Method for manufacturing a multilayer electronic component

Abstract

The present disclosure provides a method for manufacturing a multilayer electronic component. The method for manufacturing a multilayer electronic component includes: forming a stacked sheet including a side edge attachment surface to which the first internal electrode pattern and the second internal electrode pattern are exposed by alternately disposing a dielectric ceramic sheet, a first internal electrode pattern, and a second internal electrode pattern; forming a side edge portion on the side edge attachment surface; forming a main body by sintering the stacked sheet on which the side edge portion is formed; and forming an external electrode on the body. The step of forming the side edge portion is performed by disposing a side edge sheet on the side edge attachment surface and applying pressure to the side edge sheet with a roller.

Description

[0001] This application claims the benefit of priority to Korean Patent Application No. 10-2024-0116489, filed on August 29, 2024, in the Korean Intellectual Property Office, the disclosure of which is incorporated herein in its entirety by reference. TECHNICAL FIELD

[0002] The disclosure relates to a method for manufacturing a multilayer electronic component. BACKGROUND

[0003] A multilayer ceramic capacitor (MLCC, a kind of multilayer electronic component) can be a chip capacitor mounted on a printed circuit board of various types of electronic products such as an image display device (including a liquid crystal display (LCD), a plasma display panel (PDP), etc.), a computer, a smart phone, a mobile phone, an infotainment system, etc., and used to charge or discharge the same.

[0004] A side edge portion of a multilayer electronic component can function to prevent damage to an internal electrode due to physical stress and / or chemical stress. In addition, in order to suppress a step difference caused by the internal electrode, a method of cutting a stack after stacking to expose the internal electrode from both side surfaces of a stacked sheet, and then stacking a single dielectric layer or two or more dielectric layers (a side edge sheet) on both side surfaces of the stacked sheet to form an edge portion has been used.

[0005] However, during the execution of a high-temperature pressing process and a stamping process to attach a side edge sheet to a stacked sheet, a spatial distribution can increase due to reasons such as uneven thermal expansion of a mold, and thus, a bonding force between the stacked sheet and the side edge sheet can decrease, which can decrease the moisture resistance reliability of the multilayer electronic component.

[0006] Accordingly, there is a need for improvement in a method of forming a side edge portion to improve adhesion between a side edge sheet and a stacked sheet. SUMMARY

[0007] An aspect of the disclosure is to alleviate a problem of a decrease in moisture resistance reliability of a multilayer electronic component due to a decrease in adhesion of a side edge portion in the multilayer electronic component including the side edge portion.

[0008] An aspect of the disclosure is to alleviate a problem of an increase in dimensional distribution of a multilayer electronic component due to pressure applied during formation of a side edge portion in the multilayer electronic component including the side edge portion.

[0009] However, the object of the disclosure is not limited to the above, and will be more easily understood in the course of describing specific embodiments of the disclosure.

[0010] In accordance with an aspect of the disclosure, a method for manufacturing a multilayer electronic component includes forming a stacked sheet including a side edge attachment surface by alternately disposing dielectric ceramic sheets, first inner electrode patterns, and second inner electrode patterns, the first inner electrode patterns and the second inner electrode patterns being exposed to the side edge attachment surface, forming a side edge portion on the side edge attachment surface, forming a main body by sintering the stacked sheet on which the side edge portion is formed, and forming an outer electrode on the main body. The step of forming the side edge portion is performed by disposing a side edge sheet on the side edge attachment surface and applying pressure to the side edge sheet with a roller. BRIEF DESCRIPTION OF DRAWINGS

[0011] The above and other aspects, features, and advantages of the disclosure will be more clearly understood from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0012] Figure 1 FIG. 1 is a perspective view schematically illustrating a multilayer electronic component according to an embodiment of the disclosure.

[0013] Figure 2 FIG. 2 is a perspective view schematically illustrating a main body according to an embodiment.

[0014] Figure 3 FIG. 3 is a perspective view schematically illustrating a stacked sheet according to an embodiment.

[0015] Figure 4 FIG. 4 is a cross-sectional view of the multilayer electronic component of FIG. 1 taken along line I-I'. Figure 1

[0016] FIG. 5 is a cross-sectional view of the multilayer electronic component of FIG. 1 taken along line II-II'. Figure 5 Figure 1 FIG. 6 is an exploded perspective view schematically illustrating an operation of forming a stack by stacking dielectric ceramic sheets and inner electrode patterns.

[0017] Figure 6 FIG. 7 is a perspective view schematically illustrating an operation of cutting the stack.

[0018] Figure 7A Figure 7B FIG. 8 is a perspective view schematically illustrating an operation of widening gaps between a plurality of stacked sheets.

[0019] Figure 8A FIG. 9 is a perspective view schematically illustrating an operation of rotating the plurality of stacked sheets so that side edge attachment surfaces face upward. Figure 8B

[0020] FIG. 10 is a plan view schematically illustrating a conventional operation of pressing a side edge sheet to a stacked sheet. Figure 9A Figure 9B ​​​is a plan view schematically showing a conventional operation of punching a side edge piece to a stacked piece.

[0021] Figure 10 is a schematic view schematically showing an example of an operation of forming a side edge portion in a method for manufacturing a multilayer electronic component according to an embodiment.

[0022] Figure 11 is a plan view schematically showing a pressing operation S4 of Figure 10

[0023] Figure 12 is a plan view schematically showing a punching operation S5 of Figure 10

[0024] Figure 13 is a bar chart showing thicknesses of multilayer electronic components (pieces) after sintering according to a comparative example and inventive examples.

[0025] Figure 14A is a graph showing results of a humidity resistance reliability test of a multilayer electronic component according to a comparative example, and Figure 14B is a graph showing results of a humidity resistance reliability test of a multilayer electronic component according to an inventive example. DETAILED DESCRIPTION

[0026] Hereinafter, embodiments of the disclosure will be described with reference to specific examples and accompanying drawings. However, the embodiments of the disclosure can be modified in various other forms, and the scope of the disclosure is not limited to the embodiments described below. In addition, the embodiments of the disclosure can be provided to more completely describe the disclosure to one of ordinary skill in the art. Therefore, the shape, size, etc. of elements in the drawings can be exaggerated for clarity of description, and elements denoted by the same reference numerals in the drawings can be the same elements.

[0027] In addition, in order to clearly explain the disclosure in the drawings, parts irrelevant to the description will be omitted, and the thickness can be exaggerated to clearly show layers and regions. The same reference numerals will be used to denote the same components. In addition, throughout the specification, unless otherwise specifically stated, when an element is referred to as "including" or "comprising" another element, it means that the element can further include other elements, without excluding the other elements.

[0028] In the drawings, the first direction can denote a direction in which a dielectric ceramic piece and an inner electrode pattern are stacked, or a direction in which a dielectric layer and an inner electrode are stacked, or a thickness direction of a multilayer electronic component.

[0029] In addition, in the drawings, the second direction can denote a direction perpendicular to the first direction or a length direction, and the third direction can denote a direction perpendicular to the first direction and the second direction or a width direction. ​​

[0030] Multilayer electronic assembly Hereinafter, before a detailed description of a method for manufacturing a multilayer electronic component according to embodiments of the disclosure, reference will be made to Figures 1 to 5 A detailed description of a multilayer electronic component 100 according to embodiments will be described.

[0031] Figure 1 is a perspective view schematically illustrating a multilayer electronic component according to embodiments of the disclosure.

[0032] Figure 2 is a perspective view schematically illustrating a body according to embodiments.

[0033] Figure 3 is a perspective view schematically illustrating a stack sheet according to embodiments.

[0034] Figure 4 is Figure 1 a cross-sectional view of the multilayer electronic component of

[0035] Figure 5 is Figure 1 a cross-sectional view of the multilayer electronic component of

[0036] Referring to Figure 1 , the multilayer electronic component 100 according to embodiments can include a body 110 and outer electrodes 131 and 132 disposed on the body 110.

[0037] Referring to Figure 2 , the body 110 can include a stack sheet 210 and side edge portions 114 and 115 disposed on the stack sheet 210. Although the specific shape of the body 110 is not particularly limited, the body 110 can have a hexahedral shape or the like, as illustrated in Figure 2 Due to the shrinkage of ceramic powder particles included in the body 110 during a sintering process, the body 110 can not have a perfect hexagonal shape, but can have a substantially hexahedral shape.

[0038] Referring to Figure 2 , the body 110 can include one surface 1 and another surface 2 opposite in a first direction, one surface 3 and another surface 4 opposite in a second direction, and one surface 5 and another surface 6 opposite in a third direction. In this case, the first direction can be defined as the direction in which the plurality of dielectric layers 111 and the plurality of inner electrodes 121 and 122 are stacked, the second direction can be perpendicular to the first direction, and can represent the direction in which the end portions of the first inner electrode 121 and the end portions of the second inner electrode 122 are alternately exposed from the surfaces of the body 110, and the third direction can represent the direction perpendicular to the first direction and the second direction.

[0039] The body 110 can include a corner connecting one surface 1 and another surface 2 facing each other in a first direction to one surface 3 and another surface 4 facing each other in a second direction and one surface 5 and another surface 6 facing each other in a third direction. The corner of the body can be formed by a shrinkage behavior during a sintering process. In an embodiment, the corner of the body 110 can be rounded. Accordingly, a chipping defect of the multilayer electronic component 100 can be suppressed.

[0040] Referring to Figure 3 , the stacked sheet 210 can include the dielectric layers 111 and the internal electrodes 121 and 122. The dielectric layers 111 and the internal electrodes 121 and 122 can be alternately disposed in the first direction, and the stacked sheet 210 can include a capacitor formation part Ac, which can be a region in which the dielectric layers 111 and the internal electrodes 121 and 122 are stacked in the first direction, and cover parts 112 and 113 disposed on one surface and another surface of the capacitor formation part Ac in the first direction.

[0041] Referring to Figure 3 , the stacked sheet 210 can include a first side surface ES1 and a second side surface ES2 facing each other in the first direction, a third side surface ES3 and a fourth side surface ES4 facing each other in the second direction, and a fifth side surface ES5 and a sixth side surface ES6 facing each other in the third direction.

[0042] The side surfaces of the stacked sheet 210 can form the surfaces of the body 110 after sintering, or can be covered by side edge parts 114 and 115. Specifically, the first side surface ES1 can form a part of the first surface 1 of the body 110, the second side surface ES2 can form a part of the second surface 2 of the body 110, the third side surface ES3 can form a part of the third surface 3 of the body 110, and the fourth side surface ES4 can form a part of the fourth surface 4 of the body 110. The fifth side surface ES5 and the sixth side surface ES6 can be covered by the side edge parts 114 and 115, respectively, which will be described later. In this specification, for convenience of explanation, the fifth side surface ES5 and the sixth side surface ES6 can be defined as side edge attachment surfaces.

[0043] The dielectric layers 111 can be in a sintered state, and adjacent dielectric layers 111 can be integrated to such an extent that it can be difficult to identify a boundary between the adjacent dielectric layers 111 without using a scanning electron microscope (SEM).

[0044] The raw material used to form the dielectric layer 111 is not particularly limited as long as sufficient capacitance can be obtained therewith. For example, a barium titanate-based material, a lead complex perovskite-based material, a strontium titanate-based material, or the like can be used. The barium titanate-based material can include a BaTiO3-based ceramic powder, and examples of the BaTiO3-based ceramic powder can include BaTiO3or (Ba 1-x Ca x )TiO3(0 < x < 1), Ba(Ti 1-y Ca y )O3(0 < y < 1), (Ba 1-x Ca x )(Ti 1- y Zr y )O3(0 < x < 1, 0 < y < 1), Ba(Ti 1-y Zr y )O3(0 < y < 1), or the like.

[0045] In addition, various ceramic additives, organic solvents, binders, dispersants, or the like can be added to a barium titanate (BaTiO3) powder or the like as a raw material used to form the dielectric layer 111.

[0046] The average thickness td of the dielectric layer 111 is not particularly limited. In general, when the dielectric layer 111 is formed thinner with a thickness of less than 0.6 μm, particularly when the average thickness td of the dielectric layer 111 is less than or equal to 0.35 μm, there is a concern that reliability can be reduced.

[0047] According to the embodiment of the disclosure, since the operation of forming the side edge portion is performed by disposing the side edge sheet on the side edge attachment surface and applying pressure thereto with a roller, even when the average thickness td of the dielectric layer 111 is less than or equal to 0.35 μm, excellent moisture resistance reliability of the multilayer electronic component 100 can be ensured.

[0048] Therefore, when the average thickness td of the dielectric layer 111 is less than or equal to 0.35 μm, the effects according to the disclosure can be more significant, and miniaturization and high capacitance of the multilayer electronic component 100 can be more easily achieved.

[0049] The average thickness td of the dielectric layer 111 can represent an average size of the dielectric layer 111 disposed between the adjacent first internal electrode 121 and second internal electrode 122 in the first direction. When the main body 110 includes a plurality of dielectric layers 111, the average thickness td of the dielectric layer 111 can represent an average thickness of at least one of the plurality of dielectric layers 111.

[0050] The average thickness td of the dielectric layer 111 can be measured by an image obtained by scanning a cross section of the main body 110 in the length direction and the thickness direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness of one dielectric layer can be measured at 30 points equally spaced in the length direction in the scanned image to measure an average value. The 30 equally spaced points can be designated in the capacitance forming portion Ac. Further, when the measurement of the average value is extended to 10 dielectric layers and an average value thereof is measured, the average thickness of the dielectric layer can be generalized.

[0051] The cover portions 112 and 113 can be respectively provided on one surface and the other surface of the capacitance forming portion Ac in the first direction. The cover portions 112 and 113 can be formed by stacking a single dielectric layer or two or more dielectric layers on one surface and the other surface of the capacitance forming portion Ac in the first direction, respectively, and can substantially function to prevent damage to the internal electrodes due to physical stress and / or chemical stress.

[0052] The cover portions 112 and 113 do not include the internal electrodes, and can include substantially the same material as the dielectric layer 111.

[0053] The average thickness tc of the cover portions 112 and 113 is not particularly limited. To more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average thickness tc of the cover portions 112 and 113 can be less than or equal to 15 µm. In this case, the average thickness of the cover portions 112 and 113 can represent an average thickness of at least one of the first cover portion 112 and the second cover portion 113.

[0054] The average thickness tc of the cover portions 112 and 113 can represent a first direction dimension, and can be an average value of the first direction dimension of the cover portions 112 and 113 measured at five equally spaced points above or below the capacitance forming portion Ac.

[0055] The internal electrodes 121 and 122 can be alternately provided with the dielectric layer 111 in the first direction, and the internal electrodes 121 and 122 can include a first internal electrode 121 and a second internal electrode 122. Referring to Figure 2 and Figure 3 , the first internal electrode 121 and the second internal electrode 122 can be alternately provided to face each other with the dielectric layer 111 interposed therebetween, and can be connected to (e.g., exposed to) one or more of the third side surface ES3, the fourth side surface ES4, the fifth side surface ES5, and the sixth side surface ES6 of the stacked sheet 210.

[0056] Specifically, one end of the first internal electrode 121 in the second direction can be connected to the third side surface ES3, the other end of the first internal electrode 121 in the second direction can be spaced apart from the fourth side surface ES4, one end of the second internal electrode 122 in the second direction can be connected to the fourth side surface ES4, and the other end of the second internal electrode 122 in the second direction can be spaced apart from the third side surface ES3.

[0057] For example, the first internal electrode 121 can not be connected to the second external electrode 132, but can be connected to the first external electrode 131, and the second internal electrode 122 can not be connected to the first external electrode 131, but can be connected to the second external electrode 132. In this case, the first internal electrode 121 and the second internal electrode 122 can be electrically separated from each other by the dielectric layer 111 disposed between the first internal electrode 121 and the second internal electrode 122.

[0058] Referring to Figure 3 Both ends of the first internal electrode 121 in the third direction and both ends of the second internal electrode 122 in the third direction can be simultaneously connected to the fifth side surface ES5 and the sixth side surface ES6. Accordingly, the proportion of the capacitor forming portion Ac in the entire assembly can be increased, thereby maximizing the capacitance per unit volume of the multilayer electronic assembly 100, and the step difference between the side edge portions 114 and 115 and the capacitor forming portion Ac based on the degree of stacking of the internal electrodes can be mitigated.

[0059] The material forming the internal electrodes 121 and 122 is not particularly limited, and a material having excellent electrical conductivity can be used. For example, the internal electrodes 121 and 122 can include one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof.

[0060] Further, the internal electrodes 121 and 122 can be formed by printing a conductive paste for internal electrodes including one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof on a ceramic green sheet. The method of printing the conductive paste for internal electrodes can include a screen printing method, a gravure printing method, or the like, and the present disclosure is not limited thereto.

[0061] The average thickness te of the internal electrodes 121 and 122 is not particularly limited.

[0062] Generally, when the internal electrodes 121 and 122 are formed to be relatively thin with a thickness of less than 0.6 µm, particularly when the average thickness te of the internal electrodes 121 and 122 is less than or equal to 0.35 µm, there is a concern that reliability can be reduced.

[0063] According to embodiments of the disclosure, since the operation of forming the side edge portions is performed by disposing the side edge sheet on the side edge attachment surface and applying pressure thereto with a roller, excellent moisture resistance reliability of the multilayer electronic component 100 can be ensured even when the average thickness te of the internal electrodes 121 and 122 is less than or equal to 0.35 μm.

[0064] Accordingly, when the average thickness te of the internal electrodes 121 and 122 is less than or equal to 0.35 μm, the effects according to the disclosure can be more significant, and miniaturization and high capacitance of the multilayer electronic component 100 can be more easily achieved.

[0065] The average thickness te of the internal electrodes 121 and 122 can represent an average dimension of the internal electrodes 121 and 122 in the first direction. When the main body 110 includes a plurality of internal electrodes 121 and 122, the average thickness te of the internal electrodes 121 and 122 can represent an average thickness of at least one of the plurality of internal electrodes 121 and 122.

[0066] The average thickness te of the internal electrodes 121 and 122 can be measured by an image obtained by scanning a cross section of the main body 110 in the length direction and the thickness direction with a scanning electron microscope (SEM) at a magnification of 10,000 times. More specifically, the thickness of one internal electrode can be measured at 30 equally spaced points in the length direction in the scanned image to measure an average value. The 30 equally spaced points can be designated in the capacitance forming portion Ac. In addition, when the measurement of the average value is extended to 10 internal electrodes and an average value thereof is measured, the average thickness of the internal electrodes can be made more general.

[0067] Referring to Figure 1 , Figure 2 and Figure 5 , the side edge portions 114 and 115 can be disposed on the fifth side surface ES5 and the sixth side surface ES6 of the stacked sheet 210, respectively.

[0068] The side edge portions 114 and 115 can substantially function to prevent damage to the internal electrodes due to physical stress and / or chemical stress.

[0069] The material forming the side edge portions 114 and 115 is not particularly limited, and as an example, the side edge portions 114 and 115 can be formed with the same material as the dielectric layer 111, but are not limited thereto, and as another example, the side edge portions 114 and 115 can be formed with a different material from the dielectric layer 111, in which case, the side edge portions 114 and 115 can have a different composition from that of the dielectric layer 111.

[0070] The width of the side edge portions 114 and 115 is not particularly limited. In order to more easily achieve miniaturization and high capacitance of the multilayer electronic component, the average width of the side edge portions 114 and 115 can be less than or equal to 15 μm.

[0071] The average width of the side edge portions 114 and 115 can represent the average size of the side edge portions 114 and 115 in the third direction, and can be the average of the sizes of the side edge portions 114 and 115 in the third direction measured at five equally spaced points on the side surface of the capacitance forming portion Ac.

[0072] The outer electrodes 131 and 132 can be respectively disposed on the third and fourth surfaces of the main body 110. Specifically, the first outer electrode 131 can be disposed on one surface 3 of the main body 110 in the second direction, and can be connected to the first inner electrode 121, and the second outer electrode 132 can be disposed on the other surface 4 of the main body 110 in the second direction, and can be connected to the second inner electrode 122.

[0073] In the present embodiment, although a structure in which the multilayer electronic component 100 has two outer electrodes 131 and 132 is shown, the number or shape of the outer electrodes 131 and 132 can be changed according to the shape of the inner electrodes 121 and 122 or other purposes.

[0074] The outer electrodes 131 and 132 can be formed using any material having electrical conductivity such as metal, and the specific material can be determined by considering electrical properties, structural stability, etc., and in addition, the outer electrodes 131 and 132 can have a multilayer structure.

[0075] The outer electrodes 131 and 132 can be respectively formed on one surface and the other surface of the main body 110 in the second direction, and can be disposed to extend onto a portion of one surface and a portion of the other surface of the main body 110 in the first direction and / or a portion of one surface and a portion of the other surface of the main body 110 in the third direction. In this case, the outer electrodes 131 and 132 can be disposed to cover the end portions of the side edge portions 114 and 115. In this case, the regions of the outer electrodes 131 and 132 disposed on the end portions of the side edge portions 114 and 115 can have a rounded shape, and thus, coverage of the outer electrodes 131 and 132 can be ensured even on the corners or side edge portions 114 and 115 of the main body 110.

[0076] The outer electrodes 131 and 132 can include electrode layers 131a and 132a disposed on the main body 110 and plating layers 131b and 132b formed on the electrode layers 131a and 132a.

[0077] For a more specific example of the electrode layers 131a and 132a, the electrode layer can be a sintered electrode including a conductive metal and glass, or a resin-based electrode including a conductive metal and a resin.

[0078] In addition, the electrode layers 131a and 132a can be formed in a form in which a sintered electrode and a resin-based electrode are sequentially formed on the main body 110. In addition, the electrode layers 131a and 132a can be formed by transferring a sheet including a conductive metal onto the main body 110, or can be formed by transferring a sheet including a conductive metal onto a sintered electrode.

[0079] A material having excellent electrical conductivity can be used as the conductive metal included in the electrode layers 131a and 132a, and is not particularly limited. For example, the conductive metal can be one or more of nickel (Ni), copper (Cu), and alloys thereof.

[0080] The plating layers 131b and 132b can function to improve sealing properties or mounting properties of the multilayer electronic component 100. The type of the plating layers 131b and 132b is not particularly limited, and can be a plating layer including one or more of Ni, Sn, Pd, and alloys thereof, and can be formed in multiple layers.

[0081] For a more specific example of the plating layers 131b and 132b, the plating layers 131b and 132b can be a plating layer including Ni or a plating layer including Sn, or can be a form in which a plating layer including Ni and a plating layer including Sn are sequentially formed on the electrode layers 131a and 132a, or can be a form in which a plating layer including Sn, a plating layer including Ni, and a plating layer including Sn are sequentially formed. In addition, the plating layers can include multiple Ni plating layers and / or multiple Sn plating layers.

[0082] Method for manufacturing a multilayer electronic assembly Hereinafter, a method for manufacturing a multilayer electronic component will be described with reference to Figures 6 to 12 A method for manufacturing a multilayer electronic component according to an embodiment of the disclosure is not limited to a method for manufacturing the above-described multilayer electronic component 100.

[0083] Figure 6 FIG. 7 is an exploded perspective view schematically showing an operation of forming a stack by stacking dielectric ceramic sheets and inner electrode patterns.

[0084] Figure 7A and Figure 7B FIG. 8 is a perspective view schematically showing an operation of cutting the stack.

[0085] Figure 8A FIG. 9 is a perspective view schematically showing an operation of widening gaps between the plurality of stacked sheets, Figure 8B FIG. 10 is a perspective view schematically showing an operation of making side edge attachment surfaces face upward by rotating the plurality of stacked sheets.

[0086] Figure 9A FIG. 11 is a plan view schematically showing a conventional operation of pressing side edge sheets to the stacked sheets,Figure 9B is a plan view schematically showing a conventional operation of punching a side edge sheet onto a stacked sheet.

[0087] Figure 10 is a schematic view schematically showing an example of an operation of forming a side edge portion in a method for manufacturing a multilayer electronic component according to an embodiment.

[0088] Figure 11 is a plan view schematically showing Figure 10 a pressing operation S4.

[0089] Figure 12 is a plan view schematically showing Figure 10 a punching operation S5.

[0090] A method for manufacturing a multilayer electronic component according to an embodiment of the disclosure can include an operation of forming a stacked sheet 210 by alternately disposing dielectric ceramic sheets 201 and 202, a first internal electrode pattern 221, and a second internal electrode pattern 222, the stacked sheet 210 including side edge attachment surfaces ES5 and ES6 connected to the first internal electrode pattern 221 and the second internal electrode pattern 222, an operation of forming side edge portions 114 and 115 on the side edge attachment surfaces, and an operation of sintering the stacked sheet on which the side edge portions are formed. The operation of forming the side edge portions can be performed by disposing a side edge sheet 13 on the side edge attachment surfaces and applying pressure to the side edge sheet 13 with rollers 30 and 30'.

[0091] Referring to Figure 6 , a method for manufacturing a multilayer electronic component according to an embodiment of the disclosure can include an operation of forming a stack 200 by disposing dielectric ceramic sheets 201, 202, and 203, a first internal electrode pattern 221, and a second internal electrode pattern 222.

[0092] The operation of forming the stack 200 can be performed by alternately disposing the dielectric ceramic sheets 201 and 202, the first internal electrode pattern 221, and the second internal electrode pattern 222 on a support film 310, and the dielectric ceramic sheets 201 and 202 can be disposed between the first internal electrode pattern 221 and the second internal electrode pattern 222. The internal electrode pattern (or the dielectric ceramic sheet) disposed on the uppermost end and the internal electrode pattern (or the dielectric ceramic sheet) disposed on the lowermost end can be covered by the dielectric ceramic sheet 203, and in this case, the dielectric ceramic sheet 203 can form the cover portions 112 and 113 in the multilayer electronic component 100.

[0093] The dielectric ceramic sheets 201, 202, and 203 can be manufactured by preparing a slurry in which dielectric main component powder particles such as barium titanate (BaTiO3) and additives, an organic solvent, a binder, a dispersant, and the like are mixed, and forming the slurry into a sheet shape.

[0094] Among the dielectric ceramic sheets 201, 202, and 203, the dielectric ceramic sheets 201 and 202 disposed between the first inner electrode pattern 221 and the second inner electrode pattern 222 can form the dielectric layer 111 of the multilayer electronic component 100 after sintering.

[0095] The inner electrode patterns 221 and 222 can have a strip shape. Specifically, the inner electrode patterns can be formed to have a constant interval in the second direction and to contact both ends of the dielectric ceramic sheets 201 and 202 in the third direction.

[0096] The inner electrode patterns 221 and 222 can include an electrically conductive metal such as one or more of nickel (Ni), copper (Cu), palladium (Pd), silver (Ag), gold (Au), platinum (Pt), tin (Sn), tungsten (W), titanium (Ti), and alloys thereof, and the inner electrode patterns 221 and 222 can be printed on the dielectric ceramic sheets 201 and 202. A method of printing the inner electrode patterns 221 and 222 can include a screen printing method, a gravure printing method, or the like, and the present disclosure is not limited thereto.

[0097] The operation of forming the stack 200 can be performed by stacking the inner electrode patterns 221 and 222 and the dielectric ceramic sheets 201, 202, and 203 on the support film 310 and pressing them together.

[0098] Referring to Figure 7A and Figure 7B The stack 200 can be cut along cutting lines C1-C1 and C2-C2 that are orthogonal to each other (e.g., perpendicular to each other). The cutting lines C1-C1 can be cutting lines parallel to the second direction and can be disposed at substantially equal intervals in the third direction, and the cutting lines C2-C2 can be cutting lines parallel to the third direction and can be disposed at substantially equal intervals in the second direction. The stack sheet 210 can be formed to have a substantially constant third direction size by the cutting lines C1-C1, and the stack sheet 210 can be formed to have a substantially constant second direction size by the cutting lines C2-C2.

[0099] A means for cutting the stack 200 is not particularly limited. For example, the stack 200 can be cut using a blade cutting method such as a cutting method using a doctor blade, a scribe blade, or the like, a guillotine cutting method, or a laser cutting method.

[0100] Referring to Figure 8A After the stack 200 is cut to form the stack sheets 210, an operation of increasing the distance between the plurality of stack sheets 210 can be performed. The operation can be performed by increasing the support film 310 in the second direction and the third direction, but is not limited thereto and can also be performed by moving the plurality of stack sheets 210 to another support film.

[0101] Referring to Figure 8B An operation of making the side edge attachment surfaces ES5 and ES6 of the stacked sheets 210 face upward can be performed. The operation can be a process of simultaneously making the fifth side surfaces ES5 of a plurality of the stacked sheets 210 face upward or simultaneously making the sixth side surfaces ES6 of a plurality of the stacked sheets 210 face upward to easily form the side edge portions, the fifth side surfaces ES5 or the sixth side surfaces ES6 can be surfaces of the plurality of the stacked sheets 210 which are to form the side edge portions, i.e., the side edge attachment surfaces. As described in the multilayer electronic component 100 according to the embodiment, the side edge attachment surfaces of the stacked sheets 210 can be surfaces to which both ends of the first internal electrode pattern 221 and both ends of the second internal electrode pattern 222 are connected.

[0102] The operation of making the side edge attachment surfaces ES5 and ES6 of the stacked sheets 210 face upward is not particularly limited. For example, the operation can be performed by simultaneously rotating the plurality of the stacked sheets 210 or moving the plurality of the stacked sheets 210 to another support film without rotation.

[0103] Referring to Figure 9A and Figure 9B The conventional operation of forming the side edge portions can be performed by disposing the side edge sheet 13, the elastic plate 12, and the metal plates 11 and 11' on one of the side edge attachment surfaces ES5 and ES6 of the stacked sheets 210, disposing the press plate 14 on the other of the side edge attachment surfaces ES5 and ES6 of the stacked sheets 210 opposite to the one, and then applying pressure to the metal plates 11 and 11' and the press plate 14 to perform a press process and a stamping process. In this conventional process, since thermal expansion dispersion of the press plate 14 and the metal plates 11 and 11' and an angle formed by the press plate 14 and the metal plates 11 and 11', the operation of forming the side edge portions in a surface contact (plate-to-plate) manner can increase adhesion dispersion between the stacked sheets 210 and the side edge sheet 13, and thus, the moisture resistance reliability of the multilayer electronic component can be reduced.

[0104] Referring to Figures 10 to 12 In the method for manufacturing a multilayer electronic component according to the embodiment of the disclosure, the operation of forming the side edge portions can be performed by disposing the side edge sheet 13 on the side edge attachment surfaces ES5 and ES6 and applying pressure thereto with the rollers 30 and 30'.

[0105] Thus, unlike the stacked sheets 210 and the side edge sheet 13 being pressed and stamped by pressure generated when a surface meets a surface in the conventional process, in the method for manufacturing a multilayer electronic component according to the embodiment of the disclosure, the stacked sheets 210 and the side edge sheet 13 can be pressed and stamped by pressure generated when a surface meets a line (for example, as in Figure 11 and Figure 12As shown in the middle, the contact form between the sheet-shaped carrier film 15 and the cylindrical rollers 30 and 30' is surface-to-line contact, i.e., the contact area is linear, so that the pressure generated at the corner where the stacked sheet 210 is in contact with the side edge sheet 13 is pressed and punched, thereby minimizing and uniformizing the space dispersion of the components involved in the operation of forming the side edge portion, and thus, the deformation of the stacked sheet 210 due to the pressing and punching of the stacked sheet 210 and the side edge sheet 13 can be reduced, and the adhesion between the stacked sheet 210 and the side edge sheet 13 can be improved.

[0106] Depending on the length of the rollers 30 and 30', the rollers 30 and 30' can simultaneously apply pressure to a plurality of stacked sheets 210. For example, the operation of forming the side edge portion according to the embodiment can be simultaneously performed on each row of the plurality of arrayed stacked sheets 210.

[0107] Referring to Figure 10 In the operation of forming the side edge portion according to the embodiment, the carrier film 15 connected to the conveying roller 10 and the recovery roller 10' can be provided, and the stacked sheet 210 can be attached to the carrier film 15.

[0108] In this case, the carrier film 15 can be irradiated with ultraviolet light or the like to cause a loss or improvement of the adhesion function, and thus, the same process can be repeated on different side edge attachment surfaces to which the side edge sheet is not attached after the operation of forming the side edge portion is performed once.

[0109] The composition of the carrier film 15 is not particularly limited. In the embodiment, the carrier film 15 can include one or more of polyethylene terephthalate (PET), polyurethane (PU), polyethylene (PE), polyolefin (PO), polystyrene (PS), polyvinyl chloride (PVC), and polyvinylidene chloride (PVDC).

[0110] Referring to Figure 10 The operation of forming the side edge portion according to the embodiment can be performed by disposing a plurality of stacked sheets 210 on one surface of the carrier film 15, and thus, the rollers 30 and 30' can directly apply pressure to the surface of the carrier film 15 to which the stacked sheet 210 is not attached.

[0111] In the embodiment, the operation of forming the side edge portion can include a pressing operation S4 of pressing the side edge sheet 13 to the side edge attachment surfaces ES5 and ES6 by pressing with the pressing roller 30', and a punching operation S5 of punching the side edge sheet 13 attached to the side edge attachment surfaces ES5 and ES6 by using the punching roller 30.

[0112] The operation of forming the side edge portion according to the embodiment can include, as Figure 10The operations S1 to S7 are illustrated. For convenience of explanation, the pressing operation S4 and the stamping operation S5 will be described in detail below, and then the remaining operations will be described.

[0113] Pressing operation S4 In an embodiment, the pressing operation S4 can be performed by disposing the elastic plate 12 and the metal plate 11' on the side edge piece 13.

[0114] In an embodiment, the metal plate 11' in the pressing operation S4 can be heated to a temperature higher than room temperature, specifically, can be heated to a temperature of 50 to 150°C. Accordingly, the flowability of the elastic plate 12 and the flowability of the side edge piece 13 can be improved, thereby relieving warping of the plurality of stacked pieces 210.

[0115] In an embodiment, the pressing roller 30' used in the pressing operation S4 can include a high-rigidity portion 31 disposed at a center portion and a low-rigidity portion 32 disposed on the high-rigidity portion 31. The high-rigidity portion 31 can function to maintain rigidity of the pressing roller 30', and the low-rigidity portion 32 can function to reduce pressure distribution according to a position applied to each of the plurality of stacked pieces 210 in the pressing operation S4.

[0116] A material included in the high-rigidity portion 31 is not particularly limited, and a material having high rigidity and durability can be used. A material included in the low-rigidity portion 32 is not particularly limited, and can be, for example, polyurethane.

[0117] Punching operation S5 In an embodiment, the stamping operation S5 can be performed by disposing the elastic plate 12 and the metal plate 11 on the side edge piece 13.

[0118] In an embodiment, the metal plate 11 in the stamping operation S5 can be maintained at a temperature of 50°C or less or at room temperature or a temperature lower than room temperature to prevent thermal shock. For example, the stamping operation S5 can be performed without heating the metal plate 11. Accordingly, when the flowability of the side edge piece 13 is reduced and pressure is applied, regions of the side edge piece 13 other than regions corresponding to the side edge attachment surfaces ES5 and ES6 can be cut off.

[0119] In an embodiment, a stamping roller 30 used in the stamping operation S5 can be formed as a high-rigidity portion. Accordingly, pressure applied in the stamping operation S5 can be effectively transmitted to the side edge piece 13.

[0120] In addition to the operations of disposing the side edge sheet 13 on the side edge attachment surfaces ES5 and ES6 and applying pressure to the side edge sheet 13 using the rollers 30 and 30', respectively, other operations S1 to S3, S6, and S7 can also be performed before or after the operation of forming the side edge portion according to the embodiment.

[0121] Hereinafter, the operations S1 to S3, S6, and S7 will be described in detail.

[0122] Operation S1 To perform the operation of forming the side edge portion, the plurality of stacked sheets 210 can be moved by the adhesive member 20. The adhesive member 20 can have a form in which an adhesive film is fixed with a ring.

[0123] The adhesive member 20 can be rotated so that the plurality of stacked sheets 210 face the carrier film 15, and the adhesive member 20 can be moved so that the plurality of stacked sheets 210 are attached to the carrier film 15.

[0124] Operation S2 After the plurality of stacked sheets 210 are attached to the carrier film 15, the adhesive member 20 can be separated from the plurality of stacked sheets 210. This separation can be achieved by adjusting the adhesion between the plurality of stacked sheets 210 and the carrier film 15 to be greater than the adhesion between the plurality of stacked sheets 210 and the adhesive member 20.

[0125] The method of adjusting the adhesion between the carrier film 15 and the stacked sheets 210 is not particularly limited. As an example, a method of increasing or decreasing the adhesion of the carrier film 15 according to the wavelength of ultraviolet light can be used.

[0126] Operation S3 After the operation S2, the side edge sheet 13 can be disposed on the side edge attachment surface of the stacked sheet 210. In this case, since the side edge sheet 13 has not yet undergone the pressing operation S4 or the stamping operation S5, the adhesion between the side edge sheet 13 and the stacked sheet 210 can be minimal. To further increase the adhesion between the stacked sheet 210 and the side edge sheet 13, a separate adhesion layer can be additionally provided between the stacked sheet 210 and the side edge sheet 13.

[0127] Operation S6 After the stamping operation S5, an operation of separating the stacked sheet 210' to which the side edge sheet 13 is attached from the carrier film 15 can be performed. The method of separating the stacked sheet 210' to which the side edge sheet 13 is attached from the carrier film 15 is not particularly limited, and for example, a method of disposing an ultraviolet irradiation unit 16 below the carrier film 15 and irradiating the carrier film 15 with ultraviolet light to decrease or lose the adhesion between the stacked sheet 210' and the carrier film 15 can be used.

[0128] Operation S7 After operation S6, a process of separating the stack sheet 210' to which the side edge sheet 13 is attached from the carrier film 15 using the adhesive member 20 can be performed. Since the adhesion between the carrier film 15 and the stack sheet 210' to which the side edge sheet 13 is attached can be reduced or lost by operation S6, the stack sheet 210' can be attached to the adhesive member 20 and can be separated from the carrier film 15.

[0129] Since the operation of forming the side edge portion according to the embodiment shown in FIG. 6 is to attach the side edge sheet 13 to one of the side edge attachment surfaces ES5 and ES6 of the stack sheet 210, operations S1 to S7 can be performed on one of the side edge attachment surfaces ES5 and ES6, and then the same operations S1 to S7 can be performed on the other side edge attachment surface to which the side edge sheet 13 is not attached, so that the side edge sheet 13 can be attached to both of the side edge attachment surfaces ES5 and ES6. Figure 10

[0130] Thereafter, an operation of forming the main body by sintering the stack sheet 210' to which the side edge sheet 13 is attached can be performed. The sintering temperature is not particularly limited, but can be sintered at, for example, 1000°C to 1300°C. In addition, the sintering can be performed under a reducing atmosphere.

[0131] Thereafter, the outer electrodes 131 and 132 can be formed on one surface and the other surface of the main body 110 in the second direction, respectively, thereby manufacturing the multilayer electronic component 100. The outer electrodes 131 and 132 can be formed by disposing a conductive paste containing a metal having excellent electrical conductivity on one surface (the third surface 3) and the other surface (the fourth surface 4) of the main body 110 in the second direction, respectively, and sintering them together with the main body 110.

[0132] Referring to Figure 11 and Figure 12 , the rollers 30 and 30' can be moved in the X direction and the -X direction, the X direction can be a direction of transport of the carrier film 15 or the stack sheet 210, the -X direction can be a direction opposite to the X direction, and the rollers 30 and 30' can be moved in the Z direction and the -Z direction, the Z direction can be a direction of stacking of the side edge sheet 13, the elastic sheet 12, and the metal sheet 11 or 11' and perpendicular to the X direction, the -Z direction can be a direction opposite to the Z direction. The pressure in the pressing operation and the punching operation can be applied in the Z direction facing the side edge sheet, and the pressure in the pressing operation and the punching operation can be applied by the rollers 30 and 30'.

[0133] ​In an embodiment, the rollers 30 and 30' can be connected to a driver for driving the rollers 30 and 30'. In this case, the driver can include a servo motor 40, a vertical moving rod 41 connected to the servo motor 40, and a horizontal moving rod 42.

[0134] In an embodiment, the rollers 30 and 30' can move in one or more axes in the X-axis direction and the Z-axis direction according to movement of the driver. In this case, a Z-axis movement displacement of the rollers 30 and 30' can be determined according to a relative position between the stacked sheets 210 and the rollers 30 and 30', and an X-axis movement speed can be determined according to a required process time.

[0135] In an embodiment, the vertical moving rod 41 and the horizontal moving rod 42 can be formed as pneumatic cylinders, but are not limited thereto, and the servo motor 40 can be connected to a fixed support 50 of the driver.

[0136] (Experimental example 1) Table 1 below shows: when the operation of forming a side edge portion according to a conventional technique (Comparative Example) and the operation of forming a side edge portion according to an embodiment of the present disclosure (Inventive Examples 1, 2, and 3) are performed in an initial stacked sheet state in which the average of the thickness is 455 μm and the average of the width is 450 μm, the average (avg), the standard deviation (std), and the coefficient of variation (Cv) of each of the thickness (T) and the width (W) of the sintered body.

[0137] Figure 13 is a histogram showing the thickness of the multilayer electronic component (sheet) after sintering according to the Comparative Example and the Inventive Examples, and in the Inventive Examples, the average of the values measured in Inventive Examples 1 to 3 is shown. Based on Figure 13 It can be confirmed that the thickness of the multilayer electronic component (sheet) after sintering in the Comparative Example is greater than the thickness of the multilayer electronic component (sheet) after sintering in the Inventive Examples.

[0138] The average of the thickness and the average of the width of the stacked sheet and the body were measured by measuring the average of the maximum thickness and the average of the maximum width in the stacked sheet and the body, respectively.

[0139] About 100,000 samples were produced for the Comparative Example and Inventive Examples 1 to 3, respectively, and the experimental conditions of the Comparative Example and Inventive Examples 1 to 3 were the same, except that in the Comparative Example, pressing and punching were performed using a press plate and a metal plate, and in Inventive Examples 1 to 3, pressing and punching were performed using a metal plate and rollers.

[0140] [Table 1]

[0141] Referring to Table 1, it can be confirmed that the inventive examples 1, 2, and 3 have smaller T_avg values and larger W_avg values than the comparative example. Since the pressure is applied in the width direction of the stacked sheet during the operation of forming the side edge portion in the inventive examples 1, 2, and 3, it can be confirmed that the inventive examples 1, 2, and 3 having smaller T_avg values and larger W_avg values than the comparative example have smaller dimensional changes than the comparative example.

[0142] Since the inventive examples 1, 2, and 3 have T_std, T_Cv, W_std, and W_Cv values lower than those of the comparative example, it can be confirmed that the inventive examples 1, 2, and 3 have smaller sheet dimensional spreads after sintering than the comparative example.

[0143] Therefore, in the method for manufacturing a multilayer electronic component according to the embodiment of the disclosure, the operation of forming the side edge portion can be performed by disposing the side edge sheet 13 on the side edge attachment surfaces ES5 and ES6 and applying pressure to the side edge sheet 13 with the rollers 30 and 30', thereby providing a multilayer electronic component having a reduced dimensional spread compared to the conventional case.

[0144] (Experimental Example 2) Figure 14A and Figure 14B are graphs showing the results of performing a composite reliability evaluation of a multilayer electronic component according to a comparative example and inventive examples, respectively.

[0145] The operation of forming the side edge portion according to the conventional case (comparative example) and the operation of forming the side edge portion according to the embodiment of the disclosure (inventive examples 1, 2, and 3) were performed, and then, after sintering, samples were manufactured by forming an external electrode. The experimental conditions of the comparative example and the inventive examples 1 to 3 were the same, except that in the comparative example, pressing and punching were performed using a press plate and a metal plate, and in the inventive examples 1 to 3, pressing and punching were performed using a metal plate and a roller.

[0146] In the comparative example and the inventive examples, 400 samples were analyzed, and insulation resistance (IR) was measured under evaluation conditions of 85% relative humidity, 85℃, 4.8 vr, and 4 hours. When the insulation resistance value decreases to 10^4 (Ω) or less, the sample can be considered to be a reliability failure.

[0147] Referring to Figure 14A , it can be confirmed that a failure occurs in the multilayer electronic component according to the comparative example, and referring to Figure 14B , it can be confirmed that the moisture resistance reliability is excellent since no failure occurs.

[0148] Accordingly, it can be confirmed that in the method for manufacturing a multi-layer electronic package according to the embodiment of the disclosure, the operation of forming the side edge portion can be performed by disposing the side edge sheet 13 on the side edge attachment surfaces ES5 and ES6 and applying pressure to the side edge sheet 13 with the rollers 30 and 30', thereby improving the moisture resistance reliability compared to the conventional case.

[0149] One of the various effects of the disclosure is to dispose a side edge sheet on a side edge attachment surface of a stacked sheet and apply pressure to the side edge sheet with a pair of rollers to form a side edge portion to improve the moisture resistance reliability of a multi-layer electronic package.

[0150] Another effect of the disclosure is to dispose a side edge sheet on a side edge attachment surface of a stacked sheet and apply pressure to the side edge sheet with a pair of rollers to form a side edge portion to reduce the size spread of a multi-layer electronic package.

[0151] The various advantages and effects of the disclosure are not limited to the above and will be more readily understood in the course of explaining the specific embodiments of the disclosure.

[0152] While example embodiments have been shown and described above, it will be easy for those skilled in the art to make modifications and changes without departing from the scope of the disclosure defined by the appended claims.

Claims

1. A method for manufacturing a multilayer electronic component, comprising: forming a stacked sheet including a side edge attachment surface by alternately arranging a dielectric ceramic sheet, a first internal electrode pattern, and a second internal electrode pattern, the first internal electrode pattern and the second internal electrode pattern being exposed to the side edge attachment surface; forming a side edge portion on the side edge attachment surface; forming a main body by sintering the stacked sheet on which the side edge portion is formed; and forming an external electrode on the main body, wherein the step of forming the side edge portion is performed by arranging a side edge sheet on the side edge attachment surface and applying pressure to the side edge sheet with a roller.

2. The method of claim 1, wherein, The step of forming the side edge portion includes a pressing operation of pressing the side edge sheet with a pressing roller to attach the side edge sheet to the side edge attachment surface, and a punching operation of punching the side edge sheet with a punching roller.

3. The method of claim 2, wherein, The pressing operation is performed by arranging an elastic sheet and a metal sheet on the side edge sheet.

4. The method of claim 3, wherein, The pressing operation is performed by heating the metal sheet.

5. The method of claim 4, wherein, The pressing operation is performed by heating the metal sheet to a temperature of 50°C to 150°C.

6. The method of claim 2, wherein, The punching operation is performed by arranging an elastic sheet and a metal sheet on the side edge sheet.

7. The method of claim 6, wherein, The punching operation is performed without heating the metal sheet.

8. The method of claim 2, wherein, The pressing roller includes a high rigidity portion and a low rigidity portion, the low rigidity portion having a rigidity lower than a rigidity of the high rigidity portion, and the low rigidity portion is arranged on the high rigidity portion.

9. The method of claim 2, wherein, The punching roller includes a high rigidity portion.

10. The method of claim 1, wherein, The stacked sheet is one of a stacked sheet array, and The step of forming the side edge portion is performed simultaneously for each row of stacked sheets in the stacked sheet array.

11. The method of claim 1, wherein, The stacked sheet is one of a stacked sheet array attached to a carrier film, and The step of forming the side edge portion is performed by applying pressure to a surface of the carrier film on which the stacked sheet array is not attached by the roller.

12. The method of claim 1, wherein, The step of forming the side edge portion is performed by the roller connected to a driver and moving toward the side edge sheet.

13. The method of claim 12, wherein, The driver includes a servo motor, a vertical moving bar connected to the servo motor, and a horizontal moving bar.

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