Backlight assembly, display screen and electronic equipment

Abstract

The invention discloses a backlight assembly, a display screen and electronic equipment. The backlight assembly is used for solving the technical problem that an existing backlight assembly is poor in heat dissipation performance. The backlight assembly comprises a frame body and an FPC light-emitting assembly arranged on the frame body. The FPC light-emitting assembly comprises an FPC board and an LED module, the FPC board comprises a substrate and a heat dissipation copper layer arranged on the surface of the substrate, and the LED module is arranged on the heat dissipation copper layer and located on the light incident side of the frame. By means of the design, heat emitted by the LED module in the working process is directly dissipated through the heat dissipation copper layer on the FPC board, and the heat dissipation performance of the backlight assembly is greatly improved.

Description

Technical Field

[0001] This invention relates to the field of display screen design technology, and more particularly to a backlight assembly, a display screen, and an electronic device. Background Technology

[0002] In current LED displays, the main source of heat is the LED modules within the light-emitting FPC (Flexible Printed Circuit) components. To accelerate heat dissipation, existing technology typically involves attaching a layer of heat-dissipating copper foil to the back of the backlight assembly frame. However, because the backlight assembly frame has a certain thickness, the heat from the LED module must pass through the frame to reach the copper foil. This slows down the heat dissipation process, preventing the heat from being dissipated quickly. Prolonged exposure to high temperatures causes the LED module's performance to rapidly degrade, brightness to gradually decrease, and significantly impacts its lifespan.

[0003] Therefore, finding a technical solution that can solve the above-mentioned technical problems has become an important research topic for those skilled in the art. Summary of the Invention

[0004] This invention discloses a backlight assembly, a display screen, and an electronic device to solve the technical problem of poor heat dissipation performance of existing backlight assemblies.

[0005] The present invention provides a backlight assembly, including a frame and an FPC light-emitting component disposed on the frame;

[0006] The FPC light-emitting component includes an FPC board and an LED module. The FPC board includes a substrate and a heat-dissipating copper layer disposed on the surface of the substrate. The LED module is disposed on the heat-dissipating copper layer and located on the light-incident side of the frame.

[0007] Optionally, the frame has a light-emitting surface and a non-light-emitting surface disposed opposite to the light-emitting surface, and the FPC board is bent so that the heat dissipation copper layer is attached and fixed to the non-light-emitting surface.

[0008] Optionally, the substrate has a first surface and a second surface disposed opposite to each other, wherein the first surface and the second surface are both provided with the heat dissipation copper layer, the LED module is disposed on the heat dissipation copper layer on the second surface, and the FPC board is bent so that the heat dissipation copper layer on the second surface is attached and fixed to the non-light-emitting surface.

[0009] Optionally, a protective film layer is provided at the position of the heat dissipation copper layer on the first surface corresponding to the LED module and at the position of the heat dissipation copper layer on the second surface corresponding to the LED module.

[0010] Optionally, the surface area of ​​the heat dissipation copper layer on the first surface and the heat dissipation copper layer on the second surface is S1, and the area of ​​the non-light-emitting surface is S2.

[0011] Where 1 / 2S2≤S1≤S2.

[0012] Optionally, the heat-dissipating copper layer is provided with a plurality of protrusions or recesses spaced apart along its width or length direction.

[0013] Optionally, the LED module includes multiple LED units, which are arranged in a straight line on the heat-dissipating copper layer of the second surface.

[0014] Optionally, an optical diaphragm assembly is also provided within the frame.

[0015] The present invention provides a display screen including the backlight assembly described above.

[0016] The present invention provides an electronic device including the aforementioned display screen.

[0017] Compared with the prior art, the present invention has the following beneficial effects:

[0018] In the backlight assembly of the present invention, the LED module directly utilizes the heat dissipation copper layer on the FPC board for heat dissipation. The heat is directly transferred from the LED module to the heat dissipation copper layer, resulting in higher heat transfer efficiency. This allows the heat from the LED module to be efficiently dissipated, ensuring that the LED module is always at a normal operating temperature, guaranteeing the luminous performance of the LED module, and helping to extend the service life of the LED module. Attached Figure Description

[0019] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 A structural perspective view of the front (light-emitting surface) of a backlight assembly provided by the present invention;

[0021] Figure 2 A schematic diagram of the back side (non-light-emitting surface) of a backlight assembly provided by the present invention;

[0022] Figure 3 A schematic diagram of the first surface (front) structure of an FPC board in a backlight assembly provided by the present invention;

[0023] Figure 4A schematic diagram of the second surface (back side) structure of an FPC board in a backlight assembly provided by the present invention;

[0024] Illustration: Frame 1; Light-emitting surface 101; Non-light-emitting surface 102; FPC board 2; Heat dissipation copper layer 201; LED module 202; LED unit 2021; Protective film layer 203. Detailed Implementation

[0025] This invention discloses a backlight assembly, a display screen, and an electronic device to solve the technical problem of poor heat dissipation performance of existing backlight assemblies.

[0026] To enable those skilled in the art to better understand the present invention, the invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. Obviously, the described embodiments are merely some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0027] Please see Figures 1 to 4 An embodiment of the present invention provides a backlight assembly, including a frame 1 and an FPC light-emitting component disposed on the frame 1;

[0028] The FPC light-emitting component includes an FPC board 2 (flexible circuit board) and an LED module 202. The FPC board 2 includes a substrate and a heat-dissipating copper layer 201 disposed on the surface of the substrate. The LED module 202 is disposed on the heat-dissipating copper layer 201 and located on the light-incident side of the frame 1.

[0029] In the backlight assembly of this embodiment, the LED module 202 directly utilizes the heat dissipation copper layer 201 on the FPC board 2 for heat dissipation. The heat is directly transferred from the LED module 202 to the heat dissipation copper layer 201, resulting in higher heat transfer efficiency. This allows the heat from the LED module 202 to be efficiently dissipated, ensuring that the LED module 202 is always at a normal operating temperature, guaranteeing the light-emitting performance of the LED module 202, and helping to extend the service life of the LED module 202.

[0030] In addition, it should be noted that in the prior art, the FPC board 2 includes a substrate and a copper plating layer disposed on the surface of the substrate. In this embodiment, the heat dissipation copper layer 201 is the same copper layer as the copper plating layer mentioned above. Through this design, without adding other heat-conducting materials, this embodiment directly utilizes the original copper plating layer of the FPC board 2 as the heat dissipation copper layer 201, which directly improves the heat dissipation efficiency of the LED module 202 and greatly improves the heat dissipation performance of the backlight assembly.

[0031] It should be further noted that, due to their thinness, existing heat-dissipating copper foils tend to wrinkle during heat conduction, which also affects heat dissipation performance. In this embodiment, the heat-dissipating copper layer 201 is specifically disposed on the substrate, which can effectively solve the wrinkling problem that occurs when using heat-dissipating copper foil alone.

[0032] Furthermore, the frame 1 in this embodiment has an optical film group composed of optical films such as light guide plates, diffusers, and light shields. Therefore, the frame 1 in this embodiment has a light-emitting surface 101 and a non-light-emitting surface 102 disposed opposite to the light-emitting surface 101.

[0033] In order to avoid the FPC board 2 being exposed on the frame 1 and causing the backlight assembly to occupy too much volume of the display screen, the FPC board 2 in this embodiment is preferably bent so that the heat dissipation copper layer 201 is attached and fixed to the non-light-emitting surface 102.

[0034] In addition, the aforementioned FPC board 2 is specifically fixed to the non-light-emitting surface 102 of the frame 1 using thermally conductive double-sided adhesive of the prior art.

[0035] Furthermore, the substrate in this embodiment has a first surface and a second surface disposed opposite to each other, wherein the first surface and the second surface are both provided with the heat dissipation copper layer 201, the LED module 202 is disposed on the heat dissipation copper layer 201 on the second surface, and the FPC board 2 is bent so that the heat dissipation copper layer 201 on the second surface is attached and fixed to the non-light-emitting surface 102.

[0036] It should be noted that in this embodiment, heat dissipation copper layers 201 are provided on both opposite surfaces of the substrate, which can further improve the heat dissipation performance of the LED module 202 and allow the heat generated by the LED module 202 during operation to be dissipated as much as possible.

[0037] Furthermore, in this embodiment, a protective film layer 203 is provided at the position of the heat dissipation copper layer 201 on the first surface corresponding to the LED module 202 and at the position of the heat dissipation copper layer 201 on the second surface corresponding to the LED module 202.

[0038] It should be noted that the aforementioned protective film layer 203 is a prior art technology, which mainly serves to provide electrical insulation, buffer stress, prevent corrosion, and enhance bending resistance. This embodiment will not elaborate on these functions further.

[0039] In addition, it should be noted that in the prior art, the FPC board 2 includes a substrate, a copper plating layer disposed on the substrate, and a protective film layer 203 disposed on the surface of the copper plating layer. It can be simply understood that in the above embodiment, other protective film layers 203 outside the protective film layer 203 corresponding to the LED module 202 are removed to expose a large area of ​​copper plating layer as a heat dissipation copper layer 201, thereby directly dissipating the heat of the LED module 202 during operation.

[0040] Furthermore, the surface area of ​​the heat dissipation copper layer 201 on the first surface and the heat dissipation copper layer 201 on the second surface is S1, and the area of ​​the non-light-emitting surface 102 is S2.

[0041] Where 1 / 2S2≤S1≤S2.

[0042] It should be noted that, through design, the heat dissipation copper layer 201 with a sufficient area can be ensured to conduct the heat of the LED module 202 during operation, avoiding the impact on heat dissipation effect due to the small area of ​​the heat dissipation copper layer 201.

[0043] Furthermore, in this embodiment, the heat dissipation copper layer 201 is provided with a plurality of protrusions or recesses spaced apart along its width or length direction.

[0044] It should be noted that the design of the protrusions or recesses described above can form a structure similar to heat dissipation fins on the surface of the heat dissipation copper layer 201, further improving the heat dissipation performance of the heat dissipation copper layer 201.

[0045] Furthermore, the LED module 202 in this embodiment includes a plurality of LED units 2021, which are arranged in a straight line on the heat dissipation copper layer 201 of the second surface.

[0046] It should be noted that the specific number of LED units 2021 can be selected according to the design requirements, and this embodiment does not impose any restrictions on this.

[0047] Please see Figures 1 to 4 The present invention provides a display screen including the backlight assembly described above.

[0048] It should be noted that, in this embodiment, the display screen can be used in electronic devices such as smartphones and tablets.

[0049] In the aforementioned display screen, the LED module 202 directly utilizes the heat dissipation copper layer 201 on the FPC board 2 for heat dissipation. Heat is directly transferred from the LED module 202 to the heat dissipation copper layer 201, resulting in higher heat transfer efficiency. This allows the heat from the LED module 202 to be efficiently dissipated, ensuring that the LED module 202 is always at a normal operating temperature, guaranteeing the luminous performance of the LED module 202, and helping to extend the service life of the LED module 202.

[0050] Please see Figures 1 to 4 An electronic device provided in this embodiment of the invention includes the aforementioned display screen.

[0051] Specifically, the aforementioned electronic devices can be smartphones, tablets, etc.

[0052] In the aforementioned electronic device, the LED module 202 directly utilizes the heat dissipation copper layer 201 on the FPC board 2 for heat dissipation. Heat is directly transferred from the LED module 202 to the heat dissipation copper layer 201, resulting in higher heat transfer efficiency. This allows the heat from the LED module 202 to be efficiently dissipated, ensuring that the LED module 202 is always at a normal operating temperature, guaranteeing the luminous performance of the LED module 202, and helping to extend the service life of the LED module 202.

[0053] The foregoing has provided a detailed description of a backlight assembly, display screen, and electronic device provided by the present invention. For those skilled in the art, based on the ideas of the embodiments of the present invention, there will be changes in the specific implementation methods and application scope. Therefore, the content of this specification should not be construed as a limitation of the present invention.

Claims

1. A backlight assembly, characterized in that, Includes a frame (1) and an FPC light-emitting component disposed on the frame (1); The FPC light-emitting component includes an FPC board (2) and an LED module (202). The FPC board (2) includes a substrate and a heat-dissipating copper layer (201) disposed on the surface of the substrate. The LED module (202) is disposed on the heat-dissipating copper layer (201) and located on the light-incident side of the frame (1).

2. The backlight assembly according to claim 1, characterized in that, The frame (1) has a light-emitting surface (101) and a non-light-emitting surface (102) opposite to the light-emitting surface (101). The FPC board (2) is bent so that the heat dissipation copper layer (201) is attached and fixed to the non-light-emitting surface (102).

3. The backlight assembly according to claim 2, characterized in that, The substrate has a first surface and a second surface disposed opposite to each other, wherein the first surface and the second surface are both provided with the heat dissipation copper layer (201), the LED module (202) is disposed on the heat dissipation copper layer (201) on the second surface, and the FPC board (2) is bent so that the heat dissipation copper layer (201) on the second surface is attached and fixed to the non-light-emitting surface (102).

4. The backlight assembly according to claim 3, characterized in that, A protective film layer (203) is provided at the position corresponding to the LED module (202) on the first surface and at the position corresponding to the LED module (202) on the second surface.

5. The backlight assembly according to claim 3, characterized in that, The surface area of ​​the heat dissipation copper layer (201) on the first surface and the heat dissipation copper layer (201) on the second surface is S1, and the area of ​​the non-light-emitting surface (102) is S2. Where 1 / 2S2≤S1≤S2.

6. The backlight assembly according to claim 1, characterized in that, The heat dissipation copper layer (201) has a plurality of protrusions or recesses spaced apart along its width or length.

7. The backlight assembly according to claim 3, characterized in that, The LED module (202) includes multiple LED units (2021), which are arranged in a straight line on the heat dissipation copper layer (201) of the second surface.

8. The backlight assembly according to claim 1, characterized in that, An optical film assembly is also provided inside the frame (1).

9. A display screen, characterized in that, Includes the backlight assembly as described in any one of claims 1 to 8.

10. An electronic device, characterized in that, Includes the display screen as described in claim 9.

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