Vacuumized memory bank temperature testing device and testing method thereof
By utilizing a vacuum-assisted memory module temperature testing device, the accuracy and efficiency issues of existing memory module temperature testing technologies are solved through the use of a vacuum environment and automated operation, achieving efficient and reliable temperature testing.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-11-21
- Publication Date
- 2026-03-13
AI Technical Summary
Existing memory module temperature testing methods suffer from several drawbacks, including the inability to effectively isolate ambient moisture and dust, the potential for temperature gradients due to localized heating, the risk of condensation, and the complexity and inconvenience of device assembly and disassembly, resulting in low testing accuracy and efficiency.
The memory module temperature testing device employs vacuum extraction, including a base, a sealing cover, a vacuum module, a high and low temperature airflow meter, and a pushing mechanism. Through a vacuum environment, heat-conducting sheets, and automated operation, it ensures temperature uniformity and sealing, enabling efficient and reliable testing of memory modules.
It improves the accuracy and reliability of memory module temperature testing, simplifies the operation process, increases testing efficiency, and ensures the stability of the sealed environment and the durability of the vacuum state.
Smart Images
Figure CN121658299A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of electronic component reliability testing technology, and in particular to a vacuum-evacuated memory module temperature testing device and its testing method. Background Technology
[0002] Currently, reliability testing of memory modules under high and low temperature environments mainly employs methods such as open-type constant temperature chamber testing, local heater testing, and closed-chamber testing. Open-type testing places the motherboard under test in a large constant temperature chamber, which is low-cost but easily affected by external environmental interference. Local heating achieves rapid temperature changes by attaching additional heat films, but temperature uniformity is difficult to guarantee. Although closed-chamber testing can improve sealing, it poses the risks of inconvenience in disassembly and assembly and condensation accumulation. These methods have different focuses in terms of equipment form and control means, forming the basic technical solutions in this field.
[0003] However, existing technologies still have significant shortcomings: open-circuit testing cannot effectively isolate ambient moisture and dust; localized heating methods easily create temperature gradients on the surface of memory modules, affecting test accuracy; conventional closed-circuit testing inevitably leads to internal condensation during temperature cycling, posing a short-circuit risk; furthermore, most devices are complex in structure and bulky, resulting in inefficient sample replacement and failing to meet high-throughput testing requirements. These issues collectively limit the accuracy and efficiency of memory module temperature testing. Summary of the Invention
[0004] The purpose of this application is to provide a vacuum-evacuated memory module temperature testing device and method to solve the problems in the background art.
[0005] The vacuum-assisted memory module temperature testing device provided in this application adopts the following technical solution: it includes a base, a set of sealing covers connected to the top and rear end of the base, a set of vacuum modules connected to the top and middle of the sealing covers, a set of high and low temperature airflow meters provided at both the front and rear ends of the vacuum modules, and at least two sets of heat-conducting plates equally spaced on the bottom surface of the two sets of high and low temperature airflow meters, the bottom ends of the heat-conducting plates extending through into the sealing covers, and a pushing mechanism provided at the top and middle of the base; The pushing mechanism includes a moving groove, a material ejection mechanism, a testing platform, a fixing groove, and a locking mechanism. A set of moving grooves is located at the top center of the base, and a set of testing platforms is located within the moving grooves. The bottom ends of the testing platforms are connected to the moving grooves via the material ejection mechanism. A set of fixing grooves is located at the front bottom center of the moving grooves, and a set of locking mechanisms is located at the bottom of the fixing grooves. By adopting the above technical solution, the base and sealing cover can provide a sealed space for testing memory modules, the vacuum module can extract air to form a vacuum environment, the high and low temperature airflow meter and heat conduction plate can control the temperature inside the sealing cover, and the pushing mechanism facilitates the installation and unloading of memory modules, thus realizing the function of temperature testing of memory modules in a vacuum environment, which has the advantages of improving test accuracy and reliability.
[0006] Preferably, the bottom front end of the sealing cover is provided with a set of extension plates corresponding to the fixing grooves, and the bottom front end of the extension plates is connected to a set of fixing blocks.
[0007] By adopting the above technical solution, the extension plate and the fixing block can cooperate through the fixing groove and the locking mechanism to strengthen the connection between the sealing cover and the test platform, thereby ensuring the sealing effect, ensuring the integrity of the vacuum environment, and preventing air leakage.
[0008] Preferably, the unloading mechanism includes a first slide groove, a second slide groove, a screw, a slider, and a first drive motor. A first slide groove is provided at the middle of the bottom surface of the moving groove, and a second slide groove is provided at both the left and right ends of the first slide groove. A screw is provided inside the first slide groove, and a slider is connected to the outside of the screw. A first drive motor is connected to the rear end of the screw.
[0009] By adopting the above technical solution, the screw in the first slide can drive the slider and the test platform to move back and forth under the drive of the first drive motor, which facilitates the placement and removal of memory modules, realizes automated operation, and reduces the tediousness and inconvenience of manual operation.
[0010] Preferably, the bottom middle of the test platform is connected to the top of the slider, the middle of the top surface of the test platform is provided with a slot module, the outer side of the top surface of the test platform is provided with a sealing ring, and the rear ends of the left and right sides of the test platform are each hinged with a set of linkage arms, the other ends of the two sets of linkage arms are respectively connected to the front bottom ends of the left and right sides of the sealing cover.
[0011] By adopting the above technical solution, the slot module is used to fix and install memory modules, the sealing ring can ensure the sealing effect with the sealing cover, and the linkage arm can drive the sealing cover to automatically rise and fall when the test platform moves, realizing the linkage function between the test platform and the sealing cover, which has the advantages of automatic sealing and simplified operation.
[0012] Preferably, the locking mechanism includes a movable groove, a moving part, a rack, a gear, and a second drive motor. A set of movable grooves is provided at the front bottom end of the base corresponding to the fixed groove. A set of moving parts is provided at the top of the movable grooves. A rack is provided at the left end of the bottom surface of the moving parts. A gear corresponding to the rack is provided on the outside of the movable grooves. A set of second drive motors is connected to the rear end of the gears.
[0013] By adopting the above technical solution, the second drive motor drives the moving part to move along the movable groove through gears, so that the moving part can move into the fixed groove and clamp the fixed block, thus realizing the reliable locking of the locking mechanism. It has the advantage of ensuring that the sealing cover remains closed during the test and preventing incomplete sealing.
[0014] Preferably, the movable groove has a "Y" shaped structure, with its left and right top ends respectively connected to the left and right sides of the fixed groove.
[0015] By adopting the above technical solution, the top left and right ends of the movable groove are connected to the fixed groove, which is beneficial for the movable part to move into the fixed groove, thereby improving the moving efficiency and locking stability of the movable part.
[0016] Preferably, the movable component has a "C" shaped structure, and a set of guide grooves is provided at both the front and rear of the movable component, and the left ends of both sets of guide grooves are connected to the outside.
[0017] By adopting the above technical solution, the "C"-shaped structure allows the moving part to move along a fixed path, and the guide groove can further enhance the movement stability of the moving part, ensure the stable clamping of the moving part, prevent the sealing cover from loosening, and enhance the locking force.
[0018] Preferably, the front and rear top ends of the movable groove are provided with guide members corresponding to guide grooves.
[0019] Preferably, the sealing cover has a double-layer structure, with the inner layer being the test box and the outer layer being the temperature chamber cover.
[0020] By adopting the above technical solution, the inner test chamber works together with the outer temperature chamber cover to maintain a stable internal temperature, which can effectively reduce the temperature interference of the external environment on the test environment.
[0021] A method for testing the temperature of a vacuum-evacuated memory module includes the following steps: S1: Insert the memory module into the slot module; S2: The drive motor moves the test platform backward via a screw; S3: When the test platform moves backward, the sealing cover is pulled down by the linkage arm to cover the slot module and memory module; S4: Drive motor 2 drives the moving parts to rotate and clamp the fixed block; S5: The vacuum module extracts the air from the sealed cover to create a vacuum environment; S6: The heat-conducting sheet is heated or cooled by a high and low temperature airflow meter, which changes the temperature inside the sealed cover, thereby improving the detection reliability of the memory module. S7: After the test is completed, the moving part is reset by the second drive motor, and the sealing cover is released; S8: The drive motor moves the test platform forward via the screw. At the same time, the linkage arm lifts the sealing cover and sends the memory module out of the top surface of the base, completing the test.
[0022] In summary, this application includes at least one of the following beneficial technical effects: 1. This application utilizes a material ejection mechanism and a testing platform set in a moving trough. The material ejection mechanism includes components such as a slide 1, a slide 2, a screw, a slider, and a drive motor 1. The drive motor 1 drives the testing platform to move precisely within the moving trough via the screw and slider, and achieves synchronous automatic opening and closing of the sealing cover through a linkage arm. This facilitates the storage and retrieval of memory modules, integrates the transfer of workpieces and the opening and closing of the testing environment into a single continuous action, and realizes automated operation of the testing process. This avoids the problem of incomplete sealing that may occur when manually fastening the sealing cover, and significantly improves the operating efficiency and reliability of the testing process. 2. This application utilizes a sealing cover located at the top of the base. The sealing cover has a double-layer structure consisting of an inner test chamber and an outer temperature chamber cover. Combined with the sealing ring on the test platform, it forms basic physical insulation and sealing. Furthermore, the vacuum module can actively extract the air from the sealed space, greatly eliminating the interference of air convection and oxidation on temperature conduction. At the same time, the high and low temperature airflow meters distributed at the front and rear ends of the top of the sealing cover transfer heat or cold to the sealed space through multiple sets of heat-conducting plates, ensuring the uniformity of the temperature field in the vacuum environment. This provides the memory module with near-ideal test conditions, making the temperature stress test results more accurate and reliable. 3. This application utilizes a locking mechanism located at the bottom of the fixed groove. The locking mechanism includes components such as a movable groove, a moving part, a rack, a gear, and a drive motor. This effectively ensures a stable seal in the sealing area during the testing phase. When the sealing cover is closed, the extension plate and the fixed block at the front bottom extend into the fixed groove and are moved to the top of the fixed block by the moving part. The moving part uses its inner flange to firmly press the fixed block from above, effectively preventing gaps in the sealing environment caused by incomplete sealing of the sealing cover. This effectively ensures the durability and stability of the sealing state during the testing process. Attached Figure Description
[0023] Figure 1 This is a schematic diagram of the structure of this application; Figure 2 This is a partial structural diagram of the sealing cover of this application; Figure 3 This is a schematic diagram of the push mechanism structure of this application; Figure 4 This is a top view of the push mechanism in this application; Figure 5 yes Figure 4 Schematic diagram of the AA section structure; Figure 6This is a front view structural diagram of the locking mechanism of this application; Explanation of reference numerals in the attached drawings: 1. Base; 2. Sealing cover; 3. Vacuum module; 4. High and low temperature airflow meter; 5. Heat-conducting plate; 6. Pushing mechanism; 21. Extension plate; 22. Fixing block; 61. Moving groove; 62. Unloading mechanism; 63. Test platform; 64. Fixing groove; 65. Locking mechanism; 621. Slide groove one; 622. Slide groove two; 623. Screw; 624. Slider; 625. Drive motor one; 631. Slot module; 632. Sealing ring; 633. Linkage arm; 651. Movable groove; 652. Moving part; 653. Rack; 654. Gear; 655. Drive motor two. Detailed Implementation
[0024] The following is in conjunction with the appendix Figure 1 -Appendix Figure 6 This application will be described in further detail below.
[0025] A vacuum-assisted memory module temperature testing device, referenced Figures 1-3 The system includes a base 1, with a set of sealing covers 2 hinged to the top and rear end of the base 1. The sealing covers 2 can be rotated to cover or unfold the memory module. The sealing covers 2 have a double-layer structure, with the inner layer being a test box and the outer layer being a temperature chamber cover. The inner test box and the outer temperature chamber cover work together to maintain a stable internal temperature and effectively reduce the temperature interference of the external environment on the test environment. A set of vacuum modules 3 for extracting air is connected to the top middle of the sealing covers 2. A set of high and low temperature airflow meters 4 is provided at both the front and rear ends of the vacuum modules 3. The bottom surfaces of the two sets of high and low temperature airflow meters 4 are provided with no less than two sets of heat-conducting plates 5 at equal intervals. The bottom ends of the heat-conducting plates 5 extend through into the sealing covers 2. The high and low temperature airflow meters 4 can control the temperature of the test environment inside the sealing covers 2 by heating or cooling the heat-conducting plates 5. The top middle of the base 1 is provided with a pushing mechanism 6 for pushing the memory module.
[0026] Specifically, the base 1 and the sealing cover 2 provide a sealed space for testing the memory module, the vacuum module 3 can extract air to form a vacuum environment, the high and low temperature airflow meter 4 and the heat-conducting plate 5 can control the temperature inside the sealing cover 2, and the pushing mechanism 6 facilitates the installation and unloading of the memory module. This realizes the function of temperature testing of the memory module in a vacuum environment, which has the advantages of improving the accuracy and reliability of the test.
[0027] Reference Figures 3-5The pushing mechanism 6 includes a moving groove 61, a material ejection mechanism 62, a testing platform 63, a fixing groove 64, and a locking mechanism 65. A set of moving grooves 61 is provided at the top center of the base 1. A set of testing platforms 63 is slidably connected in the moving grooves 61. The bottom end of the testing platform 63 is connected to the moving grooves 61 through the material ejection mechanism 62. Under the drive of the material ejection mechanism 62, it can move back and forth along the moving grooves 61. A set of fixing grooves 64 is provided at the front bottom center of the moving grooves 61. When the testing platform 63 moves backward to the rear end of the moving grooves 61, the front end face of the testing platform 63 is flush with the rear end face inside the fixing groove 64, which is beneficial to the connection of the extension plate 21. A set of locking mechanisms 65 is provided at the bottom of the fixing groove 64 to enhance the sealing effect.
[0028] Specifically, the moving groove 61 provides a guide path for the test platform 63, and the unloading mechanism 62 can drive the test platform 63 to move within the moving groove 61 to facilitate loading and unloading operations. The fixed groove 64 cooperates with the locking mechanism 65 to fix the sealing cover 2 during testing, ensuring the stability and sealing of the device during the testing process. This realizes the automatic transfer and precise positioning function of the test platform 63, and has the advantages of high integration and convenient operation.
[0029] Reference Figure 1 , Figure 5 and Figure 6 The sealing cover 2 has a set of extension plates 21 corresponding to the fixing groove 64 fixedly connected to the front bottom end of the sealing cover 2. After the sealing cover 2 is rotated and attached to the top surface of the sealing ring 632, the bottom end of the extension plate 21 can extend into the fixing groove 64. The front bottom end of the extension plate 21 is fixedly connected to a set of arc-shaped fixing blocks 22. The extension plate 21 and the fixing blocks 22 are integrated, which can effectively improve the connection strength between the extension plate 21 and the fixing blocks 22.
[0030] Specifically, the extension plate 21 and the fixing block 22 can cooperate through the fixing groove 64 and the locking mechanism 65 to strengthen the connection between the sealing cover 2 and the test platform 63, thereby ensuring the sealing effect, ensuring the integrity of the vacuum environment, and preventing air leakage.
[0031] Reference Figures 3-5The unloading mechanism 62 includes a first slide 621, a second slide 622, a screw 623, a slider 624, and a first drive motor 625. A first slide 621 is formed at the center of the bottom surface of the moving groove 61. A second slide 622 is formed at both ends of the first slide 621. Slide bars corresponding to the second slide 622 are provided at both ends of the rear of the bottom surface of the testing platform 63. The slide bars extend into the second slide 622. When the testing platform 63 moves, the sliding bars and the second slide 622 work together to improve... The test platform 63 is used to test the stability of movement. A set of screws 623 is installed in the slide groove 621. A set of sliders 624 are connected to the outside of the screws 623. The inner end of the sliders 624 is provided with an internal thread hole corresponding to the screws 623. When the screws 623 rotate, they can drive the sliders 624 to move along the screws 623. A set of drive motors 625 is connected to the rear end of the screws 623. The front end of the drive shaft of the drive motors 625 is fixedly connected to the rear end of the screws 623, which can drive the screws 623 to rotate.
[0032] Specifically, the screw 623 inside the slide 621 can drive the slider 624 and the test platform 63 to move back and forth under the drive of the drive motor 625, which facilitates the placement and removal of memory modules, realizes automated operation, and reduces the tediousness and inconvenience of manual operation.
[0033] Reference Figures 3-5 The test platform 63 is fixedly connected to the top of the slider 624 at the bottom rear middle. When the slider 624 moves, it can drive the test platform 63 to move synchronously. A slot module 631 for inserting and fixing memory modules is installed at the middle of the top surface of the test platform 63. A sealing ring 632 is provided on the outer side of the top surface of the test platform 63. The sealing ring 632 is opposite to the bottom surface of the sealing cover 2, which can improve the sealing effect of the sealing cover 2. A set of linkage arms 633 is hinged to the rear ends of both the left and right sides of the test platform 63. The other end of the two sets of linkage arms 633 is connected to the front bottom ends of the left and right sides of the sealing cover 2, respectively. When the test platform 63 moves from front to back to the rear end of the moving slot 61, the sealing cover 2 can be pulled down by the linkage arms 633, so that the sealing cover 2 fits against the sealing ring 632 on the top surface of the test platform 63. When the test platform 63 moves forward, the sealing cover 2 is pushed up by the linkage arms 633, thereby realizing the unfolding of the sealing cover 2, which makes it easy to remove and replace memory modules.
[0034] Specifically, the slot module 631 is used to fix and install the memory module, the sealing ring 632 can ensure the sealing effect with the sealing cover 2, and the linkage arm 633 can drive the sealing cover 2 to automatically rise and fall when the test platform 63 moves, realizing the linkage function between the test platform 63 and the sealing cover 2, which has the advantages of automatic sealing and simplified operation.
[0035] Reference Figures 5-6The locking mechanism 65 includes a movable groove 651, a moving part 652, a rack 653, a gear 654, and a drive motor 655. A set of movable grooves 651 is provided at the front bottom end of the base 1, corresponding to the fixed groove 64. The movable grooves 651 have a "Y" shape, with their left and right top ends communicating with the left and right sides of the fixed groove 64, respectively. A set of "C"-shaped moving parts 652 is slidably connected to the top end of the movable grooves 651. Each moving part 652 has a set of guide grooves at both its front and rear ends. The top ends of both the front and rear ends of the movable grooves 651 have guide parts corresponding to these guide grooves, and the left ends of both sets of guide grooves communicate with the outside. When the moving part 652 moves to the right, its left end can separate from the left-end guide part, facilitating its extension to... The fixed groove 64 contacts the fixed block 22. Furthermore, the inner side of the movable part 652 is provided with a flange corresponding to the position of the fixed block 22, which can enhance the connection stability with the fixed block 22, thereby enhancing the sealing effect of the sealing cover 2. A rack 653 is fixedly connected to the left end of the bottom surface of the movable part 652. A gear 654 corresponding to the rack 653 is installed on the outer side of the movable groove 651. The gear 654 meshes with the rack 653. When the gear 654 rotates, it can drive the movable part 652 to move along the top of the movable groove 651 through the rack 653. A set of drive motors 655 is connected to the rear end of the gear 654. The drive shaft of the drive motor 655 is fixedly connected to the middle end of the gear 654, which can drive the gear 654 to rotate.
[0036] Specifically, the drive motor 655 drives the moving part 652 to move along the movable groove 651 through the gear 654, so that the moving part 652 can move into the fixed groove 64 and clamp the fixed block 22, realizing the reliable locking of the locking mechanism 65. This has the advantage of ensuring that the sealing cover 2 remains closed during the test, preventing incomplete sealing. Moreover, the left and right top ends of the movable groove 651 are connected to the fixed groove 64, which is conducive to the moving part 652 moving into the fixed groove 64, improving the moving efficiency and locking stability of the moving part 652. At the same time, the "C"-shaped structure allows the moving part 652 to move along a fixed path, and the guide groove can further enhance the moving stability of the moving part 652, ensure the stable clamping of the moving part 652, prevent the sealing cover 2 from loosening, and enhance the locking force.
[0037] A method for testing the temperature of a vacuum-evacuated memory module includes the following steps: S1: Insert the memory module into slot module 631; S2: Drive motor 625 drives screw 623 to rotate, and screw 623 drives test platform 63 to move backward along slide groove 622 via slider 624; S3: When the test platform 63 moves backward, the sealing cover 2 is pulled down by the linkage arm 633, so that the sealing cover 2 can fit against the sealing ring 632 on the top surface of the test platform 63, covering the slot module 631 and the memory module. S4: Drive motor 655 drives gear 654 to rotate, and gear 654 then drives moving part 652 to move along the top of movable groove 651 through rack 653, so that the right end of moving part 652 extends into fixed groove 64 and is inserted into the connection opening between the left side of fixed groove 64 and movable groove 651, thereby achieving the clamping effect on fixed block 22. S5: The air inside the sealing cover 2 is extracted by the vacuum module 3 to create a vacuum environment; S6: The heat-conducting sheet 5 is heated or cooled by the high and low temperature airflow meter 4, causing the temperature inside the sealing cover 2 to change, thereby detecting the memory module.
[0038] S7: After the test is completed, the drive motor 655 drives the moving part 652 to reset through the cooperation of the rack 653 and the gear 654, thereby releasing the fixed block 22 and the sealing cover 2; S8: Drive motor 625 drives screw 623 to rotate in the reverse direction, which drives test platform 63 to move forward. During the forward movement of test platform 63, two sets of linkage arms 633 lift the sealing cover 2 and send the memory module out of the top surface of base 1, so that the staff can pick it up and replace it to complete the test.
[0039] This application provides a vacuum-operated memory module temperature testing device and method. A material ejection mechanism 62 and a testing platform 63 are installed in a moving groove 61. The material ejection mechanism 62 includes components such as a first slide 621, a second slide 622, a screw 623, a slider 624, and a first drive motor 625. The first drive motor 625 drives the testing platform 63 to move precisely within the moving groove 61 via the screw 623 and the slider 624. The synchronous automatic opening and closing of the sealing cover 2 is achieved through a linkage arm 633, facilitating the storage and retrieval of the memory module. This integrates the transfer of the workpiece and the opening and closing of the testing environment into a single, continuous action, automating the testing process and avoiding potential sealing issues with manual sealing. This significantly improves operational efficiency and the reliability of the testing process. The sealing cover 2, located at the top of the base 1, employs a double-layer structure of an inner testing box and an outer temperature chamber cover. Combined with the sealing ring 632 on the testing platform 63, it provides basic physical insulation and sealing. Furthermore, the vacuum module 3 can actively control the temperature of the sealed space. Air extraction greatly eliminates the interference of air convection and oxidation on temperature conduction. At the same time, the high and low temperature airflow meters 4 distributed at the front and rear ends of the top of the sealing cover 2 transfer heat or cold to the sealed space through multiple sets of heat-conducting plates 5, ensuring the uniformity of the temperature field in the vacuum environment. This provides near-ideal test conditions for the memory module, making the temperature stress test results more accurate and reliable. The locking mechanism 65 set at the bottom of the fixed groove 64, which includes components such as the movable groove 651, the moving part 652, the rack 653, the gear 654 and the drive motor 655, can effectively ensure the stable sealing of the sealing area during the test phase. When the sealing cover 2 is closed, the extension plate 21 and the fixed block 22 at the front bottom end extend into the fixed groove 64 and are moved to the top of the fixed block 22 by the moving part 652. The moving part 652 uses the inner flange to firmly press the fixed block 22 from above, effectively preventing gaps in the sealing environment caused by the sealing cover 2 not being airtight, and effectively ensuring the durability and stability of the sealing state during the test.
Claims
1. A vacuum-evacuated memory module temperature testing device, characterized in that, The base (1) is connected to a set of sealing covers (2) at the top rear end. A set of vacuum modules (3) is connected to the top middle end of the sealing covers (2). A set of high and low temperature airflow meters (4) is provided at both the front and rear ends of the vacuum modules (3). At least two sets of heat-conducting plates (5) are provided at equal intervals on the bottom surface of the two sets of high and low temperature airflow meters (4). The bottom ends of the heat-conducting plates (5) extend through into the sealing covers (2). A pushing mechanism (6) is provided at the top middle end of the base (1). The pushing mechanism (6) includes a moving groove (61), a material ejection mechanism (62), a testing platform (63), a fixing groove (64), and a locking mechanism (65). The base (1) has a set of moving grooves (61) at the top center. A set of testing platforms (63) is provided in the moving grooves (61). The bottom of the testing platform (63) is connected to the moving grooves (61) through the material ejection mechanism (62). A set of fixing grooves (64) is provided at the front bottom center of the moving grooves (61). A set of locking mechanisms (65) is provided at the bottom of the fixing grooves (64).
2. The vacuum-evacuated memory module temperature testing device according to claim 1, characterized in that, The sealing cover (2) has a set of extension plates (21) corresponding to the fixing groove (64) at the front bottom end, and a set of fixing blocks (22) are connected to the front bottom end of the extension plate (21).
3. The vacuum-evacuated memory module temperature testing device according to claim 1, characterized in that, The unloading mechanism (62) includes a first slide groove (621), a second slide groove (622), a screw (623), a slider (624), and a first drive motor (625). The bottom surface of the moving groove (61) is provided with a first slide groove (621). The left and right ends of the first slide groove (621) are provided with a second slide groove (622). The first slide groove (621) is provided with a screw (623). The outside of the screw (623) is connected to a slider (624). The rear end of the screw (623) is connected to a first drive motor (625).
4. The vacuum-evacuated memory module temperature testing device according to claim 3, characterized in that, The test platform (63) is connected to the top of the slider (624) at the bottom rear middle end. The test platform (63) has a slot module (631) at the middle of the top surface. The test platform (63) has a sealing ring (632) on the outer side of the top surface. The test platform (63) has a set of linkage arms (633) hinged to the rear ends of the left and right sides. The other ends of the two sets of linkage arms (633) are respectively connected to the front bottom ends of the left and right sides of the sealing cover (2).
5. The vacuum-assisted memory module temperature testing device according to claim 1, characterized in that, The locking mechanism (65) includes a movable groove (651), a moving part (652), a rack (653), a gear (654), and a second drive motor (655). A set of movable grooves (651) is provided at the front bottom end of the base (1) corresponding to the fixed groove (64). A set of moving parts (652) is provided at the top end of the movable groove (651). A rack (653) is provided at the left end of the bottom surface of the moving part (652). A gear (654) corresponding to the rack (653) is provided on the outside of the movable groove (651). A set of second drive motors (655) is connected to the rear end of the gear (654).
6. The vacuum-evacuated memory module temperature testing device according to claim 5, characterized in that, The movable groove (651) has a "Y" shaped structure, and its left and right top ends are respectively connected to the left and right sides of the fixed groove (64).
7. The vacuum-evacuated memory module temperature testing device according to claim 6, characterized in that, The movable component (652) has a "C" shaped structure. The movable component (652) has a set of guide grooves at both the front and rear, and the left ends of both sets of guide grooves are connected to the outside.
8. The vacuum-evacuated memory module temperature testing device according to claim 7, characterized in that, The active groove (651) is equipped with guide members corresponding to the guide grooves at the top and bottom of the front and rear sides.
9. The vacuum-evacuated memory module temperature testing device according to claim 1, characterized in that, The sealing cover (2) has a double-layer structure, with the inner layer being the test box and the outer layer being the temperature chamber cover.
10. A testing method for a vacuum-evacuated memory module temperature testing device, comprising any one of claims 1-9, characterized in that, Includes the following steps: S1: Insert the memory module into the slot module (631); S2: Drive motor 1 (625) drives test platform (63) to move backward via screw (623); S3: When the test platform (63) moves backward, the sealing cover (2) is pulled down by the linkage arm (633) to cover the slot module (631) and the memory module; S4: Drive motor 2 (655) drives the moving part (652) to rotate and clamp the fixed block (22); S5: The vacuum module (3) extracts the air from the sealed cover (2) to form a vacuum environment; S6: The heat-conducting sheet (5) is heated or cooled by the high and low temperature airflow meter (4) to change the temperature inside the sealed cover (2) and start the detection of the memory module; S7: After the test is completed, the moving part (652) is driven by the second drive motor (655) to reset and release the sealing cover (2); S8: Drive motor 1 (625) drives test platform (63) forward through screw (623), and at the same time, the linkage arm (633) lifts the sealing cover (2) and sends the memory stick out of the top surface of the base (1) to complete the test.