so that the surface roughness Ra2 of the bonding portion 20 is in the range of 0.01μm≤Ra2≤1μm, and the dyne value of the surface of the bonding portion 20 is greater than or equal to 38. In this embodiment, the surface roughening treatment of the bonding portion 20 allows for more sufficient contact between the bonding portion 20 and the first metal portion 10 and the second metal portion 30, forming a micro-mechanical interlocking structure, thereby resulting in better bonding force between the first metal portion 10, the bonding portion 20, and the second metal portion 30.

[0117] Optionally, the joint 20 is first roughened and then cleaned to remove impurities from the surface.

[0118] Optionally, the surface roughening treatment can be, but is not limited to, at least one of wire drawing, grinding, sandblasting, shot peening, pickling, alkaline washing, laser treatment, etc.

[0119] Optionally, the cleaning method can be, but is not limited to, at least one of ultrasonic cleaning, solvent cleaning, plasma cleaning, etc.

[0120] Specifically, the surface roughness Ra2 of the roughened bonding portion 20 can be, but is not limited to, 0.01μm, 0.03μm, 0.05μm, 0.08μm, 0.1μm, 0.2μm, 0.3μm, 0.4μm, 0.5μm, 0.6μm, 0.7μm, 0.8μm, 0.9μm, 1μm, etc. This allows for more thorough contact between the bonding portion 20 and the first metal portion 10 and the second metal portion 30 during pretreatment and lamination, forming a micro-mechanical interlocking structure, thereby resulting in better bonding force among the first metal portion 10, the bonding portion 20, and the second metal portion 30.

[0121] When the material of the second metal part 30 is stainless steel, iron, iron alloy, titanium, or titanium alloy, the surface roughness Ra2 of the joint part 20 after surface roughening ranges from 0.1 μm to 0.5 μm. Because the hardness and melting point of the joint part 20 are lower than those of the second metal part 30, the joint part 20 softens under high temperature and pressure during pretreatment and lamination, allowing for better contact with the first metal part 10 and the second metal part 30 and the formation of a micro-mechanical interlocking structure. When the material of the second metal part 30 is magnesium or magnesium alloy, the surface roughness Ra2 of the joint part 20 after surface roughening ranges from 0.1 μm to 1 μm. Because the hardness and melting point of the joint part 20 are comparable to those of the second metal part 30, both the joint part 20 and the second metal part 30 soften under high temperature and pressure during pretreatment and lamination, allowing for better contact with the first metal part 10 and the second metal part 30 and the formation of a micro-mechanical interlocking structure.

[0122] Specifically, the dyne value of the surface of the roughened joint portion 20 can be, but is not limited to, 38, 39, 40, 41, 42, 43, 44, 45, etc. Further, the dyne value of the roughened joint portion 20 is greater than or equal to 40. If the dyne value of the roughened joint portion 20 is too small, it is not conducive to improving the bonding force between the joint portion 20 and the first metal portion 10 and the second metal portion 30.

[0123] In other embodiments, in S201, providing the bonding portion 20 or the metal powder forming the bonding portion 20 includes providing the metal powder forming the bonding portion 20, wherein the median particle size D50 of the metal powder is in the range of 1 μm ≤ D50 ≤ 20 μm.

[0124] Specifically, the median particle size D50 of the metal powder can be, but is not limited to, 1μm, 2μm, 4μm, 6μm, 8μm, 10μm, 12μm, 14μm, 16μm, 18μm, 20μm, etc. Both excessively large and excessively small median particle size D50 of the metal powder can easily lead to porosity at the bonding portion 20, resulting in decreased bonding strength. However, this is not a major influencing factor. With proper pretreatment and composite processes, even with larger or smaller particle sizes, good bonding strength can still be obtained.

[0125] In some embodiments, in S201, providing the second metal portion 30 includes: performing a surface roughening treatment on the second metal portion 30 so that the surface roughness Ra3 of the second metal portion 30 is in the range of 0.1 μm ≤ Ra3 ≤ 10 μm, and the dyne value of the surface of the second metal portion 30 is greater than or equal to 38. In this embodiment, performing a surface roughening treatment on the second metal portion 30 can increase the contact area of ​​the interface between the second metal portion 30 and the bonding portion 20. In addition, it can also make the second metal portion 30 and the bonding portion 20 have a micro-mechanical interlocking structure, which helps to improve the bonding force between the second metal portion 30 and the bonding portion 20.

[0126] Optionally, the second metal part 30 is first roughened and then cleaned to remove surface impurities.

[0127] Optionally, the surface roughening treatment can be, but is not limited to, at least one of wire drawing, grinding, sandblasting, shot peening, pickling, alkaline washing, laser treatment, etc.

[0128] Optionally, the cleaning method can be, but is not limited to, at least one of ultrasonic cleaning, solvent cleaning, plasma cleaning, etc.

[0129] Specifically, the surface roughness Ra3 of the second metal part 30 after surface roughening can be, but is not limited to, 0.1μm, 0.3μm, 0.5μm, 0.6μm, 0.7μm, 0.8μm, 0.9μm, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc. If the surface roughness Ra3 of the second metal part 30 after surface roughening is too small, it reduces the micro-mechanical interlocking structure and is not conducive to improving the bonding force between the second metal part 30 and the connecting part 20; if the surface roughness Ra3 of the second metal part 30 after surface roughening is too large, it will reduce the contact area of ​​the interface between the second metal part 30 and the connecting part 20, which is not conducive to improving the bonding force between the second metal part 30 and the connecting part 20.

[0130] Furthermore, the surface roughness Ra3 of the second metal part 30 after surface roughening is in the range of 0.5μm≤Ra3≤1μm. This can better increase the contact area of ​​the interface between the second metal part 30 and the connecting part 20, so that the second metal part 30 and the connecting part 20 have a better micro-mechanical interlocking structure, which helps to improve the bonding force between the second metal part 30 and the connecting part 20.

[0131] Specifically, the dyne value of the surface of the second metal part 30 after surface roughening can be, but is not limited to, 38, 39, 40, 41, 42, 43, 44, 45, etc. Further, the dyne value of the surface of the second metal part 30 after surface roughening is greater than or equal to 40. If the dyne value of the surface of the second metal part 30 after surface roughening is too small, it is not conducive to improving the bonding force between the second metal part 30 and the bonding part 20.

[0132] Please see Figure 5 In some embodiments, in S202, the composite process to obtain the composite board 100 includes:

[0133] S2021, pretreatment is performed at a first temperature T1 where Tm-250℃≤T1≤Tm-50℃, wherein Tm is the melting point of the lowest melting point among the first metal part 10, the bonding part 20, and the second metal part 30; and

[0134] Optionally, the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30 are placed in a special mold and placed in a vacuum furnace to create a vacuum of less than or equal to 10 Pa. Pretreatment is then performed at a first temperature T1 of Tm-250℃≤T1≤Tm-50℃ for 2 hours to 24 hours. In this embodiment, pretreatment is performed before the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30 are composited. This allows for initial bonding of the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30, and also removes as much air as possible from the mold, which helps to improve the bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30 of the formed composite plate 100.

[0135] Specifically, the vacuum degree during pretreatment can be, but is not limited to, ≤10Pa, ≤9Pa, ≤8Pa, ≤7Pa, ≤6Pa, ≤5Pa, ≤4Pa, ≤3Pa, ≤2Pa, ≤1Pa, or ≤0.5Pa. If the vacuum degree during pretreatment is too high, pores are likely to exist at the interface between the first metal part 10, the bonding part 20, and the second metal part 30 of the resulting composite plate 100, affecting the bonding between the first metal part 10, the bonding part 20, and the second metal part 30.

[0136] Specifically, the pretreatment time can be, but is not limited to, 2 hours, 4 hours, 6 hours, 8 hours, 12 hours, 14 hours, 16 hours, 18 hours, 20 hours, 22 hours, 24 hours, etc. If the pretreatment time is too short, it will be difficult to extract the air inside the mold, and the residual air will easily accumulate at the interface, causing a decrease in bonding strength; if the pretreatment time is too long, it will increase the cost of the composite board 100 and reduce the production efficiency of the composite board 100.

[0137] Specifically, the first temperature T1 can be, but is not limited to, Tm-250℃, Tm-220℃, Tm-200℃, Tm-180℃, Tm-160℃, Tm-140℃, Tm-120℃, Tm-100℃, Tm-80℃, Tm-50℃, etc. If the pretreatment temperature is too low, it will be difficult to extract the air inside the mold, and the residual air will easily accumulate at the interface, causing a decrease in the bonding strength; if the pretreatment temperature is too high, a thick oxide layer will easily form at the interface, which will significantly reduce the bonding strength.

[0138] In one specific embodiment, when the melting point of the lowest melting point among the first metal part 10, the connecting part 20 and the second metal part 30 is 550°C, the pretreatment temperature is 300°C to 500°C. Specifically, it can be, but is not limited to, 300°C, 330°C, 350°C, 380°C, 400°C, 430°C, 450°C, 480°C, 500°C, etc.

[0139] In another specific embodiment, when the melting point of the lowest melting point among the first metal part 10, the connecting part 20 and the second metal part 30 is 650°C, the pretreatment temperature is 400°C to 600°C. Specifically, it can be, but is not limited to, 400°C, 430°C, 450°C, 480°C, 500°C, 530°C, 550°C, 580°C, 600°C, etc.

[0140] S2022, hot pressing or hot isostatic pressing is performed at a pressure P1 of 10MPa≤P1≤250MPa and a second temperature T2 of Tm-150℃≤T1≤Tm-50℃ to obtain the composite board 100.

[0141] Optionally, the pre-treated first metal part 10, bonding part 20 or metal powder forming bonding part 20, and second metal part 30, together with a special mold, are placed in a hot press or hot isostatic pressing furnace. The hot pressing or hot isostatic pressing treatment is performed at a pressure P1 of 10MPa≤P1≤250MPa and a second temperature T2 of Tm-150℃≤T1≤Tm-50℃ for 1 hour to 10 hours, so that the first metal part 10, bonding part 20 or metal powder forming bonding part 20, and second metal part 30 are bonded together to obtain the composite plate 100.

[0142] Specifically, the pressure P1 can be, but is not limited to, 10MPa, 30MPa, 50MPa, 80MPa, 100MPa, 120MPa, 140MPa, 160MPa, 180MPa, 200MPa, 220MPa, 250MPa, etc. If the pressure P1 is too small, it will not be enough to cause plastic deformation of the metal material, and the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30 will not be able to adhere tightly, which is not conducive to the formation of a micro-mechanical interlocking structure and the mutual diffusion of metal atoms, resulting in a decrease in the bonding force of the first metal part 10, the bonding part 20, and the second metal part 30 of the composite plate 100. If the pressure P1 is too large, it will require high equipment, significantly increase the cost, and will not help improve the bonding force beyond a certain value.

[0143] Furthermore, the pressure P1 ranges from 50MPa to 250MPa. This allows the metal material to undergo better plastic deformation, and the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30 are closely bonded together. This facilitates the formation of a micro-mechanical interlocking structure and the mutual diffusion of metal atoms, resulting in a composite plate 100 with high bonding force between the first metal part 10, the bonding part 20, and the second metal part 30, while also having a lower manufacturing cost.

[0144] Furthermore, the pressure P1 ranges from 50MPa to 200MPa. This allows the metal material to undergo better plastic deformation, ensuring that the first metal part 10, the bonding part 20 or the metal powder forming the bonding part 20, and the second metal part 30 are tightly bonded together. This facilitates the formation of a micro-mechanical interlocking structure and the mutual diffusion of metal atoms, resulting in a composite plate 100 with high bonding strength between the first metal part 10, the bonding part 20, and the second metal part 30, while also having a lower manufacturing cost.

[0145] Specifically, the hot pressing or hot isostatic pressing treatment time can be, but is not limited to, 1 hour, 2 hours, 3 hours, 4 hours, 5 hours, 6 hours, 7 hours, 8 hours, 9 hours, 10 hours, etc. If the hot pressing or hot isostatic pressing treatment time is too short, the diffusion of atoms at the interface will be insufficient, and the bonding force between the first metal part 10, the bonding part 20, and the second metal part 30 of the composite plate 100 will decrease. If the hot pressing or hot isostatic pressing treatment time is too long, the bonding force between the first metal part 10, the bonding part 20, and the second metal part 30 of the composite plate 100 will not be improved, but the manufacturing cost of the composite plate 100 will be greatly increased.

[0146] Specifically, the second temperature T2 can be, but is not limited to, Tm-150℃, Tm-140℃, Tm-130℃, Tm-120℃, Tm-110℃, Tm-100℃, Tm-90℃, Tm-80℃, Tm-70℃, Tm-60℃, Tm-50℃, etc. If the temperature of hot pressing or hot isostatic pressing is too low, the metal deformation resistance will be high, the degree of recrystallization will be insufficient, and the atomic diffusion will be slow, which will reduce the bonding force between the first metal part 10, the bonding part 20 and the second metal part 30 of the composite plate 100. If the temperature of hot pressing or hot isostatic pressing is too high, a large number of brittle intermetallic compounds and coarse grains will be generated, which will significantly reduce the bonding force and the mechanical properties of the material.

[0147] In one specific embodiment, when the melting point of the lowest melting point among the first metal part 10, the connecting part 20 and the second metal part 30 is 550°C, the second temperature T2 is 400°C to 500°C. Specifically, it can be, but is not limited to, 400°C, 410°C, 420°C, 430°C, 440°C, 450°C, 460°C, 470°C, 480°C, 490°C, 500°C, etc.

[0148] In another specific embodiment, when the melting point of the lowest melting point among the first metal part 10, the connecting part 20 and the second metal part 30 is 650°C, the second temperature T2 is 500°C to 600°C. Specifically, it can be, but is not limited to, 500°C, 510°C, 520°C, 530°C, 540°C, 550°C, 560°C, 570°C, 580°C, 590°C, 600°C, etc.

[0149] In another specific embodiment, when the melting point of the lowest melting point among the first metal part 10, the connecting part 20 and the second metal part 30 is 750°C, the second temperature T2 is 550°C to 650°C. Specifically, it can be, but is not limited to, 550°C, 560°C, 570°C, 580°C, 590°C, 600°C, 610°C, 620°C, 630°C, 640°C, 650°C, etc.

[0150] In one specific embodiment, the pressure for hot pressing or hot isostatic pressing is 50 MPa to 250 MPa, the temperature is 450°C to 550°C, and the time is 1 h to 4 h.

[0151] In other embodiments, when the joint 20 is a sheet metal, the second metal part 30 and the joint 20 can be first bonded together by common methods such as rolling, extrusion, and friction welding, and then the bonded second metal part 30 and the joint 20 can be bonded together with the first metal part 10 by hot pressing or hot isostatic pressing.

[0152] Please see Figure 6This application also provides a method for preparing a composite board 100, which includes:

[0153] S301, a first metal part 10, a bonding part 20 or metal powder forming the bonding part 20, and a second metal part 30 are provided. The first metal part 10 is made of aluminum-based composite material, and the materials of the first metal part 10 and the second metal part 30 are different.

[0154] S302, the bonding portion 20 or the metal powder forming the bonding portion 20 is disposed between the first metal portion 10 and the second metal portion 30, and composite is performed to obtain an intermediate composite plate, wherein the bonding portion 20 is disposed on one side of the first metal portion 10, and the bonding portion 20 comprises, by mass fraction: 60.5wt% to 99wt% aluminum, 0.5wt% to 7.0wt% zinc, 0.1wt% to 20.0wt% silicon, 0.2wt% to 6.0wt% manganese, and 0.2wt% to 6.0wt% copper;

[0155] S303, the intermediate composite plate is heat-treated to obtain composite plate 100.

[0156] Please see Figure 7 Optionally, in S303, the heat treatment includes:

[0157] S3031 is annealed at a third temperature T3 of 350℃≤T3≤400℃;

[0158] Specifically, the third temperature T3 (i.e., the annealing temperature) can be, but is not limited to, 350℃, 360℃, 370℃, 380℃, 390℃, 400℃, etc. If the third temperature T3 is too low, it will not be able to achieve the effects of reducing intragranular segregation, promoting the decomposition of supersaturated solid solutions, and spheroidizing excess phases, resulting in an imbalance in the internal structure of the first metal part 10 (such as aluminum-based composite materials) and the bonding part 20; if the third temperature T3 is too high, secondary recrystallization and grain growth are likely to occur, leading to a decrease in the strength, hardness, and toughness of the material.

[0159] Optionally, the annealing time can be from 2 hours to 12 hours. The annealing time can be, but is not limited to, 2 hours, 4 hours, 6 hours, 8 hours, 10 hours, 12 hours, etc.

[0160] In this embodiment, annealing can reduce intragranular segregation in the bonding portion 20 and the first metal portion 10 during composite formation, promote the decomposition of supersaturated solid solutions, spheroidize excess phases, improve the microstructure and chemical stability of the composite plate 100, and reduce the internal stress of the obtained composite plate 100.

[0161] S3032 was subjected to solution treatment at a fourth temperature T4 of 450℃≤T4≤550℃; and

[0162] Optionally, the temperature is maintained at a fourth temperature T4 of 450℃≤T4≤550℃ for 1 hour to 4 hours, followed by rapid cooling (air cooling or water cooling) for solution treatment. In this embodiment, through solution treatment, alloying elements such as Zn, Mn, Cu, and Si in the bonding portion 20 and the first metal portion 10 are fully incorporated into the aluminum grains to form a supersaturated solid solution.

[0163] Specifically, the fourth temperature T4 (i.e., the solution temperature) can be, but is not limited to, 450℃, 460℃, 470℃, 480℃, 490℃, 500℃, 510℃, 520℃, 530℃, 540℃, 550℃, etc. If the solution temperature is too high, it can easily cause coarse grains in the aluminum matrix in the bonding part 20 and the first metal part 10 (such as aluminum-based composite material), or even overheating; if the solution temperature is too low, the reinforcing phase of the aluminum matrix in the bonding part 20 and the first metal part 10 (such as aluminum-based composite material) will not dissolve sufficiently, resulting in a decrease in the strength and hardness of the material.

[0164] Specifically, the heat treatment time can be, but is not limited to, 1 hour, 2 hours, 3 hours, 4 hours, etc.

[0165] S3033 is subjected to aging treatment at the fifth temperature T5, where T5 is 25℃≤T5≤200℃.

[0166] Optionally, artificial aging treatment can be performed by holding the material at a fifth temperature T5 of 100℃≤T5≤200℃ for 1 to 4 hours; or, natural aging treatment can be performed by storing the material at room temperature (e.g., 25℃) for more than 96 hours. In this embodiment, aging treatment can cause the supersaturated solid solution to decompose and uniformly precipitate alloying elements and form precipitated phases, thereby strengthening the bonding portion 20 and the first metal portion 10, and improving the bonding strength of the composite interface.

[0167] Specifically, the fifth temperature T5 can be, but is not limited to, 25℃, 30℃, 50℃, 80℃, 100℃, 130℃, 150℃, 180℃, 200℃, etc. If the aging treatment temperature is too high, over-aging is likely to occur, resulting in a decrease in the strength and hardness of the joint 20 and the first metal part 10 (such as aluminum-based composite material).

[0168] In this embodiment, the intermediate composite plate is subjected to heat treatments such as annealing, solution treatment and aging in sequence. This can better improve the bonding force between the first metal part 10, the joint part 20 and the second metal part 30 of the obtained composite plate 100, and improve the tensile bonding strength and shear bonding strength of the composite plate 100.

[0169] The composite board 100 of this application will be further described below through specific embodiments.

[0170] Example 1

[0171] The composite board 100 of this embodiment is prepared by the following steps:

[0172] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 50 wt% 6061 aluminum alloy and 50 wt% silicon carbide particles.

[0173] (2) Passing through the second metal part 30, the second metal part 30 is 316 stainless steel;

[0174] (3) A bonding portion 20 is provided, the material of the bonding portion 20 including: Al 90.7wt%, Zn 2.5wt%, Si 1.5wt%, Mn 1.0wt%, Cu 2.0wt%, Mg 1.5wt%, Ti 0.2wt%, Cr 0.1wt%, Y 0.2wt%, Nb 0.3wt%, and the thickness of the bonding portion 20 is 0.5mm;

[0175] (4) The first metal part 10, the connecting part 20, and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 450°C, and the pretreatment time is 6 hours.

[0176] (5) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 500 °C, and a time of 2 h.

[0177] Example 2

[0178] The composite board 100 of this embodiment is prepared by the following steps:

[0179] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 50 wt% 6061 aluminum alloy and 50 wt% silicon carbide particles.

[0180] (2) Passing through the second metal part 30, the second metal part 30 is TC4 titanium alloy;

[0181] (3) A bonding portion 20 is provided, the material of the bonding portion 20 including: Al 94.3wt%, Zn 1.5wt%, Si 1.5wt%, Mn 1.0wt%, Cu 0.6wt%, Mg 0.3wt%, Ti 0.5wt%, Cr 0.1wt%, Nb 0.1wt%, Sc 0.1wt%, and the thickness of the bonding portion 20 is 1.0mm;

[0182] (4) The first metal part 10, the connecting part 20, and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 480°C, and the pretreatment time is 6 hours.

[0183] (5) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 520 °C, and a time of 2 h.

[0184] Example 3

[0185] The composite board 100 of this embodiment is prepared by the following steps:

[0186] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 95 wt% 7075 aluminum alloy and 5 wt% titanium diboride particles.

[0187] (2) Passing through the second metal part 30, the second metal part 30 is AM91 magnesium alloy;

[0188] (3) A bonding portion 20 is provided, the material of the bonding portion 20 including: Al 90.8wt%, Zn 3.5wt%, Si 1.0wt%, Mn 1.5wt%, Cu 0.5wt%, Mg 2.0wt%, Y 0.2wt%, Nb 0.3wt%, Sc 0.1wt%, Sm 0.1wt%, and the thickness of the bonding portion 20 is 3.0mm;

[0189] (4) The first metal part 10, the connecting part 20, and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 450°C, and the pretreatment time is 4 hours.

[0190] (5) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 480 °C, and a time of 4 h.

[0191] Example 4

[0192] The composite board 100 of this embodiment is prepared by the following steps:

[0193] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 80 wt% 5052 aluminum alloy and 20 wt% silicon carbide particles;

[0194] (2) Passing through the second metal part 30, the second metal part 30 is 410 stainless steel;

[0195] (3) A bonding portion 20 is provided, the material of the bonding portion 20 including: Al 90.8wt%, Zn 3.5wt%, Si 1.0wt%, Mn 1.5wt%, Cu 0.5wt%, Mg 2.0wt%, Y 0.2wt%, Nb 0.3wt%, Sc 0.1wt%, Sm 0.1wt%, and the thickness of the bonding portion 20 is 1.0mm;

[0196] (4) The first metal part 10, the connecting part 20, and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 450°C, and the pretreatment time is 6 hours.

[0197] (5) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 500 °C, and a time of 2 h.

[0198] Comparative Example 1

[0199] The composite board 100 of this comparative example was prepared by the following steps:

[0200] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 50 wt% 6061 aluminum alloy and 50 wt% silicon carbide particles.

[0201] (2) Passing through the second metal part 30, the second metal part 30 is 316 stainless steel;

[0202] (3) The first metal part 10 and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 450°C, and the pretreatment time is 6 hours.

[0203] (4) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 500 °C, and a time of 2 h.

[0204] Comparative Example 2

[0205] The composite board 100 of this comparative example was prepared by the following steps:

[0206] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 50 wt% 6061 aluminum alloy and 50 wt% silicon carbide particles.

[0207] (2) Passing through the second metal part 30, the second metal part 30 is 316 stainless steel.

[0208] (3) A bonding portion 20 is provided, the material of the bonding portion 20 including: Al 90.3wt%, Zn 3.0wt%, Si 2.5wt%, Mn 1.0wt%, Cu 2.0wt%, Mg 0.5wt%, Ti 0.1wt%, Cr 0.1wt%, Y 0.2wt%, Nb 0.3wt%, and the thickness of the bonding portion 20 is 0.5mm;

[0209] (4) The first metal part 10, the joint part 20 and the second metal part 30 are combined by rolling method. During the combination process, the first metal part 10 breaks and the combination cannot be completed.

[0210] The composite plates 100 prepared in the above embodiments and comparative examples were tested for tensile bond strength and shear bond strength according to "GB / T 11363-2008 Test Method for Strength of Brazed Joints". The test results of the composite plates 100 of Examples 1-4 and Comparative Examples 1-2 are shown in Table 1 below.

[0211] Figures 8 to 10 An optical microscope image of the composite board 100 prepared in Example 1. Figures 11 to 13 This is a scanning electron microscope (SEM) image of the composite material 100 prepared in Example 1. Figures 8 to 13 It can be seen that the first metal part 10, the connecting part 20 and the second metal part 30 are well connected.

[0212] Table 1 Performance parameters of composite board 100 in Examples 1-4 and Comparative Examples 1-2

[0213] Example Tensile bond strength (MPa) Shear bond strength (MPa) Example 1 305MPa 272MPa Example 2 297MPa 252MPa Example 3 211MPa 187MPa Example 4 269MPa 220MPa Comparative Example 1 59MPa 24MPa Comparative Example 2 / /

[0214] As can be seen from the test results of Examples 1 to 4 and Comparative Example 1, compared with Comparative Example 1 without the joint 20, the composite board 100 prepared in this application embodiment has a significantly improved tensile strength and shear strength by adding the joint 20 and designing the material composition of the joint 20.

[0215] As can be seen from the test results of Examples 1 to 4 and Comparative Example 2, when the bonding portion 20 of the present application is used for composite bonding using conventional rolling methods, the first metal portion 10 is prone to breakage and cannot be composited. However, the present application embodiment first performs pretreatment by hot isostatic pressing in a hot isostatic pressing furnace, which can effectively composite the first metal portion 10, the bonding portion 20 and the second metal portion 30, and the resulting composite plate 100 has high tensile bonding strength and shear bonding strength.

[0216] Examples 5 to 40, Comparative Examples 3 to 14

[0217] The composite board 100 of this embodiment and comparative example is prepared by the following steps:

[0218] (1) A first metal part 10 is provided, wherein the first metal part 10 is an aluminum-based composite material, consisting of 50 wt% 6061 aluminum alloy and 50 wt% silicon carbide particles.

[0219] (2) Passing through the second metal part 30, the second metal part 30 is 316 stainless steel;

[0220] (3) A joint portion 20 is provided, the thickness of which is 0.5 mm. The composition of the joint portion 20 in each embodiment and comparative example is shown in Table 2 below.

[0221] (4) The first metal part 10, the connecting part 20, and the second metal part 30 are stacked sequentially, placed in a special mold, and then pretreated in a vacuum furnace. The vacuum degree of the vacuum furnace is 0.1 Pa, the pretreatment temperature is 450°C, and the pretreatment time is 6 hours.

[0222] (5) Composite is carried out in a hot isostatic pressing furnace at a pressure of 100 MPa, a temperature of 500 °C, and a time of 2 h.

[0223] Example 41

[0224] The difference between this embodiment and Embodiment 6 is that the preparation method of the composite board 100 further includes:

[0225] (1) The hot-pressed sheet material is annealed at 380℃ for 6 hours;

[0226] (2) Keep at 500℃ for 2 hours, then rapidly cool for solution treatment; and

[0227] (3) Perform aging treatment by keeping the temperature at 150℃ for 2 hours.

[0228] The composite plates 100 prepared in the above embodiments and comparative examples were tested for tensile bond strength and shear bond strength in accordance with GB / T 11363-2008 Test Method for Strength of Brazed Joints. The test results of the composite plates 100 of Examples 5 to 41 and Comparative Examples 3 to 14 are shown in Table 3 below.

[0229] Table 2 Material composition of the joint 20 between Examples 5-40 and Comparative Examples 3-14

[0230]

[0231]

[0232] Table 3 Performance parameters of composite board 100 of Examples 5-40 and Comparative Examples 3-14

[0233]

[0234]

[0235] The test results from Examples 5 to 9, Comparative Examples 3 and 4 show that when no zinc is added to the joint 20 (Comparative Example 3), the tensile bond strength and shear bond strength of the composite board 100 are both low. When 0.5 wt% to 7 wt% zinc is added to the joint 20 (Examples 5 to 9), the tensile bond strength of the composite board 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases, as the zinc content in the joint 20 increases. When the zinc content in the joint 20 is too high (as in Comparative Example 4), the tensile bond strength and shear bond strength of the composite board 100 decrease significantly.

[0236] The test results from Examples 10 to 15, Comparative Examples 5 and 6 show that when no silicon is added to the bonding portion 20 (Comparative Example 5), the tensile bond strength and shear bond strength of the resulting composite board 100 are both low. When silicon with a mass fraction of 0.1 wt% to 10 wt% is added to the bonding portion 20 (Examples 10 to 15), as the silicon content in the bonding portion 20 increases, the tensile bond strength of the resulting composite board 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases. When the silicon content in the bonding portion 20 is too high (as in Comparative Example 6), the tensile bond strength and shear bond strength of the resulting composite board 100 decrease significantly.

[0237] The test results from Examples 16 to 20, Comparative Examples 7 and 8 show that when no manganese is added to the joint 20 (Comparative Example 7), the tensile bond strength and shear bond strength of the resulting composite board 100 are both low. When 0.2 wt% to 5 wt% manganese is added to the joint 20 (Examples 16 to 20), the tensile bond strength of the resulting composite board 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases, as the manganese content in the joint 20 increases. When the manganese content in the joint 20 is too high (as in Comparative Example 8), the tensile bond strength and shear bond strength of the resulting composite board 100 decrease significantly.

[0238] The test results from Examples 21 to 25, Comparative Example 9, and Comparative Example 10 show that when no copper is added to the joint 20 (Comparative Example 9), the tensile bond strength and shear bond strength of the resulting composite plate 100 are both low. When copper with a mass fraction of 0.2 wt% to 6 wt% is added to the joint 20 (Examples 21 to 25), as the copper content in the joint 20 increases, the tensile bond strength of the resulting composite plate 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases. When the copper content in the joint 20 is too high (as in Comparative Example 10), the tensile bond strength and shear bond strength of the resulting composite plate 100 decrease significantly.

[0239] The test results from Examples 6, 26 to 29, and Comparative Example 11 show that when magnesium is added to the joint 20, the tensile bond strength and shear bond strength of the composite board 100 can be improved. When the mass fraction of magnesium in the joint 20 is 0.03wt% to 5wt% (Examples 6, 26 to 29), as the magnesium content in the joint 20 increases, the tensile bond strength of the composite board 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases. When the magnesium content in the joint 20 is too high (as in Comparative Example 11), the tensile bond strength and shear bond strength of the composite board 100 decrease significantly.

[0240] The test results of Examples 26, 30 to 33, and Comparative Example 12 show that when titanium is added to the joint 20, the tensile bond strength and shear bond strength of the composite plate 100 can be improved. When the mass fraction of titanium in the joint 20 is 0.01wt% to 2wt%, as the titanium content in the joint 20 increases, the tensile bond strength of the composite plate 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases. When the titanium content in the joint 20 is too high (such as in Comparative Example 12), the tensile bond strength and shear bond strength of the composite plate 100 decrease significantly.

[0241] The test results of Examples 31, 34 to 37 and Comparative Example 13 show that when chromium is added to the joint 20, the tensile bond strength and shear bond strength of the composite plate 100 can be improved. When the mass fraction of chromium in the joint 20 is 0.01wt% to 2wt%, as the chromium content in the joint 20 increases, the tensile bond strength of the composite plate 100 first gradually increases and then gradually decreases, and the shear bond strength also first gradually increases and then gradually decreases. When the chromium content in the joint 20 is too high (such as in Comparative Example 13), the tensile bond strength and shear bond strength of the composite plate 100 decrease significantly.

[0242] The test results of Examples 34, 39 to 40, and Comparative Example 14 show that when rare earth element niobium is added to the joint 20, the tensile bond strength and shear bond strength of the composite plate 100 can be improved. When the mass fraction of rare earth element niobium in the joint 20 is 0.03wt% to 1.5wt%, the tensile bond strength of the composite plate 100 increases gradually and then decreases gradually with the increase of rare earth element niobium content in the joint 20, and the shear bond strength also increases gradually and then decreases gradually. When the rare earth element niobium content in the joint 20 is too high (such as in Comparative Example 14), the tensile bond strength and shear bond strength of the composite plate 100 decrease significantly.

[0243] As can be seen from the test results of Examples 6 and 41, under the condition that other conditions remain unchanged, the composite board 100 has higher tensile bond strength and shear bond strength after being subjected to heat treatments such as annealing, solution treatment and aging after being composited.

[0244] Please see Figure 14 and Figure 15 This application embodiment also provides a structural component 200 for an electronic device, the structural component 200 including the composite board 100 described in this application embodiment.

[0245] For a detailed description of other aspects of the composite board 100, please refer to the description of the corresponding part of the above embodiments, which will not be repeated here.

[0246] Understandably, the structural component 200 is prepared using the composite sheet material 100 of the present application embodiment.

[0247] Optionally, the structural component 200 may be, but is not limited to, at least one of the following: a support plate for a foldable screen, a mid-frame for an electronic device, etc.

[0248] In some embodiments, the structural component 200 is a support plate for a foldable screen. The support plate includes a first support portion, a bendable portion, and a second support portion connected in sequence. The first support portion and the second support portion are both first metal portions 10 of this application, and the bendable portion is a second metal portion 30. The first support portion and the bendable portion, as well as the second support portion and the bendable portion, are connected by a connecting portion 20. This gives the first and second support portions of the support plate good rigidity and support performance, the bendable portion good bendability, and a light weight, which can well meet the requirements of foldable screens for support plates. In addition, the first support portion, the bendable portion, and the second support portion have good bonding strength, thereby resulting in a longer service life.

[0249] In other embodiments, the structural member 200 is a middle frame, which includes a first metal part 10, a connecting part 20, and a second metal part 30 stacked sequentially. In use, the second metal part 30 serves as the external appearance surface of the middle frame, while the first metal part 10 is a non-external appearance surface (i.e., facing away from the external appearance surface). This allows the middle frame to have high mechanical strength and light weight, and also provides a better appearance for the second metal part 30.

[0250] Please see Figures 16 to 18 This application also provides an electronic device 300, which includes: a display screen 310, a structural component 200 of the electronic device 300 described in this application, and a processor 330. The processor 330 is electrically connected to the display screen 310 and is used to control the display screen 310 to display.

[0251] The electronic device 300 in this application embodiment can be, but is not limited to, a mobile phone, tablet computer, laptop computer, desktop computer, smart bracelet, smartwatch, e-reader, game console, or other portable electronic device 300 or foldable electronic device 300.

[0252] Optionally, the structural component 200 may be at least one of the mid-frame, support plate, etc. of the electronic device 300. In the following description, the structural component 200 is illustrated and explained using the mid-frame as an example, and should not be construed as limiting the structural component 200 of the embodiments of this application; nor should it be construed as limiting the electronic device 300 of the embodiments of this application.

[0253] For a detailed description of other aspects of structural component 200, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0254] Optionally, the display screen 310 may be, but is not limited to, one or more of the following: liquid crystal display screen, light-emitting diode display screen (LED display screen), micro light-emitting diode display screen (Micro LED display screen), mini LED display screen, organic light-emitting diode display screen (OLED display screen).

[0255] Optionally, processor 330 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), microprocessor, microcontroller, main processor, controller, and ASIC, etc. Processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in memory 350, which enables the computing device to provide a wide range of services.

[0256] Optionally, the electronic device 300 of this application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store the program code required for the processor 330 to run, the program code required to control the display screen 310, the display content of the display screen 310, etc.

[0257] Optionally, memory 350 may include volatile memory, such as random access memory (RAM); memory 350 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). Memory 350 may also include combinations of the above types of memory 350.

[0258] In some embodiments, the structural member 200 is a mid-frame. The electronic device 300 in this application embodiment further includes a housing 360 and a camera module 370. The housing 360 is disposed opposite to the display screen 310. The structural member 200 is disposed between the display screen 310 and the housing 360, and the side surface (second metal part 30) of the structural member 200 is exposed between the housing 360 and the display screen 310. The structural member 200 and the housing 360 enclose an accommodating space (not shown), which is used to accommodate the processor 330, the memory 350, and the camera module 370. The camera module 370 is electrically connected to the processor 330 and is used to take pictures under the control of the processor 330.

[0259] Optionally, the housing 360 has a light-transmitting portion 361, through which the camera module 370 can capture images. That is, in this embodiment, the camera module 370 is a rear-facing camera module 370. It is understood that in other embodiments, the light-transmitting portion 361 may be disposed on the display screen 310, i.e., the camera module 370 is a front-facing camera module 370. In the schematic diagram of this embodiment, the light-transmitting portion 361 is shown as an opening. In other embodiments, the light-transmitting portion 361 may not be an opening, but may be made of a light-transmitting material, such as plastic or glass.

[0260] It is understood that the electronic device 300 described in this embodiment is merely one form of the electronic device 300 used in the housing 360, and should not be construed as a limitation on the electronic device 300 provided in this application, nor should it be construed as a limitation on the housing 360 provided in various embodiments of this application.

[0261] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form yet another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0262] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A composite board material, characterized by, comprises: a first metal portion made of an aluminum-based composite material; a bonding portion provided on one side of the first metal portion, the bonding portion comprising, by mass fraction: 60.5 to 99 wt% of aluminum, 0.5 to 7.0 wt% of zinc, 0.1 to 10.0 wt% of silicon, 0.2 to 6.0 wt% of manganese, and 0.2 to 6.0 wt% of copper; and a second metal portion provided on the side of the bonding portion facing away from the first metal portion, the second metal portion being made of a material different from that of the first metal portion.

2. The composite material according to claim 1, wherein the bonding portion comprises, by mass fraction: 77.5 to 96.4 wt% of aluminum, 1.5 to 5.0 wt% of zinc, 0.5 to 6.0 wt% of silicon, 0.5 to 2.5 wt% of manganese, and 0.5 to 4.0 wt% of copper. The bonding portion further comprises magnesium, the mass fraction of magnesium in the bonding portion being 0.03 to 5 wt%. Panel, characterized in that The bonding portion further comprises titanium, the mass fraction of titanium in the bonding portion being 0.01 to 2 wt%.

3. The composite sheet material of claim 1 or 2, wherein The bonding portion further comprises chromium, the mass fraction of chromium in the bonding portion being 0.01 to 2 wt%.

4. The composite sheet material of claim 1 or 2, wherein The bonding portion further comprises a rare earth element, the mass fraction of the rare earth element in the bonding portion being 0.03 to 1.5 wt%, the rare earth element comprising at least one of yttrium, samarium, scandium, and niobium.

5. The composite sheet material of claim 1 or 2, wherein The second metal portion is made of at least one of iron, stainless steel, or iron alloy, the bonding portion comprising, by mass fraction: 63.5 to 98.6 wt% of aluminum, 0.5 to 7.0 wt% of zinc, 0.5 to 10.0 wt% of silicon, 0.2 to 5.0 wt% of manganese, and 0.2 to 6.0 wt% of copper; 6. The composite sheet material of claim 1 or 2, wherein Alternatively, the second metal portion is made of titanium or titanium alloy, the bonding portion comprising, by mass fraction: 70.5 to 98.6 wt% of aluminum, 0.5 to 5.0 wt% of zinc, 0.5 to 8.0 wt% of silicon, 0.2 to 3.0 wt% of manganese, and 0.2 to 5.0 wt% of copper; 7. The composite sheet material of claim 1, wherein Alternatively, the second metal portion is made of magnesium or magnesium alloy, the bonding portion comprising, by mass fraction: 66.5 to 98 wt% of aluminum, 0.5 to 7.0 wt% of zinc, 0.1 to 5.0 wt% of silicon, 0.2 to 6.0 wt% of manganese, 0.2 to 5.0 wt% of copper, and 1.0 to 5.0 wt% of magnesium.

8. The composite material according to claim 1, wherein ​ ​ ​ ​ The material of the second metal part is at least one of iron, stainless steel or iron alloy, the bonding part includes, in terms of mass fraction, 79.8wt%-95.4wt% aluminum, 2.0wt%-5.0wt% zinc, 1.0wt%-6.0wt% silicon, 0.2wt%-5.0wt% manganese, 0.5wt%-4.0wt% copper, 0.1wt%-1.5wt% magnesium, 0.01wt%-0.2wt% titanium, 0.01wt%-0.5wt% chromium, and 0.5wt%-1.0wt% rare earth elements; Or, The material of the second metal part is titanium or titanium alloy, the bonding part includes, in terms of mass fraction, 86.0wt%-95.9wt% aluminum, 1.5wt%-3.0wt% zinc, 1.0wt%-3.0wt% silicon, 0.5wt%-1.5wt% manganese, 0.5wt%-3.0wt% copper, 0.1wt%-1.5wt% magnesium, 0.01wt%-0.5wt% titanium, 0.01wt%-0.5wt% chromium, and 0.5wt%-1.0wt% rare earth elements; Or, The material of the second metal part is magnesium or magnesium alloy, the bonding part includes, in terms of mass fraction, 82.8wt%-94.5wt% aluminum, 2.0wt%-5.0wt% zinc, 0.5wt%-2.0wt% silicon, 0.5wt%-2.5wt% manganese, and 0.5wt%-3.0wt% copper, 1.5wt%-3.0wt% magnesium, 0.01wt%-0.2wt% titanium, 0.01wt%-0.5wt% chromium, and 0.5wt%-1.0wt% rare earth elements.

9. The composite sheet material of claim 1, wherein, The thickness of the bonding part ranges from 0.01mm to 5mm along the arrangement direction of the first metal part, the bonding part and the second metal part.

10. The composite sheet material of claim 1, wherein The tensile bonding strength of the composite sheet ranges from 150MPa to 400MPa, and the shear bonding strength of the composite sheet ranges from 100MPa to 350MPa. The aluminum-based composite material includes an aluminum matrix and a reinforcing phase, the aluminum matrix is aluminum or aluminum alloy, and the reinforcing phase includes at least one of particles, fibers or whiskers; in the aluminum-based composite material, the mass fraction of the aluminum matrix ranges from 20wt% to 99.9wt%, and the mass fraction of the reinforcing phase ranges from 0.1wt% to 80wt%.

11. A method of manufacturing a composite board material, characterized by The method comprises: providing a first metal part, a bonding part or a metal powder forming the bonding part, and a second metal part, the material of the first metal part is an aluminum-based composite material, and the materials of the first metal part and the second metal part are different; and The metal powder of the bonding portion or the metal powder for forming the bonding portion is arranged between the first metal portion and the second metal portion, and the composite plate is obtained by compounding, wherein the bonding portion is arranged on one side of the first metal portion, and the bonding portion comprises, in terms of mass fraction, 60.5 wt% to 99 wt% of aluminum, 0.5 wt% to 7.0 wt% of zinc, 0.1 wt% to 10.0 wt% of silicon, 0.2 wt% to 6.0 wt% of manganese, and 0.2 wt% to 6.0 wt% of copper.

12. The method of claim 11, wherein the composite sheet is prepared by a method comprising: The compounding to obtain the composite plate comprises: pre-treatment is performed at a first temperature T1 of Tm-250℃≤T1≤Tm-50℃, wherein Tm is the melting point of the lowest one of the first metal portion, the bonding portion, and the second metal portion; and hot pressing or hot isostatic pressing treatment is performed at a pressure P1 of 10 MPa≤P1≤250 MPa and a second temperature T2 of Tm-150℃≤T1≤Tm-50℃ to obtain the composite plate.

13. The method of claim 11, wherein the composite sheet is prepared by a method comprising: The preparation method further comprises performing heat treatment, and the performing heat treatment comprises: annealing treatment is performed at a third temperature T3 of 350℃≤T3≤400℃; solid solution treatment is performed at a fourth temperature T4 of 450℃≤T4≤550℃; and aging treatment is performed at a fifth temperature T5 of 25℃≤T5≤200℃.

14. The method for preparing the composite board according to any one of claims 11-13, characterized in that, The first metal portion is provided by: surface roughening treatment is performed on the first metal portion, so that the roughness Ra1 of the surface of the first metal portion is in the range of 0.1 μm≤Ra1≤10 μm, and the ten-point average roughness of the surface of the first metal portion is greater than or equal to 38.

15. The method for preparing the composite board according to any one of claims 11-13, characterized in that, The bonding portion or the metal powder for forming the bonding portion is provided by: surface roughening treatment is performed on the bonding portion, so that the roughness Ra2 of the surface of the bonding portion is in the range of 0.01 μm≤Ra2≤1 μm, and the ten-point average roughness of the surface of the bonding portion is greater than or equal to 38; or, 16. The method of claim 11-13, wherein the composite sheet is prepared by the steps of: the metal powder for forming the bonding portion has a median particle size D50 in the range of 1 μm≤D50≤20 μm. The second metal portion is provided by:

17. A structural member for an electronic device, characterized by surface roughening treatment is performed on the second metal portion, so that the roughness Ra3 of the surface of the second metal portion is in the range of 0.1 μm≤Ra3≤10 μm, and the ten-point average roughness of the surface of the second metal portion is greater than or equal to 38.

18. An electronic device, comprising: The structural member comprises the composite plate of any one of claims 1-10 or the composite plate prepared by the preparation method of any one of claims 11-16. comprises: a display screen; the structural member of the electronic device of claim 17; and a processor electrically connected with the display screen and configured to control the display screen to display.

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