Excellent chemical copper deposition equipment and copper deposition method thereof

Abstract

The invention discloses excellent chemical copper deposition equipment which comprises a tank body, a reaction tank located in the tank body and used for copper deposition reaction and an automatic adding device for automatically adding chemicals, and jet flow mechanisms used for spraying the chemicals are arranged at the upper end and the lower end in the tank body. A mounting device used for swinging and clamping products is arranged between the jet flow mechanisms in the reaction tank, the output end of the automatic adding device is connected with an auxiliary tank, and the auxiliary tank is connected with the jet flow mechanisms by arranging a jet flow system; the device is simple in structure and reasonable in design, the micro-nano bubble technology is adopted, micro-nano bubbles are micro bubbles with the diameter ranging from hundreds of nanometers to ten micrometers, and the micro-nano bubbles have the advantages of being high in gas-liquid mass transfer efficiency and solubility, cannot be clamped in holes compared with the holes with the diameter larger than one hundred micrometers, and are not prone to falling off. Oxygen can be provided, the problem that bubbles are blocked cannot occur, and meanwhile the hole penetrating capacity problem of a high-aspect-ratio product is solved through an efficient jet flow system.

Description

[0001] This application is a divisional application of application filed on September 27, 2023, with application number 202311263786.1 and invention title "An excellent chemical copper plating apparatus and copper plating method thereof". Technical Field

[0002] This invention relates to the field of copper plating equipment technology, specifically to an excellent chemical copper plating equipment and its copper plating method. Background Technology

[0003] As PCB design demands higher routing specifications, the number and density of circuit layers are increasing. This increase in layer count inevitably leads to more power and ground layers, while the increased circuit density necessitates smaller via density and diameter. Therefore, PCBs are evolving towards higher layer counts and smaller via diameters. With increasing board thickness and smaller via diameters, the aspect ratio (board thickness to via diameter) of PCB products is becoming increasingly higher. Currently, the aspect ratio of high-end servers, advanced line cards, and ATE testing-related products generally exceeds 30:1, thus requiring PCB manufacturing processes with high through-hole capability.

[0004] The shortcomings of existing technology:

[0005] The electroless copper plating process is an autocatalytic redox reaction that requires oxygen. Current equipment typically uses a combination of jet spraying and aeration. Jet spraying facilitates the exchange of chemicals, while aeration provides oxygen. However, aeration involves drawing air from the atmosphere and injecting it into the bottom of the electroless copper plating tank using a blower. As the air rises in the tank, it generates numerous tiny bubbles. These bubbles, especially those in high aspect ratio holes, may become stuck due to their diameter, affecting the hole penetration capability. Therefore, vibration is often added. However, even with vibration, only large bubbles can be broken into smaller ones; it cannot prevent bubble blockage. Consequently, areas with trapped bubbles cannot deposit electroless copper, resulting in poor hole formation. Summary of the Invention

[0006] The purpose of this invention is to provide an excellent chemical copper plating apparatus to solve the problems mentioned in the background art.

[0007] To achieve the above objectives, the present invention provides the following technical solution: an excellent chemical copper plating equipment, comprising a tank, a reaction tank located inside the tank for copper plating reaction, and an automatic addition device for automatically adding reagents. The upper and lower ends of the tank are provided with a spray mechanism for spraying reagents. The reaction tank is provided with an installation device for swinging and clamping products between the spray mechanisms. The output end of the automatic addition device is connected to a secondary tank. The secondary tank is connected to the spray mechanism through a spray system.

[0008] Preferably, the jet system includes a swirling gas-liquid mixing micro / nano bubble generator A and a swirling gas-liquid mixing micro / nano bubble generator B, which are respectively connected to the liquid outlet of the auxiliary tank.

[0009] Preferably, the jetting mechanism includes:

[0010] A jetting frame, wherein the jetting frame is disposed at the upper and lower ends inside the tank body;

[0011] Spray bar A is mounted on a jet frame at the upper end of the tank. The swirling gas-liquid mixing micro / nano bubble generator A is connected to spray bar A via a conduit.

[0012] Spray bar B is mounted on the spray frame at the lower end of the tank. The swirling gas-liquid mixing micro / nano bubble generator B is connected to the spray bar B via a conduit.

[0013] Preferably, the mounting device includes:

[0014] A front-to-back rocking mechanism is provided on both sides of the reaction tank;

[0015] The product clamping mechanism is mounted on the forward and backward swinging mechanism.

[0016] Preferably, the lower end face of the tank has a liquid outlet that is connected to the lower end of the auxiliary tank with a liquid inlet.

[0017] Preferably, the lower end face of the secondary groove is lower than the upper end face of the main groove.

[0018] Preferably, the jet frame and the reaction tank are slidably connected by rollers.

[0019] As a further improvement of the present invention, the present invention also discloses an excellent method for electroless copper plating using chemical copper plating equipment, characterized in that the method includes the following steps:

[0020] S1. The front-to-back rocking mechanism is designed above the reaction tank, and the product clamping mechanism is located on the front-to-back rocking mechanism. During operation, the front-to-back rocking mechanism drives the product clamping mechanism to rock back and forth relative to the reaction tank, so that the distance between the product clamping mechanism and the spray bar A and spray bar B changes regularly.

[0021] S2. The spray frame is designed on the tank body and swings left and right relative to the reaction tank via rollers. Spray rods A and B are fixed on the spray frame and extend into the reaction tank. When the spray system is working, the tank liquid is sprayed out from the nozzle on spray rod A and acts on different positions of the product as the spray frame swings left and right. Spray rod B is designed on the other side of the tank body, and the positions of spray rod A and spray rod B are offset from each other.

[0022] S3. The cyclone gas-liquid mixing micro-nano bubble generator A and the cyclone gas-liquid mixing micro-nano bubble generator B will draw out the tank liquid with automatically added medicine from the sub-tank. The gas-liquid mixed fluid rotates at high speed under pressure and forms a negative pressure shaft in the middle of the generator. When the high-speed rotating liquid and gas are sprayed out from the spray nozzle under appropriate pressure, a large amount of tank liquid containing micron and nano-sized bubbles is generated. The liquid is then connected to the spray bar A and spray bar B through pipelines and sprayed onto the product on the product clamping mechanism.

[0023] S4. When the product clamping mechanism is in the middle position of the front and rear swing mechanism, its distance from the spray bar A and spray bar B is equal. The tank liquid passes through the high aspect ratio hole through the pressure sprayed by the spray bar A and spray bar B. When the product clamping mechanism moves towards the spray bar A, the flow rate of the swirling gas-liquid mixing micro-nano bubble generator A increases, and the flow rate of the swirling gas-liquid mixing micro-nano bubble generator B decreases. At this time, the fluid pressure between the spray bar A and the product clamping mechanism is greater than the fluid pressure between the spray bar B and the product clamping mechanism. At this time, the tank liquid will pass through the high aspect ratio hole under the combined action of the pressure sprayed by the spray bar A and the pressure difference, and the hole penetration ability is enhanced. When the product clamping mechanism moves to the maximum displacement, it is closest to the spray bar A and has the strongest hole penetration ability.

[0024] As a further improvement of the present invention, in step S3, the flow rates of spray bar A and spray bar B are inversely proportional.

[0025] As a further improvement of the present invention, in step S4, when the product clamping mechanism moves toward the spray bar B, the flow rate ejected by the swirling gas-liquid mixing micro-nano bubble generator B increases, while the flow rate ejected by the swirling gas-liquid mixing micro-nano bubble generator A decreases.

[0026] Compared with the prior art, the beneficial effects of the present invention are:

[0027] 1. This invention incorporates a jetting system, which includes a swirling gas-liquid mixing micro / nano bubble generator A and a swirling gas-liquid mixing micro / nano bubble generator B. It utilizes micro / nano bubble technology, where micro / nano bubbles are tiny bubbles with diameters ranging from hundreds of nanometers to tens of micrometers. These bubbles are characterized by high gas-liquid mass transfer efficiency and high solubility. Compared to pores with diameters of over one hundred micrometers, they will not get stuck inside the pores. This provides oxygen without causing bubble blockage. Furthermore, the efficient jetting system solves the problem of through-hole capability in products with high aspect ratios.

[0028] 2. The present invention includes a reaction tank for copper plating reaction, an automatic addition device for automatically adding reagents, a spray mechanism for spraying reagents, and an installation device for swinging and clamping products. The output end of the automatic addition device is connected to a secondary tank. The secondary tank and the spray mechanism are connected by a spray system, which can form a circulation of the entire tank solution system and improve the copper plating efficiency. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the overall invention.

[0030] In the diagram: 1. Tank; 2. Reaction tank; 3. Automatic addition device; 4. Spray mechanism; 41. Spray frame; 42. Spray bar A; 43. Spray bar B; 5. Installation device; 51. Back-and-forth swing mechanism; 52. Product clamping mechanism; 6. Sub-tank; 7. Spray system; 71. Cyclone gas-liquid mixing micro-nano bubble generator A; 72. Cyclone gas-liquid mixing micro-nano bubble generator B. Detailed Implementation

[0031] To make the technical problems to be solved, the technical solutions, and the beneficial effects of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present invention and are not intended to limit the present invention.

[0032] It should be noted that when an element is referred to as "fixed," "mounted," "connected," or "set" with another element, it can be directly on or indirectly on the other element. It should be understood that the terms "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," and "outer," etc., indicating orientation or positional relationships, are based on the orientation or positional relationships shown in the accompanying drawings and are only for the convenience of describing the invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the invention.

[0033] As a further improvement of the present invention, the terms "first," "second," "third," etc., are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.

[0034] Example 1

[0035] Please see Figure 1 The present invention provides a technical solution: an excellent chemical copper plating equipment, including a tank 1, a reaction tank 2 located inside the tank 1 for copper plating reaction, and an automatic addition device 3 for automatically adding reagents. The upper and lower ends of the tank 1 are equipped with a spray mechanism 4 for spraying reagents. The reaction tank 2 is equipped with an installation device 5 for swinging and clamping products between the spray mechanisms 4. The output end of the automatic addition device 3 is connected to a secondary tank 6. The secondary tank 6 is connected to the spray mechanism 4 through a spray system 7.

[0036] The jet system 7 includes a swirling gas-liquid mixing micro-nano bubble generator A71 and a swirling gas-liquid mixing micro-nano bubble generator B72, which are respectively connected to the liquid outlet end of the auxiliary tank 6.

[0037] The jetting mechanism 4 includes a jetting frame 41, a jetting rod A42, and a jetting rod B43. The jetting frame 41 is located at the upper and lower ends inside the tank 1. The jetting rod A42 is located on the jetting frame 41 at the upper end of the tank 1. The swirling gas-liquid mixing micro-nano bubble generator A71 is connected to the jetting rod A42 via a conduit. The jetting rod B43 is located on the jetting frame 41 at the lower end of the tank 1. The swirling gas-liquid mixing micro-nano bubble generator B72 is connected to the jetting rod B43 via a conduit.

[0038] The mounting device 5 includes a front-to-back rocking mechanism 51 and a product clamping mechanism 52. The front-to-back rocking mechanism 51 is disposed on both sides of the reaction tank 2, and the product clamping mechanism 52 is disposed on the front-to-back rocking mechanism 51.

[0039] A liquid outlet is provided on the lower end face of tank 1, which is connected to a liquid inlet provided on the lower end of sub-tank 6.

[0040] The lower end face of the secondary groove 6 is lower than the upper end face of the groove 1.

[0041] The jet frame 41 is slidably connected to the reaction tank 2 via rollers.

[0042] Example 2

[0043] This invention provides a technical solution: an excellent method for electroless copper plating using chemical copper plating equipment, the method comprising the following steps:

[0044] S1. A front-to-back rocking mechanism 51 is designed above the reaction tank 2. The product clamping mechanism 52 is located on the front-to-back rocking mechanism 51. During operation, the front-to-back rocking mechanism 51 drives the product clamping mechanism 52 to rock back and forth relative to the reaction tank 2, so that the distance between the product clamping mechanism 52 and the spray bar A42 and spray bar B43 changes regularly.

[0045] S2. The spray frame 41 is designed on the tank 1 and swings left and right relative to the reaction tank 2 through rollers. Spray rods A42 and B43 are fixed on the spray frame 41 and extend into the reaction tank 2. When the spray system 7 is working, the tank liquid is sprayed out from the nozzle on the spray rod A42 and acts on different positions of the product as the spray frame 41 swings left and right. Spray rod B43 is designed on the other side of the tank 1, and the positions of spray rod A42 and spray rod B43 are offset from each other.

[0046] S3, the cyclone gas-liquid mixing micro-nano bubble generator A71 and the cyclone gas-liquid mixing micro-nano bubble generator B72 will draw the tank liquid with automatically added chemicals from the sub-tank 6. The gas-liquid mixed fluid rotates at high speed under pressure and forms a negative pressure shaft in the middle of the generator. When the high-speed rotating liquid and gas are ejected from the spray nozzle under appropriate pressure, a large amount of tank liquid containing micron and nano-sized bubbles is generated. It is then connected to the spray bar A42 and spray bar B43 through pipelines and sprayed onto the product on the product clamping mechanism 52.

[0047] S4. When the product clamping mechanism 52 is in the middle position of the front and rear swing mechanism 51, its distance from the spray bar A42 and spray bar B43 is equal. The tank liquid passes through the high aspect ratio hole through the pressure sprayed by the spray bar A42 and spray bar B43. When the product clamping mechanism 52 moves towards the spray bar A42, the flow rate of the swirling gas-liquid mixing micro-nano bubble generator A71 increases, and the flow rate of the swirling gas-liquid mixing micro-nano bubble generator B72 decreases. At this time, the fluid pressure between the spray bar A42 and the product clamping mechanism 52 is greater than the fluid pressure between the spray bar B43 and the product clamping mechanism 52. At this time, the tank liquid will pass through the high aspect ratio hole under the combined action of the pressure sprayed by the spray bar A42 and the pressure difference, and the hole penetration ability is enhanced. When the product clamping mechanism 52 moves to the maximum displacement, it is closest to the spray bar A42 and has the strongest hole penetration ability.

[0048] In step S3, the flow rates of spray bar A42 and spray bar B43 are inversely proportional;

[0049] In step S4, when the product clamping mechanism 52 moves toward the spray bar B43, the flow rate of the swirling gas-liquid mixing micro-nano bubble generator B72 increases, while the flow rate of the swirling gas-liquid mixing micro-nano bubble generator A71 decreases.

[0050] In this invention, during operation, the plating solution overflows from the top and sides of the reaction tank 2 to the tank body 1, and then overflows from the tank body 1 to the auxiliary tank 6. At this time, the automatic addition device 3 adds the required solution to the auxiliary tank 6 according to the set addition amount. The spray system 7 draws the plating solution from the inside of the auxiliary tank 6 and sprays it back to the reaction tank 2, forming a circulation of the entire plating solution system. The aspect ratio capability of traditionally designed chemical copper plating equipment is below 20:1, but the aspect ratio of high-end printed circuit boards exceeds 30:1. This invention uses advanced micro-nano bubble technology and a high-efficiency spray system to make the aspect ratio capability exceed 40:1.

[0051] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0052] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An excellent electroless copper plating apparatus comprising a tank body (1), a reaction tank (2) for a copper plating reaction inside the tank body (1), and an automatic additive device (3) for automatically adding an additive, characterized in that: The upper and lower ends of the groove body (1) are provided with jet mechanisms (4) for jetting liquid medicine, the inside of the reaction tank (2) is provided with mounting devices (5) for swinging and clamping products between the jet mechanisms (4), the output end of the automatic adding device (3) is connected with a sub-tank (6), and the sub-tank (6) is connected with the jet mechanisms (4) through the jet system (7); The jet system (7) comprises a rotary gas-liquid mixed type micro-nano bubble generating device A (71) and a rotary gas-liquid mixed type micro-nano bubble generating device B (72), and the rotary gas-liquid mixed type micro-nano bubble generating device A (71) and the rotary gas-liquid mixed type micro-nano bubble generating device B (72) are connected with the liquid outlet end of the sub-tank (6) respectively.

2. The excellent chemical copper plating device according to claim 1, characterized in that: The jet mechanism (4) comprises: a jet frame (41) arranged at the upper and lower ends inside the groove body (1); a jet rod A (42) arranged on the jet frame (41) at the upper end of the groove body (1), and the rotary gas-liquid mixed type micro-nano bubble generating device A (71) is connected with the jet rod A (42) through a pipe; a jet rod B (43) arranged on the jet frame (41) at the lower end of the groove body (1), and the rotary gas-liquid mixed type micro-nano bubble generating device B (72) is connected with the jet rod B (43) through a pipe.

3. The superior electroless copper plating apparatus of claim 1, wherein: The mounting device (5) comprises: a front and rear swinging mechanism (51) arranged on both sides of the reaction tank (2); a product clamping mechanism (52) arranged on the front and rear swinging mechanism (51).

4. The superior electroless copper plating apparatus of claim 1, wherein: An outlet is arranged on the lower end surface of the groove body (1) and communicates with the liquid inlet arranged on the lower end of the sub-tank (6).

5. The superior electroless copper plating apparatus of claim 1, wherein: The lower end surface of the sub-tank (6) is lower than the upper end surface of the groove body (1).

6. The superior electroless copper plating apparatus of claim 1, wherein: The jet frame (41) is connected with the reaction tank (2) through a roller sliding connection.

7. The excellent copper plating method for a copper plating apparatus according to any one of claims 1 to 6, characterized by: Comprising the following steps: S1, the front and rear swinging mechanism (51) is designed above the reaction tank (2), the product clamping mechanism (52) is arranged on the front and rear swinging mechanism (51), and the front and rear swinging mechanism (51) drives the product clamping mechanism (52) to realize front and rear swinging relative to the reaction tank (2) during work, so that the distance between the product clamping mechanism (52) and the jet rod A (42) and the jet rod B (43) changes regularly. S2, the spray frame (41) is designed above the tank (1), and the left and right swing relative to the reaction tank (2) is realized by rollers, the spray rod A (42) and the spray rod B (43) are fixed on the spray frame (41) and are deep into the inside of the reaction tank (2), when the spray system (7) works, the tank liquid is sprayed from the nozzle on the spray rod A (42), and acts on different positions of the product with the left and right swing of the spray frame (41); the spray rod B (43) is designed on the other side of the tank (1), the position of the spray rod A (42) is staggered with the spray rod B (43); S3, the rotary gas-liquid mixed micro-nano bubble generator A (71) and the rotary gas-liquid mixed micro-nano bubble generator B (72) extract the tank liquid with automatically added medicine from the inside of the auxiliary tank (6), the gas-liquid mixed fluid rotates at high speed under the action of pressure, and a negative pressure shaft is formed in the middle of the generator, when the high-speed rotating liquid and gas are sprayed from the spray port under the appropriate pressure, a large amount of tank liquid containing micro-nano bubbles is generated, and is connected to the spray rod A (41) and the spray rod B (42) through a pipeline and is sprayed to the product on the product clamping mechanism (52); S4, when the product clamping mechanism (52) is in the middle position of the front and rear swing mechanism (51), the distance between the spray rod A (42) and the spray rod B (43) is equal, the tank liquid is sprayed by the spray rod A (42) and the spray rod B (43), and the pressure passes through the high aspect ratio hole, when the product clamping mechanism (52) moves towards the spray rod A (42), the flow rate of the rotary gas-liquid mixed micro-nano bubble generator A (71) increases, and the flow rate of the rotary gas-liquid mixed micro-nano bubble generator B (72) decreases, at this time, the fluid pressure between the spray rod A (42) and the product clamping mechanism (52) is greater than the fluid pressure between the spray rod B (43) and the product clamping mechanism (52), at this time, the tank liquid is sprayed by the spray rod A (42) under the joint action of the pressure and the pressure difference, and the penetration ability is enhanced, when the product clamping mechanism (52) moves to the maximum displacement, the distance between the spray rod A (42) is closest, and the penetration ability is the strongest.

8. The excellent copper plating method for a chemical copper plating apparatus according to claim 7, characterized by: The flow rates of the spray rod A (42) and the spray rod B (43) in step S3 are inversely proportional.

9. The excellent copper plating method for a chemical copper plating apparatus according to claim 7, characterized by: When the product clamping mechanism (52) moves towards the spray rod B (43) in step S4, the flow rate of the rotary gas-liquid mixed micro-nano bubble generator B (72) increases, and the flow rate of the rotary gas-liquid mixed micro-nano bubble generator A (71) decreases.

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