Automatic packaging test device and method based on semiconductor integrated circuit processing

Abstract

The invention discloses an automatic packaging testing device and method based on semiconductor integrated circuit processing, and relates to the technical field of semiconductor testing. The automatic packaging testing device and method based on semiconductor integrated circuit processing comprise a shell, a control panel fixed on the front face of the shell, a conveying unit arranged in the shell and driven by a stepping motor and a chip body, and a regulation and control assembly for adjusting the operation number of detection interfaces according to the number of pins of the chip body is arranged in the shell. The adjusting assembly comprises a poke rod which is located above the conveying unit and is driven by external force to overturn and poke the chip body to move; the adjusting plate is positioned right above the conveying unit, is matched with the poke rod, and is used for changing the placement angle of the chip body to be attached to the detection interface; only the test channels matched with the current chip pins in number are activated, invalid operation on unused test interfaces is avoided, and system response time and resource waste are reduced.

Description

Technical Field

[0001] This invention relates to the field of semiconductor testing technology, specifically to an automated packaging and testing apparatus and method based on semiconductor integrated circuit processing. Background Technology

[0002] In the semiconductor industry, an integrated circuit (IC) refers to a miniature electronic circuit that integrates transistors, diodes, resistors, capacitors, and other components and their interconnections onto a small piece of semiconductor material (usually silicon) through a series of manufacturing processes. This process includes multiple steps such as design, wafer fabrication, wafer testing, dicing, packaging, and final testing. During processing, the packaged chips are typically subjected to comprehensive testing, including electrical performance, functional verification, and reliability testing. Currently, semiconductor IC processing usually employs a sampling + full inspection approach for packaging. However, full inspection suffers from the problem that the linear movement of robotic arms to pick up and place products prolongs the inspection interval, resulting in low inspection efficiency.

[0003] For example, the automated testing device for semiconductor production disclosed in announcement number CN117420409B has the problem of low testing efficiency due to the linear feeding method, where the previous device is removed after testing and the next device is placed, which prolongs the testing interval. The automated testing device for semiconductor components disclosed in announcement number CN100480715C, although it pre-classifies the products to be tested, still requires the previous device to be removed before the next device is placed during the full inspection process, which also has the problem of low testing efficiency due to the long testing interval. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides an automated packaging and testing device and method based on semiconductor integrated circuit processing, which solves the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an automated packaging and testing device based on semiconductor integrated circuit processing, comprising a housing, a control panel fixed to the front of the housing, a conveyor assembly driven by a stepper motor and placed inside the housing, and a chip body. The housing contains an adjustment component for adjusting the position of the chip body to be tested, a control component for adjusting the number of operating detection interfaces according to the number of pins on the chip body, and a detection component connected to the chip body for detection. The adjustment component includes:

[0006] The lever, located above the conveyor unit, flips and moves the chip body under external force.

[0007] The adjustment plate, located directly above the conveyor unit, works in conjunction with the toggle lever to change the placement angle of the chip body to fit the detection interface;

[0008] The control component includes:

[0009] The push rod, located above the adjustment plate, moves a fixed distance under external force according to the number of pins on the chip body, driving the corresponding number of detection interfaces to operate.

[0010] Preferably, the adjustment assembly further includes: a cylinder, one end of which is fixed to the top of the inner wall of the housing, driving the adjustment assembly to adjust the distance between the conveyor unit; a fixing plate, the top of which is fixed to the output end of the cylinder, providing support for the adjustment assembly; a support rod, the bottom of which is fixed to the top of the fixing plate; a mounting shaft, mounted on the support rod and movably inserted into the actuating rod, providing support for the actuating rod; and a movable shaft, mounted inside the actuating rod, driving the actuating rod to rotate around the mounting shaft as the axis.

[0011] Preferably, the adjustment assembly further includes: a sliding rod, the sidewall of which is connected to one end of the movable shaft to drive the movable shaft to move; a sliding sleeve, the sidewall of which is fixed to the sidewall of the support rod and sleeved outside the sliding rod to limit the movement direction of the sliding rod; a limiting rod, one end of which is fixed to the sidewall of the sliding rod and the other end of which slides through the sliding sleeve to guide the sliding rod; and a spring, one end of which is fixed to the sliding rod and the other end of which is fixed inside the sliding sleeve to provide elastic force for the sliding rod to reset.

[0012] Preferably, the adjustment assembly further includes: a guide seat, the bottom of which is fixed to the top of the support rod; a sliding seat, which is slidably mounted on the guide seat; a left electromagnet, the bottom of which is fixed to the top of the guide seat, and which magnetically engages with the sliding seat when energized; and a right electromagnet, the bottom of which is fixed to the guide seat, and which magnetically engages with the left electromagnet when energized.

[0013] Preferably, the control assembly further includes: a guide plate, one end of which is fixed to the side wall of the support rod; a strain rod, which is slidably inserted inside the guide plate; a push plate, the side wall of which is fixed to the strain rod; and a second spring, one end of which is fixed to the side wall of the guide plate and the other end of which is fixed to the push plate, providing elastic force for the push plate to reset.

[0014] Preferably, the control component further includes: a displacement sensor located directly above the pins of the chip body to measure the distance between them; an inflatable bladder, one end of which is fixed to the side wall of the push plate; a power bladder connected to the inflatable bladder via an air supply pipe, which can inflate under the drive of the push plate; a movable sleeve slidably mounted on the support rod, with its side wall abutting against the power bladder, and moving as the power bladder inflates and deflates; and a guide rod, one end of which is fixed to the movable sleeve, and the other end of which slides through the support rod to restrict the direction of movement of the movable sleeve.

[0015] Preferably, the detection assembly includes: a limiting sleeve, the bottom of which is installed on the top of the fixed plate; a sliding block, located directly below the push rod, which moves downward under the squeezing action of the push rod; a pressing rod, one end of which is fixed to the side wall of the sliding block and slides out from the limiting sleeve; a spring, one end of which is fixed to the top of the pressing rod and the other end of which is fixed inside the limiting sleeve, providing elastic force for the pressing rod to reset; and a moving block, the top of which abuts against the bottom of the pressing rod.

[0016] Preferably, the detection component further includes: a contact block, the bottom of which is fixed to one end of the movable block and moves with the movable block to communicate with the pins of the chip body; a spring, one end of which is fixed to the contact block; a wire, one end of which is connected to the contact block; and a mounting rod, one end of which is slidably inserted into the fixed plate and slidably connected to the movable block to restrict the movement direction of the movable block.

[0017] The present invention also provides a testing method applicable to an automated packaging and testing apparatus based on semiconductor integrated circuit processing, comprising the following steps:

[0018] S1. Place the chip to be tested on the conveyor unit, and control the conveyor unit through the control panel to transport the chip to the housing for testing;

[0019] S2. During the process of the chip body being transported to the preparatory position inside the housing, the control component detects the number of pins of the current chip body and controls the number of detection interfaces that the detection component will run.

[0020] S3. During the adjustment process, the control panel controls the operation of the adjustment components, so that the lever and the adjustment plate work together to adjust the position of the chip body.

[0021] S4. After adjustment, the conveyor unit will transport the current chip body to the detection position, where the detection component will perform the detection.

[0022] S5. While the current chip body moves toward the detection position, the next chip body to be detected is also transported to the preparation position.

[0023] S6. Repeat steps S1-S5 until the current shift ends.

[0024] Preferably, the flip angle of the lever is between 0 and 90°.

[0025] This invention provides an automated packaging and testing apparatus and method based on semiconductor integrated circuit fabrication. Compared with existing technologies, it has the following advantages:

[0026] (1) The automated packaging and testing device and method based on semiconductor integrated circuit processing can reduce the adjustment time at the detection position by pre-positioning and aligning the chip body, and can complete more detection tasks in a shorter time, thereby improving the overall production efficiency and adapting to a large number of chip body detection tasks. It helps to ensure that the probe test interface and the contact point on the chip body are accurately connected, reducing the contact failure or false test caused by position deviation, thereby improving the accuracy of the detection results, helping to extend the service life of the equipment and reduce maintenance costs.

[0027] (2) The automated packaging and testing device and method based on semiconductor integrated circuit processing only activates the test channels that match the number of pins of the current chip, avoids invalid operation on unused test interfaces, reduces system response time and resource waste, and the test equipment does not need to load all test configurations every time, but only loads the part that is actually needed, speeds up the test start-up speed, effectively improves the purity and stability of test signals, and does not participate in the test process for unnecessary test interfaces, which can reduce mechanical wear and the aging speed of electrical connectors, effectively reduce the power consumption of the whole machine, meet the needs of green manufacturing and energy-saving production, and the same test equipment can automatically adapt to chips with multiple pin numbers by adjusting the components, which improves the versatility and flexible production capability of the equipment. When adding more pin types of chips in the future, only the control logic needs to be adjusted, without replacing the entire test platform, which is convenient for expansion and upgrading.

[0028] (3) The automated packaging and testing device and method based on semiconductor integrated circuit processing greatly improves the applicability of the equipment. It eliminates the need to configure dedicated testing equipment for each type of chip, reducing the complexity of the production line and the cost of equipment investment. The testing components can automatically activate the corresponding number and position of testing interfaces according to the chip parameters (such as the number of pins and the package type) identified by the control components, realizing true "unmanned" operation. This not only improves the utilization rate and testing efficiency of the equipment, but also lays a solid foundation for future intelligent manufacturing and Industry 4.0 applications. It is one of the key technologies for modern semiconductor testing systems to move towards intelligence, flexibility and efficiency.

[0029] Other features and advantages of the invention will be set forth in the description which follows, and will be apparent in part from the description, or may be learned by practicing the invention. The objects and other advantages of the invention may be realized and obtained by means of the structures particularly pointed out in the written description and the accompanying drawings. Attached Figure Description

[0030] Figure 1 This is a schematic diagram of the overall structure of the present invention;

[0031] Figure 2 This is another perspective view of the overall structure of the present invention;

[0032] Figure 3 This is a diagram showing the internal structure of the housing of the present invention;

[0033] Figure 4 This is a structural diagram showing the position of the fixing plate of the present invention;

[0034] Figure 5 This is a schematic diagram of the combined state of the guide seat of the present invention;

[0035] Figure 6 This is a structural diagram showing the position of the mounting shaft in this invention;

[0036] Figure 7 This is an exploded view of the guide seat of the present invention;

[0037] Figure 8 This is a schematic diagram of the combined state of the guide rod of the present invention;

[0038] Figure 9 This is a schematic diagram showing the exploded state of the guide rod of the present invention;

[0039] Figure 10 This is a structural diagram showing the position of the limiting sleeve of the present invention;

[0040] Figure 11 This is a schematic diagram of the combined state of the pressure bar of the present invention;

[0041] Figure 12 This is a schematic diagram showing the disassembled state of the pressure bar of the present invention;

[0042] Figure 13 This is a structural diagram of the movable block of the present invention.

[0043] In the diagram: 1. Housing; 11. Control panel; 12. Conveyor unit; 13. Chip body; 2. Cylinder; 21. Fixing plate; 22. Support rod; 23. Mounting shaft; 24. Actuating rod; 25. Adjusting plate; 26. Movable shaft; 27. Sliding rod; 28. Limiting rod; 29. ​​Spring 1; 210. Sliding sleeve; 211. Guide seat; 212. Sliding seat; 213. Left electromagnet; 214. Right electromagnet; 3. Guide plate; 31. Strain gauge; 32. Spring 2; 33. Push plate; 34. Inflatable bladder; 35. Air supply pipe; 36. Power bladder; 37. Moving sleeve; 38. Guide rod; 39. Push rod; 4. Limiting sleeve; 41. Sliding block; 42. Pressing rod; 43. Spring 3; 44. Moving block; 45. Spring 4; 46. Contact block; 47. Wire; 48. Mounting rod. Detailed Implementation

[0044] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0045] The devices or elements referred to in the embodiments of this application or implied herein must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the embodiments of this application. In the description of the embodiments of this application, "a plurality of" means two or more, unless otherwise precisely specified.

[0046] Please see Figures 1 to 7 The present invention provides the following technical solutions:

[0047] Example 1: An automated packaging and testing device based on semiconductor integrated circuit processing includes a housing 1, a control panel 11 fixed on the front of the housing 1, a conveyor group 12 driven by a stepper motor and placed inside the housing 1, and a chip body 13. The housing 1 is provided with an adjustment component for adjusting the position of the chip body 13 to be tested, a control component for adjusting the number of test interface operations according to the number of pins of the chip body 13, and a test component that communicates with the chip body 13 to perform the test.

[0048] The adjustment assembly includes: one end of a cylinder 2 fixedly mounted on the top of the inner wall of the housing 1, the cylinder 2 being used to drive the adjustment assembly to adjust the distance between it and the conveyor group 12; the top of a fixing plate 21 fixedly mounted on the output end of the cylinder 2, the fixing plate 21 being used to provide support for the adjustment assembly; the bottom of a support rod 22 fixedly mounted on the top of the fixing plate 21; one end of a mounting shaft 23 fixedly mounted on the support rod 22, the mounting shaft 23 being movably inserted into a toggle rod 24 via a bearing, the mounting shaft 23 being used to provide support for the toggle rod 24; the toggle rod 24 being located above the conveyor group 12, the toggle rod 24 being able to rotate and move the chip body 13 under external force; an adjustment plate 25 being located directly above the conveyor group 12, the adjustment plate 25 cooperating with the toggle rod 24 to change the placement angle of the chip body 13 to fit the detection interface; one end of a movable shaft 26 slidably mounted inside the toggle rod 24, the movable shaft 26 being able to drive the toggle rod 24 to rotate around the mounting shaft 23; and a sliding rod 27 being slidably mounted on the side of the sliding rod 27. The wall is fixedly connected to one end of the movable shaft 26. The sliding rod 27 can drive the movable shaft 26 to move. The side wall of the sliding sleeve 210 is fixedly installed on the side wall of the support rod 22. The sliding sleeve 210 is fixedly connected to the sliding rod 27. One end of the limiting rod 28 is fixedly installed on the side wall of the sliding rod 27. The other end of the limiting rod 28 slides through the sliding sleeve 210. The limiting rod 28 is used to guide the sliding rod 27. One end of the spring 29 is fixedly installed on the sliding rod 27. The other end of the spring 29 is fixedly installed in the sliding sleeve 210. The spring 29 can provide elastic force for the sliding rod 27 to reset. The bottom of the guide seat 211 is fixedly installed on the top of the support rod 22. The sliding seat 212 slides through the guide seat 211. The bottom of the left electromagnet 213 is fixedly installed on the top of the guide seat 211. After being energized, it is magnetically engaged with the sliding seat 212. The bottom of the right electromagnet 214 is fixedly installed on the guide seat 211. After being energized, it is magnetically engaged with the left electromagnet 213.

[0049] In use, the chip body 13 to be tested is placed on the conveyor group 12, and the drive element of the conveyor group 12 is controlled by the control panel 11. The drive element is a stepper motor, so that the conveyor group 12 drives the chip body 13 to move regularly towards the detection position under the drive of the stepper motor.

[0050] When the chip body 13 moves to the ready position under the conveyor 12, the cylinder 2 drives the fixing plate 21 to move downward. The fixing plate 21 drives the support rod 22 to move downward synchronously. The support rod 22 drives the mounting shaft 23 and the adjusting plate 25 to move downward synchronously. At the same time, during the intervals of the stepper motor's operation, the control panel 11 controls the left electromagnet 213 and the right electromagnet 214 to be energized. After being energized, the left electromagnet 213 and the sliding seat 212 are magnetically attracted, and the right electromagnet 214 and the sliding seat 212 are magnetically repelled. This allows the sliding seat 212 to move away from the fixing plate 21. The sliding seat 212 and the guide seat 211 are slidably engaged, so that the sliding seat 212 drives the sliding sleeve 210 to move linearly along the guide seat 211 in sync. The sliding sleeve 210 drives the sliding rod 27 to move. The sliding rod 27 and the sliding sleeve 210 are fixedly connected. The sliding rod 27 drives the movable shaft 26 to move. The movable shaft 26 drives the actuating rod 24 to move. Through the arc-shaped groove on the side wall of the actuating rod 24, the movable shaft 26 can slide along the arc-shaped groove while still applying a squeezing force to the actuating rod 24 during the flipping process, so that the actuating rod 24 flips around the mounting shaft 23 as the axis.

[0051] By cooperating with the lever 24 and the adjustment plate 25, the chip body 13 to be tested is clamped and its position is adjusted. After the adjustment, the stepper motor drives the conveyor 12 to run once more to transport the adjusted chip body 13 to the testing position for testing.

[0052] It should be understood that the figure only shows one embodiment of the cooperation mode between the movable shaft 26 and the actuating lever 24. In other embodiments, the cooperation between the movable shaft 26 and the actuating lever 24 may also have other forms:

[0053] The arc-shaped groove on the side wall of the actuating rod 24 is removed, and the sliding rod 27 is slidably connected to the sliding sleeve 210. The movable shaft 26 and the actuating rod 24 are movably connected by a bearing. At the same time, the sliding rod 27 and the sliding sleeve 210 are elastically connected by a spring 29. When the sliding rod 27 pushes the movable shaft 26 to drive the actuating rod 24 to rotate around the mounting shaft 23, the sliding rod 27 bends upward out of the sliding sleeve 210.

[0054] A limiting rod 28 can also be set on the sliding rod 27. The limiting rod 28 slides with the sliding sleeve 210, so that the limiting rod 28 can guide and limit the sliding rod 27. When the sliding rod 27 is bent, it slides along the arc track inside the sliding sleeve 210, so that the sliding rod 27 can push the toggle rod 24 to fold, thereby cooperating with the adjustment plate 25 to clamp and position the chip body 13.

[0055] Please see Figures 8 to 9The present invention provides the following technical solutions:

[0056] The technical solution that differs from the previous embodiments includes: a control component is provided inside the housing 1 to adjust the number of operating detection interfaces according to the number of pins on the chip body 13;

[0057] The control assembly includes: one end of a guide plate 3 is fixedly mounted on the side wall of a support rod 22; one end of a strain rod 31 slides through the guide plate 3; the side wall of a push plate 33 is fixedly mounted on the strain rod 31; one end of a second spring 32 is fixedly mounted on the side wall of the guide plate 3, and the other end of the second spring 32 is fixedly mounted on the push plate 33, providing elastic force for the push plate 33 to reset; one end of an inflatable bladder 34 is fixedly mounted on the side wall of the push plate 33; a power bladder 36 is connected to the inflatable bladder 34 via an air supply pipe 35, and the power bladder 36 can inflate under the drive of the push plate 33; and a movable sleeve 37 is slidably mounted on the support rod 22, with its side wall having an inclined surface and sliding resistance. Connected to the power bag 36, the movable sleeve 37 can move as the power bag 36 expands and deflates. One end of the guide rod 38 is fixedly installed on the movable sleeve 37, and the other end of the guide rod 38 slides through the support rod 22. The guide rod 38 is used to limit the movement direction of the movable sleeve 37. A reset spring is fixedly installed on the side wall of the movable sleeve 37, and the other end of the reset spring is fixed in the support rod 22 to provide elastic force for the movable sleeve 37 to reset. The push rod 39 is located above the adjustment plate 25. One end of the push rod 39 is fixedly installed on the side wall of the movable sleeve 37. The push rod 39 can move a fixed distance according to the number of pins of the chip body 13 under the drive of external force to drive the operation of the corresponding number of detection interfaces.

[0058] In use, during the process of transporting the chip body 13 from outside the housing 1 to the preparatory position, the strain rod 31 abuts against the pins of the chip body 13, allowing the strain rod 31 to move with the movement of the chip body 13, thereby driving the push plate 33 to move. The push plate 33 squeezes the inflation bag 34 to deflate, thereby allowing the inflation bag 34 to supply air to the power bag 36 through the air supply pipe 35, causing the power bag 36 to inflate. The inflated power bag 36 squeezes the moving sleeve 37 to move. Through the sliding cooperation between the guide rod 38 and the support rod 22, the moving sleeve 37 can only move in a straight line when moving under the action of external force. At the same time, the moving sleeve 37 synchronously drives the push rod 39 to move, so that the push rod 39 can control the number of test components activated on the fixed plate 21.

[0059] In another embodiment, distinct from the foregoing embodiments, the guide plate 3 and the strain rod 31 are no longer connected as described above. Figure 8Instead of the horizontal arrangement shown, the contact points between the guide plate 3 and the strain rod 31, as well as the push plate 33 and the inflation bag 34, are all arranged vertically. This allows the strain rod 31 to move upward slightly when it comes into contact with the pin, until the pin separates from the strain rod 31. Then, the strain rod 31 is driven downward by the second spring 32. The push plate 33 moves back and forth, causing the inflation bag 34 to continuously deflate and expand. The number of deflations matches the number of pins on the chip body 13, thereby controlling the expansion of the power bag 36 so that the movement distance of the push rod 39 is just enough to control the number of test components that can be activated and match the number of pins.

[0060] In another embodiment, different from the aforementioned embodiment, the strain gauge 31 is replaced with a displacement sensor, and a displacement sensor is provided at the guide plate 3. Figure 8 The electromagnet group moving horizontally, as shown, detects the distance between the support rod 22 and the conveyor group 12 through a displacement sensor. When the chip body moves to the preparatory position, the pin passes directly below the displacement sensor. At this time, the measured value of the displacement sensor will undergo a change. Based on the number of changes, the electromagnet group drives the push plate 33 to move, causing the airbag 34 to continuously deflate and expand. Similarly, when the airbag 34 deflates, gas is input into the power bag 36 through a one-way valve and an air supply pipe 35. When the airbag 34 expands, external air enters the airbag 34 through a one-way valve, thereby controlling the expansion of the power bag 36 so that the moving distance of the push rod 39 can be matched with the number of activated test components and the number of pins.

[0061] Please see Figures 10 to 13 The present invention provides the following technical solutions:

[0062] The technical solution of this embodiment that differs from the previous embodiment includes: a detection component that communicates with the chip body 13 for detection is provided inside the housing 1;

[0063] The detection assembly includes: a limiting sleeve 4 located to the side of the sliding block 41, the sliding block 41 located directly below the push rod 39, the sliding block 41 being able to move downwards under the squeezing action of the push rod 39; one end of the pressing rod 42 being fixedly mounted on the side wall of the sliding block 41 and sliding out through the limiting sleeve 4; one end of the spring 43 being fixedly mounted on the top of the pressing rod 42, the other end of the spring 43 being fixedly mounted inside the limiting sleeve 4, the spring 43 providing elastic force for the pressing rod 42 to reset; and the top of the moving block 44. The part slides against the bottom of the pressure rod 42. The bottom of the contact block 46 is fixedly installed on one end of the moving block 44. The contact block 46 can move with the moving block 44 and communicate with the pins of the chip body 13. One end of the spring 45 is fixedly installed on the contact block 46. One end of the wire 47 is connected to the contact block 46. One end of the mounting rod 48 slides through the fixed plate 21. The inner wall of the mounting rod 48 is slidably connected to the moving block 44. The mounting rod 48 can limit the movement direction of the moving block 44.

[0064] In use, after determining the number of pins on the chip body 13, the push rod 39 moves adaptively a certain distance. The inclined surface of the push rod 39 first slides against the inclined surface of the sliding block 41, causing the sliding block 41 to push the pressing rod 42 to move. The pressing rod 42 slides against the limiting sleeve 4, allowing it to move only in a straight line. Then, the bottom of the push rod 39 slides against the top of the sliding block 41, maintaining the sliding block 41 at this height. After the pressing rod 42 moves downward, the inclined surface at the bottom of the pressing rod 42 slides against the inclined surface at the top of the moving block 44, and the moving block 44 slides against the mounting rod 48. The moving block 44 moves towards the side where the chip body 13 is located. The moving block 44 drives the contact block 46 to move synchronously. The contact block 46 makes contact with the pin and is connected by wires. Then, the control panel 11 can be used to start the test and determine whether the chip body 13 is qualified or unqualified. After the test is completed, the control panel 11 controls the solenoid valve on the power bag 36 to open and release the air in the power bag 36. Then, the sliding block 41 separates from the push rod 39. The pressing rod 42 returns to the initial position under the action of the spring 3 43. At the same time, the contact block 46 also retracts into the mounting rod 48 under the action of the spring 45, waiting for the next use.

[0065] Furthermore, the mounting rod 48 is slidably fitted with the fixing plate 21, and a driving component is installed on the mounting rod 48, so that the mounting rod 48 can move linearly along the fixing plate 21 under the drive of the driving component, thereby adapting to the detection requirements of chips of various sizes.

[0066] In one embodiment, a contact block 46 is also installed on the side wall of the pressure rod 42. After the pressure rod 42 moves down, the two contact blocks 46 cooperate with each other and make contact with the pin to perform testing. At this time, a mounting plate is fixedly installed at the bottom of the limit sleeve 4, and another driving cylinder 2 is fixedly installed at the top of the mounting plate.

[0067] In one embodiment, only one contact block 46 is provided inside the mounting rod 48, so that the contact blocks 46 on both sides of the chip body 13 move closer to the chip body 13 under the drive of the corresponding pressing rod 42, thereby completing the contact with the pin. At this time, the bottom of the limiting sleeve 4 is directly fixedly installed on the top of the fixing plate 21.

[0068] This invention also provides a testing method suitable for automated packaging and testing apparatus based on semiconductor integrated circuit processing, comprising the following steps:

[0069] S1. Place the chip body 13 to be tested on the conveyor group 12, and control the conveyor group 12 through the control panel 11 to transport the chip body 13 into the housing 1 for testing;

[0070] S2. During the process of the chip body 13 being transported to the preparatory position inside the housing 1, the control component detects the number of pins of the current chip body 13 and controls the number of detection interfaces that the detection component will run.

[0071] S3. During the adjustment process, the control panel 11 controls the operation of the adjustment components, so that the lever 24 and the adjustment plate 25 cooperate to adjust the position of the chip body 13.

[0072] S4. After adjustment, the current chip body 13 is transported to the detection position by the conveyor group 12, and the detection component performs the detection.

[0073] S5. When the current chip body 13 moves to the detection position, the next chip body 13 to be detected is also transported to the preparation position.

[0074] S6. Repeat steps S1-S5 until the current shift ends.

[0075] The flip angle of the lever 24 is between 0 and 90°.

[0076] Furthermore, any content not described in detail in this specification is existing technology known to those skilled in the art.

[0077] It should be noted that, in this document, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.

[0078] Parallelism: The parallelism defined in this application is not limited to absolute parallelism. This definition of parallelism can be understood as basic parallelism. It allows for situations where the parallelism is not absolute due to factors such as assembly tolerance, design tolerance, and structural flatness. It also allows for errors within a small angular range, such as within 10 degrees of assembly error. These can all be considered as parallel relationships.

[0079] Perpendicularity: The perpendicularity defined in this application is not limited to an absolute perpendicular intersection (with an included angle of 90 degrees). It is permissible for non-absolute perpendicular intersections caused by factors such as assembly tolerances, design tolerances, and structural flatness. It is permissible for errors within a small angular range, such as an assembly error range of 80 to 100 degrees, which can all be understood as a perpendicular relationship.

[0080] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. An automated packaging and testing device based on semiconductor integrated circuit processing, comprising a housing (1), a control panel (11) fixed to the front of the housing (1), a conveyor assembly (12) driven by a stepper motor and placed inside the housing (1), and a chip body (13), characterized in that, The housing (1) is provided with an adjustment component for adjusting the position of the chip body (13) to be tested, a control component for adjusting the number of operating detection interfaces according to the number of pins of the chip body (13), and a detection component that communicates with the chip body (13) for detection. The adjustment component includes: The lever (24) is located above the conveyor group (12) and flips to move the chip body (13) under the drive of external force; The adjustment plate (25) is located directly above the conveyor unit (12) and works in conjunction with the toggle lever (24) to change the placement angle of the chip body (13) to fit the detection interface; The control component includes: The push rod (39), located above the adjustment plate (25), moves a fixed distance according to the number of pins on the chip body (13) under the drive of external force, driving the corresponding number of detection interfaces to operate.

2. The automated packaging and testing device based on semiconductor integrated circuit processing according to claim 1, characterized in that, The adjustment component also includes: The cylinder (2) is fixed at one end to the top of the inner wall of the housing (1) and drives the adjustment assembly to adjust the distance between the assembly and the conveyor unit (12). The top of the fixed plate (21) is fixed to the output end of the cylinder (2) to provide support for the adjustment assembly; The support rod (22) is fixed at the top of the fixing plate (21) at its bottom; The mounting shaft (23) is mounted on the support rod (22) and movably passes through the actuating rod (24) to provide support for the actuating rod (24); The movable shaft (26) is installed inside the lever (24) and drives the lever (24) to rotate around the mounting shaft (23).

3. The automated packaging and testing device based on semiconductor integrated circuit processing according to claim 2, characterized in that, The adjustment component also includes: The sliding rod (27) has its side wall connected to one end of the movable shaft (26), which drives the movable shaft (26) to move. The sliding sleeve (210) has its sidewall fixed to the sidewall of the support rod (22) and is fitted over the sliding rod (27) to restrict the movement direction of the sliding rod (27). The limiting rod (28) is fixed at one end to the side wall of the sliding rod (27), and the other end slides through the sliding sleeve (210) to guide the sliding rod (27); Spring 1 (29) has one end fixed to the sliding rod (27) and the other end fixed inside the sliding sleeve (210), providing elastic force for the sliding rod (27) to reset.

4. The automated packaging and testing device based on semiconductor integrated circuit processing according to claim 2, characterized in that, The adjustment component also includes: The guide seat (211) is fixed at the bottom to the top of the support rod (22); The sliding seat (212) is slidably mounted on the guide seat (211); The left electromagnet (213) is fixed at the top of the guide seat (211) and magnetically engages with the sliding seat (212) after being energized. The right electromagnet (214) is fixed at the bottom on the guide seat (211) and magnetically engages with the left electromagnet (213) after being energized.

5. The automated packaging and testing apparatus based on semiconductor integrated circuit processing according to claim 1, characterized in that, The control component also includes: The guide plate (3) is fixed at one end to the side wall of the support rod (22); The strain gauge (31) is slidably inserted inside the guide plate (3); The push plate (33) is fixed to the strain rod (31) by its sidewall; Spring 2 (32) has one end fixed to the side wall of the guide plate (3) and the other end fixed to the push plate (33), providing elastic force for the push plate (33) to reset.

6. The automated packaging and testing apparatus based on semiconductor integrated circuit processing according to claim 5, characterized in that, The control component also includes: The displacement sensor is located directly above the pin of the chip body (13) and measures the distance between them; An inflatable bladder (34) is fixed at one end to the side wall of a push plate (33); The power bag (36) is connected to the inflatable bag (34) through the air supply pipe (35) and can expand under the drive of the push plate (33); The movable sleeve (37) is slidably mounted on the support rod (22), and its side wall abuts against the power bag (36). It moves as the power bag (36) expands and deflates. The guide rod (38) is fixed at one end to the movable sleeve (37) and slidably inserted into the support rod (22) at the other end, thus restricting the movement direction of the movable sleeve (37).

7. The automated packaging and testing apparatus based on semiconductor integrated circuit processing according to claim 1, characterized in that, The detection component includes: The limiting sleeve (4) is installed at the bottom of the fixed plate (21) on top; The sliding block (41) is located directly below the push rod (39) and moves downward under the squeezing action of the push rod (39); The pressure rod (42) is fixed at one end to the side wall of the sliding block (41) and slides out from the limiting sleeve (4); Spring 3 (43) has one end fixed to the top of the lower pressure rod (42) and the other end fixed inside the limiting sleeve (4), providing elastic force for the lower pressure rod (42) to reset; The top of the moving block (44) abuts against the bottom of the pressing rod (42).

8. The automated packaging and testing apparatus based on semiconductor integrated circuit processing according to claim 1, characterized in that, The detection component also includes: The contact block (46) is fixed at one end of the moving block (44) and moves with the moving block (44) to communicate with the pins of the chip body (13); Spring 4 (45) has one end fixed to the contact block (46); One end of the wire (47) is connected to the contact block (46); The mounting rod (48) has one end slidably inserted into the fixed plate (21), and its inner wall is slidably connected to the moving block (44), thus restricting the moving direction of the moving block (44).

9. A testing method applicable to the automated packaging and testing apparatus based on semiconductor integrated circuit processing as described in any one of claims 1-8, characterized in that, Includes the following steps: S1. Place the chip body (13) to be tested on the conveyor group (12) and control the conveyor group (12) through the control panel (11) to transport the chip body (13) into the housing (1) for testing; S2. During the process of the chip body (13) being transported to the pre-position in the housing (1), the control component detects the number of pins of the current chip body (13) and controls the number of detection interfaces to be run by the detection component. S3. During the adjustment process, the control panel (11) controls the operation of the adjustment component, so that the lever (24) and the adjustment plate (25) cooperate to adjust the position of the chip body (13); S4. After adjustment, the current chip body (13) is transported to the detection position by the conveyor unit (12) and detected by the detection component; S5. When the current chip body (13) moves to the detection position, the next chip body (13) to be detected is also transported to the preparation position. S6. Repeat steps S1-S5 until the current shift ends.

10. The detection method of the automated packaging and testing device based on semiconductor integrated circuit processing according to claim 9, characterized in that: The flip angle of the lever (24) is between 0 and 90°.

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