DP2.1 connector capable of reducing crosstalk noise of high-frequency signal

Abstract

The invention relates to the technical field of DP2.1 connectors, and provides a DP2.1 connector capable of reducing high-frequency signal crosstalk noise, and the DP2.1 connector capable of reducing high-frequency signal crosstalk noise comprises a bearing part which is provided with a plurality of accommodation grooves; the connecting part is arranged on the bearing part and is used for being connected with a female head; the signal transmission part is arranged on the bearing part, the signal transmission part comprises a plurality of pins and a plurality of concave structures, the pins are used for being connected with a female head pairing contact end to transmit high-frequency signals, the concave structures are arranged on the pins, and the concave structures are used for reducing high-frequency signal crosstalk noise of the pins. According to the DP2.1 connector capable of reducing the crosstalk noise of the high-frequency signal, the technical problem that the signal crosstalk noise is too large due to the fact that the electromagnetic shielding effect of the DP2.1 connector is insufficient in a high-frequency transmission scene on the premise that miniaturization of the connector is considered in the prior art can be solved.

Description

Technical Field

[0001] This application relates to the field of DP2.1 connector technology, and more particularly to a DP2.1 connector for reducing high-frequency signal crosstalk noise. Background Technology

[0002] With the rapid development of high-definition display technology, virtual reality (VR), augmented reality (AR), and high refresh rate e-sports equipment, the requirements for transmission bandwidth and signal quality of display interfaces continue to increase. As a new generation of high-definition display interface standard, DisplayPort 2.1 (DP2.1) has a transmission rate of up to 20Gbps / channel and supports high-specification audio and video transmission such as 8K@120Hz and 4K@240Hz, and has become one of the core interfaces of high-end display devices.

[0003] In practical applications of DP2.1 connectors, the core bottleneck in high-frequency signal transmission is differential signal crosstalk noise. DP2.1 connectors rely on multiple differential signal pairs (composed of positive signal pins and negative signal pins) to achieve high-speed data transmission. To ensure signal integrity, differential signal pairs need to be electromagnetically shielded with ground pins. Traditional DP connectors generally use a flat rod-shaped structure for their ground pins, and the layout of the ground pins and differential signal pairs is mostly a planar adjacent design. However, the electromagnetic coupling area between the flat ground pins and the differential signal pairs is limited, resulting in poor effectiveness in blocking electromagnetic radiation interference between adjacent differential signal pairs. Furthermore, under the premise of meeting the miniaturization requirements of connectors, the spacing between differential signal pairs is constantly decreasing, which significantly increases the parasitic capacitance and mutual inductance between adjacent differential pairs, making the crosstalk problem increasingly prominent. Summary of the Invention

[0004] This application provides a DP2.1 connector for reducing high-frequency signal crosstalk noise, which can improve the technical problem in related technologies where, while taking into account connector miniaturization, the electromagnetic shielding effect of the DP2.1 connector is insufficient in high-frequency transmission scenarios, resulting in excessive signal crosstalk noise.

[0005] This application provides a DP2.1 connector for reducing high-frequency signal crosstalk noise, comprising: The support portion has multiple receiving slots; A connecting portion, disposed on the bearing portion, is used for connection with the female connector; and A signal transmission unit is disposed on the carrier unit. The signal transmission unit includes multiple pins and multiple concave structures. The pins are disposed on the carrier unit and located in the receiving groove. The pins are used to connect with the mating contact end of the female connector to transmit high-frequency signals. The concave structures are disposed on the pins and located in the receiving groove. The concave structures are used to reduce high-frequency signal crosstalk noise of the pins.

[0006] The technical solutions described in this application embodiment have at least the following technical effects: During assembly, the pins of the signal transmission unit are precisely embedded into the receiving groove of the carrier unit. The concave structure is positioned synchronously with the pins and adapts to the space of the receiving groove without occupying additional installation space. Then, the connector and carrier unit are assembled to form a stable three-layer structure, ensuring the consistency of the pin layout and the accuracy of the mating interface. During the mating process with the female connector, the guiding structure of the connector (guide groove, guide rod, etc.) guides the female connector and the pin connection end to make precise contact, while simultaneously achieving mechanical locking between the connector and the female connector to prevent loosening caused by vibration. In high-frequency transmission and crosstalk suppression, the electromagnetic coupling area between traditional flat rod-shaped ground pins and differential signal pairs is limited (effective only on the side facing the signal pins), resulting in poor shielding. The concave structure in this application increases the electromagnetic coupling area between the ground pins and differential signal pairs, forming a ground shielding cavity. This increases the electromagnetic coupling area, effectively absorbing electromagnetic waves radiated by the differential signal pairs and blocking electromagnetic interference between adjacent differential signal pairs. Simultaneously, the concave structure increases the equivalent surface width of the ground pins, reducing grounding impedance and further improving shielding efficiency. Furthermore, the electric field lines are guided and converged on the inner surface of the concave structure (unlike traditional flat ground pins where electric field lines are dispersed and easily coupled to adjacent areas), making the path more controllable and reducing leakage, thus further suppressing crosstalk noise and radiation. Structurally, the concave structure is directly integrated onto the pins, eliminating the need for additional shielding components. This improves electromagnetic shielding while meeting the requirements for connector miniaturization (without increasing the spacing between pins). Attached Figure Description

[0007] To more clearly illustrate the technical solutions in the embodiments of this application, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0008] Figure 1 A schematic diagram of the structure of a DP2.1 connector for reducing high-frequency signal crosstalk noise provided in an embodiment of this application; Figure 2 A schematic diagram of the DP2.1 connector for reducing high-frequency signal crosstalk noise provided in an embodiment of this application, viewed from the front. Figure 3 An exploded view of the DP2.1 connector for reducing high-frequency signal crosstalk noise provided in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of the support portion and the connecting portion provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the connecting part provided in an embodiment of this application; Figure 6 This is a schematic diagram of the connecting portion provided in the embodiment of this application in the front view direction.

[0009] The following are the labeling elements in the figure: 100. DP2.1 connector with reduced high-frequency signal crosstalk noise; 10. Carrier portion; 11. Carrier element; 111. Receiving groove; 112. First side; 113. Second side; 12. Locking structure; 121. Locking part; 122. Deformation end; 123. Overhanging end; 20. Connecting part; 21. Connecting space; 22. Locking hole; 30. Signal transmission part; 31. Pin; 311. Connecting part; 3111. Connecting end; 312. Transmission part; 3121. Transmission end; 32. Concave structure; 321. Arc structure. Detailed Implementation

[0010] To make the technical problems, technical solutions, and beneficial effects to be solved by this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and are not intended to limit the scope of this application.

[0011] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs; the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the application. The terms “comprising” and “having”, and any variations thereof, in the specification, claims, and foregoing description of the drawings are intended to cover non-exclusive inclusion.

[0012] It should be noted that when a component is referred to as being "fixed to" or "set on" another component, it can be directly on or indirectly on that other component. When a component is referred to as being "connected to" another component, it can be directly connected to or indirectly connected to that other component.

[0013] It should be understood that the terms "length", "width", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application.

[0014] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0015] In this application, "and / or" is merely a way of describing the relationship between related objects, indicating that three relationships can exist; for example, A and / or B can represent three cases: A existing alone, A and B existing simultaneously, and B existing alone. Additionally, the character " / " in this document generally indicates that the preceding and following related objects have an "or" relationship.

[0016] It should be noted that in this application, the words "in some embodiments," "exemplarily," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design described in this application as "in some embodiments," "exemplarily," or "for example" should not be construed as being more preferred or advantageous than other embodiments or design solutions. Specifically, the use of words such as "in some embodiments," "exemplarily," and "for example" is intended to present related concepts in a specific manner, meaning that a particular feature, structure, or characteristic described in connection with the embodiment may be included in at least one embodiment of this application. The appearance of the above words in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment that is mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.

[0017] With the rapid development of high-definition display technology, virtual reality (VR), augmented reality (AR), and high refresh rate e-sports equipment, the requirements for transmission bandwidth and signal quality of display interfaces continue to increase. As a new generation of high-definition display interface standard, DisplayPort 2.1 (DP2.1) has a transmission rate of up to 20Gbps / channel and supports high-specification audio and video transmission such as 8K@120Hz and 4K@240Hz, and has become one of the core interfaces of high-end display devices.

[0018] In practical applications of DP2.1 connectors, the core bottleneck in high-frequency signal transmission is differential signal crosstalk noise. DP2.1 connectors rely on multiple differential signal pairs (composed of positive signal pins and negative signal pins) to achieve high-speed data transmission. To ensure signal integrity, differential signal pairs need to be electromagnetically shielded with ground pins. Traditional DP connectors generally use a flat rod-shaped structure for their ground pins, and the layout of the ground pins and differential signal pairs is mostly a planar adjacent design. However, the electromagnetic coupling area between the flat ground pins and the differential signal pairs is limited, resulting in poor effectiveness in blocking electromagnetic radiation interference between adjacent differential signal pairs. Furthermore, under the premise of meeting the miniaturization requirements of connectors, the spacing between differential signal pairs is constantly decreasing, which significantly increases the parasitic capacitance and mutual inductance between adjacent differential pairs, making the crosstalk problem increasingly prominent.

[0019] Based on this, in order to improve the technical problem in related technologies where the DP2.1 connector has insufficient electromagnetic shielding effect in high-frequency transmission scenarios while taking into account connector miniaturization, resulting in excessive signal crosstalk noise, the embodiments of this application provide the following solutions.

[0020] Please refer to the following: Figures 1 to 3 This application provides a DP2.1 connector 100 for reducing high-frequency signal crosstalk noise. The DP2.1 connector 100 for reducing high-frequency signal crosstalk noise includes a carrier part 10, a connecting part 20 and a signal transmission part 30.

[0021] The support part 10 has multiple receiving slots 111.

[0022] The connecting part 20 is provided on the bearing part 10 and is used to connect with the female head.

[0023] The signal transmission unit 30 is disposed on the carrier unit 10. The signal transmission unit 30 includes a plurality of pins 31 and a plurality of concave structures 32. The pins 31 are disposed on the carrier unit 10 and located in the receiving groove 111. The pins 31 are used to connect with the mating contact end of the female connector to transmit high-frequency signals. The concave structures 32 are disposed on the pins 31 and located in the receiving groove 111. The concave structures 32 are used to reduce the high-frequency signal crosstalk noise of the pins 31.

[0024] It is understood that the carrier portion 10 is the basic mounting base of the entire connector, providing stable support and precise spatial positioning for the connection portion 20 and the signal transmission portion 30. For example, the carrier portion 10 can be integrally injection molded from plastic, or it can be made of aluminum alloy as the base, with an alumina ceramic insulating bushing embedded in the receiving groove 111, etc., but it is not limited to these.

[0025] The connecting part 20 is the key interface for achieving mechanical connection and electrical conduction between the connector and the female head. For example, the connecting part 20 can be injection molded from flame-retardant PC material, with a guide chamfer on the end face for precise insertion into the female head, or it can be made of stainless steel, but is not limited to these. The surface of the connecting part 20 may have protrusions corresponding to the grooves on the inside of the female head to prevent accidental dislodgement after insertion into the female head.

[0026] Pin 31 is the signal transmission channel of the DP2.1 connector, including a differential positive signal pin, a differential negative signal pin, and a ground pin. The structural design of pin 31 meets the equal length and parallelism requirements of the DP2.1 standard. For example, pin 31 can be made of high-conductivity copper alloy by stamping and silver plating. The fit between pin 31 and the receiving groove 111 of the carrier part 10 can be an interference fit to reduce the risk of loosening. The structure of pin 31 can be an L-shaped structure, a rod-shaped structure, etc., but is not limited to these.

[0027] For example, pin 31 may also include a hot-plug detection pin, a power supply pin, and a power return pin.

[0028] The concave structure 32, integrated on the pin 31 (preferably on the ground pin), is a key design feature for high-frequency crosstalk suppression. For example, the concave structure 32 can be formed by stamping or milling a copper alloy substrate, but is not limited to these methods. The concave structure 32 can consist of two symmetrically distributed arc structures on either side of the ground pin's length. The two arc structures, together with the ground pin of the same radial cross-section, form a concave cavity. In the forward-looking direction (parallel to the insertion direction of the female connector), the projection of the concave structure 32 can partially cover the projections of the corresponding differential positive signal pin and negative signal pin, and the projection width is greater than the maximum spacing between the differential signal pairs (positive signal pin and negative signal pin), ensuring electromagnetic shielding of the differential signal pairs by the ground pin.

[0029] As can be seen from the above, the DP2.1 connector 100 for reducing high-frequency signal crosstalk noise provided in this application embodiment ensures that, during the installation and assembly process, the pins 31 of the signal transmission section 30 are precisely embedded in the receiving groove 111 of the carrier section 10. The concave structure 32 is positioned synchronously with the pins 31 and is adapted to the space of the receiving groove 111, without occupying additional installation space. Afterward, the connecting section 20 and the carrier section 10 are assembled to form a stable three-layer structure, ensuring the consistency of the pin 31 layout and the accuracy of the mating interface. During the mating process with the female connector, the guiding structure (guide groove, guide rod, etc.) of the connecting section 20 guides the female connector to make precise contact with the connecting end 3111 of the pins 31, while simultaneously achieving mechanical locking between the connector and the female connector, preventing loosening of the mating due to vibration. In high-frequency transmission and crosstalk suppression, the electromagnetic coupling area between traditional flat rod-shaped ground pins and differential signal pairs is limited (effective only on the side facing signal pin 31), resulting in poor shielding. The concave structure 32 in this application increases the electromagnetic coupling area between the ground pin and the differential signal pair, forming a grounding shielding cavity. This increases the electromagnetic coupling area, effectively absorbing electromagnetic waves radiated by the differential signal pairs and blocking electromagnetic interference between adjacent differential signal pairs. Simultaneously, the concave structure 32 increases the equivalent surface width of the ground pin, reducing grounding impedance and further improving shielding efficiency. Furthermore, the electric field lines are guided and converged on the inner surface of the concave structure 32 (unlike traditional flat ground pins where electric field lines are dispersed and easily coupled to adjacent areas), making the path more controllable and reducing leakage, thereby further suppressing crosstalk noise and radiation. Structurally, the concave structure 32 is directly integrated onto the pin 31, eliminating the need for additional shielding components. This improves electromagnetic shielding while meeting the requirements for connector miniaturization (without increasing the spacing between pins 31).

[0030] In some embodiments, please refer to the following: Figures 1 to 2 The carrier part 10 and the connecting part 20 together form a connecting space 21. The connecting end 3111 of the pin 31 is located in the connecting space 21. The connecting end 3111 is used to connect with the mating contact end of the female head.

[0031] With this configuration, the carrier part 10 and the connecting part 20 are coaxially positioned and assembled to form a connecting space 21 (the central axis of the connecting space 21 is completely parallel to the insertion direction of the female head, guiding the female head to be inserted smoothly along the preset trajectory, avoiding wear or poor contact of the pin 31 connection end 3111 due to docking offset). This space serves as the docking area between the connector and the female head, and has both mechanical guiding and positioning and electrical conduction protection functions, providing a stable physical environment for low-loss transmission of high-frequency signals.

[0032] The connection end 3111 of pin 31 of the signal transmission section 30 is located in the connection space 21, and the arrangement trajectory of the connection end 3111 is completely matched with the array layout of the mating contact end of the female head. This ensures that when the connector and the female head are inserted and mated, the connection end 3111 of pin 31 can accurately fit with the mating contact end of the female head, thereby completing the stable conduction of high-frequency differential signal and ground signal.

[0033] The connection end 3111 of pin 31 can maintain a recess distance of 0.3-1mm from the opening end face of the guide groove to avoid the connection end 3111 directly colliding with external hard objects during the connector insertion and removal process, reduce the risk of pin 31 bending and deformation, and extend the service life of the connector.

[0034] In some embodiments, please refer to the following: Figure 1 , Figure 2 , Figure 5 , Figure 6 Pin 31 has a connection portion 311 and a transmission portion 312, wherein: The connecting part 311 has a connecting end 3111.

[0035] The transmission section 312 has a transmission end 3121 located outside the receiving slot 111 for connection to external devices or cables.

[0036] The connection between the connecting part 311 and the transmission part 312 is rounded. The length extensions of the connecting part 311 and the transmission part 312 can intersect and form a right angle. The concave structure 32 is provided on the transmission part 312.

[0037] This configuration, where the extension lines of the connecting portion 311 and the transmission portion 312 intersect in the longitudinal direction to form a right angle, achieves spatial separation between the mating end of pin 31 and the transmission end 3121. The connecting portion 311 is arranged along the insertion direction of the female connector, while the transmission portion 312 is arranged along the connection direction of the external cable or PCB board. This improves space utilization under the design constraints of connector miniaturization. Furthermore, the right-angle structure guides the transmission path of high-frequency signals to a 90° turn. Combined with the concave structure 32 on the ground pin, this further optimizes the coverage of the grounding shield and reduces electromagnetic radiation leakage during signal transmission. The rounded corner transition at the connection point between the connecting portion 311 and the transmission portion 312 disperses stress concentration on pin 31 under insertion, removal, and vibration conditions, preventing metal fatigue fracture caused by sharp right-angle edges, extending the service life of pin 31, and eliminating the electric field concentration effect caused by sharp edges. This reduces high-frequency signal loss and reflection at corners, ensuring signal integrity.

[0038] The segmented integrated structure design of the connection part 311 and the transmission part 312 achieves the functions of precise female connector docking, stable external cable connection and high-frequency crosstalk suppression through the spatial layout of right-angled corners and stress optimization of rounded corner transition. At the same time, the concave structure 32 is integrated into the transmission part 312 to maximize the crosstalk suppression effect without affecting the docking stability.

[0039] In some embodiments, please refer to the following: Figures 1 to 4 The carrier part 10 has a first surface 112 and a second surface 113. At least 10 pins 31 are located on the first surface 112 and at least 10 pins 31 are located on the second surface 113. Each pin 31 forms at least 5 sets of signal transmission channels. The signal transmission channels include positive signal pins, negative signal pins and ground pins. The positive signal pins are pins 31 used to transmit differential positive signals, the negative signal pins are pins 31 used to transmit differential negative signals, and the ground pins are pins 31 used to ground. The positive signal pins and negative signal pins are parallel and of equal length. The ground pin is located opposite the positive signal pins and negative signal pins. A concave structure 32 is disposed on the ground pin. The positive signal pins and negative signal pins are adjacent on the same surface. The concave structure 32 is used to reduce high-frequency signal crosstalk noise of the positive signal pins and negative signal pins.

[0040] It is understood that the support part 10 has two parallel mounting surfaces, a first surface 112 and a second surface 113, which are symmetrically distributed on both sides of the height direction of the support part 10.

[0041] With this configuration, the positive and negative signal pins are arranged on the same side of the carrier portion 10, remaining completely parallel with a length difference of ≤0.1mm. This ensures consistent transmission delay for the differential signals and avoids signal distortion caused by delay differences. The ground pins are precisely arranged on the opposite side of the carrier portion 10, forming a vertically opposed differential-to-ground structure with the positive and negative signal pins on the same side. Compared to the traditional planar adjacent layout, this design increases the electromagnetic coverage area of ​​the ground pins on the differential signal pairs, improving the electromagnetic shielding effect. Furthermore, the double-sided pin array layout increases the channel spacing and shielding area without increasing the connector size.

[0042] For example, in Figure 2 In the first face 112, the pins 31 are numbered (PIN) from right to left as 1, 3, 5, 7, 9, 11, 13, 15, 17, 19, and the pins 31 on the second face 113 are numbered (PIN) from right to left as 2, 4, 6, 8, 10, 12, 14, 16, 18, 20.

[0043] The names and functions of the 20 standard pins 31 are shown in the table below: Table 1 In some embodiments, please refer to the following: Figures 5 to 6 The concave structure 32 includes two arc structures 321.

[0044] Two arc structures 321 are disposed on the ground pin and are symmetrically distributed on both sides of the length direction of the ground pin.

[0045] Among them, the two arc structures 321 and the ground pin located on the same radial section as the two arc structures 321 form a concave structure 32.

[0046] It can be understood that the concave structure 32 is composed of two symmetrical arc structures 321 and the ground pin body, all three forming an integrated structure without gaps, ensuring the continuity and stability of electromagnetic shielding. The two arc structures 321 are the functional core of the concave structure 32, while the ground pin body serves as the carrier of the arc structures 321 and also bears the basic function of grounding and conduction. The two arc structures 321 are precisely positioned on both sides of the ground pin's length, distributed symmetrically along the centerline of the ground pin, ensuring uniform electromagnetic shielding on both sides of the ground pin and avoiding impedance offset problems caused by structural asymmetry. From the radial cross-sectional perspective of the ground pin, the two arc structures 321 and the ground pin body on the same cross-section together form a U-shaped concave cavity. The opening of this U-shaped cavity faces the adjacent differential positive and negative signal pins on the same side, maximizing the radiation area of ​​the differential signal pair and improving electromagnetic coupling efficiency.

[0047] Compared to traditional flat rod-shaped ground pins, this symmetrical design of the double-arc structure 321 increases the electromagnetic coupling area between the ground pin and the differential signal pair, effectively absorbing electromagnetic waves radiated during differential signal transmission, blocking electromagnetic interference between adjacent differential signal pairs, and reducing crosstalk noise. The integrated molding design of the concave structure 32 avoids impedance abrupt changes caused by assembly gaps, ensuring impedance continuity during high-frequency signal transmission and reducing signal reflection and loss. By directly integrating the concave structure 32 into the ground pin body, there is no need to add a separate shielding component. High-performance shielding is achieved while meeting the miniaturization requirements of connector design, resolving the contradiction of large size and poor compatibility of traditional shielding solutions.

[0048] In some embodiments, please refer to the following: Figure 5 and Figure 6 In the forward viewing direction, the projection of the concave structure 32 can coincide with the projection of the corresponding positive signal pin and negative signal pin, and the length of the projection of the concave structure 32 in the width direction is greater than the maximum distance between the projections of the corresponding positive signal pin and negative signal pin in the same width direction.

[0049] The forward viewing direction is parallel to the insertion direction of the connecting part 20 when it is connected to the female head, and the width direction is parallel to the width of the connecting part 20.

[0050] It can be understood that the forward viewing direction is parallel to the insertion direction when the connector 20 mates with the female connector, that is, the viewing direction from the connector mating end face towards the carrier 10. The width direction is parallel to the width extension direction of the connector 20 and perpendicular to the forward viewing direction and the length direction of the pin 31.

[0051] With this configuration, in the forward-looking projection angle, the projection of the concave structure 32 integrated on the ground pin can coincide with the projection portions of the corresponding differential positive signal pin and negative signal pin. This design allows the ground shield cavity formed by the concave structure 32 to partially enclose the high-frequency radiation area of ​​the differential signal pair, reducing electromagnetic leakage and ensuring shielding effectiveness from a spatial layout perspective. By making the projection length of the concave structure 32 greater than the maximum spacing between the projections of the corresponding differential positive signal pin and negative signal pin in the same direction in the width direction, it can compensate for minor dimensional deviations during the pin 31 installation process. This ensures that even with an assembly tolerance of ±0.01mm, the concave structure 32 can still cover the differential signal pair, improving the mass production yield of the connector. It also increases the electromagnetic coupling area between the ground pin and the differential signal pair, improving the absorption efficiency of high-frequency electromagnetic waves and further reducing crosstalk noise between adjacent differential channels.

[0052] In some embodiments, please refer to the following: Figure 5 and Figure 6 The positive signal pin and negative signal pin of the signal transmission channel are located inside the corresponding concave structure 32.

[0053] With this configuration, when the differential signal pair transmits high-frequency signals in the embedded state, the radiated electromagnetic waves will directly act on the inner wall of the concave structure 32. Since the concave structure 32 is integrated with the ground pin and reliably grounded, the electromagnetic waves will be quickly guided to the ground and will not radiate to the outside to form crosstalk. At the same time, the U-shaped space of the concave structure 32 can effectively block electromagnetic interference from other signal channels, achieving a two-way shielding effect of internal absorption and external isolation.

[0054] In some embodiments, please refer to the following: Figures 1 to 4 The connecting part 20 has two locking holes 22, which are symmetrically distributed on both sides of the width direction of the connecting part 20. The supporting part 10 includes a supporting member 11 and two locking structures 12.

[0055] Two locking structures 12 are deformably disposed on the support member 11 and symmetrically distributed on both sides of the width direction of the support member 11. The locking structures 12 correspond one-to-one with the locking holes 22. The locking structures 12 are used to partially embed into the locking holes 22 when the connecting part 20 is fixed to the support member 11.

[0056] The carrier 11 has multiple receiving slots 111, the connecting part 20 is disposed on the carrier 11, and the signal transmission part 30 is disposed on the carrier 11.

[0057] It is understood that the core mounting base of the connector has multiple receiving slots 111 on its surface for positioning the pins 31 of the signal transmission section 30. For example, the material of the carrier 11 can be LCP, high-temperature nylon, etc., but is not limited to these.

[0058] The inner wall of the locking hole 22 may be provided with a guide chamfer to facilitate the quick insertion of the locking structure 12 during assembly.

[0059] The locking structure 12 adopts an elastically deformable structural design, symmetrically distributed on both sides of the support member 11 in the width direction, forming a one-to-one fitting relationship with the locking hole 22. The overall size of the locking structure 12 matches the locking hole 22, maintaining a preset extension length in its natural state. During assembly, it can undergo elastic deformation (increase extension length) under external force, and automatically spring back to its original position after being inserted into the locking hole 22, thereby fixing the support member 10 and the connecting member 20. For example, the material of the locking structure 12 can be plastic, beryllium copper alloy, etc., and the locking structure 12 can be a convex structure, but is not limited to these.

[0060] This configuration, through a symmetrical dual-point locking design, ensures uniform force distribution without off-center loading, reduces the risk of loosening under vibration conditions, and guarantees long-term stable operation of the connector.

[0061] When the connecting part 20 is connected to the carrier 11 (during assembly), the locking structure 12 abuts against the connecting part 20 and undergoes elastic deformation under the push of external force. As the connecting part 20 gradually approaches, part of the locking structure 12 slides into the locking hole 22. After reaching the preset position, it automatically rebounds and the locking structure 12 engages with the locking hole 22, thus completing the fixation of the carrier 11 and the connecting part 20.

[0062] By engaging the carrier 11 and the connector 20 through the locking structure 12 and locking hole 22 (rather than using glue or integral injection molding), the carrier 11 and connector 20 can automatically separate when the connector is subjected to excessive external force such as accidental pulling (e.g., the cable being tripped over) or lateral impact. This prevents the pins 31 from bending or breaking and avoids damage to the female connector interface (if the carrier 11 and connector 20 were integral, external force would pull the entire connector 20 out of the female connector, causing deformation of the female connector's contact springs and even damaging the PCB board of the device containing the female connector). After accidental separation, it is not necessary to replace the entire connector; only the connector 20 needs to be replaced and re-engaged, or the carrier 11 and connector 20 need to be re-engaged to restore its use.

[0063] When it is necessary to pull out the connector 20 of the female connector normally, press the locking structure 12 on both sides to increase the resistance of the locking structure 12, and then pull out the carrier 11 in the opposite direction of the insertion direction. The whole process does not require any additional tools and is convenient and efficient.

[0064] In some embodiments, please refer to the following: Figures 1 to 4 The two ends of the locking structure 12 are a deformable end 122 and a cantilever end 123, respectively. The deformable end 122 is connected to the bearing member 11, and the cantilever end 123 is in a free cantilever state. The locking structure 12 can engage or disengage with the locking hole 22 through the elastic deformation of the deformable end 122.

[0065] It is understood that the deformable end 122 and the bearing component 11 are connected by an integrated process of injection molding or stamping and riveting. The cantilever end 123 is in an unrestrained free cantilever state. The deformable end 122 can undergo controllable elastic deformation under the action of external force, thereby changing the position of the cantilever end 123, and thus realizing the engagement or disengagement of the locking structure 12 and the locking hole 22.

[0066] With this configuration, when the connecting part 20 is connected to the carrier 11, the locking structure 12 first contacts the connecting part 20. Under the push of external force, the locking hole 22 approaches the locking structure 12, and the deformable end 122 deforms under the action of external force, causing the cantilever end 123 to move away from the connecting part 20, so that a part of the locking structure 12 can smoothly slide into the locking hole 22. After the connecting part 20 and the carrier 11 are fully fitted in place, a part of the locking structure 12 passes through the locking hole 22 and abuts against the carrier 11 on the other side. The elastic stress of the deformable end 122 is released, and the cantilever end 123 automatically springs back to its original position.

[0067] When it is necessary to pull out the connector 20 inserted into the female head normally, press the locking structure 12 to increase the contact force between the locking structure 12 and the carrier 11, and then pull the carrier 11 outward, thereby pulling out the connector 20 together.

[0068] When the connector is subjected to excessive external force such as accidental pulling (e.g., the cable is tripped over) or lateral impact, the locking structure 12 and the locking hole 22 can automatically separate, thereby preventing the pin 31 from bending or breaking.

[0069] In some embodiments, please refer to the following: Figures 1 to 4 The locking structure 12 has a locking part 121. The part of the locking part 121 that contacts the locking hole 22 is rounded. The locking part 121 is used to partially embed itself into the locking hole 22 when the connecting part 20 is fixed to the carrier 11.

[0070] It is understood that the locking structure 12 integrates a locking part 121 in the middle. The locking part 121 is a structure that realizes the rigid engagement of the bearing part 10 and the connecting part 20. It is specifically used to partially embed into the locking hole 22 of the connecting part 20 when the connecting part 20 and the bearing 11 are completed and assembled, forming a stable mechanical limit constraint to ensure the overall structural integrity of the connector.

[0071] With this configuration, during the docking process between the connector 20 and the carrier 11, the rounded corner structure can act as a guide ramp, guiding the locking part 121 to quickly slide into the preset limit area along the inner wall of the locking hole 22, avoiding jamming or sticking caused by sharp edges, and making the assembly process smoother and more efficient. When the connector encounters overload external forces such as accidental pulling or lateral impact, the rounded corner structure can reduce the frictional resistance between the locking part 121 and the inner wall of the locking hole 22, allowing the locking part 121 to smoothly disengage from the locking hole 22 along the rounded corner guide under the drive of the elastic deformation of the deformation end 122, quickly completing the overload separation, thereby cutting off the transmission path of external force to the pin 31 of the signal transmission part 30, and preventing the pin 31 from bending or breaking.

[0072] The above are merely preferred embodiments of this application and are not intended to limit this application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A DP2.1 connector for reducing high-frequency signal crosstalk noise, characterized in that, include: The support portion has multiple receiving slots; A connecting part is provided on the bearing part and is used to connect with the female head; as well as A signal transmission unit is disposed on the carrier unit. The signal transmission unit includes multiple pins and multiple concave structures. The pins are disposed on the carrier unit and located in the receiving groove. The pins are used to connect with the mating contact end of the female connector to transmit high-frequency signals. The concave structures are disposed on the pins and located in the receiving groove. The concave structures are used to reduce high-frequency signal crosstalk noise of the pins.

2. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 1, characterized in that, The supporting part and the connecting part together form a connecting space, and the connecting end of the pin is located in the connecting space. The connecting end is used to connect with the mating contact end of the female connector.

3. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 2, characterized in that, The pin has a connection portion and a transmission portion, wherein: The connecting portion has the connecting end; The transmission section has a transmission end located outside the receiving slot for connection to external devices or cables. The connection between the connecting part and the transmission part is rounded, and the length extensions of the connecting part and the transmission part can intersect and form a right angle. The concave structure is provided on the transmission part.

4. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 1, characterized in that, The carrier portion has a first surface and a second surface. At least 10 pins are located on the first surface and at least 10 pins are located on the second surface. Each pin forms at least 5 signal transmission channels. Each signal transmission channel includes a positive signal pin, a negative signal pin, and a ground pin. The positive signal pin is used to transmit a differential positive signal, the negative signal pin is used to transmit a differential negative signal, and the ground pin is used to ground. The positive signal pin and the negative signal pin are parallel and of equal length. The ground pin is located opposite the positive signal pin and the negative signal pin. A concave structure is disposed on the ground pin. The positive signal pin and the negative signal pin are adjacent on the same surface. The concave structure is used to reduce high-frequency signal crosstalk noise of the positive signal pin and the negative signal pin.

5. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 4, characterized in that, The concave structure includes: Two arc structures are disposed on the ground pin and symmetrically distributed on both sides of the length direction of the ground pin; The two arc structures and the ground pin located on the same radial cross section as the two arc structures constitute the concave structure.

6. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 4, characterized in that, In the forward-looking direction, the projection of the concave structure can coincide with the projections of the corresponding positive signal pin and the negative signal pin, and the length of the projection of the concave structure in the width direction is greater than the maximum distance between the projections of the corresponding positive signal pin and the negative signal pin in the same width direction; Wherein, the forward viewing direction is parallel to the insertion direction of the connecting part when it is connected to the female head, and the width direction is parallel to the width of the connecting part.

7. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 4, characterized in that, The positive signal pin and the negative signal pin of the signal transmission channel are located inside the corresponding concave structure.

8. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 1, characterized in that, The connecting portion has two locking holes, which are symmetrically distributed on both sides of the connecting portion in the width direction. The supporting portion includes: Load-bearing components; and Two locking structures are deformably disposed on the support member and symmetrically distributed on both sides of the support member in the width direction. Each locking structure corresponds to a locking hole. The locking structure is used to partially embed itself into the locking hole when the connecting part is fixed to the support member. The carrier has multiple receiving slots, the connecting part is disposed on the carrier, and the signal transmission part is disposed on the carrier.

9. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 8, characterized in that, The locking structure has a deformable end and a cantilever end at its two ends. The deformable end is connected to the bearing member, and the cantilever end is in a free cantilever state. The locking structure can engage or disengage with the locking hole through the elastic deformation of the deformable end.

10. The DP2.1 connector for reducing high-frequency signal crosstalk noise as described in claim 8, characterized in that, The locking structure has a locking portion, and the portion of the locking portion that contacts the locking hole is rounded. The locking portion is used to partially embed itself into the locking hole when the connecting portion is fixed to the carrier.

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