Electronic device

Abstract

The invention provides an electronic device. The electronic equipment comprises a light and shadow sensitive module, a conductor structural member, a first flexible circuit board and a metal elastic sheet. The light and shadow sensitive module and the conductor structural member are arranged at an interval, and the first flexible circuit board and the metal elastic sheet are arranged between the light and shadow sensitive module and the conductor structural member. The first flexible circuit board comprises a first metal layer, a first dielectric layer and a second metal layer which are arranged in sequence, the first metal layer is electrically connected with the second metal layer, the first flexible circuit board is located on the side, facing the electric connecting piece, of the light and shadow sensitive module, and the first metal layer abuts against the light and shadow sensitive module and is electrically connected with the light and shadow sensitive module. The two ends of the metal elastic sheet are a first end and a second end respectively, the first end abuts against and is electrically connected with the second metal layer, and the second end is fixed and electrically connected to the conductor structural member. The signal transmission effect between the light and shadow sensitive module and the conductor structural member is improved, the size of the electronic equipment is reduced, the probability that the light and shadow sensitive module has a film printing problem is reduced, and the yield of the electronic equipment is improved.

Description

Technical Field

[0001] This application relates to the field of electronic equipment technology, and more particularly to electronic equipment. Background Technology

[0002] As mobile phones and other electronic devices become increasingly feature-rich, the frequency bands covered by their antennas continue to expand. Consequently, the need for electrical connection solutions within these devices to enable radio frequency signal transmission and reception, as well as grounding capabilities, is also growing.

[0003] As electronic devices become increasingly integrated, there is a need for electrical connections behind light-sensitive modules such as displays, for example, to transmit high-frequency signals or ground signals. Light-sensitive modules are highly sensitive to pressure; high pressure can easily cause film marks. However, for reliable signal transmission, a stable connection is required between the electrical connector and the light-sensitive module, generally necessitating a certain degree of elasticity in the connector. Current technology utilizes foam as the electrical connector. However, for a reliable connection between the foam and the light-sensitive component, the foam needs a certain thickness and area, occupying a significant amount of space, which is difficult to meet the miniaturization requirements of electronic devices. Summary of the Invention

[0004] This application provides an electronic device that improves the signal transmission effect between the light-sensitive module and the conductor structure, reduces the size of the electronic device, lowers the probability of film printing problems in the light-sensitive module, and improves the yield of the electronic device.

[0005] In a first aspect, this application provides an electronic device comprising a light-sensitive module, a conductive structure, a first flexible circuit board, and a metal spring. The light-sensitive module and the conductive structure are spaced apart and require electrical connection. The first flexible circuit board and the metal spring are disposed between the light-sensitive module and the conductive structure. The first flexible circuit board includes a first metal layer, a first dielectric layer, and a second metal layer arranged sequentially, and the first and second metal layers are electrically connected. The first flexible circuit board is located on the side of the light-sensitive module facing the electrical connector, and the first metal layer abuts against and is electrically connected to the light-sensitive module. The metal spring has a first end and a second end, respectively. The first end abuts against and is electrically connected to the second metal layer, and the second end is fixed and electrically connected to the conductive structure.

[0006] In this application's technical solution, the metal spring sheet, positioned between the light-sensitive module and the conductor structure, possesses elasticity along a first direction. Specifically, this first direction refers to the arrangement direction of the light-sensitive module and the conductor structure in the area where the metal spring sheet is installed. Specifically, the elasticity of the metal spring sheet is linearly related to its compression, with the elasticity F satisfying: F = kx, where k is the stiffness coefficient of the metal spring sheet, and x is the compression of the metal spring sheet. Therefore, changes in the compression of the metal spring sheet can be efficiently converted into elasticity, allowing the metal spring sheet to generate sufficient elasticity even in limited space. Furthermore, the thinness of the first flexible circuit board and its smaller footprint contribute to a smaller installation space for the electrical connector formed by the first flexible circuit board and the metal spring sheet, facilitating the miniaturization of electronic devices or reducing their overall size. For example, this electronic device could be a small, lightweight, foldable mobile terminal. The interaction between the metal spring and the first flexible circuit board ensures stable electrical contact signals between the conductor structure and the light-sensitive module, resulting in low passive intermodulation (PIM) distortion, which improves signal transmission performance. This is particularly beneficial for antenna feeding or grounding in electronic devices, where low PIM characteristics are crucial. Therefore, this embodiment is particularly effective in antenna feeding or grounding scenarios. Furthermore, the larger area of ​​the first flexible circuit board allows for the transmission of the spring force from the metal spring contacts to the surface of the light-sensitive module with lower pressure, thus reducing the likelihood of film marks appearing on the module.

[0007] In one technical solution, a first flexible circuit board includes an electrical connection area and a fixing area. A first metal layer and a second metal layer are located in the region of the first dielectric layer within the electrical connection area to electrically connect a metal spring and a light-sensitive module. The distance between the surface of the fixing area of ​​the first flexible circuit board facing the light-sensitive module and the light-sensitive module is greater than the distance between the surface of the electrical connection area of ​​the first flexible circuit board facing the light-sensitive module and the light-sensitive module. Therefore, a gap exists between the fixing area of ​​the first flexible circuit board and the surface of the light-sensitive module. A fixing connection structure can be disposed within this gap, and the fixing area is fixed to the light-sensitive module, thereby fixing the first flexible circuit board to the light-sensitive module.

[0008] Specifically, an adhesive layer is also included between the aforementioned fixing area and the light-sensitive module. The fixing area is bonded and fixed to the light-sensitive module through the adhesive layer. Fixing the first flexible circuit board to the light-sensitive module via adhesive is a reliable method with minimal impact on the light-sensitive module.

[0009] The aforementioned fixing area can be an annular fixing area, with the electrical connection area located inside the annular fixing area. The annular fixing area can be fixed to the light-sensitive module from the periphery of the electrical connection area, thereby improving the fixing effect between the first flexible circuit board and the light-sensitive module, improving the adhesion effect between the first metal layer of the electrical connection area of ​​the first flexible circuit board and the light-sensitive module, and improving the electrical connection effect between the first flexible circuit board and the light-sensitive module.

[0010] In one technical solution, the first flexible circuit board further includes an insulating layer that covers the area of ​​the first dielectric layer in the fixing region. This improves the strength of the first flexible circuit board in the fixing region and enhances its fixation strength on the surface of the light-sensitive module.

[0011] In a further technical solution, the aforementioned first flexible circuit board also includes a transition region, which connects the fixed region and the electrical connection region. The first dielectric layer continuously covers the fixed region, the electrical connection region, and the transition region. The thickness of the transition region is less than the thickness of the fixed region, making the transition region of the first flexible circuit board more flexible. This allows it to absorb the height difference between the first flexible circuit board and the fixed region, enabling the electrical connection region of the first flexible circuit board to reliably adhere to the surface of the light-sensitive module, thereby improving the electrical connection effect between the first flexible circuit board and the light-sensitive module.

[0012] Specifically, in implementing the technical solution of this application, the gap δ between the light-sensitive module and the conductor structure can be made to satisfy: 0.2mm≤δ≤0.5mm, which is beneficial to improving the miniaturization of electronic devices.

[0013] This application requires a low elasticity from the metal spring; specifically, the pressure f between the metal spring and the first flexible circuit board satisfies: f ≥ 0.1 N. Lower pressure between the metal spring and the first flexible circuit board helps to further reduce the probability of film marks forming on the light-sensitive module.

[0014] The area S of the first metal layer mentioned above satisfies: 2mm 2 ≤S≤25mm 2 The pressure conducted from the first metal layer to the light-sensitive module is relatively low, reducing the likelihood of film imprinting and improving electrical transmission between the first metal layer and the light-sensitive module. Furthermore, the area where the first flexible circuit board is mounted in the electronic device does not need to be large, which helps to improve the miniaturization of the electronic device.

[0015] In one optional technical solution, the first metal layer is a polygonal metal layer, and the length L of any side of the polygonal metal layer satisfies: 1.5mm ≤ L ≤ 5mm. In another optional technical solution, the first metal layer is a circular metal layer, and the diameter D of the circular metal layer satisfies: 1.5mm ≤ D ≤ 5mm. The pressure transmitted from the second metal layer and the first metal layer to the light-sensitive module is relatively low, making it less prone to film imprinting problems. It also helps reduce the alignment accuracy between the metal spring and the second metal layer, lowering the assembly accuracy requirements of the electronic device. Furthermore, the area where the first flexible circuit board is located in the electronic device does not need to be large, which helps improve the miniaturization of the electronic device.

[0016] To achieve electrical connection between the first metal layer and the second metal layer, the first flexible circuit board further includes conductive vias that connect the first and second metal layers. The diameter of the conductive vias is less than or equal to 0.2 mm. A smaller diameter conductive vias reduces the likelihood of film printing issues in the photosensitive module.

[0017] The surface roughness of the first metal layer is less than or equal to 5 μm. Therefore, the surface of the first layer is relatively smooth, less prone to stress concentration, and thus the light-sensitive module is less likely to develop film marks.

[0018] Regarding the thickness of the first flexible circuit board, the thickness M of the region containing the first metal layer of the first flexible circuit board can satisfy: 0.075mm ≤ M ≤ 0.2mm. The first flexible circuit board can have good rigidity, which can effectively reduce the pressure generated by the metal spring, and the light-sensitive module is less prone to film imprinting. Moreover, the installation space required for the first flexible circuit board is small, which is conducive to improving the miniaturization and integration of electronic devices.

[0019] The aforementioned electronic device also includes a second flexible circuit board, which is fixed to the light-sensitive module. This second flexible circuit board can be understood as the main circuit board of the light-sensitive module. The second flexible circuit board includes a second dielectric layer, and the first and second dielectric layers are integrally formed. This simplifies the structure of both the first and second flexible circuit boards.

[0020] Optionally, the aforementioned light-sensitive module can be a display screen, camera module, or glass back cover of an electronic device. The aforementioned conductor structure can be the mid-frame or circuit board of an electronic device. All can adopt the technical solution of this application.

[0021] In one specific technical solution, the aforementioned light-sensitive module includes an antenna radiator for an electronic device, with a first metal layer abutting against and electrically connected to the antenna radiator. This allows for direct connection between the antenna radiator and the power supply or ground, which is beneficial for improving the antenna's performance.

[0022] In one specific technical solution, the aforementioned electronic device includes a mid-frame, a conductive structural component is the mid-frame, and the antenna radiator is a portion of the metal structure of the mid-frame. For example, a ground layer for the antenna can be set in the light-sensitive module; this solution is used to ground the mid-frame antenna.

[0023] Secondly, this application provides an electronic device comprising a light-sensitive module, a conductive structural component, a metal sheet, and a metal spring. The light-sensitive module and the conductive structural component are spaced apart and require electrical connection. The metal sheet and the metal spring are disposed between the light-sensitive module and the conductive structural component. The metal sheet is located on the side of the light-sensitive module facing the electrical connector, and it abuts against and is electrically connected to the light-sensitive module. The metal sheet includes a connection area, which includes a first surface and a second surface facing away from each other. The first surface abuts against and is electrically connected to the light-sensitive module. The two ends of the metal spring are a first end and a second end, respectively. The first end abuts against and is electrically connected to the second surface, and the second end is fixed and electrically connected to the conductive structural component.

[0024] In this application's technical solution, the metal spring, positioned between the light-sensitive module and the conductor structure, possesses elasticity along a first direction. Specifically, this first direction refers to the arrangement direction of the light-sensitive module and the conductor structure in the area where the metal spring is installed. Specifically, the elasticity of the metal spring is linearly related to its compression, with the elasticity F satisfying: F = kx, where k is the stiffness coefficient of the metal spring, and x is the compression of the metal spring. Therefore, changes in the compression of the metal spring can be efficiently converted into elasticity, allowing the metal spring to generate sufficient elasticity even in limited space. Furthermore, the thin metal sheet occupies less space, which is beneficial for miniaturizing the electrical connector formed by the metal sheet and the metal spring, thus facilitating the miniaturization of electronic devices or reducing their overall size. For example, the electronic device could be a small, lightweight, foldable mobile terminal. Through the cooperation of the metal springs, the electrical contact signal between the conductor structure and the light-sensitive module is stable, and the PIM characteristic is low, which improves signal transmission performance. Especially for antenna feeding or grounding in electronic devices, the requirements for low PIM characteristics are more stringent. Therefore, this embodiment performs well in antenna feeding or grounding scenarios. In addition, the large area of ​​the metal sheet is beneficial for transmitting the elastic force of the metal spring contacts to the surface of the light-sensitive module with less pressure, thus making the light-sensitive module less prone to film imprinting.

[0025] In one technical solution, the metal sheet further includes a grooved area. The distance between the surface of the grooved area of ​​the metal sheet facing the light-sensitive module and the light-sensitive module is greater than the distance between the surface of the connecting area of ​​the metal sheet facing the light-sensitive module and the light-sensitive module. Therefore, a gap exists between the grooved area of ​​the metal sheet and the surface of the light-sensitive module, within which a fixing connection structure can be installed. The grooved area is fixed to the light-sensitive module, thereby fixing the metal sheet to the light-sensitive module.

[0026] Specifically, an adhesive layer is also included between the aforementioned grooved area and the light-sensitive module. The grooved area is bonded and fixed to the light-sensitive module through the adhesive layer. Fixing the metal sheet to the light-sensitive module via adhesive is a reliable method with minimal impact on the light-sensitive module.

[0027] The aforementioned grooved area can be an annular grooved area, with the connecting area located inside the annular grooved area. The annular grooved area can be fixed to the light-sensitive module from the periphery of the connecting area to improve the fixing effect between the metal sheet and the light-sensitive module, improve the adhesion effect between the metal sheet and the light-sensitive module in the connecting area of ​​the metal sheet, and improve the electrical connection effect between the metal sheet and the light-sensitive module.

[0028] Specifically, in implementing the technical solution of this application, the gap δ1 between the light-sensitive module and the conductor structure can be made to satisfy: 0.2mm≤δ1≤0.5mm, which is beneficial to improving the miniaturization of electronic devices.

[0029] This application requires a low elasticity from the metal spring; specifically, the pressure f1 between the metal spring and the metal sheet satisfies: f1 ≥ 0.1 N. Lower pressure between the metal spring and the metal sheet helps to further reduce the probability of film marks forming on the light-sensitive module.

[0030] The area S1 of the aforementioned metal sheet satisfies: 2mm 2 ≤S1≤25mm 2 The lower pressure conducted from the metal sheet to the light-sensitive module reduces the likelihood of film residue and improves electrical transmission between the metal sheet and the light-sensitive module. Furthermore, the area where the metal sheet is located in the electronic device does not need to be large, which helps to improve the miniaturization of the electronic device.

[0031] In one optional technical solution, the connection area of ​​the aforementioned metal sheet is a polygonal metal layer, and the length 1L of any side of the polygonal metal layer satisfies: 1.5mm≤L1≤5mm. In another optional technical solution, the connection area of ​​the metal sheet is a circular metal layer, and the diameter D1 of the circular metal layer satisfies: 1.5mm≤D1≤5mm. The pressure transmitted from the metal sheet to the light-sensitive module is relatively low, making it less prone to film imprinting. It also helps reduce the alignment accuracy between the metal spring and the metal sheet, lowering the assembly accuracy requirements of the electronic device. Furthermore, the area where the metal sheet is located in the electronic device does not need to be large, which helps improve the miniaturization of the electronic device.

[0032] The surface roughness of the first surface of the aforementioned metal sheet is less than or equal to 5 μm. This results in a relatively smooth surface, reducing the likelihood of stress concentration and thus minimizing the risk of film marks on the light-sensitive module.

[0033] Regarding the thickness of the aforementioned metal sheet, the thickness M1 of the connecting area of ​​the metal sheet can satisfy: 0.075mm ≤ M1 ≤ 0.2mm. The metal sheet can have good rigidity, which can effectively reduce the pressure generated by the metal spring, and the light-sensitive module is less prone to film marks. Moreover, the installation space required for mounting the metal sheet is small, which is conducive to improving the miniaturization and integration of electronic devices.

[0034] Optionally, the aforementioned light-sensitive module can be a display screen, camera module, or glass back cover of an electronic device. The aforementioned conductor structure can be the mid-frame or circuit board of an electronic device. All can adopt the technical solution of this application.

[0035] In one specific technical solution, the aforementioned light-sensitive module includes an antenna radiator for an electronic device, with a metal sheet abutting against and electrically connected to the antenna radiator. This allows for direct connection between the antenna radiator and the power supply or ground, which is beneficial for improving the antenna's performance.

[0036] In one specific technical solution, the aforementioned electronic device includes a mid-frame, a conductive structural component is the mid-frame, and the antenna radiator is a portion of the metal structure of the mid-frame. For example, a ground layer for the antenna can be set in the light-sensitive module; this solution is used to ground the mid-frame antenna. Attached Figure Description

[0037] Figure 1 This is a schematic diagram of the electrical connection structure of a light-sensitive module in an electronic device in the prior art;

[0038] Figure 2 This is an exploded structural diagram of an electronic device provided in an embodiment of this application;

[0039] Figure 3 This is a partial structural diagram of an electronic device in an embodiment of this application;

[0040] Figure 4 This is a simplified schematic diagram of a partial structure of an electronic device in an embodiment of this application;

[0041] Figure 5 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application;

[0042] Figure 6 This is a top view of a first flexible circuit board in an embodiment of this application;

[0043] Figure 7 This is a top view of a first flexible circuit board in an embodiment of this application;

[0044] Figure 8 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application;

[0045] Figure 9 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application;

[0046] Figure 10 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application;

[0047] Figure 11 This is a top view of a first flexible circuit board in an embodiment of this application;

[0048] Figure 12 This is a schematic diagram of the structure of the light-sensitive module facing the electrical connector in the embodiment of this application;

[0049] Figure 13 This is a partial cross-sectional view of an electronic device in an embodiment of the application;

[0050] Figure 14 This is a simplified schematic diagram of a partial structure of an electronic device in an embodiment of this application;

[0051] Figure 15 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application.

[0052] Figure label:

[0053] 1-Light and shadow sensitive module; 2-Conductor structural component;

[0054] 3-Foam; 4-Metallic attachment sheet;

[0055] 5-First flexible circuit board; 51-First metal layer;

[0056] 52 - First dielectric layer; 53 - Second metal layer;

[0057] 54 - Conductive hole; 55 - Third metal layer;

[0058] 56 - Fourth metal layer; 57 - Electrical connection region;

[0059] 58 - Fixed area; 581 - Insulation layer;

[0060] 59 - Transition zone; 6 - Metal fragment;

[0061] 61 - First end; 62 - Second end;

[0062] 7-Connection structure; 8-Second flexible circuit board;

[0063] 81 - Metal layer; 9 - Metal sheet;

[0064] 91 - First surface; 92 - Second surface;

[0065] 93 - Connection area; 94 - Trenching area;

[0066] X - First direction. Detailed Implementation

[0067] To make the objectives, technical solutions, and advantages of this application clearer, the application will now be described in further detail with reference to the accompanying drawings.

[0068] It should be noted that in this specification, similar reference numerals and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0069] In the description of this application, it should be noted that the terms "center," "upper," "lower," "left," "right," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0070] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0071] To facilitate understanding of the electronic device provided in this application embodiment, its application scenario is first described below. The electronic device provided in this application embodiment can be a mobile phone, tablet computer, laptop computer, or wearable device, etc. With the continuous advancement of the enrichment of electronic device functions and miniaturization design, there is also a need for electrical connection behind the light-sensitive module such as the display screen of the electronic device, for example, to realize the transmission of high-frequency signals or to realize the transmission of ground signals. However, it is difficult to realize electrical connection on one side of the light-sensitive module by soldering, so coupling or connector abutment is usually used for electrical connection. Using coupling for electrical connection results in poor electrical signal transmission effect, which is difficult to meet the signal transmission requirements. Using connector abutment for electrical connection is prone to the problem of film imprinting on the light-sensitive module, and usually requires a large space to set the electrical connector, which is difficult to meet the miniaturization development.

[0072] Figure 1 This is a schematic diagram of the electrical connection structure 7 of the light-sensitive module of an electronic device in the prior art, as shown below. Figure 1 As shown, the existing electronic device includes a light-sensitive module 1, a conductor structure 2, foam 3, and a metal attachment 4. The conductor structure 2 can be the frame of the electronic device, and the light-sensitive module 1 can be the display screen. The frame of the electronic device is usually made of aluminum, which is prone to oxide layer formation, leading to reduced electrical connection reliability. Therefore, a metal attachment 4 is welded onto the aluminum frame. This metal attachment 4 is made of a relatively stable metal material. The metal attachment 4 is welded to the electrical structure of the aluminum frame, improving the reliability of the electrical connection. The foam 3 is pressed between the metal attachment 4 and the light-sensitive module 1, improving the connection reliability between the light-sensitive component and the conductor structure 2. To improve the electrical connection reliability between the foam 3 and the light-sensitive module 1, the foam 3 needs to have a certain amount of compression. To improve the electrical connection effect of the foam 3, the thickness of the foam 3 needs to be greater than 0.5 mm. Furthermore, the area of ​​foam 3 needs to be relatively large to reduce the pressure between foam 3 and light-sensitive module 1, thereby reducing the probability of film marks on light-sensitive module 1. This solution requires a large amount of space for foam 3, which is difficult to meet the current miniaturization needs of electronic devices.

[0073] Based on this, embodiments of this application provide an electronic device. Figure 2 This is an exploded structural diagram of an electronic device provided in an embodiment of this application. (Reference) Figure 2As shown, the electronic device may include multiple conductive structural components 2 and a light-sensitive module 1 to support its various functions. Specifically, the conductive structural component 2 in this application may be a mid-frame, a shield, metal hardware, or a circuit board, which may be connected to modules such as displays, cameras, etc., and may be equipped with various chips and sensors. The light-sensitive module 1 in this application may be a display, a glass back cover, a camera module, or a shielding cover, etc. In some application scenarios, the aforementioned conductive structural component 2 needs to be electrically connected to the light-sensitive component.

[0074] exist Figure 2 In the illustrated embodiment, a mobile phone is used as the electronic device, the light-sensitive module 1 as the display screen, and the conductor structure 2 as the mid-frame. In other embodiments, the light-sensitive module 1 can be a shielding cover or a camera, and the conductor structure 2 can be a circuit board or metal hardware. Figure 2 In the illustrated embodiment, the middle frame and the display screen are spaced apart, and the middle frame may have an area opposite to the position of the display screen. In specific implementation, this area may be a part of the middle frame or the entire area of ​​the middle frame. The specific area can be determined according to the actual internal structure of the electronic device, and this application does not limit it.

[0075] The specific type of display screen can be selected from various options. For example, the display screen can be a liquid crystal display (LCD), an organic light-emitting diode (OLED) display screen, or a micro light-emitting diode (Micro LED) display screen.

[0076] Figure 3 This is a partial structural diagram of an electronic device in an embodiment of this application. Figure 4 This is a simplified schematic diagram of a partial structure of an electronic device in an embodiment of this application. For example... Figures 2 to 4 As shown, the electronic device provided in this application includes, in addition to the light-sensitive module 1 and the conductor structure 2, a first flexible circuit board 5 and a metal spring 6, for electrically connecting the light-sensitive module 1 and the conductor structure 2. Specifically, the light-sensitive module 1 and the conductor structure 2 are spaced apart, with a gap between them. The first flexible circuit board 5 and the metal spring 6 are disposed within this gap. Specifically, one surface of the first flexible circuit board 5 is in contact with and electrically connected to the light-sensitive module 1, and the metal spring 6 is connected between the other surface of the first flexible circuit board 5 and the conductor structure 2, thereby electrically connecting the conductor structure 2, the metal spring 6, the flexible circuit board, and the light-sensitive module 1 in sequence.

[0077] Figure 5 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application, such as... Figure 5 As shown, in one embodiment, the first flexible circuit board 5 includes a first metal layer 51, a first dielectric layer 52, and a second metal layer 53 arranged sequentially. In a specific embodiment, the first dielectric layer 52 is an insulating substrate with a certain degree of flexibility, used to fix and support the first metal layer 51 and the second metal layer 53. The first metal layer 51 and the second metal layer 53 are electrically connected. The first flexible circuit board 5 is located on the side of the light-sensitive module 1 facing the electrical connector, and the first metal layer 51 abuts against and is electrically connected to the light-sensitive module 1; therefore, the second metal layer 53 is also electrically connected to the light-sensitive module 1. The metal spring 6 is electrically connected between the second metal layer 53 and the conductor structure 2, thereby realizing the direct sequential electrical connection of the light-sensitive module 1, the first metal layer 51, the second metal layer 53, the metal spring 6, and the conductor structure 2.

[0078] Please continue to refer to this. Figure 5 In this embodiment, the two ends of the metal spring 6 are a first end 61 and a second end 62, respectively. The first end 61 abuts against and is electrically connected to the second metal layer 53, and the second end 62 is fixed and electrically connected to the conductor structure 2. Specifically, the second end 62 of the metal spring 6 is welded or riveted to the electrical connector, thus being both fixedly connected to the conductor structure 2 and electrically connected to the electrical connector. The metal spring 6 can be formed by bending a metal plate into a certain shape, so that the metal spring 6 has an elastic force along the first direction X when it is between the light-sensitive module 1 and the conductor structure 2. Specifically, the first direction X is the arrangement direction of the light-sensitive module 1 and the conductor structure 2 in the area where the metal spring 6 is installed. Specifically, the elastic force and the compression amount of the metal spring 6 are linearly related. It can be understood that the elastic force F of the metal spring 6 satisfies: F = kx, where k is the stiffness coefficient of the metal spring 6 and x is the compression amount of the metal spring 6. The change in compression can be efficiently converted into the elastic force of the metal spring 6, allowing the metal spring 6 to generate the required elastic force even in a small space. Furthermore, the thinness of the first flexible circuit board 5 and its smaller footprint reduce the installation space required for the electrical connector formed by the first flexible circuit board 5 and the metal spring 6, thus facilitating the miniaturization of electronic devices or reducing their overall size. For example, this electronic device could be a small, lightweight, foldable mobile terminal.

[0079] Furthermore, the metal spring 6 and the first flexible circuit board 5 have good electrical conductivity, which is beneficial to improving the transmission effect of electrical signals. Through the cooperation of the metal spring 6 and the first flexible circuit board 5, the electrical contact signal between the conductor structure 2 and the light-sensitive module 1 is stable, and the passive intermodulation distortion characteristics are low, which is beneficial to improving the signal transmission effect. Especially for antenna feeding or antenna grounding in electronic devices, the requirements for low PIM characteristics are more stringent. Therefore, this embodiment is particularly beneficial in antenna feeding or antenna grounding scenarios.

[0080] The first flexible circuit board 5 in this application has a large area, which is beneficial for transmitting the elastic force of the metal spring 6 contacts to the surface of the light-sensitive module 1 with a small pressure, so that the light-sensitive module 1 is less likely to have film marks.

[0081] In one possible embodiment, the pressure between the first flexible circuit board 5 and the surface of the light-sensitive module 1 is less than or equal to 25 kPa, making it less likely for film marks to appear on the light-sensitive module 1. Optionally, the pressure between the first flexible circuit board 5 and the surface of the light-sensitive module 1 can be 10 kPa, 12 kPa, 15 kPa, 18 kPa, 20 kPa, or 22 kPa, etc.

[0082] In this embodiment, the surface roughness of the first metal layer 51 of the first flexible circuit board 5 is less than or equal to 5 μm. In this embodiment, the surface roughness Ra of the first metal layer 51 satisfies: Ra≤5 μm. The surface of the first metal layer 51 is relatively smooth and stress concentration is less likely to occur. Therefore, the light-sensitive module 1 is less prone to film printing problems.

[0083] To achieve electrical connection between the first metal layer 51 and the second metal layer 53 of the first flexible circuit board 5, the first flexible circuit board 5 further includes a conductive hole 54, which connects the first metal layer 51 and the second metal layer 53. In a specific embodiment, the conductive hole 54 penetrates the first dielectric layer 52 and is electrically connected to the first metal layer 51 and the second metal layer 53 on both sides of the first dielectric layer 52. The diameter of the conductive hole 54 is less than or equal to 0.2 mm. Because the conductive hole 54 contains a metal layer 81 or a metal pillar, the conductive hole 54 has a high hardness and strong force transmission capability in the direction perpendicular to the first metal layer 51. If the diameter of the conductive hole 54 is large, it may cause film marks to appear on the light-sensitive module 1. The conductive hole 54 in this application has a small diameter, so the light-sensitive module 1 is less prone to film marks.

[0084] To improve the surface smoothness of the first metal layer 51 and reduce the occurrence of film marks on the light-sensitive module 1, the first metal layer 51 covers the end face of the conductive hole 54 facing the light-sensitive module 1. This makes it less likely to damage the first metal layer 51 during the fabrication of the conductive hole 54, resulting in a smoother surface for the first metal layer 51.

[0085] Please continue to refer to this. Figure 5 Furthermore, the thickness M of the region where the first metal layer 51 of the first flexible circuit board 5 is located satisfies: 0.075mm ≤ M ≤ 0.2mm. It is understood that in this embodiment, the first flexible circuit board 5 includes an electrical connection region 57, with the first metal layer 51 and the second metal layer 53 located in the region of the first dielectric layer 52 within the electrical connection region 57; alternatively, the region where the first metal layer 51 and the second metal layer 53 are located can also be considered as the electrical connection region 57 of the first flexible circuit board 5. This electrical connection region 57 is used to electrically connect the light-sensitive module 1 and the metal spring 6. In one embodiment, the thickness M of the electrical connection region 57 satisfies: 0.075mm ≤ M ≤ 0.2mm. Specifically, the first flexible circuit board 5 needs to convert the elasticity of the metal spring 6 into a smaller pressure to conduct to the light-sensitive module 1; therefore, the first flexible circuit board 5 needs to have a certain degree of rigidity. Therefore, the first flexible circuit board 5 has a certain thickness, and the thickness of the electrical connection area 57 of the first flexible circuit board 5 is at least 0.075 mm. This allows the first flexible circuit board 5 to have good rigidity, effectively reducing the pressure generated by the metal spring 6, and making it less likely for film marks to appear on the light-sensitive module 1. In addition, since the thickness of the electrical connection area 57 of the first flexible circuit board 5 does not exceed 0.2 mm, the installation space required for mounting the first flexible circuit board 5 is smaller. In particular, the gap between the light-sensitive module 1 and the conductor structure 2 can be set smaller, which is beneficial to improving the miniaturization and integration of electronic devices.

[0086] In an optional embodiment, the thickness M of the electrical connection area 57 of the first flexible circuit board 5 can be 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.165mm, 0.18mm or 0.19mm.

[0087] Please continue to refer to this. Figure 5In this embodiment, the gap δ between the light-sensitive module 1 and the conductor structure 2 of the electronic device satisfies: 0.2mm ≤ δ ≤ 0.5mm. In this application, the required installation space for the first flexible circuit board 5 and the metal spring 6 is relatively small, and a gap δ of 0.2mm to 0.5mm between the light-sensitive module 1 and the conductor structure 2 of the electronic device is sufficient to meet the installation requirements. In this embodiment, the gap between the light-sensitive module 1 and the conductor structure 2 of the electronic device can be set to be small, which is beneficial to improving the miniaturization of the electronic device. In optional embodiments, the gap δ between the light-sensitive module 1 and the conductor structure 2 of the electronic device can specifically be 0.25mm, 0.3mm, 0.32mm, 0.35mm, 0.4mm, 0.43mm, 0.45mm, or 0.48mm. A suitable gap can be selected based on the actual size requirements of the electronic device or the installation space of the first flexible circuit board 5 and the metal spring 6.

[0088] In this application, the pressure between the metal spring 6 and the first flexible circuit board 5 does not need to be excessive to meet the requirements of electrical connection, ensure stable signal transmission, and achieve a low PIM characteristic. Table 1 shows the PIM values ​​(in dBm) generated by applying pressure between the metal spring 6 and the first flexible circuit board 5 at different positions on the first flexible circuit board 5. As shown in Table 1, as long as the pressure between the metal spring 6 and the first flexible circuit board 5 reaches 0.1N, stable electrical signal transmission can be achieved, and the PIM value of the transmitted signal is low. Therefore, the pressure f between the metal spring 6 and the first flexible circuit board 5 in this application satisfies: f≥0.1N. The lower pressure between the metal spring 6 and the first flexible circuit board 5 in this application is beneficial to further reduce the probability of film imprinting on the light-sensitive module 1.

[0089]

[0090] Table 1

[0091] Figure 6 This is a top view of the first flexible circuit board 5 in an embodiment of this application, as shown in the diagram. Figure 6 As shown, in a specific embodiment, the area S of the first metal layer 51 of the first flexible circuit board 5 satisfies: 2mm². 2 ≤S≤25mm 2 In one embodiment, the area of ​​the electrical connection region 57 of the first flexible circuit board 5 can be considered to be the area S of the first metal layer 51. The area of ​​the first metal layer 51 is at least 2 mm². 2When the metal spring 6 has a certain elasticity, the pressure conducted from the first metal layer 51 to the light-sensitive module 1 is low, making it less prone to film imprinting. This also improves the electrical transmission between the first metal layer 51 and the light-sensitive module 1. Furthermore, the area of ​​the first metal layer 51 does not exceed 25 mm². 2 Therefore, the area where the first flexible circuit board 5 is located in the electronic device does not need to be large, which is beneficial to improving the miniaturization of the electronic device. In an optional embodiment, the area of ​​the first metal layer 51 can be 3mm². 2 4mm 2 9mm 2 10mm 2 12mm 2 15mm 2 17mm 2 18mm 2 20mm 2 22mm 2 and 24mm 2 etc.

[0092] Similarly, the area S' of the second metal layer 53 described above satisfies: 2mm 2 ≤S'≤25mm 2 The area of ​​the second metal layer 53 is at least 2 mm. 2 When the metal spring 6 has a certain elasticity, the pressure transmitted from the second metal layer 53 and the first metal layer 51 to the light-sensitive module 1 is low, making it less prone to film imprinting. This also helps reduce the alignment accuracy between the metal spring 6 and the second metal layer 53, lowering the assembly precision requirements of the electronic device. Furthermore, the area of ​​the second metal layer 53 does not exceed 25 mm². 2 Therefore, the area where the first flexible circuit board 5 is located in the electronic device does not need to be large, which is beneficial to improving the miniaturization of the electronic device. In an optional embodiment, the area of ​​the first metal layer 51 can be 3mm². 2 4mm 2 9mm 2 10mm 2 12mm 2 15mm 2 17mm 2 18mm 2 20mm 2 22mm 2 and 24mm 2 etc.

[0093] In this embodiment, the shape of the first metal layer 51 can be selected in various ways. For example, the first metal layer 51 can be a polygonal metal layer 81, a circular metal layer 81, an elliptical metal layer 81, or an irregular metal layer 81. Among these, polygonal metal layers 81, circular metal layers 81, and elliptical metal layers 81 are beneficial for simplifying the fabrication process of the first flexible circuit board 5. In addition, in some embodiments, the first metal layer 51 needs to avoid other structures, so that the first metal layer 51 is formed as an irregular metal layer 81.

[0094] Please continue to refer to this. Figure 6 In a possible embodiment, the first metal layer 51 is a polygonal metal layer 81, and the length L of any side of the polygonal metal layer 81 satisfies: 1.5mm≤L≤5mm. Figure 7 This is a top view of the first flexible circuit board 5 in an embodiment of this application, as shown in the diagram. Figure 7 As shown, or in one embodiment, the first metal layer 51 is a circular metal layer 81, and the diameter D of the circular metal layer 81 satisfies: 1.5mm ≤ D ≤ 5mm. In this embodiment, the first metal layer 51 is less prone to stress concentration on the surface of the light-sensitive module 1, thus the light-sensitive module 1 is less prone to film marks. In addition, the area of ​​the first metal layer 51 is not too large, and the area where the first metal layer 51 is installed does not need to be too large, which helps to reduce the installation space for the first flexible circuit board 5 and the metal spring 6, and improves the miniaturization and integration of the electronic device.

[0095] In a specific embodiment, the area of ​​the first metal layer 51 is the same as the area of ​​the second metal layer 53, and the orthographic projection of the first metal layer 51 onto the plane containing the second metal layer 53 coincides with the second metal layer 53. This design simplifies the structure and fabrication of the first flexible circuit board 5.

[0096] In this embodiment, the materials of the first metal layer 51 and the second metal layer 53 can be selected in various ways. For example, the first metal layer 51 can be a copper layer or a gold layer, and the second metal layer 53 can also be a copper layer or a gold layer. Copper and gold have good electrical conductivity, and copper and gold are not prone to forming oxide layers. The electrical connection effect of directly connecting them by abutting is also good.

[0097] Figure 8 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application, such as... Figure 8As shown, in one embodiment, the first flexible circuit board 5 further includes a third metal layer 55 and a fourth metal layer 56. The third metal layer 55 is located between the first dielectric layer 52 and the first metal layer 51, and the fourth metal layer 56 is located between the first metal layer 51 and the second metal layer 53. The conductive hole 54 can also penetrate the third metal layer 55 and the fourth metal layer 56. This solution is beneficial for increasing the thickness of the flexible circuit board, thereby effectively reducing the pressure between the first metal layer 51 and the light-sensitive module 1. It also facilitates the fabrication of the conductive hole 54, allowing the first metal layer 51 to cover the end face of the conductive hole 54.

[0098] Figure 9 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application, such as... Figure 9 As shown, in one embodiment, the first flexible circuit board 5 includes not only an electrical connection area 57 but also a fixing area 58, with the electrical connection area 57 fixed to the fixing area 58. The first metal layer 51 and the second metal layer 53 are located in the region of the first dielectric layer 52 within the electrical connection area 57. The region of the first flexible circuit board 5 with the first metal layer 51 and the second metal layer 53 is the electrical connection area 57. The distance between the surface of the fixing area 58 of the first flexible circuit board 5 facing the light-sensitive module 1 and the light-sensitive module 1 is greater than the distance between the surface of the electrical connection area 57 of the first flexible circuit board 5 facing the light-sensitive module 1 and the light-sensitive module 1. This creates a gap between the fixing area 58 of the first flexible circuit board 5 and the surface of the light-sensitive module 1, within which a fixing connection structure 7 can be disposed. The fixing area 58 is fixed to the light-sensitive module 1, thereby fixing the first flexible circuit board 5 to the light-sensitive module 1.

[0099] In a specific embodiment, the electrical connection area 57 of the first flexible circuit board 5 is in contact with the light-sensitive module 1, and the distance between the surface of the electrical connection area 57 of the first flexible circuit board 5 facing the light-sensitive module 1 and the light-sensitive module 1 is zero. A gap exists between the fixing area 58 of the first flexible circuit board 5 and the surface of the light-sensitive module 1, and a fixing connection structure 7 is disposed within this gap. Therefore, the side of the first flexible circuit board 5 facing the light-sensitive module 1 is relatively flat.

[0100] Please continue to refer to this. Figure 9 In one embodiment, the connection structure 7 between the fixing area 58 of the first flexible circuit board 5 and the light-sensitive module 1 is an adhesive layer, and the fixing area 58 is bonded and fixed to the light-sensitive module 1 through the adhesive layer. Fixing the first flexible circuit board 5 to the light-sensitive module 1 by adhesive bonding is a reliable method with minimal impact on the light-sensitive module 1.

[0101] The aforementioned first flexible circuit board 5 further includes an insulating layer 581, which covers the area of ​​the first dielectric layer 52 in the fixing region 58. This enhances the strength of the first flexible circuit board 5 in the fixing region 58 and improves the fixation strength of the first flexible circuit board 5 on the surface of the light-sensitive module.

[0102] In a specific embodiment, insulating layers 581 are fixed on both sides of the first dielectric layer 52, which helps to improve the symmetry of the first flexible circuit board 5.

[0103] In one embodiment, the fixing area 58 of the first flexible circuit board 5 does not include a metal layer 81, or the fixing area 58 includes a metal layer 81, but the metal layer 81 of the fixing area 58 is disconnected from the first metal layer 51, and the metal layer 81 of the fixing area 58 is also disconnected from the second metal layer 53.

[0104] Figure 10 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application, such as... Figure 10 As shown in this embodiment, the first flexible circuit board 5 further includes a transition region 59, which connects the fixed region 58 and the electrical connection region 57. The first dielectric layer 52 continuously covers the fixed region 58, the electrical connection region 57, and the transition region 59, and the thickness of the transition region 59 is less than the thickness of the fixed region 58. In this embodiment, the transition region 59 of the first flexible circuit board 5 has strong flexibility, which can absorb the height difference between the first flexible circuit board 5 and the fixed region 58, so that the electrical connection region 57 of the first flexible circuit board 5 can reliably adhere to the surface of the light-sensitive module 1, improving the electrical connection effect between the first flexible circuit board 5 and the light-sensitive module 1.

[0105] Figure 11 This is a top view schematic diagram of a first flexible circuit board in an embodiment of this application, as shown below. Figure 11 As shown, the fixing area 58 in this embodiment can be an annular fixing area 58, and the electrical connection area 57 is located inside the annular fixing area 58. The annular fixing area 58 surrounds the periphery of the electrical connection area 57, thus fixing the light-sensitive module 1 from all sides of the electrical connection area 57. This improves the fixing effect between the first flexible circuit board 5 and the light-sensitive module 1, enhances the adhesion effect between the first metal layer 51 of the electrical connection area 57 of the first flexible circuit board 5 and the light-sensitive module 1, and improves the electrical connection effect between the first flexible circuit board 5 and the light-sensitive module 1.

[0106] Or, such as Figure 3 or Figure 6 As shown, the first flexible circuit board 5 can also include two fixing areas 58, which are respectively located on both sides of the electrical connection area 57.

[0107] Figure 12This is a schematic diagram of the structure of the light-sensitive module facing the electrical connector in an embodiment of this application. Figure 13 This is a partial cross-sectional view of an electronic device in an embodiment of the application. For example... Figure 12 and Figure 13 As shown, in one embodiment, the electronic device further includes a second flexible circuit board 8, which is fixed to the surface of the light-sensitive module 1 facing the conductor structure 2. In one embodiment, the light-sensitive module 1 is a display screen, and the second flexible circuit board 8 can be a display screen circuit board. The second flexible circuit board 8 includes a second dielectric layer, and the first dielectric layer 52 and the second dielectric layer are integrally structured, which simplifies the structure of the first flexible circuit board 5 and the second flexible circuit board 8. On the one hand, this embodiment can be understood as the first flexible circuit board 5 and the second flexible circuit board 8 being reusable, thus eliminating the need for additional fabrication and installation of the first flexible circuit board 5. On the other hand, this embodiment can also be understood as using the second flexible circuit board 8 to fix the first flexible circuit board 5.

[0108] In a specific embodiment, the second flexible circuit board 8 further includes a metal layer 81, which is disconnected from the first metal layer 51 and also disconnected from the second metal layer 53. The first flexible circuit board 5 and the second flexible circuit board 8 can be connected solely through a dielectric layer to absorb the height difference between them, allowing the electrical connection area 57 of the first flexible circuit board 5 to reliably adhere to the surface of the light-sensitive module 1, thereby improving the electrical connection effect between the first flexible circuit board 5 and the light-sensitive module 1.

[0109] Figures 8-10 In the illustrated embodiment, the structures on both sides of the first flexible circuit board 5 are symmetrically arranged to simplify the structure of the first flexible circuit board 5. For example... Figure 13 As shown, in one embodiment, the structures on both sides of the first dielectric layer 52 of the first flexible circuit board 5 may be asymmetrical.

[0110] Figure 14 This is a simplified schematic diagram of a partial structure of an electronic device in an embodiment of this application. For example... Figure 2 and Figure 14As shown, the electronic device provided in this application, in addition to the light-sensitive module 1 and the conductor structure 2, also includes a metal sheet 9 and a metal spring 6 for electrically connecting the light-sensitive module 1 and the conductor structure 2. Specifically, the light-sensitive module 1 and the conductor structure 2 are spaced apart, with a gap between them, and the metal sheet 9 and the metal spring 6 are disposed within this gap. Specifically, one side surface of the metal sheet 9 is in contact with and electrically connected to the light-sensitive module 1, and the metal spring 6 is connected between the other side surface of the metal sheet 9 and the conductor structure 2, thereby electrically connecting the conductor structure 2, the metal spring 6, the flexible circuit board, and the light-sensitive module 1 in sequence.

[0111] like Figure 14 As shown, in one embodiment, the metal sheet 9 includes a connection area 93, and the metal sheet 9 in the connection area 93 includes a first surface 91 and a second surface 92 that are opposite to each other. The metal sheet 9 is located on the side of the light-sensitive module 1 facing the electrical connector, and the first surface 91 abuts against and is electrically connected to the light-sensitive module 1, so the second surface 92 is also electrically connected to the light-sensitive module 1. The metal spring 6 is electrically connected between the second surface 92 and the conductor structure 2, thereby realizing the direct electrical connection of the light-sensitive module 1, the metal sheet 9, the metal spring 6, and the conductor structure 2 in sequence.

[0112] Please continue to refer to this. Figure 14 In this embodiment, the two ends of the metal spring 6 are a first end 61 and a second end 62, respectively. The first end 61 abuts against and is electrically connected to the second surface 92, and the second end 62 is fixed and electrically connected to the conductor structure 2. Specifically, the second end 62 of the metal spring 6 is welded or riveted to the electrical connector, thus being both fixedly connected to the conductor structure 2 and electrically connected to the electrical connector. The metal spring 6 can be formed by bending a metal sheet 9 into a certain shape, so that the metal spring 6 has an elastic force along the first direction X when it is between the light-sensitive module 1 and the conductor structure 2. Specifically, the first direction X is the arrangement direction of the light-sensitive module 1 and the conductor structure 2 in the area where the metal spring 6 is installed. Specifically, the elastic force and the compression amount of the metal spring 6 are linearly related. It can be understood that the elastic force F of the metal spring 6 satisfies: F = kx, where k is the stiffness coefficient of the metal spring 6 and x is the compression amount of the metal spring 6. The change in compression can be efficiently converted into the elastic force of the metal spring 6, allowing the metal spring 6 to generate the required elastic force even in a small space. Furthermore, the thinness of the metal sheet 9 and its smaller footprint contribute to a smaller installation space for the electrical connector formed by the metal sheet 9 and the metal spring 6, facilitating the miniaturization of electronic devices or reducing their overall size. For example, this electronic device could be a small, lightweight, foldable mobile terminal.

[0113] Furthermore, the metal spring 6 and metal sheet 9 possess good electrical conductivity, which is beneficial for improving the transmission effect of electrical signals. Through the cooperation of the metal spring 6 and metal sheet 9, the electrical contact signal between the conductor structure 2 and the light-sensitive module 1 is stable, and the passive intermodulation distortion characteristics are low, which is beneficial for improving signal transmission performance. Especially for antenna feeding or antenna grounding in electronic devices, the requirements for low PIM characteristics are more stringent. Therefore, this embodiment is particularly beneficial in antenna feeding or antenna grounding scenarios.

[0114] The metal sheet 9 in this application has a large area, which is beneficial for transmitting the elastic force of the contact point of the metal spring 6 to the surface of the light and shadow sensitive module 1 with a small pressure, so that the light and shadow sensitive module 1 is less likely to have film marks.

[0115] In one possible embodiment, the pressure between the metal sheet 9 and the surface of the light-sensitive module 1 is less than or equal to 25 kPa, making it less likely for film marks to appear on the light-sensitive module 1. Optionally, the pressure between the metal sheet 9 and the surface of the light-sensitive module 1 can be 10 kPa, 12 kPa, 15 kPa, 18 kPa, 20 kPa, or 22 kPa, etc.

[0116] In this embodiment, the surface roughness of the first surface 91 of the metal sheet 9 is less than or equal to 5 μm. In this embodiment, the surface roughness Ra of the first surface 91 satisfies: Ra≤5 μm. The surface of the first surface 91 is relatively flat and stress concentration is less likely to occur. Therefore, the light-sensitive module 1 is less prone to film imprinting problems.

[0117] In one embodiment, the thickness M1 of the connection area 93 of the metal sheet 9 satisfies: 0.075mm ≤ M1 ≤ 0.2mm. Specifically, the metal sheet 9 needs to convert the elastic force of the metal spring 6 into a smaller pressure to be transmitted to the light-sensitive module 1. Therefore, the metal sheet 9 needs to have a certain rigidity. For this reason, the metal sheet 9 has a certain thickness, and the thickness of the connection area 93 of the metal sheet 9 is at least 0.075mm. Then the metal sheet 9 can have good rigidity, which can effectively reduce the pressure generated by the metal spring 6, and the light-sensitive module 1 is less likely to have film marks. In addition, since the thickness of the connection area 93 of the metal sheet 9 does not exceed 0.2mm, the installation space required to install the metal sheet 9 is smaller. In particular, the gap between the light-sensitive module 1 and the conductor structure 2 can be set to be smaller, which is beneficial to improving the miniaturization and integration of electronic devices.

[0118] In an optional embodiment, the thickness M1 of the connecting area 93 of the metal sheet 9 can be 0.08mm, 0.1mm, 0.12mm, 0.15mm, 0.165mm, 0.18mm or 0.19mm.

[0119] In this embodiment, the gap δ1 between the light-sensitive module 1 and the conductor structure 2 of the electronic device satisfies: 0.2mm ≤ δ1 ≤ 0.5mm. In this application, the required installation space for the metal sheet 9 and the metal spring 6 is relatively small; a gap δ1 of 0.2mm to 0.5mm between the light-sensitive module 1 and the conductor structure 2 is sufficient to meet the installation requirements. In this embodiment, the gap between the light-sensitive module 1 and the conductor structure 2 can be set relatively small, which is beneficial for improving the miniaturization of the electronic device. In optional embodiments, the gap δ1 between the light-sensitive module 1 and the conductor structure 2 can specifically be 0.25mm, 0.3mm, 0.32mm, 0.35mm, 0.4mm, 0.43mm, 0.45mm, or 0.48mm. A suitable gap can be selected based on the actual size requirements of the electronic device or the installation space for the metal sheet 9 and the metal spring 6.

[0120] In this application, the pressure between the metal spring 6 and the metal sheet 9 does not need to be excessive to meet the requirements of electrical connection, ensure stable signal transmission, and achieve low PIM characteristics. Stable electrical signal transmission and a low PIM value can be achieved as long as the pressure between the metal spring 6 and the metal sheet 9 reaches 0.1N. Therefore, the pressure f1 between the metal spring 6 and the metal sheet 9 in this application satisfies: f1≥0.1N. The lower pressure between the metal spring 6 and the metal sheet 9 in this application further reduces the probability of film imprinting on the light-sensitive module 1.

[0121] In a specific embodiment, the area S1 of the connection region 93 of the metal sheet 9 satisfies: 2mm. 2 ≤S1≤25mm 2 The area of ​​the connecting region 93 is at least 2 mm². 2 When the metal spring 6 has a certain elasticity, the pressure conducted from the connection area 93 to the light-sensitive module 1 is low, making it less prone to film imprinting. This also improves the electrical transmission effect between the connection area 93 and the light-sensitive module 1. Furthermore, the area of ​​the connection area 93 does not exceed 25mm². 2 Therefore, the area where the metal sheet 9 is located in the electronic device does not need to be large, which helps to improve the miniaturization of the electronic device. In an optional embodiment, the area of ​​the connection area 93 can be 3mm². 2 4mm 2 9mm 2 10mm 2 12mm 2 15mm 2 17mm 2 18mm 2 20mm 2 22mm2 and 24mm 2 etc.

[0122] In this embodiment, the shape of the connecting region 93 of the metal sheet 9 can be selected in various ways. For example, the connecting region 93 can be a polygonal metal sheet 9, a circular metal sheet 9, an elliptical metal sheet 9, or an irregular metal sheet 9. Among these, polygonal, circular, and elliptical metal sheets 9 are advantageous in simplifying the manufacturing process of the metal sheet 9. Furthermore, in some embodiments, the connecting region 93 needs to avoid other structures, so that the connecting region 93 is formed as an irregular metal sheet 9.

[0123] In possible embodiments, the connection area 93 is a polygonal metal sheet 9, where the length L1 of any side of the polygonal metal sheet 9 satisfies: 1.5mm ≤ L1 ≤ 5mm; or, the connection area 93 is a circular metal sheet 9, where the diameter D1 of the circular metal sheet 9 satisfies: 1.5mm ≤ D1 ≤ 5mm. In this embodiment, stress concentration is less likely to occur on the surface of the light-sensitive module 1 in the connection area 93, thus reducing the likelihood of film marks appearing on the light-sensitive module 1. Furthermore, the area of ​​the connection area 93 should not be too large, and the area where the connection area 93 is installed does not need to be too large, which helps to reduce the installation space for the metal sheet 9 and the metal spring 6, improving the miniaturization and integration of the electronic device.

[0124] Figure 15 This is a partial cross-sectional enlarged schematic diagram of an electronic device in an embodiment of this application, such as... Figure 15 As shown, in one embodiment, the metal sheet 9 includes a grooved area 94 in addition to the connecting area 93. The connecting area 93 and the grooved area 94 are fixed together. Specifically, the grooved area 94 can be formed by creating a groove on the surface of the metal sheet 9 facing the light-sensitive module 1. The distance between the surface of the grooved area 94 of the metal sheet 9 facing the light-sensitive module 1 and the light-sensitive module 1 is greater than the distance between the surface of the connecting area 93 of the metal sheet 9 facing the light-sensitive module 1 and the light-sensitive module 1. This creates a gap between the grooved area 94 of the metal sheet 9 and the surface of the light-sensitive module 1, within which a fixed connection structure 7 can be installed. The grooved area 94 is fixed to the light-sensitive module 1, thereby fixing the metal sheet 9 to the light-sensitive module 1.

[0125] In a specific embodiment, the connecting area 93 of the metal sheet 9 contacts the light-sensitive module 1, and the distance between the surface of the connecting area 93 of the metal sheet 9 facing the light-sensitive module 1 and the light-sensitive module 1 is zero. A gap exists between the grooved area 94 of the metal sheet 9 and the surface of the light-sensitive module 1, and a fixed connection structure 7 is disposed within this gap. Therefore, the side of the metal sheet 9 facing the light-sensitive module 1 is relatively flat.

[0126] Please continue to refer to this. Figure 15In one embodiment, the connection structure 7 between the grooved area 94 of the metal sheet 9 and the light-sensitive module 1 can be an adhesive layer, and the grooved area 94 is bonded and fixed to the light-sensitive module 1 through the adhesive layer. Fixing the metal sheet 9 to the light-sensitive module 1 by adhesive bonding is a reliable method and has minimal impact on the light-sensitive module 1.

[0127] In this embodiment, the grooved area 94 can be an annular grooved area 94, and the connecting area 93 is located inside the annular grooved area 94. The annular grooved area 94 surrounds the periphery of the connecting area 93, allowing it to be fixed to the light-sensitive module 1 from all sides of the connecting area 93. This improves the fixing effect between the metal sheet 9 and the light-sensitive module 1, enhances the adhesion effect between the first surface 91 of the connecting area 93 of the metal sheet 9 and the light-sensitive module 1, and improves the electrical connection effect between the metal sheet 9 and the light-sensitive module 1.

[0128] In this embodiment, the electronic device offers multiple options regardless of whether the metal spring 6 is connected to the light-sensitive module 1 via the first flexible circuit board 5 or via the metal sheet 9. The application scenarios are also diverse; for example, the light-sensitive module 1, the conductor structure 2, and the transmitted signals all have multiple options. To save space, the following description uses the connection between the metal spring 6 and the light-sensitive module 1 via the first flexible circuit board 5 as an example. The same application scenario applies to the case where the metal spring 6 and the light-sensitive module 1 are connected via the metal sheet 9.

[0129] In one embodiment, the metal spring 6 and the first flexible circuit board 5 (metal sheet 9) can be used for grounding the display screen and the mid-frame. Specifically, the light-sensitive module 1 is the display screen of the electronic device, and the conductor structure 2 is the mid-frame of the electronic device. Antenna slots are provided along the edges of the mid-frame, and part of the mid-frame structure serves as an antenna radiator. A metal layer 81 is provided on the side of the display screen facing the mid-frame, serving as the antenna ground. One or more metal springs 6 and the first flexible circuit board 5 (metal sheet 9) can be provided between the mid-frame and the display screen. The metal spring 6 can be positioned near the antenna slot at points of high current and high electric field to reduce the return path of the antenna current from the metal layer 81 of the display screen, thereby achieving grounding of the display screen.

[0130] In one embodiment, the metal spring 6 and the first flexible circuit board 5 (metal sheet 9) can be used for grounding or powering the antenna. Specifically, the light-sensitive module 1 can be a display screen of an electronic device, on which an antenna radiator is located. The first metal layer (metal sheet 9) of the first flexible circuit board 5 abuts against the antenna radiator. The conductor structure 2 is a circuit board of the electronic device, on which signal lines and ground lines are provided. The metal spring 6 is connected to the circuit board (e.g., connected to the ground or radio frequency signal endpoint of the circuit board).

[0131] It should be noted that the antenna radiator can also be placed on the glass back cover of the electronic device. In this case, the metal spring 6 and the first flexible circuit board 5 (metal sheet 9) can also be used to connect the glass back cover to the circuit board so that the antenna radiator on the glass back cover can be connected to the signal line or grounded.

[0132] In one embodiment, the metal spring 6 and the first flexible circuit board 5 (metal sheet 9) can be used for grounding the camera module and the mid-frame. In a specific implementation, the light-sensitive module 1 can be the camera of the electronic device, and the conductor structure 2 can be the mid-frame of the electronic device.

[0133] In one embodiment, the metal spring 6 and the first flexible circuit board 5 (metal sheet 9) can be used for grounding the shielding cover and the middle frame. In a specific implementation, the light-sensitive module 1 can be the shielding cover of the electronic device, and the conductor structure 2 can be the middle frame of the electronic device. The shielding cover can be set on the main board of the electronic device to cover the radio frequency devices set on the main board. It can be used to reduce the interference of static electricity or abnormal current and voltage on the radio frequency devices after grounding, and improve the functional reliability of the electronic device.

[0134] It should be understood that the light-sensitive module 1 and the conductor structure 2 are not limited to the scope disclosed above. In practical applications, they can be any two structures in an electronic device that need to be electrically connected using the metal spring 6. Further details will not be provided here.

[0135] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, comprising: The application relates to a light-sensitive module, which comprises a light-sensitive module, a conductor structure, a first flexible circuit board and a metal spring. The light-sensitive module is spaced apart from the conductor structure. The first flexible circuit board comprises a first metal layer, a first dielectric layer and a second metal layer arranged in sequence, and the first metal layer and the second metal layer are electrically connected; the first flexible circuit board is located on the side of the light-sensitive module facing the conductor structure, and the first metal layer is in contact with and electrically connected to the light-sensitive module. The two ends of the metal spring are a first end and a second end, the first end is in contact with and electrically connected to the second metal layer, and the second end is fixed and electrically connected to the conductor structure.

2. The electronic device of claim 1, wherein, The first flexible circuit board comprises an electrically connected area and a fixed area, the first metal layer and the second metal layer are located in the area of the first dielectric layer in the electrically connected area; the distance between the surface of the fixed area of the first flexible circuit board facing the light-sensitive module and the light-sensitive module is greater than the distance between the surface of the electrically connected area of the first flexible circuit board facing the light-sensitive module and the light-sensitive module; and the fixed area is fixed to the light-sensitive module.

3. The electronic device of claim 2, wherein, The fixed area and the light-sensitive module further comprise an adhesive layer, and the fixed area is fixed to the light-sensitive module through the adhesive layer.

4. The electronic device of claim 2 or 3, wherein, The fixed area is a ring-shaped fixed area, and the electrically connected area is located in the interior of the ring-shaped fixed area.

5. The electronic device according to any one of claims 2 to 4, wherein The first flexible circuit board further comprises an insulating layer, and the insulating layer covers the area of the first dielectric layer in the fixed area.

6. The electronic device according to any one of claims 2 to 5, wherein The first flexible circuit board further comprises a transition area, which is connected between the fixed area and the electrically connected area, the first dielectric layer continuously covers the fixed area, the electrically connected area and the transition area, and the thickness of the transition area is less than the thickness of the fixed area.

7. The electronic device according to any one of claims 1 to 6, wherein The gap delta between the light-sensitive module and the conductor structure satisfies 0.2mm <= delta <= 0.5mm.

8. The electronic device according to any one of claims 1 to 7, wherein The pressure f between the metal spring and the first flexible circuit board satisfies f >= 0.1N.

9. The electronic device of any one of claims 1 to 8, wherein, The area S of the first metal layer satisfies: 2mm 2 ≤ S ≤ 25mm 2 .

10. The electronic device according to any one of claims 1 to 9, wherein The first metal layer is a polygonal metal layer, the length L of any side of the polygonal metal layer satisfies 1.5mm <= L <= 5mm; or The first metal layer is a circular metal layer, the diameter D of the circular metal layer satisfies 1.5mm <= D <= 5mm.

11. The electronic device according to any one of claims 1 to 10, wherein The first flexible circuit board further comprises a conductive hole, which connects the first metal layer and the second metal layer, and the diameter of the conductive hole is less than or equal to 0.2mm.

12. The electronic device of any one of claims 1-11, wherein, The surface roughness of the first metal layer is less than or equal to 5um.

13. The electronic device of any one of claims 1-12, wherein, The thickness M of the area where the first metal layer is located satisfies 0.075mm <= M <= 0.2mm.

14. The electronic device of any one of claims 1-13, wherein, The application further comprises a second flexible circuit board, which is fixed to the light-sensitive module, and the second flexible circuit board comprises a second dielectric layer, and the first dielectric layer and the second dielectric layer are an integral structure.

15. The electronic device of any one of claims 1-14, wherein, The light-sensitive module is a display screen, a camera module or a glass back cover of the electronic device; or the conductor structure is a middle frame or a circuit board of the electronic device.

16. An electronic device, comprising: The light-sensitive module, the conductor structure, the metal sheet and the metal spring are included, wherein: The light-sensitive module is spaced apart from the conductor structure; The metal sheet is located on a side of the light-sensitive module facing the electrical connector, and the metal sheet includes a connecting area, the metal sheet includes a first surface and a second surface facing away from each other in the connecting area, and the first surface is in contact with and electrically connected to the light-sensitive module; The metal spring has a first end and a second end, the first end is in contact with and electrically connected to the second surface of the metal sheet, and the second end is fixed and electrically connected to the conductor structure.

17. The electronic device of claim 16, wherein, The metal sheet further includes a groove area, a surface of the groove area of the metal sheet facing the light-sensitive module is farther away from the light-sensitive module than a surface of the connecting area of the metal sheet facing the light-sensitive module; and the groove area is fixed to the light-sensitive module.

18. The electronic device of claim 16 or 17, wherein, The gap δ1 between the light-sensitive module and the conductor structure satisfies 0.2mm≤δ1≤0.5mm.

19. The electronic device of any of claims 16-18, wherein, The connecting area of the metal sheet is a polygonal metal sheet, and the length L1 of any side of the polygonal metal sheet satisfies 1.5mm≤L1≤5mm; or The connecting area of the metal sheet is a circular metal sheet, and the diameter D1 of the circular metal sheet satisfies 1.5mm≤D1≤5mm.

20. The electronic device of any of claims 16-19, wherein, The light-sensitive module is a display screen, a camera module or a glass back cover of the electronic device; or the conductor structure is a middle frame or a circuit board of the electronic device.

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