Display panel, preparation method of display panel and electronic equipment

Abstract

The embodiment of the invention provides a display panel, a preparation method of the display panel and electronic equipment, and relates to the technical field of display. In the display panel, an isolation structure is located on one side of a substrate, a plurality of isolation openings are formed in the isolation structure, and light emitting devices are at least partially located in the isolation openings. The light-emitting device comprises a first light-emitting device and a second light-emitting device which are different in light-emitting color, a first electrode of the first light-emitting device is in lap joint with the isolation structure located on the first side of the corresponding isolation opening, and a first electrode of the second light-emitting device is in lap joint with the isolation structure located on the second side of the corresponding isolation opening. In the above design, in the patterning process of the light-emitting device, multiple times of etching of the etching liquid on the film layer on the same side in the isolation opening where the post-manufactured light-emitting device is located can be reduced, so that the occurrence probability of poor dark spots of the post-manufactured light-emitting device due to the multiple times of etching is reduced, and the display effect and the process yield of the display panel are improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a method for manufacturing the display panel, and an electronic device. Background Technology

[0002] Organic light-emitting diodes (OLEDs) are considered the next generation of flat panel display technology after liquid crystal displays. Due to their superior color and image quality, they are widely used in various consumer electronics products such as mobile phones, televisions, laptops, and desktop computers, becoming the mainstream display panel.

[0003] However, the current manufacturing process of OLED display products still needs further improvement. Summary of the Invention

[0004] In order to overcome the technical problems mentioned in the above background, this application provides a display panel, a method for manufacturing the display panel, and an electronic device.

[0005] A first aspect of this application provides a display panel, the display panel comprising:

[0006] substrate;

[0007] An isolation structure is located on one side of the substrate, and the isolation structure encloses a plurality of isolation openings on the substrate;

[0008] A light-emitting device, at least partially located within the isolation opening, the light-emitting device including a first electrode, which overlaps with an isolation structure located on a first or second side opposite to each other in the isolation opening on a cross section perpendicular to the plane where the substrate is located and passing through the line connecting the centers of two adjacent isolation openings;

[0009] The light-emitting device includes a first light-emitting device and a second light-emitting device with different light-emitting colors. The first electrode of the first light-emitting device is connected to an isolation structure located on the first side of the corresponding isolation opening, and the first electrode of the second light-emitting device is connected to an isolation structure located on the second side of the corresponding isolation opening.

[0010] In one possible implementation of this application, the first electrode includes a first portion electrode that overlaps with the isolation structure and a second portion electrode that does not overlap with the isolation structure;

[0011] The electrode thickness of the first part of the electrode is less than the electrode thickness of the second part of the electrode;

[0012] Preferably, the electrode thickness of the first portion of the electrode decreases sequentially along the direction away from the substrate from the sidewall of the isolation structure;

[0013] Preferably, the electrode thickness of the first part of the electrode is 1 / 4 to 4 / 5 of the electrode thickness of the second part of the electrode.

[0014] In one possible implementation of this application, the first light-emitting device and the second light-emitting device are located within adjacent isolation openings, the first electrode of the first light-emitting device overlaps with one side of the isolation structure between the adjacent isolation openings, and the first electrode of the second light-emitting device overlaps with the other side of the isolation structure between the adjacent isolation openings.

[0015] In one possible implementation of this application, the light-emitting device further includes a third light-emitting device, wherein the light-emitting color of the third light-emitting device is different from the light-emitting colors of the first light-emitting device and the second light-emitting device;

[0016] On a cross section perpendicular to the plane where the substrate is located and passing through the center line connecting two adjacent isolation openings, the first electrode of the third light-emitting device overlaps with the isolation structure on the opposite first or second side of the corresponding isolation opening.

[0017] In one possible implementation of this application, the display panel includes a pixel delimiting layer;

[0018] The pixel defining layer is located on one side of the substrate, and the isolation structure is located on the side of the pixel defining layer away from the substrate;

[0019] The pixel defining layer defines a pixel opening on the substrate, and the orthographic projection of the pixel opening on the substrate lies within the orthographic projection of the isolation opening on the substrate.

[0020] In one possible implementation of this application, the pixel defining layer includes a recess located on the pixel defining layer within a portion of the isolation opening;

[0021] Preferably, the isolation opening includes a first isolation opening, a second isolation opening, and a third isolation opening, and the light-emitting device further includes a third light-emitting device, wherein the first light-emitting device is disposed in the first isolation opening, the second light-emitting device is disposed in the second isolation opening, and the third light-emitting device is disposed in the third isolation opening;

[0022] The recess is located on the pixel defining layer within the second isolation opening and the third isolation opening;

[0023] Preferably, the orthographic projection of the recess on the substrate is outside the orthographic projection of the first isolation opening on the substrate;

[0024] Preferably, the depth of the pit is less than the thickness of the pixel defining layer.

[0025] In one possible implementation of this application, the orthographic projection of the recess on the substrate overlaps with the orthographic projection of the isolation structure on the substrate; or,

[0026] The orthographic projection of the recess on the substrate lies between the orthographic projection of the isolation structure on the substrate and the orthographic projection of the pixel opening on the substrate.

[0027] In one possible implementation of this application, the recess in the second isolation opening is located on the pixel defining layer of the isolation structure near the second side;

[0028] Preferably, in the second isolation opening, the orthographic projection of the recess on the substrate is located outside the orthographic projection of the pixel defining layer of the isolation structure near the first side on the substrate.

[0029] In one possible implementation of this application, the recess in the third isolation opening is located on the pixel defining layer of the isolation structure near the first side and on the pixel defining layer of the isolation structure near the second side.

[0030] In one possible implementation of this application, the light-emitting device further includes a second electrode and a light-emitting material layer, wherein the second electrode, the light-emitting material layer, and the first electrode are stacked sequentially in a direction away from the substrate;

[0031] At least a portion of the second electrode is exposed from the pixel opening location;

[0032] The first electrode extends from the pixel opening through the pixel defining layer to the isolation structure sidewall on the first side or the second side of the isolation opening;

[0033] Preferably, the isolation structure includes a first isolation portion and a second isolation portion stacked together, the second isolation portion being disposed on the side of the first isolation portion away from the substrate, and the orthographic projection of the first isolation portion on the substrate being located within the orthographic projection of the second isolation portion on the substrate;

[0034] Preferably, the first electrode overlaps with the sidewall of the second isolation portion on the first or second side of the isolation opening;

[0035] Preferably, the isolation structure further includes a third isolation portion, wherein the third isolation portion, the first isolation portion, and the second isolation portion are stacked sequentially in a direction away from the substrate, and the orthographic projection of the first isolation portion on the substrate is located within the orthographic projection of the third isolation portion on the substrate;

[0036] Preferably, the orthographic projection of the third isolation portion on the substrate is located within the orthographic projection of the second isolation portion on the substrate;

[0037] Preferably, the first electrode also overlaps with a third isolation portion on the first side or the second side of the isolation opening;

[0038] Preferably, the first electrode overlaps with the third isolation portion and the second isolation portion located on the same side;

[0039] Preferably, the material of the first isolation part includes aluminum, silver or copper, the material of the second isolation part includes titanium or molybdenum, and the material of the third isolation part includes molybdenum or titanium.

[0040] In one possible implementation of this application, the display panel further includes a first encapsulation layer;

[0041] The first encapsulation layer includes multiple encapsulation units for encapsulating different light-emitting devices;

[0042] Preferably, two adjacent packaging units for encapsulating different color light-emitting devices are disconnected on the side of the isolation structure away from the substrate, and there is a gap between the packaging unit located on the side of the isolation structure away from the substrate and the isolation structure;

[0043] Preferably, two adjacent packaging units for encapsulating light-emitting devices of the same color are connected to each other on the side of the isolation structure away from the substrate;

[0044] Preferably, the display panel further includes a second encapsulation layer, the second encapsulation layer being located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer at least covering the encapsulation unit;

[0045] Preferably, the second encapsulation layer has a flat surface on the side away from the substrate;

[0046] Preferably, the display panel further includes a third encapsulation layer, the third encapsulation layer being located on the side of the second encapsulation layer away from the substrate;

[0047] Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

[0048] A second aspect of this application also provides a method for manufacturing a display panel, the method comprising:

[0049] Provide a substrate;

[0050] An isolation material layer is fabricated on the substrate, and the isolation material layer is patterned to obtain an isolation structure. The isolation structure forms a plurality of isolation openings on the substrate. On a cross section perpendicular to the plane where the substrate is located and passing through the line connecting the centers of two adjacent isolation openings, the isolation opening includes a first side and a second side, and the isolation opening includes a first isolation opening and a second isolation opening.

[0051] A first light-emitting device is formed in the first isolation opening, and the first electrode in the first light-emitting device is connected to the isolation structure on the first side of the first isolation opening;

[0052] A second light-emitting device with a different color than the first light-emitting device is fabricated in the second isolation opening, and the first electrode in the second light-emitting device is connected to the isolation structure on the second side of the second isolation opening.

[0053] In one possible implementation of this application, the step of forming a first light-emitting device in the first isolation opening and connecting the first electrode of the first light-emitting device to the isolation structure on the first side of the first isolation opening includes:

[0054] A device film layer of the first light-emitting device is formed by vapor deposition in the isolation opening using a first vapor deposition angle, wherein the first electrode of the first light-emitting device is overlapped with the isolation structure on the first side of the first isolation opening.

[0055] Remove the device film layer of the first light-emitting device outside the first isolation opening, expose the second isolation opening, and form the first light-emitting device in the first isolation opening;

[0056] Preferably, the step of fabricating a second light-emitting device with a different emission color from the first light-emitting device in the second isolation opening, and connecting the first electrode of the second light-emitting device to the isolation structure on the second side of the second isolation opening, includes:

[0057] A device film layer of the second light-emitting device is formed by vapor deposition in the isolation opening using a second vapor deposition angle, wherein the first electrode of the vapor-deposited second light-emitting device overlaps with the isolation structure on the second side of the second isolation opening, and wherein the first vapor deposition angle and the second vapor deposition angle are different;

[0058] Remove the device film layer of the second light-emitting device outside the second isolation opening, and fabricate the second light-emitting device in the second isolation opening.

[0059] In one possible implementation of this application, the isolation opening further includes a third isolation opening. After the step of fabricating a second light-emitting device with a different color than the first light-emitting device in the second isolation opening and connecting the first electrode of the second light-emitting device to the isolation structure on the second side of the second isolation opening, the method further includes:

[0060] A device film layer for a third light-emitting device is formed by vapor deposition in the isolation opening using a third vapor deposition angle. The first light-emitting device, the second light-emitting device, and the third light-emitting device emit different colors. The first electrode of the vapor-deposited third light-emitting device overlaps with the isolation structure on the first or second side of the third isolation opening. The third vapor deposition angle is the same as one of the first vapor deposition angle and the second vapor deposition angle.

[0061] Remove the device film layer of the third light-emitting device within the first isolation opening and the second isolation opening, and fabricate the third light-emitting device in the third isolation opening.

[0062] A third aspect of this application also provides an electronic device, the electronic device comprising a display panel prepared in any possible implementation of the first aspect or a display panel prepared in any possible implementation of the second aspect.

[0063] This application provides a display panel, a method for fabricating the display panel, and an electronic device. In the display panel, an isolation structure is located on one side of a substrate, and multiple isolation openings are provided on the isolation structure. At least a portion of the light-emitting devices are located within these isolation openings. The light-emitting devices include a first light-emitting device and a second light-emitting device with different emitting colors. The first electrode of the first light-emitting device overlaps with the isolation structure located on the first side of its corresponding isolation opening, and the first electrode of the second light-emitting device overlaps with the isolation structure located on the second side of its corresponding isolation opening. In this design, because the first electrodes of the different colored light-emitting devices overlap with isolation structures located on different sides of their respective corresponding isolation openings, the probability of dark spot defects caused by multiple etching processes in subsequent fabrication of the light-emitting devices is reduced, thereby improving the display effect and process yield of the display panel. Attached Figure Description

[0064] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0065] Figure 1 A cross-sectional schematic diagram of the display panel provided in this embodiment is illustrated;

[0066] Figure 2 Example Figure 1 Diagram showing the positional relationship between the central isolation structure and the isolation opening;

[0067] Figure 3a and Figure 3b A schematic diagram illustrating the positional relationship between the first electrode and the isolation structure is provided.

[0068] Figure 4 Example Figure 2 One of the schematic diagrams of the cross section in the AA direction;

[0069] Figure 5 Example Figure 2 Schematic diagram of the cross section in the AA direction (Part 2);

[0070] Figure 6 Example Figure 2 Schematic diagram of the cross section in the AA direction (Part 3);

[0071] Figure 7 Example Figure 2 Fourth schematic diagram of the cross-section in the AA direction;

[0072] Figure 8 Example Figure 2 Fifth schematic diagram of the cross-section in the AA direction;

[0073] Figure 9a Example Figure 8 A schematic diagram showing the positional relationship between the isolation structure, pixel boundary layer, and pit at the location of the second isolation opening;

[0074] Figure 9b Example Figure 8 A schematic diagram showing the positional relationship between the isolation structure, pixel boundary layer, and pit at the location of the third isolation opening;

[0075] Figure 10 Example Figure 2 Sixth schematic diagram of the cross-section in the AA direction;

[0076] Figure 11 A schematic diagram of an isolation structure is shown;

[0077] Figure 12 Another schematic diagram of the isolation structure is shown;

[0078] Figure 13 Example Figure 2 Schematic diagram of the cross section in the AA direction (Part 7);

[0079] Figure 14 Example Figure 2 Schematic diagram of the cross section in the AA direction (Part 8);

[0080] Figure 15 A flowchart illustrating the method for manufacturing the display panel provided in this embodiment is shown.

[0081] Figure 16 for Figure 15 Corresponding process flow diagram;

[0082] Figure 17 This is one of the process diagrams for this embodiment;

[0083] Figure 18 This is the second part of the process flow diagram of this embodiment;

[0084] Figure 19 This is the third part of the process flow diagram in this embodiment.

[0085] Icons: 1-Display panel; 11-Substrate; 12-Isolation structure; 1201-Isolation opening; 12011-First side; 12012-Second side; 1201a-First isolation opening; 1201b-Second isolation opening; 1201c-Third isolation opening; 121-First isolation portion; 122-Second isolation portion; 123-Third isolation portion; 13-Light-emitting device; 13a-First light-emitting device; 13b-Second light-emitting device; 13c-Third light-emitting device; 131-First electrode; 1311-First partial electrode; 1312-Second partial electrode; 132-Light-emitting material layer; 133-Second electrode; 14-Pixel defining layer; 141-Pit; 1401-Pixel opening; 151-First encapsulation layer; 1511-Encapsulation unit; 152-Second encapsulation layer; 153-Third encapsulation layer. Detailed Implementation

[0086] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0087] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0088] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0089] In the description of this application, it should be noted that the terms "center," "upper," "lower," "vertical," "horizontal," "inner," and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product of the invention is in use. They are used only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. In addition, the terms "first," "second," and "third," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0090] It should be noted that, where there is no conflict, different features in the embodiments of this application can be combined with each other.

[0091] Increasing the density of light-emitting devices (i.e., pixel density) in display panels is a crucial way to improve display quality. However, current display panels manufactured using Fine Metal Mask (FMM) technology are limited by technological constraints that prevent further increases in the density of light-emitting devices. Through long-term research, the inventors discovered that to address the technical challenge of limiting the density of light-emitting devices, an isolation structure can be incorporated into some display panels. During the full-layer vapor deposition of the light-emitting material layer and cathode, the light-emitting material layer and cathode can be separated at the isolation structure location. Through multiple vapor deposition and etching processes, light-emitting devices of different colors can be formed in different isolation openings, i.e., patterning of the light-emitting devices.

[0092] Patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419 and PCT / CN2024 / 099072 describe relevant technical solutions for isolation structures (or partition structures or isolation pillars) and encapsulation layers, the contents of which are incorporated herein by reference.

[0093] In the aforementioned display panel, increasing the brightness of the light-emitting devices can be achieved by reducing the overlap impedance between the electrodes and the isolation structure. The inventors discovered that overlapping one of the two opposing sides of the electrodes and the isolation structure effectively reduces this overlap impedance. However, the inventors also found that if this overlap method is used, the display panel may exhibit dark spots. These dark spots primarily occur in the light-emitting devices that are fabricated later in the patterning process.

[0094] Taking the sequential patterning of first, second, and third light-emitting devices of different colors as an example, the later-processed light-emitting device (such as the third light-emitting device) suffers from display dark spots. After analyzing the reasons for the display dark spots in the third light-emitting device, the inventors found that it was mainly due to excessive etching of the film layer in the isolation opening where the third light-emitting device is located, thus affecting the display effect of the third light-emitting device.

[0095] To address the aforementioned technical problems, the inventors have innovatively designed the following technical solutions, which will be described in detail below with reference to the accompanying drawings. It should be noted that the deficiencies in the existing solutions are the result of the inventors' practical experience and careful research. Therefore, the discovery process of the aforementioned technical problems and the solutions proposed in this embodiment below are contributions made by the inventors to this application during the invention process, and should not be construed as technical content known to those skilled in the art.

[0096] Please refer to Figure 1 and Figure 2 , Figure 1 This embodiment illustrates a partial film layer structure diagram of the display panel. Figure 2 Example Figure 1 A diagram showing the positional relationship between the isolation structure and the isolation opening. In this embodiment, the display panel 1 includes a substrate 11, an isolation structure 12, and a light-emitting device 13. The substrate 11 has a multi-layer structure and includes at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers. Pixel circuits that provide driving signals to the light-emitting device 13 are formed in the substrate 11. The conductive layers can be metal conductive layers.

[0097] The isolation structure 12 is located on one side of the substrate 11. A plurality of isolation openings 1201 are provided on the isolation structure 12. The isolation openings 1201 can be formed by the isolation structure 12 enclosing the substrate 11. The isolation openings 1201 can be used to accommodate the light-emitting device 13, wherein the light-emitting device 13 is at least partially located within the isolation openings 1201.

[0098] The light-emitting device 13 includes a first electrode 131, such as Figure 1 As shown, on a cross section perpendicular to the plane where the substrate 11 is located and passing through the center line connecting two adjacent isolation openings 1201, the first electrode 131 overlaps with the isolation structure 12 located on the opposite first side 12011 or second side 12012 in the isolation opening 1201.

[0099] In this embodiment, the light-emitting device 13 includes a first light-emitting device 13a and a second light-emitting device 13b, wherein the first light-emitting device 13a and the second light-emitting device 13b emit different colors. The first electrode 131 of the first light-emitting device 13a overlaps with the isolation structure 12 located on the first side 12011 of the corresponding isolation opening 1201, and the first electrode 13 of the second light-emitting device 13b overlaps with the isolation structure 12 located on the second side 12012 of the corresponding isolation opening 1201.

[0100] In the above structure, since the first electrode 131 of the light-emitting devices 13 of different colors overlaps with the isolation structure 12 on one side in their respective corresponding isolation openings 1201, the etching solution can be reduced to etch the film layer on the same side of the isolation opening 1201 where the light-emitting device 13 is located multiple times during the patterning process of the light-emitting device. This reduces the probability of dark spot defects caused by the multiple etching of the light-emitting device 13, and improves the display effect and process yield of the display panel 1.

[0101] It should be noted that the overlap between the first electrode 131 and the isolation structure 12 located on the first side 12011 or the second side 12012 of the isolation opening 1201 means that a first electrode 131 with a higher overlap height is formed on one side of the isolation opening 1201, while the side of the first electrode 131 opposite to the overlap side in the isolation opening 1201 does not overlap with the isolation structure 12, thereby increasing the electrode thickness overlapping on the isolation structure 12. For example, please refer to... Figure 3a and Figure 3b Taking the rectangular projection of the isolation opening 1201 onto the substrate 11 as an example, the isolation opening 1201 includes opposing sides a and b, and opposing sides c and d. Assuming the first electrode 131 overlaps with the isolation structure on side a of the isolation opening 1201, then in this case, the first electrode 131 will not overlap with the isolation structure on side b of the isolation opening 1201. However, the first electrode 131 may overlap with the isolation structures on side c and / or side d of the isolation opening 1201, for example... Figure 3a As shown, the first electrode 131 also overlaps with the isolation structures on sides c and d of the isolation opening 1201, but the overlap height between the first electrode 131 and the isolation structures on sides c and d of the isolation opening 1201 is less than the overlap height with the isolation structure on side a of the isolation opening 1201; for example, Figure 3bAs shown, the first electrode 131 does not overlap with the isolation structures on the c-side and d-side of the isolation opening 1201. It is understood that the first electrode 131 may also overlap with one of the isolation structures on the c-side and d-side of the isolation opening 1201. Whether the first electrode 131 overlaps with the isolation structures on the c-side and / or d-side of the isolation opening 1201 depends on the morphology of the isolation structure 12 and the selection of the vapor deposition angle. In this embodiment, unless otherwise specified, overlap of the first electrode 131 with one side of the isolation structure 12 in the isolation opening 1201 refers to overlap between the first electrode 131 and the isolation structure 12 with a higher overlap height. The overlap height refers to the distance between the far end of the first electrode 131 in contact with the isolation structure 12 and the substrate 11 in the plane perpendicular to the substrate 11.

[0102] Further, please refer to Figure 4 The first electrode 131 includes a first portion electrode 1311 and a second portion electrode 1312. The first portion electrode 1311 is in contact with the isolation structure 12, and the second portion electrode 1312 is the portion of the first electrode 131 that is not in contact with the isolation structure 12. The electrode thickness of the first portion electrode 1311 is less than the electrode thickness of the second portion electrode 1312. Optionally, the electrode thickness of the first portion electrode 1311 is 1 / 4 to 4 / 5 of the electrode thickness of the second portion electrode 1312. For example, the electrode thickness of the first portion electrode 1311 can be 1 / 4, 3 / 10, 7 / 20, 2 / 5, 9 / 20, 1 / 2, 11 / 20, 3 / 5, 13 / 20, 3 / 4, or 4 / 5 of the electrode thickness of the second portion electrode 1312. In this embodiment, the electrode thickness of the first portion electrode 1311 decreases sequentially along the sidewall of the isolation structure 12 away from the substrate 11. Compared to the double-sided overlap of the first electrode 131 and the isolation structure 12, the electrode thickness of the first part of the electrode 1311 overlapped with the isolation structure 12 in this solution is thicker, which helps to reduce the overlap impedance between the first electrode 131 and the isolation structure 12, and facilitates the improvement of the brightness of the light-emitting device 13. Thus, the power consumption of the display panel 1 can be reduced under the same display brightness conditions.

[0103] Further, in this embodiment, the first light-emitting device 13a and the second light-emitting device 13b are located within adjacent isolation openings 1201. The first electrode 131 of the first light-emitting device 13a overlaps with one side of the isolation structure 12 between the adjacent isolation openings 1201, and the first electrode 131 of the second light-emitting device 13b overlaps with the other side of the isolation structure 12 between the adjacent isolation openings 1201. For example, as... Figure 1As shown, the first electrode 131 of the first light-emitting device 13a overlaps with the left side of the isolation structure 12 between the first electrode 131 and the adjacent isolation opening 1201, and the first electrode 131 of the second light-emitting device 13b overlaps with the right side of the isolation structure 12 between the second electrode 13b and the adjacent isolation opening 1201.

[0104] Further, please refer to Figure 5 and Figure 6 In this embodiment, the light-emitting device 13 further includes a third light-emitting device 13c, wherein the light emission color of the third light-emitting device 13c is different from the light emission color of the first light-emitting device 13a and the second light-emitting device 13b. On a cross section perpendicular to the plane where the substrate 11 is located and passing through the center line connecting two adjacent isolation openings 1201, the first electrode 131 of the third light-emitting device 13c overlaps with the isolation structure 12 located on the opposite first side 12011 or second side 12012 in the corresponding isolation opening 1201.

[0105] For example, on a cross-section perpendicular to the plane of the substrate 11 and passing through the center line connecting two adjacent isolation openings 1201, the first side 12011 can be the right side of the corresponding isolation opening 1201, and the second side 12012 can be the left side of the corresponding isolation opening 1201. The first electrode 131 of the first light-emitting device 13a overlaps with the isolation structure 12 located on the first side 12011 of the corresponding isolation opening 1201, and the first electrode 131 of the second light-emitting device 13b overlaps with the isolation structure 12 located on the second side 12012 of the corresponding isolation opening 1201. Wherein, as... Figure 5 As shown, the first electrode 131 of the third light-emitting device 13c can overlap with the isolation structure 12 located on the first side 12011 of the corresponding isolation opening 1201, as shown. Figure 6 As shown, the first electrode 131 of the third light-emitting device 13c can also be connected to the isolation structure 12 located on the second side 12012 of the corresponding isolation opening 1201.

[0106] In one possible implementation of this embodiment, please refer to Figure 7 The display panel 1 also includes a pixel defining layer 14, which is located on one side of the substrate 11, and an isolation structure 12 is located on the side of the pixel defining layer 14 away from the substrate 11. The pixel defining layer 14 defines a pixel opening 1401 on the substrate 11, and the orthographic projection of the pixel opening 1401 on the substrate 11 is located within the orthographic projection of the isolation opening 1201 on the substrate 11, that is, the pixel opening 1401 and the isolation opening 1201 are connected.

[0107] In one possible implementation of this embodiment, please refer to Figure 8The isolation opening 1201 includes a first isolation opening 1201a, a second isolation opening 1201b, and a third isolation opening 1201c. A first light-emitting device 13a is disposed in the first isolation opening 1201a, a second light-emitting device 13b is disposed in the second isolation opening 1201b, and a third light-emitting device 13c is disposed in the third isolation opening 1201c. In this embodiment, the first light-emitting device 13a, the second light-emitting device 13b, and the third light-emitting device 13c can be fabricated sequentially through a light-emitting device patterning process. The pixel defining layer 14 can include pits 141 formed by etching solution during the light-emitting device patterning process. The pits 141 are located on the pixel defining layer 14 of a portion of the isolation opening 1201. For example, the pits 141 can be located on the pixel defining layer 14 within the second isolation opening 1201b and the third isolation opening 1201c. Specifically, the pit 141 in the second isolation opening 1201b is located at the pixel defining layer 14 not covered by the first light-emitting device 13a film layer, and the pit 141 in the third isolation opening 1201c is located at the pixel defining layer 14 not covered by the first light-emitting device 13a film layer or not covered by the second light-emitting device 13a film layer. The depth of the pit 141 is less than the thickness of the pixel defining layer 14, meaning the pixel defining layer 14 will not be etched through. In this embodiment, the orthographic projection of the pit 141 onto the substrate 11 is outside the orthographic projection of the first isolation opening 1201a onto the substrate 11, meaning the pit 141 is not located on the pixel defining layer 14 within the first isolation opening 1201a.

[0108] In this embodiment, the orthographic projection of the recess 141 on the substrate 11 partially overlaps with the orthographic projection of the isolation structure 12 on the substrate 11, or the orthographic projection of the recess 141 on the substrate 11 is located between the orthographic projection of the isolation structure 12 on the substrate 11 and the orthographic projection of the pixel opening 1401 on the substrate 11. Preferably, the orthographic projection of the recess 141 on the substrate 11 is located between the orthographic projection of the isolation structure 12 on the substrate 11 and the orthographic projection of the pixel opening 1401 on the substrate 11.

[0109] For example, please refer to again Figure 8 The first electrode 131 of the first light-emitting device 13a overlaps with the isolation structure 12 of the first side 12011 of the first isolation opening 1201a; the first electrode 131 of the second light-emitting device 13b overlaps with the isolation structure 12 of the second side 12012 of the second isolation opening 1201b; and the first electrode 131 of the third light-emitting device 13c overlaps with the isolation structure 12 of the first side 12011 or the second side 12012 of the third isolation opening 1201c.

[0110] Please refer to Figure 8 and Figure 9aIn the second isolation opening 1201b, the pit 141 is located on the pixel defining layer 14 of the isolation structure 12 near the second side 12012, and the orthographic projection of the pit 141 on the substrate 11 is outside the orthographic projection of the pixel defining layer 14 of the isolation structure 12 near the first side 12011 on the substrate 11.

[0111] Please refer to Figure 8 and Figure 9b In the third isolation opening 1201c, the recess 141 is located on the pixel defining layer 14 of the isolation structure 12 near the first side 12011 and on the pixel defining layer 14 of the isolation structure 12 near the second side 12012. Specifically, the depth of the pit 141 on the pixel boundary layer 14 of the first side 12011 near the third isolation opening 1201c and the depth of the pit 141 on the pixel boundary layer 14 of the second side 12012 near the third isolation opening 1201c can be equal. It can be understood that equal pit depth means that the difference between the two pit depths is less than a preset depth. For example, when the difference between the depth of the pit 141 on the pixel boundary layer 14 of the first side 12011 near the third isolation opening 1201c and the depth of the pit 141 on the pixel boundary layer 14 of the second side 12012 near the third isolation opening 1201c is less than one-tenth or less than one-tenth of the depth of the pit 141 on the pixel boundary layer 14 of the first side 12011 near the third isolation opening 1201c, the two pit depths are determined to be equal.

[0112] In this embodiment, please refer to Figure 10 The light-emitting device 13 further includes a second electrode 132 and a light-emitting material layer 133. In the direction away from the substrate 11, the second electrode 132, the light-emitting material layer 133, and the first electrode 131 are stacked sequentially. The second electrode 132 is disposed on the side of the pixel defining layer 14 near the substrate 11, wherein at least a portion of the second electrode 132 is exposed at the pixel opening 1401. The first electrode 131 extends from the pixel opening 1401 through the pixel defining layer 14 to the sidewall of the isolation structure 12 on the first side 12011 or the second side 12012 of the isolation opening 1201. The isolation structure 12 can connect the first electrodes 131 of different light-emitting devices 13 together to provide the same voltage (e.g., ELVSS voltage) to the first electrodes 131 of different light-emitting devices 13 through the isolation structure 12. Exemplarily, the first electrode 131 can be the cathode of the light-emitting device 13, and the second electrode 132 can be the anode of the light-emitting device 13.

[0113] In this embodiment, the isolation structure 12 can enclose multiple isolation openings 1201. The isolation structure 12 allows for the formation of films of different colors of light-emitting devices within different isolation openings 1201 without the need for a fine metal mask, thereby reducing the manufacturing cost of the display panel. The isolation structure 12 can isolate the light-emitting material layer 133 and the first electrode 131 in the light-emitting device, making different light-emitting devices 13 independent of each other, thus improving crosstalk between adjacent light-emitting devices 13 and enhancing the display effect. Furthermore, the independence of adjacent light-emitting devices 13 allows for independent encapsulation, improving encapsulation yield. Simultaneously, due to the presence of the isolation structure 12, the light-emitting material layer 133 and the first electrode 131 in each color of the light-emitting device 13 in the display panel can be fabricated on the entire surface before patterning, thereby eliminating the need for a fine metal mask and saving on the manufacturing cost of the display panel.

[0114] Please refer to Figure 11 In this embodiment, the isolation structure 12 includes a first isolation portion 121 and a second isolation portion 122. The first isolation portion 121 and the second isolation portion 122 are stacked sequentially in a direction away from the substrate 11. For example, the first electrode 131 of the light-emitting device 13 overlaps with the first isolation portion 121. The orthographic projection of the first isolation portion 121 onto the substrate 11 lies within the orthographic projection of the second isolation portion 122 onto the substrate 11. Optionally, the orthographic projection area of ​​the first isolation portion 121 onto the substrate 11 is smaller than the orthographic projection area of ​​the second isolation portion 122 onto the substrate 11. The cross-section of the isolation structure 12 can be T-shaped along the line connecting the geometric centers of two adjacent isolation openings 1201, perpendicular to the plane of the substrate 11. The sidewall of the isolation structure 12 facing the first isolation opening 1201 includes the sidewall of the first isolation portion 121 facing the first isolation opening 1201. The first isolation portion 121 includes a conductive material. The first isolation portion 121 is electrically connected to the first electrode 131.

[0115] In this embodiment, please further refer to Figure 12The isolation structure 12 also includes a third isolation portion 123. In the direction away from the substrate 11, the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 are sequentially stacked. For example, the first electrode 131 of the light-emitting device 13 also overlaps with the third isolation portion 123. The orthographic projection of the first isolation portion 121 onto the substrate 11 lies within the orthographic projection of the third isolation portion 123 onto the substrate 11. Optionally, the orthographic projection area of ​​the first isolation portion 121 onto the substrate 11 is smaller than the orthographic projection area of ​​the third isolation portion 123 onto the substrate 11. In this embodiment, the orthographic projection area of ​​the third isolation portion 123 onto the substrate 11 is also smaller than the orthographic projection area of ​​the second isolation portion 122 onto the substrate 11. In the direction perpendicular to the plane of the substrate 11 and along the line connecting the geometric centers of two adjacent isolation openings 1201, the cross-section of the isolation structure 12 can be I-shaped. The sidewalls of the isolation structure 12 facing the isolation openings 1201 include the sidewalls of the first isolation portion 121 and the third isolation portion 123 facing the first isolation opening 1201. At least one of the third isolation portion 123, the first isolation portion 121, and the second isolation portion 122 may include a conductive material. At least one of the third isolation portion 123 and the first isolation portion 121 is electrically connected to the first electrode 131.

[0116] In this embodiment, the material of the first isolation part 121 includes aluminum, silver or copper, and / or the material of the second isolation part 122 includes titanium or molybdenum, and / or the material of the third isolation part 123 includes molybdenum or titanium.

[0117] Further, please refer to Figure 13 In this embodiment, the display panel 1 further includes a first encapsulation layer 151, which includes multiple encapsulation units 1511. Different encapsulation units 1511 are used to encapsulate light-emitting devices 13 within different isolation openings 1201. Each encapsulation unit 1511 is used to independently encapsulate the light-emitting device 13 within one isolation opening 121. When the light-emitting devices 13 in adjacent isolation openings 1201 are of the same color, two adjacent encapsulation units 1511 are connected on the side of the isolation structure 12 away from the substrate 11. When the light-emitting devices 13 in adjacent isolation openings 1201 are of different colors, two adjacent encapsulation units 1511 are disconnected on the side of the isolation structure 12 away from the substrate 11, and there is a gap between the encapsulation unit 1511 on the side of the isolation structure 12 away from the substrate 11 and the isolation structure 12.

[0118] Please refer to Figure 14The display panel 1 further includes a second encapsulation layer 152 and a third encapsulation layer 153. The second encapsulation layer 152 covers the isolation structure 12 and the light-emitting device 13, and the side of the second encapsulation layer 152 away from the substrate 11 includes a flat surface. The third encapsulation layer 153 is located on the side of the second encapsulation layer 152 away from the substrate 11. The first encapsulation layer 151 and the third encapsulation layer 153 are inorganic encapsulation layers, and the second encapsulation layer 152 is an organic encapsulation layer. For example, the first encapsulation layer 151 and the third encapsulation layer 153 can be formed by chemical vapor deposition (CVD), and the second encapsulation layer 152 can be formed by inkjet printing (IJP). The first encapsulation layer 151, the second encapsulation layer 152, and the third encapsulation layer 153 form the thin-film encapsulation structure of the display panel 1.

[0119] It is understood that the display panel 1 may also include a touch function layer, an optical adhesive layer, a polarizer and a cover plate, etc., which are stacked sequentially on the side of the third encapsulation layer 153 away from the substrate 11. The above-mentioned film layers are conventional film layers of the display panel, and will not be described in detail here.

[0120] Based on the same inventive concept, this embodiment also provides a method for manufacturing a display panel, please refer to... Figure 15 and Figure 16 ,in Figure 15 A schematic flowchart illustrating the method for manufacturing the display panel provided in this embodiment is illustrated. Figure 16 for Figure 15 The corresponding process flow diagram is shown below. Figure 15 and Figure 16 The method for manufacturing the display panel provided in this embodiment will be described in detail.

[0121] Step S11: Provide a substrate 11.

[0122] In this embodiment, the substrate 11 has a multi-layer structure, including at least a plurality of conductive layers and an insulating layer located between adjacent conductive layers. A pixel driving circuit for providing driving signals to the light-emitting device is formed in the substrate 11. For example, the conductive layer includes a metal conductive layer.

[0123] Step S12: An isolation material layer 20 is fabricated on the substrate 11, and the isolation material layer 20 is patterned to obtain the isolation structure 12.

[0124] In this embodiment, the isolation structure 12 forms a plurality of isolation openings 1201 on the substrate 11. On a cross section perpendicular to the plane where the substrate 11 is located and passing through the center line connecting two adjacent isolation openings 1201, the isolation opening 1201 includes a first side 12011 and a second side 12012, and the isolation opening 1201 includes a first isolation opening 1201a and a second isolation opening 1201b.

[0125] Step S13: A first light-emitting device 13a is formed in the first isolation opening 1201a, and the first electrode 131 in the first light-emitting device 13a is connected to the isolation structure 12 of the first side 12011 in the first isolation opening 1201a.

[0126] For example, the device film layer (e.g., light-emitting material layer and first electrode 131) of the first light-emitting device 13a can be formed in the isolation opening 1201 by full-area vapor deposition, and the first light-emitting device 13a can be fabricated in the first isolation opening 1201a by patterning.

[0127] Step S14: In the second isolation opening 1201b, a second light-emitting device 13b with a different light-emitting color than the first light-emitting device 13a is made, and the first electrode 131 in the second light-emitting device 13b is connected to the isolation structure 12 of the second side 12012 in the second isolation opening 1201b.

[0128] For example, the device film layer (e.g., the light-emitting material layer and the first electrode 131) of the second light-emitting device 13b can be formed in the isolation opening 1201 by full-area vapor deposition, and the second light-emitting device 13b can be fabricated in the second isolation opening 1201b by patterning.

[0129] In the above preparation method, the first electrode 131 of the light-emitting device 13 fabricated successively overlaps with the isolation structure 12 on different sides of the corresponding isolation opening 1201. During the patterning process of the light-emitting device, the etching solution can be reduced to etch the film layer on the same side of the isolation opening where the light-emitting device 13 is located multiple times. This reduces the probability of dark spot defects caused by the multiple etching of the light-emitting device 13 fabricated later, and improves the display effect and process yield of the display panel 1.

[0130] Further, please refer to Figure 17 Step S13 can be achieved in the following way.

[0131] First, a device film layer for the first light-emitting device 13a is deposited in the isolation opening 1201 using a first deposition angle β1. The first electrode 131 of the deposited first light-emitting device 13a overlaps with the isolation structure 12 on the first side 12011 in the first isolation opening 1201a. The deposition angle is the angle between the deposition direction and the plane where the substrate 11 is located.

[0132] Next, the device film layer of the first light-emitting device 13 outside the first isolation opening 1201a is removed, the second isolation opening 1201b is exposed, and the first light-emitting device 13a is formed in the first isolation opening 1201a.

[0133] Further, please refer to Figure 18 Step S14 can be implemented in the following way.

[0134] First, a device film layer of the second light-emitting device 13b is formed by vapor deposition in the isolation opening 1201 using a second vapor deposition angle β2. The first electrode 131 of the vapor-deposited second light-emitting device 13b overlaps with the isolation structure 12 of the second side 12012 in the second isolation opening 1201b. The first vapor deposition angle β1 and the second vapor deposition angle β2 are different.

[0135] Next, the device film layer of the second light-emitting device 13b outside the second isolation opening 1201b is removed, and the second light-emitting device 13b is formed in the second isolation opening 1201b.

[0136] Please refer to Figure 19 The isolation opening 1201 also includes a third isolation opening 1201c. After step S14, the method for manufacturing the display panel provided in this embodiment further includes the following steps.

[0137] First, a device film layer for the third light-emitting device 13c is formed by vapor deposition in the isolation opening 1201 using the third vapor deposition angle β3.

[0138] Among them, the first light-emitting device 13a, the second light-emitting device 13b and the third light-emitting device 13c emit different colors. The first electrode 131 of the vapor-deposited third light-emitting device 13c overlaps with the isolation structure 12 of the first side 12011 or the second side 12012 in the third isolation opening 1201c. The third vapor deposition angle β3 is the same as one of the first vapor deposition angle β1 and the second vapor deposition angle β1.

[0139] Next, the device film layer of the third light-emitting device 13c in the first isolation opening 1201a and the second isolation opening 1201b is removed, and the third light-emitting device 13c is formed in the third isolation opening 1201c.

[0140] Based on the same inventive concept, this application also provides an electronic device, which includes the display panel provided in this application, or a display panel prepared by the display panel manufacturing method provided in this embodiment. The electronic device may include mobile phones, tablets, smart wearable devices, televisions, laptops, monitors and other devices with display functions.

[0141] This application provides a display panel, a method for fabricating the display panel, and an electronic device. In the display panel, an isolation structure is located on one side of a substrate, and multiple isolation openings are provided on the isolation structure. At least a portion of the light-emitting devices are located within these isolation openings. The light-emitting devices include a first light-emitting device and a second light-emitting device with different emitting colors. The first electrode of the first light-emitting device overlaps with the isolation structure located on the first side of its corresponding isolation opening, and the first electrode of the second light-emitting device overlaps with the isolation structure located on the second side of its corresponding isolation opening. In this design, since the first electrodes of the different colored light-emitting devices overlap only on one side of the isolation structures located on different sides of their respective corresponding isolation openings, the etching process can reduce the number of times the etching solution etches the film layer on the same side of the isolation opening where the light-emitting device is located during patterning. This reduces the probability of dark spot defects caused by the multiple etching processes in the subsequent light-emitting devices, thereby improving the display effect and process yield of the display panel.

[0142] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A display panel, characterized by, The display panel comprises: a substrate; an isolation structure located on one side of the substrate, a plurality of isolation openings being provided on the isolation structure; a light-emitting device at least partially located in the isolation opening, the light-emitting device comprising a first electrode, in a cross section perpendicular to a plane in which the substrate is located and passing a center connecting line of two adjacent isolation openings, the first electrode being overlapped with the isolation structure located on a first side or a second side opposite to the first side in the isolation opening; wherein the light-emitting device comprises a first light-emitting device and a second light-emitting device of different light-emitting colors, the first electrode of the first light-emitting device being overlapped with the isolation structure located on the first side of the corresponding isolation opening, and the first electrode of the second light-emitting device being overlapped with the isolation structure located on the second side of the corresponding isolation opening.

2. The display panel of claim 1, wherein, The first electrode comprises a first part electrode in contact with the isolation structure, and a second part electrode not in contact with the isolation structure; The electrode thickness of the first part electrode is smaller than the electrode thickness of the second part electrode; Preferably, the electrode thickness of the first part electrode decreases in turn in the direction away from the substrate along the side wall of the isolation structure; Preferably, the electrode thickness of the first part electrode is 1 / 4-4 / 5 of the electrode thickness of the second part electrode.

3. The display panel of claim 1, wherein, The first light-emitting device and the second light-emitting device are located in adjacent isolation openings, the first electrode of the first light-emitting device being overlapped with one side of the isolation structure between the adjacent isolation openings, and the first electrode of the second light-emitting device being overlapped with the other side of the isolation structure between the adjacent isolation openings.

4. The display panel of claim 3, wherein, The light-emitting device further comprises a third light-emitting device, wherein the light-emitting color of the third light-emitting device is different from the light-emitting colors of the first light-emitting device and the second light-emitting device; In a cross section perpendicular to a plane in which the substrate is located and passing a center connecting line of two adjacent isolation openings, the first electrode of the third light-emitting device is overlapped with the isolation structure located on a first side or a second side opposite to the first side in the corresponding isolation opening.

5. The display panel of claim 1, wherein, The display panel comprises a pixel defining layer; The pixel defining layer is located on one side of the substrate, and the isolation structure is located on a side of the pixel defining layer away from the substrate; The pixel defining layer defines a pixel opening on the substrate, and the orthographic projection of the pixel opening on the substrate is located within the orthographic projection of the isolation opening on the substrate.

6. The display panel of claim 5, wherein: The pixel defining layer comprises a pit, and the pit is located on the pixel defining layer in part of the isolation opening; Preferably, the isolation opening comprises a first isolation opening, a second isolation opening and a third isolation opening, the light-emitting device further comprises a third light-emitting device, the first light-emitting device is arranged in the first isolation opening, the second light-emitting device is arranged in the second isolation opening, and the third light-emitting device is arranged in the third isolation opening; The pit is located on the pixel defining layer in the second isolation opening and the third isolation opening; Preferably, the orthographic projection of the pit on the substrate is located outside the orthographic projection of the first isolation opening on the substrate. Preferably, the depth of the recess is less than the thickness of the pixel defining layer.

7. The display panel of claim 6, wherein, The orthogonal projection of the recess on the substrate partially overlaps with the orthogonal projection of the isolation structure on the substrate; Or, The orthogonal projection of the recess on the substrate is located between the orthogonal projection of the isolation structure on the substrate and the orthogonal projection of the pixel opening on the substrate.

8. The display panel of claim 6, wherein, In the second isolation opening, the recess is located on the pixel defining layer of the isolation structure close to the second side; Preferably, in the second isolation opening, the orthogonal projection of the recess on the substrate is located outside the orthogonal projection of the pixel defining layer of the isolation structure close to the first side on the substrate.

9. The display panel of claim 6, wherein, In the third isolation opening, The recess is located on the pixel defining layer of the isolation structure close to the first side and on the pixel defining layer of the isolation structure close to the second side.

10. The display panel of claim 6, wherein, The light emitting device further comprises a second electrode and a light emitting material layer, in a direction away from the substrate, the second electrode, the light emitting material layer and the first electrode are sequentially stacked; At least part of the second electrode is exposed from the position of the pixel opening; The first electrode extends from the pixel opening to the side wall of the isolation structure on the first side or the second side in the isolation opening via the pixel defining layer; Preferably, the isolation structure comprises a first isolation part and a second isolation part which are sequentially stacked, the second isolation part is arranged on the side of the first isolation part away from the substrate, the orthogonal projection of the first isolation part on the substrate is located within the orthogonal projection of the second isolation part on the substrate; Preferably, the first electrode overlaps with the side wall of the second isolation part on the first side or the second side in the isolation opening; Preferably, the isolation structure further comprises a third isolation part, in a direction away from the substrate, the third isolation part, the first isolation part and the second isolation part are sequentially stacked, the orthogonal projection of the first isolation part on the substrate is located within the orthogonal projection of the third isolation part on the substrate; Preferably, the orthogonal projection of the third isolation part on the substrate is located within the orthogonal projection of the second isolation part on the substrate; Preferably, the first electrode further overlaps with the third isolation part on the first side or the second side in the isolation opening; Preferably, the first electrode overlaps with the third isolation part and the second isolation part on the same side; Preferably, the material of the first isolation part comprises aluminum, silver or copper, the material of the second isolation part comprises titanium or molybdenum, and the material of the third isolation part comprises molybdenum or titanium.

11. The display panel of claim 1, wherein, The display panel further comprises a first encapsulation layer; The first encapsulation layer comprises a plurality of encapsulation units for encapsulating different light emitting devices; Preferably, two adjacent encapsulation units for encapsulating light emitting devices of different colors are disconnected on the side of the isolation structure away from the substrate, and there is a gap between the encapsulation unit located on the side of the isolation structure away from the substrate and the isolation structure; Preferably, two adjacent encapsulation units for encapsulating light emitting devices of the same color are connected to each other on the side of the isolation structure away from the substrate. Preferably, the display panel further comprises a second encapsulation layer, the second encapsulation layer is located on the side of the encapsulation unit away from the substrate, and the second encapsulation layer covers at least the encapsulation unit; Preferably, the second encapsulation layer has a flat surface on the side away from the substrate; Preferably, the display panel further comprises a third encapsulation layer, the third encapsulation layer is located on the side of the second encapsulation layer away from the substrate; Preferably, the first encapsulation layer and the third encapsulation layer are inorganic encapsulation layers, and the second encapsulation layer is an organic encapsulation layer.

12. A method for manufacturing a display panel, characterized by, The method comprises: providing a substrate; forming an isolation material layer on the substrate, and patterning the isolation material layer to obtain an isolation structure, wherein the isolation structure forms a plurality of isolation openings on the substrate, and in a cross section perpendicular to the plane in which the substrate is located and passing through the center line of adjacent two isolation openings, the isolation opening comprises opposite first and second sides, and the isolation opening comprises a first isolation opening and a second isolation opening; forming a first light emitting device in the first isolation opening, and making a first electrode in the first light emitting device overlap the isolation structure on the first side of the first isolation opening; forming a second light emitting device with a different light emitting color from the first light emitting device in the second isolation opening, and making a first electrode in the second light emitting device overlap the isolation structure on the second side of the second isolation opening.

13. The method of producing a display panel according to claim 12, wherein The step of forming a first light emitting device in the first isolation opening and making a first electrode in the first light emitting device overlap the isolation structure on the first side of the first isolation opening comprises: forming a device film layer of the first light emitting device in the isolation opening by evaporation at a first evaporation angle, wherein the first electrode of the first light emitting device formed by evaporation overlaps the isolation structure on the first side of the first isolation opening; removing the device film layer of the first light emitting device outside the first isolation opening to expose the second isolation opening, and forming a first light emitting device in the first isolation opening; Preferably, the step of forming a second light emitting device with a different light emitting color from the first light emitting device in the second isolation opening and making a first electrode in the second light emitting device overlap the isolation structure on the second side of the second isolation opening comprises: forming a device film layer of the second light emitting device in the isolation opening by evaporation at a second evaporation angle, wherein the first electrode of the second light emitting device formed by evaporation overlaps the isolation structure on the second side of the second isolation opening, and the first evaporation angle and the second evaporation angle are different; removing the device film layer of the second light emitting device outside the second isolation opening to form a second light emitting device in the second isolation opening.

14. The method of producing a display panel according to claim 13, wherein The isolation opening further comprises a third isolation opening, and after the step of forming a second light emitting device with a different light emitting color from the first light emitting device in the second isolation opening and making a first electrode in the second light emitting device overlap the isolation structure on the second side of the second isolation opening, the method further comprises: A third evaporation angle is used to evaporate a device film layer of a third light-emitting device in the third isolation opening, wherein the first light-emitting device, the second light-emitting device and the third light-emitting device have different light-emitting colors, the first electrode of the third light-emitting device is overlapped with the isolation structure on the first side or the second side of the third isolation opening, and the third evaporation angle is the same as one of the first evaporation angle and the second evaporation angle; The device film layer of the third light-emitting device in the first isolation opening and the second isolation opening is removed, and a third light-emitting device is formed in the third isolation opening.

15. An electronic device, comprising: The electronic device includes the display panel of any one of claims 1-11 or the display panel prepared by the preparation method of any one of claims 12-14.

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