Chip test probe pose adjusting device and method
By using a simplified chip test probe pose adjustment device, which utilizes a knob and a reset spring assembly to achieve flexible probe adjustment, the problem of existing equipment being unable to adapt to pin tilt is solved, thereby improving test accuracy and efficiency and reducing maintenance costs.
Patent Information
- Application Number
- CN202511884749.1
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-15
- Publication Date
- 2026-03-10
AI Technical Summary
Existing chip testing equipment has a complex structure and is difficult to adapt to problems caused by packaging process deviations or pin tilting during transportation, which can lead to test signal interruption or data distortion and affect the accuracy of test results.
A simple chip test probe pose adjustment device is adopted, which realizes flexible adjustment of the probe through a knob and a reset spring assembly to ensure stable contact between the probe and the chip pin. It includes a first adjustment component, a second adjustment component, and a third adjustment component, which are used to move, rotate, and swing the probe to adapt to the pin at different angles and positions.
It improves the accuracy and efficiency of chip testing, reduces maintenance costs, avoids probe-pin disconnection, and ensures the reliability of test data and yield rate.
Smart Images
Figure CN121633790A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of chip testing equipment technology, and in particular to a chip test probe pose adjustment device and method. Background Technology
[0002] In the industrial production of LEDs, chip testing is a crucial step, providing data support for subsequent sorting. Automated testing is essential for chip positioning, photoelectric parameter detection, and grading to ensure consistent photoelectric characteristics in packaged products, thus guaranteeing LED product quality. LED chip testing involves applying pressure to electrodes to excite the crystal to emit light, then measuring optical and electrical parameters to classify quality levels. The application of voltage and current acquisition rely on probe contact with the electrodes; the stability and accuracy of this probe contact directly affect the accuracy of the test data, which in turn relates to chip grading and packaging quality. Therefore, the test probes need to be flexibly adjusted to accurately position and contact the chip's pins.
[0003] Existing chip pin testing equipment typically incorporates adjustment mechanisms, enabling horizontal and vertical movement and rotation around a horizontal axis. However, such equipment relies on multiple independent drive mechanisms and accompanying guide and limit components, resulting in a complex overall structure and increased manufacturing costs and maintenance difficulty. Furthermore, in actual testing, chips may exhibit pin tilting due to packaging process deviations or slight deformation during transportation, meaning the pins are not perpendicular to the chip body. Existing testing equipment's probes are mostly vertically fixed and cannot accommodate tilted chip pins, easily leading to partial suspension or edge contact. Slight vibrations during testing can cause breakage of the contact, resulting in interrupted test signals or data distortion, affecting the accuracy of test results and misclassifying qualified chips as unqualified, thus increasing costs. Summary of the Invention
[0004] The purpose of this invention is to provide a chip test probe pose adjustment device and method. The chip test probe pose adjustment device is simple and reduces manufacturing costs, while the chip test probe pose adjustment method improves the accuracy of chip testing.
[0005] To achieve this objective, the present invention adopts the following technical solution:
[0006] A chip test probe pose adjustment device, comprising:
[0007] A fixing component includes a base and a fixing plate, the base being fixedly connected to a chip testing device, and the fixing plate being fixedly connected to the base;
[0008] The first adjustment component includes a first knob, a first movable plate, and a first return spring. The first movable plate is movably connected to the fixed plate. The first knob is screwed to the first movable plate and can abut against the fixed plate during the screwing process so that the first movable plate moves along a first direction. The two ends of the first return spring are respectively fixedly connected to the first movable plate and the fixed plate.
[0009] The second adjustment component includes a second knob, a second movable plate, and a second return spring. The second movable plate is movably connected to the first movable plate. The second knob is screwed to the second movable plate and can abut against the first movable plate during the screwing process so that the second movable plate can move along a second direction. The first direction is perpendicular to the second direction. The two ends of the second return spring are respectively fixedly connected to the first movable plate and the second movable plate.
[0010] The third adjustment component includes a third knob, a swing member, a third return spring, and a clamping member. The third knob is screwed to the second moving plate. The two ends of the third return spring are respectively fixedly connected to the second moving plate and the swing member. The clamping member is detachably connected to the swing member. The third knob can push against the swing member to make the swing member drive the clamping member to swing. The clamping member is used to fix the probe.
[0011] The aforementioned chip test probe pose adjustment device further includes a cross guide rail, wherein the first moving plate is connected to the fixed plate via the cross guide rail, and the second moving plate is connected to the first moving plate via the cross guide rail.
[0012] The above-mentioned chip test probe pose adjustment device includes a first adjustment component that further includes a first fixing block, which is an L-shaped block. One end of the first fixing block is fixedly connected to the first moving plate, and the other end has a first threaded hole. The first knob is screwed into the first threaded hole.
[0013] The above-mentioned chip test probe pose adjustment device includes a first adjustment component that further includes a push block, which is an L-shaped block. The horizontal section of the push block is fixedly connected to the fixing plate. One end of the first fixing block with the first threaded hole is located above the horizontal section of the push block. Tightening the first knob in the first threaded hole can push the vertical section of the push block.
[0014] In the aforementioned chip test probe pose adjustment device, the first moving plate has a receiving groove along the first direction, and the first reset spring is disposed in the receiving groove.
[0015] The above-mentioned chip test probe pose adjustment device includes a first adjustment component that further includes a first fixed shaft, which is fixedly connected to the first moving plate. The first fixed shaft has a first annular groove for moving away from the first moving plate, and one end of the first reset spring is sleeved in the first annular groove.
[0016] The above-mentioned chip test probe pose adjustment device includes a second adjustment component that further includes a second fixing block. The second fixing block includes a screwed part and a mounting part arranged at an angle. The mounting part is fixedly connected to the second moving plate. The screwed part has a second threaded hole, which is located above the first moving plate. The second knob is screwed into the second threaded hole.
[0017] In the aforementioned chip test probe pose adjustment device, the swing member is provided with a pushing surface, which is an inclined surface, and the third knob can push the pushing surface to make the swing member swing.
[0018] In the aforementioned chip test probe pose adjustment device, the first knob, the third knob, and the first knob are all provided with a knob cap, and the knob cap is provided with multiple anti-slip grooves.
[0019] A method for adjusting the pose of a chip test probe, used to implement the aforementioned chip test probe pose adjustment device, includes the following steps:
[0020] S1. Check if the probe is intact. If the probe is faulty, replace it with a new one. If the probe is normal and intact, fix the probe to the clamp.
[0021] S2. Rotate the first knob to fine-tune the probe along the first direction so that the probe is above the chip pin. Rotate the third knob to push the swing member to fine-tune the angle of the probe to ensure that the probe can contact the chip pin.
[0022] S3. Rotate the second knob to fine-tune the probe in the second direction so that the probe is close to the pin of the chip until it touches the pin of the chip.
[0023] The beneficial effects of this invention are:
[0024] The chip test probe orientation adjustment device provided by this invention allows for the following adjustments during use: rotating the first knob moves the first moving plate relative to the fixed plate along a first direction; rotating the second knob moves the second moving plate relative to the first moving plate along a second direction; and rotating the third knob causes a swinging component to oscillate. A clamping component is fixedly connected to the swinging component, and a probe is mounted on the clamping component. Therefore, rotating the first, second, and third knobs allows for adjustment of the probe's position and orientation, ensuring good contact between the probe and the chip's pins, preventing disconnection, and improving test accuracy. Furthermore, the first moving plate and the fixed plate are movably connected, the second moving plate and the first moving plate are movably connected, and the swinging component is connected to the second moving plate via a second return spring. This design is simple, easy to maintain, and reduces maintenance costs.
[0025] The chip test probe pose adjustment method provided by this invention includes the following steps: Step S1 checks the quality of the probe to prevent probe failure from misclassifying good products as defective products, thus improving test accuracy; Step S2 adjusts the first and second knobs to fine-tune the probe position, ensuring contact between the probe and chip pins while preventing collisions that could damage the probe or chip due to excessively rapid movement, thereby reducing the failure rate and improving test efficiency; Step S3 addresses poor contact between the probe and chip pins by rotating a third knob to change the probe's pose, ensuring stable contact and preventing intermittent contact, thus improving test accuracy. This reduces the probability of misclassifying good products as defective due to intermittent contact, thereby lowering production costs. Attached Figure Description
[0026] Figure 1 This is a schematic diagram of the chip test probe pose adjustment device provided in an embodiment of the present invention from a first-view perspective;
[0027] Figure 2 yes Figure 1 Enlarged view of point A in the middle;
[0028] Figure 3 yes Figure 1 Enlarged view of point B in the middle;
[0029] Figure 4 This is a schematic diagram of the chip test probe pose adjustment device provided in an embodiment of the present invention from a second perspective.
[0030] Figure 5 This is a schematic diagram of the chip test probe pose adjustment device provided in an embodiment of the present invention from a third-person perspective;
[0031] Figure 6 This is a schematic diagram of the chip test probe pose adjustment device provided in an embodiment of the present invention from a fourth perspective.
[0032] Figure 7 yes Figure 6 Enlarged diagram of point C in the middle.
[0033] In the picture:
[0034] 1. Fixing components; 11. Base; 12. Fixing plate;
[0035] 2. First adjusting component; 21. First knob; 22. First moving plate; 23. First return spring; 24. First fixing block; 25. Pushing block; 26. First fixing shaft; 261. First annular groove;
[0036] 3. Second adjustment component; 31. Second knob; 32. Second moving plate; 33. Second return spring; 34. Second fixing block; 341. Screw connection; 342. Mounting part; 35. Second fixing shaft;
[0037] 4. Third adjustment component; 41. Third knob; 42. Swing component; 421. Pushing surface; 43. Third return spring; 44. Clamping component;
[0038] 5. Cross rails. Detailed Implementation
[0039] Embodiments of the present invention are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain the present invention, and should not be construed as limiting the present invention.
[0040] In the description of this invention, unless otherwise explicitly specified and limited, the terms "connected," "linked," and "fixed" should be interpreted broadly. For example, they can refer to a fixed connection or a detachable connection; a mechanical connection or an electrical connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention according to the specific circumstances.
[0041] In the description of this invention, unless otherwise expressly specified and limited, "above" or "below" the second feature can include direct contact between the first and second features, or contact between the first and second features through another feature between them. Furthermore, "above," "over," and "on top" of the second feature includes the first feature being directly above or diagonally above the second feature, or simply indicates that the first feature is at a higher horizontal level than the second feature. "Below," "below," and "under" the second feature includes the first feature being directly below or diagonally below the second feature, or simply indicates that the first feature is at a lower horizontal level than the second feature.
[0042] The technical solution of the present invention will be further described below with reference to the accompanying drawings and specific embodiments.
[0043] like Figures 1-7As shown, the chip test probe pose adjustment device includes a fixing component 1, a first adjustment component 2, a second adjustment component 3, and a third adjustment component 4. The fixing component 1 includes a base 11 and a fixing plate 12. The base 11 can be fixedly connected to the chip test equipment, and the fixing plate 12 is fixedly connected to the base 11. The first adjustment component 2 includes a first knob 21, a first moving plate 22, and a first return spring 23. The first moving plate 22 is movably connected to the fixing plate 12, and the first knob 21 is screwed to the first moving plate 22. During the screwing process, it can abut against the fixing plate 12 to make the first moving plate 22 move in a first direction. The two ends of the first return spring 23 are fixedly connected to the first moving plate 22 and the fixing plate 12, respectively. The second adjustment component 3 includes a second knob 31, a second moving plate 32, and a second return spring 33. The second movable plate 32 is movably connected to the first movable plate 22. The second knob 31 is screwed onto the second movable plate 32 and, during the screwing process, can abut against the first movable plate 22 to cause the second movable plate 32 to move along a second direction, the first direction being perpendicular to the second direction. The two ends of the second return spring 33 are respectively fixedly connected to the first movable plate 22 and the second movable plate 32. The third adjustment assembly 4 includes a third knob 41, a swing member 42, a third return spring 43, and a clamping member 44. The third knob 41 is screwed onto the second movable plate 32. The two ends of the third return spring 43 are respectively fixedly connected to the second movable plate 32 and the swing member 42. The clamping member 44 is detachably connected to the swing member 42. The third knob 41 can push against the swing member 42 to cause the swing member 42 to drive the clamping member 44 to swing. The clamping member 44 is used to fix the probe. The first direction is as follows: Figure 1 In the X direction, the second direction is as follows Figure 1 Center Y direction.
[0044] The chip test probe orientation adjustment device provided by this invention allows for the following adjustments during use: rotating the first knob 21 moves the first moving plate 22 relative to the fixed plate 12 along a first direction; rotating the second knob 31 moves the second moving plate 32 relative to the first moving plate 22 along a second direction; and rotating the third knob 41 causes the swinging member 42 to swing. A clamping member 44 is fixedly connected to the swinging member 42, and a probe is mounted on the clamping member 44. Therefore, rotating the first knob 21, the second knob 31, and the third knob 41 allows for adjustment of the probe's position and orientation, ensuring good contact between the probe and the chip's pins, preventing disconnection, and improving test accuracy. Furthermore, the first moving plate 22 is movably connected to the fixed plate 12, the second moving plate 32 is movably connected to the first moving plate 22, and the swinging member 42 is connected to the second moving plate 32 via a second return spring 33. This design is simple, easy to maintain, and reduces maintenance costs.
[0045] For example, the base 11 is plate-shaped, and mounting holes are provided around the base 11 for inserting bolts to fix the base 11 to the chip testing equipment.
[0046] Optionally, a roller can be provided between the first movable plate 22 and the fixed plate 12 to achieve a rolling connection. One of the first movable plate 22 and the fixed plate 12 is provided with a roller, and the other is provided with a sliding groove. The roller slides inside the sliding groove to achieve a rolling connection between the first movable plate 22 and the fixed plate 12. At the same time, the sliding groove can limit the roller to ensure that the first movable plate 22 moves along the first direction.
[0047] Optionally, a roller can be provided between the second movable plate 32 and the first movable plate 22 to achieve a rolling connection. One of the second movable plate 32 and the first movable plate 22 is provided with a roller, and the other is provided with a sliding groove. The roller slides inside the sliding groove to achieve a rolling connection between the second movable plate 32 and the first movable plate 22. At the same time, the sliding groove can limit the roller to ensure that the second movable plate 32 moves along the first direction.
[0048] In this embodiment, the chip test probe pose adjustment device also includes a cross guide rail 5. The first moving plate 22 is connected to the fixed plate 12 through the cross guide rail 5, and the second moving plate 32 is connected to the first moving plate 22 through the cross guide rail 5. The cross guide rail 5 has high guiding accuracy, which can realize the smooth movement of the first moving plate 22 in the first direction and the smooth movement of the second moving plate 32 in the second direction, thereby realizing the precise adjustment of the probe in the first and second directions.
[0049] Specifically, four sets of cross guide rails 5 are provided between the first moving plate 22 and the fixed plate 12, see [reference]. Figure 1 Four sets of cross guide rails 5 are arranged from top to bottom. The fixed part of the first set of cross guide rails 5 is fixed to the fixed plate 12, and the movable part is connected to the first moving plate 22. The fixed part of the second set of cross guide rails 5 is fixed to the first moving plate 22, and the movable part is connected to the fixed plate 12. The fixed part of the third set of cross guide rails 5 is fixed to the fixed plate 12, and the movable part is connected to the first moving plate 22. The fixed part of the fourth set of cross guide rails 5 is fixed to the first moving plate 22, and the movable part is connected to the fixed plate 12. This arrangement can effectively prevent the shaking and swaying of the first moving plate 22 during the movement, and improve the stability of the movement.
[0050] Specifically, four sets of cross guide rails 5 are provided between the second movable plate 32 and the first movable plate 22, see [reference]. Figure 1 and Figure 6The four sets of cross guide rails 5 are arranged from right to left. The fixed part of the first set of cross guide rails 5 is fixed to the first moving plate 22, and the movable part is connected to the second moving plate 32. The fixed part of the second set of cross guide rails 5 is fixed to the second moving plate 32, and the movable part is connected to the first moving plate 22. The fixed part of the third set of cross guide rails 5 is fixed to the first moving plate 22, and the movable part is connected to the second moving plate 32. The fixed part of the fourth set of cross guide rails 5 is fixed to the second moving plate 32, and the movable part is connected to the first moving plate 22. This arrangement can effectively prevent the shaking and swaying of the second moving plate 32 during the movement, and improve the stability of the movement.
[0051] In other embodiments, six sets of cross rails 5 may also be provided between the second moving plate 32 and the first moving plate 22, and six sets of cross rails 5 may also be provided between the first moving plate 22 and the fixed plate 12. The number of cross rails 5 is not specifically limited here.
[0052] It should be noted that the cross rail 5 is a commonly used component, and its structure, operation method and connection method will not be described in detail here.
[0053] The first knob 21 can be directly connected to the first movable plate 22, or it can be indirectly connected to the first movable plate 22. For example, see [link to example]. Figures 1 to 3 The first adjustment component 2 also includes a first fixing block 24, which is L-shaped. One end of the first fixing block 24 is fixedly connected to the first moving plate 22, and the other end has a first threaded hole. A first knob 21 is screwed into the first threaded hole and indirectly connected to the first moving plate 22. During maintenance, only the damaged first fixing block 24 needs to be replaced, without disassembling the first moving plate 22, thus improving maintenance efficiency and reducing maintenance costs. The L-shaped first fixing block 24 can provide clearance space to avoid interference between the first fixing block 24 and the fixing plate 12 during the movement of the first moving plate 22.
[0054] Furthermore, the first adjustment component 2 also includes a push block 25, which is an L-shaped block. The horizontal section of the push block 25 is fixedly connected to the fixed plate 12. The end of the first fixed block 24 with a first threaded hole is located above the horizontal section of the push block 25. Tightening the first threaded hole with the first knob 21 can push the vertical section of the push block 25. The L-shaped push block 25 can provide clearance space to avoid interference between the push block 25 and the first moving plate 22 during the movement of the first moving plate 22.
[0055] It should be noted that during the rotation of the first knob 21, the first knob 21 pushes against the push block 25. Since the push block 25 is fixedly connected to the fixed plate 12, and the fixed plate 12 remains stationary, the first moving plate 22 will move in the opposite direction. That is, when the first knob 21 is rotated in the positive direction of the first direction, the first moving plate 22 moves in the negative direction of the first direction, and when the first knob 21 is rotated in the negative direction of the first direction, the first moving plate 22 moves in the positive direction of the first direction.
[0056] At the same time, when the first knob 21 is rotated in the positive direction of the first direction, the first moving plate 22 moves in the negative direction of the first direction, thereby causing the first return spring 23 to extend. After the first knob 21 is rotated in the negative direction of the first direction, the first return spring 23 returns to its original position, causing the first moving plate 22 to move in the positive direction of the first direction.
[0057] Specifically, see Figure 2 The first moving plate 22 has a receiving groove along the first direction, and the first return spring 23 is disposed in the receiving groove. The first return spring 23 can limit its lateral displacement and avoid deformation disorder when the first return spring 23 extends, and can guide the first return spring 23 to accurately rebound along the path of the receiving groove when resetting, so as to ensure that the extension and resetting process is stable and controllable.
[0058] Further, see Figure 1 and Figure 2 The first adjusting component 2 also includes a first fixed shaft 26, which is fixedly connected to the first moving plate 22. A first annular groove 261 is provided on the first fixed shaft 26 away from the first moving plate 22. One end of the first return spring 23 is sleeved in the first annular groove 261. The first return spring 23 is fixed to the first fixed shaft 26 via the first annular groove 261, effectively preventing the spring from falling off the first fixed shaft 26 during extension or reset, ensuring stable force transmission between the first return spring 23 and the first moving plate 22, and providing stable assistance for the movement of the first moving plate 22.
[0059] The second knob 31 can be directly connected to the second movable plate 32, or it can be indirectly connected to the second movable plate 32. For example, see [link to example]. Figure 1The second adjustment assembly 3 also includes a second fixing block 34. The second fixing block 34 includes a threaded portion 341 and a mounting portion 342 arranged at an angle. The mounting portion 342 is fixedly connected to the second moving plate 32. The threaded portion 341 has a second threaded hole, which is located above the first moving plate 22. A second knob 31 is screwed into the second threaded hole and indirectly connected to the second moving plate 32. During maintenance, only the damaged second fixing block 34 needs to be replaced, without disassembling the second moving plate 32, thus improving maintenance efficiency and reducing maintenance costs. The angled arrangement of the threaded portion 341 and the mounting portion 342 provides clearance space, preventing interference between the second fixing block 34 and the first moving plate 22 during the movement of the second moving plate 32.
[0060] Specifically, the screw connection 341 and the mounting part 342 are arranged at a 90° angle.
[0061] Further, see Figure 1 , Figure 6 and Figure 7 The second adjusting assembly 3 also includes a second fixed shaft 35, which is fixedly connected to the first moving plate 22. A second annular groove is provided on the second fixed shaft 35 away from the first moving plate 22, and one end of the second return spring 33 is sleeved in the second annular groove. The fact that one end of the second return spring 33 is fixed to the second fixed shaft 35 through the second annular groove effectively prevents the spring from falling off the second fixed shaft 35 during extension or reset, ensuring stable force transmission between the second return spring 33 and the second moving plate 32, and providing stable assistance for the movement of the second moving plate 32.
[0062] It should be noted that during the rotation of the second knob 31, the second knob 31 pushes against the first moving plate 22. Since the first moving plate 22 is connected to the fixed plate 12, the fixed plate 12 restricts the movement of the first moving plate 22 in the second direction. Therefore, the second moving plate 32 will move in the opposite direction. That is, when the second knob 31 is rotated in the positive direction of the second direction, the second moving plate 32 moves in the negative direction of the second direction, and when the second knob 31 is rotated in the negative direction of the second direction, the second moving plate 32 moves in the positive direction of the second direction.
[0063] At the same time, when the second knob 31 is rotated in the positive direction of the second direction, the second moving plate 32 moves in the negative direction of the second direction, thereby causing the second return spring 33 to extend. After the second knob 31 is rotated in the negative direction of the second direction, the second return spring 33 returns to its original position, causing the second moving plate 32 to move in the positive direction of the second direction.
[0064] In this embodiment, participants Figure 1 and Figure 4The swing member 42 is provided with a pushing surface 421, which is an inclined surface. The third knob 41 can push the pushing surface 421 to make the swing member 42 swing, thus enabling the swing member 42 to be smoothly and finely adjusted.
[0065] When in use, when the third knob 41 is rotated in the second direction square, it will move along the abutment surface 421. Since the third knob 41 is always pushed against the abutment surface 421, the swing member 42 will swing. The swing member 42 will cause the third return spring 43 to bend. When the third knob 41 is rotated out in the second direction negative square, the third return spring 43 will return and drive the swing member 42 to swing to fit against the third knob 41.
[0066] Specifically, the third adjustment component 4 also includes a mounting block, which is fixedly connected to the second moving plate 32. The third reset spring 43 is fixedly inserted into the mounting block and the swinging component 42. During maintenance, only the damaged mounting block needs to be replaced, which reduces maintenance steps, improves maintenance efficiency, and reduces maintenance costs.
[0067] In this embodiment, the first knob 21 and the third knob 41 are all provided with knob caps. The knob caps are provided with multiple anti-slip grooves, which can increase friction, prevent slippage, and improve adjustment efficiency.
[0068] Specifically, the anti-slip groove extends along the axial direction of the cap, and the grooves are arranged circumferentially on the outer surface of the cap.
[0069] The present invention also provides a chip test probe pose adjustment method for implementing a chip test probe pose adjustment device, comprising the following steps: S1, checking whether the probe is intact; if the probe has a problem, it needs to be replaced with a new probe; if the probe is normal and intact, fixing the probe to the clamp 44; S2, rotating the first knob 21 to fine-tune the probe along the first direction so that the probe is above the chip pin; rotating the third knob 41 to push the swing member 42 to fine-tune the angle of the probe to ensure that the probe can contact the chip pin; S3, rotating the second knob 31 to fine-tune the probe along the second direction so that the probe is close to the chip pin until it abuts the chip pin.
[0070] The chip test probe pose adjustment method provided by this invention includes the following steps: Step S1 checks the quality of the probe to prevent probe failure from misclassifying good products as defective products, thus improving test accuracy; Step S2 adjusts the first knob 21 and the second knob 31 to fine-tune the probe position, ensuring contact between the probe and the chip pins while preventing collisions that could damage the probe or chip due to excessively rapid movement, thereby reducing the failure rate and improving test efficiency; Step S3 addresses poor contact between the probe and the chip pins by rotating the third knob 41 to change the probe's pose, ensuring stable contact and preventing intermittent contact, thus improving test accuracy. This method reduces the probability of misclassifying good products as defective products due to intermittent contact, increases yield, and lowers production costs.
[0071] It should be noted that there is no order restriction on the adjustment of the first knob 21 and the third knob 41 in step S2. You can adjust the first knob 21 first and then the third knob 41, or you can adjust the third knob 41 first and then the first knob 21, or you can adjust the first knob 21 and the second knob 31 alternately, as long as the probe can contact the pin of the chip.
[0072] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, and are not intended to limit the implementation of the present invention. Those skilled in the art can make other variations or modifications based on the above description. It is neither necessary nor possible to exhaustively describe all embodiments here. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the scope of protection of the claims of the present invention.
Claims
1. A chip test probe position adjusting apparatus characterized by comprising: The utility model relates to a probe fixing device for chip testing equipment, which comprises a fixing assembly (1), a first adjusting assembly (2), a second adjusting assembly (3) and a third adjusting assembly (4). The fixing assembly (1) comprises a base (11) and a fixing plate (12), the base (11) can be fixedly connected to the chip testing equipment, and the fixing plate (12) is fixedly connected to the base (11). The first adjusting assembly (2) comprises a first knob (21), a first moving plate (22) and a first reset spring (23), the first moving plate (22) is movably connected to the fixing plate (12), the first knob (21) is screwed to the first moving plate (22), and the screwing process can abut against the fixing plate (12) to make the first moving plate (22) move in a first direction, and the two ends of the first reset spring (23) are fixedly connected to the first moving plate (22) and the fixing plate (12) respectively. The second adjusting assembly (3) comprises a second knob (31), a second moving plate (32) and a second reset spring (33), the second moving plate (32) is movably connected to the first moving plate (22), the second knob (31) is screwed to the second moving plate (32), and the screwing process can abut against the first moving plate (22) to make the second moving plate (32) move in a second direction, the first direction is perpendicular to the second direction, and the two ends of the second reset spring (33) are fixedly connected to the first moving plate (22) and the second moving plate (32) respectively. The third adjusting assembly (4) comprises a third knob (41), a swing piece (42), a third reset spring (43) and a clamping piece (44), the third knob (41) is screwed to the second moving plate (32), the two ends of the third reset spring (43) are fixedly connected to the second moving plate (32) and the swing piece (42) respectively, the clamping piece (44) is detachably connected to the swing piece (42), the third knob (41) can push the swing piece (42) to make the swing piece (42) drive the clamping piece (44) to swing, and the clamping piece (44) is used for fixing the probe.
2. The chip test probe position adjusting apparatus according to claim 1, wherein The first moving plate (22) is connected to the fixing plate (12) through a cross guide rail (5), and the second moving plate (32) is connected to the first moving plate (22) through the cross guide rail (5).
3. The chip test probe position adjusting apparatus according to claim 1, wherein The first adjusting assembly (2) further comprises a first fixed block (24), the first fixed block (24) is an L-shaped block, one end of the first fixed block (24) is fixedly connected to the first moving plate (22), the other end is provided with a first threaded hole, and the first knob (21) is screwed into the first threaded hole.
4. The chip test probe position adjusting apparatus according to claim 3, wherein The first adjusting assembly (2) further comprises a pushing block (25), the pushing block (25) is an L-shaped block, the horizontal section of the pushing block (25) is fixedly connected to the fixing plate (12), one end of the first fixed block (24) provided with the first threaded hole is located above the horizontal section of the pushing block (25), and the first knob (21) screwed into the first threaded hole can push the vertical section of the pushing block (25).
5. The chip test probe position adjusting apparatus according to claim 1, wherein The first mobile plate (22) is provided with a containing groove in a first direction, and the first reset spring (23) is arranged in the containing groove.
6. The chip test probe position adjusting apparatus according to claim 1, wherein The first adjusting assembly (2) further comprises a first fixed shaft (26) fixedly connected to the first mobile plate (22), wherein a first annular groove (261) is arranged on the first fixed shaft (26) away from the first mobile plate (22), and one end of the first reset spring (23) is sleeved in the first annular groove (261).
7. The chip test probe position adjusting apparatus according to claim 1, wherein The second adjusting assembly (3) further comprises a second fixed block (34) comprising a screwing part (341) and a mounting part (342) arranged at an angle, wherein the mounting part (342) is fixedly connected to the second mobile plate (32), the screwing part (341) is provided with a second threaded hole, and the second threaded hole is located above the first mobile plate (22), and the second knob (31) is screwed in the second threaded hole.
8. The chip test probe position adjusting apparatus according to claim 1, wherein The swing piece (42) is provided with a pushing surface (421) which is an inclined surface, and the third knob (41) can push the pushing surface (421) to swing the swing piece (42).
9. The probe card posture adjustment apparatus according to any one of claims 1 to 8, wherein The first knob (21), the first knob (21) and the third knob (41) are all provided with a rotating cap provided with a plurality of anti-skid grooves.
10. A method of adjusting the position of a chip test probe, for implementing the apparatus for adjusting the position of a chip test probe according to any one of claims 1 to 9, characterized by, The method comprises the following steps: S1, check whether the probe is intact, if the probe has problems, replace the new probe, if the probe is normal, fix the probe to the clamping piece (44); S2, rotate the first knob (21) to fine-tune the probe in a first direction, so that the probe is located above the pins of the chip, rotate the third knob (41) to push the swing piece (42), and fine-tune the angle of the probe to ensure that the probe can contact the pins of the chip; S3, rotate the second knob (31) to fine-tune the probe in a second direction, so that the probe is close to the pins of the chip until it abuts against the pins of the chip.