Server signal transmission link and server

Abstract

The invention provides a server signal transmission link and a server, and relates to the technical field of communication. According to the server signal transmission link, the repeater module is integrated on the cable carrier plate to form the cable module which can be independently replaced, flexible deployment of the repeater module is achieved, the repeater module is connected with the first hardware carrier plate of the server through the cable and the first connector adapter module, and the server signal transmission link is convenient to use. The repeater module is connected with the second hardware carrier plate of the server through the cable and the second connector adaptation module, compared with the prior art in which a repeater chip is integrated on a PCB carrier plate, decoupling of the repeater chip and the PCB carrier plate is achieved, when the repeater module breaks down, only the repeater module needs to be replaced independently, and the cost is reduced. The server hardware carrier plate does not need to be disassembled or replaced, the maintenance cost is remarkably reduced, and the maintainability of the server system is improved.

Description

TECHNICAL FIELD

[0001] The present application relates to the technical field of communication, in particular to a server signal transmission link and a server. BACKGROUND

[0002] With the rapid development of artificial intelligence (AI) technology, the transmission rate of the high-speed bus in the server is getting faster and faster, and therefore, the requirement for the signal transmission channel is getting more and more stringent. However, in the process of high-speed signal transmission, there will be a significant signal integrity challenge, that is, when the signal is transmitted in a long distance link, the high frequency component is attenuated due to the medium loss and impedance mismatch, resulting in the problem of "eye diagram" closure, Inter Symbol Interference (ISI) aggravation and link transmission error of the received signal, and ultimately causing the bit error rate to rise. To solve this problem, a repeater is usually inserted in the signal transmission link to optimize the signal on the intermediate link, so as to enhance the signal quality and reduce the high frequency attenuation of the signal at the receiving end.

[0003] In the related art, the repeater chip is usually integrated on a printed circuit board (PCB) carrier to realize the optimization of the high-speed link of the server. Specifically, the repeater chip (such as a retimer chip with signal retiming function) is welded on the PCB carrier (such as a riser card or a large backplane (BP)), and together with a switch, a master control chip and other key devices to form a signal transmission link.

[0004] However, the inventors have found that the server signal transmission link with the repeater chip integrated on the PCB carrier has the problem of high maintenance cost. SUMMARY

[0005] The present application provides a server signal transmission link and a server to solve the problem of high maintenance cost of the server signal transmission link with the repeater chip integrated on the PCB carrier in the related art.

[0006] In a first aspect, the present application provides a server signal transmission link, comprising: a cable carrier, a repeater module, and a first connector adapter module and a second connector adapter module connected to the input end and the output end of the repeater module through a cable, respectively, the repeater module is integrated on the cable carrier;

[0007] The repeater module is configured to optimize the signal transmitted in the signal transmission link.

[0008] The first connector adapter module is used to provide a first differential interface for connecting to the first hardware carrier board of the server;

[0009] The second connector adapter module is used to provide a second differential interface for connecting to the second hardware carrier board of the server.

[0010] In one possible implementation, the repeater module includes a repeater chip and a storage chip for communication connection; the repeater chip is used to optimize the signal transmitted in the signal transmission link; the storage chip is used to store the signal optimization parameter data corresponding to the repeater chip, so that the repeater chip can quickly read the signal optimization parameter data when powered on, and optimize the signal transmitted in the signal transmission link according to the signal optimization parameter data.

[0011] In one possible implementation, the signal optimization parameter data includes a preset combination of emphasis parameters, which is pre-adjusted based on different impedance matching between the cable and the hardware carrier.

[0012] In one possible implementation, the repeater module further includes peripheral circuitry; the input of the peripheral circuitry is connected to a power supply, and the peripheral circuitry includes a DC-DC step-down circuit, the input of which is connected to the power supply, and the output of which is connected to the power supply pin of the repeater chip; the DC-DC step-down circuitry is used to provide a stable operating voltage for the repeater chip and the memory chip.

[0013] In one possible implementation, the repeater module also includes a heat dissipation module for thermal management of the repeater chip.

[0014] In one possible implementation, the cable includes a first cable and a second cable; the repeater module is connected to the first connector adapter module via the first cable; and the repeater module is connected to the second connector adapter module via the second cable.

[0015] In one possible implementation, the first loss parameter of the first cable and the second loss parameter of the second cable are determined based on the overall loss of the server signal transmission link.

[0016] In one possible implementation, the cable carrier board and the cable are connected via a standardized interface.

[0017] In one possible implementation, a differential trace is provided on the cable carrier board, which is used to connect the differential signal transmitted by the cable to the differential interface of the repeater chip.

[0018] Secondly, this application provides a server, including: a server signal transmission link as provided in the first aspect above, the server signal transmission link being used to connect the server's motherboard to external devices.

[0019] The server signal transmission link and server provided in this application include a cable carrier board, a repeater module, and a first connector adapter module and a second connector adapter module connected to the input and output ends of the repeater module respectively via cables. The repeater module is integrated on the cable carrier board. The repeater module is used to optimize the signal transmitted in the signal transmission link. The first connector adapter module is used to provide a first differential interface for connecting to a first hardware carrier board of the server. The second connector adapter module is used to provide a second differential interface for connecting to a second hardware carrier board of the server. This application integrates the repeater module onto the cable carrier board, forming an independently replaceable cable module, enabling flexible deployment of the repeater module. The repeater module is connected to the first server hardware carrier board via a cable and a first connector adapter module, and to the second server hardware carrier board via a cable and a second connector adapter module. Compared to related technologies that integrate the repeater chip onto the PCB carrier board, this design decouples the repeater chip from the PCB carrier board. In the event of a repeater module failure, only the repeater module needs to be replaced, without disassembling or replacing the server hardware carrier board, significantly reducing maintenance costs and improving the maintainability of the server system. Attached Figure Description

[0020] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0021] Figure 1 A schematic diagram of the server signal transmission link provided in the embodiments of this application. Figure 1 ;

[0022] Figure 2 A schematic diagram of the server signal transmission link provided in the embodiments of this application. Figure 2 .

[0023] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0024] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended claims.

[0025] In related technologies, repeaters are typically integrated onto a PCB substrate to optimize high-speed links for servers. Specifically, repeater chips (such as retimer chips with signal retiming capabilities) are soldered onto the PCB substrate, forming a signal transmission link together with key components such as switch chips and main control chips. In this server signal transmission link, on the one hand, the repeater chip itself has a low cost, but when a single repeater chip fails, not only the repeater chip needs to be replaced, but also the PCB carrier board that integrates the repeater chip needs to be replaced. This PCB carrier board also integrates high-value integrated circuits (ICs) such as switching chips, resulting in high maintenance costs. On the other hand, the core function of the repeater chip is to optimize the attenuated signal in the server signal transmission link by retiming and equalizing it before retransmitting it. When it is placed in the middle of the entire server signal transmission link, the signal loss compensation effect at both ends of the link is optimal, which can reduce the overall loss. However, integrating the repeater chip on the PCB carrier board is limited by the physical installation position of the PCB carrier board, and the installation position of the repeater chip cannot be flexibly adjusted to the optimal compensation point, thus failing to meet the requirements for signal optimization.

[0026] Based on the problems existing in related technologies, the embodiments of this application integrate the repeater module on the cable carrier board to form an independently replaceable cable module, thereby enabling flexible deployment of the repeater module. The repeater module is connected to the first hardware carrier board of the server through the cable and the first connector adapter module, and to the second hardware carrier board of the server through the cable and the second connector adapter module. Compared with the related technologies that integrate the repeater chip on the PCB carrier board, this decouples the repeater chip from the PCB carrier board. When the repeater module fails, only the repeater module needs to be replaced, without disassembling or replacing the server hardware carrier board, which significantly reduces maintenance costs and improves the maintainability of the server system.

[0027] The application scenarios of the embodiments of this application will be described in detail below.

[0028] The server signal transmission link provided in this application embodiment is applicable to signal optimization scenarios in high-speed server links, such as scenarios where high-speed signals are transmitted in servers via high-speed cables (such as Peripheral Component Interconnect Express (PCIe) 5.0 or PCIe 6.0). It is particularly suitable for server types that require high-speed interconnection of multiple nodes, high bandwidth and low latency transmission, such as AI training servers, high-performance computing (HPC) servers and data center servers.

[0029] Specifically, in signal optimization scenarios, the server needs to connect the graphics processing unit (GPU), central processing unit (CPU), and motherboard via high-speed cables (such as PCIe cables), and repeater modules need to be deployed in the middle of the server signal link to optimize signal integrity.

[0030] The server signal transmission link provided in this application embodiment will be described in detail below with reference to specific embodiments.

[0031] Figure 1 A schematic diagram of the server signal transmission link provided in the embodiments of this application. Figure 1 .like Figure 1 As shown, the server signal transmission link includes a cable carrier board, a repeater module, and a first connector adapter module and a second connector adapter module that are connected to the input and output ends of the repeater module via cables, respectively. The repeater module is integrated on the cable carrier board.

[0032] The repeater module is used to optimize the signals transmitted in the signal transmission link.

[0033] The first connector adapter module is used to provide a first differential interface for connecting to the first hardware carrier board of the server;

[0034] The second connector adapter module is used to provide a second differential interface for connecting to the second hardware carrier board of the server.

[0035] For example, a cable carrier board can also be described as a repeater carrier board.

[0036] For example, the cable carrier can be a flexible substrate or a rigid substrate. This application does not limit this, and the specific choice can be made according to the actual application requirements.

[0037] It is understood that in this embodiment of the application, the cable carrier board serves as the carrier platform for the repeater module, and the repeater chip and cable are integrated through physical connection, thereby enabling the flexible deployment of the repeater module in the cable structure.

[0038] For example, the cable can be a PCIe high-speed differential pair cable. (e.g.) Figure 1 As shown, each cable between the repeater module and the first connector adapter module and the second connector adapter module is used to represent a PCIe high-speed differential pair.

[0039] For example, the number of cables between the repeater module and the first connector adapter module, and between the repeater module and the second connector adapter module, can be 10, 16, etc. This application embodiment does not limit this, and the specific number can be determined according to the actual application requirements.

[0040] like Figure 1 As shown, the input terminal of the repeater module is connected to the first connector adapter module via a cable, and the output terminal of the repeater module is connected to the second connector adapter module via a cable.

[0041] like Figure 1 As shown, the repeater module is used to perform optimization processing such as retiming, equalization and amplification on the high-speed serial signal sent by the first hardware carrier board, and then resend it to the second hardware carrier board to compensate for the insertion loss, crosstalk and amplitude attenuation and other losses generated in the server signal transmission link, so as to ensure the integrity of the signal transmitted to the second hardware carrier board.

[0042] For example, the first connector adapter module is equipped with an adapter, the type of which can be determined according to the connector specifications of the corresponding server first hardware carrier board, such as the server motherboard (MB) and backplane. The adapter can be a Mini Cool Edge I / O (MCIO).

[0043] For example, the second connector adapter module includes an adapter, the type of which can be determined according to the connector specifications of the corresponding server second hardware carrier board, such as a GPU carrier board, backplane, and high-speed network card. The adapter can be an MCIO.

[0044] For example, the second hardware carrier of the server can be a carrier that carries high-speed peripheral devices (such as GPUs and high-speed network cards), or a backplane and switching board that are directly connected to high-speed peripheral devices.

[0045] It is understood that the adapter provided in this application embodiment is positioned between the cable terminal (Connector) and the first and second server hardware carrier boards. It can adapt to the terminal types of different carrier boards through standardized terminal design, improving mechanical compatibility for stable connection. It also ensures impedance matching for high-speed differential signal transmission, avoiding signal reflection and loss caused by interface conversion, further supporting link signal integrity optimization. In other words, the adapter provided in this application embodiment can solve the mechanical and electrical interface compatibility problems caused by PCB layout limitations in related technologies, ensuring the compatibility of cables with different server hardware carrier board interfaces, thereby simplifying product testing procedures and improving testing accuracy.

[0046] For example, the first differential interface is used to receive the high-speed differential signal output by the first hardware carrier board of the server and transmit it to the repeater module via a cable; the second differential interface is used to receive the differential signal optimized by the repeater module and transmit the differential signal to the second hardware carrier board of the server via a cable.

[0047] For example, such as Figure 1 As shown in the figure, the signal transmission path of the server signal transmission link provided in this application embodiment can be as follows: after the signal is output from the first hardware carrier board of the server, it is transmitted to the repeater module via a cable through the first differential interface provided by the first connector adapter module. After the repeater module optimizes the signal, the optimized signal is transmitted to the second hardware carrier board of the server via a cable through the second differential interface provided by the second connector adapter module.

[0048] Understandably, from Figure 1 As can be seen from the embodiments of this application, in the server signal transmission link, the repeater module can be flexibly deployed in the cable structure and can be adjusted to the optimal compensation point according to the link loss characteristics (usually the electrical midpoint of the signal transmission path, at which point the accumulated signal loss is within a reasonable range and the compensation effect is optimal), thereby accurately offsetting the insertion loss, crosstalk and timing offset in the high-speed signal transmission process, and maximizing the improvement of signal transmission performance and integrity.

[0049] In this embodiment, the repeater module is integrated onto the cable carrier board to form an independently replaceable cable module, enabling flexible deployment of the repeater module. The repeater module is connected to the first hardware carrier board of the server via a cable and a first connector adapter module, and to the second hardware carrier board of the server via a cable and a second connector adapter module. Compared to related technologies that integrate the repeater chip onto the PCB carrier board, this method decouples the repeater chip from the PCB carrier board. When the repeater module fails, only the repeater module needs to be replaced, without disassembling or replacing the server hardware carrier board, significantly reducing maintenance costs and improving the maintainability of the server system.

[0050] Optionally, the repeater module provided in this application embodiment includes a repeater chip and a storage chip connected in communication; wherein, the repeater chip is used to optimize the signal transmitted in the signal transmission link; the storage chip is used to store the signal optimization parameter data corresponding to the repeater chip, so that the repeater chip can quickly read the signal optimization parameter data when powered on, and optimize the signal transmitted in the signal transmission link according to the signal optimization parameter data.

[0051] Understandably, repeater chips can include redriver chips and retimer chips. Redriver chips only amplify signal amplitude (they cannot distinguish between signal and noise, and will amplify noise simultaneously), and lack timing calibration capabilities, resulting in weak signal optimization performance. Retimer chips, on the other hand, can separate clock and data using Clock and Data Recovery (CDR) technology, calibrate signal timing deviations, and perform signal equalization. This is equivalent to physically reconstructing the signal and retransmitting it, resulting in stronger signal optimization performance and a more significant optimization effect, effectively extending the signal transmission distance of the overall server signal transmission link.

[0052] For example, the repeater chip used in the server signal transmission link provided in this application embodiment can be a retimer chip.

[0053] For example, repeater chips are used to perform optimization processing such as retiming, equalization, and amplification on high-speed serial signals in server signal transmission links to compensate for link losses and improve signal integrity.

[0054] For example, the memory chip can be an electrically erasable programmable read-only memory (EEPROM).

[0055] For example, the repeater chip and the memory chip can be connected via a communication bus, such as an I²C bus or an SPI bus. For instance, the clock and data pins of the memory chip can be connected to the I²C interface pins of the repeater chip via PCB traces.

[0056] For example, the signal optimization parameter data corresponding to the repeater chip includes, but is not limited to, the repeater chip's firmware (FW), preset emphasis parameter combinations, and initialization configuration data. The firmware within the repeater chip is used to control the repeater chip's power-on initialization, read the signal optimization parameter data, and execute signal optimization logic. It also supports firmware upgrades via an external interface.

[0057] Optionally, the signal optimization parameter data includes a preset combination of emphasis parameters, which is pre-adjusted based on different impedance matching between the cable and the hardware carrier.

[0058] In this embodiment, one possible implementation is to use multiple cables with different impedance and loss characteristics, as well as multiple server hardware carriers with different impedance characteristics, to conduct cross-tests of multiple sets of different impedance matching scenarios, and screen out the preset weighting parameter combination that can meet the signal optimization performance (such as eye diagram quality and bit error rate) in mainstream impedance matching scenarios.

[0059] In this embodiment, a preset combination of emphasis parameters in the repeater chip is pre-adjusted according to the different impedance matching of the cable and the hardware carrier board to optimize the signal in the server signal transmission link, thereby achieving adaptation to different impedance matching scenarios.

[0060] Optionally, the relay module provided in this application embodiment further includes peripheral circuitry, which includes a DC-DC step-down circuit. The input terminal of the DC-DC step-down circuit is connected to the power supply, and the output terminal of the DC-DC step-down circuit is connected to the power supply pin of the repeater chip. The DC-DC step-down circuit is used to provide a stable operating voltage for the repeater chip and the memory chip.

[0061] For example, a DC buck circuit can also be described as a power supply buck circuit.

[0062] For example, the power supply can be the power supply for the server system.

[0063] In one possible implementation, a DC buck circuit converts the high voltage (e.g., 12V, 15V) input to the server system power supply into a stable DC voltage (e.g., 1.8V, 1.2V) that conforms to the operating voltage specifications of the repeater chip and memory chip, thereby providing a stable operating voltage for the repeater chip and memory chip.

[0064] In this embodiment, a DC step-down circuit is set in the repeater module to provide a stable operating voltage for the repeater chip and the memory chip, ensuring the normal operation of the repeater chip and the memory chip and improving the stability of the server system.

[0065] Optionally, the peripheral circuit may also include 0201 packaged RC components (such as resistors, capacitors, etc.).

[0066] It is understood that the 0201 packaged resistors and capacitors used in the repeater template provided in this application are small in size, have low parasitic parameters, and are highly compatible, making them suitable for the high-density PCB layout requirements of the repeater module. On the one hand, they can reduce the area occupied by the devices in the cable structure, support the miniaturization design of the module, and facilitate flexible deployment in the server signal transmission link. On the other hand, their low parasitic inductance and capacitance characteristics can reduce interference to high-speed differential signals, and work with the DC step-down circuit to achieve stable power supply. Together with the signal optimization function of the repeater chip, they can ensure the integrity of the link signal.

[0067] Optionally, the repeater module provided in this application embodiment further includes a heat dissipation module, which is used for thermal management of the repeater chip.

[0068] For example, the heat dissipation module may include a heat pipe. One end of the heat pipe is in contact with the repeater chip, and the other end of the heat pipe is in contact with the external environment through heat dissipation fins.

[0069] In one possible implementation, one end of the heat pipe contacts the heat dissipation surface of the repeater chip. After absorbing heat, the working fluid vaporizes and is transported along the heat pipe to the other end, where it condenses and releases heat at the heat dissipation fins. The heat dissipation fins accelerate heat dissipation by increasing the contact area with the external environment.

[0070] In this embodiment, a heat dissipation module is used to achieve efficient heat dissipation of the repeater chip, thereby improving the stability of the server system.

[0071] Optionally, in the server signal transmission link provided in this application embodiment, the cable includes a first cable and a second cable; the repeater module is connected to the first connector adapter module through the first cable; and the repeater module is connected to the second connector adapter module through the second cable.

[0072] As mentioned above Figure 1 As shown, the solid lines contained in dashed box 11 can be the first cable, and the solid lines contained in dashed box 12 can be the second cable.

[0073] For example, the first cable and the second cable are connected via the signal processing function of the repeater module. That is, the signal transmitted in the server signal transmission link is transmitted from the first cable to the repeater module, processed by the repeater module, and then transmitted to the server's second hardware carrier board via the second cable.

[0074] In this embodiment of the application, by adopting a segmented design with at least two cable segments, segmented optimization of signal transmission over long distances is achieved, thereby improving the overall performance of the server system.

[0075] Optionally, the first loss parameter of the first cable and the second loss parameter of the second cable are determined based on the overall loss of the server signal transmission link.

[0076] For example, the first loss parameter of the first cable can be as follows: Figure 1 The loss parameters between the first hardware carrier board of the server and the repeater chip shown in the figure, and the second loss parameters of the second cable can be as follows: Figure 2 The loss parameters between the server's second hardware carrier board and the repeater chip are shown.

[0077] For example, when both the first and second cables are PCIe 5.0 high-speed cables, the first and second loss parameters (test frequency 28GHz, corresponding to the Nyquist frequency of the PCIe 5.0 protocol) can both be set within 36dB to ensure that the repeater chip's signal optimization functions (equalization, amplification, retiming) can effectively compensate for link loss and guarantee signal integrity. For instance, the first and second loss parameters can be 30dB, 36dB, etc.

[0078] It is understood that the overall loss of the server signal transmission link, i.e. the insertion loss threshold of the server signal transmission link, is determined according to the signal transmission protocol. This application embodiment does not limit this, and it can be determined according to the actual application requirements.

[0079] In this embodiment of the application, by setting a first loss parameter for the first cable and a second loss parameter for the second cable, it is ensured that the repeater module, after being independently deployed in the cable structure, can still achieve a signal optimization effect comparable to that of integrating the repeater chip onto a PCB substrate in related technologies.

[0080] Optionally, in the server signal transmission link provided in this application embodiment, the cable carrier board and the cable are connected through a standardized interface.

[0081] For example, the cable carrier board and the cable are physically and electrically connected through a standardized high-speed interface (such as a board-to-board connector or MCIO interface), which also has a mechanical fixing function. The board-to-board connector can employ a snap-fit ​​structure, meaning the cable carrier board and the cable are mechanically locked together via a snap-fit ​​mechanism.

[0082] In one possible implementation, one end of the snap-fit ​​structure is integrated with the cable carrier board, and the other end is adapted to the interface end of the cable. When the cable is inserted into the standardized high-speed interface of the cable carrier board, the snap-fit ​​structure snaps into the preset slot of the interface through elastic deformation, forming a stable mechanical lock, which not only ensures the reliable transmission of high-speed differential signals, but also facilitates quick plugging and unplugging and replacement in case of subsequent failures.

[0083] In this embodiment, the cable carrier board and the cable are connected through a standardized interface, enabling rapid assembly and disassembly of the cable carrier board and the cable, thereby improving the maintainability and versatility of the server system.

[0084] Optionally, the cable carrier board is provided with differential traces, which are used to connect the differential signals transmitted by the cable to the differential interface of the repeater chip.

[0085] For example, the differential traces can be high-speed differential traces, and the differential signals can be high-speed differential signals.

[0086] For example, the high-speed differential traces and standardized high-speed interfaces on the cable carrier board meet compatibility design requirements (such as 100Ω impedance matching, signal crosstalk suppression, reflection control, etc.) to ensure the integrity of high-speed differential signal transmission.

[0087] In this embodiment of the application, differential signals transmitted via cables are connected to the differential interface of the repeater chip through differential wiring, which can ensure impedance matching and anti-interference capability during signal transmission.

[0088] Figure 2 A schematic diagram of the server signal transmission link provided in the embodiments of this application. Figure 2 .like Figure 2 As shown, the server signal transmission link includes a first connector adapter module, a first cable 11, a second cable 12, a repeater chip 13, a memory chip 14, a DC step-down circuit 15, a heat dissipation module 16, a differential trace 17, and a cable carrier board 18.

[0089] like ​ As shown, the repeater chip 13, memory chip 14, DC-DC step-down circuit 15, heat dissipation module 16, and differential wiring are arranged on the cable carrier board 18. The repeater chip 13, memory chip 14, DC-DC step-down circuit 15, and heat dissipation module 16 together constitute the repeater module provided in this embodiment of the application.

[0090] The specific implementation of the signal transmission path and the optimization of the signal transmitted in the server signal transmission link by the repeater chip in the repeater module in the server signal transmission link provided in this application is similar to that described above, and will not be repeated here.

[0091] For example, in the server signal transmission link provided in this application embodiment, when the repeater chip interfaces with the uplink and downlink chips (server first hardware carrier board and server second hardware carrier board), the signal adaptation margin of the signal transmission link is improved through optimization functions such as clock and data recovery and adaptive equalization. Specifically, the actual eye diagram margin of the high-speed differential signal is greater than or equal to 20mVppd (the minimum threshold specified by the PCIe 5.0 protocol is 15mVppd, and the margin is ≥5mVppd), and the bit error rate (BER) is less than or equal to... (Agreement requirements) The margin satisfies three orders of magnitude of redundancy, and the total insertion loss margin of the signal transmission link is less than or equal to 30 dB (the maximum threshold specified by the PCIe 5.0 protocol is 36 dB, and the insertion loss margin is ≥6 dB). These quantitative indicators ensure that the signal transmission link can still achieve stable signal transmission under conditions of individual differences in mass production, environmental temperature fluctuations (-40℃~85℃), and long-term aging scenarios, significantly improving the reliability and compatibility of docking and adaptation.

[0092] In summary, the server signal transmission link provided in this application embodiment has the following beneficial effects:

[0093] 1) By integrating the repeater module onto the cable carrier board, an independently replaceable cable module is formed, enabling flexible deployment of the repeater module. The repeater module is connected to the first hardware carrier board of the server via the cable and the first connector adapter module, and to the second hardware carrier board of the server via the cable and the second connector adapter module. Compared with related technologies that integrate the repeater chip onto the PCB carrier board, this decouples the repeater chip from the PCB carrier board. When the repeater module fails, only the repeater module needs to be replaced, without disassembling or replacing the server hardware carrier board, significantly reducing maintenance costs and improving the maintainability of the server system.

[0094] 2) By placing the adapter between the cable connector and the first and second server hardware carrier boards, standardized terminal design can adapt to different carrier board terminal types, improving mechanical compatibility for stable connection. It also ensures impedance matching for high-speed differential signal transmission, avoiding signal reflection and loss caused by interface conversion, further supporting link signal integrity optimization. In other words, the adapter provided in this application can solve the mechanical and electrical interface compatibility problems caused by PCB layout limitations in related technologies, ensuring cable compatibility with different server hardware carrier board interfaces, thereby simplifying product testing procedures and improving testing accuracy.

[0095] 3) By pre-adjusting the preset emphasis parameter combination in the repeater chip to optimize the signal in the server signal transmission link according to the different impedance matching of the cable and the hardware carrier board, the adaptation to different impedance matching scenarios can be achieved.

[0096] 4) By setting the first loss parameter of the first cable and the second loss parameter of the second cable, it is ensured that the repeater module can still achieve a signal optimization effect comparable to that of the related technology of integrating the repeater chip on the PCB substrate after being deployed independently in the cable structure.

[0097] 5) By using the cable carrier board as the carrier platform for the repeater module, the repeater chip and cable are integrated through physical connection, enabling flexible deployment of the repeater module in the cable structure.

[0098] 6) By connecting the cable carrier board and the cable through standardized interfaces, the cable carrier board and the cable can be quickly assembled and disassembled, improving the maintainability and versatility of the server system;

[0099] 7) Connecting the differential signal transmitted by the cable to the differential interface of the repeater chip through differential wiring can ensure impedance matching and anti-interference capability during signal transmission.

[0100] This application also provides a server, including: a server signal transmission link as provided in the above embodiments, the server signal transmission link being used to connect the server's motherboard and external devices.

[0101] For example, the external device can be a high-speed peripheral device, such as a GPU or a high-speed network card.

[0102] Those skilled in the art will understand that all or part of the steps of the above-described method embodiments can be implemented by hardware related to program instructions. The aforementioned program can be stored in a computer-readable storage medium. When executed, the program performs the steps of the above-described method embodiments; and the aforementioned storage medium includes various media capable of storing program code, such as ROM, RAM, magnetic disks, or optical disks.

[0103] Finally, it should be noted that other embodiments of the invention will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This invention is intended to cover any variations, uses, or adaptations of the invention that follow the general principles of the invention and include common knowledge or customary techniques in the art not disclosed herein, and is not limited to the precise structures described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope. The scope of the invention is limited only by the appended claims.

Claims

1. A server signal transmission link, characterized by, The server signal transmission link comprises: a cable carrier plate, a repeater module, and a first connector adaptation module and a second connector adaptation module connected with the input end and the output end of the repeater module through a cable respectively; the repeater module is configured to optimize the signal transmitted in the signal transmission link, and the repeater module is integrated on the cable carrier plate; the first connector adaptation module is configured to provide a first differential interface connected with a first hardware carrier plate of a server; the second connector adaptation module is configured to provide a second differential interface connected with a second hardware carrier plate of a server.

2. The server signal transmission link of claim 1, wherein, The repeater module comprises a repeater chip and a storage chip connected in communication; the repeater chip is configured to optimize the signal transmitted in the signal transmission link; the storage chip is configured to store signal optimization parameter data corresponding to the repeater chip, so that the signal optimization parameter data can be quickly read when the repeater chip is powered on, and the signal transmitted in the signal transmission link can be optimized according to the signal optimization parameter data.

3. The server signal transmission link of claim 2, wherein, The signal optimization parameter data comprises a preset emphasis parameter combination, which is obtained by pre-adjusting according to the impedance matching of the cable and the hardware carrier plate.

4. The server signal transmission link of claim 2, wherein, The repeater module further comprises a peripheral circuit; the peripheral circuit comprises a DC voltage reduction circuit, an input end of the DC voltage reduction circuit is connected with a power supply, and an output end of the DC voltage reduction circuit is connected with a power supply pin of the repeater chip; the DC voltage reduction circuit is configured to provide a stable working voltage for the repeater chip and the storage chip.

5. The server signal transmission link of claim 2, wherein, The repeater module further comprises a heat dissipation module, and the heat dissipation module is configured to perform thermal management on the repeater chip.

6. The server signal transmission link according to any one of claims 1 to 5, characterized in that, The cable comprises a first cable and a second cable; the repeater module is connected with the first connector adaptation module through the first cable; the repeater module is connected with the second connector adaptation module through the second cable.

7. The server signal transmission link of claim 6, wherein, The first loss parameter of the first cable and the second loss parameter of the second cable are determined according to the overall loss of the server signal transmission link.

8. The server signal transmission link according to any one of claims 1 to 5, characterized in that, The cable carrier plate and the cable are connected through a standardized interface.

9. The server signal transmission link of claim 8, wherein, The cable carrier plate is provided with a differential trace, and the differential trace is configured to connect the differential signal transmitted by the cable with a differential interface of the repeater chip.

10. A server, characterized by The server signal transmission link comprises: any one of the server signal transmission links according to the preceding claims 1 to 9, and the server signal transmission link is configured to connect a mainboard of the server with an external device.

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