Packaging method and packaging body of CT (Computed Tomography) detector
By using the alignment marks on the adapter plate and the bonding plate, the precise positioning of the heat sink component of the CT detector is achieved, solving the problem of high packaging error and improving modular expansion performance and imaging accuracy.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-12-01
- Publication Date
- 2026-03-13
AI Technical Summary
In existing CT detector packaging methods, the high packaging error and low packaging accuracy of the heat sink component result in poor modular expansion performance of photon counting CT detectors.
The adapter plate and the bonding plate are aligned by using the first alignment mark on the adapter plate and the second alignment mark on the heat sink to accurately position the heat sink on the bonding plate and fix it with fasteners to reduce packaging errors.
The packaging precision of the heat sink was improved, the packaging error was reduced, and the modular expansion performance and imaging accuracy of the CT detector were enhanced.
Smart Images
Figure CN121647706A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of photon counting detectors, and in particular to a packaging method and package for a CT detector. Background Technology
[0002] With the rapid development of medical imaging and non-destructive testing technologies, photon-counting computed tomography (CT) detectors, due to their energy spectral resolution capabilities, are becoming a core development direction for next-generation CT systems. Among them, semiconductor detector elements, represented by cadmium zinc telluride (CZT) crystals, demonstrate enormous application potential in this field due to their excellent detection performance. As a key sensing material in photon-counting CT detectors, CZT crystals require high-precision packaging processes and heat sink integration to ensure their long-term electrical stability and heat dissipation efficiency. Since photon-counting CT detectors need to be expandable on all four sides—meaning each detector module can precisely interface with the same module on all four sides—internal positional errors in individual modules will lead to error propagation and accumulation during subsequent four-sided stitching, thus affecting the imaging performance, accuracy, and reliability of the entire photon-counting CT system. Therefore, achieving and strictly controlling the relative positional accuracy of CZT crystals and heat sinks during the packaging process has become one of the key technical challenges in overcoming the packaging bottleneck of photon-counting CT detectors and improving their modular expandability.
[0003] Currently, traditional packaging methods mainly involve first aligning and bonding the CZT crystal to a rigid-flex PCB, and then aligning and bonding the rigid-flex PCB to a heat sink. This method suffers from problems such as large cumulative errors and low precision. Summary of the Invention
[0004] This application provides a packaging method and package for a CT detector to solve the problems of high packaging error and low packaging accuracy of heat sink components.
[0005] To address the aforementioned technical problems, this application provides a packaging method for a CT detector, comprising: attaching an adapter plate to a bonding plate; aligning the adapter plate with a first alignment mark and a second alignment mark of a heat sink to determine the mounting position of the heat sink on the bonding plate; and fixing the heat sink to a mounting position on the side of the bonding plate away from the adapter plate.
[0006] The step of attaching the adapter plate to the bonding plate includes: aligning the third alignment mark on the bonding plate with the first pair of marks on the adapter plate; determining the installation position of the adapter plate on the bonding plate; and attaching the side of the adapter plate without the first alignment mark to the bonding plate.
[0007] The step of aligning the heat sink with the first alignment mark of the adapter plate and the second alignment mark of the heat sink to determine the installation position of the heat sink on the bonding plate includes: aligning the first alignment mark on the side of the adapter plate away from the bonding plate with the second alignment mark on the heat sink to determine the installation position; the step of attaching the heat sink to the installation position on the side of the bonding plate away from the adapter plate includes: fixing the heat sink to the installation position of the bonding plate using the second alignment mark.
[0008] The step of aligning the heat sink with the first alignment mark of the adapter plate and the second alignment mark of the heat sink to determine the installation position of the heat sink on the bonding plate includes: acquiring the position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink through the acquisition module; and determining the installation position of the heat sink on the bonding plate based on the position information.
[0009] The acquisition module includes a first acquisition module disposed above the adapter plate and a second acquisition module disposed below the heat sink component. The step of acquiring the position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink component through the acquisition module includes: acquiring the position information of the first alignment mark of the adapter plate through the first acquisition module; and acquiring the position information of the second alignment mark of the heat sink component through the second acquisition module.
[0010] The step of determining the installation position of the heat sink on the bonding plate based on the position information includes: converting the position information of the first alignment mark and the position information of the second alignment mark to the same coordinate system to obtain the converted position information; based on the converted position information, taking the first alignment mark as a reference, determining an installation position that makes the second alignment mark and the first alignment mark spatially match in the thickness direction of the bonding plate, and determining the installation position as the installation position of the heat sink on the bonding plate.
[0011] To address the aforementioned technical problems, this application provides a CT detector package, comprising: a bonding plate; an adapter plate mounted on one side of the bonding plate, wherein a first alignment mark is provided on the side of the adapter plate away from the bonding plate; and a heat sink fixed to the side of the bonding plate away from the adapter plate; wherein a second alignment mark is provided on the heat sink; wherein the second alignment mark and the first alignment mark are spatially matched in the thickness direction of the bonding plate, and the adapter plate and the heat sink are disposed on both sides of the bonding plate after being aligned by the second alignment mark and the first alignment mark.
[0012] Specifically, the process involves obtaining a first package and a second package; aligning the first alignment mark on the adapter plate of the first package with the second alignment mark on the heat sink of the second package; and setting the alignment of the first package and the second package based on the alignment result.
[0013] The step of aligning the first alignment mark on the adapter plate of the first package with the second alignment mark on the heat sink of the second package includes: acquiring position information of the first alignment mark and the second alignment mark through a data acquisition module; and determining the alignment position relationship between the first package and the second package based on the position information.
[0014] The step of aligning and mounting the first package and the second package based on the alignment result includes: converting the position information of the first alignment mark of the first package and the position information of the second alignment mark of the second package to the same coordinate system to obtain the converted position information; based on the converted position information, taking the first alignment mark of the first package as a reference, determining an alignment position relationship that makes the second alignment mark of the second package match the first alignment mark of the first package in space; and setting the first package and the second package based on the alignment position relationship.
[0015] The beneficial effects of this application are as follows: Unlike existing technologies, the packaging method of this application includes: attaching an adapter plate to a bonding plate; aligning the heat sink component with a first alignment mark on the adapter plate and a second alignment mark on the heat sink component to determine its mounting position on the bonding plate; and fixing the heat sink component to a mounting position on the side of the bonding plate away from the adapter plate. Through the above method, this application reduces the packaging error of the heat sink component, thereby improving its packaging accuracy. Attached Figure Description
[0016] Figure 1 This is a flowchart illustrating an embodiment of the encapsulation method provided in this application; Figure 2 This is a schematic diagram of the mounting embodiment of the adapter plate and bonding plate provided in this application; Figure 3 This is a schematic diagram of the structure of an embodiment of the package provided in this application; Figure 4 This is a flowchart illustrating another embodiment of the packaging method provided in this application; Figure 5 This is a schematic diagram of the structure of the bonding plate embodiment provided in this application; Figure 6 This is a schematic diagram of another embodiment of the package provided in this application. Detailed Implementation
[0017] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0018] The terminology used in the embodiments of this application is for the purpose of describing specific embodiments only and is not intended to limit the application. The singular forms "a," "the," and "the" used in the embodiments of this application and the appended claims are also intended to include the plural forms. Unless otherwise clearly indicated above, "multiple" generally includes at least two, but does not exclude the inclusion of at least one. It should be noted that if the embodiments of this application involve directional indications (such as up, down, left, right, front, back, etc.), these directional indications are only used to explain the relative positional relationships and movement of the components in a specific posture (as shown in the accompanying drawings). If the specific posture changes, the directional indications also change accordingly. Furthermore, if the embodiments of this application involve descriptions of "first," "second," etc., these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of indicated technical features. Therefore, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. In addition, in the embodiments of this application, the meaning of "and / or" can be both, or either one. Furthermore, the technical solutions of the various embodiments can be combined with each other, but only if they are based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or cannot be implemented, it should be considered that such combination of technical solutions does not exist and is not within the scope of protection claimed in this application.
[0019] Please see Figure 1 , Figure 1 This is a flowchart illustrating an embodiment of the encapsulation method provided in this application.
[0020] Step S11: Attach the adapter plate to the bonding plate.
[0021] For a better explanation of the mounting method for the adapter plate and bonding plate, please refer to the following: Figure 2 , Figure 2 This is a schematic diagram of the mounting embodiment of the adapter plate and the bonding plate provided in this application, which includes: adapter plate 1, bonding plate 2, first alignment mark 4 and third alignment mark 5.
[0022] The adapter plate has a first alignment mark on one side, and the connecting plate has a third alignment mark on the other side.
[0023] Alignment is performed by matching the third alignment mark on the mating plate with the first alignment mark on the adapter plate to determine the installation position of the adapter plate on the mating plate. The side of the adapter plate without the first alignment mark is then attached to the mating plate.
[0024] In one specific embodiment, the bonding plate is a rigid-flex plate comprising: a flexible plate, a rigid plate, and a connecting portion. Multiple third alignment marks may be provided on the top and bottom surfaces of the rigid plate. Multiple first alignment marks may be provided on one side of the adapter plate 1. The alignment process determines the mounting coordinates by matching the positions of the third alignment marks on the adapter plate 1 with the third alignment marks on the rigid plate, and the adapter plate without first alignment marks is mounted facing the rigid plate.
[0025] In a specific application scenario, the third alignment mark on the board and the first alignment mark on the adapter board can be set using methods such as laser engraving, screen printing, and mechanical scribing. The setting method for the third alignment mark and the first alignment mark can be selected according to actual conditions such as hardware facilities and accuracy requirements.
[0026] For a better explanation of the mounting method between the heat sink and the bonding plate, please refer to [link / reference needed]. Figure 3 , Figure 3 This is a schematic diagram of an embodiment of the package provided in this application, including: an adapter plate 1, a bonding plate 2, a heat sink 3, a first alignment mark 4, a second alignment mark 6, and a third alignment mark 5.
[0027] Step S12: Align the first alignment mark of the adapter plate with the second alignment mark of the heat sink to determine the installation position of the heat sink on the bonding plate.
[0028] Align the first alignment mark on the side of the adapter plate away from the connecting plate with the second alignment mark on the heat sink to determine the installation position.
[0029] In one specific embodiment, the position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink is obtained by the acquisition module, and the installation position of the heat sink on the bonding plate is determined based on the position information.
[0030] In a specific application scenario, the acquisition module obtains the coordinates of the first alignment mark of the adapter plate and the coordinates of the second alignment mark of the heat sink. Using the first alignment mark as a reference, the position where the second mark point is spatially matched and aligned with the first alignment mark in the thickness direction of the bonding plate is the installation position of the heat sink on the bonding plate.
[0031] Step S13: Fix the heat sink to the mounting position on the side of the connecting plate away from the adapter plate.
[0032] The heat sink is fixed to the mounting position of the bonding plate using the second alignment mark.
[0033] In one specific embodiment, the second alignment mark of the heat sink is a mounting hole that penetrates the heat sink. Fasteners are used to fix the heat sink to a mounting position on the side of the connecting plate away from the adapter plate through the mounting hole.
[0034] Through the above steps, the packaging method of this embodiment reduces the packaging error of the heat sink by attaching the adapter plate to the bonding plate; aligning the first alignment mark of the adapter plate with the second alignment mark of the heat sink component to determine the installation position of the heat sink component on the bonding plate; and fixing the heat sink component to the installation position on the side of the bonding plate away from the adapter plate.
[0035] Please see Figure 4 , Figure 4 This is a flowchart illustrating another embodiment of the encapsulation method provided in this application.
[0036] Step S21: Attach the adapter plate to the bonding plate.
[0037] This step is the same as step S11. Please refer to the relevant description of step S11 for details, which will not be repeated here.
[0038] Step S22: Obtain the position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink through the acquisition module.
[0039] The acquisition module includes a first acquisition module located above the adapter plate and a second acquisition module located below the heat sink.
[0040] The first acquisition module acquires the position information of the first alignment mark of the adapter plate, and the second acquisition module acquires the position information of the second alignment mark of the heat sink.
[0041] In one specific embodiment, the first acquisition module acquires the three-dimensional coordinates of the first alignment mark of the adapter plate, and the second acquisition module acquires the three-dimensional coordinates of the second alignment mark of the heat sink.
[0042] In a specific application scenario, the adapter board can have multiple first alignment marks set in multiple locations. For example, two first alignment marks can be set at the top left and bottom right corners of the top surface of the adapter board, four first alignment marks can be set at the top left and bottom right corners of the top surface of the adapter board, or multiple first alignment marks can be arranged in an array on the top surface of the adapter board. The specific location and number of first alignment marks on the adapter board can be adjusted and set according to the actual alignment requirements and hardware settings.
[0043] In some embodiments, the second alignment mark of the heat sink is a mounting hole of the heat sink, which penetrates the heat sink.
[0044] In some implementations, the acquisition module can be an image sensor, which obtains the position information of the first alignment mark of the adapter plate by acquiring an image of the surface where the first alignment mark of the adapter plate is located; and obtains the position information of the second alignment mark of the heat sink by acquiring an image of the surface where the second alignment mark of the heat sink is located.
[0045] Step S23: Convert the position information of the first alignment mark and the position information of the second alignment mark to the same coordinate system.
[0046] In one specific embodiment, a common calibration benchmark is preset to perform system calibration on the first acquisition module and the second acquisition module, and to establish a spatial mapping relationship between their coordinate systems.
[0047] In another specific embodiment, a coordinate transformation relationship between the first acquisition module and the second acquisition module is established through a preset system calibration. Based on this transformation relationship, the position information of the first alignment mark and the position information of the second alignment mark are unified to the same reference coordinate system.
[0048] In another specific embodiment, the three-dimensional coordinates of the first alignment mark and the two alignment marks are respectively transformed into the reference coordinate system based on a preset reference coordinate system.
[0049] Step S24: Based on the converted position information, determine the installation position of the heat sink on the bonding plate.
[0050] Based on the converted position information, and taking the first alignment mark as a reference, a position is determined that makes the second alignment mark spatially match the first alignment mark in the thickness direction of the bonding plate. This position is the installation position of the heat sink on the bonding plate.
[0051] In one specific embodiment, by pre-setting a common calibration benchmark, the first acquisition module and the second acquisition module are systematically calibrated to establish a spatial mapping relationship between their coordinate systems. The first alignment mark of the adapter plate is a fixed spatial benchmark, and the position where the projection of the second alignment mark and the projection of the first alignment mark coincide in the thickness direction of the connecting plate is the installation position of the heat sink on the connecting plate.
[0052] Step S25: Secure the heat sink to the mounting position on the side of the bonding plate away from the adapter plate.
[0053] This step is the same as step S13. Please refer to the relevant description of step S13 for details, which will not be repeated here.
[0054] Please see Figure 3 , Figure 3 This is a schematic diagram of the structure of an embodiment of the package provided in this application.
[0055] The package includes: an adapter plate 1, a bonding plate 2, and a heat sink 3.
[0056] The adapter plate 1 is attached to one side of the connecting plate 2, and the side of the adapter plate 1 away from the connecting plate 2 is provided with a first alignment mark 4.
[0057] The heat sink 3 is fixed to the side of the connecting plate 2 away from the adapter plate 1; wherein, the heat sink 3 is provided with a second alignment mark 5; The second alignment mark 5 and the first alignment mark 4 are spatially matched in the thickness direction of the connecting plate 2. The adapter plate 1 and the heat sink 3 are set on both sides of the connecting plate 2 after being aligned by the second alignment mark 5 and the first alignment mark 4.
[0058] In some embodiments, the third alignment mark 6 of the connecting plate 2 and the first alignment mark 4 of the adapter plate 1 can be set by means of laser engraving, screen printing, or mechanical scribing. The setting method of the third alignment mark 6 and the first alignment mark 4 can be selected according to actual conditions such as hardware facilities and accuracy requirements.
[0059] In some embodiments, the adapter board 1 may have multiple first alignment marks 4 at multiple locations. For example, two first alignment marks 4 may be set at the upper left and lower right corners of the top surface of the adapter board 1, four first alignment marks 4 may be set at the upper left and lower right corners of the top surface of the adapter board 1, or multiple first alignment marks 4 may be arranged in an array on the top surface of the adapter board 1. The specific location and number of the first alignment marks 4 on the adapter board 1 can be adjusted and set according to the actual alignment requirements and hardware settings.
[0060] In some embodiments, the second alignment mark 5 of the heat sink 3 can be a mounting hole that penetrates the heat sink 3. The mounting hole is aligned with the position of the first alignment mark 4 of the adapter plate 1 in the thickness direction of the connecting plate 2. Then, fasteners are used to fix the heat sink 3 to the side of the connecting plate 2 away from the adapter plate 1 through the mounting hole.
[0061] For a better explanation of the structural features of plate 2, please refer to the following: Figure 5 , Figure 5 This is a schematic diagram of the structure of the bonding plate embodiment provided in this application.
[0062] In some embodiments, the bonding plate 2 is a rigid-flex bonding plate, including: a rigid plate 7, a plurality of flexible plates 8, and a plurality of connecting portions 9. The top and bottom surfaces of the rigid plate 7 are provided with a plurality of third alignment marks 5. These third alignment marks 5 allow the adapter plate 1 (without second alignment marks 4) to be attached to the bonding plate 2, aligning with the first alignment marks 4 of the adapter plate 1. Then, the first alignment marks 4 of the adapter plate 1 are aligned with the second alignment marks 5 of the heat sink 3, thereby fixing the heat sink 3 to the side of the bonding plate 2 away from the adapter plate 1. Furthermore, the flexible plates 8 of the bonding plate 2 are bendable, and the connecting portions 9 are used to connect other equipment components.
[0063] Please see Figure 6 , Figure 6 This is a schematic diagram of another embodiment of the package provided in this application, and can be combined with, if necessary, the following: Figures 1 to 5 .
[0064] The first package 10 includes: an adapter plate 11 and a bonding plate 12. Figure 6 (Not shown), heat sink 13 ( Figure 6 (Not shown), wherein the adapter plate 11 has a first alignment mark 13 on the side away from the connecting plate 12, and the heat sink 13 has a second alignment mark 14.
[0065] The second package 20 includes: an adapter plate 21, a bonding plate 22, and a heat sink 23, wherein the adapter plate 21 has a first alignment mark 23 on the side away from the bonding plate 22. Figure 6 (Not shown), the heat sink 23 is provided with a second alignment mark 24.
[0066] The first alignment mark 13 and the second alignment mark 14 of the first package 10 can be identified, and the first alignment mark 23 and the second alignment mark 24 of the second package 20 can be identified.
[0067] In this embodiment, a first package 10 and a second package 20 can be obtained; the first alignment mark 13 on the adapter plate 11 of the first package 10 and the second alignment mark 24 on the heat sink 23 of the second package 20 can be aligned; based on the alignment result, the first package 10 and the second package 20 can be aligned.
[0068] In a specific embodiment, the position information of the first alignment mark 13 on the adapter plate 11 of the first package 10 and the second alignment mark 24 on the heat sink 23 of the second package 20 is obtained by the acquisition module; the first package 10 and the second package 20 are aligned with the first alignment mark 13 of the first package 10 as a reference.
[0069] In another specific embodiment, a first package 10 and a second package 20 are obtained, and the position information of the first alignment mark 13 of the first package 10 and the second alignment mark 24 of the second package 20 are obtained through a collection module; the first package 10 and the second package 20 are aligned with the second alignment mark 24 of the second package 20 as a reference.
[0070] In another specific embodiment, a first package 10 and a second package 20 are acquired. The position information of the first alignment mark 13 of the first package 10 is acquired through a first acquisition module, and the position information of the second alignment mark 24 of the second package 20 is acquired through a second acquisition module. The position information of the first alignment mark 13 of the first package 10 and the position information of the second alignment mark 24 of the second package 20 are transformed to the same coordinate system. Using the position information of the first alignment mark 13 of the first package 10 and the position information of the second alignment mark 24 of the second package 20 in the same coordinate system after transformation, and taking the first alignment mark 13 of the first package 10 as a reference, an alignment position relationship that makes the second alignment mark 24 of the second package 20 match the first alignment mark 13 of the first package 10 in space is determined. The second package 20 is set on the alignment position relationship that matches the first package 10 in space.
[0071] Through the above steps, this application reduces the packaging error of the heat sink and improves its packaging accuracy by mounting the adapter plate onto the bonding plate; acquiring the position information of the first alignment mark on the adapter plate and the second alignment mark on the heat sink component through a data acquisition module; converting the position information of the first and second alignment marks to the same coordinate system; determining the installation position of the heat sink component on the bonding plate based on the converted position information; and fixing the heat sink component to the installation position on the side of the bonding plate away from the adapter plate. Furthermore, this application also acquires a first package and a second package; wherein the first alignment mark on the adapter plate of the first and second packages and the second alignment mark on the heat sink component can be identified; aligning is performed using the first alignment mark on the adapter plate of the first package and the second alignment mark on the heat sink component of the second package; and aligning the first and second packages based on the alignment result, thereby reducing the error in the alignment and mounting of the packages and improving the accuracy of the alignment and mounting.
[0072] In the several embodiments provided in this application, it should be understood that the disclosed methods and apparatus can be implemented in other ways. For example, the apparatus implementations described above are merely illustrative. For instance, the division of modules or units is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple units or components may be combined or integrated into another system, or some features may be ignored or not executed. Furthermore, the mutual coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection of devices or units may be electrical, mechanical, or other forms.
[0073] The above are merely embodiments of this application and do not limit the scope of this patent application. Any equivalent structural or procedural changes made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the scope of patent protection of this application.
Claims
1. A method for packaging a CT detector, characterized in that, The encapsulation method includes: Attach the adapter plate to the bonding plate; The first alignment mark of the adapter plate is used to align with the second alignment mark of the heat sink to determine the installation position of the heat sink on the connecting plate. The heat sink is fixed to the mounting position on the side of the connecting plate away from the adapter plate.
2. The packaging method according to claim 1, characterized in that, The step of attaching the adapter plate to the bonding plate includes: Alignment is performed using the third alignment mark on the connecting plate and the alignment mark on the adapter plate; the installation position of the adapter plate on the connecting plate is determined. The side of the adapter plate without the first alignment mark is attached to the bonding plate.
3. The packaging method according to claim 1, characterized in that, The step of aligning the heat sink component with the first alignment mark of the adapter plate and the second alignment mark of the heat sink component to determine the installation position of the heat sink component on the connecting plate includes: The installation position is determined by aligning the first alignment mark on the side of the adapter plate away from the connecting plate with the second alignment mark on the heat sink. The step of attaching the heat sink to the mounting position on the side of the bonding plate away from the adapter plate includes: The heat sink is fixed to the mounting position of the bonding plate using the second alignment mark.
4. The packaging method according to claim 1 or 3, characterized in that, The step of aligning the heat sink component with the first alignment mark of the adapter plate and the second alignment mark of the heat sink component to determine the installation position of the heat sink component on the connecting plate includes: The position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink is obtained by the acquisition module. Based on the location information, the installation position of the heat sink on the bonding plate is determined.
5. The packaging method according to claim 4, characterized in that, The acquisition module includes: a first acquisition module disposed above the adapter plate and a second acquisition module disposed below the heat sink; The step of acquiring the position information of the first alignment mark of the adapter plate and the second alignment mark of the heat sink through the acquisition module includes: The position information of the first alignment mark of the adapter board is obtained through the first acquisition module; The second acquisition module obtains the position information of the second alignment mark of the heat sink.
6. The packaging method according to claim 4, characterized in that, The step of determining the installation position of the heat sink on the bonding plate based on the location information includes: The position information of the first alignment mark and the position information of the second alignment mark are transformed to the same coordinate system to obtain the transformed position information; Based on the converted position information, and taking the first alignment mark as a reference, an installation position is determined that makes the second alignment mark spatially match the first alignment mark in the thickness direction of the bonding plate, and the installation position is determined as the installation position of the heat sink on the bonding plate.
7. A CT detector package, characterized in that, The package includes: bonding plate; An adapter plate is attached to one side of the connecting plate, and a first alignment mark is provided on the side of the adapter plate away from the connecting plate; A heat sink is fixed to the side of the connecting plate away from the adapter plate; wherein, the heat sink is provided with a second alignment mark; The second alignment mark and the first alignment mark are spatially matched in the thickness direction of the bonding plate, and the adapter plate and the heat sink are disposed on both sides of the bonding plate after being aligned by the second alignment mark and the first alignment mark.
8. The package according to claim 7, characterized in that, Obtain and provide a first package and a second package; Alignment is performed using the first alignment mark on the adapter plate of the first package and the second alignment mark on the heat sink of the second package; Based on the alignment results, the first package and the second package are aligned.
9. The package according to claim 8, characterized in that, The step of aligning the first alignment mark on the adapter plate of the first package with the second alignment mark on the heat sink of the second package includes: The position information of the first alignment mark and the second alignment mark is obtained through the acquisition module; Based on the location information, the alignment relationship between the first package and the second package is determined.
10. The package according to claim 9, characterized in that, The step of aligning and mounting the first package and the second package based on the alignment result includes: The position information of the first alignment mark of the first package and the position information of the second alignment mark of the second package are converted to the same coordinate system to obtain the converted position information; Based on the converted position information, and taking the first alignment mark of the first package as a reference, an alignment position relationship is determined that makes the second alignment mark of the second package match the first alignment mark of the first package in space. The first package and the second package are configured based on the aforementioned alignment relationship.